JP4210692B2 - Drilling device - Google Patents

Description

  The present invention relates to a perforating apparatus.

  In electronic devices, as electronic components for surface mounting such as IC chips, resistors, capacitors, and the like are miniaturized, printed wiring boards on which these are mounted are often required to have a high density and are often multilayered. The multilayer printed wiring board is composed of a conductor layer exposed to the outside of the front and back two layers, and several inner conductor layers that are not exposed. An insulating substrate is disposed between the conductor layers, and the conductor layers are bonded by the substrate.

  When producing a multilayer printed wiring board, a predetermined number of double-sided printed wiring boards for inner layers are used. Each double-sided printed wiring board for the inner layer has at least two reference holes for positioning and a reference hole for front and back identification in advance, and patterns and the like on both sides are formed in the etching process based on this reference hole Is done. The patterns of the front and back sides of the double-sided printed wiring board are maintained in a positional relationship with each other in plan view. A pattern or the like is formed on each double-sided printed wiring board for inner layers constituting the same multilayer printed wiring board using reference holes at the same coordinate position. The pattern formed on the double-sided printed wiring board for the inner layer includes, in addition to the pattern constituting the circuit, a guide hole for a newly provided reference hole and a guide mark indicating the position of the reference hole for front and back identification. It is formed.

  Laying up the etched inner-layer double-sided printed wiring boards and aligning the positional relationship of the patterns formed on the conductor portions of the respective double-sided printed wiring boards is called lay-up. In order to perform layup, a jig plate in which a plurality of pins are implanted is prepared. Usually, the pin is provided at a position that matches the already provided reference hole. In order to align the pattern of each layer of the completed multilayer wiring board more accurately, a new lay-up reference hole may be provided.

  One etched double-sided printed wiring board is placed on the jig plate by inserting the pin of the jig plate into the reference hole, and the reference hole is opened on the substrate material (prepreg) before heating. Is called). Furthermore, another sheet of double-sided wiring board is placed on the jig plate by inserting the pin of the jig plate into the reference hole. At this stage, the lay-up is completed by temporarily fixing the outer periphery of the two double-sided wiring boards and the prepreg placed therebetween.

  When the prepreg and the copper foil of the conductor material are placed on both sides of the two laid-up double-sided printed wiring boards and heated under pressure with a hot press, the prepreg inserted between the copper foil and the double-sided wiring board is thermoset (insulated) ) Change to the substrate, the adhesion between each conductor is completed.

  After this, the multilayer printed wiring board is provided with a reference hole corresponding to the inner layer pattern and a reference hole for front and back identification, and etching of the outermost layer conductor wiring pattern, through hole drilling processing, etc. are performed based on the reference hole. Done. Furthermore, a plating process, a rust prevention process process, etc. are performed, it divides | segments into a single wiring board by machining, and it cuts out to a required external shape, and a multilayer printed wiring board is completed.

  Here, the through-hole formed in the multilayer printed wiring board manufacturing process is related to the pattern formed on the double-sided printed wiring board for the inner layer where the multilayer printed wiring board is not exposed, based on the coordinate axis determined by the reference hole for positioning. As shown, it is opened at a predetermined coordinate position. Therefore, it is necessary to set the front and back of the multilayer printed board correctly. However, as described above, both the front and back outer surfaces of the multilayer printed wiring board pressurized and heated by a hot press are covered with a solid conductor layer, and it is difficult to distinguish the front and back with the naked eye. Therefore, a reference hole for front and back identification is formed in the multilayer printed wiring board, similarly to the double-sided printed board for the inner layer.

For example, Patent Documents 1 and 2 listed below are examples of apparatuses that open a reference hole for front and back identification in addition to a positioning reference hole on a double-sided printed circuit board or a multilayer printed wiring board.
JP-A-5-228800 Japanese Patent No. 3248092

  In the perforating apparatus shown in Patent Document 1 and Patent Document 2, a reference hole for front and back identification is opened after a positioning reference hole is opened. Therefore, the processing time becomes long and it is difficult to reduce the cost.

  An object of this invention is to provide the punching apparatus which can reduce the processing cost of a multilayer printed wiring board.

In order to achieve the above object, a perforating apparatus according to an aspect of the present invention comprises:
A table on which a printed wiring board is placed;
A plurality of perforating units having a perforating means for perforating a target, a lifting means for moving the perforating means in the Z-axis direction, and a fixing means for fixing the printed wiring board, and for perforating the printed wiring board; ,
A plurality of imaging means for measuring a position of a hole or a reference point of the printed wiring board;
A moving means for moving the imaging means and the punching unit on an XY plane including the X-axis direction and the Y-axis direction perpendicular to the Z-axis direction while maintaining a distance between the imaging means and the punching unit;
At least one perforation unit of the plurality of perforation units is
When the perforation unit moves in the Y-axis direction, the perforation unit moves in the Y-axis direction, and has the perforation means, the elevating means, and the fixing means. Front and back identification hole drilling unit to be opened,
Front and back identification hole perforation unit moving means for moving the front and back identification hole perforation unit on the XY plane independently of the perforation unit;
When the front / back identification hole drilling unit moves in the Y-axis direction in conjunction with the drilling unit including the front / back identification hole drilling unit , a linear guide for moving the front / back identification hole drilling unit in the Y-axis direction is used as the drilling unit. It is characterized by sharing.

  The imaging means may be an X-ray camera.

  The table may be movable on an XY plane.

  The present invention can realize a punching device capable of reducing the processing cost of a multilayer printed wiring board.

A perforating apparatus 1 according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a main part of a perforating apparatus 1 according to an embodiment of the present invention, and FIG. 1 shows the inside of the perforating apparatus 1 as seen through.
FIG. 2 is a diagram showing a multilayer printed wiring board 70 to be processed.
FIG. 3 is a diagram illustrating a main internal configuration example of the punching device 1.

  The perforating apparatus 1 shown in FIG. 1 uses, for example, a rectangular multilayer printed wiring board 70 as shown in FIG. 2 to open two positioning reference holes 71 and 72 and identifies the front and back of the multilayer printed wiring board 70. For this purpose, a front / back identification reference hole 73 is opened.

The perforating apparatus 1 includes a housing 1 a that blocks the inside and the outside, a movable table 2, and a gantry 3. A gantry 3 is fixed inside the housing 1a. The movable table 2 functions as a means for moving the placed multilayer printed wiring board 70 to a predetermined position.
The machine coordinate system (origin O, X, Y, Z) entered in FIG. 1 is a coordinate system fixed to a non-moving part (for example, the frame 1a or the gantry 3) of the punching apparatus 1, and the moving directions of various machine parts of the feeding device Is made parallel to this coordinate axis. The white arrow in FIG. 1 is the worker's fixed position, and the worker stands in the direction of the arrow (the positive direction of the Y axis) and inserts a printed wiring board (not shown) as a workpiece. When the processing is completed, the punching device 1 is taken out. The supply and removal of the workpiece may be performed by a transport device. The transfer device can be configured by a robot arm including an adsorber that adsorbs air, for example.

  A linear guide 4 parallel to the X axis is attached to the top of the gantry 3. Two X-axis moving platforms 10 and 20 are placed on the linear guide 4, and the X-axis moving platforms 10 and 20 are supported by the linear guide 4 so as to be movable. Two ball screws 5 parallel to the linear guide 4 are further attached to the upper portion of the gantry 3. The two ball screws 5 move the X-axis moving platforms 10 and 20, respectively, and are disposed below the bottom surfaces of the X-axis moving platforms 10 and 20. Nuts (not shown) that engage with the ball screws 5 are respectively attached to the lower sides of the bottom surfaces of the X-axis moving bases 10 and 20.

The two X-axis moving bases 10 and 20 have a channel shape having a bottom surface, a wall portion, and an upper surface, and the channel-shaped release portions face each other. X-ray generators 11 and 21 are fixed to the upper portions of the X-axis moving bases 10 and 20, respectively. A linear guide 12 parallel to the Y axis and a ball screw 13 are mounted on the bottom surface of the X-axis moving gantry 10, and the linear guide 12 supports the Y-axis moving gantry 30 and the Y-axis moving gantry 40 so as to be movable. is doing.
The Y-axis moving gantry 30 has a bottom surface, a wall portion, and an upper surface, and has a channel shape in which the X-axis moving gantry 20 side is released. It is a channel shape in which the mobile gantry 20 side is released. A nut (not shown) is attached to the lower side of the bottom surface of the Y-axis moving frame 30, and the nut is engaged with the ball screw 13 on the bottom surface of the X-axis moving frame 10.

  A nut 31 is attached to the wall portion of the Y-axis moving gantry 30, and a ball screw 41 parallel to the Y axis is attached to the wall portion of the Y-axis moving gantry 40. When the nut 31 engages with the ball screw 41 and the Y-axis moving gantry 30 moves, the Y-axis moving gantry 30 and the Y-axis moving gantry 40 are coupled so that the Y-axis moving gantry 40 also moves. Further, the Y-axis moving gantry 40 can be moved relative to the Y-axis moving gantry 30 by rotating the ball screw 41.

  An X-ray protective tube 32 is disposed on the upper surface of the Y-axis moving gantry 30, and an air cylinder 33 for moving the clamper up and down is installed along with the X-ray protective tube 32. The clamper suppresses the multilayer printed wiring board below the upper surface of the Y-axis moving gantry 30, and for example, a circular hole is formed to prevent interference with the drill 34. On the bottom surface of the Y-axis moving mount 30, a drill moving mount 35 on which a drill 34 is mounted and an X-ray camera 36 are attached. The drill moving gantry 35 can adjust the horizontal position of the drill 34 with respect to the X-ray camera 36. When the drill moving base 35 is raised, the drill 34 is raised, and a hole can be formed in the multilayer printed wiring board 70 by the drill bit 34a gripped by the drill 34.

The Y-axis moving gantry 40 further accommodates an X-axis moving gantry 50. A ball screw 42 is attached to the wall portion of the Y-axis moving gantry 40 in parallel with the X axis, and a nut 51 that engages with the ball screw 42 is attached to, for example, the wall portion of the X-axis moving gantry 50. By rotating the ball screw 42, the X-axis moving gantry 50 can be moved with respect to the Y-axis moving gantry 40.
The X-axis moving gantry 50 has an upper surface, a wall portion, and a bottom surface. The X-axis moving gantry 20 has a channel shape in which the X-axis moving gantry 20 side is released. A cylinder 53 is installed. The clamper suppresses the multilayer printed wiring board 70 below the upper surface of the X-axis moving mount 50. For example, a circular hole is formed to prevent interference with the drill 54.
On the bottom surface of the X-axis moving mount 50, a drill moving mount 55 on which a drill 54 is mounted is attached. When the drill moving base 55 (see FIG. 3) is raised, the drill 54 is raised, and a hole can be formed in the multilayer printed wiring board 70 with the drill bit 54a gripped by the drill 54.

  On the other hand, a linear guide 22 and a ball screw 23 are attached to the bottom surface of the X-axis moving mount 20 in parallel with the Y-axis. A Y-axis moving mount 60 is supported by the linear guide 22.

  The Y-axis moving gantry 60 has a bottom surface, a wall, and an upper surface, and has a channel shape in which the X-axis moving gantry 10 side is released. A nut (not shown) is attached to the lower side of the bottom surface of the Y-axis moving frame 60, and the nut is engaged with the ball screw 23 on the bottom surface of the X-axis moving frame 10.

  An X-ray protective tube 62 is disposed on the upper surface of the Y-axis moving gantry 60, and an air cylinder 63 that moves the clamper up and down is installed along with the X-ray protective tube 62. The clamper suppresses the multilayer printed wiring board 70 below the upper surface of the Y-axis moving gantry 60. In order to prevent interference with the drill 64, for example, a circular hole is formed to prevent interference with the drill 64. Has been. On the bottom surface of the Y-axis moving mount 60, an X-ray camera 66 and a drill moving mount 65 (see FIG. 3) on which a drill 64 is mounted are attached. The drill 64 can adjust the horizontal position with respect to the X-ray camera 63. By raising the drill moving base 65, the drill 64 rises, and a hole can be made in the multilayer printed wiring board 70 with the drill bit 64a gripped by the drill 64.

  The movable table 2 is supported by a plurality of linear guides and ball screws (not shown) fixed to the central portion of the housing 1a, and the clamp of the Y-axis moving gantry 30, the clamp of the X-axis moving gantry 50, and the Y-axis moving gantry 60. In combination with the clamp, the multilayer printed wiring board 70 is supported so that the multilayer printed wiring board 70 can be suppressed. The movable table 2 is desirably movable not only in the Y-axis direction but also in the X-axis direction.

  A jig plate 80 is attached on the movable table 2. An adsorption portion 81 that adsorbs and fixes the multilayer printed wiring board 70 is provided at the center of the jig board 80. A jig hole 83 is provided in the jig board 80 so that a drill or a drill bit does not interfere when a hole is made in the multilayer printed wiring board 70.

  In FIG. 1, the X-ray generator is provided above the X moving gantry 10, 20. However, the X-ray generator 4 is provided on the Y moving gantry 30, 40. You may comprise integrally with an X-ray protective tube.

  Although not shown in FIGS. 1 and 3, the ball screw that supports the movable table 2, the ball screw incorporated in the gantry 3, and the like are driven by a motor. These motors are controlled by control signals from the control device 90.

FIG. 4 is a block diagram illustrating a configuration example of the control device 90.
As shown in FIG. 4, the control device 90 includes a control unit 91, a main storage unit 92, an external storage unit 93, an operation unit 94, a display unit 95, and an input / output unit 96. The main storage unit 92, the external storage unit 93, the operation unit 94, the display unit 95, and the input / output unit 96 are all connected to the control unit 91 via the internal bus 97.
The control unit 91 is configured by a CPU (Central Processing Unit) and the like, and executes processing for punching, which will be described later, according to a program stored in the external storage unit 93.

  The main storage unit 92 includes a RAM (Random-Access Memory) or the like, loads a program stored in the external storage unit 93, and is used as a work area of the control unit 91.

  The external storage unit 93 includes a nonvolatile memory such as a flash memory, a hard disk, a DVD-RAM (Digital Versatile Disc Random-Access Memory), a DVD-RW (Digital Versatile Disc Rewritable), and the processing described above is performed by the control unit 91. A program to be executed is stored in advance, and in accordance with an instruction from the control unit 91, data stored in the program is supplied to the control unit 91, and data supplied from the control unit 91 is stored.

  The operation unit 94 includes a pointing device such as a keyboard and a mouse, and an interface device that connects the keyboard and the pointing device to the internal bus 97. A command for starting or ending processing is input via the operation unit 94 and supplied to the control unit 91.

  The display unit 95 is configured by a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display) or the like, and captures images of the X-ray cameras 36 and 66, position coordinates of the X-ray cameras 36 and 66 and the drills 34 and 64, and measurement. The coordinates of the marks or holes described later of the multilayer printed wiring board 70, warnings, and the like are displayed.

  The input / output unit 96 includes a serial interface or a LAN (Local Area Network) interface. Image signals taken from the X-ray cameras 36 and 66 are input via the input / output unit 96. Further, signals for driving the motors of the X-axis moving bases 10 and 20, the Y-axis moving bases 30, 40 and 60, the movable table 2 and the drill moving bases 35 and 65 are output. Then, the position information (and speed information) of each frame or table is obtained from the linear scales of the X-axis moving frame 10, the Y-axis moving frame 20, the movable table 2, and the drill moving frames 35 and 65 via the input / output unit 96. Enter.

Next, a processing flow in the case where the positioning reference holes 71 and 72 and the front and back identification holes 73 are opened in the multilayer printed wiring board 70 using the punching device 1 having the above configuration is shown (see FIG. 5).
The multilayer printed wiring board 70 is obtained by stacking a plurality of double-sided printed boards with a substrate material (prepreg) sandwiched between them, a prepreg and a copper foil of a conductor member being stacked on both sides, and the prepreg being thermoset in that state. is there.

  Each double-sided printed board is formed with a pattern based on a positioning reference hole. These double-sided printed circuit board patterns include marks for determining the position of the multilayer printed wiring board 70 on the copper foil, marks indicating the front and back of the multilayer printed wiring board 70, and marks indicating the directionality of the multilayer printed wiring board 70. Etc. are formed as a pattern. The marks for determining the position of the multilayer printed wiring board 70 on the copper foil correspond to the positioning reference holes 71 and 72. A mark indicating the direction of the multilayer printed wiring board 70 and a mark indicating the front and back of the multilayer printed wiring board 70 are formed, for example, in the vicinity of the mark corresponding to the positioning reference hole 71.

  The positioning reference hole 71 is disposed in the vicinity of one side of the rectangular multilayer printed wiring board 70, and the positioning reference hole 72 is disposed in the vicinity of the opposing side that faces the one side. The front and back identification reference hole 73 is, for example, in the vicinity of one side where the positioning reference hole 71 is arranged, and a line segment connecting the positioning reference hole 71 and the front and back identification reference hole 73 is the positioning reference hole 71, 72 is arranged at a position that is perpendicular to the line segment connecting 72.

  The front and back surfaces of the multilayer printed wiring board 70 are covered with copper foil. However, the punching device 1 photographs the marks formed on the double-sided printed circuit board with the X-ray cameras 36 and 66, and uses the captured images as reference positioning holes. 71 and 72 and a front and back identification reference hole 73 are drilled.

  Step S1 is a process performed in advance. The design distance between the positioning reference hole 71 and the positioning reference hole 72 is obtained, and the distance between the drills 34 and 64 is adjusted to the distance. Subsequently, a design distance between the positioning reference hole 71 and the front / back identification reference hole 73 is obtained, and the distance between the drills 34 and 54 is set to stand by according to the distance. When these are completed, for example, a message is displayed from the display unit 95 to prompt the user to insert the multilayer printed wiring board 70 (step S2).

  The operator places (puts in) the multilayer printed wiring board 70 as a work at a predetermined position on the movable table 2. This predetermined position means that when the multilayer printed wiring board 70 is placed in the correct vertical direction with the front and back facing in error, the imaging of the X-ray camera 36 is performed when the movable table 2 moves in the Y-axis direction from the standby state. This is the position where the mark corresponding to the positioning reference hole 71 falls within the range. For example, a rectangle corresponding to the outer mold of the multilayer printed wiring board 70 is drawn on the movable table 2 so that the operator can easily recognize the predetermined position. An operator who has placed the multilayer printed wiring board 70 operates the input / output unit 96 to notify the control device 90 of completion of input.

If the completion of the introduction of the multilayer printed wiring board 70 was informed (step S3: YES), the control device 90 while the imaging by the X-ray camera 36, the Y-axis moving platform 30 and Y-axis moving platform 60 Y-axis direction The mark corresponding to the positioning reference hole 71 is scanned from the captured image (step S4). By moving the Y-axis moving mount 30 in the Y-axis direction, the Y-axis moving mount 40 is also moved in the Y-axis direction in conjunction therewith.

  When the mark corresponding to the positioning reference hole 71 cannot be detected (step S5: NO), the control device 90 determines that the direction of the multilayer printed wiring board 70 is different and displays a message from the display unit 95 to display the multilayer print. The operator is notified that the direction of the wiring board 70 is different (step S6), and the process returns to step S2.

When the mark corresponding to the positioning reference hole 71 can be detected (step S5: YES), the control device 90 determines whether the front and back of the multilayer printed wiring board 70 are correctly inserted from the image captured by the X-ray camera 36. Judgment is made (step S7).
When it is determined that the front and back of the multilayer printed wiring board 70 are not correct (step S7: NO), the control device 90 displays a message indicating that the front and back of the multilayer printed wiring board 70 is not correct on the display unit 95 (step S8). The process returns to step S2.

  When it is determined that the front and back of the multilayer printed wiring board 70 are correct (step S7: YES), the control device 90 determines the multilayer printed wiring board 70 based on the captured image of the X-ray camera 36 incorporated in the Y-axis moving gantry 30. The coordinates of the center of the mark corresponding to the positioning reference hole 71 are obtained. The control device 90 captures an image with an X-ray camera 66 incorporated in the Y-axis moving gantry 60, and obtains the coordinates of the center of the mark corresponding to the positioning reference hole 72 of the multilayer printed wiring board 70 from the captured image. .

The control device 90 controls each position of the drill moving bases 35 and 65 independently, so that the centers of the drills 34 and 64 are aligned with the center coordinates of the marks corresponding to the reference holes 71 and 72 for positioning. To move. That is, the positions of the drills 34 and 64 are corrected (step S9).

Subsequently, the control device 90 corrects the position of the drill 54 (step S10). The input multilayer printed wiring board 70 is slightly rotated around the Z axis. That is, the XY axis in the machine coordinate system and the axis connecting the center coordinates of the marks corresponding to the positioning reference holes 71 and 72 do not match, and a slight error occurs.
Due to this error, the drilling position of the front / back identification hole 73 is also shifted by the rotation angle. Therefore, it is necessary to correct the position of the drill 54. In the correction of the position of the drill 54, the center coordinates of the front / back identification hole 73 are obtained by calculation from the center coordinates of the positioning reference hole 71 and the center coordinates of the mark of the positioning reference hole 72.
Then, the control device 90 moves the drill 54 so that the center of the drill 54 is aligned with the center coordinates of the front / back identification hole 73 . By moving the Y-axis moving platform 40 drives the ball screw 41 in the case of moving the drill 54 in the Y-axis direction, to move the X-axis moving platform 50 and the drill 54 on the Y-axis moving platform 40.
When moving the drill 54 in the X-axis direction, the ball screw 42 is driven, and the X-axis moving mount 50 is moved in the X-axis direction with respect to the Y-axis moving mount 40 to move the drill 54.

After combining the center of the drill 54 to the center coordinates of the front and back identification holes 73, the control device 90, e Ashirinda 33,63, controls 53, incorporated to the respective Y-axis moving platform 30, 60 and X-axis moving platform 50 The clamper is lowered and the multilayer printed wiring board 70 is held down by the clamper.
Then, the control device 90 rotates the drill bits 34a, 54a, 64a of the drills 34, 54, 64. In this state, the drill moving bases 35, 55, and 65 are simultaneously lifted to bring the drill bits 34a, 54a, and 64a into contact with the multilayer printed wiring board 70 from the tip, and positioning reference holes 71 and positioning on the multilayer printed wiring board 70. The reference hole 72 for use and the reference hole 73 for front and back identification are drilled (step S11).

  When the positioning reference hole 71, the positioning reference hole 72, and the front / back identification reference hole 73 have been drilled, the air cylinders 33, 53, and 63 are controlled, and the Y-axis moving base 30, the X-axis moving base 50, The clamper of the Y-axis moving gantry 60 is raised and the fixation of the multilayer printed wiring board 70 is released (step S12).

The movable table 2 is moved in the Y-axis direction, the drilled multilayer printed wiring board 70 is discharged to the operator (step S13), and the drills 34, 54, 64 are returned to the standby position and waited (step 14). .
Then, from the number of multilayer printed wiring boards 70 that have been perforated so far, it is determined whether or not there is a remaining multilayer printed wiring board 70 that has not yet been perforated (step S15). If there is a remaining multilayer printed wiring board 70 (step S15: YES), the process returns to step S2 to continue drilling. If there is no remaining multilayer printed wiring board 70 (step S15: NO), the series of operations is terminated.

As described above, in the punching device 1 of this embodiment, the positioning reference holes 71 and 72 and the front and back identification reference holes 73 can be punched at the same time, so that the processing cost of the multilayer printed wiring board 70 can be reduced. is there. Also, two independent and Y-axis moving platform 30 and Y-axis moving platform 40, since the arrangement is moved on a common linear guide 1 2 Thus the Y-axis direction, necessary to prepare a straight guide 1 2 separately is The increase in size of the apparatus can be suppressed.

In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. Examples of such modifications include the following.
(1) The number of positioning reference holes 71 and 72 formed in the multilayer printed wiring board 70 may be two or more. In this case, what is necessary is just to increase the number of the X-axis moving mounts 20 carrying the Y-axis moving mounts 60.

  (2) It is also possible to increase the number of front and back identification reference holes 73. In this case, a frame similar to the Y-axis moving frame 40 may be connected to the Y-axis moving frame 40. Further, the Y-axis moving mount 60 may be connected to the same mount as the Y-axis moving mount 40.

  (3) In the present embodiment, the multilayer printed wiring board 70 is a workpiece to be processed, but a double-sided printed board for constituting the multilayer printed wiring board 70 may be the workpiece.

It is a perspective view which shows the outline | summary of the punching apparatus which concerns on embodiment of this invention. It is a figure which shows a multilayer printed wiring board. It is a figure which shows the example of main inside arrangement | positioning of a punching apparatus. It is a block diagram which shows a control apparatus. It is a flowchart which shows the operation | movement of a drilling.

Explanation of symbols

1 Drilling device 1a
2 Movable table 3 Base 4, 12, 22 Linear guide 5, 13, 23, 41, 42 Ball screw 10, 20, 50 X-axis moving base 30, 40, 60 Y-axis moving base 33, 53, 63 Air cylinder 34, 54, 64 Drill 35, 55, 65 Drill moving stand 36, 66 X-ray camera 70 Multilayer printed wiring board 71, 72 Positioning reference hole 73 Front / back identification reference hole 80 Jig plate 90 Control device 91 Control unit 92 Main storage unit 93 External storage unit 94 Operation unit 95 Display unit 96 I / O unit 97 Internal bus

Claims (3)

A table on which a printed wiring board is placed;
A plurality of perforating units having a perforating means for perforating a target, a lifting means for moving the perforating means in the Z-axis direction, and a fixing means for fixing the printed wiring board, and for perforating the printed wiring board; ,
A plurality of imaging means for measuring a position of a hole or a reference point of the printed wiring board;
A moving means for moving the imaging means and the punching unit on an XY plane including the X-axis direction and the Y-axis direction perpendicular to the Z-axis direction while maintaining a distance between the imaging means and the punching unit;
At least one perforation unit of the plurality of perforation units is
When the perforation unit moves in the Y-axis direction, the perforation unit moves in the Y-axis direction, and has the perforation means, the elevating means, and the fixing means. Front and back identification hole drilling unit to be opened,
Front and back identification hole perforation unit moving means for moving the front and back identification hole perforation unit on the XY plane independently of the perforation unit;
When the front / back identification hole drilling unit moves in the Y-axis direction in conjunction with the drilling unit including the front / back identification hole drilling unit , a linear guide for moving the front / back identification hole drilling unit in the Y-axis direction is used as the drilling unit. A perforating apparatus characterized by sharing.   The perforation apparatus according to claim 1, wherein the imaging unit is an X-ray camera.   The perforating apparatus according to claim 1, wherein the table is movable on an XY plane.

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