CN103111651A - Method for designing positioning hole drilling targets after multilayer PCB (printed circuit board) pressing - Google Patents
Method for designing positioning hole drilling targets after multilayer PCB (printed circuit board) pressing Download PDFInfo
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- CN103111651A CN103111651A CN201310056023XA CN201310056023A CN103111651A CN 103111651 A CN103111651 A CN 103111651A CN 201310056023X A CN201310056023X A CN 201310056023XA CN 201310056023 A CN201310056023 A CN 201310056023A CN 103111651 A CN103111651 A CN 103111651A
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Abstract
The invention relates to a method for designing positioning hole drilling targets after multilayer PCB (printed circuit board) pressing. The method includes setting three targets including two reference targets A and B and a direction target C, wherein the targets A and B are arranged on the same horizontal line, the targets A and C are arranged on the same vertical line, and the three targets are distributed in a right-angled manner. Each of the targets is composed of concentric circles different in diameter, wherein the targets B and C are identical, and the target eyes are solid circles. The concentric circles of the target A are identical with those of the targets B and C, an equilateral triangle is drilled at the target eye of the target A, and a vertex angle of the equilateral triangle points at the direction target C. The method for designing positioning hole drilling targets after multilayer PCB pressing is applicable to any target drilling crews, recognition time of the drilling crews can be effectively shortened by the aid of the target design, the drilling screws can be quickly positioned, processing time is shortened, work efficiency is improved and target drilling accuracy can be increased.
Description
Technical field
The present invention relates to PCB manufacturing technology field, be specifically related to a kind of positioning hole drilling drone design method after multi-layer PCB board pressing.
Background technology
The design of internal layer edges of boards positioning target is indispensable in multilayer (more than four layers or four layers) PCB manufacturing process, it is mainly when shifting by inner figure, at edges of boards ad-hoc location Design Orientation target in advance, be convenient to get out after pressing, for the fixing instrument of plate and machine drilling aligning inner figure of follow-up boring processing procedure pin.Various figures are adopted in traditional multi-layer PCB positioning target design, after pressing by milling copper sheet, high light penetrates base material part, the light tight formation image of copper part is arranged, automatically be positioned to the brill target position after the CCD camera lens catches and complete bore operation, or adopt the X-RAY ray to penetrate the characteristic that the different-thickness metal weakens degree varies, and the figure that the formation shade differs projects on the CCD camera lens, and board is positioned to target position and bore operation automatically.Development along with the PCB industry, make the PCB number of plies more and more higher, requirement on machining accuracy is also more and more higher, and copper sheet is milled in use and CCD brill target operating type is affected by the factors such as thickness of slab, precision and interlayer skew, can't satisfy the demand of production development, so most of pressing manufacturer all produces importing energetically and adopting X-RAY to bore the target mode.But the target setting of X-RAY lathe often because the lathe model is different, is difficult to unification, and drone design has increased designer's workload, and production efficiency is low.In addition, after the multi-layer sheet pressing, target position may have skew or may produce the shift phenomenon in hole due to the operation of drilling operating, and these all can't be monitored and correct, and affect the production board quality.
Summary of the invention
The technical problem to be solved in the present invention be to provide a kind of be applicable to different bore the target drone platforms can the pressing of effective monitoring multi-layer sheet after the level to level alignment degree and bore target after the method for designing of positioning hole drilling target after the multi-layer PCB board pressing of locating hole degrees of offset.
For solving the problems of the technologies described above, the technical scheme that the present invention takes is: a kind of positioning hole drilling drone design method after multi-layer PCB board pressing, target A, B, C are set, the rectangular Triangle-Profile of described target, target A and target B are basic target, be separately positioned on limit, pcb board two opposite sides and target center and be positioned on a horizontal linear, target C is the direction target, is positioned at the same side of pcb board and its target center and basic target A target center with target A and is positioned on a vertical straight line; Described three target shapes are identical, and target B and target C are solid target, and an equilateral triangle is drawn out in target A target center position, and drift angle of triangle points to the target center of target C.
Preferably, between target A and target B, distance is 250-650mm, and the distance between target A and target C is 50-350mm.
Preferably, described target A, target B and target C size, size, shape are identical.
Preferably, described target A, target B and target C include a square housing and be positioned at that four diameters, the live width of square housing do not wait take at square housing center as the concentric circles in the center of circle.
Preferred, described square housing is the square of 6.5-7.0mm for the length of side that the lines that adopt live width 0.20mm-0.30mm form, and can connect with edges of boards other guide phase, separates with edges of boards other guide thing target position in frame is clear; In the square housing, the first annulus is the annulus of 5.5-6.0mm for the external diameter that the lines that adopt live width 0.075-0.10mm form; The second annulus in the first annulus is the annulus of 5.0-5.5mm for the external diameter that the lines that adopt live width 0.075-0.10mm form; The 3rd annulus in the second annulus is the annulus of 3.175-3.25mm for the internal diameter that the lines that adopt live width 0.50-0.60mm form; In the 3rd annulus is 2.5-3.0mm at circular diameter.
Preferably, described equilateral triangle is drawn out in circle, and its length of side is between 1.5-2.0mm.
Compared with prior art, the invention has the beneficial effects as follows:
(1) in the present invention, basic target and direction target at right angles distribute, and can realize that X-RAY bores a feeding of target and completes three target borings, shorten the process-cycle, increase work efficiency;
(2) basic target A target center arranges equilateral triangle and can play Y-axis fool proof and direction target boring foolproof function, and when X-RAY bores target, in target A, intracardiac equilateral triangle drift angle points to and can make board confirm fast the orientation of target C, the time in target C orientation is reaffirmed in saving, enhance productivity, the direction target adopts and does not chase after the target operation, shortens board identification and reaction time, is guaranteeing to maximize raising board production efficiency under the prerequisite of quality;
(3) to adopt diameter be the circular target center of 2.5-3.0mm in the present invention, is fit to any brill target drone platform, is the most suitable design, can effectively shorten the board recognition time, and board is located fast, shortens process time, and can improve brill target precision.
Description of drawings
Fig. 1,2 is structural representation of the invention process.
The specific embodiment
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment, the present invention is explained in further detail.
As shown in Figure 1, positioning hole drilling drone design method after disclosed multi-layer PCB board pressing, comprise benchmark target A and B, target A and target B are separately positioned on the pcb board two relative side, the target center line of target A and B is parallel to the pcb board central axis, and the distance of target A and B is between 250-650mm.Direction target C and benchmark target A are at the same side of pcb board, the target center line of target A and C is perpendicular to the plank central axis, the distance of target A and C is between 50-350mm, and A, B, three targets of C at right angles distribute, and target A is advisable with 100-150mm to the distance of target C.
The size of target A of the present invention, target B and target C, size, shape are all identical, draw out an equilateral triangle in the center circle of different is target A.As shown in Fig. 2 embodiment, basic target B and direction target C comprise square housing 1 and the first annulus 2, the second annulus 3, the 3rd annulus 4 and circle 5.Basic target A is to draw out an equilateral triangle 6 on target circle 5, and the target center of one of them drift angle fixed directional direction target C of triangle, this design can be played Y-axis fool proof and direction target boring foolproof function, by the distinctive points of target A in target B, and in target A, the drift angle of equilateral triangle points to, when adopting three axles to bore target or the blind brill in the 3rd hole (being direction hole C), can effectively prevent before and after plank or the left and right puts back and causes boring wrong wad cutter C, rear processing procedure produces and scraps because locating mistake.And making the boring board can identify easily basic target, the direction target adopts and does not chase after the target operation, is directly calculated by mechanical inner setting and realizes boring, guarantees that namely processing quality can shorten again board identification and reaction time.
During concrete enforcement, preferred square housing 1 adopts the lines of live width 0.20mm-0.30mm, and the length of side is 6.5-7.0mm, can connect with edges of boards other guide phase, separates with edges of boards other guide thing target position in frame is clear; The first annulus 2 adopts the lines of live width 0.075-0.10mm, and external diameter is 5.5-6.0mm; The second annulus 3 is for adopting the lines of live width 0.075-0.10mm, and external diameter is 5.0-5.5mm; The 3rd annulus 4 is for adopting the lines of live width 0.50-0.60mm, and internal diameter is the annulus of 3.175-3.25mm; Circle 5 diameters are 2.5-3.0mm.Equilateral triangle is drawn out in circle 5, and the length of side is between 1.5-2.0mm.
Above-described embodiment is the preferred embodiment of the present invention, and in addition, the present invention can also have other implementations.That is to say, under the prerequisite that does not break away from the present invention's design, within any apparent replacement also should fall into protection scope of the present invention.
Claims (8)
1. positioning hole drilling drone design method after the multi-layer PCB board pressing, arrange target A, B, C, it is characterized in that:
The rectangular Triangle-Profile of described target, target A and target B are basic target, be separately positioned on limit, pcb board two opposite sides and target center and be positioned on a horizontal linear, target C is the direction target, is positioned at the same side of pcb board and its target center and basic target A target center with target A and is positioned on a vertical straight line;
Three target shapes are identical, and target B and target C are solid target, and an equilateral triangle is drawn out in target A target center position, and drift angle of triangle points to the target center of target C.
2. positioning hole drilling drone design method after multi-layer PCB board pressing according to claim 1 is characterized in that: between target A and target B, distance is 250-650mm.
3. positioning hole drilling drone design method after multi-layer PCB board pressing according to claim 1, it is characterized in that: the distance between target A and target C is 50-350mm.
4. positioning hole drilling drone design method after multi-layer PCB board pressing according to claim 1 is characterized in that: described target A, target B and target C size, size, shape are identical.
5. positioning hole drilling drone design method after multi-layer PCB board pressing according to claim 4 is characterized in that: described target A, target B and target C include a square housing and be positioned at that four diameters, the live width of square housing do not wait take at square housing center as the concentric circles in the center of circle.
6. positioning hole drilling drone design method after multi-layer PCB board pressing according to claim 5, it is characterized in that: described square housing (1) is the square of 6.5-7.0mm for the length of side that the lines that adopt live width 0.20mm-0.30mm form, can connect with edges of boards other guide phase, separate with edges of boards other guide thing target position in frame is clear;
In the square housing, the first annulus (2) is the annulus of 5.5-6.0mm for the external diameter that the lines that adopt live width 0.075-0.10mm form;
The second annulus (3) in the first annulus (2) is the annulus of 5.0-5.5mm for the external diameter that the lines that adopt live width 0.075-0.10mm form;
The 3rd annulus (4) in the second annulus (2) is the annulus of 3.175-3.25mm for the internal diameter that the lines that adopt live width 0.50-0.60mm form;
In the 3rd annulus (4) is 2.5-3.0mm justifying (5) diameter.
7. positioning hole drilling drone design method after multi-layer PCB board pressing according to claim 1, it is characterized in that: described equilateral triangle is drawn out in justifying (5), and its length of side is between 1.5-2.0mm.
8. positioning hole drilling drone design method after according to claim 5 or 6 described multi-layer PCB board pressings is characterized in that: described square housing, circle are copper-clad plate and form after etching.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106211637A (en) * | 2016-07-21 | 2016-12-07 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI circuit board |
CN112985320A (en) * | 2019-12-16 | 2021-06-18 | 颀邦科技股份有限公司 | Circuit board |
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WO2002030636A1 (en) * | 2000-10-11 | 2002-04-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board production method and circuit board production data |
JP2009045680A (en) * | 2007-08-17 | 2009-03-05 | Yanagisawa Giken Co Ltd | Method for machining tilted fine hole |
CN101537505B (en) * | 2008-12-30 | 2011-05-25 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
CN103056411A (en) * | 2012-12-30 | 2013-04-24 | 胜宏科技(惠州)有限公司 | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing |
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2013
- 2013-02-22 CN CN201310056023XA patent/CN103111651A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2002030636A1 (en) * | 2000-10-11 | 2002-04-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board production method and circuit board production data |
JP2009045680A (en) * | 2007-08-17 | 2009-03-05 | Yanagisawa Giken Co Ltd | Method for machining tilted fine hole |
CN101537505B (en) * | 2008-12-30 | 2011-05-25 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
CN103056411A (en) * | 2012-12-30 | 2013-04-24 | 胜宏科技(惠州)有限公司 | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106211637A (en) * | 2016-07-21 | 2016-12-07 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI circuit board |
CN112985320A (en) * | 2019-12-16 | 2021-06-18 | 颀邦科技股份有限公司 | Circuit board |
CN112985320B (en) * | 2019-12-16 | 2024-04-16 | 颀邦科技股份有限公司 | Circuit board |
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Application publication date: 20130522 |