1333543 九、發明說明： 【發明所屬之技術區域】 本發明係關於配線基板的檢查方法、配線基板的製造 方法及配線基板的檢查裝置。 【先前技術】 (專利文獻1)日本專利公報特開平7-8 3 84 1號 (專利文獻2)日本專利公報特開平1 1 -94762號 (專利文獻3)日本專利公報特開平1 1 - 1 66903號 (專利文獻4)日本專利公報特開平1 1 -27 1 23 3號 (專利文獻5)日本專利公報特開2002- 1 225 54號 1C、微處理器等之半導體晶片，近年來因急速地朝高 積體化前進，從而晶片輸出入部之端子數也隨著大幅地增 加。受到這種情勢之發展，用於連接這種晶片的電子電路 基板的線路導體的數量也急速地增加，而挾持介電體層積 層多數之配線層之所謂增層（build-up)基板也逐漸增加，前 述之介電體層係由高分子材料形成。增層基板之配線層之 間爲了進行電氣連接，在介電體層之必要位置上形成貫通 介電體層的通路孔（via hole)，然後，在通路孔之內面藉鍍 敷形成通路孔導體。 以往，此通路孔導體，如第1 4圖所示，大多係沿著通 路孔的內面形成電鍍層，並在其內側餘留空隙UJ之所謂保 形通路孔導體（conformal via conductor)CV»這種情形，若 要形成在其上另重疊的通路孔而與上層側之配電層連接之 構造時，如果上側之通路孔導體重疊在下側之通路孔導體 1333543 的空隙的話因通路孔之鍍層不良進而也會造成導電不良等 的原因，因此'以往都是形成將上側的通路孔導體和下側的 通路孔導體位置偏移使不致相互重疊。 但是，隨著配線的積體密度之提昇，上述那樣之保形 通路孔導體，在上下的通路孔連接構造上會產生空間上之 限制，因此最近逐漸採用如第15圖所示那樣，在導體的內 側採用電敷充塡之充塡通路孔導體134s。充塡通路孔導體 134s因在通路孔的內部不餘留空隙，因此能形成上下之通 路孔導體疊合之所謂堆疊通路孔（stacked via)，從通路孔和 配線的高密度配置方向來看，係爲有利的構造。 【發明內容】 (發明欲解決的課題） 如第16圖所示，充塡通路孔134s係藉在通路孔的內 部鍍敷金屬而充塡形成，但在進行電敷中途若有附著異物 等而妨礙充塡敷層的成長時則會留下空隙，進而在通路孔 的頂面產生凹狀缺陷。充塡通路孔導體134s這樣的凹狀缺 陷，以往是用放大鏡藉且視觀察來檢查，但欠缺效率和精 確度自不待言。因此，對通路孔導體的頂面進行影像攝影 ，藉解析該影像以辨識（identify)凹狀缺陷當然能考慮。 不過，通路孔導體會呈現金屬光澤，因此即便產生凹 狀缺陷，當照射照明光時凹陷周圍和凹陷內面皆會產生強 的反射光，在凹陷區域和其周圍區域之間不易形成對比 (contrast)，具有欠缺缺陷偵測精確度之困難點。另外，專 利文獻1〜5上有揭示藉光學上的方法以執行增層基板之 -6- 1333543 .通路孔檢查的種種裝置，但是，皆是用在檢查通路孔導體 形成前之通路孔內部之樹脂殘留之凹陷者，並非揭示適用 於檢查充塡通路孔導體的凹狀缺陷的方法。 本發明的課題是提供能確實又高效率地找出因電敷不 良等而在充塡通路孔導體內部產生之凹狀缺陷之配線基板 的檢查方法，使用該檢查方法之配線基板的製造方法，及 配線基板的檢查裝置。 (解決課題用之方法及發明的效果） 爲了解決上述課題，本發明之配線基板的檢查方法， 係爲具有交互地積層金屬配線層和由高分子材料形成之介 電體層，並在積層方向挾持介電體層而接鄰之金屬配線層 之間藉內部被充塡金屬之充塡通路孔導體而連接之構造之 配線積層部之配線基板的檢査方法，其特徵爲： 在充塡通路孔導體之頂面露出在上面的狀態之被檢査 基板體，藉從基板主表面之法線之單側以傾斜之角度射入 照明光，一方面藉此照明光照亮充塡通路孔導體之頂面區 域，一方面攝取該頂面區域之影像，且根據在被攝影到之 影像上之頂面區域產生之陰影資訊，檢查充塡通路孔導體 因金屬充塡不良所產生之凹狀缺陷之發生狀態》 又，本發明的配線基板的製造方法，其特徵爲包括： 製造由具有交互地積層金屬配線層和由高分子材料形 成之介電體層，並將在積層方向挾持介電體層而鄰接之金 屬配線層之間，藉內部被金屬充塡之通路孔導體而連接之 構造之配線積層部之配線基板或該配線基板之中間產品所 1333543 .構成之被檢査基板體之基板製造作業， 藉上述本發明的檢査方法，檢査該被檢查基板體之檢 查作業，及 根據該檢查的結果篩選被檢查基板體爲良品和不良品 之篩選作業。 另外，本發明的配線基板的檢查裝置係爲使用上述本 發明的檢查方法之裝置，其特徵爲具備： 在被檢查基板體，藉從基板主表面之法線的單側以傾 斜的角度射入之照明光照明充塡通路孔導體之頂面區域之 照明裝置。 攝取頂面區域之影像之攝影裝置，及 影像之輸出裝置。 依上述本發明的檢查方法及裝置，對產生凹狀缺陷之 充塡通路孔導體，從基板主表面法線的單側以傾斜之角度 照射射入之照明光。如第7圖所示那樣，藉這種傾斜之照 明光，在充塡通路孔導體產生之凹狀缺陷之內側產生照明 光因被遮蔽而形成陰影的區域。因此，不管凹狀缺陷之內 部係被反射率高之金屬包覆，能藉上述之陰影形成而容易 地識別凹狀缺陷，進而能確實又高效率地找出在充塡通路 孔導體內部產生之該凹狀缺陷。又，依藉該檢查方法執行 基板製品之篩選之本發明之配線基板的製造方法，因能提 昇凹狀缺陷之偵測精確度，確實地執行不良品之排除，故 能降低出貨之基板之不良率。 另外，專利文獻4揭示之檢査裝置係爲使用傾斜之照 1333543 明光以執行通路孔之檢查裝置， 之檢査對象者係爲在藉電敷形成 之蝕刻樹脂殘渣，與偵測通路孔 明，其目的不同。而且係對基板 明光，若將此方式應用於解決本 傾斜光產生之陰影區域會被另一 法達成藉陰影區域偵測凹狀缺陷 影像之攝影光軸方向也可用 範圍，對基板主表面法線傾斜， 域的偵測之觀點看，還是希望影 主表面法線一致。 照明光對基板主表面法線之 20°以上80°以下時具有提高凹狀 。該傾斜角度設定在20°以上40 本發明的裝置雖能使用二維 知器，及使用面型照明對攝影區 型照明會有照明光的角度依照射 陰影形成不清楚的可能性’且各 不足。因此，攝影裝置若構成爲 體上之攝影區域上定在水平面內 訊之線感知器相機（line sensor ( 狀攝影資訊的取得位置之線照明 正交之第2方向掃描在攝影區域 置之攝影掃描部；及將藉該掃描 如前述那樣，成爲此裝置 通路孔導體前，於通路孔 導體內之凹狀缺陷之本發 法線從兩側照射傾斜之照 發明之課題時則由單側之 側之傾斜光消除，從而無 的目的。 比照明光的傾斜角度小的 但從高精確度執行陰影區 像之攝影光軸方向與基板 傾斜角度當特別地設定在 缺陷之偵測精確度之效果 °以下則更佳。 CCD感知器等二維影像感 域進行二維地照射，但面 區域上的位置而異，進而 位置之照明光光量亦容易 具備：取得在被檢查基板 之第1方向之線狀攝影資 :amera);選擇性地照射線 :在水平面內與第1方向 上線感知器相機之攝影位 依序得出之線狀攝影資訊 -9- 1333543 在水平面內合成，獲得對應攝影區域之二維影像資訊之影 像資訊產生單元；則能將照明光集中在線狀之攝影區域， 能形成更爲清楚之陰影，而能提昇缺陷之偵測精確度。這 種情形’若將線感知器相機和照明裝置之位置固定，將攝 影掃描部作成具有使被檢查基板體在第2方向掃描移動之 基板掃描移動部之構成時，則可省掉在相機之光學系統用 於掃描之驅動機構，而不易產生光軸偏向和焦點偏移等之 不良情況。 本發明之裝置也可作成爲在影像上目視觀察陰影區域 以判定缺陷之形式’但若設置根據被攝影之影像上之頂面 區域產生之陰影資訊’解析充塡通路孔導體因金屬充塡不 良而產生之凹狀缺陷之發生狀態之檢查解析部時能提高凹 陷判定之能力。 關於凹狀缺陷之檢查，具體上，係藉照明光之照度將 影像上之區域’以既定之臨界値爲境界區分爲明區域和暗 區域’然後根據出現在充塡通路孔導體之頂面區域上之暗 區域之面積或尺寸之資訊’能判定有關凹狀缺陷之形成程 度。這種情形’本發明之裝置上之前述檢查解析部則構成 具有：藉照明光產生之照度，以既定之臨界値爲境界將影 像上之區域區分爲明區域和暗區域，並運算出現在充塡通 路孔導體之頂面區域之暗區域之面積或尺寸之暗區域運算 單元；及根據暗區域之面積或尺寸，執行有關凹狀缺陷的 形成程度之判定之判定單元。 作成上述那樣’不僅能評估凹狀缺陷之定性上之有無 -10- 1333543 ..，且能藉暗區域之面積或尺寸定量地評估形成之凹狀缺陷 ^ 之程度。其結果可適當發現過度的凹狀缺陷’又，因能夠 排除本質上不會形成問題之輕微之凹狀缺陷，故也能達成 * 適性地降低篩選作業上之不良率。 • 若是開口尺寸約略相同之凹狀缺陷的情形，則如第7 圖所示，缺陷愈深陰影區域會愈大，因此，能夠判定暗區 域的面積或尺寸愈大，凹狀缺陷的深度愈大。至於裝置方 面則是前述的判定單元將構成爲若是暗區域之面積或尺寸 B 大於既定之基準値時則判定該充塡通路孔導體爲不良。而 堆疊通路孔的導通不良等因受到凹陷的深度之影響比受到 凹陷之開口面積之影響大，故能夠確實地排除深凹陷之上 述方法係較具效果。具體說，暗區域的面積或尺寸若是比 既定之基準値大時則判定該充塡通路孔導體爲不良，判定 運算也簡單，而有助於檢查效率的提昇。 【實施方式】 (實施發明之最佳形態） # 以下，將參照附圖說明本發明的實施形態》 第17圖係模式地表示成爲本發明的檢查方法，裝置及 製造方法的對象之配線基板100之斷面構造。該配線基板 100係在以耐熱性樹脂板（例如，雙馬來醯亞胺-三嗪（bis-maleimide-triazine)樹脂板）和纖維強化樹脂板（例如，玻璃 纖維強化環氧樹脂）等構成之板狀核心層（c〇re)102之兩表 面上，分別形成有將配線金屬層作成既定圖案之核心導體 層Ml、Mil。這些核心導體層Ml、Mil係形成爲被覆板 -11- 1333543 .狀核心層102之大部分表面之面導體圖案，且係做爲電源 層或接地層使用者。另外，在板狀核心層102形成有藉鑽 孔（drill)等而貫穿之貫通孔（through hole)112，在貫通孔 112之內壁面形成有使核心導體層Ml、Mil相互導通之通 孔導體130。又，貫通孔112內係被環氧樹脂等之樹脂製 之塡孔材1 3 1所充塡。 另外，在核心導體層Ml、Mil的上層形成配線積層部 LI、L2。具體說，分別形成有藉感光性樹脂組成物106構 成之第1介電體層（加強層（build-up layer):介電體層）VI 、VII，在這些介電體層之表面上有藉銅鍍層而形成之第1 導體層M2、M12，這兩第1導體層M2，M12分別具有金 屬配線107。另外，核心導體層Ml、Mil和第1導體層 M2、M12係分別藉通路孔134而行層間連接。同樣地，在 第1導體層M2、M12之上層分別形成有使用感光性樹脂組 成物106之第2介電體層（加強層：介電體層）V 2、V12。在 這些介電體層V2、V12之表面上形成有第2導體層M3、 M13,這些第2導體層M3、M13具有金屬端子焊墊（pad)108 、118。這些第1導體層M2、M12和第2導體層M3、M13 係分別藉通路孔1 34而行層間連接》通路孔1 34 ’如第1 7 圖所示，具有：設在通路孔134h和其內周面之充塡通路孔 導體134s;設在底面側而與充塡通路孔導體134s導通之通 路孔焊墊（viapad)134p;及在通路孔焊墊134p之相反側從 充塡通路孔導體134s之開口周緣向外伸出之通路孔焊墊 1341° -12- 1333543 充塡通路孔導體134s係爲藉鍍金屬充塡內部而形成之 充塡通路孔導體者，以橫跨鄰接之介電體層之形式，將兩 個或以上之多數充塡通路孔導體13 4s以相互在水平面內產 生重疊的方式積層而成堆疊通路孔（stacked vias)。 在板狀核心層102之第1主表面MP1形成含有核心導 體層Ml、第1介電體層VI、第1導體層M2及第2介電體 層V2之第1配線積層部L1。又，在板狀核心層102之第 2主表面MP 2形成含有核心導體層Ml卜第1介電體層VII 、第1導體層M12及第2介電體層V12之第2配線積層部 L2。兩個配線積層部內之介電體層和導體層皆係使堆疊部 之第1主表面CP係由介電體層形成那樣交互地積層，在該 兩第1主表面CP上分別形成有多數之金屬端子焊墊110 或117。第1配線積層部L1側之金屬端子焊墊110係構成 做爲用於積體電路晶片等執行倒裝片接合（flip chip bonding) 之銲墊之軟銲銲墊（soft solder pad)»又，第2配線積層部 L2側之金屬端子焊墊1 1 7係做爲用來將配線基板本身藉柵 格陣列（Pin Grid Array: PGA)或球格陣列（Ball Grid Array :BGA)封裝方式而接合於主機板（mother board)等之裏面銲 墊。 介電體層VI、VII、V2、V12，及防歸阻絕層（3〇1<161·-resist)108、1 18，例如，係如下述那樣製造。亦即，將感 光性樹脂組成物清漆（vanish)與薄膜化之感光性黏接膜積 層（疊合），然後重疊在具有對應通路孔134h之圖案之透明 遮光罩（mask)(例如，玻璃遮光罩）而行曝光。通路孔134h -13- 1333543 -以外之薄膜部分藉曝光而硬化，但通路孔134h部分 未硬化’因此，若將其置於溶劑內而予以除去後即 地在所要的圖案上形成通路孔134h(所謂光致通路子I (photo via process)。接著，使用感光型鍍敷阻g (plating resist resin)形成配線形狀被圖案化之遮光 後執行眾知之無電銅鍍敷，藉鍍敷而形成配線圖案 通路孔13 4h之內部充塡鍍金屬，進而形成充塡通路 134s»藉重複上述作業，能形成各個配線積層部L1 充塡通路孔導體13 4s係每個介電體層皆形成， —個介電體層形成充塡通路孔導體134s時即檢査是 鍍層充塡不良而產生凹狀缺陷。於是，被檢査基板 是第17圖那樣的最終製品之配線基板1〇〇，而係在 査對象之介電體層形成充塡通路孔導體13 4s之狀態 作業之可以說是中間製品。下文，將說明基於本發 檢查方法之細節及使用於這種檢查方法之裝置之構丨 第1圖係爲本發明的一個實施形態之檢查裝置 式圖。此檢査裝置1係爲對被檢查基板體W之主表 ’從其之單側以傾斜之角度射入照明光（光束）LB， 明光LB，如第7圖所示那樣，照射充塡通路孔導看 之頂面區域，同時對該頂面區域的影像進行攝影， 據在被攝取之影像上之頂面區域上產生之陰影區域 資訊，檢查充塡通路孔導體13 4s因金屬充塡不良所 凹狀缺陷PF之發生狀態者，其具備用於產生照明光 照明裝置25及攝取頂面區域之影像之攝影裝置i3c 仍保留 能簡單 ^流程） 遇樹脂 罩，然 ，並在 孔導體 、L2。 每當在 否有因 體，不 做爲檢 下中斷 明之該 戎。 1之模 面法線 藉此照 I 134s 然後根 DA之 產生之 ;LB之 。如第 -14- λ 1333543 7圖所示，本實施形態之影像攝影光軸CA的方向係與基板 主表面法線一致。又，如第1圖所示，照明光LB對基板主 表面法線之傾斜角度Θ係設定在20°以上80°以下（最好是 20°以上40°以下，例如30°)之範圍內》 攝影裝置13C具備：在被檢查基板體W上之攝影區域 ，用於取得定在水平面內之第1方向（X方向）之線狀之攝影 資訊之線感知器相機（line sensor camera) 13c ;選擇性照射 線狀之攝影資訊之取得位置之線照明裝置25;在水平面內 與第1方向正交之第2方向（Y方向），掃描在攝影區域上線 感知器相機13c之攝影位置之攝影掃描部23;及藉該掃描 逐次得出之線狀之攝影資訊在水平面內合成而取得對應攝 影區域之二維影像資訊之影像資訊產生部1 2(第3圖）。線 感知器相機13c和照明裝置25之位置係固定，攝影掃描部 係藉使被檢査基板體W在第2方向掃描移動之基板掃描移 動部23而構成。本實施形態之線感知器相機13c係爲在一 維C CD感知器附加攝影光學系統之市售之數位線感知器相 機，影像資訊產生部12也是使用市售之數位線感知器相機 用之影像處理模組（image processing module) (例如，對應 AVAL DATA CORPORATION 製：PSM- 3 3 0D/ APC322，PCI bus)。又，基板掃描移動部23係藉眾知之縱 橫移動台（X-Y table)(以下也稱爲縱橫移動台23)而構成。 本實施形態上，被檢查基板體W係如第2圖所示，將 多數之被檢查基板體SB卜SB2…在水平面內以被分離之形 態一體化而成之大張基板工件（work)W。如第1圖所示，在 -15- 1333543 檢查裝置1以支撐該大張基板工件W之基板工件支撐部50 、52，及令攝影相機13c之攝影位置對基板工件支撐部50 、52上之多數被檢查基板體SBl、SB2…順序移動那樣， 設有使該基板工件支撐部50、52對攝影相機13c及照明裝 置25相對地移動之工件相對移動部23。藉此，能夠在分 離前之大張基板工件W之狀態下順序檢査各被檢查基板體 SB 1、SB2…’也可省掉將被檢查基板體SB 1、SB2…逐張 裝在（mount)檢査裝置之工夫，故具有效率。工件相對移動 部也是兼用前述之縱橫移動台。 集合多數薄的被檢査基板體SB1、SB2…之大張基板工 件W容易產生撓曲，進而容易使攝影裝置13c之焦點偏移 。這種情形，爲了消除此種不良情事，如第2圖所示那樣 ，在基板工件支撐部50、52上設置用於矯正基板工件W 之撓曲之撓曲矯正部60。基板工件支撐部50、52皆配置 在縱橫移動台23上，撓曲矯正部60係構成爲具備：在該 基板工件支撐部50、52上之基板工件W的水平面內既定 之施能方向，把持該基板工件W之一側的端緣之固定把持 部50;在基板工件支撐部50、52上可在施能之方向移動 那樣地配置，而在基板工件W之該施能方向把持另一側之 端緣之可動支撐部52;及將該可動支撐部52在施能方向 拉引施能以將基板工件W張開，藉此矯正撓曲之張開施能 機構53。藉拉引基板工件W未形成被檢查基板體SB1、SB2 …之端部以行張開矯正，能有效果地消除撓曲，又，有關 矯正之構件因未干擾到被檢查基板體SB1、SB2…之攝影區 -16-1333543. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a method of inspecting a wiring board, a method of manufacturing a wiring board, and an inspection apparatus for a wiring board. [Prior Art] Japanese Patent Laid-Open Publication No. Hei No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The ground advances toward a high level, and the number of terminals of the wafer input and output portion also increases greatly. Due to the development of this situation, the number of line conductors for connecting electronic circuit boards of such wafers has also rapidly increased, and the so-called build-up substrates of the wiring layers which hold a large number of dielectric layers are gradually increasing. The dielectric layer described above is formed of a polymer material. For the electrical connection between the wiring layers of the build-up substrate, a via hole penetrating the dielectric layer is formed at a necessary position of the dielectric layer, and then the via hole conductor is formed by plating on the inner surface of the via hole. Conventionally, as shown in Fig. 14, the via-hole conductor is a so-called conformal via conductor CV» which forms a plating layer along the inner surface of the via hole and leaves a void UJ on the inner side thereof. In this case, if a via hole which is overlapped on the upper side is formed to be connected to the power distribution layer on the upper layer side, if the via hole conductor on the upper side overlaps the gap of the via hole conductor 1333354 in the lower side, the plating of the via hole is defective. Further, since the cause of the conduction failure or the like is also caused, the position of the upper via hole conductor and the lower via hole conductor are shifted so as not to overlap each other. However, as the integrated density of the wiring increases, the conformal via-hole conductor as described above has a space limitation in the connection structure of the upper and lower via holes. Therefore, as shown in Fig. 15, the conductor is gradually adopted. The inner side is electrically filled with a filled via hole conductor 134s. Since the filled via hole conductor 134s does not leave a space inside the via hole, a so-called stacked via that overlaps the upper and lower via hole conductors can be formed, and from the viewpoint of the high-density arrangement direction of the via hole and the wiring, It is an advantageous structure. [Problem to be Solved by the Invention] As shown in Fig. 16, the charging via hole 134s is formed by plating a metal inside the via hole, but if foreign matter adheres to the middle of the electric coating, When the growth of the filling layer is hindered, a void is left, and a concave defect is formed on the top surface of the via hole. The concave defect such as the via hole conductor 134s has been examined by a magnifying glass and observed by observation, but the lack of efficiency and precision is self-evident. Therefore, the top surface of the via hole conductor is image-captured, and it is of course possible to analyze the image to identify the concave defect. However, the via hole conductor exhibits a metallic luster, so even if a concave defect occurs, strong reflection light is generated around the recess and the inner surface of the recess when the illumination light is irradiated, and contrast is hard to be formed between the recessed region and its surrounding region (contrast ), has the difficulty of lacking defect detection accuracy. Further, Patent Documents 1 to 5 disclose various means for performing the inspection of the via hole by the optical method to perform the build-up substrate, but they are used for inspecting the inside of the via hole before the formation of the via hole conductor. The recess of the resin residue does not disclose a method suitable for inspecting concave defects of the filled via hole conductor. An object of the present invention is to provide a method for inspecting a wiring board capable of reliably and efficiently finding a concave defect generated in a via-hole conductor due to a poor electric current or the like, and a method of manufacturing a wiring board using the inspection method. And an inspection device for the wiring board. (Means for Solving the Problems and Effects of the Invention) In order to solve the above problems, the wiring substrate inspection method of the present invention has a dielectric layer formed by alternately laminating a metal wiring layer and a polymer material, and is held in the lamination direction. A method of inspecting a wiring board of a wiring layered portion having a structure in which a dielectric layer is connected to a metal wiring layer adjacent to each other by a filled via hole conductor filled with a metal, and is characterized in that: The inspected substrate body with the top surface exposed to the upper surface is incident on the illumination light by an oblique angle from one side of the normal line of the main surface of the substrate, and the illumination is illuminated to brighten the top surface region of the via hole conductor. On the one hand, the image of the top surface area is taken, and according to the shadow information generated on the top surface area of the image being photographed, the occurrence state of the concave defect caused by the metal filling failure is checked. Further, a method of manufacturing a wiring board of the present invention includes: manufacturing a dielectric layer formed by alternately laminating a metal wiring layer and formed of a polymer material a wiring layer of a wiring layered portion having a structure in which a dielectric layer is sandwiched between adjacent metal wiring layers and a via hole conductor which is internally filled with a metal, or an intermediate product of the wiring substrate, 1333543 In the substrate manufacturing operation of the substrate body to be inspected, the inspection operation of the substrate to be inspected is inspected by the inspection method of the present invention, and the screening operation of the substrate to be inspected is selected as a good product and a defective product based on the result of the inspection. Further, the inspection apparatus for a wiring board according to the present invention is an apparatus using the inspection method of the present invention, and is characterized in that: the substrate to be inspected is incident at an oblique angle from one side of a normal line of the main surface of the substrate. Illumination light illuminates the illumination device that fills the top surface area of the via hole conductor. A photographic device that captures images of the top area, and an image output device. According to the inspection method and apparatus of the present invention described above, the charged via hole conductor which generates the concave defect is irradiated with the illumination light incident at an oblique angle from one side of the normal to the main surface of the substrate. As shown in Fig. 7, by the oblique illumination light, a region where the illumination light is shaded by the shadow is generated inside the concave defect generated by the via hole conductor. Therefore, regardless of whether the inside of the concave defect is covered with a metal having a high reflectance, the concave defect can be easily recognized by the above-described shadow formation, and the inside of the charged via hole conductor can be surely and efficiently found. The concave defect. Moreover, according to the method of manufacturing the wiring board of the present invention for performing the screening of the substrate product by the inspection method, since the detection accuracy of the concave defect can be improved, the elimination of the defective product is surely performed, so that the substrate to be shipped can be reduced. Bad rate. Further, the inspection apparatus disclosed in Patent Document 4 is an inspection apparatus that uses a tilted light of 1333354 to perform a via hole, and the object to be inspected is an etching resin residue formed by the electric charge, which is different from the purpose of detecting the via hole. . And the light is applied to the substrate. If the method is applied to solve the shadow region generated by the oblique light, the photographic optical axis direction of the concave defect image can be detected by another method, and the normal surface of the substrate is normal. From the perspective of tilting, domain detection, it is still desirable to have the same surface normal. When the illumination light is 20° or more and 80° or less of the normal to the main surface of the substrate, the concave shape is increased. The tilt angle is set at 20° or more. 40 The device of the present invention can use a two-dimensional device, and the use of the surface illumination can have an illumination light angle that is unclear depending on the illumination shadow. . Therefore, if the photographing device is configured as a line sensor camera that is positioned in the horizontal plane in the photographing area on the body (line sensor), the line in the second position of the photographing information is orthogonally scanned in the photographing area. As described above, the front line of the concave defect in the via hole conductor is irradiated from both sides before the passage hole conductor of the device is as described above, and the side of the invention is unilaterally The tilting light is eliminated, thereby eliminating the purpose. The tilting angle of the illumination light is smaller than the illumination angle of the shadow region and the tilt angle of the substrate is performed with high precision. The effect of detecting the accuracy of the defect is specifically set. The following is preferable: a two-dimensional image sensing field such as a CCD sensor is irradiated two-dimensionally, but the position on the surface area is different, and the amount of illumination light at the position is also easily obtained: obtaining the line in the first direction of the substrate to be inspected Photographic: amera); selectively illuminating the line: linear photographic information in the horizontal plane and the first direction of the line sensor camera photographic position - 9 - 1333543 in water The in-plane synthesis obtains the image information generating unit corresponding to the two-dimensional image information of the photographing area; the illumination light can be concentrated in the linear photographing area, which can form a clearer shadow and improve the detection precision of the defect. In the case where the position of the line sensor camera and the illumination device is fixed, and the imaging scanning unit is configured to have a substrate scanning moving portion that scans the substrate to be inspected in the second direction, the optical of the camera can be omitted. The system is used for the driving mechanism of the scanning, and is not easy to cause the optical axis deviation and the focus shift. The device of the present invention can also be used to visually observe the shadow area on the image to determine the form of the defect 'but if the setting is based on the photographed The shadow information generated in the top surface of the image is analyzed. The ability to determine the state of the concave defect caused by the defective metal filling can improve the ability to determine the depression. Specifically, by the illumination of the illumination light, the area on the image is divided into the bright area by the established threshold. The dark region 'then can then determine the degree of formation of the concave defect based on the information of the area or size of the dark region appearing on the top surface region of the filled via hole conductor. This case is the aforementioned inspection analysis on the device of the present invention. The part has the illuminance generated by the illumination light, and the area on the image is divided into the bright area and the dark area by the predetermined critical threshold, and the area of the dark area appearing in the top surface area of the filled via hole conductor is calculated. Or a dark area calculation unit of a size; and a determination unit for determining the degree of formation of the concave defect according to the area or size of the dark area. As described above, 'not only the qualitative determination of the concave defect can be evaluated -10- 1333543 . . . and can quantitatively evaluate the degree of concave defects formed by the area or size of the dark area. As a result, excessive concave defects can be appropriately found, and the slight concave which does not form a problem in nature can be excluded. Defects can also be achieved* to reduce the rate of defects in screening operations. • In the case of a concave defect with an approximately the same opening size, as shown in Fig. 7, the deeper the shadow, the larger the shadow area will be. Therefore, the larger the area or size of the dark area, the greater the depth of the concave defect. . In the case of the device, the determination unit described above is configured to determine that the charge via hole conductor is defective if the area or size B of the dark region is larger than a predetermined reference value. However, the conduction failure of the stacked via holes is greatly affected by the depth of the recesses, and the effect of the recessed opening area is large. Therefore, it is possible to reliably exclude the deep recesses. Specifically, if the area or size of the dark region is larger than the predetermined reference width, it is determined that the charged via hole conductor is defective, and the determination operation is simple, which contributes to an improvement in inspection efficiency. [Embodiment of the Invention] The following describes an embodiment of the present invention with reference to the drawings. FIG. 17 is a view schematically showing a wiring board 100 which is an inspection method, an apparatus, and a manufacturing method of the present invention. Section structure. The wiring board 100 is formed of a heat resistant resin sheet (for example, a bis-maleimide-triazine resin sheet) and a fiber reinforced resin sheet (for example, a glass fiber reinforced epoxy resin). On both surfaces of the plate-like core layer 102, core conductor layers M1 and Mil for forming a wiring metal layer into a predetermined pattern are formed. The core conductor layers M1 and Mil are formed as a surface conductor pattern of a majority of the surface of the cladding layer -11- 1333543. The core layer 102 is used as a power layer or a ground layer user. Further, a through hole 112 penetrating through a drill or the like is formed in the plate-like core layer 102, and a via hole conductor through which the core conductor layers M1 and Mil are electrically connected to each other is formed on the inner wall surface of the through hole 112. 130. Further, the inside of the through hole 112 is filled with a boring material 1 31 made of a resin such as an epoxy resin. Further, wiring layer portions LI and L2 are formed on the upper layers of the core conductor layers M1 and Mil. Specifically, a first dielectric layer (build-up layer: dielectric layer) VI and VII composed of the photosensitive resin composition 106 is formed, and a copper plating layer is formed on the surface of the dielectric layer. The first conductor layers M2 and M12 are formed, and the two first conductor layers M2 and M12 each have a metal wiring 107. Further, the core conductor layers M1 and Mil and the first conductor layers M2 and M12 are connected to each other via the via holes 134. Similarly, a second dielectric layer (reinforcing layer: dielectric layer) V 2 and V12 using the photosensitive resin composition 106 is formed on each of the first conductor layers M2 and M12. Second conductor layers M3 and M13 are formed on the surfaces of the dielectric layers V2 and V12. These second conductor layers M3 and M13 have metal terminal pads 108 and 118. The first conductor layers M2 and M12 and the second conductor layers M3 and M13 are connected via the via holes 134, respectively. The via holes 134' have a via hole 134h and are provided as shown in FIG. a via via conductor 134s on the inner peripheral surface; a via pad 134p provided on the bottom surface side to be electrically connected to the filled via hole conductor 134s; and a via via hole conductor on the opposite side of the via via pad 134p The via hole of the opening of the opening of the 134s is extended to the periphery of the opening pad 1341° -12- 1333543. The filled via hole conductor 134s is a filled via hole conductor formed by plating the inside of the metal to cross the adjacent dielectric. In the form of a bulk layer, two or more of the filled via hole conductors 13 4s are stacked in such a manner as to overlap each other in a horizontal plane to form stacked vias. The first wiring layer portion L1 including the core conductor layer M1, the first dielectric layer VI, the first conductor layer M2, and the second dielectric layer V2 is formed on the first main surface MP1 of the plate-like core layer 102. Further, the second main surface layer MP2 including the core conductor layer M1, the first dielectric layer VII, the first conductor layer M12, and the second dielectric layer V12 is formed on the second main surface MP2 of the plate-like core layer 102. The dielectric layer and the conductor layer in the two wiring layer portions are alternately laminated such that the first main surface CP of the stacked portion is formed of a dielectric layer, and a plurality of metal terminals are formed on the two first main surfaces CP, respectively. Pad 110 or 117. The metal terminal pad 110 on the side of the first wiring layer portion L1 constitutes a soft solder pad for performing a flip chip bonding such as an integrated circuit wafer. The metal terminal pads 1 1 7 on the side of the second wiring layer portion L2 are used to bond the wiring substrate itself by a grid array (PGA Array: PGA) or a ball grid array (BGA) package. On the inside of the motherboard (mother board) and other solder pads. The dielectric layers VI, VII, V2, and V12, and the anti-return barrier layers (3〇1 <161·-resist) 108 and 18 are manufactured, for example, as follows. That is, a photosensitive resin composition varnish (vanish) is laminated (laminated) with a thinned photosensitive adhesive film, and then superposed on a transparent mask having a pattern corresponding to the via hole 134h (for example, glass shading) Cover) and expose. The film portion other than the via hole 134h - 13 - 1333543 is hardened by exposure, but the portion of the via hole 134h is not hardened. Therefore, if it is removed in the solvent, the via hole 134h is formed in the desired pattern ( The photo via process is performed. Then, a light-shielded copper plating is performed by using a plating resist resin to form a wiring pattern, and a known wiring is formed by plating. The inside of the via hole 13 4h is filled with metal plating to form a filling path 134s». By repeating the above operation, each wiring layer portion L1 can be formed. The via hole conductor 13 is formed. Each dielectric layer is formed, and a dielectric layer is formed. When the body layer is formed with the via hole conductor 134s, it is checked that the plating layer is defective and the concave defect is formed. Therefore, the substrate to be inspected is the wiring substrate 1 of the final product as shown in Fig. 17, and the dielectric is inspected. The state in which the bulk layer forms the filled via hole conductor 13 4s can be said to be an intermediate product. Hereinafter, the details based on the present inspection method and the apparatus used in the inspection method will be described. Fig. 1 is a view showing an inspection apparatus according to an embodiment of the present invention. The inspection apparatus 1 is configured to inject illumination light (beam) at an oblique angle from a single side of the main surface of the substrate body W to be inspected. LB, the light LB, as shown in Fig. 7, illuminates the top surface area of the filled via hole, and simultaneously images the top area image, which is generated on the top surface area of the captured image. The shaded area information is used to check the state of occurrence of the concave defect PF due to poor metal filling, and the imaging device i3c having the image for generating the illumination light illumination device 25 and the ingesting top surface region remains. Can be simple ^ process) encountered resin cover, and, in the hole conductor, L2. Whenever there is a cause, it is not considered as an interruption. The surface normal of 1 is taken as I 134s and then the root DA is produced; LB. As shown in the figure -14- λ 1333543, the direction of the image capturing optical axis CA of the present embodiment coincides with the normal to the main surface of the substrate. Further, as shown in Fig. 1, the inclination angle 照明 of the illumination light LB to the normal to the main surface of the substrate is set to be in the range of 20° or more and 80° or less (preferably 20° or more and 40° or less, for example, 30°). The photographing device 13C includes a line sensor camera 13c for acquiring linear photographing information in the first direction (X direction) in the horizontal plane on the photographing region on the substrate body W to be inspected; A line illumination device 25 that acquires a position of the linear photographic information; a second direction (Y direction) orthogonal to the first direction in the horizontal plane, and a scanning unit that scans the imaging position of the line sensor camera 13c in the imaging area And a video information generating unit 12 (FIG. 3) that combines the linear photographic information sequentially obtained by the scanning in the horizontal plane to obtain the two-dimensional image information corresponding to the photographing area. The position of the line sensor camera 13c and the illumination device 25 is fixed, and the image scanning unit is configured by scanning the substrate scanning moving portion 23 in which the substrate body W to be inspected and moved in the second direction. The line sensor camera 13c of the present embodiment is a commercially available digital line sensor camera that adds a photographic optical system to a one-dimensional C CD sensor, and the video information generating unit 12 also uses a commercially available digital line sensor camera image. An image processing module (for example, corresponding to AVAL DATA CORPORATION: PSM-3 3 0D/ APC322, PCI bus). Further, the substrate scanning and moving unit 23 is configured by a well-known vertical and horizontal moving table (X-Y table) (hereinafter also referred to as a vertical and horizontal moving table 23). In the present embodiment, the substrate body W to be inspected is a large-sized substrate workpiece in which a plurality of inspected substrate bodies SB, SB2, ... are integrated in a horizontal plane as shown in FIG. . As shown in Fig. 1, the apparatus 1 is inspected to support the substrate workpiece supporting portions 50, 52 of the large substrate workpiece W, and the photographing position of the photographing camera 13c is applied to the substrate workpiece supporting portions 50, 52 at -15 - 1333543. The workpiece relative movement unit 23 that relatively moves the substrate workpiece supporting portions 50 and 52 to the photographing camera 13c and the illumination device 25 is provided in order to sequentially move the plurality of inspected substrate bodies SB1 and SB2. Thereby, it is possible to sequentially inspect each of the inspected substrate bodies SB 1 and SB2 . . . in the state of the large substrate workpiece W before separation, and it is also possible to omit the mounting of the inspected substrate bodies SB 1 and SB2 . It is efficient to check the time of the device. The workpiece relative movement portion also uses the above-described vertical and horizontal moving table. The large-sized substrate workpiece W of the plurality of thin substrate substrates SB1, SB2, ... is likely to be deflected, and the focus of the image pickup device 13c is easily shifted. In this case, in order to eliminate such a problem, as shown in FIG. 2, the deflection correction portion 60 for correcting the deflection of the substrate workpiece W is provided on the substrate workpiece supporting portions 50, 52. The substrate workpiece supporting portions 50 and 52 are disposed on the vertical and horizontal moving table 23, and the deflection correcting portion 60 is configured to include a predetermined energy application direction in the horizontal plane of the substrate workpiece W on the substrate workpiece supporting portions 50 and 52. The fixed grip portion 50 of the edge on one side of the substrate workpiece W is disposed so as to be movable in the direction in which the substrate workpiece support portions 50 and 52 are moved, and the other side is held in the energizing direction of the substrate workpiece W. The movable supporting portion 52 of the end edge; and the opening and urging mechanism 53 for correcting the deflection by pulling the movable supporting portion 52 in the energizing direction to open the substrate workpiece W. The end portion of the substrate to be inspected SB1, SB2, which is not formed by pulling the substrate workpiece W, is corrected in a row, and the deflection can be effectively eliminated. Further, the member for correction does not interfere with the substrate body SB1, SB2 to be inspected. ...the photography area-16-
1333543 域，故不會妨礙到檢查。 固定把持部50係藉螺栓等而鎖住在縱橫移動 ，其上面係做爲基板工件W之端緣之支撐面。而， 面爲了卡合把持基板工件w及決定基板工件…之-未形成被檢查基板體SB1、SB2···之基板工件W之 域突出設置插通被鑽孔之貫通孔SH之定位用卡合 另外一方面，可動把持部52係能滑動（slide)地配置 移動台23上，在其之上面同樣也設有定位用卡合 將各個定位用卡合銷51插通基板工件W之貫通孔 後藉做爲張開施能機構之汽缸53朝將可動把持部 固定把持部50之方向施能，藉此能對基板工件W 曲矯正之張開力。 再參照第1圖，攝影裝置13c係爲焦點距離事 之相機1 3 c。另外，設有用於測定距基板工件W之 面間之距離之距離測定部2 1，和根據該距離測定音 定之距離，調整該相機13c之光軸方向之位置俾使牛 之焦點在被檢查面上與其焦點距離一致之相機13c 調整機構61。藉此，能有效果地防止因焦點距離之 造成影像放大（magnification)的變化之不良情事。 本實施形態係構成爲上述之相機1 3 c係配置成 基板工件支撐部50、52之被檢査面，照明裝置25 機13c之攝影光軸以傾斜的方式朝相機13c在被檢 之聚焦位置照射照明光束，且相機1 3 c之位置調整 在使相機13c朝光軸方向移動之際，照明裝置25係 今23上 在該上 i置，在 .端緣區 銷51。 在縱橫 銷5卜 SH，然 52拉離 施加燒 先固定 被檢查 5 21測 目機13c 之位置 .變化， ,聚焦於 係對相 :查面上 機構61 丨與相機 -17- 1333543 13c —體地在該光軸方向移動。 具體的構造係如下述。檢查裝置1係形成爲具有安裝 用的基座（base)29，在豎立於該基座29上之支柱31、31 之上端結合有上部框32之門型框架（frame)構成。在上部框 32的下方設有能沿著支柱31、31昇降之昇降框33。昇降 框33設有在其昇降方向貫通之雌螺絲部40、40，各個螺 軸34、34係分別嚙合此雌螺絲部40、40。這些螺軸34、 34係在基座29內經斜齒輪35及連結軸36而能連動旋轉 ，其等係被設在上部框32之相機聚焦用驅動馬達19旋轉 驅動，進而使昇降框33昇降。 在昇降框33設有相機13c、由雷射距離感知器等構成 之距離測定部21、及照明裝置25，其等係藉螺軸34、34 之驅動，而與昇降框33 —體昇降。構成做爲線照明之照明 裝置25係使照明光束LB朝向相機1 3c之焦點位置那樣， 經連結構件3 8而與相機1 3 c結合。照明裝置2 5係配置在 連結構件3 8上通過上述焦點位置與相機光軸C A正交之軸 線周圍之任意位置上能固定之滑件（s 1 i d e r) 3 9上，照明光束 LB和相機光軸CA之角度Θ係能調整。 如第6圖所示，被支撐在基板工件支撐部50、52上之 基板工件W之撓曲測定基準位置（例如工件的中心位置）係 定位於距離測定部21之正下方，測定距該基準位置止之距 離K。在測定此距離K之前，事先測定距離相當於撓曲爲 零之水平基準面P〇之距離K0，驅動螺軸34、34使焦點位 置事先定位於該水平基準面P0,以決定攝影機之預備位置 -18- 1333543 .。又，能藉Κ-ΚΟ算出撓曲量D，使相機13c之焦點朝下方 僅移動撓曲量D那樣，再行驅動螺軸34、34俾行定位· 第3圖係爲表示檢查裝置1之電氣構成的一例之方塊 圖。檢查裝置1含有解析因充塡通路孔導體之金屬充塡不 良所產生之凹狀缺陷之發生狀態之檢査解析部2。該檢査 解析部2係由兼做爲檢查裝置之驅動控制部之微電腦 (micro cmputer)(又稱工作站）所構成（以下也稱微電腦2)。 微電腦2的基本部分係由CPU4、記存電腦控制用之基本程 式之1101^15、做爲0?1；4之工作區（评〇4 316&)之11八]^6及輸 出入部7所組成，這些元件係藉主機匯流排（host bus)3而 連接。 又，主機匯流排3係經PCI橋接器（bridge)lO而接於 PCI匯流排1卜在設於該pci匯流排1 1上之卡槽（carci si〇t) 接有做爲前述之影像資訊產生部之影像處理模組12之基 板。另外，線感知器相機13c係接於此影像處理模組12。 第1圖之縱橫移動台係爲能將固定在台上之被檢查基 板體W在水平面內之X方向和與其正交之γ方向獨立地， 且於規定範圍內之任意之X-Y座標位置上移動驅動以行定 位者，其具備X驅動馬達14和Y驅動馬達18»如第3圖 所示’ X驅動馬達1 4和γ驅動馬達1 8係經裝有伺服控制 機構（servo-contral mechanism)之馬達驅動器15而接到微 電腦2之輸入出部7。X驅動馬達丨4和γ驅動馬達18皆 具備用於偵測馬達之旋轉角度位置（賦與反映在馬達驅動 量上之被檢查基板體W之X-Y定位標座）之編碼器16。馬 -19- 1333543 .•達驅動器15之任務係接收來自微電腦2之定位用之χ座標 .指令値及Y座標指令値，並與從編碼器16饋還（feed-back) 之各個馬達14' 18之現在之角度位置比較，然後驅動各馬 達14、18，使被檢查基板體W移動到χ座標指令値及γ • 座標指令値給與之目標位置。符號17係爲用於使編碼器 16之脈衝信號緣（edge)抖崚化之施密特觸發器（schmitt trigger)。另外’在微電腦2側爲了把握被檢查基板體W的 位置，X驅動馬達14和Y驅動馬達18之各編碼器16之信 ，號也輸入輸入出部7。又’前述的相機聚焦用驅動馬達19 係經馬達驅動器20而與距離測定部2 1 —起接到輸入出部 7 » 來自線感知器相機13c之一維影像信號係在被定於被 檢查基板體W之攝影區域（例如，具有僅包含一個充塡通路 孔導體之縱橫尺寸之區域）上之X方向上被取得。而，交互 地重複使被檢查基板體W朝Y方向步進（step)移動和取得 一維影像信號，能以在Y方向掃描攝影區域之形式順序地 > 取得一維影像信號。線感知器相機13c輸出之一維影像信 號係做爲一串的像素資料（pixel data)列而被傳送到影像處 理模組1 2，'每送完一串像素資料列後即送出同步信號。影 像處理模組12藉從縱橫移動台23之Y方向的編碼器16 之輸入信號把握一維影像信號的Y方向掃描位置，並藉來 自線感知器相機13c之同步信號辨識像素資料列之段落， 將Y方向的各位置的一維影像信號在模組內之影像記億體 內合成，從而產生對應攝影區域之二維影像資料。此二維 -20- 1333543 影像資料係經PCI匯流排1 1而分批（batch)被傳送到微 2，然後被記存於RAM6內之影像記憶體6d。又，該 影像資料係做爲影像資料22d而被保存於由連接於微 2之HDD (硬碟）等構成之外部記憶裝置22。 在外部記憶裝置22有安置（install)負責檢查裝置 基本動作之控制軟體22a，和從上述取得之二維影像 進行充塡通路孔導體的缺陷檢查解析之解析軟體22b CPU4而在RAM6內的控制/解析軟體執行記憶體6a上 〇 使用上述檢查裝置1，進行第7圖所示那樣的凹 陷PF的檢查之際，藉照明光LB產生之照度將影像上 域以既定之臨界値爲境界區分爲明區域和暗區域，然 根據呈現在充塡通路孔導體134s之頂面區域之暗區域 積或尺寸之資訊，進行有關凹狀缺陷PF的形成程度的 。檢查解析部2藉執行上述之解析軟體22b，實現依 光LB產生之照度，以既定之臨界値爲境界將影像上的 區分成明區域和暗區域，並運算呈現在充塡通路孔 134s的頂面區域之暗區域的面積或尺寸之暗區域運算 根據暗區域之面積或尺寸執行有關凹狀缺陷PF的形 度之判定之判定單元之各個功能。 含於來自線感知器相機13c之一維影像資料內之 能做爲多數位元之深淺度像素資料而被取得，例如照 高的區域，設定於該區域之像素之亮度則愈大。像素 度設定値若設定一定的臨界値時則能藉眾知的方法容 電腦 二維 電腦 1之 資料 ，藉 執行 狀缺 之區 後， 之面 判定 照明 區域 導體 ，及 成程 像素 度愈 的売 易地 -21- 1333543 .將深淺度（gradient)影像資料轉換成兩値影像資料。影像上 .的明區域係在該兩値影像資料上做爲對應「明」狀態之第 1像素之集合區域’又，暗區域係對應「暗」狀態之第2 像素之集合區域，而能分別予以辨識。 又’藉上述暗區域的面積判定凹狀缺陷PF的形成程度 之情形，若計數形成第2像素的集合區域之像素數時則能 簡單運算該暗區域的面積。另外一方面，若是藉尺寸來判 定時則在第2像素的集合區域決定尺寸測定方向，然後運 算沿著該尺寸測定方向之第2像素之連續的最大値，藉此 能求出暗區域之尺寸。下文將敘述處理的運算法則 (algorithm) 〇 若是開口尺寸約略相同之凹狀缺陷PF之情形時，則如 第7圖所示那樣，凹陷愈深陰影區域DA則愈大，因此能 判定暗區域的面積或尺寸愈大，凹狀缺陷PF之深度愈大。 這種情形，能藉運算將暗區域的尺寸轉換爲凹狀缺陷PF的 深度Η。如第7圖所示那樣，將照明光的傾斜之光軸方向 投影到基板主表面，將其方位設定於尺寸測定方向，然後 在影像上求出該尺寸測定方向之暗區域，亦即陰影區域DA 的最大尺寸L，接著，該照明光的光軸對基板主表面法線 的傾斜角度爲Θ，即能由Leo ste推定凹狀缺陷PF的深度Η 〇 算出之暗區域（陰影區域DA)的面積S或尺寸L若大於 基準値（SO、L0)之情形，則視爲在取得的該暗區域之充塡 通路孔導體13 4s產生容許範圍外的凹狀缺陷，能判定此爲 -22- 1333543 .不良情形。另外’下述係屬稍爲粗糙的判定方法，其係將 臨界値設定稍爲大一點而行影像之兩値化，藉是否有存在 成爲暗區域（陰影區域DA)之像素，不見得需算出暗區域的 面積S或尺寸L，也能進行不良的判定。這種情形，只有 像素全部成爲明區域之情形才判定爲良（合格），因此，運 算既定區域內影像的像素設定値之乘積，依運算的結果進 行判定即可。 其次，第3圖的檢查裝置1設定記憶充塡通路孔導體 形成在被檢査基板體上的位置資訊與充塡通路孔導體之良 否判定結果產生對應關係之判定結果記億部22，及對應設 定於輸出區域上之基板區域之各充塡通路孔導體134s之位 置，映對（mapping)輸出良否判定結果之判定結果輸出部8 、9。這樣子的話，能一眼即看出在被檢查基板體SB 1、SB2 …之任何位置上是否存有被判定爲不良之充塡通路孔導體 134s。充塡通路孔導體形成在被檢查基板體上之位置資訊 係做爲製品別通路孔位置資料22c而記存於外部記憶裝置 22。如第4圖所示，該資料22c係被包含在每個配線基板 之產品號碼（產品種類）項下，爲個別地掌握每個介電體層 之不同通路孔位置，每個介電體層之層（layer)別含有各充 塡通路孔導體的配置位置的座標資料（例如係爲圓形的通 路孔區域的中心位置座標）。 又，判定結果記憶部係形成在外部記憶裝置22，做爲 通路孔不良判定結果資料22e的記憶部。如第5圖所示， 充塡通路孔導體的檢査判定結果係以與配線基板的產品號 -23- 1333543 碼、大張基板工件W之批（lot)號（批次辨識資訊）、大張基 板工件W內之基板號碼（基板辨識資訊）、及充塡通路孔導 體所在之介電體層的層號（層辨識資訊）產生對應關係之方 式，記存各充塡通路孔導體之凹陷面積、凹陷深度及良否 判定結果。又，各充塡通路孔導體的攝影影像資料（第3圖 的符號22d)也一倂記存。 藉製品別通路孔位置資料22c，讀出被指定之層的充 塡通路孔導體的座標資料，從通路孔不良判定結果資料 22e(判定結果記憶部22)讀出各充塡通路孔導體的良否判 定結果，如第8圖所示，在對應輸出區域內之座標位置藉 良否結果相互能識別之圖形（例如判定良之V A和判定不良 之VR係以改變描繪點的顏色和形狀等表示）映對（map ping) 各充塡通路孔導體的判定結果。該映對結果係能從接於輸 入出部7之當作判定結果輸出部之監視器8、和印表機9 輸出。 ‘下文，將使用流程圖說明檢查裝置1的影像取得處理 之流程。第9圖係表示影像取得流程，其係藉第3圖之控 制軟體22a而執行。首先，將大張基板工件（work)W設定 在縱橫移動台23之基板支撐部50、52上，然後啓動處理 流程，這一來，撓曲矯正部60首先作動，張開大張基板工 件W以矯正撓曲（參照第2圖）。其次，啓動第9圖的S1: 初始設定處理。 第10圖係表示處理的詳細內容，在S51輸入基板之品 號及批號，在S52輸入做爲檢查對象之層之號，並從製品 -24- 1333543 .別通路孔位置資料22c(第4圖）讀出該層內之充塡通路孔導 .體之配置位置。接著在S53，驅動縱橫移動台23將大張基 板工件W移動到原點位置，在S54使相機位置調整機構61 動作，進行高度方向之位置對準俾使相機1 3 c之焦點與原 點位置（第6圖之水平基準面P0) —致。然後進入S56，藉 距離測定部21測定距大張基板工件W之距離L，在S57 算出應調整之相機移動量L-LO (前述），然後在S58僅降低 相機13c已算出之移動量，從而對準基板工件W表面之焦 點。 藉上述之步驟執行完初始設定處理，然後進入第9圖 之S2，進行初始化被檢查基板體的號碼。接著，在S3藉 縱橫移動台23移動大張基板工件W，使相機13c的位置對 準在大張基板工件W內被指定之號碼的被檢查基板體的基 板內之原點位置（例如，能藉形成在基板上之對準標記 (alignment ncark)等識別）’然後在S4重設（reset)第3圖的 X計數器6b及Y計數器6c。 接著，在S5進行通路孔號碼之初始化。在S6使相機 13c之位置對準被指定號碼之充塡通路孔導體，在S7設定 攝影視野俾將該充塡通路孔導體之整體涵蓋在攝影範圍內 。又，在S8藉已說明之方法進行攝取充塡通路孔導體之影 像，而在S9記存該攝取之影像。亦即，並非進行被檢查基 板體之全面之影像攝影，而是在基板內形成充塡通路孔導 體之每個位置，設定涵蓋該充塡通路孔導體之限定式的攝 影視野，俾個別地進行影像攝影處理。藉此，能排除無充 -25- 1333543 .塡通路孔導體存在之無用白費的影像區域，即便 塡通路孔導體的攝影影像的解析度，也不必擴大 即可實現。 其次，在S10判定是否有下一個通路孔’若 入S11遞昇通路孔號碼，然後返回S6,以下重複教 之處理。在S10若判定無次一個通路孔時即結束 基板體的攝影處理，然後進入S12，檢查在大張 W是否有餘留未攝影之被檢查基板體。若有餘留 S13，遞增（increment)被檢查基板體之號碼，然 S3，重複執行直到S12之處理。在S12，若判定 一個被檢查基板體時即結束影像取得處理。 第11圖係爲表示使用取得之影像進行充塡 體之良否判定處理之流程。首先，在S101，輸入 對象之被檢査基板體之辨識資訊（品號、批號、基 層別），在S102,讀出對應之層之充塡通路孔導體 料。在S 1 03，初始化通路孔號碼，在S 1 04兩値 號碼的充塡通路孔導體的影像。而，在S105使用 之影像資料進行判定處理。 第12圖係爲表示根據陰影區域的面積執行 理之情形的處理流程。首先，在S201，在兩値化 上將陰影區域的像素之設定狀態定爲「1」，陰影 的像素的設定狀態爲「0」（若係在充塡通路孔導 輪廓線的外側有存在暗的背景區域之情形，則藉 像處理方法抽出該背景區域和充塡通路孔導體區 要提高充 影像尺寸 有時則進 t行到S 1 0 該被檢查 基板工件 時則進入 後，返回 無餘留次 通路孔導 成爲判定 板號碼及 的影像資 化被指定 該兩値化 該判定處 後之影像 區域以外 體的外形 眾知之影 域之接緣 -26- 1333543 (edge)線，然後僅將該接緣線之內側做爲判定對象區域）， 求出在影像上成爲「1」之像素的總和，並將此像素的總和 做爲陰影區域之面積參數（area parameter)S。接著，在S202 ，比較該面積參數S和合否（合格與否）判定基準値SO，若 是SS SO時則判定充塡通路孔導體爲合格，若是S>S0時則 判定爲不合格，然後，如第5圖那樣記存結果（S203〜S205) 〇 另外一方面，第13圖係爲表示從陰影區域求出凹陷深 度Η，然後藉該凹陷深度Η執行判定之情形的處理流程。 此流程之主體係爲將藉第7圖已說明之尺寸測定方向定爲 X方向，求出在該X方向之每個像素列上成爲陰影區域 (亦即「1」）之像素的連續數之處理。具體說，在S251，初 始化Υ方向位置，在S252，求出具有被指定之Υ座標之X 方向像素列上成爲陰影區域之像素之連續數L’，在S253 順序遞增Υ方向位置之同時重複執行S25 2之處理。若對影 像區域的全部像素列執行完上述處理時則從 S254進行 S2 5 5，求出成爲陰影區域之像素之連續數L'之最大値，然 後將此最大値識別爲尺寸測定方向之陰影區域之尺寸L。 而，在S256，藉H = Lc〇ste算出凹陷深度Η，然後在S257 比較此算出之Η和基準値H0。若是HSH0時則判定該充 塡通路孔導體爲合格，若是Η>Η0時則判定爲不合格，然 後如第5圖那樣記存結果（S25 8〜S260)。另外，照明角度Θ 若係一定時則coste係爲常數，因此，比較陰影區域之尺 寸L該値與基準値L0之處理在數學上也是等效，從而也能 -27- 1333543 .利用這種方式進行判定。 . 第5圖那樣彙總之通路孔不良判定結果資料22e 第3圖之監視器8或印表機9輸出。如第11圖S107〜 所示那樣’讀出各個通路孔的位置，描繪在對應映對 之通路孔之位置上之判定結果，藉此得出第8圖那樣 出結果。而’參照該輸出結果，對各個被檢査基板體 次’亦即對每個大張基板工件，在被判定爲不良之被 基板體上利用油墨作成標記等形成表示係爲不良之記 檢查後之大張基板工件然後切斷分離成各個配線基板 有不良記號之被檢查基板體藉目視後人工動作或眾知 選裝置，從沒有不良記號之被檢查基板體篩選、分離 下面將說明爲了確認本發明的檢查方法的妥當性 施之實驗結果。準備約10,000個其上形成有高度爲35〜 ’直徑爲80μιη之充塡通路孔之各種配線基板的中間 ，事先用光學顯微鏡詳細地辨識產生深度15μιη以上 狀缺陷之充塡通路孔。接著，藉第1圖之檢查裝置 將線照明之角度Θ作種種的變更，一邊辨識產生15 上之凹狀缺陷之充塡通路孔，另同時對照藉光學顯卷 察得出之檢查結果，對照結果若是一致時則視爲成Ϊ 是不一致時則視爲不成功這樣重複進行檢查判定。$ 檢查裝置之各部之規範係如下列。 (線感知器相機） •像素數：4096像素/線 係從 S 1 08 區域 的輸 之批 檢查 號。 ，將 之篩 〇 所實 4 0 μιη 製品 之凹 一邊 m以 鏡觀 ，若 外， -28- 1333543 •解析度：5μιη/像素 •焦點距離：125mm (線照明裝置） •使用鹵光（halogen light)’聚光距離爲100mm的透 鏡。 以上實驗的結果列於第1表。 (第1表） 號碼 角度Θ 成功或然率（％) 1 5 0 2 15 0 3 25 100 4 35 100 5 45 95 6 55 95 7 65 90 8 75 8 5 9 85 01333543 domain, so it will not hinder the inspection. The fixed grip portion 50 is locked in the vertical and horizontal directions by bolts or the like, and the upper surface thereof serves as a support surface for the end edge of the substrate workpiece W. On the other hand, in order to engage and hold the substrate workpiece w and the substrate substrate, the positioning substrate for inserting the through hole SH of the drilled hole is protruded from the field of the substrate workpiece W on which the substrate body SB1, SB2, ... is not formed. On the other hand, the movable grip portion 52 is slidably disposed on the movable table 23, and is provided with a positioning engagement for inserting the positioning engagement pins 51 through the through holes of the substrate workpiece W. Then, the cylinder 53 serving as the open energizing means is energized in the direction in which the movable grip portion is fixed to the grip portion 50, whereby the opening force of the substrate workpiece W can be corrected. Referring again to Fig. 1, the photographing device 13c is a camera 1 3 c having a focus distance. Further, a distance measuring unit 2 1 for measuring the distance from the surface of the substrate workpiece W is provided, and a distance determined by the distance is measured, and the position of the optical axis direction of the camera 13c is adjusted so that the focus of the cow is on the surface to be inspected. The camera 13c is adjusted to the mechanism 61 in accordance with its focal length. Thereby, it is possible to effectively prevent the deterioration of the image magnification due to the focal length. In the present embodiment, the camera 1 3 c is disposed so as to be inspected on the substrate workpiece supporting portions 50 and 52, and the photographing optical axis of the illumination device 25 is tilted toward the camera 13c at the in-focus position to be inspected. The illumination beam is adjusted, and the position of the camera 13c is adjusted to move the camera 13c toward the optical axis. The illumination device 25 is placed on the upper edge 23 in the end edge region 51. In the vertical and horizontal pin 5, SH, 52 is pulled away from the position where the burnt-fixed inspection is inspected by the heading 13c. The focus is on the phase-to-phase: the face-up mechanism 61 丨 and the camera -17- 1333543 13c The ground moves in the direction of the optical axis. The specific structure is as follows. The inspection device 1 is formed to have a base 29 for mounting, and is constituted by a door frame in which an upper frame 32 is joined to an upper end of the pillars 31, 31 standing on the base 29. Below the upper frame 32, there is provided a lifting frame 33 which can be moved up and down along the pillars 31, 31. The lifting frame 33 is provided with female screw portions 40 and 40 penetrating in the lifting direction, and the respective screw shafts 34, 34 are engaged with the female screw portions 40, 40, respectively. These screw shafts 34 and 34 are rotatably driven in the susceptor 29 via the helical gear 35 and the coupling shaft 36, and are driven to rotate by the camera focus drive motor 19 provided in the upper frame 32, thereby elevating and lowering the lift frame 33. The lift frame 33 is provided with a camera 13c, a distance measuring unit 21 composed of a laser distance sensor or the like, and an illumination device 25, which are driven by the screw shafts 34 and 34 to be lifted and lowered with the lift frame 33. The illumination device 25, which is configured as a line illumination, is coupled to the camera 1 3 c via the connecting member 38 such that the illumination beam LB is directed toward the focus position of the camera 13c. The illuminating device 25 is disposed on the connecting member 38 on the slider sizable at any position around the axis orthogonal to the camera optical axis CA, the illumination beam LB and the camera light. The angle of the axis CA can be adjusted. As shown in Fig. 6, the deflection measurement reference position (for example, the center position of the workpiece) of the substrate workpiece W supported on the substrate workpiece supporting portions 50, 52 is positioned directly below the distance measuring portion 21, and the distance is measured from the reference. The distance K is the position. Before measuring the distance K, the distance K0 corresponding to the horizontal reference plane P〇 whose deflection is zero is measured in advance, and the screw shafts 34 and 34 are driven to position the focus position in advance on the horizontal reference plane P0 to determine the preparatory position of the camera. -18- 1333543 .. Further, the amount of deflection D can be calculated by Κ-ΚΟ, and the focus of the camera 13c can be moved downward only by the amount of deflection D, and the drive shafts 34 and 34 can be positioned again. FIG. 3 is a view showing the inspection device 1. A block diagram of an example of electrical construction. The inspection apparatus 1 includes an inspection and analysis unit 2 that analyzes the state of occurrence of concave defects caused by the poor filling of the metal of the via hole conductor. The inspection analysis unit 2 is constituted by a micro cmputer (also referred to as a workstation) which also serves as a drive control unit of the inspection device (hereinafter also referred to as a microcomputer 2). The basic part of the microcomputer 2 is composed of the CPU4, the basic program for controlling the computer, 1101^15, and the working area of the 0?1;4 (the evaluation of 4 316&) 11 8]^6 and the input and output 7 Composition, these components are connected by a host bus 3. Moreover, the host bus 3 is connected to the PCI bus 1 via a PCI bridge (1), and the card slot (carci si〇t) disposed on the pci bus 1 is connected to the image information. The substrate of the image processing module 12 of the generating unit. In addition, the line sensor camera 13c is coupled to the image processing module 12. The vertical and horizontal moving stage of Fig. 1 is capable of moving the X-direction of the inspected substrate W fixed on the stage in the horizontal plane and the γ direction orthogonal thereto, and moving in any XY coordinate position within a predetermined range. The drive is a line locator having an X drive motor 14 and a Y drive motor 18» as shown in Fig. 3, the 'X drive motor 14 and the γ drive motor 18 are equipped with a servo-contral mechanism. The motor driver 15 is connected to the input/output portion 7 of the microcomputer 2. Both the X drive motor 丨4 and the γ drive motor 18 are provided with an encoder 16 for detecting the rotational angular position of the motor (the X-Y positioning target to which the substrate body W to be inspected is reflected on the motor drive amount). Ma-19-1333543. The task of the driver 15 is to receive the coordinates 値 and Y coordinate commands from the positioning of the microcomputer 2, and to feed the motor 14' from the encoder 16 The current angular position of 18 is compared, and then the motors 14 and 18 are driven to move the substrate body W to be inspected to the target position given by the χ coordinate command 値 and the γ coordinate command. Symbol 17 is a Schmitt trigger for dithering the pulse signal edge of the encoder 16. Further, in order to grasp the position of the substrate body W to be inspected on the side of the microcomputer 2, the signals of the encoders 16 of the X drive motor 14 and the Y drive motor 18 are also input to the input/output unit 7. Further, the aforementioned camera focus drive motor 19 is connected to the distance measuring unit 2 1 via the motor driver 20 to the input/output unit 7 » One-dimensional image signal from the line sensor camera 13c is set on the substrate to be inspected The photographic region of the body W (for example, having an area containing only one aspect of the via hole conductor) is taken in the X direction. On the other hand, the one-dimensional image signal of the substrate body W to be inspected is stepwise moved in the Y direction and the one-dimensional image signal is obtained, and the one-dimensional image signal can be sequentially obtained in the form of scanning the image capturing area in the Y direction. The line sensor camera 13c outputs a one-dimensional image signal as a string of pixel data columns and transmits it to the image processing module 12, and sends a synchronization signal every time a string of pixel data columns is sent. The image processing module 12 grasps the Y-direction scanning position of the one-dimensional image signal by the input signal of the encoder 16 in the Y direction of the vertical and horizontal mobile station 23, and recognizes the paragraph of the pixel data column by the synchronization signal from the line sensor camera 13c. A one-dimensional image signal at each position in the Y direction is synthesized in the image within the module, thereby generating two-dimensional image data corresponding to the photographing area. The two-dimensional -20- 1333543 image data is transferred to the micro 2 via the PCI bus 1 and then recorded in the image memory 6d in the RAM 6. Further, the image data is stored as an image data 22d and stored in an external memory device 22 composed of an HDD (hard disk) or the like connected to the micro 2 . The external memory device 22 has a control software 22a that is responsible for the basic operation of the inspection device, and an analysis software 22b CPU4 that performs the defect inspection analysis of the charge via hole conductor from the obtained two-dimensional image, and controls the RAM 6 in the RAM/ In the analysis software execution memory 6a, when the inspection device 1 is used and the inspection of the depression PF as shown in FIG. 7 is performed, the illuminance generated by the illumination light LB is used to distinguish the upper region of the image from the predetermined threshold. The area and the dark area are subjected to the degree of formation of the concave defect PF based on the information of the dark area product or size of the top surface area of the filled via hole conductor 134s. The inspection analysis unit 2 implements the above-described analysis software 22b to realize the illuminance generated by the light LB, and divides the image into a bright region and a dark region at a predetermined threshold, and the calculation is performed on the top of the filling via hole 134s. The dark area calculation of the area or size of the dark area of the surface area performs each function of the determination unit regarding the determination of the shape of the concave defect PF in accordance with the area or size of the dark area. It is included in the one-dimensional image data from the line sensor camera 13c and can be obtained as the majority of the pixel data of the majority of the bits. For example, in the region where the illumination is high, the brightness of the pixels set in the region is larger. Pixel setting 値 If a certain threshold is set, the data of the computer 2D computer 1 can be used by a known method. After the execution of the missing area, the surface of the illumination area conductor is determined, and the pixel of the process is more.易地-21- 1333543 . Converts the gradient image data into two images. The bright area on the image is the collection area of the first pixel corresponding to the "bright" state on the two image data, and the dark area corresponds to the second pixel collection area of the "dark" state. Be identified. Further, when the degree of formation of the concave defect PF is determined by the area of the dark region, when the number of pixels forming the collection region of the second pixel is counted, the area of the dark region can be simply calculated. On the other hand, if it is determined by the size, the dimension measurement direction is determined in the set region of the second pixel, and then the continuous maximum 値 of the second pixel along the dimension measurement direction is calculated, whereby the size of the dark region can be obtained. . In the following, the algorithm of the processing will be described. If the concave defect PF having the same opening size is the same, as shown in Fig. 7, the deeper the shadow area DA is larger, so that the dark area can be determined. The larger the area or size, the greater the depth of the concave defect PF. In this case, the size of the dark area can be converted into the depth 凹 of the concave defect PF by an operation. As shown in Fig. 7, the optical axis direction of the tilt of the illumination light is projected onto the main surface of the substrate, the orientation is set in the dimension measurement direction, and then the dark area of the dimension measurement direction, that is, the shaded area is obtained on the image. The maximum dimension L of the DA, and then the tilt angle of the optical axis of the illumination light to the normal to the main surface of the substrate is Θ, that is, the dark region (shaded area DA) of the depth Η 凹 of the concave defect PF can be estimated by Leo ste If the area S or the dimension L is larger than the reference 値 (SO, L0), it is considered that a concave defect outside the allowable range is generated in the obtained filled via hole conductor 13 4s in the dark region, and it can be determined that this is -22- 1333543. Bad situation. In addition, the following method is a slightly rough determination method. The threshold is set to be slightly larger and the image is doubled. If there is a pixel that becomes a dark area (shaded area DA), it is not necessary to calculate The area S or the size L of the dark area can also be judged badly. In this case, it is determined that the pixels are all good (qualified) only when the pixels are all in the bright region. Therefore, the product of the pixel setting of the image in the predetermined region is calculated, and the result of the calculation can be determined. Next, the inspection apparatus 1 of FIG. 3 sets the determination result of the position information of the memory-filled via hole conductor formed on the substrate to be inspected and the result of the determination of the quality of the charge via-hole conductor, and the corresponding setting. The determination result output units 8 and 9 of the output quality determination result are mapped to the positions of the respective filled via hole conductors 134s in the substrate region on the output region. In this case, it can be seen at a glance whether or not the filled via hole conductor 134s determined to be defective exists at any position of the substrate bodies SB 1 and SB2 to be inspected. The position information of the filled via hole conductor formed on the substrate to be inspected is recorded in the external memory device 22 as the product via hole position data 22c. As shown in Fig. 4, the data 22c is included in the product number (product type) of each wiring substrate, and the position of each via layer is separately grasped for each dielectric layer. (layer) does not contain coordinate data (for example, a central position coordinate of a circular via hole region) of each of the filled via hole conductors. Further, the determination result memory unit is formed in the external memory device 22 as a memory portion of the via hole failure determination result data 22e. As shown in Fig. 5, the inspection result of the filled via hole conductor is the product number of the wiring board No. -23- 1333543, the lot number of the substrate workpiece W (batch identification information), and the large sheet. The substrate number (substrate identification information) in the substrate workpiece W and the layer number (layer identification information) of the dielectric layer in which the via hole conductor is filled are associated with each other, and the recessed area of each of the filled via hole conductors is recorded. Depth depth and good or bad judgment results. Further, the photographic image data (symbol 22d in Fig. 3) of each of the filled via hole conductors is also recorded. By using the product via hole position data 22c, the coordinate data of the filled via hole conductor of the designated layer is read, and the quality of each of the filled via hole conductors is read from the via hole defect determination result data 22e (determination result memory unit 22). As a result of the determination, as shown in FIG. 8, the coordinates of the coordinates in the corresponding output region can be recognized by the result of the good or bad result (for example, the VA which determines the good VA and the VR which determines the badness are represented by changing the color and shape of the drawing point). (map ping) The result of the determination of each of the filled via hole conductors. The result of the mapping can be output from the monitor 8 and the printer 9 as the determination result output unit connected to the input/output unit 7. </ RTI> Hereinafter, the flow of the image acquisition processing of the inspection apparatus 1 will be described using a flowchart. Fig. 9 is a view showing an image acquisition flow, which is executed by the control software 22a of Fig. 3. First, a large substrate work W is set on the substrate supporting portions 50, 52 of the vertical and horizontal moving table 23, and then the processing flow is started. Thus, the deflection correcting portion 60 is first actuated to open the large substrate workpiece W. To correct the deflection (see Figure 2). Next, S1 of the Fig. 9 is started: initial setting processing. Fig. 10 shows the details of the processing. In S51, the article number and lot number of the substrate are input, and in S52, the number of the layer to be inspected is input, and the product is -24-133343. The other via hole position information 22c (Fig. 4) The position of the body of the filled via hole conductor in the layer is read. Next, at S53, the vertical and horizontal moving table 23 is driven to move the large substrate workpiece W to the origin position, and the camera position adjusting mechanism 61 is operated in S54 to perform the positional alignment in the height direction so that the focus and the origin position of the camera 1 3 c are (horizontal reference plane P0 in Figure 6). Then, the process proceeds to S56, the distance measuring unit 21 measures the distance L from the large substrate workpiece W, and in S57, the camera movement amount L-LO (the aforementioned) to be adjusted is calculated, and then the amount of movement calculated by the camera 13c is reduced only in S58. Align the focus of the surface of the substrate workpiece W. The initial setting process is executed by the above steps, and then the process proceeds to S2 of Fig. 9, and the number of the substrate to be inspected is initialized. Next, at S3, the large substrate workpiece W is moved by the vertical and horizontal moving table 23, and the position of the camera 13c is aligned with the origin position in the substrate of the substrate to be inspected at the designated number in the large substrate workpiece W (for example, The X counter 6b and the Y counter 6c of Fig. 3 are reset by resetting at S4 by an alignment mark formed on the substrate. Next, initialization of the via hole number is performed at S5. The position of the camera 13c is aligned with the designated via hole conductor at S6, and the photographic field of view is set in S7, and the entire via hole conductor is covered in the imaging range. Further, in S8, the image of the filled via hole conductor is taken by the method described, and the taken image is recorded in S9. That is, instead of performing a full-scale image capturing of the substrate to be inspected, each position of the filled via hole conductor is formed in the substrate, and a limited photographic field of view covering the filled via hole conductor is set and individually performed. Image photography processing. Therefore, it is possible to eliminate the use of the image area of the via-hole conductor without any charge, and it is not necessary to expand the resolution of the image of the via hole conductor. Next, it is judged at S10 whether or not there is a next via hole 'If the S11 step-up via hole number is entered, and then the process returns to S6, and the processing is repeated as follows. When it is determined in S10 that there is no one via hole, the photographing process of the substrate body is terminated, and then the process proceeds to S12, and it is checked whether or not the substrate to be inspected which remains uncaptured in the large sheet W is left. If there is a remaining S13, the number of the substrate to be inspected is incremented, and then S3 is repeatedly executed until the processing of S12. At S12, when one of the substrates to be inspected is judged, the image acquisition processing is ended. Fig. 11 is a flow chart showing the process of determining the quality of the body using the acquired image. First, in S101, the identification information (item number, lot number, and base layer) of the inspected substrate body of the object is input, and in S102, the filled via hole conductor material of the corresponding layer is read. At S 1 03, the via hole number is initialized, and the image of the filled via hole conductor at the S 1 04 two-digit number. On the other hand, the image data used in S105 is subjected to determination processing. Fig. 12 is a flow chart showing the processing in accordance with the area of the shaded area. First, in S201, the setting state of the pixel in the shaded area is set to "1", and the setting state of the shaded pixel is "0" (if there is a darkness outside the lead line of the filled via hole) In the case of the background area, the background area and the filled via hole conductor area are extracted by the image processing method, and the image size is increased. Sometimes the line is sent to S 1 0. When the workpiece is inspected, it is returned, and the remaining is returned. The secondary via hole is defined as the edge of the image of the determination board number and the edge of the image area specified by the image area after the determination is -26- 1333543 (edge) line, and then only The inner side of the edge line is used as the determination target area, and the sum of the pixels that become "1" on the image is obtained, and the sum of the pixels is used as the area parameter S of the shaded area. Next, in S202, the area parameter S and the comparison (pass or fail) determination criterion 値SO are compared, and if it is SS SO, it is determined that the charge via hole conductor is qualified, and if it is S > S0, it is judged as unqualified, and then, for example, The result is as shown in Fig. 5 (S203 to S205). On the other hand, Fig. 13 is a flow of processing for determining the depth of depression from the shaded area and then performing the determination by the depth of the recess. The main system of this flow is to determine the dimension of the dimension determined by the seventh figure as the X direction, and to find the continuous number of pixels which are shaded regions (ie, "1") in each pixel column in the X direction. deal with. Specifically, in S251, the Υ direction position is initialized, and in S252, the continuation number L' of the pixel having the shaded area in the X-direction pixel column having the designated Υ coordinate is obtained, and the S253 is sequentially incremented in the Υ direction position and repeatedly executed. S25 2 processing. When the above processing is performed on all the pixel columns of the image area, S25 5 is performed from S254, and the maximum number of consecutive numbers L' of pixels which are shaded areas is obtained, and then the maximum 値 is recognized as the shadow area of the dimension measurement direction. The size L. However, at S256, the depression depth 算出 is calculated by H = Lc〇ste, and then the calculated enthalpy and the reference 値H0 are compared at S257. If it is HSH0, it is judged that the charge via hole conductor is acceptable, and if it is Η > Η 0, it is judged as defective, and then the result is recorded as shown in Fig. 5 (S25 8 to S260). In addition, the illumination angle Θ is constant if the system is constant, so the comparison of the size L of the shadow area and the processing of the reference 値L0 is mathematically equivalent, so that it can also be -27- 1333543. Make a decision. The via hole defect determination result data 22e summarized in Fig. 5 is output from the monitor 8 or the printer 9 in Fig. 3. As shown in Fig. 11 to S107, the position of each of the via holes is read, and the result of the determination at the position of the corresponding via hole is plotted, and the result as shown in Fig. 8 is obtained. In the case of referring to the output result, the number of the substrates to be inspected is determined, that is, for each of the large substrate workpieces, the ink is formed on the substrate body determined to be defective, and the inspection is performed after the inspection is performed. The large-sized substrate workpiece is then cut and separated into individual printed circuit boards, and the substrate to be inspected, which has a defective mark, is screened or separated by manual operation or a known selection device, and the substrate to be inspected without the bad mark is screened and separated. The validity of the inspection method is applied to the experimental results. About 10,000 intermediate wiring boards each having a filling hole having a height of 35 Å and a diameter of 80 μm were prepared, and a filled via hole having a depth of 15 μm or more was previously identified in detail by an optical microscope. Next, using the inspection device of Fig. 1 to change the angle of the line illumination into various kinds of changes, while identifying the filled via holes that produce the concave defects on the 15th, and at the same time comparing the inspection results obtained by the optical display, If the result is consistent, it is regarded as Ϊ. If it is inconsistent, it is regarded as unsuccessful and the inspection is repeated. The specifications for each part of the inspection unit are as follows. (Line Sensor Camera) • Number of pixels: 4096 pixels/line The batch check number from the S 1 08 area. , sifting the concave side of the 40 μιη product to the mirror, if other, -28- 1333543 • Resolution: 5μιη / pixel • Focus distance: 125mm (line lighting device) • Halogen light ) 'Lens with a concentrating distance of 100 mm. The results of the above experiments are listed in Table 1. (Table 1) Number Angle Θ Success probability (%) 1 5 0 2 15 0 3 25 100 4 35 100 5 45 95 6 55 95 7 65 90 8 75 8 5 9 85 0
依上述之結果照明之角度Θ在20°以上80°以下時檢查 的成功或然率（probability)高，20°以上 60°以下時成功的 或然率更高。又，得知2 0 °以上6 0 °以下時能得出約1 0 〇 % 的成功或然率。 【圖式簡單說明】 第1圖係爲表示本發明的檢査裝置之一實施形態之正 面模式圖。 第2圖係爲表示大張基板工件設定成縱橫移動台之狀 -29- Ι33·3543 • •態之模式圖。 .. 第3圖係爲表示第1圖之檢查裝置之電氣上之構成之 〜例之方塊圖。 第4圖係依製品別區分之通路孔位置資料的槪念圖。 * 第5圖係通路孔不良判定結果資料槪念圖。 第6圖係基板撓曲量之測定槪念圖。 第7圖係本發明之檢査方法的原理說明圖。 第8圖係執行通路孔檢查結果之映對（mapping)之槪念 鲁 圖。 第9圖係表示影像取得處理流程之流程圖。 第10圖係表示第9圖之初始設定處理之詳細之流程圖 〇 第1 1圖係表示通路孔之良否判定處理之流程之流程 圖。 第1 2圖係表示第1 1圖之判定處理之詳細之第丨例之 流程圖。 Φ 第13圖係表示第11圖之判定處理之詳細之第2例之 流程圖。 第14圖係保形通路孔的槪念圖。 第15圖係充塡通路孔導體及使用此種導體之堆疊通 路孔槪念圖。 第16圖係爲表示在充塡通路孔導體上之凹狀缺陷之 發生狀況之模式圖。 第17圖係爲表示做爲本發明之適用對象之配線基板 -30- 1333543 .之斷面構造之模式圖。 【主要元件符號說明】 1 檢 查 信 號 12 影 像 處 理 單 元 (影 像 資 訊 產 生 單元） 13c 線 感 知 器 相 機 (攝 影 裝 置 ) 22 外 部 記 憶 裝 置 (判 定 結 果 記 憶 部） 25 昭 j» 明 裝 置 100 配 線 基 板 L 1，L2 配 線 積 層 部 134s 充 塡 通 路 孔 導 體 SB 1 ,SB2 … 被 檢 査 基 板 體 LB 照 明 光 PF 凹 狀 缺 陷 DA 陰 影 1品 域 W 大 張 基 板 工 件According to the above results, the success rate of the inspection when the angle of illumination 20 is 20° or more and 80° or less is high, and the probability of success is higher when the angle is 20° or more and 60° or less. Further, when it is known that 20 ° or more and 60 ° or less, a success probability of about 10 〇 % can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view showing an embodiment of an inspection apparatus according to the present invention. Fig. 2 is a view showing a mode in which a large substrate is set as a vertical and horizontal moving table. -29- Ι33·3543 • • State. Fig. 3 is a block diagram showing an electrical configuration of the inspection apparatus of Fig. 1. Figure 4 is a commemorative map of the location of the via hole according to the product. * Figure 5 is a data diagram of the results of the hole hole determination. Fig. 6 is a diagram showing the measurement of the amount of deflection of the substrate. Fig. 7 is a schematic view showing the principle of the inspection method of the present invention. Figure 8 is a commemoration of the mapping of the results of the via hole inspection. Fig. 9 is a flow chart showing the flow of image acquisition processing. Fig. 10 is a flow chart showing the details of the initial setting processing of Fig. 9 〇 Fig. 11 is a flow chart showing the flow of the determination of the quality of the via hole. Fig. 12 is a flow chart showing a detailed example of the determination process of Fig. 11. Φ Fig. 13 is a flow chart showing a second example of the detailed determination process of Fig. 11. Figure 14 is a conceptual view of the conformal via hole. Figure 15 is a diagram of a filled via conductor and a stacked via hole using such a conductor. Fig. 16 is a schematic view showing the occurrence of a concave defect on the via hole conductor. Fig. 17 is a schematic view showing a sectional structure of a wiring board -30- 1333543 which is an object of the present invention. [Explanation of main component symbols] 1 Check signal 12 Image processing unit (image information generating unit) 13c Line sensor camera (photographic device) 22 External memory device (judgment result memory unit) 25 Display device 100 Wiring board L1 L2 wiring laminate portion 134s filled via hole conductors SB 1 , SB2 ... inspected substrate body LB illumination light PF concave defect DA shadow 1 domain W large substrate workpiece
•3 1-•3 1-