JPH1110593A - Substrate drilling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely drill at a specified position against a standard mark even when it is a sheet type substrate. SOLUTION: This device has driving means 8, 9 to move a positioning table 6 fixed by protruding a part of a substrate 4 having a standard mark, a radiation detector 5 to detect a picture image of the standard mark by radiation, a computing means to compute positional slipping quantity of the substrate 4 by slipping quantity of a picture image signal of the standard mark by receiving it, a control means to correct positional slipping quantity of the substrate 4 by controlling the driving means 8, 9 in accordance with the computed positional slipping quantity and a drilling means 10 to drill at a specified position against the standard mark on an protruding part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate drilling apparatus for manufacturing a substrate.

[0002]

2. Description of the Related Art When manufacturing an electric circuit board having a multi-layer structure (hereinafter, referred to as a "multi-layer substrate"), a method is generally used in which a reference hole is formed in each substrate of each layer, and holes are aligned with rods and joined. Have been done. Since the reference hole is formed based on the reference mark printed at the same time as the printed pattern of the substrate, each layer can be joined without displacement. Visible light or X-rays are used to detect the reference mark position on the substrate. As a conventional substrate drilling device for drilling the above-mentioned reference hole, for example, there is one as shown in FIG. 1A is a plan view, FIG. 1B is a front view, and FIG. 1C is a side view. In this conventional technique, X-rays are used for detecting the position of a reference mark, and an X-ray tube 81, an X-ray detector 88, and holes 89a and 89b are provided in an X-ray shielding room 90.
It is held integrally with the frame 87, and the horizontal x
It is driven in the direction. On the other hand, the substrate 8
3 is fixed to the y table 84 by the y drive unit 86.
It is driven in the direction. 82 is a collimator. The X-ray detector 88 has a two-dimensional resolution, and outputs a transmission image signal when the substrate 83 enters the field of view. Substrate 83
For example, a circular fiducial mark is printed, and a control unit (not shown) receives the output of the X-ray detector 88 and controls the x driving unit 85 and the y driving unit 86 so that the fiducial mark is located at the center of the field of view. X and y directions. Further, after the driving in the x direction is performed by the difference between the X-ray detector 88 and the drilling units 89a and 89b, drilling is performed. This makes it possible to make a hole in the center of the reference mark. The substrate 83 has its lower periphery supported by a y-table 84 and its periphery clamped from above. The lower portion of the substrate 83 of the y-table 84 is a hole, and the substrate 83 is supported so that there are no obstacles in the upper and lower portions except for the peripheral portion. When drilling, the backing plate is raised from the lower drilled portion 89b to support the substrate 83 from below, and the rotating drill teeth are lowered from the upper drilled portion 89a to drill a hole.

[0003]

The conventional substrate drilling device is a method in which the substrate is supported around the periphery and a hole is made by applying a patch from below, so that it cannot be applied to a thin and easily bent sheet-like substrate. is there. Traditionally this kind of substrate,
Although there is a flexible substrate commonly used in cameras and printers under the generic name, these are almost single-layer substrates. In recent years, conductive bump interlayer connection (Buried
A board of the type called "Bump Interconnection Technique" has been developed. In this method, a pattern is printed on copper foil with an etching resist, bumps for interlayer connection are printed, a plastic insulating sheet is heated and joined, a reference hole is made, and the pattern is further etched to form a single-layer substrate. And the single-layer substrates are stacked and joined by heating to form a multilayer. When joining the copper foil and the insulation sheet, the bumps break the insulation sheet, and the head is exposed on the insulation sheet side, and serves to connect the layers. With this method, a multilayer substrate exceeding 30 cm square and as many as several tens of layers is being manufactured. The conventional substrate drilling apparatus cannot be applied to such a sheet-like substrate. In addition, the conventional substrate drilling device performs drilling one by one and has a low processing speed.

[0004] The present invention has been made in view of the above,
It is an object of the present invention to provide a substrate drilling apparatus that can accurately drill a hole at a predetermined position with respect to a fiducial mark even in the case of a thin and easily bendable sheet-like substrate, and that can efficiently advance the drilling process. And

[0005]

According to a first aspect of the present invention, there is provided a positioning table for fixing a portion of a substrate having a reference mark by protruding a part of the substrate, and fixing the positioning table to a surface of the substrate. Driving means for moving along
A radiation generating means for irradiating the substrate with radiation, a radiation detector having a two-dimensional resolution and detecting an image of the fiducial mark by the radiation, and receiving a signal of the image of the fiducial mark from the radiation detector and shifting Calculating means for calculating the amount of displacement of the substrate from the amount; control means for controlling the driving means based on the calculated amount of displacement to correct the amount of displacement of the substrate; and The gist of the present invention is to have a drilling means for drilling a hole at a predetermined position with respect to the reference mark. With this configuration, the substrate protrudes from the positioning table and is fixed. The positioning table is moved to the measurement position, the substrate is irradiated with radiation, and an image of the reference mark is obtained from the radiation detector.
The amount of displacement of the substrate is calculated from the amount of displacement of the image by the calculating means. The control means controls the driving means on the basis of the calculated positional deviation amount, moves the positioning table to the drilling means, and drills a hole at a position defined with respect to the reference mark at the protruding portion of the substrate. Thereby, even if the substrate is shifted and fixed to the positioning table, a hole is formed at a fixed position with respect to the reference mark.

According to a second aspect of the present invention, in the substrate drilling apparatus according to the first aspect, the drilling means has an upper surface in the same plane as a table surface of the positioning table, and a receiving portion on which the protruding portion of the substrate is mounted. Means and a protruding means for perforating a protruding portion of the substrate placed on the receiving means to form a hole. With this configuration, when the positioning table is moved to the drilling means,
The protruding portion of the substrate is placed in contact with the receiving means, and a hole is formed by a pushing means such as a press rod.

According to a third aspect of the present invention, in the substrate drilling apparatus according to the first aspect, the positioning table comprises:
The gist is to fix the substrate by air absorption. With this configuration, even if the substrate is, for example, a sheet,
It is arranged in a plane on the positioning table, and the image detection of the reference mark and the like are accurately performed.

According to a fourth aspect of the present invention, in the substrate drilling apparatus of the first aspect, first substrate feeding means for replenishing the substrate to the positioning table, and the substrate on the positioning table to a storage section. A second substrate feeding means for moving the substrate, wherein the first and second substrate feeding means have a suction portion for fixing the substrate by air suction. With this configuration, the substrate is fixed on the substrate feeding means by air suction and supplied to the positioning table, and is also sent to the storage section and stored after completion of the drilling. Thus, even if the substrate is, for example, a sheet-like substrate, replenishment and storage can be performed without fear of damage.

According to a fifth aspect of the present invention, in the substrate drilling apparatus according to the first aspect, the calculating means drives the substrate into a quadrilateral shape by the driving means to correct the image of the image. I do. With this configuration, the substrate is preliminarily driven into a quadrilateral shape by the driving unit, and the image calibration is performed so that the position on the image and the position in the real space correspond from the image of the reference mark obtained at that time.

According to a sixth aspect of the present invention, in the substrate drilling apparatus according to the first aspect, a temporary positioning table, a temporary positioning means for temporarily positioning the substrate on the temporary positioning table by abutting the substrate against an abutment plate, The present invention has a substrate feeding means for moving the substrate from the temporary positioning table to the positioning table. With this configuration,
The substrate is fixed on the positioning table without significant displacement, and when the positioning table is moved to the measurement position, the fiducial mark is prevented from deviating from the field of view of the radiation detector.

According to a seventh aspect of the present invention, in the substrate drilling apparatus according to the sixth aspect, the substrate feeding means has a suction portion for fixing the substrate by air suction. With this configuration, even if the substrate is, for example, a sheet, the substrate is moved onto the positioning table while the temporary positioning state is reliably maintained.

According to an eighth aspect of the present invention, in the substrate drilling apparatus according to the seventh aspect, there is provided a substrate replenishing section for replenishing the temporary positioning table with the substrate, and the substrate feeding means removes the substrate by air suction. The gist of the present invention is to have two suction portions to be fixed, and to move the substrate from the temporary positioning table to the positioning table and at the same time to move another substrate from the substrate replenishing portion to the temporary positioning table.
With this configuration, the movement of the substrate from the temporary positioning table to the positioning table and the replenishment of the substrate from the substrate replenishing section to the temporary positioning table are simultaneously and efficiently performed without damaging the substrate.

According to a ninth aspect of the present invention, in the substrate drilling apparatus according to the second aspect, the piercing means has a movable pressing means for sandwiching the substrate between the substrate and the receiving means, and holds the substrate. The point is to make a hole in the state of being held. With this configuration, even if the substrate is, for example, a sheet, the substrate is arranged in a planar shape, and a hole is accurately formed at a predetermined position with respect to the reference mark.

According to a tenth aspect of the present invention, in the substrate drilling apparatus according to the second aspect, the receiving means has an inclined surface at an end thereof and guides the protruding portion of the substrate to be mounted on the receiving means. The gist is to form the substrate guide means. With this configuration, even if the substrate is, for example, a sheet-like substrate, or if the protruding portion of the substrate hangs down, the substrate can be reliably mounted on the receiving means without damaging the substrate.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 to FIG. 9 are views showing a first embodiment of the present invention. The substrate drilling apparatus according to the present embodiment includes:
It is a manual type universal machine that replenishes substrates manually. The substrate size can correspond to various ones. First, FIG.
The configuration centering on the mechanism will be described with reference to FIG. 2 and FIG. In the X-ray shielding room 12, an X-ray tube 1 as a radiation generating means and an X-ray detector 5 as a radiation detector are arranged to face each other in the vertical direction. The X-ray detector 5 is composed of an imaging tube sensitive to X-rays and its control unit, has a two-dimensional resolution, and obtains a two-dimensional image. 2 is a collimator. The suction table 6 as a positioning table for fixing the substrate 4 by air suction is driven in a horizontal plane by an x drive unit 8 and a y drive unit 9 as drive means with the table surface being horizontal. The substrate guide 11b is arranged so that its upper surface matches the table surface of the suction table 6, and the upper substrate guide 14 faces the upper surface of the substrate guide 11b. Board Guide 11b and Upper Board Guide 1
Each of the holes 4 has a hole for passing the X-ray beam 3. A press unit 10 (details of the configuration will be described later) as a punching means is supported by the floor. X-ray shielding room 12
Is provided with an electric door 13, and the suction table 6
The X-ray shielding room 12 can enter and exit through the electric door 13. The suction table 6 has a pump for sucking air,
Pipes, solenoid valves, etc. are attached, but are omitted in the figure. Near the electric door 13 outside the X-ray shielding room 12,
2 having a surface orthogonal to the substrate guide 11a
One abutment plate 7a, 7b is supported by the floor. The upper surface of the substrate guide 11a is set flush with the table surface of the suction table 6.

The details of the configuration of the press unit 10 will be described with reference to FIGS. FIG. 1A is a front view, and FIG. 1B is a side view showing a cross section taken along line AA of FIG. 1A. The press unit itself is equivalent to the conventional one. A receiving plate 16 as a receiving means having a hole 16a and two slide guides 21 are fixed on the column 15. Each slide guide 21 is provided with a spring 22. The upper surface of the receiving plate 16 is set flush with the upper surface of the suction table 6. Further, a substrate guide 16b having an inclined surface is formed at an end of the receiving plate 16, so that even if the protruding portion of the substrate 4 has a droop, it can be guided by the substrate guide 16b and placed on the receiving plate 16. It has become. A slide plate 20 is supported on the slide guide 21 so as to be slidable up and down, and is driven and slid by a drive cylinder 23 supported by the support 15. The drive cylinder 23 operates with compressed air and a solenoid valve. Slide plate 2
At 0, a press rod 18 as a pushing means is fixed,
The holding plate 17 as a holding means is provided with a spring 19.
Attached through. When the slide plate 20 descends, the press rod 18 passes through the hole of the holding plate 17 and fits into the hole 16 a of the receiving plate 16.

FIG. 4 shows a system configuration centering on a control system. The mechanism control unit 25 as a control unit is connected to an image processing unit 26 as a calculation unit and various mechanism units. Various mechanism units include a suction table 6, an x drive unit 8,
The y drive unit 9, the press unit 10, the electric door 13, and the like. The mechanism control unit 25 stores the sequence operations of the various mechanism units and performs control based on the storage. The operation timing, the selection of the operation type, the operation amount, and the like are based on signals from the image processing unit 26. The image processing unit 26 is a normal personal computer provided with an image memory and the like. The X-ray tube 1 is connected to an image processing unit 26 via an X-ray control unit 29. The X-ray control unit 29 supplies electric power to the X-ray tube 1 and controls the tube voltage and the tube current, and controls ON / OFF of the X-ray based on a signal from the image processing unit 26. X
The line detector 5 is connected to the image processing unit 26 via the data collection unit 30.
It is connected to the. The output video signal of the X-ray detector 5 is converted into a digital signal by the data collection unit 30, converted into an image with little noise by image addition, and sent to the image processing unit 26. The start of image addition and image transfer is performed by a signal from the image processing unit 26. Further, the data collection unit 30 is connected to the image monitor 31 and displays the collected images. The image processing section 26 is connected to a keyboard 27 and a display 28 as a man-machine interface. Here, system startup, menu selection, calibration value input, parameter input, and the like are performed.

FIG. 5 shows the substrate 4. The target substrate 4 is a single-layer substrate before bonding to a multilayer substrate of a conductive bump interlayer connection type. Copper foil is adhered to the lower surface of one plastic insulating sheet, and a bump group 32 for interlayer connection breaks the sheet from the copper foil side to protrude the head on the upper surface. At the side of the bump group 32, a reference bump serving as a reference mark printed simultaneously protrudes. Each reference bump has four bumps B1a-B1d, B2a-B2d, B3a-
B3d and B4a to B4d. Since the outer shape of the substrate 4 does not exactly match the bumps and the copper foil pattern, the reference bumps B1a to B1d, B2a to B2d, B3a to B3d, B4a to
B4d also has reference holes H1, H2, H3,
Open H4.

Next, the drilling operation under the control of the image processing unit 26 will be described with reference to the flowchart of FIG. 6, the suction table position of FIG. 7, and the bump image of FIG. In the flow, only main items are described, and ON / OFF of X-rays, opening / closing of the electric door 13 and the like are omitted. First, the mechanism control unit 25
To the suction table 6 (hereinafter, the command is omitted).
Is moved to the substrate setting position, the vector _R0 . At this time, the electric door 13 is opened (when the substrate passes; open, X-ray ON)
Time; closed, but omitted hereafter) (step 101). next,
The operator sets the substrate 4 on the suction table 6 so as to press it against the abutment plates 7a and 7b. When there is a set end signal from the keyboard 27, the substrate 4 is fixed by air suction (step 102). As shown in FIG. 7, the measurement positions a suction table 6 [1], it is moved to the vector R _1. At this time, even if the substrate 4 hangs or turns up, the substrate 4 is adjusted to a planar shape by the substrate guide 11b and the upper substrate guide 14 (step 103). X-rays are turned on, and transmission images of the reference bumps B1a to B1d are obtained by the X-ray detector 5. As shown in FIG. 8, the displacement vector ΔR ₁ of the bump in the real space is obtained from the displacement of the average bump position M ₁ of the reference bump B ₁ a to B ₁ d images from the image center C (step 10).
4). As shown in FIG. 7, the measurement positions a suction table 6 [2], is moved to the vector R ₂ (Step 10
5). After the transmission images of the reference bumps B2a to B2d are obtained by the X-ray detector 5, the X-rays are turned off. As shown in FIG. 8, from the deviation from the image center C of the average bump position M ₂ of the reference bump B2a~B2d image, it obtains the positional deviation vector [Delta] R ₂ bumps in the real space (step 106). Vector R
Drilling positions [1] and [2] corrected by the following equations (1) and (2) are obtained from ₁ , R ₂ , ΔR ₁ and ΔR ₂ .

[0021]

(Equation 1) In the above equation, the vector R _p0 is a drilling position based on the image center position in the real space, and is calibrated and input in advance (step 107). The corrected drilling position [1] is sent to the mechanism control unit 25 and moved (step 108).
The press unit 10 is driven by a driving cylinder 23 to hold the pressing plate 1.
7 is lowered, the substrate 4 is sandwiched between the receiving plate 16 and the spring 19, and the spring 19 is further compressed to lower the press rod 18 to make a reference hole H1 in the substrate 4 (step 10).
9). The corrected drilling position [2] is sent to the mechanism control unit 25 and moved (step 110). In the same manner as in step 109, a reference hole H2 is made in the substrate 4 (step 1).
11). The suction table 6 is returned to the substrate setting position (Step 112). The flow at the time of actual operation is completed as described above. In addition to this, there is a calibration and test flow, which can be selected by menu selection. "Image calibration" will be described later. The reference holes H1 and H2 are made in the above flow,
Is rotated by 180 ° and the same is repeated, so that the reference holes H3 and H4 on the opposite side can be opened. Further, by re-inputting the measurement position from the keyboard 27, it is possible to cope with a substrate 4 having a different reference bump position. The number of holes to be drilled can be one, three, or many by inputting from the keyboard 27.

"Image calibration" will be described with reference to FIG.
In steps 104 and 106 in the flow described above, the shift in the real space is obtained from the shift on the image. For this, it is necessary to perform "image calibration" in advance to obtain the conversion coefficient. This will be described below. First, the operator manually operates the x-drive unit 8 and the y-drive unit 9 so that one calibration bump enters the vicinity of the center of the visual field. When calibration is started from the keyboard 27 in this state, the image processing unit 26 automatically performs the following calibration. The bump is moved four points in a square shape along x and y to obtain a transmission image. When the transmission images are superimposed, as shown in FIG. 9 due to the inclination of the scanning line of the X-ray detector 5,
It becomes a hilarious quadrilateral. The position of each bump A to D in the real space is (in x, y coordinates)

(Equation 2) It is. Next, by image processing (binarization and calculation of the center of gravity of the continuous area portion having the largest area in the screen), the position (in the i and j coordinates) of each bump point on the image,

(Equation 3) Ask for. The unit vectors k and l in the x and y directions are (i, j
In coordinates)

(Equation 4) However, since E, F, G, and H can be calculated, the unit vectors k and l are obtained. From this, the conversion formula of x, y coordinates → i, j coordinates is:

(Equation 5) And the transformation matrix (M) is obtained. Inverse matrix of (M) (M
^* ) Is obtained, and the conversion formula of i, j coordinates → x, y coordinates

(Equation 6) Is found. (How to find the inverse matrix is well known). The calibration is completed by storing this conversion matrix.

As described above, according to the present embodiment,
A hole can be made at a position defined with respect to a reference mark (reference bump) on the substrate 4, and the present invention can be applied to a thin and easily bent sheet-like substrate. By changing input constants, various substrates 4 can be handled. Since X-rays are used, it is possible to accurately measure the positions of bumps that are difficult to identify with visible light. Since the substrate guide is used, the substrate 4 can be arranged in a planar shape and can be measured accurately. The upper surface of the receiving plate 16 is adjusted to the same height as the upper surface of the suction table 6, and is pressed by the pressing plate 17, so that the substrate 4 can be arranged in a planar shape and holes can be accurately formed. Since the end of the receiving plate 16 has an inclined surface, it can be placed on the receiving plate 16 even if the protruding portion of the substrate 4 hangs down. Butt plate 7
Since the provisional positioning is performed at a and 7b, the substrate 4 is not largely displaced, and the bumps are not out of the field of view of the X-ray detector 5. Further, since the bumps are automatically moved in four squares along the x and y to calibrate the image, the calibration can be easily performed without relying on mechanical and electrical adjustments.

Although the present embodiment is designed to be applicable to a substrate of a conductive bump interlayer connection system,
It is apparent that the present invention is not limited to this and can be applied to substrates of other types. The reference mark is not limited to the bump, but may be a copper foil, a paint, or the like. Drilling of the multilayer substrate is also possible using the reference mark of the inner layer of the multilayer substrate. Other than the reference hole can be used. The X-ray detector 5 is not limited to an image pickup tube, but may be any as long as it has a two-dimensional resolution. For example, X
A combination of the line II (image intensifier) and the television camera may be used, or a scintillator may be attached on the CCD image sensor. Visible light and a television camera may be used instead of the X-ray and the X-ray detector. However, in this case, the reference mark does not face the bump or the mark on the inner layer, and must be a pattern on the outer surface of the copper foil or paint. In this case, a television camera is installed on the upper side of the substrate, and illumination is performed from above. The fixing of the substrate to the table is not limited to suction, and a method of manually clamping may be used. Since the substrate is manually replenished, the reduction in efficiency caused by the manual clamping does not cause much problem. Although the press unit 10 is used for drilling, a rotating drill may be used.
At this time, rotating drill teeth are used instead of the press rod 18. The drive cylinder 23 may also use a solenoid, a motor, or the like. An elevating mechanism may be attached to the upper substrate guide 14 so that the substrate is sandwiched when measurement is performed.
In this case, accurate measurement can be performed even on a substrate that is more easily bent. The substrate guide 11b may have a suction function. When setting the substrate on the suction table 6, the position of the reference mark may be adjusted using a laser pointer. In the present embodiment, the correction amount is obtained by one measurement, but the accuracy can be further improved by repeating the correction operation and the measurement several times. Control may be performed to determine the direction of displacement and move it to the center of the field of view.

FIGS. 10 to 19 show a second embodiment of the present invention. The substrate drilling apparatus according to the present embodiment is a mass production type high efficiency machine that automatically replenishes substrates. First, a configuration centering on the mechanism will be described with reference to FIGS. 10 and 11. As the X-ray tube 1 and the X-ray detector 5, those substantially equivalent to those of the first embodiment are used. In the X-ray shield room 47, the substrate 34 is absorbed by air.
Suction table 4 as positioning table for fixing c
5 are arranged. The suction table 45 has an x-drive unit 42, a y-drive unit 43, and a θ-drive unit 4 with the table surface horizontal.
4 in a horizontal plane. A hole is formed in the suction table 45 so as not to obstruct the X-ray beam 3 at a position of a reference bump described later. Press unit 46a,
46b (details of the configuration will be described later) is supported by the floor.
The X-ray shielding room 47 is provided with electric doors 48a and 48b on the entrance side and the exit side, respectively. On the entrance side outside the X-ray shielding chamber 47, a substrate replenishing unit 37, a temporary positioning unit 38, and a substrate feeding mechanism 35a as first substrate feeding means are supported by the floor, respectively. The substrate 34a is placed on the substrate replenishing section 37 in an overlapping manner. The temporary positioning section 38 includes a temporary positioning table 39 fixed horizontally, and two surfaces each having a surface orthogonal to the temporary positioning table 39.
Push plates 41a, 4 for pressing the two butting plates 40a, 40b and the substrate 34b against the butting plates 40a, 40b.
1b. These two butting plates 40
a, 40b and pushers 41a, 41b constitute temporary positioning means. The substrate feed mechanism 35a includes a fixed part 50a, a slide part 51a that moves in a horizontal direction with respect to the fixed part 50a, and suctions fixed to two vertically moving parts 52a and 52b supported by the slide part 51a and moving up and down. It consists of parts 36a and 36b. The distance between the two vertically moving parts 52a and 52b is equal to the distance between the substrate replenishing part 37 and the temporary positioning table 39. In addition to the above, there are a pump, a pipe, a solenoid valve, etc. for air suction, but these are omitted in the figure. On the exit side outside the X-ray shield room 47, a substrate storage unit 49 and a substrate feed mechanism 35b as a second substrate feed means are supported by the floor, respectively. In the substrate storage section 49, the substrates 34d are stored in an overlapping manner. The substrate feed mechanism 35b includes a fixed part 50b, a slide part 51b, a vertically moving part 52c, and a suction part 36c, like the substrate feed mechanism 35a on the entrance side.

The details of the structure of the press units 46a and 46b will be described with reference to FIGS. 12 (a) and 12 (b) and FIG. FIG. 12A is a front view, and FIG. 12B is FIG.
FIG. 13 is a side view of FIG. 12A. The press unit itself is equivalent to the conventional one. It consists of two columns 55a, 55b and a configuration mounted on the respective columns 55a, 55b, but since each configuration is equivalent, only one will be described. Two holes 54a, 54b are provided on the support 55a.
Opened receiving plate 56a and two slide guides 6
1a and 61b are fixed. Each slide guide 61
A spring 62 is provided in each of the portions a and 61b. The upper surface of the receiving plate 56a is
Are set on the same plane as the upper surface of the. In addition, receiving plate 56a
A substrate guide 65a having an inclined surface is formed at the end of
Even if the protruding portion of the substrate 34c hangs down, it can be guided by the substrate guide 65a and placed on the receiving plate 56a. Slide guide 61
A slide plate 60a is slidably supported up and down by 61a and 61b, and is slid by being driven by a drive cylinder 63a supported by a support 55a via a cylinder support 64a. The drive cylinder 63a operates with compressed air and a solenoid valve. Two press rods 58a and 58b are fixed to the slide plate 60a, and a pressing plate 57a is attached via a spring 59. Slide plate 6
0a descends, the two press rods 58a, 58
b passes through the holes of the holding plate 57a and fits into the holes 54a and 54b of the receiving plate 56a, respectively.

FIG. 14 shows a system configuration centering on a control system. The mechanism control unit 70 is connected to the image processing unit 71 and various mechanism units. The various mechanism units include a substrate feeding mechanism 35, a suction unit 36, a pusher 41, and an x driving unit 4.
2, y drive unit 43, θ drive unit 44, suction table 45,
The press unit 46, the electric door 48, and the like. The mechanism control unit 70 stores the sequence operations of the various mechanism units and performs control based on the storage. The operation timing, the selection of the operation type, the operation amount, and the like are based on signals from the image processing unit 71. The image processing unit 71 is a normal personal computer provided with an image memory and the like. X-ray tube 1 is X-ray controller 2
The X-ray detector 5 is connected to the image processing unit 71 via the data collection unit 30. The data collection unit 30 includes an image monitor 31
, And the collected images are displayed. The image processing section 71 is connected to a keyboard 72 and a display 73. Here, system startup, menu selection, calibration value input, parameter input, and the like are performed.

FIG. 15 shows the substrate 34. The target substrate 34 is a single-layer substrate before bonding to a multilayer substrate of a conductive bump interlayer connection type. Copper foil is adhered to the lower surface of one plastic insulating sheet, and a bump group 32 for interlayer connection breaks the sheet from the copper foil side to protrude the head on the upper surface. At the side of the bump group 32, simultaneously printed reference bumps B1 and B2 protrude. Since the outer shape of the substrate 34 does not exactly match the bump and the copper foil pattern, reference holes H1, H2, H3 and H4 are formed at positions shown in the figure based on the reference bumps B1 and B2 instead of the outer shape.

Next, the drilling operation under the control of the image processing unit 26 will be described with reference to the flowchart of FIG. 16, the suction table position of FIG. 17, the bump image of FIG. 18, and the correction amount calculation of FIG. In the flow, only the main items will be described, and ON / OFF of X-rays, opening / closing of electric doors 48a and 48b, ON / OFF of suction, and suction units 36a, 36b and 36 will be described.
The elevation of c is omitted. First, a command is sent to the mechanism control unit 70 (hereinafter, the command is omitted). The substrate feeding mechanism 35a sucks the substrate 34a in the substrate replenishing unit 37 by the suction unit 36a and moves the substrate 34a onto the temporary positioning table 39. At this time, ON / OFF of the suction by opening and closing the solenoid valve, the suction unit 3
6a is performed (hereinafter, omitted) (step 20).
1). The pushers 41a and 41b are used to move the second of the substrates 34b.
The sides are pressed against the abutment plates 40a and 40b, respectively, to perform temporary positioning (step 202). As shown in FIG. 17, the suction table 45 is moved to the substrate receiving position, the vector R
₀ and θ ₀ (step 203). The substrate feed mechanism 35a sucks the substrate 34b on the temporary positioning table 39 by the suction unit 36b and moves the substrate 34b to the suction table 45.
The suction table 45 sucks and fixes it. When moving, the electric door 48a is opened (when the substrate passes; when the X-ray is ON;
Closed but omitted below) (step 204). Step 2
Simultaneously with 04, the next substrate 34a is sucked by the sucking section 36a and moved onto the temporary positioning table 39 (step 205). As shown in FIG. 17, the suction table 45 is moved to the measurement position [1] and the vectors R ₁ and θ ₀ (θ is unchanged) (step 206). As shown in FIG. 18, the X-ray is turned on, and the X-ray detector 5 obtains a transmission image of the reference bump B1. From the deviation from the image center C of the reference bump B1 image, it obtains the positional deviation vector [Delta] R ₁ bump in the real space (step 207). As shown in FIG. 17, the suction table 45 is moved to the measurement position [2] and the vector R ₂ , θ ₀ (θ is unchanged) (step 208). As shown in FIG. 18, after the transmission image of the reference bump B2 is obtained by the X-ray detector 5, the X-ray is turned off. From the deviation from the image center C of the reference bump B2 image, it obtains the positional deviation vector [Delta] R ₂ bumps in the real space (step 209). FIG.
As shown in the following, the correction amount vectors ΔR, Δθ are calculated from the vectors R ₁ , R ₂ , ΔR ₁ , and ΔR ₂ by the following equations (9) and (10).
(Step 210).

[0030]

(Equation 7) As shown in FIG. 17, the corrected press position is obtained by the following equations (11) and (12).

(Equation 8) The corrected press position is sent to the mechanism control unit 70 for movement. In the above equation, the vectors R _p0 and θ ₀ are press positions based on the image center position in the real space, and have been input in advance (step 211). Press units 46a, 46
b denotes drive cylinders 63a and 63b,
57b is lowered, the substrate 34c is sandwiched between the receiving plates 56a and 56b, and the spring 59 is further compressed to lower the press rods 58a to 58d to make reference holes H1 to H4 in the substrate 34c (step 212). The substrate feeding mechanism 35b sucks the substrate 34c on the suction table 45 by the suction unit 36c and moves the substrate 34c to the substrate storage unit 49 (Step 213). Whether the next substrate is on the temporary positioning table 39 (with a photo sensor not shown)
Is determined, and if not, the processing is terminated.
Go to (Step 214). The suction table 45 is returned to the substrate receiving position (Step 215). Step 215
In parallel with this, the next substrate 3 is pushed by pushers 41a and 41b.
The two sides of 4b are pressed against the abutment plates 40a and 40b, respectively, to perform temporary positioning (step 216). Next, the process returns to step 204 and is repeated. In steps 207 and 209 in the flow described above, the shift in the real space is obtained from the shift on the image. For this purpose, the “image calibration” described in the first embodiment is performed in advance. A conversion coefficient is obtained in advance. The flow at the time of actual operation is completed as described above. In addition, there are calibration and test flows, which can be selected by menu selection, but the description is omitted. In the above flow, the substrates 34 a stacked on the substrate replenishing section 37 are automatically pierced one after another and stacked on the substrate storage section 49. In the present embodiment, a large number of holes are drilled in a substrate having the same substrate size and the same hole position. In order to handle different types of substrates, it is necessary to replace or adjust the suction table 45, the press units 46a and 46b, and the like.

As described above, according to the present embodiment,
A hole can be formed at a position defined with respect to a reference mark (reference bump) on the substrate 34, and the present invention can be applied to a thin and easily bent sheet-like substrate. Since X-rays are used, it is possible to accurately measure the positions of bumps that are difficult to identify with visible light. Since the suction table 45 is used, the substrate 34 is arranged in a planar shape and can be measured accurately. Since the suction table 45 and the substrate feeding mechanisms 35a and 35b adopt the fixation of the substrate by air suction, the substrate 34 can be moved at a high speed without being damaged, and the substrate 34 can be accurately drilled because the substrate 34 is arranged in a planar shape. be able to. Receiving plate 56
The upper surfaces of the substrates a and 56b have the same height as the upper surface of the suction table 45 and are pressed by the pressing plates 57a and 57b, so that the substrate 34 can be arranged in a planar shape and holes can be accurately formed. Since the substrate guides 65a and 65b having inclined surfaces are provided at the ends of the receiving plates 56a and 56b, the substrates 34 can be placed on the receiving plates 56a and 56b even if the protruding portions of the substrate 34 hang down. Since the temporary positioning is performed by the temporary positioning section 38, the substrate 34 is not largely displaced, and
There is no deviation from the field of view of the line detector 5. The substrate feeding mechanism 35a is provided with two suction portions 36a and 36b.
Since the plurality of substrates 34 are sent at the same time, there is an advantage that the number of mechanisms is reduced and interference between the mechanisms does not occur as compared with an independent mechanism. Further, the reference holes can be formed in a large number of substrates in a fully automatic manner without manual operation, and all the holes in one substrate can be formed at once, thereby enabling high-speed processing.

In this embodiment, each time one substrate 34 is processed, the X-ray is kept ON instead of being electrically turned ON / OFF, and is instead mechanically turned ON / OFF by an X-ray shutter. It can also be done. This gives X
The life of the wire tube 1 can be extended. Substrate replenishing unit 37,
The substrate accommodating portion 49 has a structure in which the substrate table on which the substrate 34 is mounted can be moved up and down by a motor, and can be controlled so that the uppermost portion of the substrate 34 stacked and superimposed maintains the same level. By doing so, the stroke of the vertically moving parts 52a, 52c can be reduced, and the mechanism can be made compact. Further, the amount of the substrate 34 to be stacked can be increased. In the present embodiment, the adjustment is performed so that the x and y directions are orthogonal to each other, but it is possible to correct the image by the image processing unit 71 instead of performing the strict adjustment. Assuming that the deviation from the right angle between the coordinates x ′ and y ′ of the actual mechanism is δ, when it is desired to move x and y in the ideal coordinates, the movement amount corrected and commanded by the following equations (13) and (14) x 'and y' may be obtained. x '= x + y * tan (δ) (13) y' = y / cos (δ) (14)

[0033]

As described above, according to the first aspect of the present invention, a positioning table for fixing a part of a substrate having a reference mark so as to protrude, and moving the positioning table along the surface of the substrate. Driving means, radiation generating means for irradiating the substrate with radiation, a radiation detector having a two-dimensional resolution and detecting an image of the fiducial mark by the radiation, and a signal of the image of the fiducial mark from the radiation detector Calculating means for calculating the displacement amount of the substrate from the displacement amount; controlling means for controlling the driving means based on the calculated displacement amount to correct the displacement amount of the substrate; Since a punching means for punching a hole at a predetermined position with respect to the reference mark in the protruding portion is provided, even if the substrate is displaced and fixed to the positioning table, it does not face the reference mark. It can be accurately drilled defined position.

According to the second aspect of the present invention, the piercing means includes a receiving means having an upper surface in the same plane as the table surface of the positioning table, on which the protruding portion of the substrate is mounted, and And a protruding means for protruding a hole by protruding the protruding portion of the placed substrate, so that the protruding portion of the substrate is perforated in a state where the protruding portion of the substrate is placed in contact with the receiving means, and the protruding portion is defined. It is possible to accurately drill a hole at a given position.

According to the third aspect of the present invention, since the positioning table fixes the substrate by air suction, even if the substrate is, for example, a sheet-like substrate, it can be arranged on the positioning table in a planar shape. As a result, since the image of the reference mark is accurately detected, the amount of displacement of the substrate can be correctly calculated.

According to the fourth aspect of the present invention, the first substrate feeding means for supplying the substrate to the positioning table, and the second substrate feeding means for moving the substrate on the positioning table to the storage section. And the first and second substrate feeding means have an adsorption portion for fixing the substrate by air adsorption. Therefore, even if the substrate is a sheet, for example, the substrate can be moved to the positioning table without fear of damage. Can be supplied and stored in the storage section after the drilling is completed.

According to the fifth aspect of the present invention, the calculating means drives the substrate into a quadrilateral shape by the driving means and corrects the image of the image. Preliminary image calibration that corresponds to a position in space can be easily performed, and a hole can be accurately formed at a position determined with respect to the reference mark.

According to the sixth aspect of the present invention, a temporary positioning table, temporary positioning means for temporarily positioning the substrate on the temporary positioning table by abutting the abutment plate, and moving the substrate from the temporary positioning table to the temporary positioning table Since the substrate feeding means for moving the positioning table to the positioning table is provided, when the positioning table is moved to the measurement position, the fiducial mark is prevented from deviating from the field of view of the radiation detector, and the drilling process at a predetermined position is efficiently performed. Can proceed well.

According to the seventh aspect of the present invention, the substrate feeding means has the suction portion for fixing the substrate by air suction. Can be transferred onto the positioning table while securely holding the position.

According to the invention described in claim 8, a substrate replenishing section for replenishing the substrate to the temporary positioning table is provided,
The substrate feeding means has two suction portions for fixing the substrate by air suction, and transfers the substrate from the temporary positioning table to the positioning table and simultaneously transfers another substrate from the substrate replenishing portion to the temporary positioning table. Therefore, even if the substrate is, for example, a sheet,
The movement of the board from the temporary positioning table to the positioning table and the replenishment of the board from the board replenishment unit to the temporary positioning table,
It can be performed efficiently in conjunction with each other without damaging the substrate.

According to the ninth aspect of the present invention, the piercing means has a movable pressing means for holding the substrate between the receiving means and the receiving means, and pierces the substrate while pressing the substrate. Even if the substrate is, for example, a sheet, the substrate can be formed in a planar shape and can be accurately drilled at a fixed position with respect to the reference mark.

According to the tenth aspect of the present invention, the end of the receiving means is formed with a substrate guide means having an inclined surface for guiding the protruding portion of the substrate and mounting the substrate on the receiving means. For example, even if it is a sheet-like material, even if the protruding portion of the substrate hangs down, the substrate can be reliably mounted on the receiving means without damaging the substrate.

[Brief description of the drawings]

FIG. 1 is a front view showing the configuration of a mechanism in a first embodiment of a substrate punching device according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a configuration diagram of a press unit according to the first embodiment.

FIG. 4 is a block diagram of a control system according to the first embodiment.

FIG. 5 is a plan view of a substrate according to the first embodiment.

FIG. 6 is a flowchart for explaining a drilling operation in the first embodiment.

FIG. 7 is a diagram for explaining a moving position of a suction table in association with a drilling operation in the first embodiment.

FIG. 8 is a diagram for explaining a reference bump image in the first embodiment.

FIG. 9 is a diagram for explaining image calibration in the first embodiment.

FIG. 10 is a front view illustrating a configuration of a mechanism section according to a second embodiment of the present invention.

FIG. 11 is a plan view of FIG. 10;

FIG. 12 is a front view and a partial cross-sectional view illustrating a configuration of a press unit according to the second embodiment.

FIG. 13 is a side view illustrating a configuration of a press unit according to the second embodiment.

FIG. 14 is a block diagram of a control system according to the second embodiment.

FIG. 15 is a plan view of a substrate according to the second embodiment.

FIG. 16 is a flowchart for explaining a drilling operation according to the second embodiment.

FIG. 17 is a diagram for explaining a moving position of a suction table in association with a drilling operation in the second embodiment.

FIG. 18 is a diagram for explaining a reference bump image in the second embodiment.

FIG. 19 is a diagram for explaining a correction amount calculation of a press position in the second embodiment.

FIG. 20 is a configuration diagram of a conventional substrate drilling apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 X-ray tube (radiation generating means) 4,34 Substrate 5 X-ray detector (radiation detector) 6,45 Suction table (positioning table) 8,42 x drive part (drive means) 9,43 y drive part (drive Means) 10, 46a, 46b Press unit (drilling means) 16, 56a, 56b Receiving plate (receiving means) 16b, 65a, 65b Board guide 17, 57 Pressing plate (pressing means) 18, 58a-58c Press rod (thrusting means) 25, 70 Mechanism control unit (control means) 26, 71 Image processing unit (calculation means) 35a Inlet-side substrate feed mechanism (first substrate feed means) 35b Outlet-side substrate feed mechanism (second substrate feed means) 36a , 36b, 36c Suction unit 37 Substrate replenishment unit 39 Temporary positioning table 40a, 40b Butt plate 41a, 41b Temporary positioning together with butt plate Pusher 49 substrate housing portion B1 which constitutes the means ~B4 reference bump (reference mark) H1 ~H4 reference holes

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Akihiko Nishiide 2-1-24-1 Harumi-cho, Fuchu-shi, Tokyo Toshiba FA System Engineering Co., Ltd. (72) Inventor Hideyuki Tomizawa 2 Harumi-cho, Fuchu-shi, Tokyo 24-1, Chome Toshiba FA System Engineering Co., Ltd. (72) Inventor Tetsuya Kudo 2--24-1, Harumicho, Fuchu-shi, Tokyo Toshiba FA System Engineering Co., Ltd. (72) Inventor Masaaki Sonoda Fuchu, Tokyo 2-24-24 Harumi-cho, Toshiba Toshiba FA System Engineering Co., Ltd. (72) Inventor Hiroaki Kobayashi 2-24-1, Harumicho, Fuchu-shi, Tokyo Toshiba FA System Engineering Co., Ltd. (72) Inventor Uyama Kiichiro Haru, Fuchu-shi, Tokyo 1 Toshiba Efue of 2-chome address 24 town system engineering shares in the company

Claims (10)

[Claims] A positioning table that protrudes and fixes a part of a substrate having a reference mark, a driving unit that moves the positioning table along a surface of the substrate, a radiation generation unit that irradiates the substrate with radiation, A radiation detector having a two-dimensional resolution and detecting the image of the reference mark due to the radiation, and an operation of receiving a signal of the image of the reference mark from the radiation detector and calculating a positional deviation amount of the substrate from the deviation amount Means, control means for controlling the driving means based on the calculated displacement amount to correct the displacement amount of the substrate, and forming a hole at a predetermined position with respect to the reference mark in the protruding portion. A substrate drilling device, comprising: drilling means. 2. The piercing means includes a receiving means having an upper surface in the same plane as a table surface of the positioning table and on which a protruding portion of the substrate is mounted, and a protruding portion of the substrate placed on the receiving means. 2. A punching device according to claim 1, further comprising: a punching means for punching holes. 3. The substrate drilling device according to claim 1, wherein the positioning table fixes the substrate by air suction. 4. A first substrate feeding means for replenishing the substrate to the positioning table, and a second substrate feeding means for moving the substrate on the positioning table to a storage section, 2. The substrate drilling apparatus according to claim 1, wherein the second substrate feeding means has an adsorption part for fixing the substrate by air adsorption. 5. The apparatus according to claim 1, wherein the calculating means drives the substrate into a quadrilateral shape by the driving means to correct the image. 6. A tentative positioning table, tentative positioning means for tentatively positioning the substrate on the tentative positioning table by abutting the abutment plate, and substrate feeding means for moving the substrate from the tentative positioning table to the positioning table. The substrate drilling apparatus according to claim 1, further comprising: 7. The substrate drilling apparatus according to claim 6, wherein said substrate feeding means has an adsorption section for fixing said substrate by air adsorption. 8. A substrate replenishing section for replenishing the substrate to the temporary positioning table, wherein the substrate feeding means has two suction sections for fixing the substrate by air suction, and moves the substrate from the temporary positioning table. The substrate drilling apparatus according to claim 7, wherein another substrate is moved from the substrate replenishing unit to the temporary positioning table at the same time as the substrate is moved to the positioning table. 9. The substrate according to claim 2, wherein said perforating means has movable pressing means for sandwiching said substrate between said receiving means and said perforating means, and perforates said substrate while pressing said substrate. Drilling equipment. 10. A substrate guide means having an inclined surface at an end portion of said receiving means for guiding a protruding portion of said substrate to be mounted on said receiving means. Substrate drilling equipment.