A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（1 ) 〔發明所屬之技術領域〕 本發明係有關多層基板之製造方法及其製造裝置者。 〔習知技術〕 近來之電子製品之複雜化，使之對於印刷電路基板亦 有要求著高密度化，而作爲實現印刷電路基板之高密度化 之一，有予以疊層複數之印刷電路基板，並以連接各層之 電路所形成之多層基板。多層基板係予以疊層印刷有電路 於兩面之基板複.數片，且配設黏接層（Prepr eg Sheet， 預浸膠片）於各基板間，以互成固定黏著者所構成。各基 板之電路彼此係藉通孔來連接，惟對於該等電路之連接， 必需實施正確的對準位置。而作爲如此之對準位置之手段 ，將在各基板對向面之2〜4處以上予以開孔，並貫穿銷 於該孔中，以達成防止各圖型之錯位。 〔發明擬解決之課題〕 然而，在各基板予以開孔，並插穿銷於該處來定位時 ，不僅要對準孔之位置且插穿銷之作業爲麻煩之外，所有 之基板上之開孔位置並非經常成正確，因而在精度上有界 限。爲此，在技術上要在每一基板以高精度來開孔即使有 可能，要實現該狀態卻具有生產成本會增大之問題。 〔解決課題用之手段〕 。 爲了解決上述之課題*在本發明，乃予以攝影個別配 (請先¾讀背面之注意事項再填寫本頁) .裝. 訂 -線 本紙張尺度適用中國國家標準（CNS ) A4規格（210'/297公釐）-4- A7 B7 五、發明説明（2 ) 設於一對基板之標 位置脫節），且予 位置關係疊合之狀 之基板之標記間之 具有差異之時，就 記，而在一方之基 記並以 以修正 態下加以固定 間隔和另一方 進行重叠一方 板之標 圖像處 該位錯 記間之間隔產生有差異之 給予一方端部和另一方端 之標記和另一方基 又以使用預先 複數孔部之工模板 以使要算出基板之 板之標 鑽設（ 來使算 標記位 記間之 時，就 部，以 記之距 鑽孔配 出攝影 置使之 理來求 來使兩 黏著》 之基板 基板之 間隔和 平分分 進行在 離使之 設）間 手段間 成爲容 出兩基板之位錯（ 基板以形成正確之 而該修正係在一方 之標記間之間隔不 標記與另一方之標 另一方之基板之標 配差異之二等分值 兩端部之一方基板 能成爲 隔已有 之間隔 相等者。 明確判別之 成爲容易， 請 、尤· Μ 讀 背 ώ 之 注 意 事 項 再 填 禽裝 本各 頁 易 訂 之實施形 了達成上 〔發明 爲 ，係以藉未硬化 經濟部中央標準局負工消費合作社印製 標記之一對基板 在一對_基板之一 影手段 記之位 基板之 記間之 時，就 記與另 態〕 述之目的 狀態之黏 成對向狀 方端部個 別所配設 處理來求 來攝取個 置以圖像 相對性之位錯（位 間隔和另一方之基 ，本發明之 接層來保持 態，而以第 別所配設的 於另一方之 多層基板 預先在兩 1之攝影 標記，且 端部的標 之製造方法 端部形成有 手段來攝取 以第2之攝 記，將各標 出，並依據圖像處理來求出一對 置脫節） 板之標記間之間隔不 以相對性地加以移動一對基板 一方之標記重疊來修正位錯， 並在一方之基板之標 具有差異之 ，以令一方基板之標 而在一方之基板之標 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）-5 - 線 A7 B7 五、發明説明（ 記間之間隔和 時，就以相對 二等分值給予 方基板之標記 者，且以修正 固定，爲其特 在上述之 對基板之任何 經濟部中央標準局員工消費合作社印製 著一定 使另一 再 將配設 標記， 之標記 之狀態 又 基板之 時固定 所形成 又 先鑽設 板重疊 時，予 攝影位 間隔成 方之基 者，在 於兩基 而配設 更小直 下來進 本發明 至少一 裝配之 之多層 在上述 間隔已 ，而以 以攝影 於另一 3 ) 另一方之基板之標記間之間隔產生有差異之 性地加以移動一對基板，以平分分配羞異之 一方端部和另一方端部，以令在兩端部之一 和另一方基板之標記之距離使之能成爲相等 完成該位錯之狀態下來使一對基板互相黏著 徵者。 多層基板之製造方法中，以配設黏接層於一 一方，並使另一方基板保持爲從該黏接層隔 非接觸狀態，而相對性地移動兩基板之後， 板疊層於黏接層上爲其理想。 上述之多層基板之製造方法中之任何之一， 板中之一方基板的標記作爲空白（空白點） 於另一方基板之標記則予以形成較上述空白 徑，並以該小直徑標記能位於空白標記內部 行兩標記之攝影爲其理想》 在上述之各多層基板之製造方法中，將一對 方予以作成由複數層所形成之多層基板或暫 複數基板，就可製造以疊層三片以上之基板 基板。 之多層基板之製造方法中，以包括有，將預 有明確判別之複數孔部之工模板配設成與基 第1之攝影手段在攝影位於一方端部之標記 工模板孔部中之一，且由第2之攝影手段在 方端部之標記時，予以攝影工模板孔部中之 請 it , 'm 讀 背 .面 之 注 意 事 項 再 填衰裝 頁 訂 線 本紙張尺度適用中國國家榇準（CNS ) A4規格（210X297公釐）_ 6 A7 B7 經濟部中央標準局員工消費合作社印製 五 、 發明説明（ 4 ) 另 _. 個 並 將 其 以 园 圖 像 處 理 來 個 別 求 出 在 兩 攝 影 手 段 之 rat 圖 像 區 域 內 之 兩 孔 部 之 中 心 位 置 > 而 依 據 該 等 之 各 孔 部 之 各 圖 像 區 域 內 之 中 心 位 置 及 預 先 已 明 確 判 別 之 所 攝 取 之 孔 部 間 之 間 隔 予 以 算 出 攝 影 手 段 間 之 間 隔 > 並 依 據 兩 攝 影 手 段 間 之 間 隔 來 求 出 用 以 修 正 一 對 基 板 之 位 錯 用 之 相 對 移 動 量 之 過 程 爲 其 理 想 〇 又 在 上 述 之 多 層 基 板 之 製 造 方 法 中 兩 基 板 Z 固 定 裝 配 係 以 使 用 刖 端 形 狀 實 質 上 爲 環 狀 之 鐵 石占 角 ( ho r η ) 來 施 加 超 音 波 振 動 以 熔 著 被 挾 持 於 兩 基 板 間 之 黏 接 層 來 進 行 爲 其 理 想 0 使 用 於 上 述 多 層 基 板 製 造 方 法 之 製 造 裝 置 係 一 種 多 曆 基 板 之 製 造 裝 置 主 要 以 藉 黏 接 層 來 固 定 裝 配 預 先 已 形 成 有 標 記 於 兩 孔 部 之 一 對 基 板 其特 徵 爲 具 備有 . 保持 上 述 一 對 基 板中 之 *~~· 方 用 之 第 1 保 持 手 段 保持 一 對 基 板 中 之 另 —· 方 基 板 成 相 對 向 於 一 方 基 板 用 之 第 2 保 持 手 段 在 該 等 基 板 之 一 方 端 部 可 同 時 攝 影 個 別 配 設 於 —· 對 基 板 之 標 記 之 第 1 攝 影 手 段 同 樣 在 該 等 基 板 之 另 -~. 方 9 可 同 時 攝 影 個 別 配 設 於 一 對 基 板 之 標 記 之 第 2 攝 影 手 段 i 爲 了 修 正 依 據 該 等 之 各 標 記 之 位 置 所 求 出 之 一 對 基 板 之 相 對 性 位 錯 而 使 一 對 基 板 成 相 對 性 移 S1, 動 用 之 移 動 手 段 » 及 以 已 修 正 兩 基 板 間 之 位 錯 的 狀 態 下 9 將 該 等 — 對 基 板 互 相 加 以 固 定 裝 配 用 之 固 定 裝 配 手 段 〇 上 述 之 多 層 基 板 之 製 造 裝 置 的 移 動 手 段 乃 具 備 有 > 使 基 板 之 —· 方 朝 長 度 方 向 及 寬 度 方 向 移 動 用 之 X Y 機 台 手 段 1Τ 線 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）-7 - 請 ' 讀 背 之 注 意 事 項 再 填 J裝 頁 A7 B7 經濟部中央標隼局貝工消費合作社印_裝 五、發明説明（5 ) ’及與該XY機台並列設置而移動一方基板朝寬度方向用 之iLT機台手段，並令由上述攝影手段所攝取之圖像依據 所實施之圖像處理結果，使之可自動對準爲其理想。 上述之多層基板之製造裝置的兩保持手段乃形成爲， 以設成可互相接近且可分離來使一對基板彼此緊密地黏住 ，而在未產生位錯之狀態下可固定裝配爲其理想。 又上述之多層基板製造裝置乃形成爲，予以配設設有 攝影手段之位置確認用之孔部複數個之工模板於兩保持手 段之一方，而在該工模板配設有攝影手段之位置確認用之 孔部複數個，該等之孔部間隔係預先明確判別者，而該等 之孔部中之至少一個，乃與位於基板一方端部之標記由第 1攝影手段可同時加以攝取，而其他之孔部中之至少一個 ，則與位於基板另一方端部之標記由第2攝影手段可同時 加以攝取之結構，以達成可容易地實施各攝影手段之位置 確認即可。 作爲上述之多層基板之製造裝置之固定裝配手段，以 使用具有前端形狀實質上爲環狀之鐵砧角的超音波熔接手 段爲其理想。 〔實施例〕 首先，將說明有關多層基板P。作爲多層基板之最簡 單之結構，有介居黏接層B於以形成電路圖型於兩面所形 成之二片基板P 1，P 2之相對向面來固定裝配兩基板者 (參照圖1，2)。各基板在個別之兩端預先附設有對準 (請先裯讀背面之注意事項再填寫本頁) •裝. 訂 線- 本紙張尺度適用中國國家標準（CNS)A4規格（ 210X297公釐）- 8 - 經濟部中央標準局員工消費合作社印製 A7 ,, ________B7 ___ 五、發明説明（6 ) 位置用之標記ml，m2，nl，n2。又多層基板者， 除了如上述外，即印刷電路基板彼此構成爲，疊層3.片（ 6層）或4片（8層）者。通常乃在該等基板上下藉黏接 層（絕緣性）來貼合銅板，並以蝕刻該銅板來進行製作圖 型。亦即，最後所完成者，將成爲2片曼層之基板具有4 層，3片疊層之基板具有6層，4片疊層之基板具有8層 之僵型。 構成多層基板之基板P 1，P 2，乃由形成電路圖型 於環氧系樹脂板兩面者所構成。黏接層B則由半硬化狀態 之樹脂片（預浸膠片）所形成，採用加熱而硬化以令兩基 板可固定裝配者。 接著，使用圖1，2來對於有關本發明之多層基板製 造裝置加以說明。 如圖所示，在固定機台1上，設有基板P之移動手段 Μ。移動手段Μ乃設於下機台（第1保持手段）1 1上面 左端，而是由設成可移動基板朝長（度）方向及寬（度） 方向之ΧΥ機台手段2,及並列設置於下機台11上面右 側可使基板朝寬方向移動之2L_Y機台手段3所形成。 爲第1移動手段之XY機台手段2乃具備有，載置於 固定機台1上面之Y機台4及XY機台5機台4係設 成藉嵌合於對於紙（圖）面朝垂直方向展延之第丄之丫軸 軌（道）6 ，6之第1Y軸導件7，7來朝向Y方向（垂 直於紙面方向）可移動。Y機台4上面、則配設有與紙面平 行之X軸軌8，8 (僅顯示前述之軌道）》χγ機台5乃 本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇χ297公釐）-9 - ——Γ — J-----裝--------訂l·--L---線 " (請先閱讀背面之注意事項再填寫本f ) 經濟部中央標率局員工消費合作社印製 A7 ___B7_ ' 五、發明説明（7 ) 藉X軸導件9，9來載置於該X軸軌上。Y機台4乃由未 圖示之驅動手段形成可朝Y方向（基板之寬方向）移動自 如，XY機台5亦同樣設成由未圖示之驅動手段可朝.X方 向（基板之長度方向）移動自如。其結果，以驅動各驅動 手段而XY機台5就可朝XY方向可任意地移動。 XY機台5中心部則設有朝上面突出而被形成爲圓筒 狀之下機台支撐部5 a。下機台支撐部5 a之中心部則設 有上下成貫穿之攝影用孔部5 b。又在下機台支撐部5.a 外周部，嵌合有滾珠軸承1 〇，並將藉此所被支承之下機 台1 1可在水平面內形成擺動。下機台支撐部5 a乃藉該 滾珠軸承1 0來支撐下機台1 1可朝長（度）方向及寬（ 度）方向移動。 爲第2移動手段之互_Y機台手段3係配設於固定機台 1上面右端，設成支撐下機台1 1右端而可朝γ方向（基 板之寬方向）移動。互_γ機台手段3具備有，在朝垂直於 紙面方向設在固定機台1上之第2 Υ軸軌12，.12上， 藉第2Υ軸導件1 3，1 3可朝Υ方向移動自如所配.設之 Υ機台1 4 » Υ機台1 4乃由未圖示之驅動手段而可朝寬 方向（垂直於紙面之方向）移動。而在形成於γ機台1 4 上面中心部之圓柱狀之突起部1 4 a ，以藉滾珠軸承1 〇 嵌合著聯結構件1 5。再者’在聯結構件上面，設有第2 X軸導件1 5 a成一體。第2 X軸導件1 5 a乃與配設於 下機台1 1下面之第2X軸軌1 6嵌合著，而下機台1 1 乃形成對於Y機台1 4可朝X方向（長度方向）成相對性 本紙張尺度適用中國國家標準（CNS ) A4規格（21*^297公釐h 10 - ——_——.-----裝------訂L——.---線 i - (請先-^讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印製A7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Description (1) [Technical Field to Which the Invention belongs] The present invention relates to a method for manufacturing a multilayer substrate and a device for manufacturing the same. [Knowledge technology] The recent complexity of electronic products has required high density of printed circuit boards, and as one of the high-density printed circuit boards, a plurality of printed circuit boards are laminated. A multilayer substrate formed by a circuit connecting the layers. The multi-layer substrate is composed of a plurality of substrates printed with circuits printed on both sides, and is provided with an adhesive layer (Prepr eg Sheet, prepreg film) between the substrates to form fixed adhesives. The circuits of the substrates are connected to each other through through holes, but for the connection of these circuits, the correct alignment position must be implemented. As a means of aligning such positions, holes are to be opened at 2 to 4 places on the opposite sides of the substrates, and pins are penetrated through the holes to prevent misalignment of the various patterns. [Problems to be Solved by the Invention] However, when opening holes on each substrate and inserting pins there for positioning, it is not only necessary to align the position of the holes, but the operation of inserting pins is troublesome. The position of the hole is not always correct, so there is a limit in accuracy. For this reason, it is technically necessary to make holes in each substrate with high accuracy, and even if it is possible, achieving this state has a problem that production costs increase. [Methods for solving problems]. In order to solve the above-mentioned problems * in the present invention, it is individually equipped for photography (please read the precautions on the back before filling this page). Binding. Binding-line paper size applies Chinese National Standard (CNS) A4 specification (210 ' / 297mm) -4- A7 B7 V. Description of the Invention (2) When the mark positions of a pair of substrates are disjointed), and there is a difference between the marks of the substrates whose positional relationship is superimposed, remember, If the interval between the dislocations in the base image of one side is fixed at a fixed interval in the modified state and the other side overlaps, the interval between the dislocations in the target image is different. One base uses a template with a plurality of holes in advance to set the standard drill of the board to calculate the mark. (When the mark is marked, the part is drilled with the distance.) Let ’s make the space between the two substrates that are adhered to each other and divide it evenly between the two means to allow the dislocation between the two substrates (the substrates are formed correctly and the correction is between the marks on one side). Not marked The standard of the other party The standard board of the other party has a difference of two halves of the standard. One of the two sides of the board can be equal to the existing one. Clear identification becomes easy. Refilling each page of the bird's book is easy to implement. [Invention is based on a pair of substrates printed by one of the marks printed by the Central Laboratories of the Ministry of Economic Affairs, Central Standards Bureau, and Consumer Cooperatives.] When the position of the substrate is recorded, it is recorded and the other state] The end of the sticky paired square end is individually configured to obtain a dislocation (bit interval) that sets the relativeity of the image. Based on the other side, the connection layer of the present invention is used to maintain the state, and the multilayer substrate disposed on the other side is marked in advance on the two 1's, and the end portion of the manufacturing method of the target has a means to form the end portion. Take the second recording, mark each one, and obtain a pair of dislocations based on image processing.) The space between the marks on the board is not moved relative to each other. Dislocation, and there is a difference in the standard of one substrate, so that the standard of one substrate and the standard of the sample on one substrate apply to the Chinese National Standard (CNS) A4 specification (210X297 mm)-5-line A7 B7 V. Description of the invention (The interval and time between the records will be marked on the square substrate with a relative halving value, and fixed with amendments. It is printed on the above-mentioned substrate consumer's cooperative of any Ministry of Economics Central Standard Bureau. It is necessary to make another setting mark, and the state of the mark is formed when the substrate is fixed. When the setting plate is drilled first, the space between the two photographic spaces is square, and the setting is smaller and straighter. The multilayers that have been assembled into at least one of the present invention are at the above-mentioned interval, and a pair of substrates are moved with a difference between the marks on the other substrate by photography 3) to distribute the shame evenly. One end portion and the other end portion, so that the distance between one of the two end portions and the mark of the other substrate can be made equal to complete the dislocation. Candidates another adhesive substrate. In the method for manufacturing a multi-layer substrate, an adhesive layer is provided on one side and the other substrate is maintained in a non-contact state from the adhesive layer. After the two substrates are moved relatively, the plates are laminated on the adhesive layer. Ideal for layers. In any of the above-mentioned methods for manufacturing a multilayer substrate, the mark of one of the substrates in the board is regarded as a blank (blank dot). The mark of the other substrate is formed to have a diameter larger than the above blank, and the small diameter mark can be located inside the blank mark. In the above-mentioned manufacturing method of each of the multilayer substrates, one of the counterparts is made into a multi-layer substrate or a plurality of temporary substrates, so that three or more substrates can be laminated. . In the manufacturing method of the multilayer substrate, the method includes: arranging a template with a plurality of holes that are clearly discriminated with one of the first photography means to photograph one of the marked template holes at one end, In addition, when marking by the second photographic means on the square end, please read it, 'm in the hole section of the photo template. Read the back. Note on the surface, and then refill the binding page. The paper dimensions are applicable to Chinese national standards. (CNS) A4 specification (210X297 mm) _ 6 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (4) Another _. The center position of the two hole parts in the rat image area of the means > and the photography is calculated based on the center position in the image area of each hole part and the interval between the ingested hole parts that have been clearly identified in advance. The interval between the means > is calculated based on the interval between the two photographic means to modify a The process of the relative movement amount of the substrate dislocation is ideal. In the above-mentioned manufacturing method of the multi-layer substrate, the two substrates Z are fixedly assembled to use an iron ring with an end shape that is substantially annular (hor r η). ) To apply ultrasonic vibration to fuse the adhesive layer held between two substrates to make it ideal. The manufacturing device used in the above-mentioned multilayer substrate manufacturing method is a multi-calorie substrate manufacturing device mainly based on the adhesive layer. The fixed assembly has a pair of substrates marked in one of the two holes in advance. It is characterized by having. The first holding means for holding one of the above-mentioned pair of substrates is held by the other one of the pair of substrates. The second holding means facing one substrate can be photographed at one end of one of these substrates at the same time. The first photographing means of the marking of the substrate is also on the other of these substrates. Party 9 can simultaneously photograph the second photographing means of the marks arranged on a pair of substrates at the same time. A relative dislocation of the pair of substrates causes a pair of substrates to move relative to each other S1, the moving means used »and in a state where the dislocation between the two substrates has been corrected 9 Fix these-the substrates are fixed to each other The fixed assembly means used above. The moving means of the above-mentioned multi-layer substrate manufacturing device is provided with:> XY machine means for moving the substrate in the length direction and the width direction 1T line. The paper dimensions are applicable to Chinese national standards ( CNS) Α4 Specification (210X297mm) -7-Please fill in the note for reading and then fill in the J page A7 B7 Printed by the Bayer Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs _Package 5. Description of the Invention (5) XY machine It is ideal to use an iLT machine that is arranged side by side to move one substrate in the width direction, and make the images captured by the above-mentioned photographic means according to the image processing results implemented. The two holding means of the above-mentioned multi-layer substrate manufacturing device are formed so as to be close to each other and separable so that a pair of substrates are closely adhered to each other, and it can be fixedly assembled without dislocations being ideal. . The multi-layer substrate manufacturing apparatus described above is formed so that a plurality of hole templates for position confirmation provided with photographic means are provided on one of the two holding means, and a position confirmation provided with photographic means is provided on the tool form. A plurality of holes are used, and the intervals of these holes are clearly identified in advance. At least one of these holes can be taken in simultaneously with the mark located on one end of the substrate by the first photographing means, and At least one of the other holes may have a structure in which the mark located on the other end of the substrate can be taken in by the second photographing means at the same time so that the position confirmation of each photographing means can be easily performed. As a means of fixing and assembling the above-mentioned manufacturing apparatus for a multilayer substrate, it is desirable to use an ultrasonic welding method having an anvil angle with a substantially end shape in a ring shape. [Embodiment] First, the multilayer substrate P will be explained. As the simplest structure of a multi-layer substrate, there are two substrates P 1 and P 2 on the opposite sides of the adhesive layer B interposed on both sides to form a circuit pattern to fix the two substrates (see FIGS. 1 and 2). ). Alignment is pre-attached to the two ends of each substrate (please read the precautions on the back before filling this page). • Binding.-This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)- 8-Printed by A7 ,, ________B7 ___ of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (6) Marks ml, m2, nl, n2 for the location. In addition to the multi-layer substrate, in addition to the above, the printed circuit boards are constituted by stacking 3. 3 (6 layers) or 4 (8 layers). Usually, copper plates are bonded by an adhesive layer (insulation) above and below these substrates, and the copper plates are etched to make patterns. That is, in the final completion, two substrates with a Mann layer have four layers, three laminated substrates have six layers, and four laminated substrates have a rigid type of eight layers. The substrates P1 and P2 constituting the multilayer substrate are formed by forming a circuit pattern on both sides of the epoxy resin plate. The adhesive layer B is formed of a semi-hardened resin sheet (pre-impregnated film), and is hardened by heating so that the two substrates can fix the assembler. Next, a multilayer substrate manufacturing apparatus according to the present invention will be described with reference to Figs. As shown in the figure, on the fixed table 1, a moving means M for the substrate P is provided. The moving means M is provided at the left end of the upper side of the lower machine (the first holding means) 1 1, but is provided by the XY machine means 2 which are set to move the substrate in the length (degree) direction and the width (degree) direction, and are arranged in parallel. It is formed by the 2L_Y machine means 3 which can move the substrate in the wide direction on the upper right side of the lower machine 11. The XY machine means 2 which is the first moving means is provided, and the Y machine 4 and the XY machine 5 and the machine 4 placed on the fixed machine 1 are arranged so as to face the paper (picture) by fitting. The first Y-axis guides 6 and 6 extending in the vertical direction can move toward the Y direction (vertical to the paper surface). Above the Y machine 4, there are X-axis rails 8, 8 parallel to the paper surface (only the above-mentioned track is shown) "χγ machine 5 is a paper standard that applies the Chinese National Standard (CNS) A4 specification (21〇χ297 公) Li) -9-——Γ — J ----- install -------- order l · --L --- line " (Please read the notes on the back before filling in this f) Economy Printed by A7 _B7_ 'of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Foreign Affairs of the People's Republic of China. 5. Description of the Invention (7) The X-axis guides 9 and 9 are used to place the X-axis guide. The Y machine 4 is formed by a driving means (not shown) and can move freely in the Y direction (the width direction of the substrate), and the XY machine 5 is also set so that the driving means (not shown) can be moved in the X direction (the length of the substrate). Direction) to move freely. As a result, the XY table 5 can be arbitrarily moved in the XY direction by driving each driving means. The center portion of the XY table 5 is provided with a lower table support portion 5a protruding upward and formed into a cylindrical shape. A center portion of the lower platform supporting portion 5a is provided with a photographing hole portion 5b which penetrates up and down. A ball bearing 10 is fitted in the outer peripheral portion of the lower machine support portion 5.a, and the lower machine 11 supported by the ball bearing 10 can swing in a horizontal plane. The lower machine support portion 5a supports the lower machine 1 by the ball bearing 10 to move in the length (degree) direction and the width (degree) direction. For the second movement means, the _Y machine means 3 is arranged on the upper right end of the fixed machine 1 to support the right end of the lower machine 11 and can be moved in the γ direction (the width direction of the substrate). The cross-γ machine means 3 is provided on the second yoke rails 12, .12 provided on the fixed machine 1 in a direction perpendicular to the paper surface, and the second yoke guides 1 3, 1 3 can be oriented in the Υ direction. Equipped with free movement. Set up the machine table 1 4 »The machine table 1 4 can be moved in a wide direction (direction perpendicular to the paper surface) by driving means not shown. On the other hand, a cylindrical protruding portion 14 a formed at the center portion of the upper surface of the gamma table 14 is fitted with a link member 15 through a ball bearing 10. Furthermore, a second X-axis guide 15a is provided on the joint structure as a whole. The second X-axis guide 1 5 a is fitted with the second X-axis rail 16 arranged under the lower machine 1 1, and the lower machine 1 1 is formed so that the Y machine 14 can be oriented in the X direction ( Length direction) is relative. This paper size is applicable to China National Standard (CNS) A4 specifications (21 * ^ 297 mmh 10-----_——.----- installation ------ order L—— .--- line i-(please read the notes on the back before filling in this page) A7 B7 Printed by the Employees' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs
五、發明説明（8) 一 之移動。因此’下機台.1 1左端可由第1移動手段2而能 朝長（度）方向及寬（度）方向移動，至於右端則可由第 2移動手段3而能朝寬方向移動自如之同時，可由第2 χ 軸導件1 5 a及第2Χ軸軌1 6而容許朝著以第1移動手 段之朝長方向之移動。又伴隨著第1，2移動手段2 , 3 之朝Y方向之移動量之差之在下機台11之水平面內之擺 動，個別可由滾珠軸承10，10來順暢地對應。 在下機台（第1保持手段）1 1 ，內裝有予以吸著固 定載置於其上面之下基板P 1用之吸著手段（在圖面未顯 示）。又在下機台11上面配設有吸著且保持擬疊層於多 層基板P或下基板P 1之上基板P 2用之第2保持手段 1 7。第2保持手段1 7乃具備有在卡盤部1 7 a下面與 真空產生裝置成連通之吸著部，並對於與下機台1 1成一 體之吸著手段設成互相可接近且可（朝反方向）分離》 在爲第1移動手段之XY機台手段2上方，配設有構 成第1攝影手段C 1之第ΓΧ (射）線產生裝置1 8。而 在XY機台5下方則設有攝取來自第1X線產生裝置18 所照射之X (射）線之透射光用之X (射）線照相機1 9 。從第1之X線產生裝置所照射之X線，將透射基板P 1 ，P2，並通過設於XY機台5之孔部5 b會到達第IX 線照相機1 9 ，而可攝取配設於基板內之定位（用）標記 1111，111(參照第2圖）。 第1攝影手段C 1右方配設有第2攝影手段C2。構 成第2攝影手段C 2之第2X線產生裝置2 0及第2之X (請先閏讀背面之注意事項再填寫本頁) .裝. 訂 線 本紙張尺度適用中國國家標準（ CNS)A4規格（2丨0X297公釐广Π 一 經濟部中央標準局貝工消費合作社印製 A7 ' __B7___' .' 五、發明説明（9 ) 線照相機2 1 ’乃設成可個別由未圖示之移動手段成一體 地移動》 如圖2所示’在下機台11上下，配設有要加壓固定 裝配基板彼此用之複數之固定裝配手段2 2，2 2 (僅加 以圖示二處而已）。固定裝配手段2 2係在抵接應疊層之 基板之後，予以接近成相對向之電極棒前端來挾持兩基板 ’而予以加壓之同時加以通電來加熱黏接層之裝置所形成 。並以使用電極棒之加熱來使介居於基板間之黏接層（預 浸膠片）B成部分性之硬化，致使可固定裝配兩基板。 接著，對於多層基板之製造方法，將順著圖3所示之 流程圖來加以說明。 圖1中，當接通啓動開關時（步驟1)，首先，由第 2保持手段17來吸著保持下基板P1並載置於下機台 1 1上面而加以安置（步驟2 )。此時，由第1之攝影手 段C 1來攝取標記且求出其中心，以令該中心和滾珠軸承 10之中心實質上可成爲一致。被載置於下機台11上之 下（側）基板P1乃由配設於下機台之吸著手段來吸著固 定於下機台上之所定位置（步驟3)。 接著，由預浸膠片供給手段（未圖示）來形成黏接層 B於下基板P1上面（安置預浸膠片）（步驟4)。 接著，由第2保持手段（基板之吸著頭〇 1 7從上（ 側）基板收容部（未圖示）吸著上（側）其板P 2並加以 取出，且移動至所定位置而以與黏接層B隔著一定間隔成 非接觸狀態來加以保持（步驟5)。圖1係顯示下基板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）· 12 - 丨_—丨：-----裝-------訂——-I丨--線 . - - (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A 7 B7 ' , 五、發明説明（1Q) P 1和上基板P 2以一定間隔個別由保持手段所保持之狀 態者。 如前述，附在下基板P 1左端之定位用標記m 1係被 安置成可進入於第1攝影手段C 1之攝影範圍，同樣附在 上基板P 2左端之定位用標記η 1亦被安置成可進入於攝 影範圍。 接著，由第1攝影手段C 1來攝取上下基板左端之標 記m 1，η 1，而由第2攝影手段C 2來攝取上下基板右 端之標記m2，ml (參照圖4)。各攝影手段C1， C 2所進行之攝取標記，係由各X (射）線產生裝置1 8 ，2 0照射X (射）線於基板之標記位置，並由X (射） 線照相機1 9 ，2 1來攝取各標記之X (射）線圖像而實 施者.。 .各標記m，η乃爲了容易進行圖像處理，將下基板 Ρ 1之標記作成空白之環狀標記，而在上基板Ρ 2之標記 η則採用可收容於該環狀標記之空白部分之小的黑色圓狀 之標記（參照圖4 )。該等標記m，η乃被實施圖像處理 (步驟6)，以移動下機台11來調整成可使上（側）基 板之標記進入於下（側）基板之環狀標記之空白部分。 圖4係顯示個個附於上基板Ρ 2之點標記η 1 ，η 2 ，個別進入於附在下基板Ρ.1之空白的標記m 1 ’ m 2內 之狀態者。當空白之標記中心A 1 ’ A2 ’和點標記之中 心B 1，B 2之中心，個別成一致時，就成爲上下基板之 對稱位置爲完整之狀態。然而，一開始就使兩中心成爲一 本紙張尺度適用中國國家標隼（CNS )八4規格（210X297公釐卜13 - (請先閲讀背面之注意事項再填寫本頁) -裝 訂 經濟部中央標隼局員工消費合作社印製 A7 B7 五、發明説明（11) 致實爲極少，通常乃形成如圖示之個別爲位錯（位置脫節 )之狀態。 當該等之各標記m.，η由各攝影手段Cl，C2來攝 影時，就由圖像處理裝置（省略圖示）來進行要求出各標 記之中心位置A，Β之重心計算（步驟7 )。計算重心之 結果，因首先會計算聯結各重心A1—A2 ，B1 — B2 之線的位錯，因而，依據該計算值，將作爲已使基板P 1 兩端個別朝Y方向（垂直於紙（圖）面方向〕移動者，以 算出兩標記之中心位置成一致時之各中心位置間之距離 L 1，L 2之距離。該結果，對於下基板P 1之中心位置 A 1，A2間之距離L 1雖與上基板P 2之中心位置Β 1 ，B 2間之距離L 2之間會產生L 1 — L 2之差異，惟該 差，將實施朝左右個別平分爲（L 1 — L 2 ) /2之平分 計算（步驟8)，以調整對準爲一方基板P1之標記m之 中心和另一方基板P 2之標記η之中心之距離成爲相等。 亦即，使之成爲A 1 —Β 1間之距離和A 2 — Β 2間之距 離相等。 以如此地來進行由圖像處理所產生之位錯計算，當求 出上基板之檩記應移動之位置Bl / ，B2 <時，第1移 動手段2就會啓動，而使下機台1 1朝XY方向移動，以 令上基板左端之標記中心位置Β 1作相對移動來形成爲一 致於目標位置之Β 1 > (步驟9 )。而此時，下機台1 1 之朝長度方向之移動則僅以XY機台手段2來進行，而在 機台手段3則使第2 X軸軌1 6沿著第2 X軸導件 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐h 14 - -° 给； (請先閲請背面之注意事項再填寫本頁)V. Description of the invention (8) One move. Therefore, 'Down Machine. 1 1' can be moved in the long (degree) direction and width (degree) direction by the first moving means 2 at the left end, while being able to move in the wide direction by the second moving means 3 at the right end, The second x-axis guide 15 a and the second x-axis rail 16 allow movement in the long direction by the first moving means. With the movement of the first and second moving means 2 and 3 in the Y direction in the horizontal plane of the lower table 11, the ball bearings 10 and 10 can smoothly cope with each other. The lower machine (the first holding means) 1 1 is provided with a suction means (not shown in the drawing) for the substrate P 1 to be fixedly mounted on the lower part of the lower part. A second holding means 17 for sucking and holding the substrate P 2 to be laminated on the multi-layer substrate P or the lower substrate P 1 is arranged on the lower machine 11. The second holding means 17 is provided with a suction part which communicates with the vacuum generating device under the chuck part 17 a, and is provided to be mutually accessible and accessible to the suction means integrated with the lower machine 11 ( Towards the opposite direction) Separation "Above the XY machine means 2 as the first moving means, a Γ × (radiation) line generating device 18 constituting the first photographing means C 1 is arranged. An X (ray) camera 19 for capturing transmitted light from the X (ray) rays irradiated by the first X-ray generating device 18 is provided below the XY machine 5. The X-rays irradiated from the first X-ray generating device will pass through the substrates P 1 and P 2 and pass through the hole portion 5 b provided in the XY machine 5 to reach the IX-ray camera 1 9, and can be taken in and arranged. Positioning (with) marks 1111, 111 in the substrate (see Figure 2). A second photographing means C2 is disposed to the right of the first photographing means C1. The second X-ray generating device 20 and the second X that constitute the second photographic means C 2 (please read the precautions on the back before filling this page). Binding. Threading This paper size applies Chinese National Standard (CNS) A4 Specifications (2 丨 0X297mm wide) A7 '__B7___' printed by the Central Standards Bureau of the Ministry of Economic Affairs Shellfish Consumer Cooperatives. 5. Description of the invention (9) The line camera 2 1 'is designed to be individually movable by an unillustrated one As shown in FIG. 2, 'a plurality of fixed assembling means 2 2, 2 2 (only shown in two places for illustration) are used to pressurize and fix the assembling substrates to each other. The fixed assembly means 22 is formed by a device which is close to the substrates to be laminated, and is close to the front ends of the opposite electrode rods to hold the two substrates, and is pressurized while being energized to heat the adhesive layer. The electrode rod is heated to partially harden the adhesive layer (prepreg) B interposed between the substrates, so that the two substrates can be fixedly assembled. Next, for the manufacturing method of the multi-layer substrate, the method shown in FIG. 3 will be followed. Flowchart to illustrate. Figure 1 When the start switch is turned on (step 1), first, the second holding means 17 sucks and holds the lower substrate P1 and places it on the lower table 11 (step 2). At this time, the first The photographing means C 1 of 1 takes the mark and finds its center so that the center and the center of the ball bearing 10 can be substantially the same. The substrate P1 placed on the upper and lower (side) of the lower machine 11 is arranged by The suction means provided on the lower machine is used to suck and fix the fixed position on the lower machine (step 3). Next, a prepreg film supply means (not shown) is used to form an adhesive layer B on the lower substrate P1. (Place the prepreg sheet) (Step 4). Next, the second holding means (the suction head of the substrate 〇17) sucks the upper (side) plate P2 from the upper (side) substrate receiving section (not shown). And take it out, move it to a predetermined position and keep it in a non-contact state with a certain interval from the adhesive layer B (step 5). Figure 1 shows that the paper size of the lower substrate is applicable to China National Standard (CNS) A4 specifications (210X297mm) · 12-丨 _— 丨: ---------------------------- I --- line.--( (Please read the notes on the back before filling this page) Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A 7 B7 ', V. Description of the invention (1Q) P 1 and the upper substrate P 2 are individually held by the holding means at a certain interval. As mentioned above, the positioning mark m 1 attached to the left end of the lower substrate P 1 is placed so that it can enter the photographic range of the first photographing means C 1, and the positioning mark η 1 attached to the left end of the upper substrate P 2 is also It is placed so that it can enter the photographic range. Next, the first photographing means C 1 captures the marks m 1 and η 1 at the left end of the upper and lower substrates, and the second photographing means C 2 captures the marks m 2 at the right end of the upper and lower substrates, ml ( (See Figure 4). The taking marks performed by each of the photographing means C1, C2 are irradiated by the X (radiation) ray generating devices 18, 20 at the mark position of the substrate, and the X (radiation) camera 1 9 , 21 to take X (ray) line images of each mark and implement. Each mark m, η is for easy image processing. The mark on the lower substrate P 1 is made into a blank ring mark, and the mark η on the upper substrate P 2 is a blank portion that can be accommodated in the ring mark. Small black round marks (see Figure 4). These marks m, η are subjected to image processing (step 6), and the lower machine 11 is moved to adjust so that the mark on the upper (side) substrate can enter the blank portion of the ring mark on the lower (side) substrate. FIG. 4 shows the dot marks η 1 and η 2 attached to the upper substrate P 2 and each enters the state of the blank marks m 1 ′ m 2 attached to the lower substrate P.1. When the blank mark centers A 1 ′ A2 ′ and the dot mark centers B 1 and B 2 coincide with each other, the symmetrical positions of the upper and lower substrates are complete. However, at the beginning, the two centers became a paper size applicable to China National Standards (CNS) 8-4 specifications (210X297 mm 13-(Please read the precautions on the back before filling out this page)-Central standard of the Ministry of Binding A7 B7 printed by the Bureau ’s Consumer Cooperatives V. Invention Description (11) It is very rare, and usually it is in the state of dislocation (dislocation) as shown in the figure. When each of these marks m., Η is formed by When each photographing means Cl, C2 takes a picture, the image processing device (not shown) is required to calculate the center of gravity of the center position A, B of each mark (step 7). The result of calculating the center of gravity will be calculated first The dislocations of the lines of gravity A1—A2, B1—B2 are connected. Therefore, according to the calculated value, it will be regarded as the person who has moved both ends of the substrate P 1 in the Y direction (perpendicular to the direction of the paper (picture) plane). Calculate the distances L 1 and L 2 between the center positions when the center positions of the two marks are consistent. As a result, the distance L 1 between the center positions A 1 and A 2 of the lower substrate P 1 is the same as that of the upper substrate P 2. The center position B 1, the distance L 2 between B 2 There will be a difference between L 1 — L 2, but the difference will be divided into (L 1 — L 2) / 2 equal left and right (step 8) to adjust the alignment as the mark m of one substrate P1. The distance between the center and the center of the mark η of the other substrate P 2 becomes equal. That is, the distance between A 1 and B 1 and the distance between A 2 and B 2 are equal. The dislocations generated by the process are calculated. When the positions Bl /, B2 < of the upper substrate that should be moved are obtained, the first moving means 2 will be started, and the lower machine 11 will be moved in the XY direction to The center position B1 of the left end of the upper substrate is relatively moved to form B1 which is consistent with the target position (step 9). At this time, the lengthwise movement of the lower machine 1 1 is only performed by the XY machine. The second X-axis rail 16 is guided along the second X-axis in the machine method 3, and the paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mmh 14--). ° Give; (Please read the notes on the back before filling this page)
經濟部中央標準局負工消費合作社印製 A7 ____ B7_' 1 五、發明説明（12) . 1 5 a進行XY滑動來對應》對於此，由於名_γ機台手段 3而產生之下機台1 1之寬方向之擺動，個別可由滾珠軸 承1 0，1 0來對應。當左端之標記中心位置Β 1成爲一 致於B1 /之時，就接著實施可令上基板右端之標記中心 位置B2成爲一致於B2>之相對移動（步驟10)。而 該對準位置乃由第2移動手段3來使下機台1 1右端朝 XY方向移動而進行》該時，下機台之擺動亦同樣地可由 滾珠軸承1 0來對應。再者，亦可在算出下基板之標記所 應移動之目標位置之後，方予以實施柑對移動。 以如上述，依據上下基板之各標記中心位置A 1， Β 1及A 2，B 2予以修正位錯時，其次就降下爲第2保 持手段之吸著頭1 7，而如圖2所示，疊合上基板P 2於 安置在下基板P1上之黏接層B上（步驟11)。因黏接 層B係形成半硬化狀態，因而，僅在於該上面重疊上基板 .並不會使兩者接合。 接著，對於被疊合之兩基板，以固定裝配手段之一例 子之電極棒2 2之前端來加以推壓，並由通電於各電極棒 來實施局部性之加熱，以進行暫時固定裝配黏接層B之數 個部位之要被加熱部位（步驟1 2 > 。 當完成了暫時之固定裝配，就會釋放由第1保持手段 1 1 a所作之固定下基板P1至下機台1 1之情況’而爲 第2保持手段之吸著頭17就以保持著由被接合之兩基板 P 1，P 2所成之被暫時固定裝配之基扳P來上升（步驟 13)。而吸著頭1 7則可由未圖示之移動手段，以保持 本紙張又度適用中國國家標準（CNS)A4規格（210Χ297公釐卜15 - (請先閲讀背面之注意事項再填寫本頁) •裝_ 訂 線 經濟部中央標準局員工消費合作社印製 A7 B7 ' 五、發明説明（13) 著該被固定裝配著之基板p之狀態下來移動，並將其排出 於基板回收箱（省略圖示）（步驟14)。 以藉黏接層B來暫時予以固定裝配下基板P1和上基 板P 2之暫時固定裝配基板，將由另一裝置之熱壓機被實 施熱加壓，以整面性地加以熔解黏著而完成多層基板。兩 基板因以被對準位置之狀態下被暫時固定裝配著，因此， 形成即使被熱壓製後亦不具有會產生位錯之虞。在本發明 因以同一裝置來連續地進行對準位置和固定裝配（或暫時 固定裝配），因此，可謂幾乎不具有會產生位錯之虞。 接著，對於其他實施例加以說明。 爲了在上述實施例所說明之多層基板之製造裝置中， 可容易地確認攝影手段之位置而採用工模（Jig)板者， 在每一工模板之製造過程中，預先構成可由確認攝影手段 之位置而使算出基板之標記位置作成確實且容易者。 如圖5所示，工模板J係對於以所定寬度而與下（側 )機台11爲同一長度之長方形形狀之板體配設攝影手段 之位置確認用之複數之孔部所形成者。孔部乃由配設於與 位於基板一方之端部的標記能同時以第1攝影手段C 1可 攝取之位置之第1孔部5 1，及個別成相對向來並列配設 於與位於基板另一方端部之標記能同時由第2攝影手段 C 3 (參照圖6，7)所攝取之位置的第2孔部5 2所形 成。由於該等之孔部5 1 ，5 2之各間隔已預先瞭解，因 而，以該等之孔部作爲基準予以求出兩攝影手段間之間隔 ，並依據該結果來決定攝影手段之移動量而加以移動時， 本紙張又度適用中國國家標準（€阳）八4規格（210'乂297公釐）-16-~" ——.——：-----裝------訂------線 ' ·. 》 * (請先閎讀背面之注意事項再填寫本買) 經濟部中央標準局員工消費合作社印製 A7 ,. __—___B7 _ 五、發明説明（14) 就可容易地進行上下基板間之正確的對準位置。再者，與 第2孔部5 2成平行所設之長構孔5 3係標記攝影用之窗 孔。 將對於在本發明採用著工模之多層基板之製造裝置之 概要加以說明。 如圖6，7所示，基本性之結構係與上述之實施例爲 相同，因而，僅對於有相異之部分加以說明，有關共同之 部分將省略其說明，並對於圖式之符號將賦與同一之符號 〇 圖6，7係顯示設置工模板J於下機台11上面來進 行兩基板之位置對準之狀態者，以第1攝影手段C1能同 時攝影工模板J之第1孔部51和下基板P1之標記ml 及上基板P 2之標記η 1者。. 另一方面，要攝影多層基板右方用之第2攝影手段 C 3，係與第2 Υ機台手段6 3裝配成可形成一體來移動 。第2之Υ機台手段6 3係配設成舖設於固定機台1上面 及下機台1 1下面之第2Χ軸軌76 ’ 7 6所導引可朝X 方向（多層基板之長方向）移動。而在設成可滑動於舖設 (架設）於固定機台1上面之第2Χ軸軌7 6之X軸導件 75a上，固定裝配有Υ機台手段之移動機台75b。在 該移動機台7 5 b上面則配設有朝Y方向（多層基板之寬 (度）方向）展延之第2Y軸軌72 ’ 72。在移動機台 7 5 b上方，藉載置於各第2Y軸軌7 2上之第2Y軸導 件73 ，7 3來配設有第2Y機台7 4。而Y機台74中 本紙張尺度適用中國國家標準（<:阳）八4規格（210>< 297公釐卜17- -------.裝.------訂 l·--L---線 I (請先閲讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標隼局員工消費合作社印製 五 發明説明（ 15) | 央 部 則 成 圓 筒 狀 豎 立 來 形 成 Y 機 台 支 撐 部 並 在 其 周 圍 嵌 1 入 有 滾 珠 軸 承 7 0 〇 滾 珠 軸 承 7 0 上 面 則 形 成 已 陳 述 之 固 1 定 裝 配 於 設 在 下 機 台 1 1 下 面 之 Y 軸 導 件 7 5 〇 1 由 於 形 成 如 此 之 結 構 第 2 攝 影 手 段 C 3 之 X ( 射 ) 請 先 1 線 照 相 機 2 1 可 由 第 2 之 Y 機 台 手 段 6 3 而 朝 Y 方 向 ( 閲 背 1 1 多 層 基 板 之 寬 方 向 ) 移 動 之 同 時 如 上 述 之 可 由 移 動 機 台 面 之 注 Γ I 7 5 b 沿 著 X 軸 軌 7 6 7 6 來 朝 X 方 向 移 動 〇 而 第 2 攝 意 事 項 1 I 影 手 段 C 3 則沿 著 第 2 X 軸 軌 7 6 7 6 朝 X 方 向 移 動 9 再 填 1 寫 太 裝 並 可 同 時 地 來 攝 影 工 模 板 J 之 第 2 孔 部 5 2 之 至 少 其中 之 頁 1 1 一 和 下 基 板 P 1 之 標 記 m 2 及 上 基 板 之 標 記 Π 2 〇 1 1 接 著 將 對 於 本 實 施 例 之 對 準 下 基 板 P 1 和 上 基 板 1 1 P 2 之 位 置 的 方 法 加 以 說 明 如 下 .〇 1 訂 如 rwt 圖 8 所 示 工 模 板 j 之 第 1 孔 部 5 1 位 於 第 1 攝 影 1 手 段 C 1 之 X ( 射 ) 線 照 相 機 1 9 ( 參 照 圖 6 ) 之 tst 圖 像 區. 叫_ I 域 f 1 內 而 第 2 孔 部 5 2 5 2 則 位 於 第 2 攝 影 手 段 1 I C 3 之 X ( 射 ) 線 照 相 機 2 1 之 固 圖 像 區 域 f 2 內 〇 第 2 孔 線 I 部 5 2 係在 並 列 設 置 之 多 數 中 以 沿 著 X 軸 軌 7 6 移 動 第 1 | 2 Y 機 台 7 4 及 第 2 攝 影 手 段 C 3 直 至 下 基 板 P 1 之 標 記 1 1 m 1 可 收 入 之 位 置 之 狀 態 下 > 來 使 圖 8 所 示 之 2 個 能 位 於 rat 圖 像 區 域 f 2 內 0 此 時 > 就 能 以 已 知 之 孔 部 5 1 > 5 2 間 1 之 間 隔 作 爲 基 準 ( 參 考 ) » 容 易 地 可 算 出 兩 圖 像 區 域 f 1 > f 2 之 中 心 ( i 1 > i 2 ) 間 之 距 離 〇 1 I 亦 即 ， 由 园 圖 像 處 理 來 求 出 第 1 孔 部 5 1 之 中 心 和 孔 部 1 I 5 2 ( 即 使 爲 其 中 之 任 何 一 個 亦 可 ) 之 中 心 0 並 求 出 圖 像 1 1 1 士秘路i?疳谪用Φ圃圃宏換進· f CNS ) A4規格（210 X 297公釐）~ 18 一 經濟部中央標隼局員工消費合作社印裝 A7 __B7_____' 五、發明説明（16) 區域f 1之中心i 1和第1孔部5 1之中心的相對位置關 係，及圖像區域f 2之中心i 2和第2孔部5 2之中心的 相對位置關係。於此，由於兩孔部5 1 ，5 2間之間隔 L 3爲已知，因而，若考慮到上述之相對位置關係時，就 可求出兩圖像區域之中心i 1 ，i 2間之間隔L 4。 當攝影孔部51，5 2時，亦可同時攝影下基板P1 之標記m 1，m 2，及上基板P 2之標記η 1，η 2。並 與第1實施例同樣，配合於下基板之標記A1 ，Α2，而 會使移動手段2，3產生動作以令上基板之標記Β 1， Β2到達目標位置Bl> ，Β2> (參照圖4)。具體地 說時，首先由第1移動手段2來使基板左側之標記中心 Β1移動至Β 1 >之位置，接著，由第2之移動手段3來 使右側之標記中心Β 2移動至Β 2 >。該時，基板乃以固 定左側來移動右側》亦即，如圖7所示，因攝影手段C 1 ’ C 3被裝入於移動手段2，3之中心，因而攝影手段 C 3側會以攝影手段C 1之中心i 1 '(參照圖8 )爲轉動 中心來轉動。於此，首先所求出之攝影手段C 1 ，C 3間 之間隔L 4會成爲轉動半徑。以如此地，轉動半徑因已明 確’因而’爲使B 2來到B 2 <之位置用之移動手段3之 移動量，就可正確地加以算出。 在第1實施例之狀況時，若要移動基板右側，就會產 生轉動運動所進行之分量之誤差，而有必要進行錯誤嘗試 改正之修正’惟在本實施例，因轉動半徑爲已知，而可算 出由轉動運動所產生之移動量，因而，可求出亦考慮到該 張尺度適用中國國家標準（CNS ) A4規格（21〇χ 297公針19 ~ ~ ' ——；——：-----裝-------訂L——.---線 . = ' (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印掣 A7 ______B7____1 五、發明説明（17) 轉動運動之下的移動手段3所應移動之量，以致可容易且 正確地加以移動標記中心B 2至B 2 /之位置。 圖7係顯示以如上述的對準各基板P 1 ，P 2之標記 ml ’ nl及m2，n2之位置之後，藉預浸膠片B來疊 層兩基板之狀態者。而有關其他之過程則與上述之第1實 施例相同。 在本實施例，因預先已知道工模板之孔部間之間隔， 因而，以該孔部中心爲基準可求出X (射）線照相機1 9 ，21之視野中心距離，故可正確且容易地求出移動手段 之移動量。 又由於第2孔部5 2乃夾著長溝孔5 3每各一對成相 對向並列配設著，因而以求出在聯結該等之直線之圖像區 域內之傾斜狀況，而可察明攝影手段3之裝配誤差，因而 ，可作爲移動時之修正（用）資料。 又由於可經常攝影工模板之各孔部，因而，可適應於 機械之經年變化，而遍及長期間可實施印刷電路基板彼此 之正確定位。再者，由於配合工模板之孔部來進行標記之 對準位置，因而，在更換照相機時亦可瞭解照相機之位錯 量，致使具有更換照相機時之對準位置成爲容易之優點。 再者，實際上，圖4所示之標記A1 ，A2 ’ B1 ’ B 2及圖8所示之孔部5 1，5 2會顯示於同一畫面內， .惟爲了容易說明，將分爲圖4和圖8來顯示。 以上之說明，對於任何一實施例，均予以陳述疊層未 本纸張尺度適用中國國家標準（CMS ) A4規格（210χ2π公釐）· 20 - ----------裝------訂:-l·I-1--丨線 f (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 , l· _B7_ 五、發明説明（18) 形成電路圖型於表面之一張基板（一面基板或兩面基板） 彼此者。惟該等之基板亦可在下（側）基板或上（側）基 板之任何一方，或兩者均爲多層基板或暫時固定裝配之複 數基板者。 例如將下基板作爲以上述過程所製造之重疊2片（張 )(4層）之多層基板，而上基板作爲一片之兩面基板（ 2層）之時，對準位置用標記，就形成如圖9所示，除了 下基板兩端之m，η之外會增加上基板之g »而等分計算 亦可同樣地來進行。然而，如上述，由於聯結空白標記之 中心位置A 1，A 2之線上，已具有多層基板之上側基板 之標記η 1，η 2，因而，再在該線上予以加入上基板之 標記g 1 ，g 2之時，就會成爲混淆不易分辨，有可能成 爲難以對準位置。爲此，在如此之狀況時，就預先使上基 板之標記gl ，g2之中心位置配設於與下基板之標記中 心位置A1 ，A2有一定距離dl ，d2分開之位置，而 在對準位置之時，予以修正該距離d 'l，d 2之分量就可 。以如上述之方式，就可製造重疊3片（6層）之基板。 除此之外，作爲本發明之其他實施例，亦可令移動，手 段加設於X Y機台機構以作爲具備轉動機構之XY 0機台 ’而形成爲單一之移動手段。當然，此狀態時，要對準上 下基板之位置的要令，亦當然會有所不同。又在上述說明 以移動下機台1 1來對準位置，惟亦可作成相反之下機台 使之不動，而移動吸著頭來實施對準位置。再者，各攝影 手段雖形成位於XY機台等之移動手段之中心部之位置， 本紙張尺度適用中國國家標準（CNS )_A4規格（210X297公釐h 21 - (請洗閲讀背面之注意事項再填寫本頁) -裝· 訂 線 經濟部中央標準局員工消費合作社印製 ΑΊ Β7 _' 五、發明説明（19) 惟有關該狀態，亦可配設於移動手段之內外任何其中之一 0 再者，攝影手段並非僅限定於組合在上述各實施例所 採用之X (射）線產生裝置和X (射）線照相機，亦可構 成爲，個別配置C C D攝影機等於下機台之上下，以攝影 附上於個別基板表面之標記之結構。該時，下基板之標記 並不一定需要爲空白者，上基板之標記亦不需要爲小直徑 者。 上述各實施例，用以對準位置後之暫時固定用之固定 裝配手段，雖採用著電極棒，惟以下將對於進行超音波熔 接裝配之實施例加以說明。 在圖1 0所示之實施例，有關作爲固定裝配手段，配 設著具有傳達超音波振動用之鐵砧角（horn) 3 0及包覆 其外側之壓板3 1之超音波熔接手段。該鐵砧角3 0及壓 板3 1之前端形狀（抵接於基板之部分的形狀）乃顯示於 圖1 1 »在配設於壓板3 1之孔3 1 ή內部，令環狀之鐵 砧角位於該位置。以如此之狀態下，將與前述實施例同樣 ，修正兩基板之位錯之後，首先予以抵接壓板3 1於上基 板Ρ2，以形成固定兩基板PI ，Ρ2於下機台1 1上之 狀態下，予以降下鐵砧角3 0來抵接於上基板Ρ 2而施加 超音波振動。而該振動會傳達於兩基板PI ，Ρ2間之黏 接層（預浸膠片）Β以使黏接層熔融，而後被冷卻成硬化 ，就能使兩基板成暫時固定。壓板3 1亦具有要來防止所 熔化之預浸膠片滲出於壓板31以外之作用。 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐）-22 - ----^-----裝------訂—--_---線 * ^ ~ (請先閲讀背面之注意事項再填寫本f) A7 A7 經濟部中央標準局員工消費合作社印製 t 1 __B7 五、發明説明（2Q) 以下，將對於本實施例中，予以形成鐵砧角前端部 30a爲如圖所示之環狀之理由加以說明。 如圖1 3所示，並非使用著前端爲環狀之鐵砧角而是 使用中間爲實心之圓柱狀之鐵砧角之時，黏接層之與鐵砧 角3 2 a相對向之位置就不會成爲固定黏接，而是主要固 定黏接於其周邊，亦即壓板3 3之孔3 3 a和鐵砧角前端 部3 2 a外周之間隙之處（黏接固定之部分乃以點狀圖示 著）》因此，實際之固定黏著部分36形成較爲小之面積 而成爲效率不好亦缺乏黏著力。若如圖1 3所示，在壓板 3 3之孔3 3 a之直徑和鐵砧角前端部3 2 a之外徑之差 異爲較小時，尤其容易使固定黏接部分3 6之面積變爲狹 窄又會降低黏著力。此情況，乃由於在與鐵砧角前端部 3 2 a相對向之位置，會使熔化之預浸膠片由鐵砧角之振 動而重複地形成接觸分離，以致成爲不穩定之緣故，因而 ，有必要嚴密地來設定適當之黏著條件，惟要設定成如此 之條件及維持它亦並非容易。 爲此，如圖1 1所示，使甩前端爲環狀之鐵砧角3 0 之時，所熔化之預浸膠片會滯留於環狀之抵接部分內側之 凹部3 0 b和外側之溝狀部分（壓板3 1之孔3 1 a和鐵 砧角前端部3 0 a外周之間隙）’且不會受鐵砧角振動之 影響而重複地進行接觸分離之情事而成爲穩定’致使固定 黏接部分35之面積變爲廣闊而以極佳之效率下強有力地 被固定黏接。 又如圖1 2所示’當使用前端部3 4 a成爲兩層之環 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）-23 - '~~" -----------裝------訂-1丨_^---線 - (請先閱讀背面之注意事項再填寫本瓦) 經濟部中央標準局負工消費合作社印製 A7 B7 五、發明説明（21) 狀的鐵砧角時’就會在內側之凹部3 4 b，和中間之溝部 3 4 c ’及外側之溝狀部分（壓板3 i之孔3 1 3和鐵砧 角前端部34 a外周之間隙）生成固定黏接部分3 7，使 之黏著效率有所增進。 胃者’接合兩基板之方法，並非僅根定於至此所說明 之由電極棒來接合及超音波接合之方式，亦可利用黏接劑 來接合’以孔眼的金屬圏（eyelet)來夾緊接合，以焊錫 來接合。再者，亦可不加以進行如上述之暫時性之固定， 而在該裝置上予以安裝熱壓機，並在對準位置後，立即進 行全面性之接合。 又在上述實施例，雖以第2保持手段1 7來自動搬運 各基板及黏接層而加以安置，惟亦可構成爲，以手動載置 各基板及黏接層於下機台11之後，由第2保持手段17 僅吸著上基板來開始進行對準位置之動作的結構。 〔發明之效果〕 依據本發明，因以藉未硬化狀態之黏接層來保持個別 附上有對準位置用之標記的一對基板成相對向狀態，並以 實施該等標記之圖像處理，並在一方之上述基板之標記間 之間隔和另一方之上述基板之標記間之間隔不具有差異之 時，就使一方之上述基板之標記與另一方之上述標記重疊 ，而在一方之上述基板之標記間之間隔和另—方之上述基 板之標記間之間隔產生有差異之時’就以相對性地加以移 動上述兩基板，以平分分配差異之二等分值給予一方端部 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）~ 24 - ---I------裝------訂 l·---ul---線 - (請先閲讀背面之注意事項再填寫本f ) 經濟部中央標準局員工消費合作社印製 A7 t __—__ B7 ' 五、發明説明（22) 和另一方端部，以令在兩端部之一方之上述基板之標記和 另一方之上述基板之標記之距離使之能成爲相等來修正位 錯（位置脫節）之狀態下，方予以進行一對基板之固定黏 著作業，因而可製造成對準位置之精密度極高之多層基板 0 又以構成爲，予以形成黏接層於一對基板中之任何一 方，而使另一方之基板隔著一定間隔來保非接觸狀態，且 爲了兩基板之對準位置加以移動之後，方使另一方之基板 緊密地黏著於黏接層者，因而並不會受到黏接層之妨礙， 能以正確地對準位置之狀態下來加以固定黏著。 作爲該等對準位置用之標記，若使一方基板之標記爲 空白者，而另一方基板之標記則作成較該空白標記更爲小 直徑之時，就會形成容易地來算出各標記之中心位置，而 對於促進對準位置之自動化極有頁獻。 又一對之基板，即使個別爲單層基板或重疊基板有兩 (2 )片之多層基板，或暫時性地固定黏著之複數基板均 可用，因而，可容易地來製造疊層有3片以上之基板的多 層基板。 _ 依據本發明之多層基板之製造裝置’能製造以藉有關 本發明之製造方法來進行正確之對準位置的多層基板。 又以配設具備有在兩保持手段一方已預先瞭解中心間 之距離之複數之孔部的工模板，並將該等孔部作爲基準來 加以求出各基板之標‘記位置之時，除了可更正確且容易地 來實施對準位置之外，甚至在更換攝影手段之時等，亦具 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐h 25 - 丨_^-------裝------訂l·.__——丨線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標隼局員工消費合作社印製 A7 , - _^_ B7___匕 五、發明説明（23) 有可容易地來實施對準位置之功效。 當爲了接合兩基板而使用具有前端形狀實質上爲環狀 之鐵砧角之超音波熔接手段作爲固定黏著（裝配）手段時 ，就能以極有效率地來加以固定黏著。 〔圖式之簡單說明〕 圖1係在有關本發明之製造裝置中，顯示一對基板以 隔著一定間隔被保持成非接觸狀態的狀態之主要部分剖面 圖。 圖2係顯示一對基板藉黏接層成緊密黏貼之狀態的主 要部分之剖面圖。 圖3係顯示本發明之一實施例的多層基板製造過程之 流程圖。 圖4係顯示修正一對基板之各標記間之位錯用的說明 圖。 圖5係顯示配設工模板於下基板之狀態的平面圖。 圖6係顯示在其他之實施例中，一對基板以隔著一定 間隔被保持成非接觸狀態之狀態的主要部分之剖面圖。 圖7係顯示在其他之實施例中，使一對基板藉黏接層 成緊密黏貼之狀態的主要部分剖面圖。 圖8係顯示在其他之實施例中，配設於工模板之孔部 間之間隔和攝影手段間之間隔之關係的說明圖。 圖9.係顯示使一對基板之一方作爲多層基板時之標記 位置的說明圖。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐26 - 丨_-------裝-----丨訂l·,— -l·---線 (請先閲讀背面之注意事項再填寫本頁) Μ , Β7 ---------- — ____ 五、發明説明（24) 圖ίο係作爲固定黏著手段予以配設超音波熔接手段 之實施例的主要部分剖面圖。 圖11係顯示圖10所示之實施例之鐵砧角的說明圖 〇 圖1 2係顯示鐵砧角之其他例子的說明圖。 圖1 3係顯示鐵砧角之習知例的說明圖。 〔符號之說明〕 P ( Ρ 1，Ρ 2 ):基板 m ’ η，g :標記 B:黏接層（預浸膠片） C 1 :第1攝影手段 C2’ C3 :第2攝影手段 Μ:移動手段 2 · ΧΥ機台手段.（第1.移動手段） .3 · 機台手段（第2移動手段） 1 1:第1保持手段（下機台） II-------裝丨---- — 訂Ί-^—-Γ---線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印掣 頭 著 吸段 板手 基} 部 {配 域端 段裝 區 前 手 < 部像 ： 持著 孔圖 a 保黏 :: 角 4 2 定板 2 2 .站 3 第固模 5 f 鐵 ， * * · · ， 9 · _a 7 2: 1 1 ο ο IX CXI J LO -i oo oo 本纸張尺度適用中國國家標準（CNS)A4規格（ 210X297公釐h 27 -Printed by the Central Bureau of Standards, Ministry of Economic Affairs, Consumer Cooperatives A7 ____ B7_ '1 V. Description of the invention (12). 1 5 a XY sliding to correspond "For this, due to the name _γ machine means 3, the next machine The swing in the width direction of 11 can be individually matched by ball bearings 10, 10. When the mark center position B1 at the left end is consistent with B1 /, a relative movement is performed to make the mark center position B2 at the right end of the upper substrate coincide with B2> (step 10). The alignment position is performed by the second moving means 3 to move the right end of the lower table 11 in the XY direction. At this time, the swing of the lower table can also be correspondingly supported by the ball bearing 10. In addition, after the target position of the mark on the lower substrate should be calculated, the pair of movements can be performed. As described above, when the dislocations are corrected according to the center positions A 1, B 1 and A 2, B 2 of the respective marks on the upper and lower substrates, the suction head 17 which is the second holding means is lowered, and as shown in FIG. 2, The upper substrate P 2 is laminated on the adhesive layer B disposed on the lower substrate P 1 (step 11). Since the adhesive layer B is in a semi-hardened state, the substrate is merely superposed on the upper surface. The two are not bonded. Next, for the two substrates to be laminated, the front end of the electrode rod 22, which is an example of a fixed assembly method, is pressed, and local heating is performed by applying current to each electrode rod to perform temporary fixed assembly bonding. The parts to be heated in several parts of the layer B (step 1 2 >) When the temporary fixing assembly is completed, the fixed lower substrate P1 to the lower machine 1 1 by the first holding means 1 1 a will be released. "Case" and the suction head 17 as the second holding means is raised by holding the temporarily fixed base plate P formed by the two bonded substrates P1, P2 (step 13). The suction head 17 can be moved by means not shown in order to keep this paper suitable for China National Standard (CNS) A4 specifications (210 × 297 mm 15-(Please read the precautions on the back before filling out this page). Printed by the Consumers ’Cooperative of the Central Standards Bureau of the Ministry of Online Economics A7 B7 'V. Description of the invention (13) Move the substrate p fixedly assembled and discharge it to the substrate recovery box (not shown) (steps) 14). It is temporarily fixed by the adhesive layer B The temporarily fixed mounting substrate for assembling the lower substrate P1 and the upper substrate P 2 will be thermally pressurized by a hot press of another device to melt and adhere to the entire surface to complete the multilayer substrate. The two substrates are aligned to each other In this state, it is temporarily fixed and assembled, so there is no risk of dislocations even after being hot-pressed. In the present invention, the same device is used to continuously perform alignment and fixed assembly (or temporarily fixed assembly). Therefore, it can be said that there is almost no risk of dislocation. Next, other embodiments will be described. In order to easily confirm the position of the photographic means in the manufacturing apparatus of the multilayer substrate described in the above embodiment, a mold is used. (Jig) In the manufacturing process of each work template, it is pre-constructed that the position of the mark on the substrate can be calculated accurately and easily by confirming the position of the photography means. As shown in FIG. 5, the work template J The rectangular plate body having the same width as the lower (side) machine 11 is formed with a plurality of holes for confirming the position of the photographing means. The part is a first hole part 51 arranged at a position which can be taken by the first photographing means C 1 at the same time as the marker located on one end of the substrate, and is arranged in parallel with each other in parallel with the other part located on the substrate. The end mark can be formed by the second hole portion 52 at the position taken by the second photographing means C 3 (refer to FIGS. 6 and 7) at the same time. Since the intervals of the hole portions 5 1 and 5 2 have been previously set, Understand, therefore, when using the holes as a reference to determine the interval between the two photographic means, and to determine the amount of movement of the photographic means based on the result, the paper is subject to the Chinese national standard (European). Eight 4 specifications (210 '乂 297mm) -16- ~ " ——.——: ---------------------------- Order ---' Read the precautions on the back before filling in this purchase) Printed A7 by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. __—___ B7 _ V. Description of the invention (14) The correct alignment position between the upper and lower substrates can be easily carried out . Furthermore, a long structure hole 5 3 provided in parallel with the second hole portion 52 is a window hole for marking photography. An outline of a manufacturing apparatus for a multilayer substrate using a mold in the present invention will be described. As shown in Figures 6 and 7, the basic structure is the same as the above-mentioned embodiment. Therefore, only the parts that are different will be described. The common parts will be omitted from the description, and the symbols of the drawings will be given. The same symbols are shown in the same figure. Figures 7 and 7 show the state where the template J is set on the lower machine 11 to perform the position alignment of the two substrates, and the first hole of the template J can be photographed simultaneously by the first photographing means C1. 51 and the mark ml of the lower substrate P1 and the mark n 1 of the upper substrate P 2. On the other hand, the second photographing means C 3 used for photographing the right side of the multilayer substrate is assembled with the second machine tool 6 3 so as to be integrated to move. The second machine tool 6 3 is arranged to be laid on the fixed machine 1 and the lower machine 1 1 and the second X-axis rail 76 '7 6 can be guided in the X direction (long direction of the multilayer substrate). mobile. On the X-axis guide 75a provided on the second X-axis rail 76 that can be slid (erected) on the fixed machine 1, a mobile machine 75b equipped with a machine tool is fixed. A second Y-axis rail 72 ′ 72 extending in the Y direction (the width (degree) direction of the multilayer substrate) is provided on the moving machine 7 5 b. Above the moving table 7 5 b, the second Y table 74 is provided by the second Y axis guides 73 and 7 3 placed on each of the second Y axis rails 72. The paper size of the Y machine 74 is applicable to the Chinese national standard (<: yang) 8-4 specification (210 > < 297 mm) 17 -------. l · --L --- Line I (Please read the precautions on the back before filling out this page) A7 B7 Printed by the Consumers ’Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs, Five Invention Notes (15) | The central part is cylindrical Stand up to form the Y machine support and insert around it. 1 Ball bearing 7 0 〇 Ball bearing 7 0 is formed on the top. 1 It is fixed to the Y-axis guide provided under the lower machine 1 1 7 5 〇1 Because of this structure, the X (shooting) of the second photographing means C 3, please first the line camera 2 1 can be directed to the Y direction by the second Y machine means 6 3 (see the width direction of the 1 1 multilayer substrate) At the same time as moving, as described above, it can be moved by the note of the moving machine table. I 7 5 b moves along the X-axis rail 7 6 7 6 in the X direction. The second subject matter 1 I shadow means C 3 is along the first. 2 X axis track 7 6 7 6 Move in the X direction 9 Refill 1 Write too much and can come at the same time to photograph the second hole portion 5 of the template J 1 at least one of the pages 1 1 and the mark of the lower substrate P 1 m 2 and the mark of the upper substrate Π 2 〇 1 1 Next, the method of aligning the positions of the lower substrate P 1 and the upper substrate 1 1 P 2 in this embodiment will be described as follows. The first hole portion 5 1 of the template j is located in the tst image area of the X-ray camera 1 9 (see FIG. 6) of the first photography 1 means C 1. It is called the _ I domain f 1 and the second hole portion 5 2 5 2 is located in the fixed image area f 2 of the X (ray) line camera 2 1 of the second photographing means 1 IC 3 〇 The second hole line I part 5 2 is located in a side by side majority along the X axis Track 7 6 moves the first | 2 Y machine 7 4 and the second photographic means C 3 up to the mark 1 1 m 1 of the lower substrate P 1 which can be put into place Under the condition of > so that the two as shown in FIG. 8 can be located in the rat image area f 2 at this time > the known hole portion 5 1 > 5 2 interval 1 can be used as a reference (reference ) »The distance between the centers (i 1 > i 2) of the two image areas f 1 > f 2 can be easily calculated. That is, the first hole portion 5 1 Center and hole 1 I 5 2 (Even if it is any one of them) Center 0 and find the image 1 1 1 Shimi Road i? 圃 Use Φ Pupu macro · f CNS) A4 size ( (210 X 297 mm) ~ 18-Printed on A7 __B7_____ 'by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (16) Relative position relationship between the center i 1 of the area f 1 and the center of the first hole 51 And the relative positional relationship between the center i 2 of the image area f 2 and the center of the second hole portion 52. Here, since the distance L 3 between the two hole portions 5 1 and 5 2 is known, if the above-mentioned relative position relationship is considered, the center i 1 and i 2 between the two image regions can be obtained. Interval L 4. When the holes 51, 52 are photographed, the marks m1, m2 of the lower substrate P1 and the marks η1, η2 of the upper substrate P2 can be photographed simultaneously. In the same way as in the first embodiment, the marks A1 and A2 on the lower substrate are combined to cause the moving means 2 and 3 to move so that the marks B1 and B2 on the upper substrate reach the target positions Bl > and B2 > (refer to FIG. 4) ). Specifically, first, the first moving means 2 moves the mark center B1 on the left side of the substrate to the position of B 1 > and then, the second moving means 3 moves the right mark center B 2 to B 2. >. At this time, the substrate moves to the right by fixing the left side. That is, as shown in FIG. 7, since the photographing means C 1 ′ C 3 is installed in the center of the moving means 2, 3, the photographing means C 3 side will take photographs. The center i 1 ′ (see FIG. 8) of the means C 1 is the rotation center to rotate. Here, the distance L 4 between the photographing means C 1 and C 3 obtained first becomes the radius of rotation. In this way, since the turning radius is clear, the amount of movement of the moving means 3 for bringing B 2 to the position of B 2 < can be accurately calculated. In the case of the first embodiment, if the right side of the substrate is to be moved, an error in the component of the rotational movement will occur, and it is necessary to correct the error by attempting to correct it. However, in this embodiment, because the radius of rotation is known, And the amount of movement generated by the rotation can be calculated. Therefore, it can be calculated and taken into account that the scale is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ 297male 19 ~~ '——;-:- ---- Equipment ------- Order L ——.--- line. = '(Please read the precautions on the back before filling out this page) The Central Government Bureau of the Ministry of Economic Affairs's Consumer Cooperatives Seal A7 ______B7____1 5 Explanation of the invention (17) The amount by which the moving means 3 should be moved under the turning motion, so that the positions of the mark centers B 2 to B 2 / can be easily and accurately moved. Figure 7 shows the alignment of the respective points as described above. After the positions of the substrates P 1 and P 2 are marked with ml 'nl and m 2 and n 2, the state of the two substrates is laminated by the prepreg B. The other processes are the same as those of the first embodiment described above. In the embodiment, since the interval between the hole portions of the work template is known in advance, The center distance of the field of view of the X (ray) line cameras 19, 21 can be obtained based on the center of the hole, so that the amount of movement of the moving means can be accurately and easily calculated. The second hole 5 2 is sandwiched. Each of the long groove holes 5 3 is arranged in pairs facing each other. Therefore, in order to obtain the tilt condition in the image area connecting the straight lines, the assembly error of the photographic means 3 can be found. Therefore, it can be used as Correction (use) data when moving. Also, because the holes of the template can be photographed frequently, it can adapt to the changes of the machine over the years, and the correct positioning of the printed circuit boards can be implemented over a long period of time. The alignment position of the mark is matched with the hole portion of the work template, so the amount of dislocation of the camera can also be known when the camera is replaced, so that it has the advantage of being easy to change the alignment position when the camera is replaced. In addition, actually, the figure The marks A1, A2'B1'B2 shown in 4 and the holes 51, 52 shown in Fig. 8 will be displayed on the same screen. However, for ease of explanation, they will be divided into Figs. 4 and 8 to display. The above description, for any In the examples, it is stated that the size of the paper is not applicable to the Chinese National Standard (CMS) A4 specification (210 x 2π mm) · 20----------- installation ------ order:- l · I-1-- 丨 line f (please read the precautions on the back before filling this page) Printed by A7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, l · _B7_ V. Description of the invention (18) Form the circuit pattern on the surface One substrate (one substrate or two substrates) each other. However, these substrates can be either one of the lower (side) substrate or the upper (side) substrate, or both are multilayer substrates or a plurality of substrates temporarily fixedly assembled. By. For example, when the lower substrate is a multilayer substrate (two layers) (two layers) manufactured by the above process, and the upper substrate is a two-sided substrate (two layers), a mark is used to align the position. As shown in Fig. 9, in addition to m and η at both ends of the lower substrate, g »of the upper substrate is increased, and the division calculation can be similarly performed. However, as described above, since the center position A1, A2 of the blank mark is connected with the marks η1, η2 of the upper substrate of the multilayer substrate, the mark g1 of the upper substrate is added to the line. At g 2, it will become confused and difficult to distinguish, and may become difficult to align. For this reason, in such a situation, the center position of the marks gl, g2 of the upper substrate is arranged in advance with the mark center positions A1, A2 of the lower substrate at a certain distance dl, and d2 is separated, and in the alignment position At this time, the components of the distance d'l, d2 may be corrected. In the manner as described above, it is possible to manufacture a substrate in which three pieces (six layers) are stacked. In addition, as another embodiment of the present invention, it is also possible to make the movement, and the means is added to the X Y machine mechanism to form a single moving means as the XY 0 machine having a rotation mechanism. Of course, in this state, the requirements for aligning the positions of the upper and lower substrates are of course different. In the above description, the lower machine 11 is moved to align the position, but the opposite machine can also be made to move and the suction head is moved to perform the alignment. In addition, although each photographic means is located at the center of a mobile means such as an XY machine, this paper size applies the Chinese National Standard (CNS) _A4 specification (210X297 mmh 21-(Please wash and read the precautions on the back again) (Fill in this page)-Printed and printed by the Central Consumers Bureau of the Ministry of Economic Affairs, Consumer Cooperatives ΑΊ Β7 _ 'V. Description of the invention (19) However, this state can also be assigned to any of the mobile means inside and outside 0 The photography means is not limited to the combination of the X (radiation) line generating device and the X (radiation) line camera used in the above embodiments, and it can also be configured such that the individual configuration of the CCD camera is equal to the top and bottom of the lower machine to take the photo The structure of the mark attached to the surface of the individual substrate. At this time, the mark of the lower substrate does not necessarily need to be blank, and the mark of the upper substrate does not need to be a small diameter. The above embodiments are used to align the positions. Although the fixing assembly means for temporary fixing uses electrode rods, an embodiment for performing ultrasonic welding and assembly will be described below. The embodiment shown in FIG. An assembling means is provided with an ultrasonic welding means having an horn 30 for transmitting ultrasonic vibration and a pressure plate 31 covering the outside thereof. The shape of the anvil end 30 and the front end of the pressure plate 31 (The shape of the part abutting the substrate) is shown in Fig. 1 »Inside the hole 3 1 priced in the pressure plate 3 1 so that the ring-shaped anvil corner is located at this position. In this state, it will be related to In the same embodiment as above, after correcting the dislocation between the two substrates, the pressure plate 31 is first abutted on the upper substrate P2 to form the fixed two substrates PI, and the anvil angle 3 is lowered in a state where P2 is on the lower machine 11. 0 to abut the upper substrate P 2 and apply ultrasonic vibration. This vibration will be transmitted to the adhesive layer (prepreg) B between the two substrates PI and P 2 to melt the adhesive layer and then be cooled to harden. The two substrates can be temporarily fixed. The platen 31 also has the effect of preventing the melted prepreg from leaking out of the platen 31. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)- 22----- ^ ----- install ------ order ---_--- line * ^ ~ (Please read first Note on the back, fill in this again f) A7 A7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs t 1 __B7 V. Description of the Invention (2Q) Below, in this embodiment, the anvil corner front end portion 30a is formed as follows The reason for the ring shape shown in the figure will be explained. As shown in Figure 13, when the anvil corner with a ring-shaped front end is used instead of a solid cylindrical anvil corner with a middle, the bonding layer and the The opposite position of the anvil corner 3 2 a will not become fixed adhesion, but mainly fixed to the periphery, that is, the gap between the hole 3 3 a of the pressure plate 3 3 and the front end of the anvil corner 3 2 a. (The part that is fixed and glued is shown in a dot shape) "Therefore, the actual fixed and fixed glued part 36 forms a relatively small area, which is not efficient and lacks adhesion. If the difference between the diameter of the hole 3 3 a of the pressure plate 33 and the outside diameter of the anvil corner front end portion 3 2 a is small as shown in FIG. 13, it is particularly easy to change the area of the fixed adhesive portion 36. Being narrow also reduces adhesion. In this case, because the position opposite to the anvil corner front end 3 2 a will cause the molten prepreg to repeatedly contact and separate due to the vibration of the anvil corner, so that it will become unstable. It is necessary to set proper adhesion conditions strictly, but it is not easy to set such conditions and maintain it. Therefore, as shown in FIG. 11, when the tip end is made into a ring-shaped anvil angle 3 0, the melted prepreg will stay in the concave portion 3 0 b inside the ring-shaped abutting portion and the groove outside. (The gap between the periphery of the hole 3 1 a of the pressure plate 3 1 and the front end of the anvil corner 30 a) 'and it will not be affected by the vibration of the anvil corner and will repeatedly contact and separate to become stable. The area of the joint portion 35 becomes wide and is strongly fixed and adhered with excellent efficiency. As shown in Figure 12 'When the front end 3 4 a becomes a two-layered ring, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -23-' ~~ " ----- ------ Equipment ------ Order-1 丨 _ ^ --- line- (Please read the precautions on the back before filling in this tile) Printed by A7 B7 V. Description of the invention (21) When the anvil-shaped corners are 'the inner recess 3 4 b, the middle groove 3 4 c' and the outer groove (the hole 3 1 3 of the pressure plate 3 i and the anvil) The gap at the outer periphery of the corner front end portion 34a) generates a fixed adhesive portion 37, which improves the adhesion efficiency. The stomacher's method of joining two substrates is not only based on the electrode rod and ultrasonic bonding methods described so far, but it can also be bonded with an adhesive to clamp with a metal eyelet. Bonding, soldering. Furthermore, instead of the temporary fixing as described above, a heat press may be installed on the device, and after the alignment position, a comprehensive joint is performed immediately. In the above-mentioned embodiment, although the second holding means 17 is used to automatically transport and place each substrate and the adhesive layer, it may be configured to manually place each substrate and the adhesive layer after the lower machine 11. The second holding means 17 is configured to start only the upper substrate and perform the alignment operation. [Effects of the Invention] According to the present invention, a pair of substrates with respective marks for alignment positions are held in an opposing state by an adhesive layer in an unhardened state, and image processing of these marks is performed. And when there is no difference between the interval between the marks on one of the substrates mentioned above and the interval between the marks on the other substrate, the mark on the substrate on one side overlaps with the mark on the other side, and on the one side When there is a difference between the interval between the marks on the substrate and the interval between the marks on the other side, the two substrates are moved relative to each other, and one end of the paper is divided into two equal divisions of the difference. The scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) ~ 24---- I ------ installation ------ order l · --- ul --- line- (please first Read the notes on the back and fill in this f) A7 t _____ B7 'printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of the invention (22) and the other end, so that the above Marking of the substrate and marking of the other substrate The distance can be equal to correct dislocations (dislocations), and then a pair of substrates can be fixed and glued. Therefore, a multilayer substrate with extremely high precision of alignment can be manufactured. , Forming an adhesive layer on any one of a pair of substrates, and keeping the non-contact state of the other substrate at a certain interval, and after moving the alignment position of the two substrates, make the other substrate tight Those who are ground adhered to the adhesive layer are not hindered by the adhesive layer, and can be fixed and adhered in a state of correct alignment. As the marks for such alignment positions, if the mark on one substrate is blank and the mark on the other substrate is made smaller than the blank mark, the center of each mark can be easily calculated. Position, and is extremely helpful for automation that facilitates alignment. For another pair of substrates, even a single-layer substrate or a multi-layer substrate with two (2) pieces of overlapping substrates, or a plurality of substrates that are temporarily fixed and adhered, can be used. Therefore, it is easy to manufacture a laminate with more than 3 pieces Multilayer substrate. _ The apparatus for manufacturing a multi-layer substrate according to the present invention ' can manufacture a multi-layer substrate for performing accurate alignment by the manufacturing method of the present invention. In addition, when a work template having a plurality of hole portions having a distance between the centers that has been previously known by one of the two holding means is provided, and the mark positions of the respective substrates are determined using these hole portions as a reference, In addition to the alignment position, it can be implemented more accurately and easily, even when changing the photography method, etc., the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mmh 25-丨 _ ^- ----- Equipment ------ Order l · .__—— 丨 line (Please read the precautions on the back before filling this page) Printed by A7, Consumer Cooperatives of Central Bureau of Standards, Ministry of Economic Affairs,-_ ^ _ B7___ D. V. Description of the invention (23) The effect of aligning position can be easily implemented. When bonding two substrates, using ultrasonic welding means with anvil corners with a substantially circular front end shape as a fixed adhesive [Assembly] means, it can be fixed and adhered with high efficiency. [Simplified description of the drawing] Fig. 1 shows a manufacturing device according to the present invention, which shows that a pair of substrates are held in a non-spacing manner at certain intervals. A cross-sectional view of the main part of the contact state. 2 is a cross-sectional view of a main part showing a state where a pair of substrates are closely adhered by an adhesive layer. FIG. 3 is a flowchart showing a manufacturing process of a multilayer substrate according to an embodiment of the present invention. An explanatory diagram of the dislocations between the marks. Fig. 5 is a plan view showing a state where a working template is provided on the lower substrate. Fig. 6 is a view showing another embodiment in which a pair of substrates are held at intervals with a certain interval. A cross-sectional view of a main part in a state of a contact state. FIG. 7 is a cross-sectional view of a main part showing a state in which a pair of substrates are closely adhered by an adhesive layer in other embodiments. FIG. 8 is a view showing other embodiments In the figure, it is an explanatory diagram showing the relationship between the space between the holes in the template and the space between the photographic means. Fig. 9 is an explanatory diagram showing the position of a mark when one of a pair of substrates is used as a multilayer substrate. Applicable to China National Standard (CNS) A4 specification (210X297 mm 26-丨 _------- install ----- 丨 order l ·,--l · --- line (please read the note on the back first) Please fill in this page again for matters) Μ, Β7 ---------- — ____ 5 Explanation of the invention (24) FIG. 8 is a sectional view of a main part of an embodiment in which an ultrasonic welding means is provided as a fixed adhesive means. FIG. 11 is an explanatory view showing anvil corners of the embodiment shown in FIG. 10 FIG. 1 2 is an explanatory diagram showing other examples of anvil corners. Fig. 1 3 is an explanatory diagram showing a conventional example of anvil corners. [Explanation of symbols] P (P 1, P 2): substrate m 'η, g: Mark B: Adhesive layer (prepreg film) C 1: The first photographic means C2 'C3: The second photographic means M: the moving means 2 · XY camera means. (The 1. moving means). 3 · the means (The second means of movement) 1 1: The first means of holding (down the machine) II ------- installation 丨 ---- — order-^-Γ --- line (please read the first Please fill in this page again.) The Central Government Bureau of Standards, Ministry of Economic Affairs, the Consumer Cooperatives Co., Ltd. is holding the suction section wrench base} Department {Front end section loading area front hand < part image: Holding hole diagram a sticky: :: corner 4 2 Fixing plate 2 2 .Station 3 No. 5 die of iron, * * · ·, 9 · _a 7 2: 1 1 ο IX XI CXI J LO -i oo oo This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 mm h 27-