CN205071431U - PCB board is with preventing partially to bit architecture - Google Patents
PCB board is with preventing partially to bit architecture Download PDFInfo
- Publication number
- CN205071431U CN205071431U CN201520702748.6U CN201520702748U CN205071431U CN 205071431 U CN205071431 U CN 205071431U CN 201520702748 U CN201520702748 U CN 201520702748U CN 205071431 U CN205071431 U CN 205071431U
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- pcb board
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- egative film
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- bias
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Abstract
PCB board is with preventing partially to bit architecture, relate to PCB board technical field, its structure includes the PCB board, outer film with prevent welding the film, adopt the numerical control device outer film with prevent welding the corresponding edge of film and edit and make a plurality of target, during outer exposure, the target of outer film shifts the board in PCB along with the outer figure of outer film, because make after the etching of PCB board in PCB board target hole, therefore the offset in PCB board target hole and the offset direction outer figure of all accompanying the PCB board, the outer figure that is the PCB board does not have any relativity shift with the PCB board target hole of PCB board flange, for guaranteeing the uniformity, when preventing welding the exposure counterpoint like this, regard as new tooling hole and prevent the film target hole of welding the film with PCB board target hole and counterpoint, go up and effectively to correct behind the PIN needle because of the outer figure of the harmomegathus of PCB board or therefore the PCB board that lead to the fact former because of skin counterpoint precision and the skew of preventing welding the figure, make the PCB board outer image with prevent welding that the film is accurate counterpoints.
Description
Technical field
The utility model relates to pcb board technical field, is specifically related to the anti-bias aligning structure of a kind of pcb board.
Background technology
At present, in the anti-welding exposure process of pcb board, most of pcb board manufacturer still uses manual exposure machine to carry out operation, before utilizing manual exposure machine to carry out operation, contraposition need be carried out to the outer graphics on pcb board and solder prevention bottom plate, existing alignment mode mainly contains two kinds, one is contraposition manually, adopt contraposition manually, need operating personnel relatively many, and higher to the skill set requirements of operating personnel, and then cause production cost higher, and artificial contraposition easily causes off normal, causes product quality bad, another kind adopts PIN to nail on PIN contraposition, although this mode comparatively manual alignment can save manpower, efficiency promotes to some extent, but in this employing, PIN follows closely contraposition tooling hole used is that skin is manufactured last brill and got out, due to can harmomegathus be there is aborning because of pcb board, and outer egative film and pcb board contraposition time the pcb board that all can cause because of reasons such as equipment aligning accuracy on the comparatively boring of outer graphics have certain deviation, therefore, before pcb board carries out anti-welding exposure, outer graphics on pcb board on it tooling hole got out have certain offseting, if now also adopt above-mentioned tooling hole to position exposure to solder prevention bottom plate, probably cause off normal, on ink, PAD causes product bad or scrap.
Summary of the invention
The purpose of this utility model is for deficiency of the prior art, and provides simple, easy to implement, the anti-welding contraposition of a kind of structure anti-bias aligning structure of pcb board accurately.
The purpose of this utility model is achieved through the following technical solutions:
There is provided a kind of pcb board anti-bias aligning structure, comprise pcb board, outer egative film and solder prevention bottom plate, it is characterized in that: the described outer egative film edge corresponding with described solder prevention bottom plate is equipped with several targets with numerical control device editing.
During outer exposure, the target of described outer egative film shifts in described pcb board with the outer graphics of described outer egative film, and described pcb board forms pcb board target hole with the described target punching on it.
During anti-welding exposure, described solder prevention bottom plate forms egative film target hole with the described target punching on it, and PIN needle is arranged in corresponding described pcb board target hole and described egative film target hole.
Wherein, four edges that described outer egative film is corresponding with described solder prevention bottom plate are equipped with target.
Wherein, each edge that described outer egative film is corresponding with described solder prevention bottom plate is equipped with two targets.
Wherein, four edges of described pcb board are also provided with for carrying out the pcb board tooling hole of contraposition with described outer egative film.
Wherein, an edge of described pcb board is also provided with error-proof structure.
Wherein, described error-proof structure is four the fool proof holes be arranged side by side.
Wherein, described pcb board is individual layer pcb board.
Wherein, described pcb board is multi-layer PCB board.
The beneficial effects of the utility model:
The anti-bias aligning structure of pcb board of the present utility model, adopt numerical control device at outer egative film edge editing several targets corresponding with solder prevention bottom plate, during outer exposure, the target of outer egative film shifts in pcb board with the outer graphics of outer egative film, because pcb board target hole is made after pcb board etching, thus the side-play amount in pcb board target hole and offset direction are all in company with the outer graphics of pcb board, namely the outer graphics of pcb board and the pcb board target hole of pcb board edges of boards are without any relativity shift, keep consistency, like this when anti-welding exposure aligning, contraposition is carried out using pcb board target hole as the egative film target hole of new tooling hole and solder prevention bottom plate, can effectively correct because of the harmomegathus of pcb board or the outer graphics of pcb board caused because of outer aligning accuracy reason and the skew of anti-welding figure after upper PIN needle, make outer tomographic image and the solder prevention bottom plate exactitude position of pcb board.
Accompanying drawing explanation
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in accompanying drawing does not form any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the structural representation of pcb board of the present utility model by anti-bias aligning structure.
Include in Fig. 1:
1-PCB plate;
2-PCB plate target hole;
3-PCB plate tooling hole;
4-fool proof hole.
Embodiment
With the following Examples the utility model is further described.
embodiment 1
A kind of pcb board of the present utility model one of embodiment of anti-bias aligning structure, as shown in Figure 1, comprise pcb board 1, outer egative film and solder prevention bottom plate, pcb board 1 is individual layer pcb board.Adopt numerical control device to have several targets at four edge editings that outer egative film is corresponding with solder prevention bottom plate, preferably, each edge is provided with each one of two target C.S faces, and target is that X-Ray bores the legible radar graphic figure of rake machine.Be provided with for carrying out the pcb board tooling hole 3 of contraposition with outer egative film at four edges of pcb board 1, certainly, outer egative film is also provided with the tooling hole corresponding with pcb board tooling hole 3, when exposing, outer egative film and pcb board 1 carry out contraposition by the tooling hole of outer egative film and pcb board tooling hole 3, are then shifted on pcb board 1 by the outer graphics of outer egative film.
During outer exposure, by while the Graphic transitions on outer egative film is on pcb board 1, the target patterns on outer egative film also shifts in pcb board 1 with the outer graphics on outer egative film, after etching, adopts and bores the target that target drone aims on PCB1 and carry out brill wad cutter 2.
During anti-welding exposure, the same target boring target drone aligning solder prevention bottom plate that adopts is drilled to target hole, and PIN needle is arranged in corresponding pcb board target hole 2 with in egative film target hole, thus completes pcb board 1 and solder prevention bottom plate contraposition.
Because pcb board target hole 2 is made after pcb board 1 etches, thus the side-play amount in pcb board target hole 2 and offset direction are all in company with the outer graphics of pcb board 1, namely the outer graphics of pcb board 1 and pcb board target hole 2 are without any relativity shift, like this when anti-welding exposure aligning, contraposition is carried out in egative film target hole as new tooling hole and solder prevention bottom plate by pcb board target hole 2, can effectively correct after upper PIN needle because of the harmomegathus of pcb board 1 or outer exposure aligning accuracy error and the skew of the outer graphics of the pcb board 1 caused, make outer graphics and the solder prevention bottom plate exactitude position of pcb board 1.
In the present embodiment, an edge of pcb board 1 is also provided with error-proof structure, and error-proof structure is four the fool proof holes 4 be arranged side by side, fast and easy, correctly contraposition.
embodiment 2
A kind of pcb board of the present utility model one of embodiment of anti-bias aligning structure, as shown in Figure 1, this embodiment is identical with the main technical schemes of embodiment 1, its difference is: described pcb board 1 is multi-layer PCB board, in the band of position of target place pcb board 1, pcb board 1 internal layer in this region is without layers of copper or for there being layers of copper, when boring target hole 2 like this, bore target drone and can find target accurately, and get out target hole.
Finally should be noted that; above embodiment is only in order to illustrate the technical solution of the utility model; but not the restriction to the utility model protection range; although done to explain to the utility model with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical solution of the utility model or equivalent replacement, and not depart from essence and the scope of technical solutions of the utility model.
Claims (8)
- The anti-bias aligning structure of 1.PCB plate, comprises pcb board, outer egative film and solder prevention bottom plate, it is characterized in that: the described outer egative film edge corresponding with described solder prevention bottom plate is equipped with several targets with numerical control device editing;During outer exposure, the target of described outer egative film shifts in described pcb board with the outer graphics of described outer egative film, and described pcb board forms pcb board target hole with the described target punching on it;During anti-welding exposure, described solder prevention bottom plate forms egative film target hole with the described target punching on it, and PIN needle is arranged in corresponding described pcb board target hole and described egative film target hole.
- 2. the anti-bias aligning structure of pcb board according to claim 1, is characterized in that: described outer egative film four edges corresponding with described solder prevention bottom plate are equipped with target.
- 3. the anti-bias aligning structure of pcb board according to claim 2, is characterized in that: each edge is equipped with two targets.
- 4. the anti-bias aligning structure of pcb board according to claim 1, is characterized in that: four edges of described pcb board are also provided with for carrying out the pcb board tooling hole of contraposition with described outer egative film.
- 5. the anti-bias aligning structure of pcb board according to claim 1, is characterized in that: an edge of described pcb board is also provided with error-proof structure.
- 6. the anti-bias aligning structure of pcb board according to claim 5, is characterized in that: described error-proof structure is four the fool proof holes be arranged side by side.
- 7. the anti-bias aligning structure of the pcb board according to claim 1 to 6 any one, is characterized in that: described pcb board is individual layer pcb board.
- 8. the anti-bias aligning structure of the pcb board according to claim 1 to 6 any one, is characterized in that: described pcb board is multi-layer PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520702748.6U CN205071431U (en) | 2015-09-11 | 2015-09-11 | PCB board is with preventing partially to bit architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520702748.6U CN205071431U (en) | 2015-09-11 | 2015-09-11 | PCB board is with preventing partially to bit architecture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071431U true CN205071431U (en) | 2016-03-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520702748.6U Expired - Fee Related CN205071431U (en) | 2015-09-11 | 2015-09-11 | PCB board is with preventing partially to bit architecture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071431U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578734A (en) * | 2016-03-10 | 2016-05-11 | 广州美维电子有限公司 | Circuit board external layer alignment structure and generation method thereof |
| CN105744730A (en) * | 2016-04-27 | 2016-07-06 | 广东欧珀移动通信有限公司 | PCB panel and processing method thereof |
| CN106028669A (en) * | 2016-07-13 | 2016-10-12 | 广德新三联电子有限公司 | Novel circuit board solder mask PIN alignment method |
| CN106061108A (en) * | 2016-08-12 | 2016-10-26 | 广德新三联电子有限公司 | Printed circuit board welding prevention counterpoint structure |
| CN106211559A (en) * | 2016-08-12 | 2016-12-07 | 广德新三联电子有限公司 | A kind of anti-welding alignment method of printed circuit board (PCB) |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| CN106231808A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of processing technology of pcb board welding resistance para-position exposure |
| CN107241863A (en) * | 2016-12-09 | 2017-10-10 | 百强电子（深圳）有限公司 | Automatic processing equipment and method for photoelectric printed circuit board |
| CN107318233A (en) * | 2017-07-13 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of HDI board blind holes |
| CN107734827A (en) * | 2016-08-10 | 2018-02-23 | 北大方正集团有限公司 | Register guide and alignment detecting method |
| CN109031898A (en) * | 2018-09-21 | 2018-12-18 | 东莞市多普光电设备有限公司 | A kind of novel anti-welding dual surface LED exposure machine |
| CN110113885A (en) * | 2019-06-05 | 2019-08-09 | 景旺电子科技(龙川)有限公司 | A kind of FPC method for manufacturing circuit board |
| CN111988917A (en) * | 2020-09-11 | 2020-11-24 | 奥士康精密电路（惠州）有限公司 | Method for preventing error of automatic character printing line |
| WO2022006981A1 (en) * | 2020-07-08 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Inner-layer board structure for lcp substrate and lcp substrate |
-
2015
- 2015-09-11 CN CN201520702748.6U patent/CN205071431U/en not_active Expired - Fee Related
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578734A (en) * | 2016-03-10 | 2016-05-11 | 广州美维电子有限公司 | Circuit board external layer alignment structure and generation method thereof |
| CN105578734B (en) * | 2016-03-10 | 2019-03-29 | 广州美维电子有限公司 | A kind of circuit board outer layer aligning structure and generation method |
| CN105744730A (en) * | 2016-04-27 | 2016-07-06 | 广东欧珀移动通信有限公司 | PCB panel and processing method thereof |
| CN106028669A (en) * | 2016-07-13 | 2016-10-12 | 广德新三联电子有限公司 | Novel circuit board solder mask PIN alignment method |
| CN107734827A (en) * | 2016-08-10 | 2018-02-23 | 北大方正集团有限公司 | Register guide and alignment detecting method |
| CN106061108A (en) * | 2016-08-12 | 2016-10-26 | 广德新三联电子有限公司 | Printed circuit board welding prevention counterpoint structure |
| CN106211559A (en) * | 2016-08-12 | 2016-12-07 | 广德新三联电子有限公司 | A kind of anti-welding alignment method of printed circuit board (PCB) |
| CN106061108B (en) * | 2016-08-12 | 2018-12-28 | 广德新三联电子有限公司 | A kind of anti-welding aligning structure of printed circuit board |
| CN106211559B (en) * | 2016-08-12 | 2018-11-16 | 广德新三联电子有限公司 | A kind of anti-welding alignment method of printed circuit board |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| CN106231805B (en) * | 2016-08-15 | 2019-01-22 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the manufacture craft of inner plating |
| CN106231808A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of processing technology of pcb board welding resistance para-position exposure |
| CN107241863A (en) * | 2016-12-09 | 2017-10-10 | 百强电子（深圳）有限公司 | Automatic processing equipment and method for photoelectric printed circuit board |
| CN107241863B (en) * | 2016-12-09 | 2023-06-16 | 百强电子（深圳）有限公司 | Automatic processing equipment and automatic processing method for photoelectric printed circuit board |
| CN107318233A (en) * | 2017-07-13 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of HDI board blind holes |
| CN107318233B (en) * | 2017-07-13 | 2019-09-10 | 深圳明阳电路科技股份有限公司 | A kind of production method of HDI board blind hole |
| CN109031898A (en) * | 2018-09-21 | 2018-12-18 | 东莞市多普光电设备有限公司 | A kind of novel anti-welding dual surface LED exposure machine |
| CN110113885A (en) * | 2019-06-05 | 2019-08-09 | 景旺电子科技(龙川)有限公司 | A kind of FPC method for manufacturing circuit board |
| CN110113885B (en) * | 2019-06-05 | 2021-09-07 | 景旺电子科技(龙川)有限公司 | FPC circuit board manufacturing method |
| WO2022006981A1 (en) * | 2020-07-08 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Inner-layer board structure for lcp substrate and lcp substrate |
| CN111988917A (en) * | 2020-09-11 | 2020-11-24 | 奥士康精密电路（惠州）有限公司 | Method for preventing error of automatic character printing line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20200911 |