CN102721384B

CN102721384B - A kind of wiring board V-arrangement cutting bias detecting method

Info

Publication number: CN102721384B
Application number: CN201210210832.7A
Authority: CN
Inventors: 龙亚波; 陈光宏; 周定忠
Original assignee: SHENGHUA ELECTRONICS (HUIYANG) CO Ltd
Current assignee: SHENGHUA ELECTRONICS (HUIYANG) CO Ltd
Priority date: 2012-06-26
Filing date: 2012-06-26
Publication date: 2015-10-21
Anticipated expiration: 2032-06-26
Also published as: CN102721384A

Abstract

The present invention relates to a kind of wiring board V-arrangement cutting bias detecting method, in drilling holes on circuit board operation, in boring formula, add V-CUT offset inspection hole drilling program, V-CUT offsets the setting of inspection hole drilling program: before or after first time boring, outside the form wire of circuit board substrate, bore one or more V-CUT in every bar V-CUT line two ends of intending carrying out V-arrangement cutting and offset inspection hole; After wiring board is shaping, whether the V-CUT groove formed after the cutting of inspection V-arrangement offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, and cuts through, and can judge that V-arrangement cutting does not offset, otherwise then can judge V-arrangement cutting skew.The diameter in the anti-offset hole of described V-CUT is 0.8-1.0 millimeter.The distance that described V-CUT offsets inspection hole and form wire is 1-2 millimeter.Adopt this method to be conducive to reducing V-CUT to check difficulty, improve inspection timeliness, can stop because V-CUT line is not removed caused short circuit phenomenon, be conducive to improving V-CUT precision simultaneously.

Description

A kind of wiring board V-arrangement cutting bias detecting method

Technical field

The present invention relates to wiring board manufacture method technical field, be specifically related to a kind of wiring board V-arrangement cutting bias detecting method.

Background technology

In molding procedure, need carry out V-arrangement cutting (i.e. V-CUT) in the circuit board, owing to need carry out repeatedly V-CUT operation to wiring board, in order to enhance productivity, the general justifying V-CUT mode that adopts carries out operation.And check V-arrangement cutting whether to occur skew mainly adopting visual type at present, check that whether the V-CUT line of design on each PCS part is removed, if V-CUT line is removed, is considered as not offseting.But in actual job, because V-CUT line adopts when skin makes image transfer and artificial alignment mode to be formed, therefore there is Yin Feilin harmomegathus or artificially V-CUT line shift phenomenon caused to local derviation.And shaping profile management and control mainly carries out management and control to edges of boards distance to overall dimensions according to hole, therefore as whether being removed using V-CUT line as judging whether V-arrangement cutting occurs the standard offset, then there will be single PCS and surpass tolerance phenomenon in forming process.In addition, existing V-CUT line design mostly is and is provided with V-CUT line between each PCS and PCS, and V-CUT line tens places at least on every PNL plate, place up to a hundred at most, large by sight check workload, inspection timeliness is slow, accuracy is low, easily occur that V-CUT is not removed undetected and causes short circuit phenomenon, cause quality hidden danger.

Summary of the invention

In view of this, the technical problem to be solved in the present invention is to provide one and is conducive to reducing V-CUT inspection difficulty, improving inspection timeliness, stop because V-CUT line is not removed caused short circuit phenomenon, be conducive to the wiring board V-arrangement cutting bias detecting method improving V-CUT precision simultaneously.

For solving the problems of the technologies described above, the technical scheme that inventing provides is: a kind of wiring board V-arrangement cutting bias detecting method, comprise: in drilling holes on circuit board operation, in boring formula, add V-CUT offset inspection hole drilling program, V-CUT offsets the setting of inspection hole drilling program: before or after first time boring, outside the form wire of circuit board substrate, bore one or more V-CUT in every bar V-CUT line two ends of intending carrying out V-arrangement cutting and offset inspection hole; After wiring board is shaping, whether the V-CUT groove formed after the cutting of inspection V-arrangement offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, and cuts through, and can judge that V-arrangement cutting does not offset, otherwise then can judge V-arrangement cutting skew.

The topmost innovative point of the present invention arranges V-CUT to offset inspection hole at every bar V-CUT line two ends, whether the V-CUT groove formed after making only to need to check V-arrangement cutting when detecting offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, thus achieve simple, quick, efficient detection mode, significantly reduce V-CUT and check difficulty, improve inspection timeliness.

By implementing technical scheme of the present invention, the V-CUT line arranged on the film in prior art can be cancelled, effectively can avoid the V-CUT line skew that Yin Feilin harmomegathus in plate process and manual operation deviation are caused, thus avoid causing bigger than normal or the less than normal or V-CUT line of single PCS not cross falling to cause test short circuit phenomenon to occur.Simultaneously, the present invention adopts beyond form wire, arranges V-CUT skew inspection hole, replace and originally need design V-CUT line between each PCS, be conducive on the one hand simplifying and improve V-arrangement cutting operation operation, improve V-arrangement cutting operation precision, greatly reduce V-CUT offset detection difficulty on the other hand, improve Detection accuracy and timeliness, and effectively can check the depth of parallelism of each V-CUT groove, avoid occurring that one end is parallel, one end shift phenomenon occurs.

Further, the diameter that described V-CUT offsets inspection hole is 0.8-1.0 millimeter, and the distance that described V-CUT offsets inspection hole and form wire is 1-2 millimeter.Diameter V-CUT being offset inspection hole is preferably 0.8-1.0 millimeter, can improve the V-CUT line alignment precision on pcb board two sides.

Distance V-CUT being offset inspection hole and form wire is set to 1-2 millimeter.Can overcome within V-CUT line is arranged on form wire in the past, in tune machine process, very easily cause V-CUT to offset the problem of scrapping, be arranged on beyond form wire because V-CUT offsets inspection hole, can test-manufacture in tune machine process, then carry out adjustment job parameter according to V-CUT quality status and cause and scrap within can not form wire being hurt, can ensure that the alignment precision of the V-CUT line on wiring board two sides controls within 0.05mm.

Compared with prior art, the invention has the beneficial effects as follows: the present invention offsets inspection hole by arranging V-CUT at every bar V-CUT line two ends, whether the V-CUT groove formed after making only to need to check V-arrangement cutting when detecting offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, thus achieve simple, quick, efficient detection mode, significantly reduce V-CUT and check difficulty, improve inspection timeliness.2, the present invention adopts beyond form wire, arranges V-CUT skew inspection hole, replace and originally need design V-CUT line between each PCS, be conducive on the one hand simplifying and improve V-arrangement cutting operation operation, improve V-arrangement cutting operation precision, greatly reduce V-CUT offset detection difficulty on the other hand, improve Detection accuracy and timeliness, and effectively can check the depth of parallelism of each V-CUT groove, avoid occurring that one end is parallel, one end shift phenomenon occurs.3, the present invention cancels the V-CUT line arranged on the film in prior art, effectively can avoid the V-CUT line skew that Yin Feilin harmomegathus in plate process and manual operation deviation are caused, thus avoid causing bigger than normal or the less than normal or V-CUT line of single PCS not cross falling to cause test short circuit phenomenon to occur.

Accompanying drawing explanation

Fig. 1 offsets inspection hole rear board board structure schematic diagram for arranging V-CUT.

Embodiment

The present invention to be explained in further detail below in conjunction with drawings and Examples for the ease of it will be appreciated by those skilled in the art that.

Embodiment 1

Be used in the production of dual platen by this wiring board V-arrangement cutting bias detecting method, making sheet flow process is as follows:

Issuance of materials → boring → justifying copper facing → dry film → graphic plating → etching → anti-welding → word → shaping → product inspection.

Other step all adopts prior art to carry out, but in drilling operating, in boring formula, add V-CUT offset inspection hole drilling program, V-CUT offsets the setting of inspection hole drilling program: before or after first time boring, as shown in Figure 1, outside the form wire 11 of circuit board substrate 1, bore a V-CUT in every bar V-CUT line 12 two ends of intending carrying out V-arrangement cutting and offset inspection hole 13, the diameter that V-CUT offsets inspection hole is 0.8 millimeter, and the distance that V-CUT offsets inspection hole and form wire is 1 millimeter.In dry film operation, the film is cancelled V-CUT line, after wiring board is shaping, whether the V-CUT groove formed after the cutting of inspection V-arrangement offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, cut through, can judge that V-arrangement cutting does not offset, otherwise then can judge V-arrangement cutting skew.

Embodiment 2

Be used in the production of four panels by this wiring board V-arrangement cutting bias detecting method, making sheet flow process is as follows:

Other step all adopts prior art to carry out, but in drilling operating, in boring formula, add V-CUT offset inspection hole drilling program, V-CUT offsets the setting of inspection hole drilling program: before or after first time boring, outside the form wire of circuit board substrate, bore a V-CUT in every bar V-CUT line two ends of intending carrying out V-arrangement cutting and offset inspection hole, the diameter that V-CUT offsets inspection hole is 1 millimeter, and the distance that V-CUT offsets inspection hole and form wire is 2 millimeters.In dry film operation, the film is cancelled V-CUT line, after wiring board is shaping, whether the V-CUT groove formed after the cutting of inspection V-arrangement offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, cut through, can judge that V-arrangement cutting does not offset, otherwise then can judge V-arrangement cutting skew.

More than in embodiment, during detection, whether the V-CUT groove that staff is formed after only needing to check V-arrangement cutting offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, detection mode is simple, quick, efficient, significantly reduce V-CUT to check difficulty, improve inspection timeliness, thoroughly stop because V-CUT line is not removed caused short circuit phenomenon.Because diameter V-CUT being offset inspection hole is preferably 0.8-1.0 millimeter, significantly improve the V-CUT line alignment precision on pcb board two sides.Distance V-CUT being offset inspection hole and form wire is set to 1-2 millimeter, overcome within V-CUT line is arranged on form wire in the past, in tune machine process, very easily cause V-CUT to offset the problem of scrapping, be arranged on beyond form wire because V-CUT offsets inspection hole, can test-manufacture in tune machine process, then carry out adjustment job parameter according to V-CUT quality status and cause and scrap within can not form wire being hurt, the alignment precision of the wiring board not V-CUT line of coplanar is controlled within 0.05mm.

Above-described embodiment is the preferred embodiment of the present invention, and in addition, the present invention can also have other implementations.That is, under the prerequisite not departing from the present invention's design, any apparent replacement also should fall within protection scope of the present invention.

Claims

1. a wiring board V-arrangement cutting bias detecting method, it is characterized in that comprising: in drilling holes on circuit board operation, in boring formula, add V-CUT offset inspection hole drilling program, V-CUT offsets the setting of inspection hole drilling program: before or after first time boring, outside the form wire (11) of circuit board substrate (1), bore one or more V-CUT in every bar V-CUT line (12) two ends of intending carrying out V-arrangement cutting and offset inspection hole (13); In dry film operation, the film is cancelled V-CUT line; After wiring board is shaping, whether the V-CUT groove formed after the cutting of inspection V-arrangement offsets the inspection hole center of circle from the V-CUT at V-CUT line two ends cuts through, and cuts through, and can judge that V-arrangement cutting does not offset, otherwise then can judge V-arrangement cutting skew.

2. wiring board V-arrangement cutting bias detecting method according to claim 1, is characterized in that: the diameter that described V-CUT offsets inspection hole (13) is 0.8-1.0 millimeter.

3. wiring board V-arrangement cutting bias detecting method according to claim 2, is characterized in that: it is 1-2 millimeter that described V-CUT offsets inspection hole (13) with the distance of form wire (11).