CN104640380B - A kind of non-heavy copper hole with orifice ring and print circuit plates making method - Google Patents
A kind of non-heavy copper hole with orifice ring and print circuit plates making method Download PDFInfo
- Publication number
- CN104640380B CN104640380B CN201310571588.1A CN201310571588A CN104640380B CN 104640380 B CN104640380 B CN 104640380B CN 201310571588 A CN201310571588 A CN 201310571588A CN 104640380 B CN104640380 B CN 104640380B
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- China
- Prior art keywords
- hole
- orifice ring
- heavy copper
- printed circuit
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The production method in the present invention relates to a kind of non-heavy copper hole and printed circuit board with orifice ring, belongs to printed circuit board manufacturing technology field.The present invention drills first：Through-hole is made on printed circuit board after pressing；Next is electroplated：Copper facing in plate face and the through-hole hole to the printed circuit board after the pressing；Pattern transfer is carried out again：Printed circuit board plate face after the pressing produces figure, and opens a window to the hole with orifice ring；Finally it is etched：The figure is etched, and the hole of windowing is etched, forms non-heavy copper hole.The present invention reduces a drilling program, to optimize entire production process when making the non-heavy copper hole with orifice ring.Moreover, because flow is bored without two, so the burr and orifice ring damaging problem because of the generation of two driller's skills have obtained thorough improvement.
Description
Technical field
The invention belongs to printed circuit boards（PCB）Manufacturing technology field, and in particular to a kind of non-heavy copper hole with orifice ring and
Print circuit plates making method.
Background technology
In printed circuit board（PCB）In manufacturing field, with the raising of properties of product, from the NPTH of no orifice ring（Non- heavy copper
Hole Non Plating Through Hole）Printed wiring board develops the printed circuit board to the NPTH for including orifice ring.And it is right
Manufacture craft in the non-heavy copper hole with orifice ring, at present in entire printed circuit board industry generally using two driller's skills make come
It completes, production procedure is as follows：
Pressing --- drilling（It drills for the first time）--- plating --- pattern transfer --- etching（It is acid）--- drilling（The
Secondary drilling）——AOI（Optical check）.
The effect of each process is as follows in the above flow：
（1）Drilling（For the first time）：Predominantly make other through-holes.
（2）Plating：Copper-plated process in printed circuit board plate face and hole.
（3）Pattern transfer：Graphic making process.
（4）Etching：Go out figure in printed circuit board facet etch（Circular pad PAD including this technique）.
（5）Drilling（Second of drilling）：It drills in the PAD of etched figure, to form the holes NPTH.
Effect diagram such as Fig. 1 after the completion of each flow（a）To Fig. 1（e）It is shown.Such holes NPTH with orifice ring make work
Skill needs to drill again after the etching（Two often said bore flow）It completes, this manufacture craft has the disadvantage that when drilling for second：
（1）Second when drilling after the etching, printing plate face has a line pattern after etching, and when second of drilling operation is easy
Figure circuit is scratched, causes to open a way；
（2）It is also easy to produce burr, and difficult；
（3）The conditions such as material limit, such as RO4350B materials, easily occur orifice ring breakage when second of drilling makes；
With the rapid development of electronics industry, makes the holes the NPTH technique with orifice ring using two driller's skills and have been unable to meet electricity
The requirement of sub-industry development, it is necessary to have a kind of new technique to make up the deficiency in terms of the manufacture craft bored with two, optimize its system
Make flow and solve the holes NPTH with orifice ring two drill as when the burr that generates and orifice ring damaging problem.
Invention content
In view of the deficiencies in the prior art, technical problem to be solved by the invention is to provide a kind of good bands of effect
The non-heavy copper hole of orifice ring and print circuit plates making method.
In order to solve the above technical problems, the technical solution adopted by the present invention is as follows：
A kind of production method in the non-heavy copper hole with orifice ring, includes the following steps：
（1）Drilling：Through-hole is made on printed circuit board after pressing；
（2）Plating：Copper facing in plate face and the through-hole hole to the printed circuit board after the pressing；
（3）Pattern transfer：Printed circuit board plate face after the pressing produces figure, and is carried out to the hole with orifice ring
Windowing；
（4）Etching：The figure is etched, and the hole of windowing is etched, forms non-heavy copper hole.
The production method in the non-heavy copper hole with orifice ring as described above, step（4）Described in etching use acid etching stream
Journey.The acid etching flow includes the following steps：1. pattern transfer；2. developing；3. etching；4. striping.
The production method in the non-heavy copper hole with orifice ring as described above, step（3）Described in the method that opens a window be：Band orifice ring
Non- heavy copper hole set copper mode be boring aperture-X.The X is according to borehole accuracy, pattern transfer exposure bench aligning accuracy, electricity
Copper thickness, etching factor determine below for plating.
The production method in the non-heavy copper hole with orifice ring as described above, wherein further include using optical check after the etching
The step of method checks the non-heavy copper hole.
A kind of production method of printed circuit board, the printed circuit board includes the non-heavy copper hole with orifice ring, described with holes
The non-heavy copper hole of ring is made by the above method.
The method of the invention reduces a drilling program, to optimize when making the non-heavy copper hole with orifice ring
Entire production process.Moreover, because flow is bored without two, so because the burr of two driller's skills generation and non-heavy copper hole breakage are asked
Topic has obtained thorough improvement.
Description of the drawings
Fig. 1 is two to bore technological process effect diagram, wherein Fig. 1 in the prior art（a）It is the effect diagram after pressing,
Fig. 1（b）It is the effect diagram after drilling, Fig. 1（c）It is the effect diagram after plating, Fig. 1（d）Be etching after effect show
It is intended to, Fig. 1（e）It is the effect diagram after second of drilling；
Fig. 2 is the holes the NPTH production method flow chart with orifice ring in specific implementation mode；
Fig. 3 is the holes the NPTH production method flow effect diagram with orifice ring, wherein Fig. 3 in specific implementation mode（a）It is
Effect diagram after pressing, Fig. 3（b）It is the effect diagram after drilling, Fig. 3（c）It is the effect diagram after plating, Fig. 3
（d）It is the effect diagram after pattern transfer, Fig. 3（e）It is the effect diagram after etching.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with the accompanying drawings.
As shown in Fig. 2, the holes the NPTH production method with orifice ring includes the following steps in present embodiment：
（1）Drilling.
Through-hole, such as Fig. 3 are made on printed circuit board after pressing（a）PATENT left side via.Certainly, it can also make and remove simultaneously
Through-hole except non-heavy copper hole with orifice ring, such as Fig. 3（b）Right side through-hole.It will be with the drilling flow in the holes NPTH of orifice ring
It is dissolved into normal drill flow, the drilling flow that the existing holes NPTH with orifice ring of optimization make（Two bore）.Electricity after pressing
Road plate effect such as Fig. 3（a）It is shown, effect such as Fig. 3 after drilling（b）It is shown.
（2）Plating.
Include to copper facing in the through-hole with orifice ring to copper facing in printed circuit board plate face and hole.Effect such as Fig. 3 after plating
（c）It is shown.
（3）Pattern transfer.
Figure is produced in printed circuit board plate face, in addition to normal figure, it is also necessary to open a window to the hole with orifice ring, i.e.,
The holes NPTH windowing making data with orifice ring is added in normal graphic documentation.The method that it opens a window is as follows：With orifice ring
The holes NPTH set copper is designed as the original aperture that drills（D）—X（mil）, mil is unit Mill.X is according to borehole accuracy, pattern transfer
Copper thickness, etching factor etc. below is electroplated in exposure bench aligning accuracy.The effective ways for obtaining X values are to set X as different values
Tested, X values determined from the effect after etching, with ensure etch after the completion of the holes NPTH without orifice ring the defect caused by deviation
Phenomenon.Effect such as Fig. 3 after pattern transfer（d）It is shown.
（4）Etching.
The figure is etched, in addition to etching normal figure, it is also necessary to the hole of windowing is etched, formed
The holes NPTH.Etching uses acid etching flow, specially：Development → etching → striping.Effect such as Fig. 3 after etching（e）It is shown.
（5）It checks.
After etching, using optical check（AOI）Orifice ring is checked, checks whether its orifice ring has the hole caused by deviation
Ring is damaged.Optical check is the existing production procedure for making pcb board, herein not reinflated explanation.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technology
Within, then the present invention is also intended to include these modifications and variations.
Claims (7)
1. a kind of production method in the non-heavy copper hole with orifice ring, includes the following steps：
（1）Drilling：Through-hole is made on printed circuit board after pressing；
（2）Plating：Copper facing in plate face and the through-hole hole to the printed circuit board after the pressing；
（3）Pattern transfer：Printed circuit board plate face after the pressing produces figure, and opens the hole with orifice ring
Window；
（4）Etching：The figure is etched, and the hole of windowing is etched, forms non-heavy copper hole.
2. the production method in the non-heavy copper hole with orifice ring as described in claim 1, it is characterised in that：Step（4）Described in lose
It carves and uses acid etching flow.
3. the production method in the non-heavy copper hole with orifice ring as claimed in claim 2, it is characterised in that：The acid etching flow
Include the following steps：1. pattern transfer；2. developing；3. etching；4. striping.
4. the production method in the non-heavy copper hole with orifice ring as described in claim 1, it is characterised in that：Step（3）Described in open
The method of window is：Non- heavy copper hole set copper mode with orifice ring is boring aperture-X.
5. the production method in the non-heavy copper hole with orifice ring as claimed in claim 4, it is characterised in that：The X is according to drilling essence
Copper thickness, etching factor determine below for degree, pattern transfer exposure bench aligning accuracy, plating.
6. the production method in the non-heavy copper hole with orifice ring as described in any one of claim 1 to 5, it is characterised in that：It is losing
Further include the steps that being checked the non-heavy copper hole using optical inspection after quarter.
7. a kind of production method of printed circuit board, the printed circuit board includes the non-heavy copper hole with orifice ring, which is characterized in that
The non-heavy copper hole with orifice ring is made by the either method in the claims 1~6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310571588.1A CN104640380B (en) | 2013-11-13 | 2013-11-13 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310571588.1A CN104640380B (en) | 2013-11-13 | 2013-11-13 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104640380A CN104640380A (en) | 2015-05-20 |
| CN104640380B true CN104640380B (en) | 2018-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310571588.1A Active CN104640380B (en) | 2013-11-13 | 2013-11-13 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
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| CN (1) | CN104640380B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106529106B (en) * | 2017-01-09 | 2019-09-06 | 郑州云海信息技术有限公司 | One kind building hole method, apparatus and a kind of PCB |
| CN107949188A (en) * | 2017-11-16 | 2018-04-20 | 广东兴达鸿业电子有限公司 | Connect the circuit board processing method in hole with NPTH |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| CN115334756A (en) * | 2022-08-19 | 2022-11-11 | 东莞联桥电子有限公司 | Manufacturing process of ball grid array printed circuit board |
| CN116916563A (en) * | 2023-08-10 | 2023-10-20 | 清远市富盈电子有限公司 | Manufacturing method of PCB with PTH holes connected with NPTH holes, and PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495394B1 (en) * | 1999-02-16 | 2002-12-17 | Sumitomo Metal (Smi) Electronics Devices Inc. | Chip package and method for manufacturing the same |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
| CN203523145U (en) * | 2013-10-12 | 2014-04-02 | 北大方正集团有限公司 | Pcb |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590758A (en) * | 1991-02-18 | 1993-04-09 | Dia Denshi Kk | Production of multilayered printed-board |
-
2013
- 2013-11-13 CN CN201310571588.1A patent/CN104640380B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495394B1 (en) * | 1999-02-16 | 2002-12-17 | Sumitomo Metal (Smi) Electronics Devices Inc. | Chip package and method for manufacturing the same |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
| CN203523145U (en) * | 2013-10-12 | 2014-04-02 | 北大方正集团有限公司 | Pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104640380A (en) | 2015-05-20 |
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| CP03 | Change of name, title or address |
Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, fangzheng building, 298 Fu Cheng Road, Beijing, Haidian District Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220916 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |