CN102686009B - Wiring board and line manufacturing process thereof - Google Patents
Wiring board and line manufacturing process thereof Download PDFInfo
- Publication number
- CN102686009B CN102686009B CN201110054923.1A CN201110054923A CN102686009B CN 102686009 B CN102686009 B CN 102686009B CN 201110054923 A CN201110054923 A CN 201110054923A CN 102686009 B CN102686009 B CN 102686009B
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- CN
- China
- Prior art keywords
- photosensitive resin
- layer
- insulating barrier
- wiring board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The invention discloses wiring board and line manufacturing process thereof, at surface of insulating layer coating photosensitive resin layer, photosensitive resin layer is made to form circuit by the mode of contraposition exposure imaging, on the photosensitive resin layer forming circuit, heavy copper forms line layer again, compare traditional wiring board, amount of copper consuming is few, and cost of manufacture greatly reduces; And structure is simple, easy to make.
Description
Technical field
The present invention relates to wiring board art, especially a kind of wiring board of line layer straight forming and line manufacturing process thereof.
Background technology
Existing wiring board, the mode adopting double face copper to carry out contraposition exposure imaging after etching on copper foil layer makes circuit, and multi-layer sheet then continues pressing insulating resin and copper foil layer, then carries out circuit etching making, and serious to the waste of copper, production cost expends larger.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of wiring board and line manufacturing process thereof, amount of copper consuming is few, and structure is simple.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of wiring board, comprise insulating barrier and line layer, described surface of insulating layer is coated with photosensitive resin layer, and this photosensitive resin layer forms circuit, and this photosensitive resin layer surface deposition has layers of copper, and described layers of copper forms line layer.
As a further improvement on the present invention, the quantity of described insulating barrier is one deck, and this insulating barrier is substrate.
As a further improvement on the present invention, the quantity of described insulating barrier is greater than one deck, and insulating barrier and line layer are in superposing alternately, and wherein a layer insulating is substrate.
1., clean substrate plate face a line manufacturing process for wiring board, follows these steps to carry out:; 2., plate face coating photosensitive resin; 3., dry; 4., contraposition exposure imaging, corresponding line keeps the photosensitive resin needed here, and the development of photosensitive resin outside circuit is fallen; 5., solidify, the circuit that photosensitive resin layer is made firmly onboard; 6., heavy copper, the heavy last layer copper in photosensitive resin surface stayed, forms line layer.
7., lamination when making four sandwich circuit boards, carry out one step press making, then also in turn include the following steps after step 6.:, at wiring board surface pressing insulating barrier; 8., again the plate face of insulating barrier is cleaned; 9., repeat step 2. ~ step 6., complete the circuit after one step press make; .
When line layer is greater than four layers, carries out repeatedly pressing again and make after step is 9., its pressing makes number of times for often increasing by two sandwich circuit multiple pressures unifications time, each pressing make repeat step 7. ~ step 9..
The invention has the beneficial effects as follows: form circuit with photosensitive resin layer, layers of copper deposition, on the line to form line layer, compares traditional wiring board, and amount of copper consuming is few, and cost of manufacture greatly reduces; And structure is simple, easy to make.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present invention.
Embodiment
Embodiment: a kind of wiring board, comprises insulating barrier 1 and line layer 2, and described insulating barrier 1 surface coverage has photosensitive resin layer 3, and this photosensitive resin layer 3 forms circuit, and this photosensitive resin layer 3 surface deposition has layers of copper, and described layers of copper forms line layer 2.
The quantity of described insulating barrier 1 is one deck, and this insulating barrier 1 is substrate.
The quantity of described insulating barrier 1 is greater than one deck, and insulating barrier 1 and line layer 2 are in superposing alternately, and wherein a layer insulating 1 is substrate.
1., clean substrate plate face a line manufacturing process for wiring board, is characterized in that: follow these steps to carry out:; 2., plate face coating photosensitive resin; 3., dry; 4., contraposition exposure imaging, corresponding line keeps the photosensitive resin needed here, and the development of photosensitive resin outside circuit is fallen; 5., solidify, the circuit that photosensitive resin layer is made firmly onboard; 6., heavy copper, the heavy last layer copper in photosensitive resin surface stayed, forms line layer.
7., lamination when making four sandwich circuit boards, carry out one step press making, then also in turn include the following steps after step 6.:, at wiring board surface pressing insulating barrier; 8., again the plate face of insulating barrier is cleaned; 9., repeat step 2. ~ step 6., complete the circuit after one step press make; .
When line layer is greater than four layers, carries out repeatedly pressing again and make after step is 9., its pressing makes number of times for often increasing by two sandwich circuit multiple pressures unifications time, each pressing make repeat step 7. ~ step 9..
Claims (1)
1. a wiring board, comprise insulating barrier (1) and line layer (2), it is characterized in that: described insulating barrier (1) surface coverage has photosensitive resin layer (3), this photosensitive resin layer (3) forms circuit, this photosensitive resin layer (3) surface deposition has layers of copper, and described layers of copper forms line layer (2); And the quantity of described insulating barrier (1) is greater than one deck, insulating barrier (1) and line layer (2) are in superposing alternately, and wherein a layer insulating (1) is substrate;
1., clean substrate plate face the line manufacturing process of this wiring board follows these steps to carry out:; 2., plate face coating photosensitive resin; 3., dry; 4., contraposition exposure imaging, corresponding line keeps the photosensitive resin needed here, and the development of photosensitive resin outside circuit is fallen; 5., solidify, the circuit that photosensitive resin layer is made firmly onboard; 6., heavy copper, the heavy last layer copper in photosensitive resin surface stayed, forms line layer;
And when making four sandwich circuit board, carry out one step press making, then also in turn include the following steps after step 6.: 7., lamination, at wiring board surface pressing insulating barrier; 8., again the plate face of insulating barrier is cleaned; 9., repeat step 2. ~ step 6., complete the circuit after one step press make;
And when making line layer and being greater than four layers, step 9. after, carry out repeatedly pressing again make, its pressing makes number of times for often increasing by two sandwich circuit multiple pressures unifications time, each pressing make repetition step 7. ~ step 9..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110054923.1A CN102686009B (en) | 2011-03-08 | 2011-03-08 | Wiring board and line manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110054923.1A CN102686009B (en) | 2011-03-08 | 2011-03-08 | Wiring board and line manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102686009A CN102686009A (en) | 2012-09-19 |
| CN102686009B true CN102686009B (en) | 2015-10-28 |
Family
ID=46817175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110054923.1A Expired - Fee Related CN102686009B (en) | 2011-03-08 | 2011-03-08 | Wiring board and line manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102686009B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132104A (en) * | 2016-07-05 | 2016-11-16 | 浙江近点电子股份有限公司 | A kind of production technology of FPC |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784121A (en) * | 2004-12-02 | 2006-06-07 | 三星电机株式会社 | Method of fabricating printed circuit board having thin core layer |
| CN101257769A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Contraposition method for manufacturing printed circuit board |
| CN201957335U (en) * | 2011-03-08 | 2011-08-31 | 昆山市华升电路板有限公司 | Circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758438A (en) * | 1993-08-18 | 1995-03-03 | Shinko Electric Ind Co Ltd | Circuit substrate and manufacture thereof |
| JPH09307216A (en) * | 1996-05-13 | 1997-11-28 | Ngk Spark Plug Co Ltd | Manufacture of wiring board, and wiring board |
| US20050016762A1 (en) * | 2003-07-22 | 2005-01-27 | Unitech Printed Circuit Board Corp. | Method of forming a multi-layer printed circuit board and the product thereof |
| JP2005142984A (en) * | 2003-11-10 | 2005-06-02 | Shin Etsu Polymer Co Ltd | Translucent antenna |
| KR20080098753A (en) * | 2007-05-07 | 2008-11-12 | 삼성전기주식회사 | Pcb and manufacturing method thereof |
-
2011
- 2011-03-08 CN CN201110054923.1A patent/CN102686009B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784121A (en) * | 2004-12-02 | 2006-06-07 | 三星电机株式会社 | Method of fabricating printed circuit board having thin core layer |
| CN101257769A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Contraposition method for manufacturing printed circuit board |
| CN201957335U (en) * | 2011-03-08 | 2011-08-31 | 昆山市华升电路板有限公司 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102686009A (en) | 2012-09-19 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20160621 Address after: 215341 Suzhou city in Jiangsu province Kunshan City Qiandeng Fumin Industrial Development Zone Patentee after: Kunshan Huasheng circuit board research and development base Co Ltd Address before: Henderson Fumin Industrial Zone, Kunshan Road, Qiandeng Town Suzhou city Jiangsu province 215341 No. 198 Patentee before: Kunshan Huasheng Printed Circuit Board Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151028 Termination date: 20200308 |
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| CF01 | Termination of patent right due to non-payment of annual fee |