CN103056411A - Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing - Google Patents
Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing Download PDFInfo
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- CN103056411A CN103056411A CN 201210585292 CN201210585292A CN103056411A CN 103056411 A CN103056411 A CN 103056411A CN 201210585292 CN201210585292 CN 201210585292 CN 201210585292 A CN201210585292 A CN 201210585292A CN 103056411 A CN103056411 A CN 103056411A
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Abstract
The invention relates to a method for designing a positioning hole drilling target after multi-layer printed circuit board (PCB) pressing. According to the method, benchmark targets A and B and a directional target C are arranged, the targets A and B are located on the same horizontal line, the targets A and C are located on the same vertical line, and the three targets are distributed in a right angle. The targets are composed of concentric circles in different sizes, the target B is same to the target C, and target centers of the targets B and C are solid circles. Sizes of the concentric circles of the target A are equal to those of the concentric circles of the targets B and C, an equilateral triangle is hollowed out at the position of the target center of the target A , and a vertex angle of the equilateral triangle directs to the directional target C. The method is suitable for any target drilling machine table, recognition time of the machine table can be effectively shortened by the aid of the target design, the machine table can be rapidly positioned, the machining time is shortened, the work efficiency is improved, and the target drilling accuracy can be improved.
Description
Technical field
The present invention relates to PCB manufacturing technology field, be specifically related to positioning hole drilling drone design method after a kind of multi-layer PCB board pressing.
Background technology
The design of internal layer edges of boards positioning target is indispensable in multilayer (more than four layers or four layers) PCB manufacturing process, it mainly is when shifting by inner figure, at edges of boards ad-hoc location Design Orientation target in advance, be convenient to get out after the pressing, for the fixing instrument of plate and machine drilling aligning inner figure of follow-up boring processing procedure pin.Various figures are adopted in traditional multi-layer PCB positioning target design, after the pressing by milling copper sheet, high light penetrates base material part, the light tight formation image of copper part is arranged, automatically be positioned to the brill target position after the CCD camera lens catches and finish bore operation, or adopt the X-RAY ray to penetrate the characteristic that the different-thickness metal weakens degree varies, and the figure that the formation shade differs projects on the CCD camera lens, and board is positioned to target position and bore operation automatically.Development along with the PCB industry, make the PCB number of plies more and more higher, requirement on machining accuracy is also more and more higher, and copper sheet is milled in use and CCD brill target operating type is subjected to the factor affecting such as thickness of slab, precision and interlayer skew, can't satisfy the demand of production development, so most of pressing manufacturer all produces importing energetically and adopting X-RAY to bore the target mode.But the target setting of X-RAY lathe often because the lathe model is different, is difficult to unification, and drone design has increased designer's workload, and production efficiency is low.In addition, target position may have skew or because the operation of drilling operating may produce the shift phenomenon in hole, these all can't be monitored and correct, and affect the production board quality after the multi-layer sheet pressing.
Summary of the invention
The technical problem to be solved in the present invention provide a kind of be applicable to different bore the target drone platforms can the pressing of effective monitoring multi-layer sheet after the level to level alignment degree and bore target after the method for designing of positioning hole drilling target after the multi-layer PCB board pressing of locating hole degrees of offset.
For solving the problems of the technologies described above, the technical scheme that the present invention takes is: positioning hole drilling drone design method after a kind of multi-layer PCB board pressing, target A, B, C are set, the rectangular Triangle-Profile of described target, target A and target B are basic target, be separately positioned on limit, pcb board two opposite sides and target center and be positioned on the horizontal linear, target C is the direction target, is positioned at the same side of pcb board and its target center and basic target A target center with target A and is positioned on the vertical straight line; Described three target shapes are identical, and target B and target C are solid target, and an equilateral triangle is drawn out in target A target center position, and drift angle of triangle points to the target center of target C.
Preferably, distance is 250-650mm between target A and the target B, and the distance between target A and the target C is 50-350mm.
Preferably, described target A, target B and target C size, size, shape are identical.
Preferably, described target A, target B and target C include a square housing and are positioned at the concentric circles take square housing center as the center of circle that four diameters, the live width of square housing do not wait.
Preferred, described square housing is the square of 6.5-7.0mm for the length of side that the lines that adopt live width 0.20mm-0.30mm form, and can connect with edges of boards other guide phase, separates with edges of boards other guide thing target position in the frame is clear; The first annulus is the annulus of 5.5-6.0mm for the external diameter that the lines that adopt live width 0.075-0.10mm form in the square housing; The second annulus in the first annulus is the annulus of 5.0-5.5mm for the external diameter that the lines that adopt live width 0.075-0.10mm form; The 3rd annulus in the second annulus is the annulus of 3.175-3.25mm for the internal diameter that the lines that adopt live width 0.50-0.60mm form; In the 3rd annulus is 2.5-3.0mm at circular diameter.
Preferably, described equilateral triangle is drawn out in circle, and its length of side is between 1.5-2.0mm.
Compared with prior art, the invention has the beneficial effects as follows:
(1) basic target and direction target at right angles distribute among the present invention, can realize that X-RAY bores a feeding of target and finishes the boring of three targets, shorten the process-cycle, increase work efficiency;
(2) basic target A target center arranges equilateral triangle and can play Y-axis fool proof and direction target boring foolproof function, and when X-RAY bores target, intracardiac equilateral triangle drift angle points to and can make board confirm fast the orientation of target C among the target A, the time in target C orientation is reaffirmed in saving, enhance productivity, the direction target adopts and does not chase after the target operation, shortens board identification and reaction time, is guaranteeing that maximization improves board production efficiency under the prerequisite of quality;
(3) to adopt diameter be the circular target center of 2.5-3.0mm in the present invention, is fit to any brill target drone platform, is the most suitable design, can effectively shorten the board recognition time, and board is located fast, shortens process time, and can improve brill target precision.
Description of drawings
Fig. 1,2 is structural representation of the invention process.
The specific embodiment
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment the present invention is explained in further detail.
As shown in Figure 1, positioning hole drilling drone design method after the disclosed multi-layer PCB board pressing, comprise benchmark target A and B, target A and target B are separately positioned on the pcb board two relative side, the target center line of target A and B is parallel to the pcb board central axis, and the distance of target A and B is between 250-650mm.Direction target C and benchmark target A are at the same side of pcb board, the target center line of target A and C is perpendicular to the plank central axis, the distance of target A and C is between 50-350mm, and A, B, three targets of C at right angles distribute, and target A is advisable with 100-150mm to the distance of target C.
The size of target A of the present invention, target B and target C, size, shape are all identical, draw out an equilateral triangle in the center circle of different is target A.Shown in Fig. 2 embodiment, basic target B and direction target C comprise square housing 1 and the first annulus 2, the second annulus 3, the 3rd annulus 4 and circle 5.Basic target A then is to draw out an equilateral triangle 6 on the target circle 5, and the target center of one of them drift angle fixed directional direction target C of triangle, this design can be played Y-axis fool proof and direction target boring foolproof function, by the distinctive points of target A in target B, and the drift angle of equilateral triangle points in the target A, when adopting three axles to bore target or the blind brill in the 3rd hole (being direction hole C), can effectively prevent before and after the plank or about put back and cause boring wrong wad cutter C, rear processing procedure produces and scraps because locating mistake.And making the boring board can identify easily basic target, the direction target adopts and does not chase after the target operation, is directly calculated by mechanical inner setting and realizes boring, guarantees that namely processing quality can shorten again board identification and reaction time.
During implementation, preferred square housing 1 adopts the lines of live width 0.20mm-0.30mm, and the length of side is 6.5-7.0mm, can connect with edges of boards other guide phase, separates with edges of boards other guide thing target position in the frame is clear; The first annulus 2 adopts the lines of live width 0.075-0.10mm, and external diameter is 5.5-6.0mm; The second annulus 3 is for adopting the lines of live width 0.075-0.10mm, and external diameter is 5.0-5.5mm; The 3rd annulus 4 is for adopting the lines of live width 0.50-0.60mm, and internal diameter is the annulus of 3.175-3.25mm; Circle 5 diameters are 2.5-3.0mm.Equilateral triangle is drawn out in circle 5, and the length of side is between 1.5-2.0mm.
Above-described embodiment is preferred embodiment of the present invention, and in addition, the present invention can also have other implementations.That is to say, under the prerequisite that does not break away from the present invention's design, any apparent replacement also should fall within protection scope of the present invention.
Claims (8)
1. positioning hole drilling drone design method after the multi-layer PCB board pressing arranges target A, B, C, it is characterized in that:
The rectangular Triangle-Profile of described target, target A and target B are basic target, be separately positioned on limit, pcb board two opposite sides and target center and be positioned on the horizontal linear, target C is the direction target, is positioned at the same side of pcb board and its target center and basic target A target center with target A and is positioned on the vertical straight line;
Three target shapes are identical, and target B and target C are solid target, and an equilateral triangle is drawn out in target A target center position, and drift angle of triangle points to the target center of target C.
2. positioning hole drilling drone design method after the multi-layer PCB board pressing according to claim 1 is characterized in that: distance is 250-650mm between target A and the target B.
3. positioning hole drilling drone design method after the multi-layer PCB board pressing according to claim 1, it is characterized in that: the distance between target A and the target C is 50-350mm.
4. positioning hole drilling drone design method after the multi-layer PCB board pressing according to claim 1 is characterized in that: described target A, target B and target C size, size, shape are identical.
5. positioning hole drilling drone design method after the multi-layer PCB board pressing according to claim 4 is characterized in that: described target A, target B and target C include a square housing and are positioned at the concentric circles take square housing center as the center of circle that four diameters, the live width of square housing do not wait.
6. positioning hole drilling drone design method after the multi-layer PCB board pressing according to claim 5, it is characterized in that: described square housing (1) is the square of 6.5-7.0mm for the length of side that the lines that adopt live width 0.20mm-0.30mm form, can connect with edges of boards other guide phase, separate with edges of boards other guide thing target position in the frame is clear;
The first annulus (2) is the annulus of 5.5-6.0mm for the external diameter that the lines that adopt live width 0.075-0.10mm form in the square housing;
The second annulus (3) in the first annulus (2) is the annulus of 5.0-5.5mm for the external diameter that the lines that adopt live width 0.075-0.10mm form;
The 3rd annulus (4) in the second annulus (2) is the annulus of 3.175-3.25mm for the internal diameter that the lines that adopt live width 0.50-0.60mm form;
In the 3rd annulus (4) is 2.5-3.0mm justifying (5) diameter.
7. positioning hole drilling drone design method after the multi-layer PCB board pressing according to claim 1, it is characterized in that: described equilateral triangle is drawn out in justifying (5), and its length of side is between 1.5-2.0mm.
8. positioning hole drilling drone design method according to claim 5 or after the 6 described multi-layer PCB board pressings, it is characterized in that: described square housing, circle are copper-clad plate and form after etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210585292 CN103056411A (en) | 2012-12-30 | 2012-12-30 | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210585292 CN103056411A (en) | 2012-12-30 | 2012-12-30 | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing |
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| CN103056411A true CN103056411A (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201210585292 Withdrawn CN103056411A (en) | 2012-12-30 | 2012-12-30 | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103111651A (en) * | 2013-02-22 | 2013-05-22 | 胜宏科技（惠州）股份有限公司 | Method for designing positioning hole drilling targets after multilayer PCB (printed circuit board) pressing |
| CN103752882A (en) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN108801172A (en) * | 2017-05-05 | 2018-11-13 | 成都唐源电气股份有限公司 | A kind of contactless pantograph Dynamic Envelope measurement method and device |
| CN109773246A (en) * | 2019-01-30 | 2019-05-21 | 无锡深南电路有限公司 | A kind of cutting edge method and apparatus of package substrate |
| CN110213912A (en) * | 2019-06-26 | 2019-09-06 | 江门市众阳电路科技有限公司 | The radium-shine blind hole alignment method of HDI multi-layer board |
| CN111002376A (en) * | 2019-11-27 | 2020-04-14 | 惠州市金百泽电路科技有限公司 | Intelligent fool-proof method for PCB inner layer target hole |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN114521056A (en) * | 2022-04-19 | 2022-05-20 | 惠州威尔高电子有限公司 | PCB multi-layer board drilling efficiency improving method and electronic equipment |
-
2012
- 2012-12-30 CN CN 201210585292 patent/CN103056411A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103111651A (en) * | 2013-02-22 | 2013-05-22 | 胜宏科技（惠州）股份有限公司 | Method for designing positioning hole drilling targets after multilayer PCB (printed circuit board) pressing |
| CN103752882A (en) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN103752882B (en) * | 2013-12-27 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | The boring method of wiring board |
| CN108801172A (en) * | 2017-05-05 | 2018-11-13 | 成都唐源电气股份有限公司 | A kind of contactless pantograph Dynamic Envelope measurement method and device |
| CN109773246A (en) * | 2019-01-30 | 2019-05-21 | 无锡深南电路有限公司 | A kind of cutting edge method and apparatus of package substrate |
| CN110213912A (en) * | 2019-06-26 | 2019-09-06 | 江门市众阳电路科技有限公司 | The radium-shine blind hole alignment method of HDI multi-layer board |
| CN111002376A (en) * | 2019-11-27 | 2020-04-14 | 惠州市金百泽电路科技有限公司 | Intelligent fool-proof method for PCB inner layer target hole |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN114521056A (en) * | 2022-04-19 | 2022-05-20 | 惠州威尔高电子有限公司 | PCB multi-layer board drilling efficiency improving method and electronic equipment |
| CN114521056B (en) * | 2022-04-19 | 2022-08-05 | 惠州威尔高电子有限公司 | PCB multi-layer board drilling efficiency improving method and electronic equipment |
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Application publication date: 20130424 |