CN101257769A - Contraposition method for manufacturing printed circuit board - Google Patents
Contraposition method for manufacturing printed circuit board Download PDFInfo
- Publication number
- CN101257769A CN101257769A CNA2008100275475A CN200810027547A CN101257769A CN 101257769 A CN101257769 A CN 101257769A CN A2008100275475 A CNA2008100275475 A CN A2008100275475A CN 200810027547 A CN200810027547 A CN 200810027547A CN 101257769 A CN101257769 A CN 101257769A
- Authority
- CN
- China
- Prior art keywords
- layer
- contraposition
- printed circuit
- basic unit
- increase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A positioning method for making a printed circuit board is provided. A set of positioning targets is arranged on a single sided or double sided PCB substrate, the method is characterized in that adding layer pattern positioning and drilling process use the same set of positioning targets on the PCB substrate as reference. Because the positioning target of each adding layer is arranged on the same internal layer, the circuit making up efficiency can be improved effectively; meanwhile, the method uses the same set of positioning targets to position to realize a plurality of times of adding layers using the same set of positioning targets as reference, reduces accumulated error of a plurality of times of positioning, solves and perfects interlayer positioning deviation generated during making a plurality of times of adding layer printed circuit boards, thereby improving positioning precision of adding layers. The positioning method of the invention is suitable for making multilayer (two or more layers) printed circuit boards, especially for making HDI adding layer (four or more layers) printed circuit boards.
Description
Technical field
The present invention relates to a kind of manufacture method of printed circuit board, more particularly, relate to a kind of be used to make printed circuit board to method for position.
Background technology
Printed circuit board (Printed Circuit Board, PCB) be with copper foil circuit complicated between part and the part, being incorporated on the plank, so that the main carrier of electronic component assembly when installing with interconnection to be provided, is the indispensable fundamental parts of electronic product.
Because the circuit of printed circuit board becomes increasingly complex, high density interconnect (High DensityInterconnection, HDI) technology is arisen at the historic moment, and this technology is to add to increase layer on multilayer circuit board, and produce Microvia, thereby realize inter-level interconnects in the mode of laser drill.
Miniaturization of electronic products and complicated trend are promoting the printed circuit board packaging technology and are also entering a breakthrough developing period.
With the mobile phone is the high performance mini electronic product of representative, and design, the Integration Assembly And Checkout of HDI/BUM printed circuit board all proposed new challenge.The lifting significantly of the expansion of mobile phone market and demand, driven the life of circuit board, at present, the employed circuit board of mobile phone generally comprises traditional force fit plate and increases layer multi-layer plate (Build-up Multilayer by process technique, BUM), wherein, the BUM plate is the process technique of making the high-order of circuit board of mobile phone at present, promptly the skin at the single or double plate of making is increased layer, and with non-mechanical means pore-forming (mostly being Microvia greatly), become high density interconnect (High Density Interconnection, HDI) circuit board, HDI circuit board typically refer to and utilize Microvia collocation fine rule and close distance can carry more multicomponent or the more multi circuit board of laying in the unit are to reach.
HDI high density interconnect printed circuit board is to continue after the multi-layer sheet that PC industry promotes printed circuit board and the new trend of printed circuit board assembly industry.U.S.'s electronic circuit and electronic interconnection employer's organization (IPC), point out that in its printed circuit board industrial development route map industry, technology and product that the industry of driving printed circuit board continues to advance comprise: massage storage, radio frequency and the microwave electron of electronic game, consumer electronics, portable wireless product, main frame and server and aviation under the extreme environment and automobile electronics etc.The development in these fields all be unable to do without technology and the making of HDI, certainly, wherein the portable wireless product will take the lead and the other products field HDI printed circuit board and Microvia technology requirement, and along with the fast development of science and technology, the product in above-mentioned field all will adopt HDI and Microvia manufacturing technology.
At present, the printed circuit board industry particularly in carrying out HDI lamination (more than four layers or four layers) printed circuit board manufacturing process, all adopts contraposition mode successively to process in carrying out the printed circuit board manufacturing process of multilayer (two layers or more).Promptly comprising that each conductive layer in the PCB basic unit of single or double is equipped with the contraposition target, every layer figure transfer and laser drilling contraposition, all the contraposition target with this conductive layer carries out contraposition processing.The advantage of above-mentioned multilayer printed circuit board manufacture method is: technology is easy, automaticity is high, can better guarantee to face mutually the alignment precision of line layer; Its weak point is: because the contraposition target of layout design is too much, so association each other and mutual restriction; Owing to respectively increase the benchmark difference that layer adopts,, repeatedly be easy to generate the offset issue of interlayer alignment especially in lamination process and the high density interconnection structure product especially, thereby having influence on reliability of products again so cause deviation accumulation easily.
Summary of the invention
The technical problem to be solved in the present invention provide high being used to of a kind of contraposition precision make printed circuit board to method for position.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of be used to make printed circuit board to method for position, in the PCB of single or double basic unit, be provided with one group of contraposition target, it is characterized in that: the figure contraposition and the boring processing that increase layer are benchmark with same group of contraposition target in the PCB basic unit all.Be that follow-up figure transfer that respectively increases its copper foil layer of layer (conductive layer) and boring processing all comes contraposition with same group of contraposition target in the PCB basic unit.
As a kind of optimal technical scheme of the present invention: before increasing layer and PCB basic unit, increasing layer and the pressing that increases layer, to increase earlier layer go up with PCB basic unit on material (copper foil layer and thicker or opaque resin bed) the tool window that goes into operation of register guide target position corresponding position, will increase again layer with PCB basic unit, increase layer and increase lamination and close; Increase layer with PCB basic unit, increase layer and increase lamination and close after, the contraposition target in the PCB basic unit reveals by the instrument window; Increasing the figure contraposition and the boring processing of layer, is benchmark with the same group of contraposition target that reveals all.The method that technique scheme adopted is pre-fenestration.
Like this, respectively increase layer in the process of pressing successively, increase the figure contraposition and the boring processing of layer, all the time be benchmark with same group of contraposition target, the accumulated error that reduces repeatedly contraposition produces, solve and improve repeatedly the interlayer alignment offset problem that is easy to generate in the Build-up Multilayer Printed Circuit Boards making, thereby improved the contraposition precision of lamination widely.
As another kind of optimal technical scheme of the present invention: will increase layer and PCB basic unit, increase layer and increase lamination and close, cut out Copper Foil or resin material (copper foil layer and thicker or opaque resin bed) on the contraposition target then, the contraposition target in the PCB basic unit is revealed; Increasing the figure contraposition and the boring processing of layer, is benchmark with the same group of contraposition target that reveals all.The method that technique scheme adopted is for digging the target method.
For convenience in the material that cuts out on the contraposition target, before increasing layer and PCB basic unit, increasing layer and the pressing that increases layer, elder generation's pasting protective film on the contraposition target does not combine resin bed with the contraposition target, therefore, can easily the material on the contraposition target be cut out.
Like this, respectively increase layer in the process of pressing successively, by digging the target method, the contraposition target is exposed, increasing the figure contraposition and the boring processing of layer, is benchmark with same group of contraposition target all the time, and the accumulated error that reduces repeatedly contraposition produces, solve and improve repeatedly the interlayer alignment offset problem that is easy to generate in the Build-up Multilayer Printed Circuit Boards making, thereby improved the contraposition precision of lamination widely.
The described layer that respectively increases comprises insulating barrier and conductive layer, forms after insulating barrier and the conductive layer pressing and increases layer.
Described insulating barrier is resin bed preferably, and described conductive layer is copper foil layer preferably, forms after resin bed and the copper foil layer pressing and increases layer.
When the fruit resin bed was thin or more transparent, copper foil layer on the then direct etching off contraposition target made optical CCD can discern the contraposition target in the PCB basic unit; When thicker or material is opaque when resin bed, should remove copper foil layer and thicker or material opaque resin layer on the contraposition target, make optical CCD can tell contraposition target in the PCB basic unit.
The present invention's beneficial effect against existing technologies is owing to the present invention is set in the contraposition target of each lamination on the same internal layer, effectively to improve circuit layout efficient; Simultaneously, carry out contraposition with same group of contraposition target, realize that repeatedly lamination is a benchmark with same group of contraposition target, the accumulated error that reduces repeatedly contraposition produces, solve and improve repeatedly the interlayer alignment offset problem that is easy to generate in the Build-up Multilayer Printed Circuit Boards making, thereby improved the contraposition precision of lamination widely.Therefore, of the present invention method for position is applicable to the making of the printed circuit board of multilayer (two layers or more), is specially adapted to the making of HDI lamination (more than four layers or four layers) printed circuit board.
The present invention is described further below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 be the mode of windowing in advance increase layer and the preceding vertical view of PCB basic unit pressing;
Fig. 2 is that A-A among Fig. 1 is to cutaway view;
Fig. 3 is the structural representation that increases among Fig. 2 after layer and the PCB basic unit pressing;
Fig. 4 is increasing layer and increasing lamination and close preceding structural representation of the mode of windowing in advance on the laminated plates in Fig. 3;
Fig. 5 is the structural representation after increasing layer among Fig. 4 and increasing lamination and close;
Fig. 6 be dig the target mode increase layer and the preceding vertical view of PCB basic unit pressing;
Fig. 7 is that B-B among Fig. 6 is to cutaway view;
Fig. 8 is the structural representation that increases among Fig. 7 after layer and the PCB basic unit pressing;
Fig. 9 is that laminated plates is dug structural representation behind the target among Fig. 8;
Figure 10 digs increasing layer and increasing lamination and close preceding structural representation of target mode on the laminated plates in Fig. 9;
Figure 11 is the structural representation after increasing layer among Figure 10 and increasing lamination and close;
Figure 12 is that laminated plates is dug structural representation behind the target among Figure 11;
Embodiment
Extremely shown in Figure 5 as Fig. 1, being used in this preferred embodiment make printed circuit board to method for position, in two-sided PCB basic unit 1, be provided with one group of contraposition target 2, as shown in Figure 2, first increases layer 3 comprises insulating barrier and conductive layer, above-mentioned insulating barrier is a resin bed 31, and above-mentioned conductive layer is a copper foil layer 32, forms the gum Copper Foil after resin bed 31 and copper foil layer 32 pressings and promptly first increases layer 3.
Adopt pre-fenestration in this preferred embodiment: before first increases the pressing of layer 3 and PCB basic unit 1, earlier with first increase on the layer 3 with PCB basic unit 1 on the copper foil layer 32 of corresponding position, contraposition target 2 position and the thicker or opaque resin bed 31 tool window 33 that goes into operation, as shown in Figure 2; Again with first increase the layer 3 with 1 pressing of PCB basic unit, first increase the layer 3 with 1 pressing of PCB basic unit after, the contraposition target 2 in the PCB basic unit 1 reveals by instrument window 33; First increases the figure contraposition of layer 3 and the processing of holing, i.e. first figure transfer and the boring that increases layer 3 its copper foil layer 32 is processed, and is benchmark with the same group of contraposition target 2 that reveals all.
As Fig. 4, shown in Figure 5, in Fig. 3 on the laminated plates, add second with the mode of windowing in advance and increase layer 4, as shown in Figure 4, second increases layer 4 comprises insulating barrier and conductive layer, and above-mentioned insulating barrier is a resin bed 41, and above-mentioned conductive layer is a copper foil layer 42, forming second after resin bed 41 and copper foil layer 42 pressings increases layer 4, the second and increases layer 4 and first to increase layers 3 structure and material identical.
Before second increases layer 4 and first and increases layer 3 pressing, earlier with second increase on layers 4 with PCB basic unit 1 on the copper foil layer 42 of corresponding position, contraposition target 2 position and the thicker or opaque resin bed 41 tool window 43 that goes into operation, instrument window 43 is identical with instrument window 33, as shown in Figure 4; Increase layer 4 and first with second again and increase layer 3 pressing, second increase layer 4 and first and increase layer 3 pressing after, the contraposition target 2 in the PCB basic unit 1 reveals by instrument window 43; Second increases the figure contraposition of layer 4 and the processing of holing, i.e. second figure transfer and the boring that increases layer 4 its copper foil layer 42 is processed, and is benchmark with the same group of contraposition target 2 that reveals all.
The rest may be inferred, with above-mentioned pre-fenestration, through pressing successively, respectively increases the figure contraposition and the boring processing of layer, is benchmark with the same group of contraposition target 2 in the PCB basic unit 1 all the time, can produce the multilayer circuit board that increases layer more than four layers or four layers.
The model that above-mentioned pressing can be produced by German BURKEL is that the press of LAMV150 is finished;
Above-mentioned figure contraposition can be finished by the ONO SOKKI automatic exposure machine that the little wild model of surveying the production of device Co., Ltd. of Japan is EV2400;
The model that above-mentioned boring processing can be produced by HIT is that the laser drilling machine of LC-2G212E/2C is finished.
To shown in Figure 12, adopt the target method of digging as Fig. 6 among the embodiment 2: before first increased the pressing of layer 3 and PCB basic unit 1, pasting protective film 20 on contraposition target 2 did not combine resin bed 31 with contraposition target 2 earlier; As shown in Figure 8, increase layer 3 and 1 pressing of PCB basic unit with first again, cut out copper foil layer 32 and thicker or opaque resin bed 31 on the contraposition target 2 then, as shown in Figure 9, the contraposition target 2 in the PCB basic unit 1 is revealed; First increases the figure contraposition of layer 3 and the processing of holing, i.e. first figure transfer and the boring that increases layer 3 its copper foil layer 32 is processed, and is benchmark with the same group of contraposition target 2 that reveals all.
As Figure 10, Figure 11, shown in Figure 12, in Fig. 9 on the laminated plates, with dig the target mode add second increase the layer 4, as shown in figure 11, increase the pressing that layer 4 and first increases layer 3 with second, cut out copper foil layer 42 and thicker or opaque resin bed 41 on the contraposition target 2 then, as shown in figure 12, the contraposition target 2 in the PCB basic unit 1 is revealed; Second increases the figure contraposition of layer 4 and the processing of holing, i.e. second figure transfer and the boring that increases layer 4 its copper foil layer 42 is processed, and is benchmark with the same group of contraposition target 2 that reveals all.
The rest may be inferred, with the above-mentioned target method of digging, through pressing successively, respectively increases the figure contraposition and the boring processing of layer, is benchmark with the same group of contraposition target 2 in the PCB basic unit 1 all the time, can produce the multilayer circuit board that increases layer more than four layers or four layers.
Claims (6)
1, a kind of be used to make printed circuit board to method for position, in the PCB of single or double basic unit, be provided with one group of contraposition target, it is characterized in that: the figure contraposition and the boring processing that increase layer are benchmark with same group of contraposition target in the PCB basic unit all.
2, as claimed in claim 1 be used to make printed circuit board to method for position, it is characterized in that: before increasing layer and PCB basic unit, increasing layer and the pressing that increases layer, to increase earlier layer go up with PCB basic unit on the material of the register guide target position corresponding position tool window that goes into operation, will increase again layer with PCB basic unit, increase layer and increase lamination and close; Increase layer with PCB basic unit, increase layer and increase lamination and close after, the contraposition target in the PCB basic unit reveals by the instrument window; Increasing the figure contraposition and the boring processing of layer, is benchmark with the same group of contraposition target that reveals all.
3, as claimed in claim 1 be used to make printed circuit board to method for position, it is characterized in that: will increase layer and PCB basic unit, increase layer and increase lamination and close, and cut out Copper Foil or resin material on the contraposition target then, the contraposition target in the PCB basic unit is revealed; Increasing the figure contraposition and the boring processing of layer, is benchmark with the same group of contraposition target that reveals all.
4, as claimed in claim 3 be used to make printed circuit board to method for position, it is characterized in that: before increasing layer and PCB basic unit, increasing layer and the pressing that increases layer, first on the contraposition target pasting protective film.
5, as in the claim 1 to 4 each described be used to make printed circuit board to method for position, it is characterized in that: the described layer that respectively increases comprises insulating barrier and conductive layer, forms after insulating barrier and the conductive layer pressing and increases layer.
6, as claimed in claim 5 be used to make printed circuit board to method for position, it is characterized in that: described insulating barrier is a resin bed, described conductive layer is a copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100275475A CN101257769A (en) | 2008-04-16 | 2008-04-16 | Contraposition method for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100275475A CN101257769A (en) | 2008-04-16 | 2008-04-16 | Contraposition method for manufacturing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101257769A true CN101257769A (en) | 2008-09-03 |
Family
ID=39892137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100275475A Pending CN101257769A (en) | 2008-04-16 | 2008-04-16 | Contraposition method for manufacturing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101257769A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697001B (en) * | 2009-01-22 | 2011-07-13 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| WO2012092806A1 (en) * | 2011-01-05 | 2012-07-12 | 惠州中京电子科技股份有限公司 | Blind hole opening process of multilayer hdi circuit board |
| CN102686009A (en) * | 2011-03-08 | 2012-09-19 | 昆山市华升电路板有限公司 | Circuit board and circuit fabricating process thereof |
| CN103900475A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Laser blind hole and through hole alignment precision detection method |
| CN104113995A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN104427794A (en) * | 2013-09-10 | 2015-03-18 | 欣兴电子股份有限公司 | Method for manufacturing multi-layer circuit board |
| CN105578734A (en) * | 2016-03-10 | 2016-05-11 | 广州美维电子有限公司 | Circuit board external layer alignment structure and generation method thereof |
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN107949189A (en) * | 2017-11-29 | 2018-04-20 | 瑞声声学科技(苏州)有限公司 | The production method of four sandwich circuit boards |
| CN109596971A (en) * | 2018-11-28 | 2019-04-09 | 大族激光科技产业集团股份有限公司 | The alignment method of flying probe tester |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN110536568A (en) * | 2019-09-26 | 2019-12-03 | 上海航天电子通讯设备研究所 | A kind of high-accuracy bonding localization method of multilayer circuit board |
| CN111556669A (en) * | 2020-04-02 | 2020-08-18 | 深圳市景旺电子股份有限公司 | Method for manufacturing high-density interconnection board |
| CN112512216A (en) * | 2020-11-06 | 2021-03-16 | 龙南骏亚电子科技有限公司 | Circuit board interlayer alignment control method |
| CN115023067A (en) * | 2022-05-23 | 2022-09-06 | 高德(江苏)电子科技股份有限公司 | Processing technology for improving alignment precision of printed circuit board |
-
2008
- 2008-04-16 CN CNA2008100275475A patent/CN101257769A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697001B (en) * | 2009-01-22 | 2011-07-13 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| WO2012092806A1 (en) * | 2011-01-05 | 2012-07-12 | 惠州中京电子科技股份有限公司 | Blind hole opening process of multilayer hdi circuit board |
| CN102686009B (en) * | 2011-03-08 | 2015-10-28 | 昆山市华升电路板有限公司 | Wiring board and line manufacturing process thereof |
| CN102686009A (en) * | 2011-03-08 | 2012-09-19 | 昆山市华升电路板有限公司 | Circuit board and circuit fabricating process thereof |
| CN104113995A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN104113995B (en) * | 2013-04-22 | 2017-01-18 | 北大方正集团有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN104427794B (en) * | 2013-09-10 | 2017-09-22 | 欣兴电子股份有限公司 | The preparation method of multilayer circuit board |
| CN104427794A (en) * | 2013-09-10 | 2015-03-18 | 欣兴电子股份有限公司 | Method for manufacturing multi-layer circuit board |
| CN103900475A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Laser blind hole and through hole alignment precision detection method |
| CN105578734B (en) * | 2016-03-10 | 2019-03-29 | 广州美维电子有限公司 | A kind of circuit board outer layer aligning structure and generation method |
| CN105578734A (en) * | 2016-03-10 | 2016-05-11 | 广州美维电子有限公司 | Circuit board external layer alignment structure and generation method thereof |
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN107949189A (en) * | 2017-11-29 | 2018-04-20 | 瑞声声学科技(苏州)有限公司 | The production method of four sandwich circuit boards |
| CN109596971A (en) * | 2018-11-28 | 2019-04-09 | 大族激光科技产业集团股份有限公司 | The alignment method of flying probe tester |
| CN109596971B (en) * | 2018-11-28 | 2020-12-18 | 深圳市大族数控科技有限公司 | Alignment method of flying probe tester |
| CN110536568A (en) * | 2019-09-26 | 2019-12-03 | 上海航天电子通讯设备研究所 | A kind of high-accuracy bonding localization method of multilayer circuit board |
| CN111556669A (en) * | 2020-04-02 | 2020-08-18 | 深圳市景旺电子股份有限公司 | Method for manufacturing high-density interconnection board |
| CN112512216A (en) * | 2020-11-06 | 2021-03-16 | 龙南骏亚电子科技有限公司 | Circuit board interlayer alignment control method |
| CN115023067A (en) * | 2022-05-23 | 2022-09-06 | 高德(江苏)电子科技股份有限公司 | Processing technology for improving alignment precision of printed circuit board |
| CN115023067B (en) * | 2022-05-23 | 2024-02-06 | 高德(江苏)电子科技股份有限公司 | Processing technology for improving alignment precision of printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101257769A (en) | Contraposition method for manufacturing printed circuit board | |
| US7152318B2 (en) | Method for manufacturing built-up printed circuit board with stacked type via-holes | |
| CN101472404B (en) | Multi-layer circuit board and manufacturing method thereof | |
| US9743533B2 (en) | Method for manufacturing rigid-flexible printed circuit board | |
| CN103025051B (en) | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof | |
| CN103068165B (en) | Printed circuit board (PCB) outer edge plating layer manufacturing technology | |
| CN102387672B (en) | Method for manufacturing multilayer circuit board | |
| CN103220889B (en) | Layer manufacturing method thereof in a kind of oversize PCB backboard | |
| KR101084250B1 (en) | Electronic Components Embedded Printed Circuit Board and Method of Manufacturing the Same | |
| CN102438413A (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| JP2001053447A (en) | Multilayer wiring board with built-in part and manufacturing method thereof | |
| TW200744417A (en) | Method for manufacturing stack via of HDI printed circuit board | |
| JP2006261651A (en) | Capacitor incorporated printed circuit board having blind via hole, and method of manufacturing the board | |
| CN109041459B (en) | Manufacturing method of groove bottom pattern stepped groove and PCB | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN104869763A (en) | High-density interconnected PCB and processing method thereof | |
| TWI618462B (en) | Method for manufacturing embedded electronic component circuit board with dielectric directly attached | |
| CN102413646B (en) | Manufacturing method of circuit board | |
| KR102442389B1 (en) | Printed circuit board and method of manufacturing the same | |
| CN104023484A (en) | Manufacturing method of printed circuit board overlaid through hole structure | |
| KR101049228B1 (en) | Printed circuit board with improved heat dissipation and its manufacturing method | |
| CN110933870A (en) | Positioning method for processing six-layer rigid-flex board | |
| CN103607845A (en) | Manufacturing method of flexible printed circuit board | |
| CN104302111A (en) | Method for manufacturing base plate alignment target | |
| CN201726602U (en) | Counterpoint work fixture used for exposing flexible circuit board line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20080903 |