JP5952053B2 - Drilling device - Google Patents

Description

  The present invention relates to a punching device, and more particularly to a punching device that punches a printed wiring board carried in from a carry-in entrance.

  In electronic devices, as electronic components for surface mounting such as IC chips, resistors, capacitors, and the like are miniaturized, printed wiring boards on which these are mounted are becoming denser and more complicated. In such a printed wiring board, a single layer printed wiring board is stacked and the wiring patterns thereof are aligned correctly to form a multilayer printed wiring board, or a completed large printed wiring board is divided into a plurality of printed wiring boards. In order to obtain a printed wiring board, a reference hole may be formed by a drilling device or the like.

  Conventionally, as a punching device for making a hole in a printed wiring board, an alignment mark formed on a printed wiring board is imaged with an X-ray camera, and a hole position of the printed wiring board is determined based on the captured image. There is known a technique in which drilling is performed with a tool in a state in which a backing plate is in contact with the back side of the plate (see, for example, Patent Document 1). In the apparatus described in Patent Document 1, the X-ray irradiator and the X-ray camera are arranged so as to face each other in the vertical direction, and a hole is provided on the operator side (manual side) from the X-ray irradiator and the X-ray camera. The opening tool and the contact plate are arranged to face each other in the vertical direction, and are configured to move integrally in the horizontal direction by the output from the motor.

JP 2008-227422 A

  In the punching device described in Patent Document 1, for example, an operator carries in the printed wiring board and aligns it so that the alignment mark of the printed wiring board is imaged at the position where the through hole of the table is formed. Here, particularly when a small printed wiring board is carried in, there is a possibility that the printed wiring board may not reach the imaging position, so it is preferable that the alignment mark can be imaged at a position close to the carry-in entrance.

  However, if the X-ray irradiator and the X-ray camera are placed on the operator side so that the alignment mark can be imaged on the front side, the punching tool and the backing plate are placed on the back side. It becomes difficult. The backing plate needs to be replaced, for example, every time a predetermined number of holes are drilled so that distortion and burrs do not occur on the printed wiring board.

  The present invention has been made in view of the above-described circumstances, and is capable of carrying out holes by loading printed wiring boards of various sizes, and capable of easily exchanging the backing plates. The purpose is to provide.

In order to achieve the above object, the drilling device of the present invention comprises:
A punching device that punches holes in a printed wiring board carried in from a carry-in entrance,
A first through hole is formed in a predetermined processing area and a second through hole is formed closer to the carry-in port than the first through hole , and the printed wiring board is placed thereon. A table,
An imaging mechanism for imaging an X-ray generating mechanism for irradiating X-rays to the printed wiring board placed on the mounting table, a transmission image of the X-rays irradiated before Symbol printed wiring board via the through hole, An imaging unit having
A punching unit having a punching mechanism that forms a hole in the printed wiring board through the through hole, and a contact plate that comes into contact with the printed wiring board when making a hole in the printed wiring board;
A first moving mechanism for moving together along the said X-ray generating mechanism and front Symbol piercing mechanism in a predetermined conveying direction,
A second moving mechanism for moving together along the a front Symbol caul prior SL imaging mechanism in the transport direction,
With
The piercing mechanism, said the X-ray generator configured by remote said inlet port and the first moving mechanism is disposed on the opposite side,
The caul plate is disposed in front Symbol imaging Organization by remote said inlet port side Te said second moving mechanism smell,
When making a hole in the printed wiring board, the first moving mechanism and the second moving mechanism cause the hole making mechanism and the contact plate to face each other through the first through hole in the predetermined processing area. ,
When replacing the backing plate, the second moving mechanism causes the backing plate to face the second through hole,
The second through hole has a larger width in the transport direction than the first through hole.
It is characterized by that.

  Moreover, you may provide the conveyance mechanism which moves the printed wiring board mounted in the said mounting base in the said conveyance direction.

Moreover, it may be provided between the first through hole and the carry-in entrance, and may include shielding means for shielding X-rays from the X-ray generation mechanism.

Moreover, you may provide the fixing means which fixes the printed wiring board mounted in the mounting base to the mounting surface to the mounting surface.
The printed wiring board has two reference marks,
In each of the first through hole and the second through hole, the two reference marks may be photographed simultaneously.

  According to the punching device of the present invention, printed wiring boards of various sizes can be carried in to make holes, and the backing plate can be easily replaced.

It is a perspective view which shows the external appearance of the punching apparatus which concerns on embodiment of this invention. Outline of the configuration of the drilling device when a cross section passing through the center of the width (X direction) of the drilling device shown in FIG. 1 and parallel to the plane perpendicular to the XY plane is viewed from the right side direction (−Y direction). FIG. It is a perspective view which shows a work table, an imaging unit, and a punching unit. It is a perspective view which shows a conveyance part and a movement part. It is a perspective view which shows a moving part. It is a perspective view which shows the positional relationship of an imaging unit and a punching unit. It is explanatory drawing of a control apparatus. It is a flowchart which shows an example of a punching process. It is a figure for demonstrating alignment. FIG. 3 is a view corresponding to FIG. 2 when an X-ray irradiator and an X-ray camera face each other through a sub through hole. FIG. 4 is a view corresponding to FIG. 3 when an X-ray irradiator and an X-ray camera face each other through a sub through hole. FIG. 3 is a view corresponding to FIG. 2 when a hole is drilled by a drilling unit through a main through hole.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a punching device according to an embodiment of the present invention will be described with reference to the drawings. As shown in the external view of FIG. 1 and the schematic configuration diagrams of FIGS. 2 and 10, the punching device 10 according to this embodiment includes a casing 11 that blocks the inside and the outside, a gantry (mounting table) 12, and the like. , Work table 13 for placing printed wiring board PCB to be punched, printed wiring board presser 14 for pressing printed wiring board PCB, transport unit 15 for moving work table 13, X-ray irradiator 161 and X An image pickup unit 16 that picks up an image of a printed wiring board PCB including a line camera 162, a punching unit 17 that makes a hole in the printed wiring board PCB, a moving mechanism 18 that moves the image pickup unit 16 and the punching unit 17, and the entire apparatus The control part 19 which controls is provided. Hereinafter, the direction (transport direction) in which the printed wiring board PCB moves by the transport unit 15 is the X direction, the horizontal direction perpendicular to the X direction (the width direction of the punching device 10) is the Y direction, and the vertical direction is the Z direction. .

  The white arrow in FIGS. 1 and 2 is a fixed position of the worker, the worker stands in the direction of the arrow (the positive direction of the X axis), and carries the printed wiring board PCB into the punching device 10, When the drilling process is finished, the printed wiring board PCB is taken out from the punching device 10. The carry-in entrance 10 a of the printed wiring board PCB is covered with an X-ray shielding portion (shielding means) 11 a of the casing 11. The X-ray shielding part 11a is made of a material that shields X-rays generated from the X-ray irradiator 161, and the -Z end of the X-ray shielding part 11a is such that there is no problem in carrying the printed wiring board PCB. The work table 13 is disposed at a predetermined distance from the + Z end (upper surface). On the -Z end side of the X-ray shielding part 11a, for example, a strip-shaped lead-containing rubber protective curtain is disposed. The −Z end (bottom surface) of the protective curtain is formed so as to come into contact with the + Z end (top surface) of the work table 13, and the printed wiring board PCB can be easily carried in and out, and the printed wiring board PCB. X-rays can be prevented from leaking outside when carrying in / out.

  The gantry 12 is disposed inside the casing 11 and serves as a stationary part in the punching device 10. The gantry 12 supports the work table 13 so as to be movable in the X direction by the transport unit 15. The work table 13 has a horizontal mounting surface on which the printed circuit board PCB is mounted. That is, the printed wiring board PCB is placed on the gantry 12 via the work table 13. The gantry 12 has a support surface that is parallel (that is, horizontal) to the mounting surface of the work table 13. On this support surface, as shown in FIG. A main through hole (first imaging hole) 12a for opening is formed, and a sub through hole (second imaging hole) 12b on the carry-in entrance 10a side (operator side) with respect to the main through hole 12a. Is formed.

  The main through hole 12a formed in the gantry 12 does not interfere with the imaging of the printed wiring board PCB and the drilling process depending on the size (width) in the Y direction of the printed wiring board PCB to be drilled. It has a long hole shape extending in the Y direction. The sub through hole 12b is formed with one through hole on each of the left and right so as not to hinder imaging of the printed wiring board PCB due to the size of the printed wiring board PCB in the X direction and the Y direction. Here, the sub through-hole 12b is configured by one through-hole at the left and right without being continuous at the center, because the main through-hole 12a drills all areas of the printed wiring board PCB and the imaging target. On the other hand, the sub through hole 12b identifies the alignment mark provided at the corner on the printed wiring board PCB in order to keep the printed wiring board PCB at a certain angle on the XY plane, that is, to perform alignment. This is because it is sufficient to secure a sufficient area to do this. For this reason, the sub through hole 12b is not a long hole extending in the Y direction, but is formed as one through hole on the left and right.

  The sub through hole 12b is also used when replacing the contact plate 173 of the drilling unit 17, which will be described in detail later. Therefore, the width is larger in the X direction than the main through hole 12a. Thus, since the sub through-hole 12b is constituted by one through-hole on the left and right without being continuous at the center, it can be made a large through-hole while ensuring the rigidity of the gantry 12. If there is no problem in specification, the sub through hole 12b may be formed in the shape of a long hole extending in the Y direction similarly to the main through hole 12a.

The work table 13 is supported on the gantry 12 so as to be movable along the X direction. In the work table 13, a plurality of through holes (not shown) are formed in order to perform imaging by the imaging unit 16 and drilling by the drilling unit 17. The work table 13 is also formed with suction holes (not shown) on the mounting surface. When the suction hole is set to a negative pressure while the printed wiring board PCB is placed on the work table 13, the printed wiring board PCB is sucked and fixed to the work table 13.
The fixing of the printed wiring board PCB by this suction is called temporary fixing.

  The printed wiring board presser 14 is disposed vertically above the main through hole 12a of the gantry 12 (see FIG. 4, not shown in FIG. 3). The printed wiring board retainer 14 is supported by the printed wiring board retainer raising / lowering means 500 so as to be movable up and down, and when the printed wiring board PCB is punched, the printed wiring board retainer 14 is lowered to hold the printed wiring board PCB. Press and fix on the work table 13. The fixing of the printed wiring board PCB by the printed wiring board presser 14 is referred to as main fixing.

  As shown in FIG. 4, the transport unit 15 includes a pair of rails 151 that are fixed to the gantry 12 and extend in the X direction, and a motor 153 that rotates a ball screw (not shown) that extends in the X direction. The transport unit 15 rotates the ball screw by the motor 153 to move the work table 13 in the X direction along the guide rail 151.

  As shown in FIGS. 2 and 3, the imaging unit 16 includes an X-ray irradiator (X-ray generation mechanism) 161 that is arranged vertically above the gantry 12 and irradiates the printed wiring board PCB with X-rays. And an X-ray camera (imaging mechanism) 162 that is disposed vertically below and that captures a transmission image of X-rays irradiated to the printed wiring board PCB. The X-ray irradiator 161 and the X-ray camera 162 are arranged so as to face each other in the Z direction at a position corresponding to either the main through hole 12a or the sub through hole 12b of the gantry 12, and the main through hole 12a and the sub through hole The printed wiring board PCB is imaged through any of the holes 12b. In this embodiment, two sets of X-ray irradiators 161 and X-ray cameras 162 are provided side by side in the Y direction as shown in FIGS. The two sets of the X-ray irradiator 161 and the X-ray camera 162 are respectively supported by the moving mechanism 18 and moved in the X direction and the Y direction.

  As shown in FIGS. 2 and 3, the hole punching unit 17 is disposed vertically above the gantry 12, and has a hole punching mechanism 171, 172 that punches a printed wiring board PCB using a tool (for example, a drill). It has the contact plate 173 (173a, 173b) which is arrange | positioned vertically below the mount frame 12 and contact | abuts the printed wiring board PCB. The punching mechanisms 171 and 172 and the contact plate 173 are operated as one set as will be described later, and are arranged so as to be opposed to each other in the Z direction at a position corresponding to the main through hole 12a of the gantry 12. Is driven in the Z direction to open a hole in the printed wiring board PCB through the main through hole 12a.

  In this embodiment, the punching mechanisms 171 and 172 are provided with two punching mechanisms 171 and 172 aligned in the X direction. For example, tools having different diameters of holes to be drilled are attached to the two drilling mechanisms 171 and 172. In addition, a contact plate 173 is provided so that the printed wiring board PCB is not distorted or burred when a hole is made in the printed wiring board PCB.

  The contact plate 173 includes two contact plates 173a and 173b arranged side by side in the Y direction. Depending on the diameter of the tool attached to the drilling mechanisms 171 and 172, the drilling mechanism 171 or the drilling mechanism is provided. 172 and one set are used. Further, as shown in FIGS. 4 and 5, two sets of the punching mechanisms 171 and 172 and the contact plate 173 are provided side by side in the Y direction. The two sets of punching mechanisms 171 and 172 and the contact plate 173 are supported by the moving mechanism 18 and move in the X direction and the Y direction, respectively.

  The contact plate 173a and the contact plate 173b are intended to prevent the PCB from being distorted or burred during the drilling operation as described above. For example, the contact plate 173a and the contact plate 173b have the same diameter (clearance 0) with respect to the tool diameter. Alternatively, there is one in which a hole formed so as to have a large diameter by a predetermined amount is opened. When the contact plate 173a and the contact plate 173b have the same diameter as the diameter of the tool, the effect of preventing burr is maximized. Therefore, it is ideally replaced every time processing is performed. For reasons such as efficiency, the same contact plate 173a and contact plate 173b are continuously used without replacement while there is no problem.

  When the punching mechanisms 171 and 172 and the contact plate 173 are opposed to each other, the center of the hole provided in the contact plate and the rotation center of the corresponding tool are positioned so as to coincide with each other. Due to the fact that each center does not perfectly match. Therefore, as the use is continued, the diameter of the hole formed in the contact plate 173 becomes larger than the initial diameter, and the effect of preventing burr is reduced.

  Therefore, it is necessary to replace the contact plate 173 with a new one when, for example, a predetermined number of times of processing is reached. In that case, it can replace | exchange easily by making the contact plate 173a or the contact plate 173b, and the sub through-hole 12b oppose.

  The moving mechanism 18 supports the imaging unit 16 and the punching unit 17 and moves them in the X direction and the Y direction. As shown in FIGS. 4 to 6, the moving mechanism 18 includes an upper moving mechanism 18 </ b> T that supports and moves the X-ray irradiator 161 and the punching mechanisms 171 and 172 vertically above the gantry 12, and the gantry 12. And a lower moving mechanism 18D that supports and moves the X-ray camera 162 and the contact plate 173 integrally. The movement of the X-ray irradiator 161 and the punching mechanisms 171 and 172 by the upper movement mechanism 18T and the movement of the X-ray camera 162 and the contact plate 173 by the lower movement mechanism 18D can be performed independently. It is configured.

  In the upper moving mechanism 18T, as shown in FIGS. 5 and 6, the X-ray irradiator 161 and the punching mechanisms 171 and 172 are supported in this order (along the X direction) from the operator side. In the lower movement mechanism 18D, the contact plate 173 and the X-ray camera 162 are supported in this order (along the X direction) from the operator side. Therefore, when the X-ray irradiator 161 and the X-ray camera 162 are opposed to each other in the vertical direction, the punching mechanisms 171 and 172 are not opposed to the contact plate 173, and conversely, the punching mechanisms 171 and 172 and the contact plate 173 are Are opposed to each other in the vertical direction, the X-ray irradiator 161 and the X-ray camera 162 do not face each other. As described above, the X-ray irradiator 161 is arranged on the front side (the carry-in entrance 10a side) with respect to the punching mechanisms 171 and 172, so that the X-ray irradiator 161 is located on the back side (the side opposite to the carry-in entrance 10a). The X-ray irradiator 161 can be moved to the near side without interfering with the X-ray shielding part 11a, and the sub through-hole 12b can be formed on the near side as compared with that arranged in FIG. In addition, the hole punching device 10 can be reduced in size. Further, since the contact plate 173 is disposed on the front side (the carry-in entrance 10a side) of the X-ray camera 162, the punching mechanisms 171 and 172 are compared with those in which the contact plate 173 is disposed on the back side. Depending on the tool or the like attached to, the contact plate 173 can be easily replaced and the punching device 10 can be downsized.

  In the upper moving mechanism 18T, a rail 182T extending in the Y direction is provided on the frame body 181T, which is a stationary member in the punching mechanism 10, and the Y-axis mount 183T is movably supported by the rail 182T. The Y-axis mount 183T is engaged with a ball screw 184T extending in the Y direction, and moves in the Y direction along the rail 182T when the ball screw 184T is driven by the motor 185T supported by the frame body 181T. . Although not shown, the rotating shaft of the motor 185T and the rotating shaft of the ball screw 184T are connected via a belt, for example, and when the rotating shaft of the motor 185T rotates, the rotating shaft of the ball screw 184T also rotates in conjunction with it. To do. Further, in the upper moving mechanism 18T, a rail 186T extending in the X direction is formed on the Y-axis mount 183T, and a moving body 187T that supports the X-ray irradiator 161 and the punching mechanisms 171 and 172 is movable on the rail 186T. It is supported by. The moving body 187T is engaged with a ball screw 188T extending in the X direction, and moves in the X direction along the rail 186T when the ball screw 188T is driven by the motor 189T supported by the Y-axis mount 183T. . With this configuration, the upper moving mechanism 18T can drive the motors 185T and 189T to move the X-ray camera 162 and the punching mechanisms 171 and 172 in the X direction and the Y direction. The upper moving mechanism 18T can be moved in the X direction and the Y direction independently for each of the two sets of the X-ray irradiator 161 and the punching mechanisms 171 and 172 arranged side by side in the Y direction. Thus, two sets are provided symmetrically in the Y direction.

  In the lower movement mechanism 18D, as in the upper movement mechanism 18T, a rail 182D extending in the Y direction is provided on the frame body 181D that is a stationary member in the drilling mechanism 10, and the Y-axis mount 183D can be moved on the rail 182D. It is supported. The Y-axis mount 183D is engaged with a ball screw 184D extending in the Y direction, and moves in the Y direction along the rail 182D when the ball screw 184D is driven by the motor 185D supported by the frame body 181D. . Although not shown, the rotating shaft of the motor 185D and the rotating shaft of the ball screw 184D are connected via a belt, for example, and when the rotating shaft of the motor 185D rotates, the rotating shaft of the ball screw 184D also rotates in conjunction with it. To do. Further, in the lower movement mechanism 18D, a rail 186D extending in the X direction is formed on the Y-axis mount 183D, and a movable body 187D that supports the contact plate 173 and the X-ray irradiation mechanism 161 is movably supported on the rail 186D. Has been. The moving body 187D is engaged with a ball screw 188D extending in the X direction, and moves in the X direction along the rail 186D when the ball screw 188D is driven by the motor 189D supported by the Y-axis mount 183D. . With this configuration, the lower movement mechanism 18D can drive the motors 185D and 189D to move the contact plate 173 and the X-ray camera 162 in the X direction and the Y direction. The lower moving mechanism 18D can be moved in the X direction and the Y direction independently for each of the two sets of the X-ray camera 162 and the contact plate 173 arranged side by side in the Y direction. Similar to the upper moving mechanism 18T, two sets are provided symmetrically in the Y direction.

  As shown in FIG. 7, the control device 19 includes a control unit 191, a main storage unit 192, an external storage unit 193, an operation unit 194, a display unit 195, and an input / output unit 196. The main storage unit 192, the external storage unit 193, the operation unit 194, the display unit 195, and the input / output unit 196 are all connected to the control unit 191 via the internal bus 198.

  The control unit 191 includes a CPU (Central Processing Unit) and the like, and executes processing for measurement described later according to a program stored in the external storage unit 193.

  The main storage unit 193 includes a RAM (Random-Access Memory) or the like, loads a program stored in the external storage unit 193, and is used as a work area of the control unit 191.

  The external storage unit 193 includes a non-volatile memory such as a flash memory, a hard disk, a DVD-RAM (Digital Versatile Disc Random-Access Memory), a DVD-RW (Digital Versatile Disc Rewritable), and the above processing is performed in the control unit 191. A program to be executed is stored in advance, and data stored in the program is supplied to the control unit 191 in accordance with an instruction from the control unit 191, and the data supplied from the control unit 191 is stored.

  The operation unit 194 includes a pointing device such as a keyboard and a mouse, and an interface device that connects the keyboard and the pointing device to the internal bus 198. A processing start or end command or the like is input via the operation unit 194 and supplied to the control unit 191. The operation unit 194 may be configured to input an operation command using a user's finger, a dedicated input pen, or the like using the display unit 195 or another monitor as a touch panel system.

  The display unit 195 is composed of a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display), and displays imaging by the imaging unit 16, warnings, instructions to workers, and the like.

  The input / output unit 196 includes a serial interface or a LAN (Local Area Network) interface. An image signal captured from the imaging unit 16 is input to the control unit 191 via the input / output unit 196. Further, a signal for driving the suction unit, the transport unit 15 and the moving mechanism 18 (not shown) of the work table 13 and a signal for driving the imaging unit 16 and the punching unit 17 are output from the control unit 191 via the input / output unit 196. Is done. The transport unit 15, the moving mechanism 18, the imaging unit 16, and the punching unit 17 are not limited to those connected to the control unit 191 via the input / output unit 196. For example, an image signal from the imaging unit 16 is an image. It may be configured to exchange signals with the control unit 191 via a dedicated board, such as being input to the control unit 191 via a capture board.

  Next, the operation of the punching device 10 will be described. The control unit 191 of the hole punching device 10 performs initial processing by driving various actuators, for example, at the time of activation. In the initial process, the work table 13, the imaging unit 16, and the punching unit 17 are moved to a predetermined initial position. In this embodiment, the work table 13 is disposed at a position that covers the main through hole 12a of the gantry 12, and as shown in FIGS. 2 and 3, the X-ray irradiator 161 and the X-ray are passed through the main through hole 12a. The imaging unit 16 is arranged so as to face the camera 162. At this time, as described above, the perforation mechanisms 171 and 172 and the contact plate 173 in the perforation unit 17 are not arranged to face each other in the Z direction.

  Then, for example, the control unit 191 executes the drilling process shown in FIG. 8 when the start switch is turned on by the operator and the initial carry-in position of the printed wiring board PCB to be drilled is selected. To do. Here, for example, when the printed wiring board PCB to be punched is smaller than a predetermined size, the operator selects the initial loading position on the near side as viewed from the operator, and the printed wiring board PCB is set as the initial loading position. When the size is larger than the initial size, the back side initial carry-in position is selected.

  When the punching process shown in FIG. 8 is started, the control unit 191 first determines whether the initial loading position of the selected printed wiring board PCB is the front side or the back side, for example, by an operator in advance. Is determined on the basis of the size of the printed wiring board PCB input by (step S1). 9 and 10, the work table 13 is moved to a position covering the sub through hole 12b of the gantry 12, and the X-ray irradiator 161 and the X-ray camera 162 are sub-penetrated as shown in FIGS. It is made to oppose through the hole 12b (step S2), and the X-ray irradiator 161 and the X-ray camera 162 are turned on (step S3a). As a result, the X-ray camera 162 starts obtaining a transmission image of the printed wiring board PCB.

  Subsequently, the operator carries in the printed wiring board PCB from the carry-in entrance 10a, and performs approximate alignment of the printed wiring board PCB while viewing the display on the display unit 195. The control unit 191 displays the transmission image acquired by the X-ray camera 162 on the display unit 195, for example, as shown in FIG. 9 (step S4a). Here, the display 20 is an image of the alignment mark for alignment, and the display M is an image of the alignment mark formed on the printed wiring board PCB. At this time, an image acquired via the sub through hole 12b is displayed on the display unit 195.

  The operator moves the printed wiring board PCB in the front-rear direction (X direction) and the horizontal direction (Y direction) so that the alignment mark M comes to the center of the aiming mark 20 while viewing the display on the display unit 195. When the control unit 191 detects that the alignment mark M is positioned at the approximate center of the aiming mark 20 and is stopped, for example, when the switch is pressed by the operator (step S5a: Yes), the work table 13 is not shown. The printed wiring board PCB is fixed to the work table 13 with the suction hole set to a negative pressure, and the printed wiring is printed at a position (predetermined processing area) corresponding to the main through hole 12a based on the transmission image acquired by the X-ray camera 162. The board PCB is moved, and the upper moving mechanism 18T and the lower moving mechanism 18D are driven to move the X-ray irradiator 161 and the X-ray camera 162 so as to face each other through the main through hole 12a (step S6). ). When the X-ray irradiator 161 and the X-ray camera 162 are moved, the X-ray irradiator 161 and the X-ray camera 162 may be turned off.

  Subsequently, the control unit 191 controls the printed wiring board presser up-and-down means 500 to lower the printed wiring board presser 14 and press the printed wiring board PCB against the work table 13 to be permanently fixed. By the main fixing by the printed wiring board presser 14, the printed wiring board PCB is fixed to the work table 13 more strongly than the fixing by suction. Next, the alignment mark M of the printed wiring board PCB is imaged through the main through hole 12a, and the position where the hole is to be formed in the printed wiring board PCB is specified based on the position of the imaged alignment mark M (step S7). The position where the hole is opened may be the position of the alignment mark M, or may be a position away from the alignment mark M by a predetermined distance. For example, if determined based on information set in advance by the operator Good.

  When the drilling position is specified, the control unit 191 positions the drilling position of the printed wiring board PCB in the main through hole 12a as necessary, and turns off the X-ray irradiator 161 and the X-ray camera 162 (step). S8), the upper moving mechanism so that the pre-selected perforation mechanism 171 or perforation mechanism 172 and the corresponding contact plate 173a or contact plate 173b are opposed to each other in the Z direction at a position corresponding to the perforation position. 18T and the lower side movement mechanism 18D are driven, and the tool of the selected drilling mechanisms 171 and 172 is lowered while rotating to open a hole at the drilling position (step S9). As described above, at this time, the X-ray irradiator 161 and the X-ray camera 162 do not face each other in the Z direction.

  When the punching is completed, the control unit 191 raises the punching mechanism 171 or the punching mechanism 172 to stop driving, and controls the printed wiring board presser up / down means 500 to raise the printed wiring board presser 14. Then, the permanent fixing of the printed wiring board PCB is released. Next, the control unit 191 performs initial processing again, and moves the work table 13, the imaging unit 16, and the punching unit 17 to the initial positions. Thereafter, the negative pressure in the suction holes of the work table 13 is released, the temporary fixing of the printed wiring board PCB is released, and the punching process is finished. At this time, for example, a message is displayed on the display unit 195 to prompt the user to remove the printed wiring board PCB, and the operator removes the printed wiring board PCB.

  Thus, when the initial carry-in position of the printed wiring board PCB is selected on the near side, the alignment mark M of the printed wiring board PCB is placed in the sub through hole 12b formed on the carry-in entrance 10a side (operator side). Since alignment is sufficient, the operator can easily align the alignment mark M even with a small printed wiring board PCB. When the alignment of the printed wiring board PCB is completed in the sub through hole 12b, the control unit 191 moves the printed wiring board PCB to the main through hole 12a based on the imaging information acquired through the sub through hole 12b. In the main through hole 12a, a drilling position is specified and drilling is performed. With such a configuration, a small printed wiring board PCB can be easily punched.

  On the other hand, when the initial carry-in position of the printed wiring board PCB is selected in step S1, the X-ray irradiator 161 and the X-ray camera 162 are turned on (step S3b), and printing by the X-ray camera 162 is performed. Acquisition of a transmission image of the wiring board PCB is started. As described above, in this embodiment, the X-ray irradiator 161 and the X-ray camera 162 are initially arranged so as to face each other through the main through hole 12a of the gantry 12 when the drilling device 10 is activated. Therefore, the transmission image of the printed wiring board PCB is acquired by the X-ray camera 162 through the main through hole 12a.

  Subsequently, the operator carries in the printed wiring board PCB from the carry-in entrance 10a, and performs approximate alignment of the printed wiring board PCB while viewing the display on the display unit 195. The control unit 191 displays the transmission image acquired by the X-ray camera 162 on the display unit 195 as shown in FIG. 9 (step S4b). At this time, an image acquired through the main through hole 12a is displayed on the display unit 195.

  As in the case where the near side is selected as the initial carry-in position of the printed wiring board PCB, the operator looks at the display on the display unit 195 so that the alignment mark M is at the center of the aiming mark 20. Are moved back and forth (X direction) and laterally (Y direction). Then, when the control unit 191 detects that the alignment mark M is positioned substantially at the center of the aiming mark 20 and is stopped (step S5b: Yes), the suction hole (not shown) of the work table 13 is set to a negative pressure to print wiring. The board PCB is fixed to the work table 13, and then the printed wiring board presser up / down means 500 is controlled to lower the printed wiring board presser 14 and press the printed wiring board PCB against the work table 13 to be permanently fixed. After that, based on the position of the alignment mark M imaged by the X-ray camera 162, the position where a hole is made in the printed wiring board PCB is specified (step S7). Here, since the back side is selected as the initial carry-in position of the printed wiring board PCB and the printed wiring board PCB is imaged through the main through hole 12a, the printed wiring board PCB is picked up based on this imaging information. The position where the hole is made is specified.

  Then, similarly to the case where the near side is selected as the initial carry-in position of the printed wiring board PCB, the control unit 191 positions the drilling position of the printed wiring board PCB in the main through-hole 12a as necessary, so that the X-ray The irradiator 161 and the X-ray camera 162 are turned off (step S8), and the selected drilling mechanisms 171 and 172 and the corresponding contact plates 173a and 173b are opposed to each other in the Z direction at positions corresponding to the drilling positions. As described above, the upper moving mechanism 18T and the lower moving mechanism 18D are driven to make holes in the printed wiring board PCB by the punching mechanism 171 or the punching mechanism 172 (step S9), and the printed wiring board presser 14 is raised. The fixed fixing of the printed wiring board PCB is released, the initial processing is performed again, and the work table 13, the imaging unit 16, and the punching unit 17 are performed. After moving to the initial position, and it ends the drilling process.

  Thus, when the initial carry-in position of the printed wiring board PCB is selected on the back side, the printed wiring board PCB is inserted into the main through hole 12a formed on the side far from the carry-in entrance 10a (the side far from the operator). Since the alignment mark M only needs to be aligned, the operator can easily align and punch a large printed wiring board PCB at the initial loading position. In addition, by inserting and aligning the large printed wiring board PCB from the carry-in entrance 10a to the back, the work space for supporting the printed wiring board PCB in the punching device 10 can be reduced, and the apparatus can be downsized. can do.

  As described above, in the hole punching device 10 of this embodiment, the main through hole 12a located in the processing area where the hole is punched by the hole punching unit 17 and the sub through hole 12b located on the carry-in port 10b side are provided. Since it is formed on the gantry 12, when a small printed wiring board PCB is carried into the punching device 10, the printed wiring board PCB is easily imaged through the sub through hole 12b on the front side, so that the holes in the printed wiring board PCB can be easily obtained. Opening can be performed. In addition, when the large printed wiring board PCB is carried into the punching device 10, the printed wiring board PCB can be imaged through the main through hole 12a on the back side, so that the size of the device can be reduced.

  Further, in the drilling device 10 of this embodiment, since the X-ray irradiator 161 is disposed on the near side (the carry-in entrance 10a side) than the drilling mechanisms 171 and 172, the sub through hole 12b is on the near side. The punching device 10 can be reduced in size, and the contact plate 173 is disposed on the front side (the entrance 10a side) of the X-ray camera 162, so that the contact plate 173 can be easily replaced. And the hole punching device 10 can be downsized.

  Although the present invention has been described with reference to one embodiment, the present invention is not limited to the above-described embodiment, and its application, modification, and the like are arbitrary. For example, in the above-described embodiment, the X-ray irradiator 161 and the punching mechanisms 171 and 172 are supported by the upper movement mechanism 18T vertically above the gantry 12, and the X-ray camera 162 is vertically below the gantry 12. The contact plates 173a and 173b are supported by the lower movement mechanism 18D. However, the X-ray irradiator 161 and the punching mechanism 171 are supported by the lower movement mechanism 18D vertically below the gantry 12. The X-ray camera 162 and the contact plates 173a and 173b may be supported by the upper movement mechanism 18T vertically above the gantry 12. Further, the punching mechanisms 171 and 172 and the X-ray irradiator 161 are disposed between the upper moving mechanism 18T and the lower moving mechanism 18D so that the X-ray irradiator 161 is disposed on the front side of the punching mechanisms 171 and 172. The support plate 173 and the X-ray camera 162 are supported on the other of the upper movement mechanism 18T and the lower movement mechanism 18D so that the support plate 173 is disposed on the near side of the X-ray camera 162. May be.

  In the above embodiment, the X-ray irradiator 161 is supported on the carry-in entrance 10a side with respect to the punching mechanisms 171 and 172, and the X-ray camera 162 is supported on the back side with respect to the contact plates 173a and 173b. However, in the case where the main through hole 12a and the sub through hole 12b are formed in the gantry 12, regardless of the arrangement of the imaging unit 16 and the punching unit 17, various sizes of the printed wiring board PCB are provided. Can be easily drilled. In addition, the upper moving mechanism 18T and the lower moving mechanism 18D are not limited to those that move the imaging unit 16 and the punching unit 17 that are arranged vertically above and below the gantry 12 independently. The imaging unit 16 and the punching unit 17 that are arranged to face each other may be moved together in the X direction and the Y direction.

  In the above embodiment, the imaging unit 16 includes the X-ray irradiator 161 and the X-ray camera 162. However, any imaging unit 16 may be used as long as it can image the printed wiring board PCB through the through hole. A thing may be used.

  In the above embodiment, the suction hole of the work table 13 is set to a negative pressure so that the printed wiring board PCB is sucked and fixed to the work table 13. For example, a print placed on the work table 13 is used. The printed wiring board PCB may be fixed to the work table 13 by other methods such as pressing the wiring board PCB from vertically above.

DESCRIPTION OF SYMBOLS 10 Hole punching device 11 Casing 12 Base 13 Work table 14 Jig plate 15 Conveyance part 16 Imaging unit 17 Hole punching unit 18 Movement mechanism 18T Upper side movement mechanism 18D Lower side movement mechanism 19 Control part 161 X-ray irradiation machine 162 X-ray camera 171 , 172 Drilling mechanism 173

Claims (5)

A punching device that punches holes in a printed wiring board carried in from a carry-in entrance,
A first through hole is formed in a predetermined processing area and a second through hole is formed closer to the carry-in port than the first through hole , and the printed wiring board is placed thereon. A table,
An imaging mechanism for imaging an X-ray generating mechanism for irradiating X-rays to the printed wiring board placed on the mounting table, a transmission image of the X-rays irradiated before Symbol printed wiring board via the through hole, An imaging unit having
A punching unit having a punching mechanism that forms a hole in the printed wiring board through the through hole, and a contact plate that comes into contact with the printed wiring board when making a hole in the printed wiring board;
A first moving mechanism for moving together along the said X-ray generating mechanism and front Symbol piercing mechanism in a predetermined conveying direction,
A second moving mechanism for moving together along the a front Symbol caul prior SL imaging mechanism in the transport direction,
With
The piercing mechanism, said the X-ray generator configured by remote said inlet port and the first moving mechanism is disposed on the opposite side,
The caul plate is disposed in front Symbol imaging Organization by remote said inlet port side Te said second moving mechanism smell,
When making a hole in the printed wiring board, the first moving mechanism and the second moving mechanism cause the hole making mechanism and the contact plate to face each other through the first through hole in the predetermined processing area. ,
When replacing the backing plate, the second moving mechanism causes the backing plate to face the second through hole,
The second through hole has a larger width in the transport direction than the first through hole.
A drilling device characterized by that. A transport mechanism that moves the printed wiring board placed on the mounting table in the transport direction;
The drilling device according to claim 1, wherein A shielding means disposed between the first through hole and the carry-in port, and shielding X-rays from the X-ray generation mechanism;
The drilling device according to claim 1 or 2 , characterized in that. A fixing means for fixing the printed wiring board mounted on the mounting table to the mounting surface;
The drilling device according to any one of claims 1 to 3 , wherein: The printed wiring board has two reference marks,
5. The punching device according to claim 1, wherein each of the first through hole and the second through hole can simultaneously photograph the two reference marks. 6.

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