CN101083875A - Perforating device for printed circuit wiring board and reference perforating method - Google Patents
Perforating device for printed circuit wiring board and reference perforating method Download PDFInfo
- Publication number
- CN101083875A CN101083875A CN 200710105845 CN200710105845A CN101083875A CN 101083875 A CN101083875 A CN 101083875A CN 200710105845 CN200710105845 CN 200710105845 CN 200710105845 A CN200710105845 A CN 200710105845A CN 101083875 A CN101083875 A CN 101083875A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- datum hole
- back side
- location
- positive back
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The present invention provides a perforation device, which sets a Y axis mobile station frame (30, 40) on the X axis mobile station frame (10) and a X axis mobile station frame (50) on the Y axis mobile station frame (40). Furthermore, to configure the Y axis mobile station frame (60) on the X axis mobile station frame (20). To collect image for multilayer printing circuit layout board using a X-ray camera (36, 66) installed on the Y axis mobile station frame (30, 60), then to decide the position of the benchmark hole for orientation and identifying front and back according to the image collection data. To move the aiguilles (34, 54, 64) on the X axis mobile station frame (50) and Y axis mobile station frame (30, 60) to each position of the benchmark hole using a perforation device mobile mechanism, and to lift the aiguilles (34, 54, 64) using aiguille lifting mechanism, so as to implement perforation on the printing circuit layout board at the same time.
Description
Technical field
Punching machine that the present invention relates on printed circuit board, bore a hole and datum hole method for punching.
Background technology
Multilayer printed wiring board is made of the conductor layer of the conductor layer that exposes at front and back, a plurality of internal layers of not exposing.Between conductor layer, dispose the substrate of insulating properties, conductor layer is bondd mutually by this substrate.
In general multilayer printed wiring board is to utilize following operation manufacturing.
At first, prepare the circuitron wiring plate that the internal layer of regulation sheet number is used.Each circuitron wiring plate is made of insulating barrier (substrate) and the electrically conductive film (being generally Copper Foil) that is disposed at the two sides of this insulating barrier.On each circuitron wiring plate that internal layer is used, offer 2 datum holes of location usefulness and the datum hole of positive back side identification usefulness in advance.With these datum holes is benchmark, and the electrically conductive film of both sides is carried out etching, and (pattern is handled: patterning), form conductive pattern on the two sides of substrate.Conductive pattern comprises: the pattern of the guiding mark of the position of the datum hole of the newly-installed positive back side identification usefulness of pattern, conduct expression of the guiding mark (guide mark) of the position of the pattern of forming circuit, the newly-installed datum hole of conduct expression etc.On each circuitron wiring plate that the internal layer that constitutes a multilayer printed wiring board is used, be formed with identical datum hole.
The operation of the circuitron wiring plate that has formed conductive pattern being carried out overlapping and aligned position is called superimposed (Lay up).Superimposed in order to carry out, prepare with position that datum hole cooperates on plugged the jig plate of pin.In addition, for the conductive pattern of each layer aligned position more exactly, also form the new datum hole of superimposed usefulness sometimes.
The datum hole of a slice circuitron wiring plate inserted wear pin and be placed on jig plate.Place the preceding baseplate material (being known as preforming material) of heating of having offered datum hole thereon.And then, the datum hole of another sheet circuitron wiring plate is inserted the pin of wearing jig plate, and make itself and preforming material overlapping.In this stage with two double sided wired plates with to be disposed at the periphery of preforming material therebetween temporary fixed and finish superimposed.
On the two sides of two superimposed circuitron wiring plates, place preforming material and as the Copper Foil of conductor material, by hot pressing with its pressurized, heated.So preforming material generation thermmohardening and become (insulation) substrate is finished the bonding between each conductor.
On multilayer printed wiring board, offer the datum hole of with interior layer pattern corresponding datum hole and positive back side identification usefulness thereafter.Based on this datum hole, carry out the pattern processing of outermost Copper Foil, the formation of through hole etc.Then, utilize machining to cut out required outer shape, finish multilayer printed wiring board.
Here, in order to process multilayer printed wiring board, its positive back side correctly need be positioned over processing unit (plant).But the just back of the body two outsides of carrying out the multilayer printed wiring board after the pressurized, heated by hot pressing are covered by conductor layer.Thus, be difficult to the naked eye differentiate the positive back side of multilayer printed wiring board.Therefore, on multilayer printed wiring board, the circuitron substrate of using with internal layer is identical, is formed for easily discerning the datum hole of the positive back side identification usefulness at the positive back side.
On circuitron substrate or multilayer printed wiring board etc., the punching machine of offering the datum hole of positive back side identification usefulness with datum hole with the location is published in the following patent documentation 1,2.
[patent documentation 1]: Japanese kokai publication hei 5-228800 communique
[patent documentation 2]: No. 3248092 communique of Japan Patent
Punching machine shown in patent documentation 1 and the patent documentation 2 is offered the datum hole of positive back side identification usefulness behind the datum hole of having offered location usefulness.Therefore just need at least two manufacturing procedures, long processing time, the many problems of cost cost are arranged.
Summary of the invention
The objective of the invention is to, provide and on multilayer printed wiring board, to offer datum hole is used in the location with datum hole and the identification of the positive back side punching machine and datum hole method for punching with less man-hour, lower cost.
In addition, another object of the present invention is to, in the compression process cost, on multilayer printed wiring board, form and locate with datum hole and positive back side identification datum hole.
In order to reach above-mentioned purpose, the punching machine that viewpoint of the present invention relates to is characterized in that, possesses:
Workbench is placed printed circuit board; Image mechanism is made a video recording to the printed circuit board that is positioned over above-mentioned workbench; Datum hole position mechanism for identifying, according to the photographed images of above-mentioned image mechanism, the formation precalculated position of datum hole is used in a plurality of location of obtaining above-mentioned printed circuit board with datum hole and the identification of the positive back side; Location datum hole punch unit, it has first perforating tool, above-mentioned first perforating tool is moved and with the first instrument travel mechanism of above-mentioned printed circuit board perforation along Z-direction, and offers above-mentioned location datum hole on above-mentioned printed circuit board; Move with the datum hole punch unit above-mentioned image mechanism and above-mentioned location with datum hole punch unit travel mechanism the location on perpendicular to the XY axial plane of above-mentioned Z-direction; Positive back side identification datum hole punch unit, it possesses second perforating tool, above-mentioned second perforating tool is moved and with the second instrument travel mechanism of above-mentioned printed circuit board perforation along above-mentioned Z-direction, and offers above-mentioned positive back side identification datum hole on above-mentioned printed circuit board; Positive back side identification datum hole punch unit travel mechanism, it makes above-mentioned positive back side identification move on above-mentioned XY plane with the datum hole punch unit.
In addition, in order to reach above-mentioned purpose, the datum hole method for punching that relates to of viewpoint of the present invention is to form a plurality of location datum hole and the datum hole method for punching of positive back side identification with datum hole on printed circuit board, it is characterized in that, above-mentioned printed circuit board is made a video recording, use the image of being made a video recording, the formation precalculated position of datum hole is used in the location of obtaining above-mentioned printed circuit board with datum hole and the identification of the positive back side, first perforating tool is moved to the formation precalculated position that datum hole is used in the above-mentioned location of being tried to achieve, second perforating tool is moved to the formation precalculated position that datum hole is used in the above-mentioned positive back side identification of being tried to achieve, utilize above-mentioned first and above-mentioned second perforating tool, form the location concurrently and discern with the datum hole and the positive back side and use datum hole.
According to punching machine of the present invention, can form concurrently simultaneously and locate with datum hole and positive back side identification datum hole.Like this, just can compress the number of perforation process, compression process time, compression process cost.
According to datum hole method for punching of the present invention, can form two holes simultaneously concurrently.So just can compress the number of perforation process, compression process time, compression process cost.
Description of drawings
Fig. 1 is the stereogram of the related punching machine of embodiments of the present invention.
Fig. 2 is the figure of configuration of the major part of expression punching machine shown in Figure 1.
Fig. 3 is the block diagram of formation of the control device of expression punching machine shown in Figure 1.
Fig. 4 is the example of datum hole is used in expression multilayer printed wiring board and location with datum hole and the identification of the positive back side figure.
Fig. 5 is the flow chart of the perforation action of expression punching machine shown in Figure 1.
Fig. 6 is the figure of configuration of major part of the punching machine of expression other execution modes of the present invention.
Embodiment
With reference to Fig. 1, the punching machine 1 related to embodiments of the present invention describes.
The mechanical coordinate of mark system (initial point O, X, Y, Z) is fixed in the static part (for example basket 1a or stand 3) of punching machine 1 in Fig. 1.The moving direction of various mechanical parts is set to parallel with this reference axis.In addition, the arrow YA of the blank of Fig. 1 represents position and the direction (positive direction of Y-axis) of operator towards punching machine 1.The operator is positioned over punching machine 1 with workpiece (as the multilayer printed wiring board of perforation object), if punch off is then taken out from punching machine 1.The placement of workpiece also can utilize carrying device to carry out with taking-up.Carrying device for example is made of the manipulator that has possessed the absorber that utilizes air adsorption multi-layer printed circuit board.
On stand 3, be equipped with and X-axis parallel linear guides 4.Utilize line slideway 4 to support 2 X-axis movably and move stand 10,20 along X-direction.On stand 3, also with line slideway 4 abreast and the shape ground that is in line dispose ball screw 5a, 5b (below be generically and collectively referred to as ball screw 5) side by side.Ball screw 5a and 5b make X-axis move the member that stand 10,20 moves respectively, are configured under the bottom surface that X-axis moves stand 10,20.Move in each X-axis on the bottom surface of stand 10,20, be separately installed with the nut (diagram slightly) that engages with ball screw 5a, 5b.
2 X-axis move stand the 10, the 20th, have the flute profile of bottom surface (base plate), wall portion and top (upper plate), and the opening portion of groove is faced mutually.On each X-axis moves stand 10,20, be fixed with X ray generation device 11,21 respectively.
Move in X-axis on the bottom surface of stand 10, line slideway 12 and ball screw 13 are installed abreast with Y-axis.Utilize line slideway 12 to support moving stand 30 of y-axis shift and the moving stand 40 of y-axis shift movably along Y direction.
The moving stand 30 of y-axis shift has bottom surface (base plate), wall portion and top (upper plate), is X-axis is moved the flute profile that stand 20 sides have been opened.In addition, the moving stand 40 of y-axis shift has bottom surface (base plate) He Bibu, is that X-axis is moved the angle bar shape of the wall portion side of stand 10 as wall portion.Downside in the bottom surface of the moving stand 30 of y-axis shift is equipped with nut (diagram slightly).The ball screw 13 that this nut and X-axis move on the bottom surface of stand 10 engages (screwing togather).
Wall portion at the moving stand 30 of y-axis shift is equipped with nut 31.In addition, the wall portion at the moving stand 40 of y-axis shift is equipped with the ball screw parallel with Y-axis 41.Nut 31 engages with ball screw 41.Therefore, when the moving stand 30 of y-axis shift when Y direction moves, the moving stand 40 of y-axis shift also can move (driven) along Y direction.In addition, by swing roller screw rod 41, the moving stand 40 of y-axis shift is moved along Y direction with respect to the moving stand of y-axis shift 30.
On the moving stand 30 of y-axis shift, dispose the X-ray protection pipe 32 that X ray is produced the X ray guiding x ray camera 36 that produces in the source 11.With X-ray protection pipe 32 position side by side, be provided with the cylinder 33 that pressing plate 33a is moved up and down.Pressing plate 33a is set at the top downside of the moving stand 30 of y-axis shift, has the function of pushing multilayer printed wiring board.For example be formed with circular hole on pressing plate 33a, prevention conflicts with drill bit 34.In addition, on the bottom surface of the moving stand 30 of y-axis shift, the drill bit that drill bit 34 is housed is installed moves stand 35 and x ray camera 36.Drill bit moves the Z microscope carrier formation of stand 35 by the position (highly) of the Z-direction of regulating drill bit 34.Rise along Z-direction by making drill bit move stand 35, drill bit 34 is risen, the drill bit 34a that is controlled with drill bit 34 offers the hole on multilayer printed wiring board 70.
On the moving stand 40 of y-axis shift, accommodate X-axis and move stand 50.Wall portion at the moving stand 40 of y-axis shift is equipped with ball screw 42 abreast with X-axis.The X-axis that is installed in the nut 51 that engages with screw rod 42 moves for example wall portion of stand 50.By swing roller screw rod 42, X-axis can be moved stand 50 is that benchmark moves along X-direction with the moving stand 40 of y-axis shift.
X-axis move stand 50 have above (upper plate), wall portion and bottom surface (base plate), form X-axis moved the flute profile that stand 20 sides have been opened.On on X-axis moves stand 50, be provided with the cylinder 53 that pressing plate 53a is moved up and down.The X-axis of being located at pressing plate 53a moves the top downside of stand 50, has the function of pushing multilayer printed wiring board 70.On pressing plate 53a, for example be formed with circular hole, prevention conflicts with drill bit 54.
In the bottom surface that X-axis moves stand 50, the drill bit that drill bit 54 is housed is installed moves stand 55.Drill bit moves stand 55 makes drill bit 54 move along Z-direction.By drill bit 54 is risen, can on multilayer printed wiring board 70, offer the hole with the drill bit 54a that drill bit 54 is controlled.
Move in X-axis on the bottom surface of stand 20, line slideway 22 and ball screw 23 are installed abreast with Y-axis.Utilize the moving stand 60 of line slideway 22 supporting y-axis shifts.
The moving stand 60 of y-axis shift has bottom surface (base plate), wall portion and top (upper plate), forms X-axis is moved the flute profile that stand 10 sides have been opened.The downside that moves the bottom surface of stand 60 at y-axis shift is equipped with nut (diagram slightly), and this nut engages with ball screw 23.
On on the moving stand 60 of y-axis shift, dispose X-ray protection pipe 62.In addition, be provided with the cylinder 63 that pressing plate 63a is moved up and down with it abreast.Pressing plate 63a is located at the top downside of the moving stand 60 of y-axis shift, has the function of pushing multilayer printed wiring board 70.On pressing plate 63a, in order to prevent and the conflicting of drill bit 64, for example be formed with circular hole, prevention conflicts with drill bit 64.
On the bottom surface of the moving stand 60 of y-axis shift, the drill bit that x ray camera 66 is installed, drill bit 64 is housed moves stand 65.Drill bit moves stand 65 by drill bit 64 is constituted along the Z microscope carrier that Z-direction moves.Rise along Z-direction by making drill bit move stand 65, drill bit 64 is risen, and on multilayer printed wiring board 70, offer the hole with drill bit 64a.
On movable stage 2, drill jig (anchor clamps) plate 80 is installed.The shape of bushing plate 80 and the multilayer printed wiring board 70 of being bored a hole, size etc. are produced accordingly.Be installed on the movable stage 2 with multilayer printed wiring board 70 corresponding bushing plates 80 as the perforation object.In the central authorities of bushing plate 80, be provided with adsorption section 81.Movable stage 2 will be fixing as multilayer printed wiring board 70 absorption of perforation object by adsorption section 81.On bushing plate 80, on the perforation precalculated position of the multilayer printed wiring board 70 of correspondence, be provided with drill jig hole 83, so that when on multilayer printed wiring board 70, offering the hole, can not conflict with drill bit or drill bit.
Pressing plate 33a, the X-axis of the moving stand 30 of y-axis shift moves the pressing plate 53a of stand 50 and the pressing plate 63a of the moving stand 60 of y-axis shift pushes multilayer printed wiring board 70, fix to bushing plate 80.In addition, also X ray generation device 11,21 can be located at the top of the moving stand 30,60 of y-axis shift, the X-ray protection that moves on the stand 30,60 with y-axis shift constitutes pipe integratedly.
Among Fig. 1 and Fig. 2, though not shown, supporting the ball screw of movable stage 2, the ball screw of the stand 3 of packing into etc. is by electric motor driven.The control of these motor etc. is carried out according to control signal by control device 90.
Input and output portion 96 is by formations such as serial line interface, LAN (Local Area Network) interfaces.The picture signal that control part 91 is made a video recording from x ray camera 36,66 inputs via input and output portion 96.In addition, control part 91 outputs drive X-axis and move the drive signal that stand 10,20,50, the moving stand 30,40,60 of y-axis shift, movable stage 2 and drill bit move the drive motor of stand 35,55,65.In addition, control part 91 is via input and output portion 96, moves the linear staff of stand 10,20,50, the moving stand 30,40,60 of y-axis shift, movable stage 2 according to X-axis, imports the positional information of each stand or workbench etc.
Below, with reference to the flow chart of Fig. 5, the punching machine 1 of above formation is offered the action of discerning with datum hole 73 with the datum hole 71,72 and the positive back side location describe on multilayer printed wiring board 70.
As the multilayer printed wiring board 70 clamping preforming materials of perforation object multi-disc printed on both sides substrate is carried out overlapping, and at overlapping preforming material in its both sides and Copper Foil, under this state with the preforming material thermmohardening.
On each printed on both sides substrate, be formed with conductive pattern.This conductive pattern comprises: be used to determine the mark of the position of multilayer printed wiring board 70, the mark at the positive back side of expression, the mark of expression direction.The mark of location usefulness is configured in the formation precalculated position of location with datum hole 71,72.
The location with datum hole 71 be configured in rectangle multilayer printed wiring board 70 one side near.In addition, the location with datum hole 72 be configured in this opposed opposed edge in one side near.The identification of the positive back side for example be configured in datum hole 73 one side of having disposed location usefulness datum hole 71 near.And the location is configured in to link with datum hole 73 with datum hole 71,72 and the identification of the positive back side and locatees with datum hole 71 and the line segment and binding location line segment vertical position with datum hole 71,72 of positive back side identification with datum hole 73.
The positive back side of multilayer printed wiring board 70 is covered by Copper Foil, can't with the naked eye discern each mark.But 36,66 pairs of punching machine 1 usefulness x ray cameras are formed at the mark of the Copper Foil on the printed on both sides substrate of internal layer and make a video recording.Punching machine 1 is offered with datum hole 73 with datum hole 71,72 and the identification of the positive back side the location based on the image of each mark in the photographed images of x ray camera 36,66.
When connecting the power supply of punching machine 1, the control part 91 of punching machine 1 is at first carried out initialization process.Next, control part 91 beginnings perforation shown in Figure 5 is handled.
Next, control part 91 information as the input of the multilayer printed wiring board 70 of object of will urging is shown in (step S2) in the display part 95, waits for that multilayer printed wiring board 70 is placed (step S3).
The operator is positioned over multilayer printed wiring board 70 assigned position of the bushing plate 80 that is arranged on the movable stage 2.This assigned position is in follow-up step S4, and in movable stage 2 was moved along Y direction, x ray camera 36 can be to making a video recording with the position of datum hole 71 corresponding marks with the location.In order to make the operator see this assigned position easily clearly, for example on bushing plate 80, describe the rectangle suitable with the profile of multilayer printed wiring board 70.After having placed multilayer printed wiring board 70, the operator operates input and output portion 96, will drop into and finish to inform control part 91.
Even moving predetermined distance, also can't detect and locate with under the situation of datum hole 71 corresponding marks (step S5:NO), control part 91 just is judged as the direction difference of multilayer printed wiring board 70.Control part 91 demonstrates information in display part 95, inform the different situation (step S6) of direction of multilayer printed wiring board 70 to the operator, and processing is turned back to step S2.
Under can detecting and locate with the situation of datum hole 71 corresponding marks (step S5:YES), control part 91 judges according to the photographed images of x ray camera 36 whether multilayer printed wiring board 70 correctly is provided with (step S7) with the positive back side.Specifically, control part 91 is differentiated the position relation of using datum hole 73 according to the mark corresponding to locating with benchmark 71 in the image of being made a video recording with the positive back side, and whether the positive back side of differentiating multilayer printed wiring board 70 is correct.
Be judged as under the incorrect situation in the positive back side of multilayer printed wiring board 70 (step S7:NO), control part 91 will represent that the incorrect information in the positive back side of multilayer printed wiring board 70 is shown in (step S8) in the display part 95, and processing is turned back to step S2.
Under the correct situation in the positive back side that is judged as multilayer printed wiring board 70 (step S7:YES), control part 91 is based on the photographed images of the x ray camera 36 in the moving stand 30 of the y-axis shift of packing into, obtains and the location of multilayer printed wiring board 70 coordinate with the center of the corresponding mark of datum hole 71.In addition, pack into 66 pairs of multilayer printed wiring boards 70 of x ray camera of the moving stand 60 of y-axis shift of control part 91 usefulness are made a video recording, according to this photographed images, obtain the coordinate of using the center of datum hole 72 corresponding marks with the location of multilayer printed wiring board 70.
When the correction of the position of drill bit 34,64 finished, control device 90 reduced pressing plate 33a, 63a, with multilayer printed wiring board 70 by press fit.
Next, (step S10) revised in the position of 91 pairs of drill bits 54 of control part.If be described more specifically, then be that the multilayer printed wiring board 70 that is arranged on the bushing plate 80 has rotated slightly around the Z axle.That is, the XY axle in the mechanical coordinate system is with to link the axle that is equivalent to locate with the centre coordinate of the mark of datum hole 71,72 inconsistent, and produces error.Because the influence of this error, the identification of the positive back side is with also can the offset amount of this anglec of rotation of the position of opening of datum hole 73.So just need to revise the position of drill bit 54.Therefore, control part 91, calculates and tries to achieve the centre coordinate of positive back side identification with datum hole 73 with the centre coordinate of datum hole 71, the centre coordinate that the mark of datum hole 72 is used in the location according to the location.And control part 91 moves drill bit 54, makes that the center of drill bit 54 is consistent with the centre coordinate of datum hole 73 with the identification of the positive back side.Under the situation that drill bit 54 is moved along Y direction, control part 91 is the moving stand 40 of mobile y-axis shift by driving ball screw 41, makes X-axis on the moving stand 40 of y-axis shift move stand 50 and drill bit 54 moves.In addition, under the situation that drill bit 54 is moved along X-direction, control part 91 drives ball screws 42, and with respect to the moving stand 40 of y-axis shift X-axis is moved stand 50 and move along X-direction, thus mobile drill bit 54.
Next, control part 91 each drill bit 34,54,64 of control, and on multilayer printed wiring board 70, offer the location and discern with datum hole 73 (step S11) with the datum hole 71,72 and the positive back side.Be that at first, control part 91 control cylinders 53 reduce the pressing plate 53a that X-axis moves stand 50, push multilayer printed wiring board 70 if specifically describe.Next, control part 91 makes drill bit 34a, 54a, the 64a rotation of each drill bit 34,54,64.Under this state, control part 91 makes drill bit move stand 35,55,65 to rise simultaneously, utilize drill bit 34a, 54a, 64a, on multilayer printed wiring board 70, offer the location with datum hole 71,72 and the identification of the positive back side with datum hole 73.
When punch off, control part 91 makes drill bit move stand 35,55,65 declines, stops the rotation of drill bit 34,54,64.Next, control part 91 each cylinder 33,53,63 of control promote pressing plate 33a, 53a, 63a, remove fixing (the step S12) of multilayer printed wiring board 70.
Next, control part 91 moves movable stage 2 along Y direction, and moves to the position that the operator can take out the multilayer printed wiring board 70 that has been perforated, and next, makes movable stage 2 return original position (step S13).In addition, control part 91 makes drill bit 34,54,64 return the position (step 14) of standby.
Then, the number of the multilayer printed wiring board 70 that control part 91 will hereto be bored a hole adds 1, according to this number, has judged whether still imperforated remaining multilayer printed wiring board 70 (step S15).Under the situation that remaining multilayer printed wiring board 70 is arranged (step S15:YES), control part 91 turns back to step S2 with processing, continues perforation and handles.Under the situation that does not have remaining multilayer printed wiring board 70 (step S15:NO), control part 91 finishes a series of action.
As above shown in the explanation, the punching machine 1 of present embodiment is side by side offered the location and is discerned with datum hole 73 with the datum hole 71,72 and the positive back side.Therefore, compare with the device of the datum hole 73 of positive back side identification usefulness with datum hole 71,72, can reduce process time, manufacturing procedure and the processing cost of multilayer printed wiring board 70 with in turn offering the location.
In addition, the moving stand 40 of y-axis shift can be driven in moving stand 30 ground of y-axis shift and move along X-direction and Y direction, or moves along X-direction and Y direction independently with moving of the moving stand 30 of y-axis shift.Therefore, when make the moving stand 30 of y-axis shift and 40 distance with as the distance D 2 of the multilayer printed wiring board 70 of perforation object when consistent, if the moving stand 30 of y-axis shift is aimed at, then the moving stand 40 of y-axis shift just automatically becomes by the state of rough alignment.Therefore, the moving stand 40 of y-axis shift can only be realized correct aligning by finely tuning its position.
In addition,, the position of x ray camera 36 and drill bit 34, x ray camera 66 and drill bit 64 is fixed because concerning, therefore according to the camera data of x ray camera 36,66, and can be so that the aligning of drill bit 34,64 be more easy.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various distortion.
For example, will be arbitrarily as the multilayer printed wiring board 70 fixing methods of perforation object.For example, in the above-described embodiment,, also can be made as one or more pressing plates 82 as shown in Figure 6 though on each drill bit 34a, 54a, 64a, disposed pressing plate 33a, 53a, 63a.In addition, though cylinder 33,53,63 is disposed at stand 30,50,60 respectively, cylinder 81 that also can be as shown in Figure 6 is such, is fixed in basket 1a.
In the above-described embodiment, drill bit stand 35,65 is from not moving along X-axis and Y direction on the moving stand 10,20 of y-axis shift.But, also can make drill bit move stand 35,65 and also can move along X-direction and Y direction.In this case, for example, also can utilize X-axis to move stand 10,20,50 drill bit 34,64 bigger mobile and moving the moving of stand 30,40,60 of y-axis shift carried out, under the situation of trim locations, carry out with drill bit stand 35,65.In this case, for example as long as following operation, promptly, make a video recording with datum hole 71,72 with 36,66 pairs of location of x ray camera, making X-axis move the moving stand 30,40,60 of stand 10,20,50 and y-axis shift according to this camera data moves, and then make a video recording with x ray camera 36,66, carry out the fine setting of drill bit 34,64 positions with drill bit stand 35,65.
In the above-described embodiment, though image mechanism constitute by x ray camera, yet under the situation that belongs to the perforate object that can utilize the unaided eye discrimination position of opening, also can use typical CCD camera from the outside.
In addition, the location that is formed on the multilayer printed wiring board 70 also can be more than 2 with the number of datum hole 71,72.In this case, as long as increase the number that the X-axis that the moving stand 60 of y-axis shift is housed moves stand 20.
In addition, also can increase the number of positive back side identification with datum hole 73.In this case, also can be on the moving stand 40 of y-axis shift, link with y-axis shift and move the identical stand of stand 40.In addition, also can be on the moving stand 60 of y-axis shift, link the one or more stands that move identical other of stand 40 with y-axis shift.
In addition, in the present embodiment, though, also can constitute the printed on both sides substrate of multilayer printed wiring board 70 as workpiece with being used to the workpiece of multilayer printed wiring board 70 as processing object.
Claims (6)
1. punching machine is characterized in that possessing:
Workbench (2) is placed printed circuit board (70);
Image mechanism (36,66) is made a video recording to the printed circuit board (70) that is positioned over above-mentioned workbench;
Datum hole position mechanism for identifying (90), according to the photographed images of above-mentioned image mechanism (36,66), the formation precalculated position of datum hole (73) is used in a plurality of location of obtaining above-mentioned printed circuit board (70) with datum hole (71,72) and the identification of the positive back side;
The location is with datum hole punch unit (34,34a, 35,64,64a, 65), it possesses: first perforating tool (34a, 64a), above-mentioned first perforating tool (34a, 64a) is moved and with the first instrument travel mechanism (35,65) of above-mentioned printed circuit board (70) perforation along Z-direction, and offer above-mentioned location with datum hole (71,72) on above-mentioned printed circuit board (70);
The location is with datum hole punch unit travel mechanism (4,5,12,13,22,23), and it makes above-mentioned image mechanism (36,66) and above-mentioned location move on the XY axial plane vertical with above-mentioned Z-direction with datum hole punch unit (34,34a, 35,64,64a, 65);
The identification of the positive back side is with datum hole punch unit (54,54a, 55), it possesses: second perforating tool (54a), above-mentioned second perforating tool (54a) is moved and with the second instrument travel mechanism (55) of above-mentioned printed circuit board (70) perforation along above-mentioned Z-direction, and offer above-mentioned positive back side identification with datum hole (73) on above-mentioned printed circuit board (70);
The identification of the positive back side is with datum hole punch unit travel mechanism (12,13,31,41,42,51), and it makes above-mentioned positive back side identification move on above-mentioned XY plane with datum hole punch unit (54,54a, 55).
2. punching machine according to claim 1 is characterized in that,
Said reference hole site mechanism for identifying (90) uses the photographed images of above-mentioned image mechanism (36,66), the formation precalculated position of datum hole (73) is used in the above-mentioned location of obtaining the above-mentioned printed circuit board (70) that is positioned over above-mentioned workbench with datum hole (71,72) and above-mentioned positive back side identification
Above-mentioned location moves to the formation precalculated position with datum hole (71,72), above-mentioned location that said reference hole site mechanism for identifying (90) tried to achieve with datum hole punch unit travel mechanism (4,5,12,13,22,23) with above-mentioned first perforating tool (34a, 64a)
The identification of the above-mentioned positive back side will above-mentioned second perforating tool (54a) moves to the formation precalculated position that usefulness datum hole (73) is discerned at the above-mentioned positive back side that said reference hole site mechanism for identifying (90) tried to achieve with datum hole punch unit travel mechanism (12,13,31,41,42,51)
The above-mentioned first and second instrument travel mechanisms (35,55,65) move along above-mentioned Z-direction by making above-mentioned first and second perforating tools of having aimed at (34a, 54a, 64a), form above-mentioned location respectively with datum hole (71,72) and above-mentioned positive back side identification usefulness datum hole (73).
3. punching machine according to claim 1 is characterized in that,
Above-mentioned location makes above-mentioned image mechanism (36,66) and mobile under the state that keeps its distance corresponding to above-mentioned first perforating tool (34a, 64a) of above-mentioned image mechanism (36,66) with datum hole punch unit travel mechanism (4,5,12,13,22,23).
4. punching machine according to claim 1 is characterized in that,
The identification of the above-mentioned positive back side is being kept and above-mentioned location is moved the above-mentioned positive back side down with the state of the distance between the datum hole punch unit (34,34a, 35) and discerned and use datum hole punch unit (54,54a, 55) with datum hole punch unit travel mechanism (12,13,31,41,42,51).
5. punching machine according to claim 1 is characterized in that,
Above-mentioned positive back side identification possesses with datum hole punch unit travel mechanism (12,13,31,41,42,51):
Make the identification of the above-mentioned positive back side with datum hole punch unit (54,54a, 55) be driven in an above-mentioned location with the mobile mechanism of the above-mentioned X-direction of datum hole punch unit (34,34a, 35) and above-mentioned Y direction,
Make the identification of the described positive back side with datum hole punch unit (54,54a, 55) and an above-mentioned location with the above-mentioned X-direction of datum hole punch unit (34,34a, 35) and the mobile mechanism that moves independently of above-mentioned Y direction.
6. a datum hole method for punching is to go up a plurality of location of formation at printed circuit board (70) to use datum hole (71,72) and the identification of the positive back side with the datum hole method for punching of datum hole (73), it is characterized in that,
Above-mentioned printed circuit board (70) is made a video recording, uses the image of being made a video recording, obtain the location of above-mentioned printed circuit board (70) and discern the formation precalculated position of using datum hole (73) with the datum hole (71,72) and the positive back side,
First perforating tool (34a, 64a) is moved to the formation precalculated position that datum hole (71,72) is used in the above-mentioned location of being tried to achieve,
Second perforating tool (54a) is moved to the formation precalculated position that datum hole (73) is used in the above-mentioned positive back side identification of being tried to achieve,
Utilize above-mentioned first and above-mentioned second perforating tool (34a, 54a, 64a), form the location concurrently with datum hole (71,72) and positive back side identification datum hole (73).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006150707A JP4210692B2 (en) | 2006-05-30 | 2006-05-30 | Drilling device |
| JP2006-150707 | 2006-05-30 | ||
| JP2006150707 | 2006-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101083875A true CN101083875A (en) | 2007-12-05 |
| CN101083875B CN101083875B (en) | 2010-06-02 |
Family
ID=38853173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101058457A Expired - Fee Related CN101083875B (en) | 2006-05-30 | 2007-05-30 | Perforating device for printed circuit wiring board and reference perforating method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4210692B2 (en) |
| CN (1) | CN101083875B (en) |
| TW (1) | TW200810634A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343507A (en) * | 2010-07-30 | 2012-02-08 | 信义汽车玻璃(深圳)有限公司 | Method for mounting and positioning automobile glass accessory |
| WO2015096667A1 (en) * | 2013-12-27 | 2015-07-02 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN104858465A (en) * | 2014-02-21 | 2015-08-26 | 维亚机械株式会社 | Backdrilling method, and backdrilling apparatus |
| CN107803878A (en) * | 2017-11-28 | 2018-03-16 | 江苏华神电子有限公司 | Target drone is bored to process the CCD of film positioning hole |
| TWI772188B (en) * | 2021-09-24 | 2022-07-21 | 健鼎科技股份有限公司 | Perforation forming method of a multilayer circuit board, manufacturing method of a multilayer circuit board, multilayer circuit board and multilayer circuit board manufacturing system |
| CN116100791A (en) * | 2023-02-23 | 2023-05-12 | 飞尔德航空器材制造(上海)有限公司 | Hot press device of aviation transparent piece with bolt mounting structure |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228107B (en) * | 2012-01-31 | 2016-03-23 | 王锦燕 | Position correction apparatus and use the method for correcting position of this position correction apparatus |
| JP5952052B2 (en) * | 2012-03-29 | 2016-07-13 | セイコープレシジョン株式会社 | Drilling device |
| JP5952053B2 (en) * | 2012-03-29 | 2016-07-13 | セイコープレシジョン株式会社 | Drilling device |
| CN103557793A (en) * | 2013-11-14 | 2014-02-05 | 成都金大立科技有限公司 | PCB hole site and hole diameter detecting system and detecting method |
| KR101846385B1 (en) * | 2016-07-12 | 2018-04-06 | 주식회사 에이치비테크놀러지 | Review measurement device that has both ends suporting structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3569548B2 (en) * | 1994-05-25 | 2004-09-22 | セイコープレシジョン株式会社 | Multi-axis drilling machine for plate workpiece |
| JP2873439B2 (en) * | 1995-09-22 | 1999-03-24 | セイコープレシジョン株式会社 | Drilling device and method for printed circuit board |
| JP3248092B2 (en) * | 1996-03-29 | 2002-01-21 | セイコープレシジョン株式会社 | Method and apparatus for discriminating orientation of printed circuit board and drilling method |
| JP3011101B2 (en) * | 1996-07-18 | 2000-02-21 | 皆見電子工業株式会社 | Substrate pretreatment system |
-
2006
- 2006-05-30 JP JP2006150707A patent/JP4210692B2/en not_active Expired - Fee Related
-
2007
- 2007-03-12 TW TW96108432A patent/TW200810634A/en not_active IP Right Cessation
- 2007-05-30 CN CN2007101058457A patent/CN101083875B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343507A (en) * | 2010-07-30 | 2012-02-08 | 信义汽车玻璃(深圳)有限公司 | Method for mounting and positioning automobile glass accessory |
| WO2015096667A1 (en) * | 2013-12-27 | 2015-07-02 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN104858465A (en) * | 2014-02-21 | 2015-08-26 | 维亚机械株式会社 | Backdrilling method, and backdrilling apparatus |
| CN107803878A (en) * | 2017-11-28 | 2018-03-16 | 江苏华神电子有限公司 | Target drone is bored to process the CCD of film positioning hole |
| CN107803878B (en) * | 2017-11-28 | 2023-12-15 | 江苏华神电子有限公司 | CCD (charge coupled device) drilling target machine for processing film positioning holes |
| TWI772188B (en) * | 2021-09-24 | 2022-07-21 | 健鼎科技股份有限公司 | Perforation forming method of a multilayer circuit board, manufacturing method of a multilayer circuit board, multilayer circuit board and multilayer circuit board manufacturing system |
| CN116100791A (en) * | 2023-02-23 | 2023-05-12 | 飞尔德航空器材制造(上海)有限公司 | Hot press device of aviation transparent piece with bolt mounting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007319956A (en) | 2007-12-13 |
| TWI323145B (en) | 2010-04-01 |
| JP4210692B2 (en) | 2009-01-21 |
| TW200810634A (en) | 2008-02-16 |
| CN101083875B (en) | 2010-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101083875B (en) | Perforating device for printed circuit wiring board and reference perforating method | |
| US9913384B2 (en) | Substrate-related-operation apparatus | |
| JP4542046B2 (en) | Drilling method and drilling device | |
| EP0669792B1 (en) | Drill coordinate optimization for multi-layer printed circuit board | |
| KR100247266B1 (en) | Punching device for printed circuit board and punching method | |
| US20020124699A1 (en) | Punching device and workpiece processing method | |
| CN101000498A (en) | Arrangement information generating device for punch press | |
| US6467383B1 (en) | Machine for punching panels | |
| JP4555118B2 (en) | Component mounting apparatus and component holding member discrimination method | |
| US5721587A (en) | Method and apparatus for inspecting product processed by turret punch press machine | |
| KR20100074041A (en) | Automated machine tool and method for drilling reference bores into printed circuit boards | |
| KR100381673B1 (en) | Multilayer printed circuit board and method for measuring a gap between the layers | |
| GB2288229A (en) | Method and apparatus for perforating printed circuit boards | |
| JP2001185863A (en) | Reference hole borer and method of correcting feed position | |
| TW200417449A (en) | Perforating device and method for plate-like works | |
| JPS6255320B2 (en) | ||
| CN103369841A (en) | Punching device | |
| CN103358351A (en) | Trepanning device | |
| KR102324545B1 (en) | Automatic attachment changer and boring machine including the same | |
| JP2985045B2 (en) | Drilling method and X-ray drilling device using X-ray | |
| JPH09267297A (en) | Directional discriminating method of printed circuit board and drilling method and device thereof | |
| JP4332597B2 (en) | Drilling device | |
| US20050002553A1 (en) | Image pattern recording method | |
| JP2002178058A (en) | Die changing device | |
| JP2000167738A (en) | Automatic tool change device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180126 Address after: Tokyo, Japan Patentee after: Seiko Timing System Co.,Ltd. Address before: Chiba County, Japan Patentee before: SEIKO Precision Inc. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Seiko Chuangshi Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Timing System Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |