CN110708896B - Manufacturing method of HDI board - Google Patents
Manufacturing method of HDI board Download PDFInfo
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- CN110708896B CN110708896B CN201910995952.4A CN201910995952A CN110708896B CN 110708896 B CN110708896 B CN 110708896B CN 201910995952 A CN201910995952 A CN 201910995952A CN 110708896 B CN110708896 B CN 110708896B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The invention relates to the technical field of PCBs, and discloses a manufacturing method of an HDI board. The PIN hole machining method comprises the following steps: drilling holes at two ends of the designated setting area in the length direction respectively to form two guide holes with the diameter smaller than the width of the preset PIN hole; respectively carrying out reaming operation on the two guide holes to form two reamed holes with the diameter equal to the width of the preset PIN hole; and performing at least one additional drilling operation between the two counterbores until the PIN hole is formed. The HDI board manufacturing method comprises the following steps: respectively manufacturing a first sub-board and a second sub-board; determining a pre-given expansion and contraction coefficient of the middle core plate according to the actual expansion and contraction coefficients of the two sub-plates; carrying out exposure manufacturing on the middle core plate according to a pre-given expansion and contraction coefficient; and pressing the first daughter board, the middle core board and the second daughter board to form a mother board. The embodiment of the invention can effectively improve the interlayer alignment degree of the HDI board and also can effectively improve the processing precision of the PIN hole, and is particularly suitable for daughter boards with larger board thickness.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a manufacturing method of an HDI Board.
Background
With the development of PCBs towards high-rise multilayer boards, the requirement on the alignment degree is higher and higher, and the manufacturing difficulty is higher and higher. This is due to the fact that the factors affecting the alignment capability are very numerous, involving multiple processes throughout the PCB fabrication process. Poor alignment can cause short circuit, poor signal, CAF and other poor phenomena of the PCB, thereby improving the alignment capability and playing a key role in improving the PCB processing capability and enhancing the market competitiveness of enterprises.
For N +2+ … +2+ N mechanical HDI boards (also called as S boards), no clear alignment control specification exists at present, and the expansion and shrinkage coefficients of all core boards are generally given in a unified manner, so that the problem that the expansion and shrinkage range of different daughter boards is large exists in the daughter board manufacturing process, and the expansion and shrinkage deviation cannot be reflected by the later-stage mother board matching, so that the alignment between layers after lamination is poor, and the improvement of the product yield is limited.
In addition, at present, no matter a sub-board formed by laminating a plurality of layers of core boards or a single-layer core board, PIN holes at the edges of the board are formed in a stamping mode. However, when the plate thickness of the sub-plate is large, the PIN holes formed by the stamping method often cannot meet the manufacturing requirements, so the processing technology of the PIN holes is to be improved,
disclosure of Invention
The invention aims to provide a manufacturing method of an HDI board, which can effectively improve the interlayer alignment degree and improve the PIN hole processing precision.
In order to achieve the purpose, the invention adopts the following technical scheme:
a PIN hole machining method comprises the following steps:
respectively drilling holes at two ends of a designated PIN hole arrangement area in the length direction to form a first guide hole and a second guide hole, wherein the diameters of the first guide hole and the second guide hole are smaller than the width of a preset PIN hole;
respectively carrying out reaming operation on the first guide hole and the second guide hole to form a third reaming and a fourth reaming, wherein the diameters of the third reaming and the fourth reaming are equal to the width of a preset PIN hole;
and performing at least one drilling repairing operation between the third reaming and the fourth reaming until PIN holes are formed in the appointed PIN hole setting area.
Optionally, the first guide hole and the second guide hole are respectively formed in the middle of the two ends.
A manufacturing method of an HDI board comprises the following steps:
respectively manufacturing a first sub-board and a second sub-board, wherein PIN holes are formed in the first sub-board and the second sub-board, and the PIN holes are formed according to any one of the processing methods;
determining a pre-feeding expansion and contraction coefficient of the middle core plate according to the first actual expansion and contraction coefficient of the first sub-plate and the second actual expansion and contraction coefficient of the second sub-plate;
carrying out pattern transfer manufacturing on the middle core plate, and carrying out exposure manufacturing according to the pre-given expansion and contraction coefficient in the pattern transfer manufacturing process;
and pressing the first sub-board, the middle core board and the second sub-board to form a mother board.
Optionally, the manufacturing method of the first sub-board or the second sub-board includes:
firstly, respectively designing targets at corresponding positions of plate edges of each layer of core plates forming a current daughter board, then pressing the core plates to form the current daughter board, and then shooting targets on the current daughter board according to the targets to form four alignment holes distributed at board corners;
automatically measuring the expansion and contraction coefficient of the current daughter board, taking the measured value of the expansion and contraction coefficient as the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, stretching a drill tape according to the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, and performing alignment drilling on the current daughter board according to the alignment hole to form a via hole for transmitting signals;
carrying out pattern transfer manufacturing on the current sub-board, carrying out alignment according to the alignment holes in an exposure process of the pattern transfer manufacturing, and simultaneously manufacturing a first pattern light spot;
and according to the first pattern light spot alignment, manufacturing the PIN hole on the current sub-board.
Optionally, the method further includes:
making a second pattern light spot on the middle core board while performing pattern transfer making on the middle core board; the second graph light spot is coincided with the projection position of the first graph light spot in the lamination direction;
and manufacturing PIN holes on the middle core board according to the first pattern light spot alignment.
Optionally, the manufacturing method of the first sub-board or the second sub-board includes:
respectively designing targets at corresponding positions of plate edges of each layer of core plates forming a current daughter board, pressing the core plates to form the current daughter board, measuring the expansion and contraction coefficient of the current daughter board, stacking the current daughter board according to the measurement value of the expansion and contraction coefficient and a plurality of preset expansion and contraction coefficient intervals, and shooting the target on the current daughter board according to the target to form three L-shaped positioning holes distributed at the plate edges;
taking the average value of the measurement values of the expansion and contraction coefficients of all the daughter boards in a first daughter board stack or a second daughter board stack to which the current daughter board belongs as the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, performing drill strip stretching according to the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, drilling holes in the current daughter board to form through holes for transmitting signals, drilling four alignment holes distributed at board angles, and simultaneously manufacturing PIN holes in the current daughter board according to a ratio of 1: 1;
and carrying out pattern transfer manufacturing on the current sub-board, and carrying out alignment according to the alignment holes in an exposure process of the pattern transfer manufacturing.
Optionally, the method further includes:
making a pattern light spot on the middle core plate while performing pattern transfer making on the middle core plate; and manufacturing PIN holes on the middle core board according to the pattern light spot alignment.
Optionally, the method further includes:
after the first daughter board, the middle core board and the second daughter board are pressed to form a mother board, the mother board is subjected to target shooting to form a plurality of positioning holes, and after the drill tape is stretched, holes are drilled to form through holes for signal transmission.
Optionally, in the manufacturing method, the alignment hole is manufactured in a target-finding targeting mode or a half compensation mode.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, the pre-given expansion and contraction coefficient of the middle core plate is determined according to the actual expansion and contraction coefficients of the upper daughter board and the lower daughter board, so that the interlayer alignment degree of the HDI board can be effectively improved, the design capacity of dense holes is improved, and the product yield is improved; the embodiment of the invention also provides a PIN hole processing method which comprises the steps of firstly drilling the guide hole, then reaming and then performing additional drilling, can effectively improve the processing precision of the PIN hole and is particularly suitable for daughter boards with large board thicknesses.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a manufacturing method of an HDI board according to an embodiment of the present invention.
Fig. 2 is a flowchart of a first manufacturing method of the present daughter board according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a first manufacturing method of an HDI board according to an embodiment of the present invention.
Fig. 4 is a flowchart of a second manufacturing method of the present daughter board according to an embodiment of the present invention.
FIG. 5 is a schematic diagram of a second manufacturing method of an HDI board according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a PIN hole processing method according to an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing an HDI board, where the HDI board is manufactured by pressing a first sub-board, at least one middle core board, and a second sub-board, and the manufacturing method specifically includes:
and 101, respectively manufacturing a first sub-board and a second sub-board.
And 102, determining a pre-given expansion and contraction coefficient of the middle core plate according to the first actual expansion and contraction coefficient of one sub-plate and the second actual expansion and contraction coefficient of the second sub-plate.
Optionally, the pre-given expansion and contraction coefficient of the middle core plate is set to be a corresponding value of an average value of the first actual expansion and contraction coefficient and the second actual expansion and contraction coefficient, so that the interlayer alignment range between the middle core plate and the two daughter boards is reduced.
And 103, carrying out pattern transfer manufacturing on the middle core plate, and carrying out exposure manufacturing according to the pre-given expansion and contraction coefficient in the pattern transfer manufacturing process.
And 104, pressing the first daughter board, the middle core board and the second daughter board to form a mother board.
Because the two daughter boards have a large expansion and contraction range in the manufacturing process, in the manufacturing method of the embodiment, a pre-given expansion and contraction coefficient of the middle core board is set according to the actual expansion and contraction coefficients of the first daughter board and the second daughter board, instead of setting the pre-given expansion and contraction coefficient according to an empirical value, so that the range between layers can be effectively reduced, and the alignment degree is further improved.
The manufacturing methods for the first sub-board and the second sub-board may be the same, and in this embodiment, the two manufacturing methods may be adopted. For convenience of description, the first sub-board and the second sub-board to be fabricated will be hereinafter collectively referred to as a current sub-board.
Referring to fig. 2 and 3, a first method of manufacturing a present sub-board includes:
And 203, utilizing an X-RAY machine to target on the current daughter board according to the target, and forming four alignment holes 31 distributed at the board corners.
In this step, the four alignment holes 31 are respectively made by a target-finding and shooting method, specifically: and at each target shooting position, shooting by taking the gravity center position of the projection graph of the targets of all the core plates of the current daughter board on the outer layer board surface as the center point of the hole to form the alignment hole 31.
And 204, automatically measuring the expansion and contraction coefficient of the current daughter board, taking the measured value of the expansion and contraction coefficient as a first actual expansion and contraction coefficient/a second actual expansion and contraction coefficient, stretching a drill tape according to the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, aligning the current daughter board according to the alignment hole 31, and then drilling to form a via hole 32 for transmitting signals.
In practical application, any PCB processing equipment with an automatic measurement function can be applied to realize automatic measurement of the expansion and contraction coefficient, such as a CCD drilling machine, a DI exposure machine, a laser drilling machine, and the like, and these equipment have an automatic measurement function although they are not special-purpose measurement equipment.
In step 205, pattern transfer is performed on the current daughter board, and the first pattern light spot 33 is formed while performing alignment with the alignment hole 31 in the exposure step for pattern transfer formation.
In the exposure process, exposure can be performed on each of the first sub-board and the second sub-board by using a DI machine according to the actual expansion and contraction coefficient of the first sub-board and the second sub-board.
In the actual mass production process, the number of the manufactured first sub-boards/second sub-boards is large, and the actual expansion and contraction coefficients of each first sub-board/second sub-board are different, so that a plurality of expansion and contraction coefficient intervals can be set according to the requirement of alignment, all the exposed sub-boards (including the first sub-boards and the second sub-boards) are stacked, a plurality of first sub-board stacks and a plurality of second sub-board stacks are obtained, and all the sub-boards in each first sub-board stack/second sub-board stack belong to one expansion and contraction coefficient interval. Therefore, different control ranges can be established according to the design requirement of the alignment degree, and the production is more facilitated.
And when the pre-given expansion and contraction coefficients of the middle core plates are determined subsequently, for the matched first sub-plate stack and second sub-plate stack, determining the pre-given expansion and contraction coefficient of the corresponding middle core plate according to the average value of the first actual expansion and contraction coefficients of all the first sub-plates in the first sub-plate stack and the average value of the second actual expansion and contraction coefficients of all the second sub-plates in the second sub-plate stack. Thus, the interlayer alignment can be controlled within a preset range.
And step 206, aligning according to the first pattern light spot 33, and manufacturing a PIN hole 34 on the current daughter board.
In summary, in the above-mentioned method for manufacturing a daughter board, the alignment holes 31 are formed by targeting on the daughter board, then the alignment is performed according to the alignment holes 31 to realize the via holes 32, the exposure and the first pattern light spots 33 manufacturing, and then the PIN holes 34 are manufactured by alignment according to the first pattern light spots 33, so that the four alignment holes 31 are uniformly used for alignment in the via holes 32, the exposure and the first pattern light spots 33 manufacturing processes, thereby improving the alignment accuracy, reducing the misalignment of the via holes, the exposure patterns and the PIN holes 34 to the maximum extent, reducing various risks caused by the misalignment, and effectively improving the product yield. According to the daughter board manufacturing method, the split stack design is adopted after the exposure process, different control ranges can be established according to the design requirement of the alignment degree, the production is facilitated, the matching deviation of the daughter board and the core board can be controlled in a smaller range, and the alignment degree can be effectively improved.
When the first sub-board and the second sub-board are manufactured by the first manufacturing method, as shown in fig. 3, a second pattern light spot 35 can be manufactured on the middle core board while the pattern transfer manufacturing is performed on the middle core board, and the second pattern light spot 35 is overlapped with the projection position of the first pattern light spot 33 in the board stacking direction; after the pattern transfer is completed, the PIN holes 36 are formed in the intermediate core board by aligning the second pattern light spots 35. Therefore, the PIN holes on the two sub-boards and the middle core board are respectively aligned by the first pattern light spots 33 or the second pattern light spots 35 with the same positions, so that the alignment accuracy of the PIN holes of the sub-boards and the middle core board is ensured, and the stitching alignment degree of the sub-boards and the middle core board is further improved.
In addition, after the first daughter board, the middle core board and the second daughter board are pressed to form the mother board in step 104, the method further includes the steps of: and manufacturing target holes 37 on the mother board, performing drill tape stretching, and drilling holes on the mother board according to the target hole alignment to form through holes 38 for transmitting signals.
Referring to fig. 4 and 5, a second method of manufacturing a present sub-board includes:
301, respectively designing targets at corresponding positions of plate edges of each layer of core plates forming the current daughter board; the number of targets on each layer of core plate is three, and the targets are respectively arranged on the plate edges at two opposite sides and form an L shape.
And step 302, laminating the core boards to form the current daughter board.
And 303, utilizing an X-RAY machine to target on the current daughter board according to the target to form three L-shaped positioning holes 51 distributed at the edge of the board.
In this step, the manufacturing of the positioning hole 51 can be completed by adopting a half compensation mode or the above-mentioned target shooting mode. Wherein, the halving compensation mode is as follows: and measuring the actual distance between the targets, and performing halving compensation according to the central point to hit the target hole.
And step 304, after the drill strip is stretched according to the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, drilling holes on the current daughter board to form through holes 52 for signal transmission, drilling four alignment holes 53 distributed at board corners, and simultaneously manufacturing PIN holes 54 on the current daughter board according to the ratio of 1: 1.
Before the drill strip is stretched, a plurality of expansion and contraction coefficient intervals can be set according to the requirement of the alignment degree, all the sub-plates (including the first sub-plate and the second sub-plate) are stacked according to the expansion and contraction coefficient intervals, a plurality of first sub-plate stacks and a plurality of second sub-plate stacks are obtained, and all the sub-plates in each first sub-plate stack/second sub-plate stack belong to one expansion and contraction coefficient interval.
For each first sub-board stack, taking the average value of the measurement values of the expansion and contraction coefficients of all the first sub-boards in the current first sub-board stack as a corresponding first actual expansion and contraction coefficient, after the drill tapes are stretched according to the first actual expansion and contraction coefficient, drilling all the first sub-boards in the current first sub-board stack uniformly according to the stretched drill tapes to form the via holes 52.
Similarly, for each second sub-board stack, the average value of the measurement values of the expansion and contraction coefficients of all the second sub-boards in the current second sub-board stack is used as the corresponding second actual expansion and contraction coefficient, after the drill tape is stretched according to the second actual expansion and contraction coefficient, all the second sub-boards in the current second sub-board stack are drilled according to the stretched drill tape uniformly to form the via hole 52.
And when the pre-given expansion and contraction coefficient of the intermediate core plate is determined subsequently, for the matched first sub-plate stack and second sub-plate stack, determining the pre-given expansion and contraction coefficient of the matched intermediate core plate according to the mean value of the first actual expansion and contraction coefficient corresponding to the first sub-plate stack and the second actual expansion and contraction coefficient corresponding to the second sub-plate stack. Thus, the interlayer alignment can be controlled within a preset range.
Since the PIN holes 54 are only used for fixing the stack of the current daughter board, other daughter boards, and the intermediate core board, and only the projection positions in the stack direction are kept coincident with each other, the PIN holes do not need to be made by stretching.
In step 305, pattern transfer is performed on the current daughter board, and alignment is performed based on the four alignment holes 53 in the exposure step for pattern transfer.
In the exposure process of the step, all the first sub-boards or the second sub-boards belonging to the same sub-stack are manufactured by adopting a film tool with the exposure coefficient matched with the expansion and contraction interval of the current sub-stack.
Different from the first manufacturing method, the second manufacturing method comprises the steps of firstly shooting on the daughter board to form an L-shaped positioning hole 51, then conducting drilling tape stretching to achieve manufacturing of a through hole 52 and a registration hole 53, manufacturing a PIN hole 54 in a ratio of 1:1, and then conducting registration according to the registration hole 53 to achieve exposure.
Compared with the prior art, the second manufacturing method of the current sub-board realizes the establishment of different control ranges according to the design requirement of the alignment degree by the method of firstly performing the sub-stacking, then performing the drilling tape stretching according to the sub-stacking, then drilling and manufacturing the pattern (the drilling tape stretching coefficient and the exposure coefficient of each stack are fixed values).
When the second manufacturing method is used to manufacture the first sub-board and the second sub-board, as shown in fig. 5, a pattern light spot 54 can be manufactured on the middle core board while the pattern transfer manufacturing is performed on the middle core board, and the position of the pattern light spot 54 is consistent with that of the target hole 51 on the first sub-board/the second sub-board; after the pattern transfer is completed, the PIN holes 55 are formed in the intermediate core board by aligning the pattern light spots 54.
In addition, after the first daughter board, the middle core board and the second daughter board are pressed to form the mother board, the method further comprises the following steps: an L-shaped positioning hole 56 is formed in the motherboard, and after the drilling tape is stretched, a hole is drilled to form a through hole 57 for signal transmission.
In addition, referring to fig. 6, the present embodiment further provides a PIN hole processing method, including:
drilling holes at two ends of the designated PIN hole arrangement area in the length direction respectively to form a first guide hole 61 and a second guide hole 62, wherein the diameters of the first guide hole 61 and the second guide hole 62 are smaller than the width of the preset PIN hole;
respectively reaming the first guide hole 61 and the second guide hole 62 to form a third reaming 63 and a fourth reaming 64, wherein the diameters of the third reaming 63 and the fourth reaming 64 are equal to the width of the preset PIN hole;
according to the length of the designated PIN hole setting area, at least one additional drilling operation is performed between the third counterbore 63 and the fourth counterbore 64 until a required PIN hole is formed in the designated PIN hole setting area.
Specifically, the first guide hole 61 and the second guide hole 62 are used for guiding to ensure the positional accuracy of the third counterbore 63 and the fourth counterbore 64 at both end positions, thereby improving the positional accuracy of the entire PIN hole. In the actual production process, the first guide hole 61 and the second guide hole 62 can be drilled at the middle position of the two ends by using the same drill bit with the size smaller than the width of the preset PIN hole, and other holes can be drilled by using the same drill bit with the size consistent with the width of the preset PIN hole.
Compared with the traditional stamping method, the method has the advantages that the PIN holes are formed in a drilling mode, the influence of plate thickness factors on manufacturing accuracy of the PIN holes can be effectively reduced, and the method is particularly suitable for the sub-plate in the HDI plate.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (5)
1. A manufacturing method of an HDI board is characterized by comprising the following steps:
manufacturing a first sub-board and a second sub-board respectively, wherein PIN holes are formed in the first sub-board and the second sub-board, and the PIN hole processing method comprises the following steps: respectively drilling holes at two ends of a designated PIN hole arrangement area in the length direction to form a first guide hole and a second guide hole, wherein the diameters of the first guide hole and the second guide hole are smaller than the width of a preset PIN hole; respectively carrying out reaming operation on the first guide hole and the second guide hole to form a third reaming and a fourth reaming, wherein the diameters of the third reaming and the fourth reaming are equal to the width of a preset PIN hole; performing at least one drilling repairing operation between the third reaming and the fourth reaming until a PIN hole is formed in the designated PIN hole setting area;
determining a pre-feeding expansion and contraction coefficient of the middle core plate according to the first actual expansion and contraction coefficient of the first sub-plate and the second actual expansion and contraction coefficient of the second sub-plate;
carrying out pattern transfer manufacturing on the middle core plate, and carrying out exposure manufacturing according to the pre-given expansion and contraction coefficient in the pattern transfer manufacturing process;
pressing the first daughter board, the middle core board and the second daughter board to form a mother board;
the manufacturing method of the first sub-board or the second sub-board comprises the following steps:
firstly, respectively designing targets at corresponding positions of plate edges of each layer of core plates forming a current daughter board, then pressing the core plates to form the current daughter board, and then shooting targets on the current daughter board according to the targets to form four alignment holes distributed at board corners;
automatically measuring the expansion and contraction coefficient of the current daughter board, taking the measured value of the expansion and contraction coefficient as the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, stretching a drill tape according to the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, and performing alignment drilling on the current daughter board according to the alignment hole to form a via hole for transmitting signals;
carrying out pattern transfer manufacturing on the current sub-board, carrying out alignment according to the alignment holes in an exposure process of the pattern transfer manufacturing, and simultaneously manufacturing a first pattern light spot;
according to the first graph light spot alignment, manufacturing the PIN hole on the current sub-board;
making a second pattern light spot on the middle core board while performing pattern transfer making on the middle core board; the second graph light spot is coincided with the projection position of the first graph light spot in the lamination direction;
and manufacturing PIN holes on the middle core board according to the first pattern light spot alignment.
2. The method of making an HDI board according to claim 1, wherein the method of making the first or second daughter board comprises:
respectively designing targets at corresponding positions of plate edges of each layer of core plates forming a current daughter board, pressing the core plates to form the current daughter board, measuring the expansion and contraction coefficient of the current daughter board, stacking the current daughter board according to the measurement value of the expansion and contraction coefficient and a plurality of preset expansion and contraction coefficient intervals, and shooting the target on the current daughter board according to the target to form three L-shaped positioning holes distributed at the plate edges;
taking the average value of the measurement values of the expansion and contraction coefficients of all the daughter boards in a first daughter board stack or a second daughter board stack to which the current daughter board belongs as the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, performing drill strip stretching according to the first actual expansion and contraction coefficient/the second actual expansion and contraction coefficient, drilling holes in the current daughter board to form through holes for transmitting signals, drilling four alignment holes distributed at board angles, and simultaneously manufacturing PIN holes in the current daughter board according to a ratio of 1: 1;
and carrying out pattern transfer manufacturing on the current sub-board, and carrying out alignment according to the alignment holes in an exposure process of the pattern transfer manufacturing.
3. The method of making an HDI plate according to claim 2, further comprising:
making a pattern light spot on the middle core plate while performing pattern transfer making on the middle core plate; and manufacturing PIN holes on the middle core board according to the pattern light spot alignment.
4. The method of making an HDI plate according to claim 1, further comprising:
after the first daughter board, the middle core board and the second daughter board are pressed to form a mother board, the mother board is subjected to target shooting to form a plurality of positioning holes, and after the drill tape is stretched, holes are drilled to form through holes for signal transmission.
5. A method of making an HDI plate as claimed in claim 2 wherein in the method the registration holes are made using a hit target or a half-offset.
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| CN102039435A (en) * | 2009-10-14 | 2011-05-04 | 北大方正集团有限公司 | Slotted hole machining method |
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