200810634 (1) 九、發明說明 【發明所屬之技術領域】 本發明是關於穿孔裝置 【先前技術】 在電子機器中，隨著1C晶片、電阻、電容器等的表 面安裝用的電子零件的小型化，安裝此些印刷配線板也被 要求高密度化，大都被多層化者。多層印刷配線板是以露 出於表背兩層的內部的導體層，及數層未露出的內層的導 體層所構成。在各導體層之間配置有絕緣性基板，藉由此 基板黏接有導體層。 在作成多層印刷配線板之際，使用著所定枚數的內層 用的兩面印刷配線板。在內層用各兩面印刷配線板，事先 開設有定位用的至少兩個基準孔與表背識別用基準孔，以 此基準孔作爲基準，使得表背兩面的圖案等以蝕刻工程所 形成。兩面印刷配線板的表背圖案是在平面上，互相地保 持著其位置關係。在構成相同多層印刷配線板的內層用的 各兩面印刷配線板，使用相同座標位置的基準孔形成著圖 案等。在形成於內層用的兩面印刷配線板的圖案，是除了 構成電路的圖案之外，形成有新設置的基準孔用的引導標 記，及表示表背識別用基準孔的位置的引導標記等。 重疊已鈾刻的內層用的兩面印刷配線板，並將分別形 成於兩面印刷配線板的導體部的圖案的位置關係正確地作 成整齊稱爲敷層（Lay up )。爲了進行敷層，準備複數銷 -4- 200810634 (2) 所植設的工模板。通常，銷是設在適合於已設置的基準孔 的位置。爲了更正確地作作整齊已完成的多層配線板的 各層圖案，也有設置新敷層用的基準孔的情形。 一枚已鈾刻的兩面印刷配線板，是於其基準孔插通工 模板的銷而被置放在工模板上，並在其上面載置有開設基 準孔的加熱前的基板材料（稱爲預浸材）又另一枚的兩面 配線板，是於基準孔插通工模板的銷而被重疊在工模板上 。以此階段，暫時固定兩枚兩面配線板與被置放在其間的 預浸材的外周而完成敷層。 在經敷層的兩枚面印刷配線板的兩側置放預浸材與導 體材料的銅箔而以熱壓機施以加壓加熱，則銅箔或被插入 在兩面配線板之間的預浸材被熱硬化而變成（絕緣）基板 ，完成各導體間的黏接。 之後，在多層印刷配線板，開設對應於內層圖案的基 準孔與表背識別用的基準孔，以基準孔作爲基準進行最外 層的導體配線圖案的蝕刻，貫通孔的開孔加工等。又，施 以電鍍工程，防鏽處理工程等，而以機械加工分割成單一 配線板，切出所需要的外形形狀而完成多層印刷配線板。 在此，在多層印刷配線板製程所形成的貫通孔，是依 據藉由定位用基準孔所決定的座標軸，與形成於多層印刷 配線板的未露出的內層用的兩層印刷配線板的圖案拉關係 般地，開設事先決定的座標位置。因此，必須正確地設定 多層印刷基板的表背面。然而，如上述地，用熱壓機被加 壓加熱的多層印刷配線板的表背兩外面是以無污垢的導體 -5- 200810634 (3) 層所覆蓋，而以肉眼很難判別表背面。如此，在多層印刷 配線板，與內層用的兩面印刷基板同樣地，形成有表背識 別用的基準孔。 在兩面印刷基板或多層印刷配線板等，除了定位用基 準孔之外，爲了開設表背識別用的基準孔的裝置，有如表 示於下述專利文獻1、2者。 專利文獻1 :日本特開平5-228800號公報 專利文獻2 :日本專利第3248092號公報 【發明內容】 在表示於專利文獻1及專利文獻2的穿孔裝置，是在 開設定位用的基準孔之後，才開設表背識別用的基準孔。 所以，加工時間變久，而很難減低成本。 本發明的目的在於提供可減低多層印刷配線板的加工 成本的穿孔裝置。 爲了達成上述目的，本發明的觀點的穿孔裝置，其特 徵爲：具備：載置印刷配線板的台；及 具有在抵接的對象開孔的穿孔手段，將上述穿孔手段 朝Z軸方向移動的昇降手段，及將上述印刷配線板予以固 定的固定手段，而在上述印刷配線板開孔的複數穿孔單元 ;及 測定上述印刷配線板的開孔位置或基準點的位置的複 數攝影手段；及 保持上述攝影手段與上述穿孔單元的距離的狀態下， -6 - 200810634 (4) 將該攝影手段及穿孔單元移動在垂直於上述Z軸方向的 XY平面上的移動手段；及 將上述穿孔手段在上述移動手段上，對於上述攝影手 段移動在XY平面上的穿孔單元移動手段， 上述複數穿孔單元中的至少一個穿孔單元是具備： 具有上述穿孔手段及上述昇降手段，而在上述印刷配 線板開設表背識別用的孔的表背識別孔穿孔單元，及 將上述表背識別孔穿孔單元移動在XY平面上的表背 識別孔穿孔單元移動手段；及上述固定手段。 又，上述攝影手段是X線攝影機也可以。 又，上述台是在XY平面上可移動也可以。 本發明是可實現可減低多層印刷配線板的加工成本的 穿孔裝置。 【實施方式】 針對於本發明的實施形態的穿孔裝置1，參照圖式加 說明。 第1圖是表示本發明的實施形態的穿孔裝置1的主要 部分的立體圖，第1圖是透視穿孔裝置1的筐體la而表 示內部。 第2圖是表示成爲加工對象的多層印刷配線板70的 圖式。 第3圖是表示穿孔裝置1的主要內部的構成例的圖式 -7 - (5) 200810634 第1圖的穿孔裝置1是將如第2圖所示的矩形多層印 刷配線板70作爲工件，例如開設兩個定位用基準孔7 1、 72，而且開設用以識別多層印刷配線板70之表背的表背 識別用基準孔73。 穿孔裝置1是具備：遮斷內部與外部的筐體la、及可 動台2、及架台3。在筐體la的內部，固定著架台3。可 動台2是功能作爲將所載置的多層印刷配線板70移動至 • 所定位置的手段。 被記入在第1圖的機械座標系（原點0、Χ、Υ、Ζ) 是被固定在穿孔裝置1的不動部分（例如筐體1 a或架台3 )的座標系，而移送裝置的各種機械部分的移動方向作成 平行於此座標軸。又，第1圖的空白箭號是作業人員的定 位置，作業人員是朝箭的方向（Y軸的正方向）站著，投 進工件的印刷配線板（未圖示），當完成加工則從穿孔裝 置1取出。工件的供給與取出是藉由搬運裝置來進行也可 ^ 以。搬運裝置是如以具備藉由空氣所吸附的吸附器的機器 人臂可構成。 在架台3的上部，安裝有平行於X軸的直線導件4。 在直線導件4上載置有兩台X軸移動架台1 〇、20，而X 軸移動架台1 0、2 0藉由直線導件4被支撐成可移動狀態 。在架台3的上部，又安裝有平行於直線導件4的兩支滾 珠螺絲5。兩支滾珠螺絲5是分別移動X軸移動架台1 〇、 12者，而被配置在X軸移動架台10、20的底面下側。在 各X軸移動架台1 0、20的底面下側，分別安裝有卡合於 (6) (6)200810634 滾珠螺絲5的螺帽（未圖示）。 兩台X軸移動架台10、20是具有底面與壁面及上面 的槽形，而槽形的解放部爲互相相對。在各χ軸移動架台 10、20的上部’分別固定有χ線發生裝置η、21。在χ 軸移動架台1 0的底面上，安裝有平行於γ軸的直線導件 1 2與滾珠螺絲1 3，而直攀導件i 2支撐γ軸移動架台3 〇 與Y軸移動架台40成爲可移動的狀態。 Y軸移動架台30是具有底面與壁部及上面，X軸移動 架台20側被解放的槽形，而γ軸移動架台4〇是具有底面 與壁邰及上面，X軸移動架台2 0側被解放的槽形。γ軸 移動架台3 0的底面下側，安裝有螺帽（未圖示），使得 其螺帽卡合於X軸移動架台1 0的底面上的滾珠螺絲1 3。 在Y軸移動架台3〇的壁部，安裝有螺帽31，而在γ 軸移動架台4 0的壁部，安裝有平行於γ軸的滾珠螺絲4 i 。螺帽3 1卡合於浪珠螺絲41，當Y軸移動架台3 0移動 ’則也移動Y軸移動架台40般地，連結有γ軸移動架台 3 〇及Y軸移動架台40。又，利用旋轉滾珠螺絲4 1，則對 於Y軸移動架台30可移動Y軸移動架台40。 在Y軸移動架台30的上面上，配置有X線防護管32 ，與此並排著設有上下移動夾緊裝置的氣缸3 3。夾緊裝置 是在Y軸移動架台3 0的上面下側，抑制多層印刷配線板 者，例如形成有圓形孔而預防著與鑽頭34的干擾。在γ 軸移動架台30的底面，安裝有載置鑽頭34的鑽頭移動架 台35與X線攝影機36。鑽頭移動架台35是鑽頭34對於 *9- (7) (7)200810634 X線攝影機36可調節水平方向的位置。利用上昇鑽頭移 動架台35，使得鑽頭34上昇’用鑽頭34所握持的鑽錐 3 4a，在多層印刷配線板70可開設孔。 在Y軸移動架台40，又收容有X軸移動架台5〇。在 Y軸移動架台40的壁部，朝X軸平行地安裝有滾珠螺絲 42，卡合於此滾珠螺絲42的螺帽5 1被安裝於X軸移動架 台5 0的例如壁部。利用旋轉滾珠螺絲42，而對於γ軸移 動架台40可移動X軸移動架台50。 X軸移動架台50是具有上面與壁部及底面，呈乂軸 移動架台20側被解放的槽形，在X軸移動架台5〇的上面 上，設有上下移動夾緊裝置的氣缸53。夾緊裝置是在X 軸移動架台5 0的上面下側，抑制多層印刷配線板70者， 形成有例如圓形孔而能預防與鑽頭54之干擾。 在X軸移動架台50的底面，安裝有載置鑽頭54的鑽 頭移動架台5 5。利用上昇鑽頭移動架台5 5 (參照第3圖 )，令鑽頭54上昇，用鑽頭54所握持的鑽錐54a，在多 層移動架台70可開設孔。 一方面，在X軸移動架台20的底面上，安裝有朝Y 軸平行地安裝有直線導件22與滾珠螺絲23。藉由直線導 件22支撐γ軸移動架台60。 Y軸移動架台60是具有底面與壁部及上面，呈X軸 移動架台10側被解放的槽形。在γ軸移動架台60的底面 下側’安裝有螺帽（省略圖示），其螺帽卡合於X軸移動 架台1 〇的底面上的滾珠螺絲23。 -10- 62 (8) 200810634 在Y軸移動架台60的上面上，配置有X線防護管 ，與此並排著設有上下移動夾緊裝置的氣缸63。夾緊裝 是在Υ軸移動架台60的上面下側，抑制多層印刷配線 70者，爲了防止與鑽頭64，例如形成有圓形孔而預防 與鑽頭64的干擾。在γ軸移動架台60的底面上，安裝 X線攝影機6 6與載置鑽頭6 4的鑽頭移動架台6 5 (參照 3圖）。鑽頭64是對於X線攝影機63可調節水平方向 位置。利用上昇鑽頭移動架台65，使得鑽頭64上昇， 鑽頭64所握持的鑽錐64a，在多層印刷配線板70可開 孔。 可動台2是藉由被固定於筐體la的中央部分的未 示的複數直線導件及滾珠螺絲所支撐，與γ軸移動架 30的夾緊裝置，X軸移動架台50的夾緊裝置及γ軸移 架台6 0的夾緊裝置相輔相成，能抑制多層印刷配線板 般地，支撐著其多層印刷配線板70。此可動台2，是不 可朝Y軸方向，還可朝X軸方向移動較佳。 在可動台2上，安裝有工模板80。在工模板8〇的 央設有吸附多層印刷配線板7 0而加以固定的吸附部8】 在工模板80設有工模孔83成爲在多層印刷配線板70 設孔時不會干涉著鑽頭或鑽錐。 又’在第1圖中，在X軸移動架台1〇、20的上部 備X線發生裝置，惟將X線發生裝置4設於Y軸移動 台30、40的上部，而與Y軸移動架台3〇、4〇上的X 防護管一體地構成也可以。 置 板 著 有 第 的 用 設 圖 台 動 70 僅 中 〇 開 具 架 線 -11 - (9) 200810634 在第1圖及第3圖，雖未予圖示，惟支撐可動台2的 滾珠螺絲，組裝於架台3的滾珠螺絲等，是以馬達被驅動 。此些馬達的控制等，從控制裝置9 〇藉由控制訊號所進 行。 第4圖是表示控制裝置90的構成例的方塊圖。 如第4圖所不地，控制裝置9 〇是具備：控制部91、 主記憶部92、外部記憶部93、操作部94、顯示部95及輸 ® 出入邰9 6。主記憶部9 2、外部記憶部9 3、操作部9 4、顯 示部9 5及輸出入部9 6都經由內部滙流排9 7而被連接於 控制部91。 控制部 91 是由 CPU (Central Processing Unit)等所 構成，依照被記憶在外部記憶部9 3的程式，實行用以下 述的開孔的處理。 主 §己憶 92 是由 RAM (Random-Access Memory)等所 構成，載入被記憶於外部記憶部93的程式，被使用作爲 β 控制部9 1的作業領域。 外部記憶部93是由快閃記憶體、硬碟、DVD-RAM ( Digital Versatile Disc Random-Access Memory) 、DVD-RW( Digital Versatile Disc Rewritable)等非揮發性記憶 體所構成，事先記憶用以將上述的處理進行在控制部9 1 的程式，又，依照控制部91的指示，將此程式所記憶的 資料供應於控制部9〗，而記憶著從控制部91所供應的資 料。 操作部94是由鍵盤及滑鼠等的瞄準裝置等，及將鍵 -12- (10) (10)200810634 盤與瞄準裝置等連接於內部滙流排97的介面裝置所構成 。經由操作部94，被輸入有處理的開始或終了的指令等， 被供應於控制部9 1。 顯不部 95 是由 CRT (Cathode Ray Tube)或 LCD ( Liguid Crystal Display)等所構成，顯示著χ線攝影機36 、66的攝影，或X線攝影機36、66及鑽頭34、64的位 置座標，及計測的多層印刷配線板7 0的後述的標記或孔 的座標、警告等。 輸出入部 96是由串列介面或 LAN (Local Area Network )介面所構成。經由輸出入部96，輸入從X線攝 影機36、66所攝影的畫像訊號。又，輸出驅動X軸移動 架台10、20，Y軸移動架台30、40、60，可動台2及鑽 頭移動架台35、65的馬達的訊號。又，經由輸出入部96 ，從X軸移動架台10，Y軸移動架台20，可動台2及鑽 頭移動架台3 5、6 5的線性標度’輸入各該架台或台的位 置資訊（及速度資訊）。 以下，表示使用以上構成的穿孔裝置1，將定位用基 準孔7 1、7 2與表背識別用孔7 3開設於多層印刷配線板7 0 的情形的處理流程（參照第5圖）。 多層印刷配線板7 0是隔著基板材料（預浸材）重疊 有複數枚的兩面印刷面板，而於其兩側重疊有預浸材與導 體構件的銅箔，而在其狀態下預浸材被熱硬化者。 在各兩面印刷基板，分別形成有以定位用的基準孔作 爲基準的圖案。在此些兩面印刷基板的圖案，作爲圖案形 -13- (11) 200810634 成有用以決定多層印刷配線板70的銅箔的位置的標記， 或是表示多層印刷配線板70的表背的標記，或表示多層 印刷配線板7 〇的方向性的標記等。用以決定多層印刷配 線板70的銅箔的位置的標記’是對應於定位用基準孔7 1 、72。表示多層印刷配線板70的方向性的標記及多層印 刷配線板70的表背的標記，是形成在對應於如定位用基 準孔7 1的標記近旁。 # 定位用基準孔7 1，是被配置於矩形的多層印刷配線板 70 —邊的近旁。定位用基準孔72，是被配置於相對於其 一邊的相對邊的近旁。表背識別用基準孔7 3，是如定位用 基準孔7 1所配置的一邊近旁，配置在連接定位用基準孔 7 1與表背識別用基準孔73的線分，對於連結定位用基準 孔7 1、72的線分成爲垂直的位置。 多層印刷配線板70的表背面是用銅箔所覆蓋，惟穿 孔裝置1是以X線攝影機3 6、66攝影形成於兩面印刷基 ^ 板的標記，從其攝影畫像進行穿孔定位用基準孔7 1、72 及表背識別用基準孔73。 步驟S 1是事先所進行的處理，求出定位用基準孔71 與定位用基準孔72的設計上距離，並將鑽頭34、64的距 離調在其距離。之後，求出定位用基準孔71與表背識別 用基準孔73的設計上距離，並將鑽頭34、54的距離調在 其距離使之待機。在完成此些的階段，例如從顯示部95 顯示訊號以促進多層印刷配線板70的投入（步驟S2 )。 作業人員是將作爲工件的多層印刷配線板70載置（ -14- (12) (12)200810634 投入）在可動台2上的所定位置。此所定位置是指當不會 錯誤表背而朝上下方向正確方向地載置多層印刷配線板70 ，可動台2從待機的狀態朝Y軸方向移動時，令對應於定 位用基準孔7 1的標記控制在X線攝影機3 6的攝影範圍的 位置。此所定位置會使作業人員容易知道地，例如在可動 台2事先描繪有相當於多層印刷配線板70的外型的矩形 。載置多層印刷配線板70的作業人員是操作輸出入部96 ，而將投入完成告知控制裝置90。 告知多層印刷配線板7 0的投入完成時（步驟S 3 :是 )，則控制裝置90是控制氣缸33、63、53，降低被組裝 於各Y軸移動架台30、60及X軸移動架台50的夾緊裝 置，而抑制多層印刷配線板70加以固定。 控制裝置90是在以X線攝影機3 6攝影下，朝Y軸方 向移動X軸移動架台30及Y軸移動架台60，並從攝影畫 像掃描對應於定位用基準孔71的標記（步驟S4)。藉由 市Y軸方向移動Y軸移動架台30，而與其連動Y軸移動 架台40也朝Y軸方向移動。 未檢測對應於定位用基準孔71的標記時（步驟S5: 否），當控制裝置90是判斷多層印刷配線板70的方向不 相同’從顯示部95顯示訊息；告知作業人員多層印刷配 線板7 0的方向不相同的情形（步驟s 6 );而將處理回到 步驟S 2。 檢測對應於定位用基準孔71的標記時（步驟S 5 :是 );控制裝置9 G是從X線攝影機3 6的攝影畫像，來判斷 -15- 200810634 (13) 多層印刷配線板70的表背是否正確地被投入（步展 〇 當判斷爲多層印刷配線板7 0的表背不正確時 S7 :否），則控制裝置90是將表示多層印刷配線标 表背不正確的訊息顯示在顯示部95 (步驟S8)並 _ 回到步驟S2。 當判斷爲多層印刷配線板70的表背正確時（参 • :是），則控制裝置90是依據被組裝於Y軸移動g 的X線攝影機3 6的攝影畫像，求出對應於多層印 板70的定位用基準孔7 1的標記的中心座標。又， 置90是用被組裝於Y軸移動架台60的X線攝影榜 行攝影，從其攝影畫像，求出對應於多層印刷配箱 的定位用基準孔72的標記的中心座標。 控制裝置90是獨立地控制鑽頭移動架台3 5、 令鑽頭3 4、64的中心調在相當於定位用基準孔7 1 ® 標記的中心座標般地，移動鑽頭34、64。亦即，進 3 4、64的位置修正（步驟S 9 )。 之後，控制裝置90是進行鑽頭54的位置修正 S 1 〇 )，所投入的多層印刷配線板70是稍旋轉地旋 軸周圍。亦即，與機械座標系的XY軸與連結相當 用基準孔7 1、72的標記的中心座標的軸不一致， 微的誤差。 爲了此誤差，表背識別用基準孔73的開孔位 偏離其旋轉角。因此，必須修正鑽頭54的位置。 I S7) (步驟 [70的 將處理 b驟S7 装台30 刷配線 控制裝 I 66進 !板70 65，能 、72的 行鑽頭 (步驟 轉在Z 於定位 產生些 置也僅 在此鑽 -16- (14) 200810634 孔54的位置修正，由定位用基準孔71的中心座標，及 位用基準孔72的標記的中心座標，以計算求出表背識 用基準孔73的中心座標。 又，控制裝置90是於表背識別用基準孔73的中心 標能調在鑽頭54的中心般地，移動鑽頭54。在移動鑽 54之際，控制氣缸53而從多層印刷配線板70拉開X 移動架台50的夾緊裝置。欲朝Y軸方向移動鑽頭54時 ©則驅動滾珠螺絲41而利用移動Y軸移動架台40，就可 動Y軸移動架台40上的X軸移動架台50及鑽頭54。 欲朝X軸方向移動鑽頭54時，則驅動滾珠螺絲42 而對於Y軸移動架台40朝X軸方向移動X軸移動架台 來移動鑽頭54。 將鑽頭54的中心調在表背識別用基準孔73的中心 標之後，控制裝置90是再控制氣缸5 3，下降X軸移動 台50的夾緊裝置，而藉由夾緊裝置來抑制多層印刷配 _ 板 70。 之後，控制裝置90是旋轉各鑽頭34、54、64的鑽 34a、54a、64a。在此狀態下同時地上昇鑽頭移動架台 、55、65而將鑽錐34a、54a、64a從前端抵接於多層印 配線板70，而在多層印刷配線板70進行穿孔定位用基 孔71、定位用基準孔72及表背識別用基準孔73 (步 si 1) ° 當結束定位用基準孔7 1、定位用基準孔72及表背 別用基準孔73的穿孔時，則控制各氣缸33、53、63， 定 別 座 頭 軸 y 移 50 座 架 線 錐 3 5 刷 準 驟 識 上 -17- 60 (15) 200810634 昇Y軸移動架台30、X軸移動架台50、Y軸移動架台 的夾緊裝置，俾解除多層印刷配線板70的固定（步 S12 ) 〇 朝Υ軸方向移動可動台2，作業人員排出結束穿孔 多層印刷配線板70 (步驟S13)，並將鑽頭34、54、 恢復到待機位置而待機（步驟S 1 4 )。 又，從至今已穿孔的多層印刷配線板70的數量， Φ 判斷是否還有未穿孔的剩餘的多層印刷配線板7 0 (步 S 1 5 )。若有剩餘的多層印刷配線板70時（步驟S 1 5 : )，則將處理恢復到步驟S2繼續進行穿孔。若沒有剩 的層印刷配線板70時（步驟S1 5 :否），則結束一連 的動作。 如上所述地，在本實施形態的印刷配線板1，因同 地可穿孔定位用基準孔7 1、72與表背識別用基準孔73 因而可減低多層印刷配線板70的加工成本。又，因藉 ^ 共通直線導件1 2及滾珠螺絲1 3朝Υ軸方向移動兩個獨 的Υ軸移動架台30與Υ軸移動架台40的構成，因此 必另外準備直線導件1 2及滾珠螺絲1 3，可抑制裝置的 型化。 又，本發明是並不被限定於上述實施形態，可做各 變形。作爲其變形例有如以下者。 (1 )形成於多層印刷配線板的定位用基準孔7 1、 的數目是2以上也可以。此時，增加搭載 Υ軸移動架 60的X軸移動架台20的數目也可以。 驟 的 6 4 來 驟 是 餘 串 時 由 -jy 不 大 種 72 台 -18- (16) (16)200810634 (2 )也可增加表背識別用基準孔73的數目。此時， 於Y軸移動架台40連結與γ軸移動架台40同樣的架台 也可以。又’於Y軸移動架台60連結與Y軸移動架台40 同樣的架台也可以。 (3 )在本實施形態中，將多層印刷配線板70作爲加 工對象的工件，惟將用以構成多層印刷配線板70的兩面 印刷基板作爲工件也可以。 【圖式簡單說明】 第1圖是表示本發明的實施形態的穿孔裝置的槪要的 立體圖。 第2圖是表示多層印刷配線板的圖式。 第3圖是表示穿孔裝置的主要內部的配置例的圖式。 第4圖是表示控制裝置的構成方塊圖。 第5圖是表示穿孔的動作的流程圖。 【主要元件符號說明】 1 :穿孔裝置 la :筐體 2 :可動台 3 :架台 4、 12、22 :直線導件 5、 13 ' 23、41、42 :滾珠螺絲 1〇、20、50 : X軸移動架台 -19- (17) 200810634 30、40、60: Y軸移動架台 33、 53、 63:氣缸 34、 54、64 ：鑽頭 35、 55、65 :鑽頭移動架台 36、 66 : X線攝影機 70 :多層印刷配線板 71、72 :定位用基準孔 # 73 ··表背識別用基準孔 8 0 :工模板 90 :控制裝置 91 :控制部 9 2 :主記憶部 93 :外部記憶部 94 :操作部 9 5 :顯示部 ® 96 :輸出入部 9 7 :內部滙流排 -20-[Technical Field] The present invention relates to a perforating device. [Prior Art] In an electronic device, with the miniaturization of electronic components for surface mounting of 1C chips, resistors, capacitors, and the like, The installation of such printed wiring boards is also required to be high-density, and most of them are multi-layered. The multilayer printed wiring board is composed of a conductor layer exposed inside the two layers of the front and back, and a plurality of conductor layers of the inner layer which are not exposed. An insulating substrate is disposed between the respective conductor layers, whereby the conductor layer is adhered to the substrate. When a multilayer printed wiring board is formed, a predetermined number of double-sided printed wiring boards for the inner layer are used. In the inner layer, the wiring board is printed on each of the two sides, and at least two reference holes for positioning and a reference hole for identification of the front and back are opened in advance, and the pattern on both sides of the front and back is formed by etching using the reference hole as a reference. The front and back patterns of the two-sided printed wiring board are on the plane and maintain their positional relationship with each other. In the double-sided printed wiring board for the inner layer constituting the same multilayer printed wiring board, a pattern or the like is formed using the reference holes at the same coordinate position. The pattern of the double-sided printed wiring board formed on the inner layer is a guide mark for forming a reference hole newly formed, and a guide mark indicating the position of the reference hole for surface-recognition, in addition to the pattern constituting the circuit. The double-sided printed wiring board for the inner layer of the uranium engraved layer is superimposed, and the positional relationship of the patterns of the conductor portions respectively formed on the double-sided printed wiring board is accurately formed as a Lay up. In order to carry out the coating, prepare a plurality of pins -4- 200810634 (2) The template to be planted. Usually, the pin is placed at a position suitable for the reference hole that has been set. In order to more accurately design the pattern of each layer of the completed multilayer wiring board, there is also a case where a reference hole for a new cladding layer is provided. An uranium-engraved two-sided printed wiring board is placed on a work form by inserting a reference hole into a pin of a work template, and a substrate material before heating with a reference hole is placed thereon (referred to as The prepreg) another double-sided wiring board is superposed on the work form by inserting the reference hole into the pin of the template. At this stage, the coating is completed by temporarily fixing the outer surfaces of the two double-sided wiring boards and the prepreg placed therebetween. A copper foil of a prepreg and a conductor material is placed on both sides of the two-face printed wiring board which is coated, and pressurized heating is performed by a hot press, and the copper foil or the pre-insertion between the double-sided wiring boards is inserted. The dipping material is thermally hardened to become an (insulating) substrate, and bonding between the respective conductors is completed. Then, in the multilayer printed wiring board, a reference hole for the inner layer pattern and a reference hole for the front and back identification are formed, and the outermost layer conductor wiring pattern is etched, the through hole is formed by the reference hole, and the like. Further, a plating process, an anti-rust treatment process, and the like are applied, and the multilayer wiring board is completed by mechanically dividing into a single wiring board and cutting out a desired outer shape. Here, the through hole formed in the multilayer printed wiring board process is a pattern of a two-layer printed wiring board for an unexposed inner layer formed on the multilayer printed wiring board in accordance with a coordinate axis determined by the positioning reference hole. In a similar way, a predetermined coordinate position is opened. Therefore, it is necessary to correctly set the front and back surfaces of the multilayer printed substrate. However, as described above, the front and back surfaces of the multilayer printed wiring board which is heated and heated by a hot press are covered with a layer of a non-fouling conductor, and it is difficult to discriminate the front and back sides with the naked eye. In the multilayer printed wiring board, a reference hole for identification of the front and back is formed in the same manner as the double-sided printed circuit board for the inner layer. In the case of a double-sided printed wiring board or a multilayer printed wiring board or the like, in addition to the positioning reference holes, the apparatus for establishing the reference hole for the front and back identification is shown in the following Patent Documents 1 and 2. In the perforating device shown in Patent Document 1 and Patent Document 2, after the reference hole for positioning is opened, the patent document 1 is disclosed in JP-A No. 5,228,092. The reference hole for the identification of the back of the table is opened. Therefore, the processing time becomes long and it is difficult to reduce the cost. SUMMARY OF THE INVENTION An object of the present invention is to provide a piercing device which can reduce the processing cost of a multilayer printed wiring board. In order to achieve the above object, a perforating apparatus according to the present invention is characterized in that it includes a stage on which a printed wiring board is placed, and a perforating means having an opening for abutting, and the perforating means is moved in the Z-axis direction. a lifting means, and a fixing means for fixing the printed wiring board, a plurality of punching means for opening the printed wiring board; and a plurality of photographing means for measuring a position of the opening of the printed wiring board or a position of the reference point; and maintaining -6 - 200810634 (4) a moving means for moving the photographing means and the punching means in an XY plane perpendicular to the Z-axis direction in a state in which the distance between the photographing means and the punching means is the same; and In the moving means, the perforating unit moving means for moving the imaging means on the XY plane, wherein at least one of the plurality of perforating means comprises: the perforating means and the lifting means, and the front and back of the printed wiring board are provided a front and rear identification hole perforating unit for identifying a hole, and a perforating unit for identifying the above-mentioned front and rear identification holes Movable in the XY plane and back identification hole punching unit moving means; and said fixing means. Further, the above imaging means may be an X-ray camera. Further, the above table may be movable on the XY plane. The present invention is a perforating device which can reduce the processing cost of a multilayer printed wiring board. [Embodiment] The perforating device 1 according to the embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a main portion of a punching device 1 according to an embodiment of the present invention. Fig. 1 is a perspective view showing a casing la of the punching device 1 and showing the inside. Fig. 2 is a view showing a multilayer printed wiring board 70 to be processed. Fig. 3 is a view showing a configuration example of the main inside of the piercing device 1. - (5) 200810634 The punching device 1 of Fig. 1 is a rectangular multilayer printed wiring board 70 as shown in Fig. 2, for example, Two positioning reference holes 7 1 and 72 are formed, and a reference back hole 73 for identifying the front and back of the multilayer printed wiring board 70 is provided. The punching device 1 is provided with a casing la that blocks the inside and the outside, a movable table 2, and a stand 3. Inside the casing la, the gantry 3 is fixed. The movable table 2 is a function as a means for moving the mounted multilayer printed wiring board 70 to a predetermined position. The mechanical coordinate system (original point 0, Χ, Υ, Ζ) recorded in Fig. 1 is a coordinate system that is fixed to the stationary portion (for example, the casing 1 a or the gantry 3 ) of the punching device 1 , and various types of transfer devices The direction of movement of the mechanical portion is made parallel to this coordinate axis. In addition, the blank arrow of the first figure is a fixed position of the worker, and the worker stands in the direction of the arrow (the positive direction of the Y-axis), and feeds the printed wiring board (not shown) of the workpiece, and when the processing is completed, Take out from the perforating device 1. The supply and removal of the workpiece can be carried out by means of a transport device. The conveying device can be constituted by a robot arm having an adsorber adsorbed by air. On the upper portion of the gantry 3, a linear guide 4 parallel to the X-axis is mounted. Two X-axis moving stages 1 and 20 are placed on the linear guide 4, and the X-axis moving stages 10 and 20 are supported by the linear guide 4 to be movable. On the upper portion of the gantry 3, two ball screws 5 parallel to the linear guide 4 are mounted. The two ball screws 5 are moved by the X-axis moving stages 1 and 12, respectively, and are disposed on the lower side of the bottom surface of the X-axis moving stages 10 and 20. Nuts (not shown) that are engaged with the (6) (6) 200810634 ball screws 5 are attached to the lower sides of the bottom surfaces of the X-axis moving stages 10 and 20, respectively. The two X-axis moving stages 10, 20 have a groove shape having a bottom surface and a wall surface and an upper surface, and the liberation portions of the groove shape are opposed to each other. The twist line generating devices η, 21 are respectively fixed to the upper portions ' of the respective shaft moving stages 10, 20. On the bottom surface of the yaw moving stage 10, a linear guide 12 and a ball screw 13 parallel to the γ axis are mounted, and the straight guide guide i 2 supports the γ axis moving gantry 3 〇 and the Y axis moving gantry 40 becomes Removable state. The Y-axis moving gantry 30 is a trough shape having a bottom surface, a wall portion and an upper surface, and the X-axis moving gantry 20 side is liberated, and the γ-axis moving gantry 4 〇 has a bottom surface and an alcove and an upper surface, and the X-axis moving gantry 20 side is The liberation of the trough. The γ-axis moves on the lower side of the bottom surface of the gantry 30, and a nut (not shown) is attached so that the nut is engaged with the ball screw 13 on the bottom surface of the X-axis moving gantry 10. A nut 31 is attached to the wall portion of the Y-axis moving frame 3, and a ball screw 4i parallel to the γ-axis is attached to the wall portion of the γ-axis moving frame 40. The nut 31 is engaged with the ball screw 41, and when the Y-axis moving frame 30 moves, the y-axis moving frame 3 and the Y-axis moving frame 40 are connected in the same manner as the Y-axis moving frame 40. Further, with the rotary ball screw 4 1, the Y-axis moving stand 40 can be moved with respect to the Y-axis moving stand 30. On the upper surface of the Y-axis moving stand 30, an X-ray protection tube 32 is disposed, and an air cylinder 33 provided with an up-and-down moving clamp device is arranged side by side. The clamp device is on the lower side of the upper surface of the Y-axis moving frame 30, and a multilayer printed wiring board is suppressed, for example, a circular hole is formed to prevent interference with the drill 34. A drill moving stage 35 on which the drill 34 is placed and an X-ray camera 36 are mounted on the bottom surface of the y-axis moving stage 30. The drill moving platform 35 is a position in which the drill bit 34 can be adjusted in the horizontal direction for the *9-(7) (7) 200810634 X-ray camera 36. The derrick table 35 is moved by the ascending drill bit to raise the drill bit 34. The drilled tape 3 4a held by the drill bit 34 can be opened in the multilayer printed wiring board 70. The X-axis moving stand 40 is accommodated in the Y-axis moving stand 40. A ball screw 42 is attached to the wall portion of the Y-axis moving gantry 40 in parallel with the X-axis. The nut 51 engaged with the ball screw 42 is attached to, for example, a wall portion of the X-axis moving frame 50. The X-axis moving gantry 50 can be moved by the rotating ball screw 42 while the y-axis moving frame 40 is moved. The X-axis moving gantry 50 has a groove shape in which the upper surface, the wall portion, and the bottom surface are liberated on the side of the y-axis moving gantry 20, and an air cylinder 53 for moving the clamp device up and down is provided on the upper surface of the X-axis moving gantry. The clamp device is on the lower side of the upper surface of the X-axis moving frame 50, and the multilayer printed wiring board 70 is suppressed, and a circular hole is formed, for example, to prevent interference with the drill 54. A drill moving stand 5 5 on which the drill 54 is placed is attached to the bottom surface of the X-axis moving stand 50. By moving the gantry 5 5 (see Fig. 3) with the ascending drill bit, the drill 54 is raised, and the drill cone 54a held by the drill 54 can be opened in the multi-layer moving gantry 70. On the other hand, on the bottom surface of the X-axis moving stand 20, a linear guide 22 and a ball screw 23 are attached in parallel to the Y-axis. The y-axis moving stage 60 is supported by the linear guide 22. The Y-axis moving gantry 60 has a bottom surface, a wall portion, and an upper surface, and has a groove shape in which the X-axis moving gantry 10 side is released. A nut (not shown) is attached to the lower side of the bottom surface of the γ-axis moving frame 60, and the nut is engaged with the ball screw 23 on the bottom surface of the X-axis moving frame 1 . -10- 62 (8) 200810634 On the upper surface of the Y-axis moving gantry 60, an X-ray protective tube is disposed, and a cylinder 63 provided with an up-and-down moving clamp is arranged side by side. The clamp is mounted on the lower side of the upper surface of the cymbal moving frame 60, and the multilayer printed wiring 70 is suppressed. In order to prevent the drill 64 from being formed, for example, a circular hole is formed to prevent interference with the drill 64. On the bottom surface of the γ-axis moving gantry 60, a X-ray camera 6 6 and a drill moving gantry 6 5 on which the drill 64 is placed are mounted (see Fig. 3). The drill bit 64 is an adjustable horizontal position for the X-ray camera 63. The stand 64 is moved by the ascending drill bit so that the drill bit 64 is raised, and the drill tap 64a held by the drill bit 64 can be opened in the multilayer printed wiring board 70. The movable table 2 is supported by a plurality of linear guides and ball screws (not shown) fixed to a central portion of the casing la, and a clamping device for the γ-axis moving frame 30, a clamping device for the X-axis moving frame 50, and The clamping devices of the γ-axis shifting stand 60 are complemented to each other, and the multilayer printed wiring board 70 can be supported by the multilayer printed wiring board. The movable table 2 is preferably not movable in the Y-axis direction but also in the X-axis direction. A work form 80 is attached to the movable table 2. The adsorption portion 8 in which the multilayer printed wiring board 70 is adsorbed and fixed in the center of the die plate 8 is provided with a die hole 83 in the die plate 80 so as not to interfere with the drill bit or the hole in the multilayer printed wiring board 70. Drill cone. Further, in the first drawing, the X-ray generating device is provided on the upper portion of the X-axis moving stages 1 and 20, but the X-ray generating device 4 is provided on the upper portion of the Y-axis moving tables 30 and 40, and the Y-axis moving frame is mounted. It is also possible to integrally construct the X protective tube on the 3〇 and 4〇. The board is equipped with the first set of table moves 70 Only the middle of the line is opened -11 - (9) 200810634 In Figs. 1 and 3, although not shown, the ball screws supporting the movable table 2 are assembled. The ball screw or the like of the gantry 3 is driven by a motor. Control of such motors, etc., is performed from the control unit 9 by means of control signals. Fig. 4 is a block diagram showing a configuration example of the control device 90. As shown in Fig. 4, the control unit 9 includes a control unit 91, a main storage unit 92, an external storage unit 93, an operation unit 94, a display unit 95, and an input/output unit 96. The main memory unit 9, the external memory unit 913, the operation unit 943, the display unit 905, and the input/output unit 916 are all connected to the control unit 91 via the internal bus bar 197. The control unit 91 is constituted by a CPU (Central Processing Unit) or the like, and performs processing using the following opening in accordance with the program stored in the external storage unit 93. The main memory 92 is composed of a RAM (Random-Access Memory) or the like, and is loaded into a program stored in the external storage unit 93, and is used as a work area of the β control unit 91. The external memory unit 93 is composed of a non-volatile memory such as a flash memory, a hard disk, a DVD-RAM (Digital Versatile Disc Random-Access Memory), or a DVD-RW (Digital Versatile Disc Rewritable), and is stored in advance for use. The above-described processing is performed in the program of the control unit 91, and the data stored in the program is supplied to the control unit 9 in accordance with an instruction from the control unit 91, and the data supplied from the control unit 91 is memorized. The operation unit 94 is constituted by a pointing device such as a keyboard or a mouse, and an interface device that connects the key -12-(10) (10) 200810634 disk and the aiming device to the internal bus bar 97. The command or the like in which the start or end of the process is input via the operation unit 94 is supplied to the control unit 91. The display portion 95 is constituted by a CRT (Cathode Ray Tube) or an LCD (Liguid Crystal Display) or the like, and displays photographs of the squall cameras 36 and 66, or position coordinates of the X-ray cameras 36 and 66 and the drills 34 and 64. And the coordinates, warnings, and the like of the marks or holes to be described later of the multilayer printed wiring board 70. The input/output unit 96 is composed of a serial interface or a LAN (Local Area Network) interface. The image signals photographed from the X-ray cameras 36, 66 are input via the input/output unit 96. Further, signals for driving the X-axis moving stages 10, 20, the Y-axis moving stages 30, 40, 60, the movable table 2, and the motors of the drill moving stages 35, 65 are outputted. Further, the position information (and the speed information) of each of the gantry or the table is input from the X-axis moving gantry 10, the Y-axis moving gantry 20, the movable table 2, and the linear scale of the drill moving gantry 35, 65 via the input/output unit 96. ). In the following, a processing flow in the case where the positioning reference holes 7 1 and 7 2 and the front and back identification holes 7 3 are opened to the multilayer printed wiring board 70 using the punching device 1 having the above configuration is shown (see Fig. 5). The multilayer printed wiring board 70 is a double-sided printing panel in which a plurality of sheets are stacked with a substrate material (prepreg) interposed therebetween, and a copper foil of a prepreg and a conductor member is superposed on both sides thereof, and the prepreg is in a state thereof. Those who are hardened by heat. On each of the two-sided printed boards, a pattern based on the reference holes for positioning is formed. The pattern of the double-sided printed substrate is used as a pattern 13-(11) 200810634 as a mark for determining the position of the copper foil of the multilayer printed wiring board 70, or a mark indicating the front and back of the multilayer printed wiring board 70. Or a mark indicating the directivity of the multilayer printed wiring board 7 等. The mark ' used to determine the position of the copper foil of the multilayer printed wiring board 70 corresponds to the positioning reference holes 7 1 and 72. The mark indicating the directivity of the multilayer printed wiring board 70 and the mark of the front and back of the multilayer printed wiring board 70 are formed in the vicinity of the mark corresponding to the positioning reference hole 71. # Positioning reference hole 171 is disposed in the vicinity of the side of the rectangular multilayer printed wiring board 70. The positioning reference hole 72 is disposed in the vicinity of the opposite side with respect to one side. The reference hole 7 3 for the front and back identification is placed in the vicinity of the side where the positioning reference hole 7 1 is disposed, and is placed in the line connecting the positioning reference hole 7 1 and the front and back identification reference hole 73, and is used for the connection positioning reference hole. 7 The line of 1 and 72 becomes a vertical position. The front and back surfaces of the multilayer printed wiring board 70 are covered with a copper foil. However, the punching device 1 is a mark formed on the double-sided printing substrate by the X-ray cameras 36 and 66, and the reference hole 7 for perforation positioning is performed from the photographed image. 1, 72 and the reference hole 73 for the identification of the front and back. Step S1 is a process performed in advance, and the design distance between the positioning reference hole 71 and the positioning reference hole 72 is obtained, and the distance between the drills 34 and 64 is adjusted to the distance. Thereafter, the design distance between the positioning reference hole 71 and the front and back identification reference hole 73 is obtained, and the distance between the drills 34 and 54 is adjusted to be at a distance to stand by. At the completion of such stages, for example, a signal is displayed from the display unit 95 to facilitate the input of the multilayer printed wiring board 70 (step S2). The operator places the multilayer printed wiring board 70 as a workpiece at a predetermined position on the movable table 2 by placing (-14-(12) (12)200810634). The predetermined position is a position in which the multilayer printed wiring board 70 is placed in the correct direction in the vertical direction without erroneously following the back of the watch. When the movable table 2 is moved from the standby state to the Y-axis direction, the positioning reference hole 7 1 is provided. The mark is controlled at the position of the photographing range of the X-ray camera 36. This predetermined position makes it easy for the operator to know, for example, a rectangular shape corresponding to the outer shape of the multilayer printed wiring board 70 is drawn in advance on the movable table 2. The operator who mounts the multilayer printed wiring board 70 is the operation input/output unit 96, and informs the control device 90 of the completion of the input. When the input of the multilayer printed wiring board 70 is completed (step S3: YES), the control device 90 controls the cylinders 33, 63, and 53 and is assembled to the respective Y-axis moving stages 30, 60 and the X-axis moving stage 50. The clamping device suppresses the multilayer printed wiring board 70 to be fixed. The control device 90 moves the X-axis moving gantry 30 and the Y-axis moving gantry 60 in the Y-axis direction by the X-ray camera 36, and scans the photographic image for the mark corresponding to the positioning reference hole 71 (step S4). The Y-axis moving gantry 30 is moved by the Y-axis direction of the city, and the Y-axis moving gantry 40 is also moved in the Y-axis direction. When the mark corresponding to the positioning reference hole 71 is not detected (step S5: NO), when the control device 90 determines that the direction of the multilayer printed wiring board 70 is different, 'displays a message from the display unit 95; and informs the worker of the multilayer printed wiring board 7 The case where the directions of 0 are not the same (step s 6 ); and the process returns to step S 2 . When the mark corresponding to the positioning reference hole 71 is detected (step S5: YES), the control device 9G judges the -15-200810634 (13) multilayer printed wiring board 70 from the photographic image of the X-ray camera 36. Whether the back is correctly put in (when it is judged that the front and back of the multilayer printed wiring board 70 is incorrect) (S7: NO), the control device 90 displays a message indicating that the back surface of the multilayer printed wiring is incorrect. Section 95 (step S8) and _ return to step S2. When it is determined that the front and back of the multilayer printed wiring board 70 is correct (refer to YES), the control device 90 determines the corresponding multi-layer printing plate based on the photographic image of the X-ray camera 36 that is assembled to the Y-axis movement g. The center coordinate of the mark of the reference hole 7 1 for the positioning of 70. Further, the 90 is photographed by the X-ray photographing of the Y-axis moving gantry 60, and the center coordinates of the mark corresponding to the positioning reference hole 72 of the multi-layer printing box are obtained from the photographed image. The control device 90 independently controls the drill moving frame 35, and adjusts the center of the drills 34, 64 to the center coordinates corresponding to the positioning reference hole 7 1 ® , and moves the drills 34 and 64. That is, the position correction of the 3, 64 is entered (step S9). Thereafter, the control device 90 performs position correction S 1 〇 ) of the drill 54 , and the input multilayer printed wiring board 70 is rotated around the rotary shaft. That is, the XY axis of the mechanical coordinate system does not coincide with the axis of the center coordinate of the mark corresponding to the reference holes 7 1 and 72, and the error is slight. For this error, the opening position of the reference hole 73 for the front and back identification is deviated from its rotation angle. Therefore, the position of the drill bit 54 must be corrected. I S7) (Step [70 will be processed b Step S7 Mounting 30 Brush wiring control device I 66 in! Plate 70 65, can, 72 row of drill bits (steps turn in Z to position some of the set also only drill here - 16- (14) 200810634 The positional correction of the hole 54 is calculated from the center coordinate of the positioning reference hole 71 and the center coordinate of the mark of the position reference hole 72 to calculate the center coordinate of the reference hole 73 for the back of the table. The control device 90 moves the drill 54 so that the center mark of the front and rear identification reference hole 73 can be adjusted to the center of the drill 54. When the drill 54 is moved, the cylinder 53 is controlled to pull the X from the multilayer printed wiring board 70. The clamping device for moving the gantry 50. When the drill 54 is to be moved in the Y-axis direction, the ball screw 41 is driven to move the yoke 40 by moving the Y-axis, and the X-axis moving gantry 50 and the drill 54 on the y-axis moving gantry 40 can be moved. When the drill 54 is to be moved in the X-axis direction, the ball screw 42 is driven, and the X-axis moving gantry is moved in the X-axis direction by the Y-axis moving gantry 40 to move the drill 54. The center of the drill 54 is adjusted to the front and rear reference hole 73. After the center mark, the control device 90 is to control the cylinder 53 again. The clamping device of the X-axis moving table 50 is lowered, and the multi-layer printing plate 70 is restrained by the clamping device. Thereafter, the control device 90 is a drill 34a, 54a, 64a that rotates the respective drill bits 34, 54, 64. In the state in which the drill bit moves the gantry, 55, 65 at the same time, the drill taps 34a, 54a, and 64a are brought into contact with the multilayer printed wiring board 70 from the front end, and the through hole positioning hole 71 and the positioning reference are formed in the multilayer printed wiring board 70. The hole 72 and the front and back identification reference hole 73 (step si 1) ° When the positioning reference hole 7 1 , the positioning reference hole 72 , and the front and back reference hole 73 are pierced, the cylinders 33 and 53 are controlled. 63, the fixed seat shaft y shift 50 seat line cone 3 5 brush quasi-on the upper -17- 60 (15) 200810634 liter Y-axis mobile stand 30, X-axis mobile stand 50, Y-axis mobile stand clamping device, 俾The fixing of the multilayer printed wiring board 70 is released (step S12). The movable table 2 is moved in the direction of the x-axis, and the worker discharges the perforated multilayer printed wiring board 70 (step S13), and returns the drills 34 and 54 to the standby position and stands by. (Step S 1 4 ). Also, the multi-layered print that has been perforated since now The number of the wiring boards 70, Φ, determines whether or not there are remaining multilayer printed wiring boards 70 that are not pierced (step S1 5). If there are remaining multilayer printed wiring boards 70 (step S15:), the processing will be performed. The process proceeds to step S2 to continue the piercing. If there is no remaining layer printed wiring board 70 (step S1 5: NO), the continuous operation is terminated. As described above, in the printed wiring board 1 of the present embodiment, the processing costs of the multilayer printed wiring board 70 can be reduced by the same perforation positioning reference holes 7 1 and 72 and the front and back identification reference holes 73. Further, since the two common cymbal movement gantry 30 and the cymbal movement gantry 40 are moved in the y-axis direction by the common linear guide 1 2 and the ball screw 1 3, the linear guide 12 and the ball must be separately prepared. The screw 13 can suppress the shaping of the device. Further, the present invention is not limited to the above embodiment, and various modifications can be made. The modification is as follows. (1) The number of the positioning reference holes 7 1 formed in the multilayer printed wiring board may be two or more. At this time, the number of the X-axis moving gantry 20 on which the cymbal moving frame 60 is mounted may be increased. The 6th step of the step is that the number of the reference holes 73 for the back of the front and back can be increased by -jy not 72 kinds of -18-(16) (16) 200810634 (2). At this time, the same gantry as that of the γ-axis moving gantry 40 may be connected to the Y-axis moving gantry 40. Further, the Y-axis moving gantry 60 may be connected to the same gantry as the Y-axis moving gantry 40. (3) In the present embodiment, the multilayer printed wiring board 70 is used as a workpiece to be processed, but the double-sided printed circuit board constituting the multilayer printed wiring board 70 may be used as a workpiece. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a perforating apparatus according to an embodiment of the present invention. Fig. 2 is a view showing a multilayer printed wiring board. Fig. 3 is a view showing an arrangement example of the main inside of the punching device. Fig. 4 is a block diagram showing the configuration of a control device. Fig. 5 is a flow chart showing the operation of the perforation. [Explanation of main component symbols] 1 : Perforation device la : Housing 2 : Movable table 3 : Racks 4 , 12 , 22 : Linear guides 5 , 13 ' 23 , 41 , 42 : Ball screws 1 , 20 , 50 : X Axis moving gantry-19- (17) 200810634 30, 40, 60: Y-axis moving gantry 33, 53, 63: Cylinders 34, 54, 64: Drills 35, 55, 65: Drill moving gantry 36, 66: X-ray camera 70: multilayer printed wiring board 71, 72: positioning reference hole # 73 · · front and back identification reference hole 80 : template 90 : control device 91 : control unit 9 2 : main memory unit 93 : external memory unit 94 : Operation unit 9 5 : Display unit ® 96 : Input/output unit 9 7 : Internal bus bar -20-