CN103753643A - Method for drilling in front face and back face - Google Patents
Method for drilling in front face and back face Download PDFInfo
- Publication number
- CN103753643A CN103753643A CN201410030865.2A CN201410030865A CN103753643A CN 103753643 A CN103753643 A CN 103753643A CN 201410030865 A CN201410030865 A CN 201410030865A CN 103753643 A CN103753643 A CN 103753643A
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- pcb board
- auxiliary positioning
- predetermined depth
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- positioning holes
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000005553 drilling Methods 0.000 title abstract description 8
- 229920001342 Bakelite® Polymers 0.000 claims abstract description 7
- 239000004637 bakelite Substances 0.000 claims abstract description 7
- 238000003754 machining Methods 0.000 abstract 2
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 230000001788 irregular Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 241001074085 Scophthalmus aquosus Species 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention discloses a method for drilling in a front face and a back face. The method comprises the method that A, three positioning holes are formed in the middle of a PCB, the PCB is fixed by the way that positioning pins are used for penetrating through the positioning holes, the four corners of the PCB are respectively provided with three auxiliary positioning holes, screws and gaskets are used for penetrating through the auxiliary positioning holes, and the PCB and a drilling crew panel bakelite plate are locked; B, a special drill point is used for drilling a first preset depth; C, a conventional drilling point is used for drilling a second preset depth in the front face, mirroring is conducted in a Y axis through the coordinate quadrant of the positioning holes, then a third preset depth is drilled in the back face of the PCB, and a board surface is drilled to be penetrated through. According to the technical scheme, under the condition that an existing drill point can not be used for machining thick boards, the method can be used for machining the thick boards which can not be machined in the prior art and board surfaces which are designed to be not flat, and the yield is improved.
Description
Technical field
The present invention relates to printed board manufacturing technology field, relate in particular to the boring method that a kind of tow sides bore.
Background technology
In the process of manufacture of printed board, need on applicable position, hole, so that the installation of components and parts or the layout of circuit.Conventional boring method is that pcb board is fixed on board, and then uses conventional drill bit to get out required position, hole.But along with the development of technology, the thickness of printed board increases gradually, and existing drill point can not drill thicker pcb board.In addition, part wiring board producer takes the long method lengthening of sword for≤1.0mm small-bore, but the difficult quality requirements that meets processing still.Finally, for the irregular plate of plate face, existing boring method is: to irregular region, take the method for filling to make plate face maintenance level, and then boring, operation easier is high, can not meet plate the face more and welding PAD more pcb board quality demand in position that is designed to window.
Summary of the invention
The boring method that provides a kind of tow sides to bore is provided the object of the invention, adopts technical solution of the present invention in the situation that existing drill point can not be processed slab, to process the not machinable slab of prior art and the irregular plate face of particular design, improves yields.
The embodiment of the present invention proposes the boring method that a kind of tow sides bore, and comprising:
A, three locating holes are set in the centre of described pcb board, use shop bolt through the fixing described pcb board of described locating hole, and at pcb board four jiaos, three auxiliary positioning holes are set respectively, use screw and pad, through described auxiliary positioning hole, by pcb board and the locking of machine table top bakelite plate;
B, use extraordinary drill point first to pierce the first predetermined depth;
C, use conventional drill point to pierce the second predetermined depth in the front of pcb board, the coordinate quadrant by described locating hole, carries out mirror image with Y-axis, at the reverse side of described pcb board, pierces the 3rd predetermined depth again, drills plate face.
Further, when using screw and pad locking, in three described auxiliary positioning holes of four jiaos, auxiliary positioning hole locks described in one of them of selected each angle, and all the other two auxiliary positioning holes are standby hole.
Further, described auxiliary positioning hole is that aperture is that 5 millimeters, three spacing between auxiliary positioning hole are the auxiliary positioning hole of 3 millimeters.
Further, the interval of described the first predetermined depth be described pcb board thick 5% to 20%.
Further, the interval of described the second predetermined depth be described pcb board thick 40% to 70%; The interval of described the 3rd predetermined depth be described pcb board thick 40% to 70%; And described the second predetermined depth add the above the 3rd predetermined depth be more than or equal to described pcb board thick 100%.
Therefore, the invention process is by arranging respectively three auxiliary positioning holes at pcb board four jiaos, use screw and pad that pcb board is locked on machine table top bakelite plate, the centre of plate arranges three locating holes, so that the location of boring and the leveling of plate face (using screw and pad can effectively prevent that plate from sticking up), then adopt extraordinary drill point first to carry out preboring, be pre-drilled into the first predetermined depth, pre-determined bit while realizing boring, finally in the method that adopts tow sides to bore, first with conventional drill point, pierce the second predetermined depth, by the coordinate quadrant of this locating hole, with Y-axis, carry out mirror image, pierce again overleaf the 3rd predetermined depth, once drill plate face.Visible, application the technical program, without specific, drill point is designed and lengthened, use existing drill point can process thicker pcb board, and for plate face, irregular pcb board is set, adopt the method for positive and negative brill, aperture can carry out normal process, and in big-diameter hole drilling process, can avoid because of the out-of-flatness of plate face, damage in the unsettled hole of causing of one side with backing plate contact, thereby improve working ability and product yield.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the boring method of a kind of tow sides brill provided by the invention;
Fig. 2 is the locking schematic diagram of the pcb board of boring method provided by the invention;
Fig. 3 is position, the hole schematic diagram of pcb board provided by the invention.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Referring to Fig. 1, be the schematic flow sheet of the first embodiment of the boring method that bores of the tow sides of a kind of pcb board provided by the invention, the method comprises the following steps:
Step 101:A, three locating holes are set in the centre of pcb board, use shop bolt through the fixing pcb board of described locating hole, and three auxiliary positioning holes are set respectively, use screw and pad at pcb board four jiaos, through auxiliary positioning hole, by pcb board and the locking of machine table top bakelite plate.
In the present embodiment, referring to Fig. 2, the pcb board locking schematic diagram that Fig. 2 provides for the present embodiment, wherein, screw 201 and pad 202 are by auxiliary positioning hole by pcb board 203 and 204 lockings of machine table top bakelite plate, and shop bolt 205 is by the fixing pcb board of locating hole.Pad 202 can increase contact area.Screw 201 can be, but not limited to for long 18.2 millimeters, aperture is the screw of 4 millimeters.Pad 202 can be, but not limited to for outer ring diameter be that 9 millimeters, interior ring diameter are the pad of 4.15 millimeters.
In the present embodiment, referring to Fig. 3, Fig. 3 is position, the hole schematic diagram of pcb board, as shown in the figure, wherein Reference numeral a is that the distance of auxiliary positioning hole and pcb board left margin is 3 millimeters, and b is that aperture is the auxiliary positioning hole of 5 millimeters, and c is that the coboundary distance of hole and pcb board is 5 millimeters, d is that aperture is the locating hole of 3.175 millimeters, and wherein the locating hole on PCB top is positioned at the center of pcb board.The left locating hole of bottom is positioned at the center of pcb board, and e is that the spacing between auxiliary positioning hole is 3 millimeters, and f is that the spacing of bottom two locating holes is 100 to 150 millimeters.
In the present embodiment, four jiaos at pcb board are provided with three auxiliary positioning holes, when using screw and pad locking, in three auxiliary positioning holes of four jiaos, one of them auxiliary positioning hole at selected each angle locks, and plate face is flattened, can effectively prevent that plate from sticking up, prevent locating bias, all the other two auxiliary positioning holes are standby hole, can prevent because locating with standby hole after via hole breakage again.。
Step 102:B, use extraordinary drill point first to pierce the first predetermined depth.
In the present embodiment, first use extraordinary drill point to carry out preboring to bore position, the interval of the first predetermined depth be pcb board thick 5% to 20%, for plate face, irregular plate is set, in conjunction with locate mode and preboring, can normal process.
Step 103:C, use conventional drill point to pierce the second predetermined depth in the front of pcb board, the coordinate quadrant by locating hole, carries out mirror image with Y-axis, at the reverse side of pcb board, pierces the 3rd predetermined depth again, drills plate face.
In the present embodiment, the interval of the second predetermined depth be pcb board thick 40% to 70%.The interval of the 3rd predetermined depth be described pcb board thick 40% to 70%.And second predetermined depth add the 3rd predetermined depth must be more than or equal to pcb board thick 100%, thereby can drill plate face.For example, when preboring, first preboring 5%, pierces 60% while then boring in front, and reverse side pierces 50% while boring, and once drills through plate face.
In the present embodiment, board processing can be carried out in segmentation, improves the production yield of printed board.In addition, by taking special locate mode, with the method for using segmentation to bore, make registration accuracy that tow sides add man-hour in 3mil.In the time of can guaranteeing that thickness of slab exceeds the long design of effective sword of drill point, product is processed.Finally, use the method for this invention, macropore is added to man-hour, the going out the edge of a knife and can not touch irregular plate face of drill point, can avoid wearing the hole of coming and damaging because designing irregular plate.
Therefore, the embodiment of the present invention is by arranging respectively three auxiliary positioning holes at pcb board four jiaos, use screw and pad that pcb board is locked on machine table top bakelite plate, the centre of plate arranges three locating holes, so that the location of boring and the leveling of plate face (using screw and pad can effectively prevent that plate from sticking up), then adopt extraordinary drill point first to carry out preboring, 5% of the preboring thickness of slab degree of depth, pre-determined bit while realizing boring, finally in the method that adopts tow sides to bore, first with conventional drill point, pierce 60% of the thickness of slab degree of depth, by the coordinate quadrant of this locating hole, with Y-axis, carry out mirror image, bore again 50% overleaf, once drill plate face.Visible, application the technical program, without specific, drill point is designed and lengthened, use existing drill point can process thicker pcb board, and for plate face, irregular pcb board is set, adopt the method for positive and negative brill, aperture can carry out normal process, and in big-diameter hole drilling process, can avoid because of the out-of-flatness of plate face, damage in the unsettled hole of causing of one side with backing plate contact, thereby improve working ability and product yield.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. the boring method that tow sides bore, is characterized in that, comprising:
A, three locating holes are set in the centre of described pcb board, use shop bolt through the fixing described pcb board of described locating hole, and at pcb board four jiaos, three auxiliary positioning holes are set respectively, use screw and pad, through described auxiliary positioning hole, by pcb board and the locking of machine table top bakelite plate;
B, use extraordinary drill point first to pierce the first predetermined depth;
C, use conventional drill point to pierce the second predetermined depth in the front of pcb board, the coordinate quadrant by described locating hole, carries out mirror image with Y-axis, at the reverse side of described pcb board, pierces the 3rd predetermined depth again, drills plate face.
2. the boring method that tow sides as claimed in claim 1 bore, is characterized in that,
When using screw and pad locking, in three described auxiliary positioning holes of four jiaos, auxiliary positioning hole locks described in one of them of selected each angle, and all the other two auxiliary positioning holes are standby hole.
3. the boring method that tow sides as claimed in claim 1 or 2 bore, is characterized in that,
Described auxiliary positioning hole is that aperture is that 5 millimeters, three spacing between auxiliary positioning hole are the auxiliary positioning hole of 3 millimeters.
4. the boring method that tow sides according to claim 1 bore, is characterized in that, the interval of described the first predetermined depth be described pcb board thick 5% to 20%.
5. the boring method that tow sides according to claim 1 bore, is characterized in that,
The interval of described the second predetermined depth be described pcb board thick 40% to 70%;
The interval of described the 3rd predetermined depth be described pcb board thick 40% to 70%;
And described the second predetermined depth add the above the 3rd predetermined depth be more than or equal to described pcb board thick 100%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410030865.2A CN103753643B (en) | 2014-01-22 | 2014-01-22 | The boring method that a kind of tow sides bore |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410030865.2A CN103753643B (en) | 2014-01-22 | 2014-01-22 | The boring method that a kind of tow sides bore |
Publications (2)
| Publication Number | Publication Date |
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| CN103753643A true CN103753643A (en) | 2014-04-30 |
| CN103753643B CN103753643B (en) | 2016-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410030865.2A Expired - Fee Related CN103753643B (en) | 2014-01-22 | 2014-01-22 | The boring method that a kind of tow sides bore |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104260146A (en) * | 2014-08-15 | 2015-01-07 | 安徽广德威正光电科技有限公司 | BT (bismaleimide triazine) substrate drilling process |
| CN104785811A (en) * | 2015-05-11 | 2015-07-22 | 大族激光科技产业集团股份有限公司 | Micro-hole machining method |
| CN105671217A (en) * | 2016-04-11 | 2016-06-15 | 侯如升 | Leather drilling device |
| CN106332473A (en) * | 2015-06-15 | 2017-01-11 | 东莞生益电子有限公司 | Backboard processing method, adopted die and backboard manufactured by use of processing method |
| CN107486892A (en) * | 2017-09-29 | 2017-12-19 | 广东兴达鸿业电子有限公司 | Pcb board drilling and positioning method |
| CN109093773A (en) * | 2018-09-18 | 2018-12-28 | 奥士康精密电路（惠州）有限公司 | A method of promoting shape bakelite plate service efficiency |
| CN109176703A (en) * | 2018-08-01 | 2019-01-11 | 广州美维电子有限公司 | A kind of boring method improving high thick diameter pcb board borehole accuracy |
| CN112974918A (en) * | 2021-04-15 | 2021-06-18 | 苏州维嘉科技股份有限公司 | Contact tip detecting device and method, signal processing device and method, and drilling machine |
| CN114340174A (en) * | 2022-01-10 | 2022-04-12 | 鹤山市泰利诺电子有限公司 | Drilling method for single panel and single panel manufactured by drilling method |
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| JPH08323697A (en) * | 1995-05-26 | 1996-12-10 | Matsushita Electric Works Ltd | Multi-layered printed circuit board drilling method |
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN201947534U (en) * | 2011-01-12 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | Multilayer printed circuit board with high thickness-diameter ratio |
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2014
- 2014-01-22 CN CN201410030865.2A patent/CN103753643B/en not_active Expired - Fee Related
Patent Citations (5)
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| JPH08323697A (en) * | 1995-05-26 | 1996-12-10 | Matsushita Electric Works Ltd | Multi-layered printed circuit board drilling method |
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104260146A (en) * | 2014-08-15 | 2015-01-07 | 安徽广德威正光电科技有限公司 | BT (bismaleimide triazine) substrate drilling process |
| CN104260146B (en) * | 2014-08-15 | 2016-06-22 | 安徽广德威正光电科技有限公司 | BT plate bore process |
| CN104785811A (en) * | 2015-05-11 | 2015-07-22 | 大族激光科技产业集团股份有限公司 | Micro-hole machining method |
| CN106332473A (en) * | 2015-06-15 | 2017-01-11 | 东莞生益电子有限公司 | Backboard processing method, adopted die and backboard manufactured by use of processing method |
| CN106332473B (en) * | 2015-06-15 | 2019-12-20 | 东莞生益电子有限公司 | Back plate processing method, mold adopted by back plate processing method and back plate manufactured by back plate processing method |
| CN105671217A (en) * | 2016-04-11 | 2016-06-15 | 侯如升 | Leather drilling device |
| CN107486892A (en) * | 2017-09-29 | 2017-12-19 | 广东兴达鸿业电子有限公司 | Pcb board drilling and positioning method |
| CN109176703A (en) * | 2018-08-01 | 2019-01-11 | 广州美维电子有限公司 | A kind of boring method improving high thick diameter pcb board borehole accuracy |
| CN109093773A (en) * | 2018-09-18 | 2018-12-28 | 奥士康精密电路（惠州）有限公司 | A method of promoting shape bakelite plate service efficiency |
| CN112974918A (en) * | 2021-04-15 | 2021-06-18 | 苏州维嘉科技股份有限公司 | Contact tip detecting device and method, signal processing device and method, and drilling machine |
| CN114340174A (en) * | 2022-01-10 | 2022-04-12 | 鹤山市泰利诺电子有限公司 | Drilling method for single panel and single panel manufactured by drilling method |
| CN114340174B (en) * | 2022-01-10 | 2024-04-05 | 鹤山市泰利诺电子有限公司 | Drilling method of single panel and single panel manufactured by drilling method |
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| CN103753643B (en) | 2016-09-28 |
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Granted publication date: 20160928 |