CN105578734B - A kind of circuit board outer layer aligning structure and generation method - Google Patents
A kind of circuit board outer layer aligning structure and generation method Download PDFInfo
- Publication number
- CN105578734B CN105578734B CN201610137321.5A CN201610137321A CN105578734B CN 105578734 B CN105578734 B CN 105578734B CN 201610137321 A CN201610137321 A CN 201610137321A CN 105578734 B CN105578734 B CN 105578734B
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- Prior art keywords
- circle
- contraposition
- annulus
- target
- lamina rara
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of circuit board outer layer aligning structure and generation methods, aligning structure includes contraposition annulus, the contraposition annulus be the circle PAD that is set in the process of laser drilling using in secondary lamina rara externa as align target from lamina rara externa inner layer it is radium-shine made of circle slot position, the circle slot position refers to the part surrounded between the inner circle and outer circle that align annulus, and the round PAD is also the contraposition target when blind hole in lamina rara externa generates；Contraposition target when the contraposition annulus in the process that outer graphics shift as outer graphics for shifting.The present invention goes out to align contraposition target of the annulus as pattern transfer when by radium-shine in laser drilling step, it only needs to calculate offset and is modified when can enable pattern transfer and accurately aligned with blind hole position, be effectively improved that outer graphics transfer occurs collapses foramen strength.
Description
Technical field
The present invention relates to a kind of circuit board outer layer aligning structure and its generation methods.
Background technique
The design of circuit board product is more and more accurate at present, and the design of blind hole is also smaller and smaller, in outer graphics transfer
When need it is more acurrate, be otherwise easy to appear figure with blind hole is not corresponding causes the phenomenon that collapsing blind hole.Existing lamina rara externa generates
Process include: pressing plate, laser drilling, machine drilling, plating, outer graphics transfer and automatic optics inspection.
Wherein, contraposition target when existing pattern transfer is the registration holes generated in sheeting part, lamina rara externa
Blind hole can be filled since it is too small, and when plating below, therefore contraposition when blind hole can not be as pattern transfer
Target.Lamina rara externa is divided into upper layer and lower layer, then corresponding secondary lamina rara externa also has two layers, such as has 10 laminates, then and first and the tenth layer
Plate is lamina rara externa, second and the 9th laminate be time lamina rara externa.There is corresponding round PAD on two level lamina rara externas respectively, theoretically two
Circle PAD on level lamina rara externa should be vertically superposed relationship, but can be deviated in actual production, do not form overlapping and close
System, therefore be that the intermediate point of the circle PAD on two level lamina rara externas is taken to stamp one on pcb board as contraposition target in the prior art
A through-hole through all laminates, the through-hole are then used as contraposition target when pattern transfer.As shown in Figure 1,1 is last time outer layer
The circle PAD of plate, 2 for next lamina rara externa circle PAD, 3 be the intermediate point of two round PAD, 4 for pattern transfer when register guide
Target.
And the blind hole of lamina rara externa be the laser drilling the step of in it is radium-shine out as contraposition target using circle PAD, and
And the blind hole of two lamina rara externas is relatively independent generation, i.e., the blind hole for example on the 10th laminate is made using the 9th layer of circle PAD
It is generated for contraposition target, the blind hole on the 1st laminate is to be generated using the 2nd layer of circle PAD as contraposition target.Due to generating figure
The contraposition target of transfer is in different processes from generate blind hole, and there is also certain poor for alignment system used in the two
It is different, cause the outer graphics in outer graphics transfer step that can not accurately align with blind hole, as shown in Fig. 2, even making entire
Pcb board can not normal use.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of circuit board outer layer aligning structure and lifes
At method, outer graphics is enable accurately to align with blind hole when shifting.
To solve the above problems, the technical solution adopted in the present invention is as follows:
Scheme one:
A kind of circuit board outer layer aligning structure, including contraposition annulus, the contraposition annulus is in the process of laser drilling
The circle PAD set using in secondary lamina rara externa as contraposition target from lamina rara externa inner layer it is radium-shine made of circle slot position, the circle
Slot position refers to the part surrounded between the inner circle and outer circle that align annulus, and the round PAD is also when the blind hole in lamina rara externa generates
Align target；Contraposition target when the contraposition annulus in the process that outer graphics shift as outer graphics for shifting.
Preferably, the depth of the round slot position is greater than the depth of the blind hole of lamina rara externa.
Preferably, the interior diameter of a circle of the contraposition annulus is 1.7mm, and outer diameter of a circle is 2.3mm.
Scheme two:
A kind of generation method of circuit board outer layer aligning structure, wherein the step of production circuit board outer layer includes: pressing plate step
Suddenly, laser drilling step, machine drilling step, plating step and outer graphics transfer step, in laser drilling step:
Using the circle PAD on secondary lamina rara externa as target is aligned while radium-shine blind hole out on outer laminate, with identical
Circle PAD radium-shine contraposition annulus out on outer laminate as contraposition target；The structure of contraposition annulus surrounds between inner circle and outer circle
Part form round slot position, the contraposition annulus in outer graphics transfer step as outer graphics transfer when contraposition
Target.
Preferably, the depth of the round slot position is greater than the depth of the blind hole of lamina rara externa.
Preferably, the interior diameter of a circle for aligning annulus is 1.7mm, and outer diameter of a circle is 2.3mm.
Compared with prior art, the beneficial effects of the present invention are: pass through in laser drilling step it is radium-shine go out contraposition annulus
Contraposition target when as pattern transfer, it is only necessary to calculate offset and be modified when can enable pattern transfer accurately
With blind hole position align, be effectively improved outer graphics transfer occur collapse foramen strength.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the circuit board outer layer aligning structure of the prior art；
Fig. 2 is the effect diagram of outer graphics and blind hole dislocation；
Fig. 3 is the structural schematic diagram of circuit board outer layer aligning structure of the invention.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention:
With reference to Fig. 3, the invention discloses a kind of circuit board outer layer aligning structures, including contraposition annulus 12, align annulus 12
Be the circle PAD11 that is set in the process of laser drilling using in secondary lamina rara externa it is radium-shine from lamina rara externa inner layer as contraposition target and
At round slot position, round slot position refers to the part that surrounds between the inner circle and outer circle of contraposition annulus 12.Circle PAD 11 is also outer
Contraposition target when blind hole is generated in laminate.When aligning contraposition target used when annulus 12 due to generating with outer layer blind hole is generated
Contraposition target used is consistent, and the laser drilling the step of in generate, alignment system is also consistent, that is, has common
Coordinate system.Therefore in pattern transfer below, using contraposition annulus 12 as contraposition target when pattern transfer, it is only necessary to count
Calculating offset and being modified can enable figure accurately align with blind hole position, be effectively improved outer graphics transfer and gone out
Existing collapses foramen strength.
In addition, pcb board has two outer layers plate, it is denoted as upper layer lamina rara externa and lower layer's lamina rara externa, then upper layer lamina rara externa is under
Layer lamina rara externa has corresponding contraposition annulus 12 respectively, i.e., the contraposition annulus 12 in the lamina rara externa of upper layer is according to upper level lamina rara externa
Circle PAD generate as contraposition target, and the contraposition annulus 12 in lower layer's lamina rara externa is the circle PAD according to lower level lamina rara externa
Generated as contraposition target, the blind hole in blind hole and lower layer's outer layer version in the lamina rara externa of upper layer similarly, therefore upper layer lamina rara externa
Pattern transfer with lower layer lamina rara externa is relatively independent.
Further, the depth of round slot position is greater than the depth of the blind hole of lamina rara externa, due to having after laser drilling
The step of plating, when plating, can fill blind hole, while can also fill round slot position, therefore the depth of round slot position is needed than blind
Hole depth can generally design the depth penetrates two of round slot position to three ply board, if round slot position is filled and led up, in figure below
When transfer, the CCD of exposure machine can not capture round slot position, i.e., contraposition annulus 12 can not be as contraposition target.
Further, the interior diameter of a circle for aligning annulus is 1.7mm, and outer diameter of a circle is 2.3mm.Because if circular trough
Position is wide or the narrow capturing ability that will affect CCD, it is also possible to which making to align annulus 12 can not be as contraposition target.
The invention also discloses a kind of generation methods of foregoing circuit plate outer layer aligning structure, specifically in laser drilling step
In:
Using the circle PAD on secondary lamina rara externa as target is aligned while radium-shine blind hole out on outer laminate, with identical
Circle PAD radium-shine contraposition annulus out on outer laminate as contraposition target；The structure of contraposition annulus surrounds between inner circle and outer circle
Part form round slot position, the contraposition annulus in outer graphics transfer step as outer graphics transfer when contraposition
Target.
Preferably, the depth of the round slot position is greater than the depth of the blind hole of lamina rara externa.Align the interior diameter of a circle of annulus
For 1.7mm, outer diameter of a circle is 2.3mm.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection scope of the claims in the present invention
Within.
Claims (2)
1. a kind of circuit board outer layer aligning structure, which is characterized in that including aligning annulus, the contraposition annulus is in laser drilling
Process in the circle PAD that is set using in secondary lamina rara externa as contraposition target from lamina rara externa inner layer it is radium-shine made of circle slot position,
The circle slot position refers to the part surrounded between the inner circle and outer circle that align annulus, and the round PAD is also the blind hole in lamina rara externa
Contraposition target when generation；Pair when the contraposition annulus in the process that outer graphics shift as outer graphics for shifting
Position target；
The depth of the circle slot position is greater than the depth of the blind hole of lamina rara externa；
The interior diameter of a circle of the contraposition annulus is 1.7mm, and outer diameter of a circle is 2.3mm.
2. a kind of generation method of circuit board outer layer aligning structure, wherein the step of production circuit board outer layer includes: sheeting part,
Laser drilling step, machine drilling step, plating step and outer graphics transfer step, which is characterized in that in laser drilling
In step:
Using the circle PAD on secondary lamina rara externa as target is aligned while radium-shine blind hole out on outer laminate, with identical round PAD
As aligning, target is radium-shine on outer laminate to be gone out to align annulus；The part that the structure of contraposition annulus surrounds between inner circle and outer circle
Form round slot position, the contraposition target when contraposition annulus in outer graphics transfer step as outer graphics for shifting；
The depth of the circle slot position is greater than the depth of the blind hole of lamina rara externa；
The interior diameter of a circle for aligning annulus is 1.7mm, and outer diameter of a circle is 2.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610137321.5A CN105578734B (en) | 2016-03-10 | 2016-03-10 | A kind of circuit board outer layer aligning structure and generation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610137321.5A CN105578734B (en) | 2016-03-10 | 2016-03-10 | A kind of circuit board outer layer aligning structure and generation method |
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| Publication Number | Publication Date |
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| CN105578734A CN105578734A (en) | 2016-05-11 |
| CN105578734B true CN105578734B (en) | 2019-03-29 |
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| CN201610137321.5A Active CN105578734B (en) | 2016-03-10 | 2016-03-10 | A kind of circuit board outer layer aligning structure and generation method |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604577A (en) * | 2017-01-03 | 2017-04-26 | 江苏博敏电子有限公司 | HDI circuit board manufacturing process capable of realizing accurate alignment |
| CN107278022A (en) * | 2017-07-27 | 2017-10-20 | 东莞市五株电子科技有限公司 | A kind of PCB production plates and the processing method that plate is produced based on the PCB |
| CN108401358B (en) * | 2018-01-24 | 2020-06-23 | 广州兴森快捷电路科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN108882533A (en) * | 2018-08-03 | 2018-11-23 | 江苏普诺威电子股份有限公司 | Improve MEMS-slot orifice plate contraposition precision method |
| CN108882534A (en) * | 2018-08-03 | 2018-11-23 | 江苏普诺威电子股份有限公司 | The production method for promoting welding resistance windowing concentricity at acoustic aperture and acoustic aperture |
| CN112087887B (en) * | 2019-06-12 | 2023-06-09 | 奥特斯科技(重庆)有限公司 | Alignment of component carrier structures by combining evaluation pad and hole type alignment marks |
| CN113411991B (en) * | 2021-04-29 | 2024-06-21 | 广州美维电子有限公司 | PCB pattern transfer alignment target method |
| CN113286434A (en) * | 2021-05-14 | 2021-08-20 | 宜兴硅谷电子科技有限公司 | Alignment method of HDI (high Density interconnection) boards in any interconnection |
| CN114364167B (en) * | 2021-12-23 | 2023-11-07 | 江苏普诺威电子股份有限公司 | Double-layer packaging substrate alignment method suitable for laser through holes |
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| CN101257769A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Contraposition method for manufacturing printed circuit board |
| TW201223373A (en) * | 2010-11-22 | 2012-06-01 | Foxconn Advanced Technology Co Ltd | Method for manufacturing blind hole in printed circuit board |
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| TW201233264A (en) * | 2011-01-20 | 2012-08-01 | Unitech Printed Circuit Board Corp | Method for manufacturing flexible and hard composite printed circuit board |
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| CN101257769A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Contraposition method for manufacturing printed circuit board |
| TW201223373A (en) * | 2010-11-22 | 2012-06-01 | Foxconn Advanced Technology Co Ltd | Method for manufacturing blind hole in printed circuit board |
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| CN105578734A (en) | 2016-05-11 |
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