WO2012092806A1 - Blind hole opening process of multilayer hdi circuit board - Google Patents

Blind hole opening process of multilayer hdi circuit board Download PDF

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Publication number
WO2012092806A1
WO2012092806A1 PCT/CN2011/083792 CN2011083792W WO2012092806A1 WO 2012092806 A1 WO2012092806 A1 WO 2012092806A1 CN 2011083792 W CN2011083792 W CN 2011083792W WO 2012092806 A1 WO2012092806 A1 WO 2012092806A1
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Prior art keywords
blind hole
target
circuit board
hole
rule
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PCT/CN2011/083792
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French (fr)
Chinese (zh)
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周刚
赵志平
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惠州中京电子科技股份有限公司
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Publication of WO2012092806A1 publication Critical patent/WO2012092806A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Definitions

  • the present invention relates to printed circuit board technology, and in particular to a blind hole windowing process for a multilayer HDI printed circuit board.
  • the laser blind hole windowing technology of the PCB board is one of the key technologies for making micropores.
  • the traditional laser blind hole window opening method mainly realizes the window opening of the laser blind hole by drilling the alignment hole of the plate, which requires an increase in the mechanical drilling process.
  • the impact hole of the mechanical drill may cause different degrees of deviation or deformation of the alignment hole of the clapper, which directly affects the window opening of the laser blind hole.
  • the accuracy and quality of the production and efficiency will also have a greater impact, and the overall quality of the laser blind hole is difficult to further improve.
  • the invention aims to solve the problem that the laser blind hole window opening precision is insufficient and the quality is unstable in the prior art, and further provides a laser blind hole window opening process with simple process flow, good quality stability and low production cost.
  • the technical solution adopted by the present invention is to provide a blind hole window opening process for a multilayer HDI circuit board, comprising the following steps:
  • the target hole pattern in the step (1) is disposed at four corners of the PAD laminate edge of the laser blind hole bottom, and the plane formed by the four corners can include all the cells in the panel.
  • two auxiliary alignment target patterns are disposed on either side of the laser blind hole bottom PAD laminate side; the auxiliary alignment target target pattern is disposed on any one of the long sides of the laser blind hole bottom PAD laminate.
  • auxiliary alignment target pattern and size are the same as the four target aperture patterns in step (1).
  • the laser blind hole window opening process of the invention breaks the current conventional Large Window or Conformal laser blind hole processing method, using four target holes in the same plane plate angle as the laser blind hole bottom PAD layer for precise alignment, and using X-RAY precision target machine to play the above four alignment targets
  • the hole realizes precise alignment, and finally realizes the purpose of precise blind opening of the laser blind hole.
  • the beneficial effects are as follows: (1) the mechanical drill alignment hole process is omitted, the blind hole window opening operation process is optimized; (2) the reuse of the three drill pipe position holes is avoided, In order to prevent the deformation of the borehole hole, the borehole is deviated; (3) the accuracy of the alignment is improved, which improves the precision of the blind window opening of the laser blind hole, and ensures the blind window opening quality and the blind hole quality; (4) It is beneficial to reduce the difficulty of making outer layers.
  • FIG. 1 is a schematic view of a pattern of a counter target hole according to the present invention.
  • the laser blind hole windowing process steps of the multilayer HDI circuit board disclosed by the invention are as follows:
  • the target pattern In the process step 1 of the present invention, the target pattern must be disposed on the same plane as the laser blind hole bottom PAD, and located at the four corners of the layer edge, as shown in the drawings A, B, C, and D, here attention It can't overlap with any other process hole on the edge of the board.
  • two auxiliary alignment target patterns are set on any long side of the board, as shown by e and f in the figure, to further ensure the accuracy of the alignment.
  • the two auxiliary alignment target patterns and sizes are the same as the four target aperture patterns and sizes of A, B, C, and D, and the distance between the two alignment auxiliary target patterns is required to be consistent.
  • X-RAY The process capability of the automatic exposure machine.
  • the auxiliary alignment target pattern and size are the same as the target graphic size.
  • the X-RAY machine can use a drill bit to hit all the target holes of the board surface at one time, which improves the production efficiency and reduces the operation. Difficulty.
  • Two auxiliary registration holes on the long side can be used to assist the automatic exposure machine for fast pre-positioning and improve production efficiency.
  • the labels 1, 2, and 3 indicate the target patterns of the three outer hole holes; A1, B1, C1, and D1 are the alternate target patterns of the four targets A, B, C, and D, indicating the laser blind hole bottom.
  • the alternate target pattern of the four blind holes in the PAD layer can be accurately positioned if one or more of the four target patterns A, B, C, and D are incomplete, deformed, damaged, etc.
  • the use of the alternate target graphic for positioning does not affect work efficiency.
  • a dedicated HDI board is used for LD PP (Laser Drill) Abbreviation for Prepreg, pre-cured for laser drilling) or RCC (Resin Coated) Copper, resin coated copper foil) resin coated copper foil is pressed for the purpose of making the laser blind hole easy to process and obtaining a good laser blind hole type.
  • the step 3 requires an X-RAY target machine with an accuracy within a range of 1 mil.
  • the step 4 needs to be produced by an automatic exposure machine to ensure that the precision is controlled within a range of 0.4 mil to ensure the stability of the laser blind hole windowing quality.
  • the step 5 can be produced by using the normal parameters of the general dry film developing machine, and the developing point is required before the production to avoid the phenomenon that the development is not clean.
  • the step 6 is performed by using an acid etching line, and the speed and the spray pressure of the syrup need to be adjusted according to the first piece.

Abstract

Provided is a laser blind hole opening process of multilayer high density interconnection (HDI) circuit board, comprising fabricating a target hole pattern on a underlying PAD layer of a laser blind hole, laminating a resin-coated copper foil, shooting the target hole using X ray, aligning and exposing by using an automatic exposure machine, developing and opening through etching. Accurate alignment is achieved by using four target holes at the corners that are at the same plane of the underlying PAD layer of the laser blind hole and the target hole is shoot by using an accurate X-ray shooting machine, so that the repeated use of external guide hole and errors in mechanical drilling are avoided, and accurate opening of laser blind hole is achieved. The process is simple and has high efficiency.

Description

多层HDI线路板盲孔开窗工艺 Multi-layer HDI circuit board blind hole window opening process
技术领域 Technical field
本发明涉及印刷电路板技术，具体涉及到 多层HDI印刷线路板的盲孔开窗制作工艺。 The present invention relates to printed circuit board technology, and in particular to a blind hole windowing process for a multilayer HDI printed circuit board.
背景技术 Background technique
PCB 基板能否高密度化取决于层间连接的微孔和线路，且结合电子产品的性能而定，因此PCB板的激光盲孔开窗技术成为制作微孔的关键性技术之一。行业内，传统的激光盲孔开窗方法主要是通过钻拍板对位孔来实现激光盲孔的开窗对位，这就需要增加机械钻孔工序。但机械钻对位孔会因钻咀质量、钻孔参数、员工操作、板件存放环境等客观因素的影响导致拍板对位孔出现不同程度的偏孔或变形，直接影响到激光盲孔开窗的精度及品质，生产效率也会造成较大影响，激光盲孔的整体品质也难以进一步提高。 PCB Whether the substrate can be densified depends on the micropores and lines connected between the layers, and in combination with the performance of the electronic products, the laser blind hole windowing technology of the PCB board is one of the key technologies for making micropores. In the industry, the traditional laser blind hole window opening method mainly realizes the window opening of the laser blind hole by drilling the alignment hole of the plate, which requires an increase in the mechanical drilling process. However, due to the objective factors such as the quality of the drill, the parameters of the drill, the operation of the staff, and the storage environment of the plate, the impact hole of the mechanical drill may cause different degrees of deviation or deformation of the alignment hole of the clapper, which directly affects the window opening of the laser blind hole. The accuracy and quality of the production and efficiency will also have a greater impact, and the overall quality of the laser blind hole is difficult to further improve.
发明内容 Summary of the invention
本发明旨在解决现有技术中激光盲孔开窗精度不够、品质不稳定的问题，进而提供一种工艺流程简单、品质稳定性好、生产成本低的激光盲孔开窗工艺。 The invention aims to solve the problem that the laser blind hole window opening precision is insufficient and the quality is unstable in the prior art, and further provides a laser blind hole window opening process with simple process flow, good quality stability and low production cost.
为解决上述技术问题 ，本发明采取的技术方案是：提供一种多层HDI线路板的盲孔开窗工艺，包括以下步骤： In order to solve the above technical problem, the technical solution adopted by the present invention is to provide a blind hole window opening process for a multilayer HDI circuit board, comprising the following steps:
（1）在激光盲孔底PAD层制作靶孔图形； (1) making a target hole pattern in the PAD layer of the laser blind hole bottom;
（2）采用树脂铜箔进行压合； (2) Pressing with a resin copper foil;
（3）采用X-RAY机打靶位孔； (3) using the X-RAY machine to target the hole;
（4）采用自动曝光机对位及曝光； (4) Using automatic exposure machine alignment and exposure;
（5）显影； (5) development;
（6）盲孔蚀刻开窗。 (6) Blind hole etching window.
具体的，步骤（1）中所述靶孔图形设置在激光盲孔底PAD层板边的四个角，四个角所形成的平面能够包含板内所有单元。 Specifically, the target hole pattern in the step (1) is disposed at four corners of the PAD laminate edge of the laser blind hole bottom, and the plane formed by the four corners can include all the cells in the panel.
优选的，在激光盲孔底PAD层板边的任何一边设置两个辅助对位靶标图形；所述辅助对位靶标图形设置在激光盲孔底PAD层板的任意一个长边。 Preferably, two auxiliary alignment target patterns are disposed on either side of the laser blind hole bottom PAD laminate side; the auxiliary alignment target target pattern is disposed on any one of the long sides of the laser blind hole bottom PAD laminate.
更优选的，所述辅助对位靶标图形和大小与步骤（1）中四个靶孔图形大小相同。 More preferably, the auxiliary alignment target pattern and size are the same as the four target aperture patterns in step (1).
本发明所述激光盲孔开窗工艺打破目前常规的Large window或Conformal激光盲孔加工方式，采用与激光盲孔底PAD层处在同一个平面的板角的四个靶孔进行精确对位，并采用X-RAY精确打靶机打上述四个对位靶孔实现精准对位，最终实现激光盲孔精确开窗的目的。与现有技术相比，有益效果如下：(1)省去了机械钻对位孔工序，优化了盲孔开窗的作业流程；(2)避免了三个钻孔管位孔的重复使用，以防止钻孔管位孔变形而导致钻孔偏位；(3)对位精确度提高进而提高了激光盲孔开窗的精度，保证了盲孔开窗品质及盲孔品质；(4)有利于降低外层线路的制作难度。 The laser blind hole window opening process of the invention breaks the current conventional Large Window or Conformal laser blind hole processing method, using four target holes in the same plane plate angle as the laser blind hole bottom PAD layer for precise alignment, and using X-RAY precision target machine to play the above four alignment targets The hole realizes precise alignment, and finally realizes the purpose of precise blind opening of the laser blind hole. Compared with the prior art, the beneficial effects are as follows: (1) the mechanical drill alignment hole process is omitted, the blind hole window opening operation process is optimized; (2) the reuse of the three drill pipe position holes is avoided, In order to prevent the deformation of the borehole hole, the borehole is deviated; (3) the accuracy of the alignment is improved, which improves the precision of the blind window opening of the laser blind hole, and ensures the blind window opening quality and the blind hole quality; (4) It is beneficial to reduce the difficulty of making outer layers.
附图说明 DRAWINGS
图1 为本发明所述对位靶孔图形示意图。 FIG. 1 is a schematic view of a pattern of a counter target hole according to the present invention.
具体实施方式 detailed description
为了便于本领域技术人员的理解，下面结合具体实施例及附图对本发明作进一步详细描叙： In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below with reference to specific embodiments and the accompanying drawings:
本发明所揭示的多层HDI线路板的激光盲孔开窗工艺步骤为： The laser blind hole windowing process steps of the multilayer HDI circuit board disclosed by the invention are as follows:
（1）在激光盲孔底PAD层制作靶孔图形； (1) making a target hole pattern in the PAD layer of the laser blind hole bottom;
（2）采用LD PP或RCC树脂铜箔进行压合； (2) Pressing with LD PP or RCC resin copper foil;
（3）采用X-RAY机打靶位孔； (3) using the X-RAY machine to target the hole;
（4）采用自动曝光机对位及曝光； (4) Using automatic exposure machine alignment and exposure;
（5）显影； (5) development;
（6）盲孔蚀刻开窗。 (6) Blind hole etching window.
该工艺中，需要克服四个关键性技术，分别是：次外层靶孔图形制作、X-RAY机打靶位孔、自动曝光机对位及曝光、盲孔蚀刻开窗。 In this process, four key technologies need to be overcome, namely: secondary outer target hole pattern production, X-RAY machine target hole, automatic exposure machine alignment and exposure, blind hole etching window.
本发明工艺步骤1中，靶标图形必须设置在与激光盲孔底PAD同一个平面上，且位于该层板边的四个角上，如图中A、B、C、D所示，这里注意不能与其它任何板边上的工艺孔重叠，另外在板的任意一个长边上设置两个辅助对位靶标图形，如图中e、f表示，进一步保证对位的精确性。这两个辅助对位靶标图形和大小与A、B、C、D四个靶孔图形和大小相同，且这两个对位辅助靶标图形的距离需符合 X-RAY 自动曝光机的制程能力。辅助对位靶标图形和大小与靶标图形大小相同，这样，在实际生产过程中，X-RAY机打靶时可以通过一种钻头即将板面所有的靶孔一次性打出来，提高生产效率、降低操作难度。长边设置的两个辅助对位孔可用于辅助自动曝光机进行快速预定位，提高生产效率。 In the process step 1 of the present invention, the target pattern must be disposed on the same plane as the laser blind hole bottom PAD, and located at the four corners of the layer edge, as shown in the drawings A, B, C, and D, here attention It can't overlap with any other process hole on the edge of the board. In addition, two auxiliary alignment target patterns are set on any long side of the board, as shown by e and f in the figure, to further ensure the accuracy of the alignment. The two auxiliary alignment target patterns and sizes are the same as the four target aperture patterns and sizes of A, B, C, and D, and the distance between the two alignment auxiliary target patterns is required to be consistent. X-RAY The process capability of the automatic exposure machine. The auxiliary alignment target pattern and size are the same as the target graphic size. In this way, in the actual production process, the X-RAY machine can use a drill bit to hit all the target holes of the board surface at one time, which improves the production efficiency and reduces the operation. Difficulty. Two auxiliary registration holes on the long side can be used to assist the automatic exposure machine for fast pre-positioning and improve production efficiency.
图中标号1、2、3表示三个外层钻孔管位孔的靶标图形；A1、B1、C1、D1为A、B、C、D四个靶标的备用靶标图形，表示激光盲孔底PAD层的四个盲孔开窗的备用靶标图形，如果A、B、C、D四个靶标图形中的一个或几个残缺、变形、损坏等原因造成无法精确定位打孔情况下，即可采用该备用靶标图形进行定位，不影响工作效率。 In the figure, the labels 1, 2, and 3 indicate the target patterns of the three outer hole holes; A1, B1, C1, and D1 are the alternate target patterns of the four targets A, B, C, and D, indicating the laser blind hole bottom. The alternate target pattern of the four blind holes in the PAD layer can be accurately positioned if one or more of the four target patterns A, B, C, and D are incomplete, deformed, damaged, etc. The use of the alternate target graphic for positioning does not affect work efficiency.
所述步骤2中采用专用的HDI板用LD PP（Laser Drill Prepreg的缩写，激光钻孔专用半固化片）或RCC（Resin Coated Copper，树脂涂布铜箔）树脂涂布铜箔进行压合，目的在于使激光盲孔便于加工并得到良好的激光盲孔孔型。 In the step 2, a dedicated HDI board is used for LD PP (Laser Drill) Abbreviation for Prepreg, pre-cured for laser drilling) or RCC (Resin Coated) Copper, resin coated copper foil) resin coated copper foil is pressed for the purpose of making the laser blind hole easy to process and obtaining a good laser blind hole type.
所述步骤3需采用精度在1mil范围以内的X-RAY打靶机。 The step 3 requires an X-RAY target machine with an accuracy within a range of 1 mil.
所述步骤4需采用自动曝光机生产，确保精度控制在0.4mil范围内，以确保激光盲孔开窗品质的稳定性。 The step 4 needs to be produced by an automatic exposure machine to ensure that the precision is controlled within a range of 0.4 mil to ensure the stability of the laser blind hole windowing quality.
所述步骤5采用通用的干膜显影机正常参数生产即可，生产前需做显影点，避免出现显影不净现象。 The step 5 can be produced by using the normal parameters of the general dry film developing machine, and the developing point is required before the production to avoid the phenomenon that the development is not clean.
所述步骤6采用酸性蚀刻线进行生产，速度及药水喷淋压力需依首件进行相应调整。 The step 6 is performed by using an acid etching line, and the speed and the spray pressure of the syrup need to be adjusted according to the first piece.

Claims (7)

  1. [根据细则26改正12.03.2012]
    1 .多层HDI线路板的盲孔开窗工艺，包括以下步骤：
    （1）在激光盲孔底PAD层制作靶孔图形；
    （2）采用树脂铜箔进行压合；
    （3）采用X-RAY机打靶位孔；
    （4）采用自动曝光机对位及曝光；
    （5）显影；
    （6）盲孔蚀刻开窗。
    [Correct according to Rule 26 12.03.2012]
    1. The blind hole windowing process of the multilayer HDI circuit board, comprising the following steps:
    (1) making a target hole pattern in the PAD layer of the laser blind hole bottom;
    (2) Pressing with a resin copper foil;
    (3) using the X-RAY machine to target the hole;
    (4) Using automatic exposure machine alignment and exposure;
    (5) development;
    (6) Blind hole etching window.
  2. [根据细则26改正12.03.2012]　
    根据权利要求1所述的多层HDI线路板的盲孔开窗工艺，其特征在于：步骤（1）中所述靶孔图形设置在激光盲孔底PAD层板边的四个角，四个角所形成的平面能够包含板内所有单元。     [Correct according to Rule 26 12.03.2012]
    The blind hole fenestration process of the multilayer HDI circuit board according to claim 1, wherein the target hole pattern in the step (1) is disposed at four corners of the side of the laser blind hole bottom PAD layer, four The plane formed by the corners can contain all the elements in the panel.
  3. [根据细则26改正12.03.2012]　
    根据权利要求2所述的多层HDI线路板的盲孔开窗工艺，其特征在于：在激光盲孔底PAD层板边的任何一边设置两个辅助对位靶标图形，该对位靶标图形用于辅助自动曝光机作业。     [Correct according to Rule 26 12.03.2012]
    A blind hole fenestration process for a multilayer HDI circuit board according to claim 2, wherein two auxiliary alignment target patterns are disposed on either side of the laser blind hole bottom PAD laminate, and the alignment target graphic is used For auxiliary automatic exposure machine operation.
  4. [根据细则26改正12.03.2012]　
    根据权利要求3所述的多层HDI线路板的盲孔开窗工艺，其特征在于：所述辅助对位靶标图形设置在激光盲孔底PAD层板的任意一个长边。     [Correct according to Rule 26 12.03.2012]
    The blind hole fenestration process of the multilayer HDI circuit board according to claim 3, wherein the auxiliary alignment target pattern is disposed on any one of the long sides of the laser blind hole bottom PAD laminate.
  5. [根据细则26改正12.03.2012]　
    根据权利要求4所述的多层HDI线路板的盲孔开窗工艺，其特征在于：所述辅助对位靶标图形和大小与步骤（1）中四个靶孔图形大小相同。     [Correct according to Rule 26 12.03.2012]
    The blind hole windowing process of the multilayer HDI circuit board according to claim 4, wherein the auxiliary alignment target pattern and size are the same as the size of the four target hole patterns in the step (1).
  6. [根据细则26改正12.03.2012]　
    根据权利要求1所述的多层HDI线路板的盲孔开窗工艺，其特征在于：所述步骤(2)中采用LD PP或RCC树脂铜箔进行压合。     [Correct according to Rule 26 12.03.2012]
    The blind hole fenestration process of the multilayer HDI circuit board according to claim 1, wherein in the step (2), LD PP or RCC resin copper foil is used for pressing.
  7. [根据细则26改正12.03.2012]　
    根据权利要求1-6中任意一项所述的多层HDI线路板的盲孔开窗工艺，其特征在于：在激光盲孔底PAD层制作的各个靶孔图形旁还设有备用靶标图形。     [Correct according to Rule 26 12.03.2012]
    The blind hole fenestration process of the multilayer HDI circuit board according to any one of claims 1 to 6, characterized in that a standby target pattern is further arranged beside each target hole pattern formed by the laser blind hole bottom PAD layer.
PCT/CN2011/083792 2011-01-05 2011-12-09 Blind hole opening process of multilayer hdi circuit board WO2012092806A1 (en)

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