CN102036486B - Method for making false double-sided board - Google Patents
Method for making false double-sided board Download PDFInfo
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- CN102036486B CN102036486B CN2010105182120A CN201010518212A CN102036486B CN 102036486 B CN102036486 B CN 102036486B CN 2010105182120 A CN2010105182120 A CN 2010105182120A CN 201010518212 A CN201010518212 A CN 201010518212A CN 102036486 B CN102036486 B CN 102036486B
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- sided board
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a method for making a false double-sided board, which comprises the following steps: 10. blanking; 20. drilling a first locating hole in a substrate; 30. printing the front circuit pattern layer and the back circuit pattern layer according to the first locating hole to obtain the false double-sided board; 40. carrying out acidic etching on the false double-sided board; 50. filling silver paste, copper paste or carbon paste in the hole of the false double-sided board; 60. thermosetting the silver paste, copper paste or carbon paste; and 70. printing the front solder mask character patter layer and the back solder mask character patter layer on the false double-sided board, wherein step 45 between 40 and 50 is realized by drilling a second locating hole, which is used for locating when printing the front solder mask character patter layer and the back solder mask character patter layer, in the false double-sided board. The invention can enhance the locating accuracy and eliminate the accumulative deviation when printing front solder mask character patter layer and the back solder mask character patter layer.
Description
[technical field]
The present invention relates to a kind of false double sided board manufacture method, particularly a kind of false double sided board manufacture method that improves the printing accuracy.
[background technology]
The application of false double sided board is very general, yet all there is wiring on the two sides of false double sided board, and design is comparatively complicated.General false double sided board adopts the screen printing technique printing, and technical process is: the resistance weldering character figure layer-photocuring-punching-reprocessing of resistance weldering character figure layer-photocuring-printing reverse side that the line map layer-curing-acid etching of line map layer-curing-printing reverse side that blanking-two printing location holes of brill-printing is positive-silver paste hole filled (copper slurry or carbon slurry perforation)-slurry hot curing-printing is positive-pack-dispatch from the factory.Existing printing technology shortcoming is: printing front line map layer and reverse side line map layer have a dislocation deviation; And positive resistance of printing also can produce the dislocation deviation when welding character figure layer and reverse side resistance weldering character figure layer; These two dislocation deviations superpose, and Accumulated deviation makes final products produce critical defects such as occurring test errors when copper pad is hindered covering of weldering green oil and electrical testing.
[summary of the invention]
The technical problem that the present invention will solve is to provide a kind of false double sided board manufacture method, and the deviation of stack when it can overcome printing has reduced the deviation that character figure layer is welded in the printing resistance.
The present invention is achieved in that
A kind of false double sided board manufacture method of the present invention comprises following processing step: step 10. blankings; Step 20. gets out first location hole on substrate; Step 30. obtains false double sided board according to first location hole printing front line map layer and reverse side line map layer; Step 40. pair false double sided board carries out acid etching; Step 50. pair false double sided board carries out silver slurry, copper slurry or carbon slurry perforation; Step 60. is with said silver slurry, copper slurry or the hot curing of carbon slurry; Step 70. is printed positive resistance weldering character figure layer and reverse side resistance weldering character figure layer on false double sided board; Also comprise step 45 between said step 40 and the step 50: on false double sided board, bore second location hole, said second location hole is used for when positive resistance weldering character figure layer of printing and reverse side resistance weldering character figure layer, positioning.
Further, said step 45 further comprises: on the frame of the front of said false double sided board, play three location targets, and be angular distribution; Play three location targets on the reverse side frame again, and be the inverted triangle distribution; Get out six said second location holes according to said six location targets.
Further, three of the front of said double sided board location targets lay respectively in the middle of the upper side frame and the two ends of lower frame; Reverse side three the location targets lay respectively at the two ends of upper side frame and the centre of lower frame.
Further, the quantity of said first location hole is two.
The present invention has following advantage:
The positive and negative of the present invention on the frame behind substrate printing front line map layer and the reverse side line map layer are provided with the location target, and particularly the location target on the frame of the front of said double sided board is three, and is angular distribution; Location target on the reverse side frame is three, and is the inverted triangle distribution; Get out location hole through these location targets; Make that through these location holes resistance can improve accuracy when welding character figure layer with reverse side printing positive resistance weldering character figure layer; Eliminate the Accumulated deviation of print pattern layer and printing resistance weldering character figure layer, reduced the chance that occurs mistake when copper pad is hindered chance that weldering covers with electrical testing.
[description of drawings]
Combine embodiment that the present invention is further described with reference to the accompanying drawings.
Fig. 1 is the sketch map of the inventive method.
Fig. 2 A is that double sided board plate of the present invention front comprises the sketch map of locating target.
Fig. 2 B is that double sided board plate reverse side of the present invention comprises the sketch map of locating target.
[embodiment]
Consult Fig. 1, Fig. 2 A, Fig. 2 B embodiments of the invention are done detailed explanation.
As shown in Figure 1, false double sided board may further comprise the steps according to the technical process of making: 10. blanking; Step 20. gets out first location hole on substrate; Step 30. obtains false double sided board according to first location hole printing front line map layer and reverse side line map layer; Step 40. pair false double sided board carries out acid etching; 45. the positive and negative at double sided board respectively is provided with the location target, gets out second location hole according to said location target; Step 50. pair false double sided board carries out silver slurry, copper slurry or carbon slurry perforation; Step 60. is with said silver slurry, copper slurry or the hot curing of carbon slurry; Step 70. is printed positive resistance weldering character figure layer and reverse side resistance weldering character figure layer on false double sided board.
In printing; On described substrate, bore two first location holes earlier; Position when being used for printing front line map layer and reverse side line map layer; Two first location holes are symmetricly set on the substrate frame, and for example one first location hole is arranged at the left upper end angle, and another first location hole is arranged at the bottom righthand side angle.Because all can be wrong biased poor when generally printing front line map layer and reverse side line map layer, promptly the line map layer have produced deviation.Accurate positioning when printing welding resistance character figure layer in order to improve, the present invention is provided with second locating hole again, promptly on the front frame of the false dual platen after substrate prints positive and negative line map layer and the reverse side frame location target is set again earlier.Location target 1 on the front frame of said false double sided board ' be three, shown in Fig. 2 A, middle 1 of upper side frame, each 1 on lower frame both sides are angular distribution; Location target 1 on the reverse side frame ' also be three, shown in Fig. 2 B, each 1 on upper side frame both sides, middle 1 of lower frame is inverted triangle and distributes.Then the location target 1 through 3 positive triangle relations ', the location target 1 of 3 inverted triangles relations of reverse side ', get out 6 second location holes.Through these 6 second location holes; Can aim at the line map layer when making printing resistance weldering character figure layer; Make three location targets of above-mentioned three the location target 1 ' aligning printing plates on the half tone during positive the location, make three same inverted orientation targets of above-mentioned other three the inverted orientation targets 1 ' aligning printing plate on the half tone during reverse side location.So just can improve the contraposition accuracy of printing, the resistance weldering character figure layer above the false double sided board and the contraposition accuracy of line map layer just can improve.
The above is merely preferred embodiment of the present invention, so can not limit the scope that the present invention implements according to this, the equivalence of promptly doing according to claim of the present invention and description changes and modifies, and all should still belong in the scope that the present invention contains.
Claims (3)
1. false double sided board manufacture method comprises following processing step:
Step 10. blanking;
Step 20. gets out first location hole on substrate;
Step 30. obtains false dual platen based on first locating hole printing front line map layer and reverse side line map layer;
Step 40. pair false double sided board carries out acid etching;
Step 50. pair false double sided board carries out silver slurry, copper slurry or carbon slurry perforation;
Step 60. is with said silver slurry, copper slurry or the hot curing of carbon slurry;
Step 70. is printed positive resistance weldering character figure layer and reverse side resistance weldering character figure layer on false double sided board;
It is characterized in that: also comprise between said step 40 and the step 50
Step 45: on false double sided board, bore second location hole; Said second location hole is used for when positive resistance weldering character figure layer of printing and reverse side resistance weldering character figure layer, positioning; Said brill second location hole further comprises: on the frame of the front of said false double sided board, play three location targets, and be angular distribution; Play three location targets on the reverse side frame again, and be the inverted triangle distribution; Get out six said second location holes according to said six location targets.
2. a kind of false double sided board manufacture method according to claim 1 is characterized in that: three location targets in the front of said double sided board lay respectively in the middle of the upper side frame and the two ends of lower frame; Three location targets of reverse side lay respectively at the two ends of upper side frame and the centre of lower frame.
3. a kind of false double sided board manufacture method according to claim 1, it is characterized in that: the quantity of said first location hole is two, be symmetricly set in said substrate upper and lower side frame about hold the angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105182120A CN102036486B (en) | 2010-10-25 | 2010-10-25 | Method for making false double-sided board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105182120A CN102036486B (en) | 2010-10-25 | 2010-10-25 | Method for making false double-sided board |
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| Publication Number | Publication Date |
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| CN102036486A CN102036486A (en) | 2011-04-27 |
| CN102036486B true CN102036486B (en) | 2012-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105182120A Active CN102036486B (en) | 2010-10-25 | 2010-10-25 | Method for making false double-sided board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188281A (en) * | 2015-08-28 | 2015-12-23 | 涟水县苏杭科技有限公司 | Manufacturing method for dummy double-sided PCB |
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
| CN111968920A (en) * | 2020-08-31 | 2020-11-20 | 福建天电光电有限公司 | Lead frame and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
| CN1665376A (en) * | 2005-03-28 | 2005-09-07 | 徐立军 | Production process of high precision silver slurry perforated multilayer carbon membrane surface mounting board |
| JP2007281336A (en) * | 2006-04-11 | 2007-10-25 | Fujikura Ltd | Method of manufacturing double sided printed wiring board and multilayer printed wiring board |
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101594750A (en) * | 2008-05-27 | 2009-12-02 | 南亚电路板股份有限公司 | The structure of high-density base board and method for making |
-
2010
- 2010-10-25 CN CN2010105182120A patent/CN102036486B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
| CN1665376A (en) * | 2005-03-28 | 2005-09-07 | 徐立军 | Production process of high precision silver slurry perforated multilayer carbon membrane surface mounting board |
| JP2007281336A (en) * | 2006-04-11 | 2007-10-25 | Fujikura Ltd | Method of manufacturing double sided printed wiring board and multilayer printed wiring board |
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101594750A (en) * | 2008-05-27 | 2009-12-02 | 南亚电路板股份有限公司 | The structure of high-density base board and method for making |
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| CN102036486A (en) | 2011-04-27 |
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