CN104717846A - Method for manufacturing metallization groove holes in PCB - Google Patents
Method for manufacturing metallization groove holes in PCB Download PDFInfo
- Publication number
- CN104717846A CN104717846A CN201410784400.6A CN201410784400A CN104717846A CN 104717846 A CN104717846 A CN 104717846A CN 201410784400 A CN201410784400 A CN 201410784400A CN 104717846 A CN104717846 A CN 104717846A
- Authority
- CN
- China
- Prior art keywords
- slotted eye
- hole
- pcb
- metallization
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of manufacturing of PCBs, in particular to a method for manufacturing metallization groove holes in a PCB. The method comprises the steps that a guiding hole is drilled in each hole position where a metallization groove hole needs to be manufactured in a multilayer board, and then a milling cutter is used for conducting milling along the shape of the hole positions from the guiding holes to manufacture the groove holes. Due to the fact that only one guiding hole is formed in each hole position, the problem of asymmetry of the guiding holes does not exist, so that the problem that the manufactured groove holes are special-shaped holes due to the asymmetry of the positions of the drilled guiding holes is solved, it is ensured that the shape and the appearance of the metallization groove holes meet the design requirements, and the quality of the PCB is improved.
Description
Technical field
The present invention relates to PCB manufacture technology field, particularly relate in a kind of PCB the manufacture method of the slotted eye that metallizes.
Background technology
PCB (Printed Circuit Board), Chinese is printed wiring board, and be called for short printed board, being one of vitals of electronics industry, is the carrier of the supporter of electronic devices and components, electrical connection.Along with electronic equipment improving constantly functional, precision and quality requirements, also thereupon more and more higher to the quality requirements of PCB.PCB make in, in order to meet some special designing requirements, need make on PCB metallization slotted eye, and requirement made by metallization slotted eye in chamfering well-balanced.During existing PCB makes, usually, when making slotted eye, first getting out in the surrounding of slotted eye position to be done and drawing hole, as shown in Figure 1, and then drawing hole place milling cutter and carry out cutting to be formed the slotted eye of required form, then by heavy copper and electric plating of whole board process obtained metallization slotted eye., easily because the position of institute's drill hole is asymmetric and cause the out-of-shape of made slotted eye, there is irregularly-shaped hole, as shown in Figure 2, affect outward appearance and the quality of product in the manufacture method of existing metallization slotted eye.
Summary of the invention
When the present invention is directed to the metallization slotted eye that prior art makes in PCB, easily cause the problem in irregular shape of made slotted eye because the position of institute's drill hole is asymmetric, a kind of method making high-precision metal slotted eye is provided.
For achieving the above object, by the following technical solutions, the manufacture method of the slotted eye that metallizes in a kind of PCB, comprises the following steps in the present invention:
S1, on multilayer boards need make metallization slotted eye position, each hole on one, brill draw hole; Described multi-layer sheet comprises the central layer, outer copper foil and the prepreg that are provided with internal layer circuit, and described central layer and outer copper foil are pressed together by prepreg.
S2, with milling cutter from drawing the shape milling of hole along position, hole, obtain slotted eye.
S3, successively heavy Copper treatment and electric plating of whole board process are carried out to multi-layer sheet, slotted eye is metallized, obtains metallization slotted eye.
Preferably, described slotted eye is greater than metallization slotted eye, and the minimum range between the hole wall of described slotted eye and the hole wall of metallization slotted eye is 0.03mm.
Also comprise the step being made internal layer circuit by negative film technique on central layer before described step S1, and central layer, prepreg and outer copper foil are carried out lamination, then pressing is formed as one multiple-plate step.
Also comprise after described step S3 and make outer-layer circuit, making solder mask and surface-treated step on multilayer boards successively.
Compared with prior art, the invention has the beneficial effects as follows: the present invention draws hole by needing one, brill on the position, each hole of making metallization slotted eye on multilayer boards, then obtains slotted eye with milling cutter from drawing the shape milling of hole along position, hole.Hole is drawn due to position, each hole only boring one, do not exist and draw the asymmetric problem in hole, thus it is asymmetric and cause made slotted eye to be the problem of irregularly-shaped hole to avoid position because of institute's drill hole, and then ensure that the shape of metallization slotted eye and outward appearance meet designing requirement, improve the quality of PCB.
Accompanying drawing explanation
Fig. 1 gets out in position, the hole surrounding that need make slotted eye the schematic diagram drawing hole in prior art;
Fig. 2 is because drawing the schematic diagram of the undesirable slotted eye of the asymmetric obtained shape in hole site in prior art;
Fig. 3 gets out the schematic diagram that is drawn hole in the embodiment of the present invention in the position, hole that need make slotted eye.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment
The present embodiment provides in a kind of PCB the manufacture method of the slotted eye that metallizes, and concrete making step is as follows:
(1) pressing forms multi-layer sheet
First as the production process of the PCB of prior art, sawing sheet is carried out to the raw material of PCB and obtains central layer, on central layer, then adopt negative film technique to make internal layer circuit.Detected by internal layer AOI, check whether internal layer circuit exists out the defects such as short circuit, circuit breach, circuit pin hole, flawless product introduction pressing flow process.
First-selection carries out brown process to central layer, then by design data, central layer, prepreg and outer copper foil is carried out lamination, then selects suitable pressing condition according to the Tg of plate, folded plate pressing be integrated, and forms multi-layer sheet.
(2) groove milling hole
Need that the position, each hole 1 of making metallization slotted eye bores one on multilayer boards and draw hole 2, as shown in Figure 3.Then according to borehole data, with milling cutter from drawing the shape milling of hole 2 along position, hole, slotted eye is obtained.Further, obtained slotted eye be greater than through after the obtained metallization slotted eye of operation, the minimum range between the hole wall making the hole wall of slotted eye and metallization slotted eye is 0.03mm, i.e. the monolateral monolateral large 0.03mm than metallization slotted eye of slotted eye.
(3) outer-layer circuit is made on multilayer boards
Successively heavy Copper treatment and electric plating of whole board process are carried out to multi-layer sheet, slotted eye is metallized, obtain metallization slotted eye.Then positive blade technolgy is adopted to make outer-layer circuit on multilayer boards.Specific as follows:
The heavy copper of (a) skin: slotted eye is metallized, backlight test >=9 grades.
(b) electric plating of whole board: electric plating of whole board is to copper thickness >=5 μm, hole of metallization slotted eye.
C () outer graphics: apply dry film on multilayer boards, adopts Full-automatic exposure machine, exposes, then develop with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), form plating resist layer.
D () graphic plating: in place's electro-coppering of windowing, forms copper electroplating layer; Then electrotinning on copper electroplating layer, forms plating tin layers, and the thickness of plating tin layers is 3-5 μm.Make the hole copper thickness of metallization slotted eye thickening by graphic plating, make the hole copper thickness of metallization slotted eye reach designing requirement.
E () skin etching: remove plating resist layer, then etching removing is not plated the copper face that tin layers covers, and then tin layers is electroplated in removing again, makes the outer-layer circuit on multi-layer sheet completely out exposed.
(f) outer AOI: check whether outer-layer circuit exists out the defects such as short circuit, circuit breach, circuit pin hole, flawless product introduction downstream.
(g) solder mask: at multi-layer sheet surface silk-screen welding resistance, character (adopt the solder mask in white reticulated printing TOP face, the character in TOP face adds " UL mark "), obtained solder mask.
H () is shaping: gong external form, external form tolerance +/-0.1mm.
(i) shaping rear test: the electric property of test-based examination product.
(j) FQC1: check that whether the copper face of product is abnormal.
(k) heavy silver: sink the uniform silver layer of last layer on multiple-plate surface.
(l) FQC, FQA: check the outward appearance of product, measured hole copper thickness, thickness of dielectric layers, green oil thickness, groove size and Tolerance of Degree of position etc.
M () packs: by customer requirement, pack PCB, and put into drier and humidity card.Product after packaging gets final product shipment.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (4)
1. metallize in PCB the manufacture method of slotted eye, it is characterized in that, comprise the following steps:
S1, on multilayer boards need make metallization slotted eye position, each hole on one, brill draw hole; Described multi-layer sheet comprises the central layer, outer copper foil and the prepreg that are provided with internal layer circuit, and described central layer and outer copper foil are pressed together by prepreg;
S2, with milling cutter from drawing the shape milling of hole along position, hole, obtain slotted eye;
S3, successively heavy Copper treatment and electric plating of whole board process are carried out to multi-layer sheet, slotted eye is metallized, obtains metallization slotted eye.
2. metallize in a kind of PCB the manufacture method of slotted eye according to claim 1, and it is characterized in that, described slotted eye is greater than metallization slotted eye, and the minimum range between the hole wall of described slotted eye and the hole wall of metallization slotted eye is 0.03mm.
3. metallize in a kind of PCB the manufacture method of slotted eye according to claim 2, it is characterized in that, also comprises making outer-layer circuit on multilayer boards successively, making solder mask and surface-treated step after described step S3.
4. metallize in a kind of PCB the manufacture method of slotted eye according to claim 3, it is characterized in that, the step being made internal layer circuit by negative film technique on central layer is also comprised before described step S1, and central layer, prepreg and outer copper foil are carried out lamination, then pressing is formed as one multiple-plate step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410784400.6A CN104717846B (en) | 2014-12-16 | 2014-12-16 | The preparation method of metallization slotted eye in a kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410784400.6A CN104717846B (en) | 2014-12-16 | 2014-12-16 | The preparation method of metallization slotted eye in a kind of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104717846A true CN104717846A (en) | 2015-06-17 |
| CN104717846B CN104717846B (en) | 2018-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410784400.6A Active CN104717846B (en) | 2014-12-16 | 2014-12-16 | The preparation method of metallization slotted eye in a kind of PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN104717846B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430917A (en) * | 2015-11-30 | 2016-03-23 | 江门崇达电路技术有限公司 | Method for fabricating connected slot in PCB |
| CN106961795A (en) * | 2017-03-24 | 2017-07-18 | 江门崇达电路技术有限公司 | A kind of PCB forming methods |
| CN108391378A (en) * | 2018-04-03 | 2018-08-10 | 江门崇达电路技术有限公司 | The production method of minute grooves on a kind of improvement wiring board |
| CN109121307A (en) * | 2018-09-30 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | The processing method of the through slot of circuit board |
| CN109926798A (en) * | 2019-03-18 | 2019-06-25 | 昆山苏杭电路板有限公司 | The short slot processing method of the different conventional shape of L-type |
| CN111417260A (en) * | 2020-04-07 | 2020-07-14 | 信丰祥达丰电子有限公司 | Production process of PCB bevel edge metallization copper clad |
| CN113301724A (en) * | 2021-05-24 | 2021-08-24 | 福莱盈电子股份有限公司 | Method for processing short slot hole of rigid-flex board |
| CN114211564A (en) * | 2021-11-09 | 2022-03-22 | 江门市奔力达电路有限公司 | Machining method of square slotted hole and drilling machine |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430917A (en) * | 2015-11-30 | 2016-03-23 | 江门崇达电路技术有限公司 | Method for fabricating connected slot in PCB |
| CN106961795A (en) * | 2017-03-24 | 2017-07-18 | 江门崇达电路技术有限公司 | A kind of PCB forming methods |
| CN106961795B (en) * | 2017-03-24 | 2019-02-12 | 江门崇达电路技术有限公司 | A kind of PCB forming method |
| CN108391378A (en) * | 2018-04-03 | 2018-08-10 | 江门崇达电路技术有限公司 | The production method of minute grooves on a kind of improvement wiring board |
| CN109121307A (en) * | 2018-09-30 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | The processing method of the through slot of circuit board |
| CN109926798A (en) * | 2019-03-18 | 2019-06-25 | 昆山苏杭电路板有限公司 | The short slot processing method of the different conventional shape of L-type |
| CN111417260A (en) * | 2020-04-07 | 2020-07-14 | 信丰祥达丰电子有限公司 | Production process of PCB bevel edge metallization copper clad |
| CN111417260B (en) * | 2020-04-07 | 2021-07-30 | 信丰祥达丰电子有限公司 | Production process of PCB bevel edge metallization copper clad |
| CN113301724A (en) * | 2021-05-24 | 2021-08-24 | 福莱盈电子股份有限公司 | Method for processing short slot hole of rigid-flex board |
| CN114211564A (en) * | 2021-11-09 | 2022-03-22 | 江门市奔力达电路有限公司 | Machining method of square slotted hole and drilling machine |
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|---|---|
| CN104717846B (en) | 2018-04-03 |
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Effective date of registration: 20210809 Address after: 116000 the Great Wall Road, Changxing Island Economic Zone, Dalian, Liaoning 108 Patentee after: DALIAN SUNTAK ELECTRONICS Co.,Ltd. Address before: 529000 No. 363, Lianhai Road, high tech Development Zone, Jiangmen City, Guangdong Province Patentee before: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY Co.,Ltd. |
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