CN107580418A - Improve the method for multi-layer sheet borehole throw - Google Patents
Improve the method for multi-layer sheet borehole throw Download PDFInfo
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- CN107580418A CN107580418A CN201710759780.1A CN201710759780A CN107580418A CN 107580418 A CN107580418 A CN 107580418A CN 201710759780 A CN201710759780 A CN 201710759780A CN 107580418 A CN107580418 A CN 107580418A
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- harmomegathus
- target
- plate
- bore
- layer sheet
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Abstract
The present invention relates to the method for improving multi-layer sheet borehole throw, comprise the following steps：S1, X RAY bore target；S2, the actual harmomegathus data for measuring plate, and calculate harmomegathus average value；S3, X RAY multilayer twist drill targets harmomegathus set≤75 μm, and the plate beyond this harmomegathus need to divide heap limp；S4, according to harmomegathus average value adjust drilling；S5, enter the equidistant brill target of line compensation using standard value as actual target practice distance；S6, a point different heaps move plate to gong edges of boards process；S7, the V grooves for adding in edges of boards gong difference number；S8, harmomegathus plate divide heap to handle；S9, make one piece of good on-gauge plate of brill target；S10, per order of classes or grades at school, every bench drill target drone need to use this on-gauge plate measurement accuracy error.The present invention use on-gauge plate measurement accuracy daily by strictly controlling the strict keyhole parameters of X RAY by boring target drone, it is ensured that bores target drone precision in controlled range, prevents brill target drone precision misalignment from causing to bore inclined hole.
Description
Technical field
The present invention relates to wiring board manufacture field, and in particular to improves the method for multi-layer sheet borehole throw.
Background technology
The design of printed circuit board increasingly tends to high-density development at present, and this brings all to the manufacture of printed circuit board
More challenges, production difficulty is increasing.Scrappage remains high in PCB multilayer board production, particularly in short scrap each
It is quite high that item scraps middle accounting example, and very big pressure is brought to multi-layer sheet quality management and control, and multiple-plate scrap cost is very important,
Therefore how to reduce internal layer short circuit scrappage is industry question of common concern.We will realize that lifting quality reduces cost, create
Make higher profit, it is necessary to short in reducing first to scrap.And one of short the main reason for scrapping is exactly X-RAY in wiring board appearance
When boring target process, it is inclined that layer occurs in plate harmomegathus value difference, causes to bore inclined hole, and it is short in reducing for how ensureing that X-RAY bores target precision
The emphasis scrapped.
The content of the invention
It is an object of the present invention to provide the method for improving multi-layer sheet borehole throw, it can efficiently solve in background technology and be deposited
The problem of.
The technical problems to be solved by the invention are realized using following technical scheme：
Improve the method for multi-layer sheet borehole throw, comprise the following steps：
S1, X-RAY bore target, by internal layer target, bore gong side positioning hole, while measure wad cutter distance and obtain actual harmomegathus value；
S2,5 plates to be processed are randomly selected, measure the actual harmomegathus data of plate, and calculate harmomegathus average value；
S3, X-RAY multilayer twist drill target harmomegathus set≤75 μm, and the plate beyond this harmomegathus need to divide heap limp；
S4, X-RAY layer set≤75 μm partially, and the inclined plate of riveting and normal panel are distinguished into limp to drilling, adjusts and bores according to harmomegathus average value
Band；
S5, enter the equidistant brill target of line compensation using standard value as actual target practice distance, realize that line compensation target practice divides heap；
S6, X-RAY target practice person set different target practice marker methods according to different heaps, point different heaps shifting plates to gong edges of boards process,
Different heaps enclose respective drilling application form simultaneously；
S7, gong plate person divide heap plate for difference, and in edges of boards plus the V grooves of gong difference number, the first heap adds 1V grooves, and the second heap adds 2V
Groove, the rest may be inferred；
S8, by harmomegathus plate divide heap to handle, can be achieved targetedly to adjust the corresponding harmomegathus of the means of production, realize plate, instrument
Harmomegathus is supporting, reduces brill short circuit partially and scraps；
S9, one piece of good on-gauge plate of brill target is made, thickness 2.0mm, pitch-row is 100mm~700mm, drills out 14 hole positions altogether；
S10, per order of classes or grades at school need to use this on-gauge plate measurement accuracy error per bench drill target drone, bore actual apertures that target drone measures away from gauge orifice
Away from≤20 μm of then normal uses, if actual apertures with 20 μm of standard hole pitch ＞, shutdown adjustment away from boring target drone precision；The method is main
It is the precision that can understand every bench drill target drone daily, prevents that boring target drone precision misalignment causes to bore inclined hole.
Wherein, bore target drone and bore nozzle and newly bore nozzle using 3.175mm diameters, boring the nozzle life-span is defined as 1000 holes, find burr or
Change immediately greatly in hole.
Wherein, 1 times/week of target drone accuracy correction, correction accuracy≤20 μm are bored.
Wherein, drilling machine hole position checks 1 time/month, offset≤3mil, CPK >=1.33.
Wherein, time/month of drilling machine measurement main shaft dynamic beat 1, beat value≤15 μm.
Wherein, drilling initial workpiece uses the inclined situation of X-RAY inspection holes, and every 5 times plates use the inclined situation in X-RAY self-tests hole, finds
The serious processing of hole hard stop partially.
Wherein, it is three parts that plate divides according to its actual measured value z in the S3, and corresponding three harmomegathus value sections make A respectively
（-15mil≤z≤-5mil）、B（-5mil≤z≤5mil）、C（5mil≤z≤15mil）.
Wherein, the plate for dividing heap to finish is post-processed, gong side removes unnecessary clout, and is removed by edge polisher
Edges of boards burr burr.
Wherein, it is more than 15mil for harmomegathus value and plate less than -15mil need to does over again recasting.
The beneficial effects of the invention are as follows：
The present invention uses on-gauge plate measurement accuracy daily by strictly controlling the strict keyhole parameters of X-RAY by boring target drone,
Ensure to bore target drone precision in controlled range, prevent that boring target drone precision misalignment causes to bore inclined hole.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, further
Illustrate the present invention.
Embodiment 1
Improve the method for multi-layer sheet borehole throw, comprise the following steps：
S1, X-RAY bore target, by internal layer target, bore gong side positioning hole, while measure wad cutter distance and obtain actual harmomegathus value；
S2,5 plates to be processed are randomly selected, measure the actual harmomegathus data of plate, and calculate harmomegathus average value；
S3, X-RAY multilayer twist drill target harmomegathus set≤75 μm, and the plate beyond this harmomegathus need to divide heap limp；
S4, X-RAY layer set≤75 μm partially, and the inclined plate of riveting and normal panel are distinguished into limp to drilling, adjusts and bores according to harmomegathus average value
Band；
S5, enter the equidistant brill target of line compensation using standard value as actual target practice distance, realize that line compensation target practice divides heap；
S6, X-RAY target practice person set different target practice marker methods according to different heaps, point different heaps shifting plates to gong edges of boards process,
Different heaps enclose respective drilling application form simultaneously；
S7, gong plate person divide heap plate for difference, and in edges of boards plus the V grooves of gong difference number, the first heap adds 1V grooves, and the second heap adds 2V
Groove, the rest may be inferred；
S8, by harmomegathus plate divide heap to handle, can be achieved targetedly to adjust the corresponding harmomegathus of the means of production, realize plate, instrument
Harmomegathus is supporting, reduces brill short circuit partially and scraps；
S9, one piece of good on-gauge plate of brill target is made, thickness 2.0mm, pitch-row is 100mm~700mm, drills out 14 hole positions altogether；
S10, per order of classes or grades at school need to use this on-gauge plate measurement accuracy error per bench drill target drone, bore actual apertures that target drone measures away from gauge orifice
Away from≤20 μm of then normal uses, if actual apertures with 20 μm of standard hole pitch ＞, shutdown adjustment away from boring target drone precision；The method is main
It is the precision that can understand every bench drill target drone daily, prevents that boring target drone precision misalignment causes to bore inclined hole.
Bore target drone brill nozzle and newly bore nozzle using 3.175mm diameters, the brill nozzle life-span is defined as 1000 holes, finds burr or Kong great Li
Change.
Bore 1 times/week of target drone accuracy correction, correction accuracy≤20 μm.
Drilling machine hole position checks 1 time/month, offset≤3mil, CPK >=1.33.
Time/month of drilling machine measurement main shaft dynamic beat 1, beat value≤15 μm.
Drilling initial workpiece uses the inclined situation of X-RAY inspection holes, and every 5 times plates use the inclined situation in X-RAY self-tests hole, finds serious inclined
Hole hard stop processing.
It is three parts that plate divides according to its actual measured value z in the S3, and corresponding three harmomegathus value sections make A respectively（-
15mil≤z≤-5mil）、B（-5mil≤z≤5mil）、C（5mil≤z≤15mil）.
The plate for dividing heap to finish is post-processed, gong side removes unnecessary clout, and removes edges of boards by edge polisher
Burr burr.
It is more than 15mil for harmomegathus value and plate less than -15mil need to does over again recasting.
Before I takes charge of the new management-control method of use at present, multi-layer sheet scrappage 1.05%, after performing new management-control method, interior short report
Useless to be reduced to 0.29%, I takes charge of the ㎡ of multi-layer sheet moon production capacity 45000, monthly short in reduction to scrap the ㎡ of area 342, by multi-layer sheet price
800 Yuan/㎡, it is as follows monthly to reduce scrap cost：
Yuan/㎡=27.4 ten thousand yuan of 342 ㎡ * 600
It is annual to reduce scrap cost：
27.4 ten thousand yuan of * December=3,290,000 yuan.
It is the wherein specific implementation of the present invention above, its description is more specific and detailed, but can not therefore manage
Solve as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, do not departing from
On the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection domain.
Claims (9)
1. improve the method for multi-layer sheet borehole throw, it is characterised in that comprise the following steps：
S1, X-RAY bore target, by internal layer target, bore gong side positioning hole, while measure wad cutter distance and obtain actual harmomegathus value；
S2,5 plates to be processed are randomly selected, measure the actual harmomegathus data of plate, and calculate harmomegathus average value；
S3, X-RAY multilayer twist drill target harmomegathus set≤75 μm, and the plate beyond this harmomegathus need to divide heap limp；
S4, X-RAY layer set≤75 μm partially, and the inclined plate of riveting and normal panel are distinguished into limp to drilling, adjusts and bores according to harmomegathus average value
Band；
S5, enter the equidistant brill target of line compensation using standard value as actual target practice distance, realize that line compensation target practice divides heap；
S6, X-RAY target practice person set different target practice marker methods according to different heaps, point different heaps shifting plates to gong edges of boards process,
Different heaps enclose respective drilling application form simultaneously；
S7, gong plate person divide heap plate for difference, and in edges of boards plus the V grooves of gong difference number, the first heap adds 1V grooves, and the second heap adds 2V
Groove, the rest may be inferred；
S8, by harmomegathus plate divide heap to handle, can be achieved targetedly to adjust the corresponding harmomegathus of the means of production, realize plate, instrument
Harmomegathus is supporting, reduces brill short circuit partially and scraps；
S9, one piece of good on-gauge plate of brill target is made, thickness 2.0mm, pitch-row is 100mm~700mm, drills out 14 hole positions altogether；
S10, per order of classes or grades at school need to use this on-gauge plate measurement accuracy error per bench drill target drone, bore actual apertures that target drone measures away from gauge orifice
Away from≤20 μm of then normal uses, if actual apertures with 20 μm of standard hole pitch ＞, shutdown adjustment away from boring target drone precision；The method is main
It is the precision that can understand every bench drill target drone daily, prevents that boring target drone precision misalignment causes to bore inclined hole.
2. the method according to claim 1 for improving multi-layer sheet borehole throw, it is characterised in that bore target drone and bore nozzle use
3.175mm diameters newly bore nozzle, and the brill nozzle life-span is defined as 1000 holes, it is found that burr or hole are changed greatly immediately.
3. the method according to claim 1 for improving multi-layer sheet borehole throw, it is characterised in that bore target drone accuracy correction 1
Times/week, correction accuracy≤20 μm.
4. the method according to claim 1 for improving multi-layer sheet borehole throw, it is characterised in that drilling machine hole position checks 1
Secondary/moon, offset≤3mil, CPK >=1.33.
5. the method according to claim 1 for improving multi-layer sheet borehole throw, it is characterised in that drilling machine measurement main shaft moves
Time/month of state beat 1, beat value≤15 μm.
6. the method according to claim 1 for improving multi-layer sheet borehole throw, it is characterised in that drilling initial workpiece uses X-
The inclined situation of RAY inspection holes, every 5 times plates use the inclined situation in X-RAY self-tests hole, find the serious processing of hole hard stop partially.
7. it is according to claim 1 improve multi-layer sheet borehole throw method, it is characterised in that in the S3 plate according to
Z points of its actual measured value is three parts, and corresponding three harmomegathus value sections make A respectively（-15mil≤z≤-5mil）、B（-5mil≤z
≤5mil）、C（5mil≤z≤15mil）.
8. the method according to claim 7 for improving multi-layer sheet borehole throw, it is characterised in that divide what heap finished to described
Plate post-processes, and gong side removes unnecessary clout, and removes edges of boards burr burr by edge polisher.
9. the method according to claim 7 for improving multi-layer sheet borehole throw, it is characterised in that be more than for harmomegathus value
15mil and plate less than -15mil need to do over again recasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759780.1A CN107580418A (en) | 2017-08-30 | 2017-08-30 | Improve the method for multi-layer sheet borehole throw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759780.1A CN107580418A (en) | 2017-08-30 | 2017-08-30 | Improve the method for multi-layer sheet borehole throw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107580418A true CN107580418A (en) | 2018-01-12 |
Family
ID=61030527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710759780.1A Pending CN107580418A (en) | 2017-08-30 | 2017-08-30 | Improve the method for multi-layer sheet borehole throw |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108520403A (en) * | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN108668444A (en) * | 2018-06-25 | 2018-10-16 | 广州兴森快捷电路科技有限公司 | Harmomegathus control method, processing method and system, computer storage media and equipment |
| CN109520438A (en) * | 2018-11-23 | 2019-03-26 | 梅州市志浩电子科技有限公司 | The inclined distance measurement method in the hole of machine drilling |
| CN109822670A (en) * | 2019-02-01 | 2019-05-31 | 奥士康精密电路（惠州）有限公司 | A method of improving the inclined hole pcb board BGA |
| CN110831326A (en) * | 2019-10-21 | 2020-02-21 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN110876240A (en) * | 2018-09-04 | 2020-03-10 | 胜宏科技（惠州）股份有限公司 | Method for detecting drilling deviation of multilayer circuit board |
| CN112165780A (en) * | 2020-10-20 | 2021-01-01 | 惠州市特创电子科技有限公司 | Expansion and contraction plate dividing method and expansion and contraction plate dividing device |
| CN112272449A (en) * | 2020-10-20 | 2021-01-26 | 惠州市特创电子科技有限公司 | Circuit board production system and expansion and contraction board separating device |
| CN113015335A (en) * | 2021-02-25 | 2021-06-22 | 奥士康科技股份有限公司 | Method for improving core plate direct-pressure PCB drilling alignment |
| CN113778513A (en) * | 2021-09-15 | 2021-12-10 | 定颖电子(黄石)有限公司 | Automatic generation method, device and equipment of PCB drilling program and storage medium |
| CN114521056A (en) * | 2022-04-19 | 2022-05-20 | 惠州威尔高电子有限公司 | PCB multi-layer board drilling efficiency improving method and electronic equipment |
| CN114928960A (en) * | 2022-05-12 | 2022-08-19 | 胜宏科技（惠州）股份有限公司 | Method for avoiding confusion of different collapsible PCBs |
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| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
| CN204997115U (en) * | 2015-09-15 | 2016-01-27 | 惠州中京电子科技股份有限公司 | X -RAY bores supplementary correction instrument of precision of target drone |
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| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
| CN204997115U (en) * | 2015-09-15 | 2016-01-27 | 惠州中京电子科技股份有限公司 | X -RAY bores supplementary correction instrument of precision of target drone |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108520403A (en) * | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN108668444A (en) * | 2018-06-25 | 2018-10-16 | 广州兴森快捷电路科技有限公司 | Harmomegathus control method, processing method and system, computer storage media and equipment |
| CN108668444B (en) * | 2018-06-25 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Collapsible control method, machining method and system, computer storage medium and device |
| CN110876240A (en) * | 2018-09-04 | 2020-03-10 | 胜宏科技（惠州）股份有限公司 | Method for detecting drilling deviation of multilayer circuit board |
| CN110876240B (en) * | 2018-09-04 | 2021-07-02 | 胜宏科技（惠州）股份有限公司 | Method for detecting drilling deviation of multilayer circuit board |
| CN109520438A (en) * | 2018-11-23 | 2019-03-26 | 梅州市志浩电子科技有限公司 | The inclined distance measurement method in the hole of machine drilling |
| CN109822670A (en) * | 2019-02-01 | 2019-05-31 | 奥士康精密电路（惠州）有限公司 | A method of improving the inclined hole pcb board BGA |
| CN110831326A (en) * | 2019-10-21 | 2020-02-21 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN112272449A (en) * | 2020-10-20 | 2021-01-26 | 惠州市特创电子科技有限公司 | Circuit board production system and expansion and contraction board separating device |
| CN112165780A (en) * | 2020-10-20 | 2021-01-01 | 惠州市特创电子科技有限公司 | Expansion and contraction plate dividing method and expansion and contraction plate dividing device |
| CN112272449B (en) * | 2020-10-20 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board production system and expansion and contraction board separating device |
| CN113015335A (en) * | 2021-02-25 | 2021-06-22 | 奥士康科技股份有限公司 | Method for improving core plate direct-pressure PCB drilling alignment |
| CN113778513A (en) * | 2021-09-15 | 2021-12-10 | 定颖电子(黄石)有限公司 | Automatic generation method, device and equipment of PCB drilling program and storage medium |
| CN113778513B (en) * | 2021-09-15 | 2024-02-23 | 超颖电子电路股份有限公司 | Automatic generation method, device, equipment and storage medium for PCB drilling program |
| CN114521056A (en) * | 2022-04-19 | 2022-05-20 | 惠州威尔高电子有限公司 | PCB multi-layer board drilling efficiency improving method and electronic equipment |
| CN114521056B (en) * | 2022-04-19 | 2022-08-05 | 惠州威尔高电子有限公司 | PCB multi-layer board drilling efficiency improving method and electronic equipment |
| CN114928960A (en) * | 2022-05-12 | 2022-08-19 | 胜宏科技（惠州）股份有限公司 | Method for avoiding confusion of different collapsible PCBs |
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Application publication date: 20180112 |