CN103997852B - Expandable-shrinkable plate pile-dividing method - Google Patents
Expandable-shrinkable plate pile-dividing method Download PDFInfo
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- CN103997852B CN103997852B CN201410163145.3A CN201410163145A CN103997852B CN 103997852 B CN103997852 B CN 103997852B CN 201410163145 A CN201410163145 A CN 201410163145A CN 103997852 B CN103997852 B CN 103997852B
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- harmomegathus
- heap
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Abstract
The invention discloses an expandable-shrinkable plate pile-dividing method which is characterized in that the method comprises the following steps in sequence: the step 1: pre-laminating: core plates which are subjected to brown oxidation treatment enabling the core plates, PP powders and copper foils to be fixed together according to predetermined product lamination requirements; the step 2: combination: arranging the already fixed plates in order on smooth steel plates; the step 3: plate lamination: stacking the steel plates with the plates being already arrayed orderly according to SOP requirements, the stacked steel plates being ready for entering a pressing machine; the step 4: hot-pressing: pressing the inner core plate and the PP powders into one piece effectively under the condition of vacuum, high temperature and high pressure, and forming a multilayer plate with three layers or above; the step 5: X-RAY target drilling: through an inner layer target, drilling edge-milling positioning holes, and meanwhile, measuring the target hole distance to obtain actual expandable-shrinkable values; and the step 6: pile-dividing: carrying out pile dividing on the plates according to the measured actual expandable-shrinkable values. The method can avoid the quality problem due to expansion and shrinkage phenomenon of the plates; the pile-dividing method is efficient and stable; and the production capability of the PCB is not influenced.
Description
Technical field
The present invention relates to pcb board field, especially with regard to a kind of point heaping method of harmomegathus plate.
Background technology
Size harmomegathus generally just refers in PCB Making programme, its base material moisture absorption and expand, dehumidification and the change in size shunk
Process.The more easier moisture absorption of high temperature, thus when more hot and humid, change in size is bigger.
Size harmomegathus has a great impact to the operation of each processing procedure, and it will have influence on the Aligning degree of boring and internal layer, outer layer
With anti-welding, word and Aligning degree, and the dimensional tolerance of finished product.
In the face of increasingly fierce PCB market, improving product quality is to stand firm the best mode of step, increases to plate harmomegathus
Analysis and research and develop corresponding processing scheme and become inevitable.
Content of the invention
In view of this, the present invention is to solve above-mentioned technical problem, provides a kind of point heaping method of harmomegathus plate, and the method is permissible
Avoid the quality that the harmomegathus phenomenon of plate causes, and this point of heaping method efficient stable, do not interfere with the production capacity of pcb board.
The purpose of the present invention is achieved through the following technical solutions：
A kind of point heaping method of harmomegathus plate, includes successively：
Step 1, pre- folded：The central layer that will process through brown, folds structure requirement by central layer, PP powder, Copper Foil by set product
It is fixed together；
Step 2, combination：The plate fixing neatly comes on smooth steel plate；
Step 3, lamination：The steel plate of plate will be sequenced by neat being stacked together of SOP requirement, press to be entered；
Step 4, hot pressing：By vacuum, high temperature, high pressure condition, central layer and PP powder, effectively pressing is integral, is formed
3 layers and above multi-layer sheet；
Step 5, X-RAY bores target：By internal layer target, bore gong side location hole, measurement wad cutter distance obtains actual rising simultaneously
Contracting value；
Step 6, point heap：According to the harmomegathus value of actual measurement, a point heap is carried out to plate.
Described step 6 point heap is further comprising the steps of：
Step a, randomly draws 5 plates to be processed, the actual harmomegathus data of measurement plate, and calculates harmomegathus mean value；
Step b, divides heap with actual harmomegathus mean value ± 5mil management and control harmomegathus, adjusts drilling according to harmomegathus mean value；
Step c, enters line using standard value as actual target practice distance and compensates equidistant brill target, realize line and compensate a point heap of practicing shooting；
Step d, according to the different target practice marker method of different heaps setting, point different heaps move plate to gong plate to X-RAY target practice person
Side operation, simultaneously different heaps all enclose respective drilling request slip；
Step e, gong plate person is directed to different points of heap plates, and in the V groove of edges of boards plus gong difference number, the 1st heap adds 1V groove, the 2nd heap
Plus 2V groove, the rest may be inferred；
Step f, divides heap to process by harmomegathus plate, can achieve and targetedly adjust the corresponding harmomegathus of the means of production, realize plate
Part, instrument harmomegathus are supporting, reduce brill short circuit partially and scrap.
In described step 6, plate is divided into three parts according to its actual measured value z, and corresponding three harmomegathus value intervals are A respectively（-
15mil l≦z l≦-5mil）、B（-5mil≦z l≦5mil）、C（5mi l≦z l≦15mil）.
The plate that described point of heap is finished post-processes, and gong side removes unnecessary rim charge, and removes edges of boards by edge polisher
Burr burr.
Before described step 1 starts, plate is done with pressing brown and processes：Core material is processed through brown, in copper surface shape
Become one layer of organic metal film, provide good adhesion for follow-up pressing plate flow process central layer with PP powder.
In described step 6, harmomegathus value is more than 15mil and the plate less than -15mil need to be done over again recasting.
The present invention compared to the beneficial effect of prior art is：
Because the harmomegathus value of different plates is different, if the plate of different harmomegathus values is not separated and makees alignment processing, can make
Pcb board yields is become to decline；The effect dividing heap essentially consists in the harmomegathus value measuring different plates, and by actual measured value to plate
Part carries out a point heap, multiple plates close for harmomegathus value is positioned in same stacking, is solved during pcb board produces due to plate with this
The quality problem that harmomegathus phenomenon causes.
Randomly draw 5 plates to be processed, measure its harmomegathus value, calculate harmomegathus mean value, and made with this harmomegathus mean value
For standard, determine the difference of each plate and harmomegathus mean value, point heap is carried out with the size of difference to plate and processes, and to not
Different marks stamped by plate with stacking, facilitate the identification of plate following process work, it is to avoid cause different stacking plates to mix
Disorderly.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that being described in further detail to the present invention below in conjunction with embodiment.
The embodiment of the present invention includes：
A kind of point heaping method of harmomegathus plate, includes successively：
Step 1, pre- folded：The central layer that will process through brown, folds structure requirement by central layer, PP powder, Copper Foil by set product
It is fixed together；
Step 2, combination：The plate fixing neatly comes on smooth steel plate；
Step 3, lamination：The steel plate of plate will be sequenced by neat being stacked together of SOP requirement, press to be entered；
Step 4, hot pressing：By vacuum, high temperature, high pressure condition, central layer and PP powder, effectively pressing is integral, is formed
More than 3 layers of multi-layer sheet；
Step 5, X-RAY bores target：By internal layer target, bore gong side location hole, measurement wad cutter distance obtains actual rising simultaneously
Contracting value；
Step 6, point heap：According to the harmomegathus value of actual measurement, a point heap is carried out to plate.
Because the harmomegathus value of different plates is different, if the plate of different harmomegathus values is not separated and makees alignment processing, can make
Pcb board yields is become to decline；The effect dividing heap essentially consists in the harmomegathus value measuring different plates, and by actual measured value to plate
Part carries out a point heap, multiple plates close for harmomegathus value is positioned in same stacking, is solved during pcb board produces due to plate with this
The quality problem that harmomegathus phenomenon causes.
Further comprising the steps of in step 6 point heap：
Step a, randomly draws 5 plates to be processed, the actual harmomegathus data of measurement plate, and calculates harmomegathus mean value；
Step b, divides heap with actual harmomegathus mean value ± 5mil management and control harmomegathus, adjusts drilling according to harmomegathus mean value；
Step c, enters line using standard value as actual target practice distance and compensates equidistant brill target, realize line and compensate a point heap of practicing shooting；
Step d, according to the different target practice marker method of different heaps setting, point different heaps move plate to gong plate to X-RAY target practice person
Side operation, simultaneously different heaps all enclose respective drilling request slip；
Step e, gong plate person is directed to different points of heap plates, and in the V groove of edges of boards plus gong difference number, the 1st heap adds 1 V groove, and the 2nd
Heap adds 2 V grooves, and the rest may be inferred；
Step f, divides heap to process by harmomegathus plate, can achieve and targetedly adjust the corresponding harmomegathus of the means of production, realize plate
Part, instrument harmomegathus are supporting, reduce brill short circuit partially and scrap.
Randomly draw 5 plates to be processed, measure its harmomegathus value, calculate harmomegathus mean value, and made with this harmomegathus mean value
For standard, determine the difference of each plate and harmomegathus mean value, point heap is carried out with the size of difference to plate and processes, and to not
Different marks stamped by plate with stacking, facilitate the identification of plate following process work, it is to avoid cause different stacking plates to mix
Disorderly.
Taking certain pcb board production company as a example, the number of reloading needed more than 30 minutes originally, is now divided after heap using harmomegathus, reloads
Number time just can complete for 10 minutes.
In step 6, plate is divided into three parts according to its actual measured value z, and corresponding three harmomegathus value difference value intervals are A respectively（-
15mil l≦z l≦-5mil）、B（-5mil≦z l≦5mil）、C（5mi l≦z l≦15mil）.
Size of the difference distribution due to plate meets normal distribution, and major part is distributed in -15mil to 15mil interval, this
Embodiment by being divided into trisection, i.e. A（-15mil l≦z l≦-5mil）、B（-5mil≦z l≦5mil）、C（5mi l≦z
l≦15mil）, the step that so distribution can reduce plate processing to greatest extent, and because the harmomegathus difference of same heap plate is less than
10mil, the pcb board quality made does not reduce, quality is good because harmomegathus difference is excessive.
Taking certain pcb board production company as a example, the moon production capacity 50,000, wherein multi-layer sheet ratio 30%, multi-layer sheet production board average price
700 yuan/calculate：
Reduce the short circuit partially of multilayer twist drill scrap 0.1%, singly scrap cost-effective about：
Single month cost-effective：Ten thousand/moon of 5 × 30% × 0.1% × 700=1.05；
Single year cost-effective：1.05 ten thousand/moon × December/year=12.6 ten thousand/year.
The plate that point heap is finished post-processes, and gong side removes unnecessary rim charge, and removes edges of boards burr by edge polisher
Burr.
Before step 1 starts, plate is done with pressing brown and processes：Core material is processed through brown, forms one on copper surface
Layer organic metal film, provides good adhesion for follow-up pressing plate flow process central layer with PP powder.
In step 6, harmomegathus value is more than 15mil and the plate less than -15mil need to be done over again recasting.
Finally it should be noted that above example illustrates technical scheme, rather than to the scope of the present invention
Restriction, although having made to explain to the present invention with reference to preferred embodiment, it will be understood by those within the art that,
Technical scheme can be modified or equivalent, the essence without deviating from technical solution of the present invention and model
Enclose.
Claims (5)
1. a kind of point heaping method of harmomegathus plate is it is characterised in that include successively：
Step 1, pre- folded：The central layer that will process through brown, folds structure requirement by set product and fixes central layer, PP powder, Copper Foil
Together；
Step 2, combination：The plate fixing neatly comes on smooth steel plate；
Step 3, lamination：The steel plate of plate will be sequenced by neat being stacked together of SOP requirement, press to be entered；
Step 4, hot pressing：By vacuum, high temperature, high pressure condition, central layer and PP powder, effectively pressing is integral, forms 3 layers
Above multi-layer sheet；
Step 5, X-RAY bores target：By internal layer target, bore gong side location hole, measurement wad cutter distance obtains actual harmomegathus value simultaneously；
Step 6, point heap：According to the harmomegathus value of actual measurement, a point heap is carried out to plate；
Described step 6 point heap is further comprising the steps of：
Step a, randomly draws 5 plates to be processed, the actual harmomegathus data of measurement plate, and calculates harmomegathus mean value；
Step b, divides heap with actual harmomegathus mean value ± 4mil management and control harmomegathus, adjusts drilling according to harmomegathus mean value；
Step c, enters line using standard value as actual target practice distance and compensates equidistant brill target, realize line and compensate a point heap of practicing shooting；
Step d, according to the different target practice marker method of different heaps setting, point different heaps move plate to gong edges of boards work to X-RAY target practice person
Sequence, simultaneously different heaps all enclose respective drilling request slip；
Step e, gong plate person is directed to different points of heap plates, and in the V groove of edges of boards plus gong difference number, the 1st heap adds 1V groove, and the 2nd heap adds 2V
Groove, the rest may be inferred；
Step f, divides heap to process by harmomegathus plate, can achieve and targetedly adjust the corresponding harmomegathus of the means of production, realize plate, work
Tool harmomegathus is supporting, reduces brill short circuit partially and scraps.
2. harmomegathus plate according to claim 1 point heaping method it is characterised in that：In described step 6, plate is according in fact
Border measured value z is divided into three parts, and corresponding three harmomegathus value intervals are A respectively（-15mil l≦z l≦-5mil）、B（-5mil≦z
l≦5mil）、C（5mi l≦z l≦15mil）.
3. harmomegathus plate according to claim 2 point heaping method it is characterised in that：After the plate that described point of heap is finished is made
Process, gong side removes unnecessary rim charge, and edges of boards burr burr is removed by edge polisher.
4. harmomegathus plate according to claim 3 point heaping method it is characterised in that：Before described step 1 starts, plate is done
Pressing brown is processed：Core material is processed through brown, forms one layer of organic metal film on copper surface, for follow-up pressing plate flow process core
Plate provides good adhesion with PP powder.
5. harmomegathus plate according to claim 4 point heaping method it is characterised in that：In described step 6, harmomegathus value is more than
15mil and the plate less than -15mil need to be done over again recasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410163145.3A CN103997852B (en) | 2014-04-23 | 2014-04-23 | Expandable-shrinkable plate pile-dividing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410163145.3A CN103997852B (en) | 2014-04-23 | 2014-04-23 | Expandable-shrinkable plate pile-dividing method |
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| CN103997852A CN103997852A (en) | 2014-08-20 |
| CN103997852B true CN103997852B (en) | 2017-02-22 |
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| CN106922084A (en) * | 2017-04-06 | 2017-07-04 | 昆山苏杭电路板有限公司 | High-accuracy original paper pin plug-in unit hole forming method |
| CN107613676B (en) * | 2017-08-30 | 2019-11-15 | 奥士康精密电路（惠州）有限公司 | A kind of inclined ameliorative way of multilayer circuit board layer |
| CN107580418A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Improve the method for multi-layer sheet borehole throw |
| CN108966536A (en) * | 2018-08-09 | 2018-12-07 | 江西景旺精密电路有限公司 | A kind of production method of the internal layer and pressing of circuit board |
| CN110538809B (en) * | 2019-08-09 | 2021-10-12 | 柏承科技(昆山)股份有限公司 | X-Ray collapsible drill target piling operation method |
| CN110896594A (en) * | 2019-09-30 | 2020-03-20 | 宜兴硅谷电子科技有限公司 | Pin-positioning-free automatic expansion and contraction drilling production method |
| CN110913586B (en) * | 2019-11-08 | 2021-06-04 | 通元科技(惠州)有限公司 | Manufacturing method of semi-flexible printed circuit board |
| CN111031685B (en) * | 2019-12-25 | 2022-06-21 | 深圳市景旺电子股份有限公司 | Manufacturing method of high-frequency antenna PCB |
| CN111405759B (en) * | 2020-02-17 | 2021-10-19 | 广东科翔电子科技股份有限公司 | Method for preparing high-precision communication optical module printed circuit board |
| CN111867252B (en) * | 2020-06-02 | 2021-10-22 | 江西一诺新材料有限公司 | High-precision covering film laminating method |
| CN112165780B (en) * | 2020-10-20 | 2022-02-22 | 惠州市特创电子科技股份有限公司 | Expansion and contraction plate dividing device |
| CN112272449B (en) * | 2020-10-20 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board production system and expansion and contraction board separating device |
| CN112483209A (en) * | 2020-11-26 | 2021-03-12 | 奇瑞汽车股份有限公司 | Method for determining cam profile and cam |
| CN112888196A (en) * | 2020-12-28 | 2021-06-01 | 珠海市深联电路有限公司 | Novel prepreg pressing and fixing method and lamination |
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| CN103034146A (en) * | 2012-12-31 | 2013-04-10 | 广州杰赛科技股份有限公司 | Method for controlling X-Ray punch |
| CN103635024A (en) * | 2013-11-25 | 2014-03-12 | 东莞美维电路有限公司 | Automatic partitioning board dividing method after lamination of printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009276096A (en) * | 2008-05-12 | 2009-11-26 | Seiko Precision Inc | Substrate deformation recognition method, substrate deformation recognition device, and substrate deformation recognition program |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103034146A (en) * | 2012-12-31 | 2013-04-10 | 广州杰赛科技股份有限公司 | Method for controlling X-Ray punch |
| CN103635024A (en) * | 2013-11-25 | 2014-03-12 | 东莞美维电路有限公司 | Automatic partitioning board dividing method after lamination of printed wiring board |
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