JP2007149936A - Flexible substrate sheet temporarily adhering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for automatically and temporarily adhering a sheet material (coverlay, reinforcing plate) with higher accuracy to a flexible substrate. <P>SOLUTION: After correction of displacement of a flexible substrate 1 fixed to a fixing surface 3a of a first table 3 and a coverlay film 2 fixed to a fixing surface 4a of a second table 4, the first table 3 goes downward up to the location just above the second table 4 with movement in the direction Z of a supporting arm 7, and the flexible substrate 1 fixed to the fixing surface 3a of the first table 3 and the coverlay film 2 fixed to the fixing surface 4a of the second table 4 are mutually overlapped. Moreover, under this condition, the flexible substrate 1 and the coverlay film 2 are thermally deposited at the multiple areas and are then adhered temporarily with a thermal deposition means 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sheet material temporary sticking device used in a temporary sticking step of a cover lay or a reinforcing plate in a manufacturing process of a flexible substrate in which a conductor pattern is formed on the surface of a flexible insulating substrate.

  Printed circuit boards used in various electrical and electronic devices are classified into flexible substrates and rigid substrates depending on the material of the insulating substrate, and the insulating substrate formed of a flexible material such as polyimide resin is flexible. It is called a substrate (FCR). Also, this type of printed wiring board includes a single-sided printed wiring board in which a conductor pattern is formed on one surface of an insulating substrate, and a double-sided printed wiring board in which a conductor pattern is formed on both surfaces of the insulating substrate and the other surface.

  The manufacturing process of said flexible substrate can be divided roughly into a pre-process, a post-process, and an additional processing process (refer the following patent documents 1-8).

  The pre-process is a process of forming a metal foil such as copper on the surface of an insulating substrate such as a polyimide film, a resist (photoresist) is formed on the surface of the metal foil, and processed into a desired shape pattern by exposure processing and development processing. It includes a step of forming a conductor pattern (conductor circuit) by a step, etching and resist removal treatment. When forming a conductor pattern on both sides of an insulating substrate, a through-hole that penetrates the insulating substrate and the conductor pattern on both sides is formed, and metal plating is formed including the inner peripheral surface of the through-hole. In some cases, the conductor patterns on both sides are connected via metal plating on the sides.

  The post-process includes a step of attaching a protective sheet called a coverlay film to the surface of the insulating substrate on which the conductor pattern is formed. As a coverlay film, a film in which a thermosetting adhesive such as epoxy or acrylic is applied to one surface of a resin film (polymer film) such as a polyimide film is often used. This cover lay film is pre-formed with windows (openings) by machining such as pressing in the portions corresponding to the exposed portions of the conductor pattern, such as the terminal portions of the conductor pattern and joints with parts, and then the adhesive is applied. In general, the other surface is accurately aligned and superposed on the surface of the insulating substrate on which the conductor pattern is formed, and is bonded by thermocompression bonding using a press or the like. In recent years, photosensitive coverlay films (photosensitive dry film resists) are often used. In the case of this photosensitive cover lay film, there is an advantage that the window of the exposed portion of the conductor pattern can be formed by the exposure process and the development process after being attached to the surface of the insulating substrate, and it is insulated without using an adhesive. There is an advantage that thermocompression bonding can be performed directly on the surface of the substrate (see Patent Document 7 below).

  In a subsequent process, a reinforcing sheet called a reinforcing plate may be attached to a portion that needs reinforcement, such as the back side of the position of the connection terminal on the flexible substrate. As the reinforcing plate, a thin metal plate such as aluminum or stainless steel or a resin film (polymer film) such as polyimide film or polyester tellurium film coated with a thermosetting adhesive such as epoxy or acrylic is used. However, due to the recent trend of thinning of the entire flexible substrate, many reinforcing plates based on resin films (polymer films) have been used.

  Regarding the pasting of the coverlay film, Patent Document 3 discloses a tape-like substrate (1) on which a necessary wiring pattern is formed and a tape-like shape in which portions corresponding to connection terminal portions of the wiring pattern are cut out in advance by a press or the like. The cover lay film (2) is fed continuously into the vacuum chamber (10), fixed to the upper and lower molds of the laminating machine (14, 15) in the vacuum chamber, and then moved by moving the upper and lower molds. It is disclosed that a cover lay film (2) is bonded to a substrate (1) and then firmly bonded with a hot roll (16).

  Further, in Patent Document 4, a tape-shaped flexible wiring board in which a necessary wiring pattern is formed, and a tape-shaped coverlay film provided with a notch at a location corresponding to a predetermined site such as a connection terminal portion, A plurality of alignment marks are formed, and the alignment marks are read by an optical sensor to calculate the distance to the bonding machine, and the error between the alignment marks and the design value is calculated. It is disclosed that the flexible wiring board and the cover lay film are aligned and pasted by a laminating machine by controlling the respective feeding motors of the flexible wiring board and the cover lay film based on the calculation result.

  Regarding sticking of a reinforcing plate, Patent Document 5 creates a work (11) in which a flexible printed circuit board (8), a reinforcing plate (9), and a cushion plate (22) are sandwiched between a pair of molds (21, 23). Then, the work (11) is housed in a heat-resistant vacuum box (12), the inside of the vacuum box (12) is evacuated, and a pressing force and heat are applied through the vacuum box (12). 11) It is disclosed that the flexible printed circuit board (8) and the reinforcing plate (9) are thermocompression bonded.

In Patent Document 6, when a reinforcing plate (1) is attached to a flexible substrate (1010) continuously formed on a tape-like substrate (100), the reinforcing plate (1) is attached to the flexible substrate (1010). It is disclosed that the positioning mark is formed and the reinforcing plate (1) is positioned by pattern matching by image recognition or mechanical positioning means.
JP-A-7-283494 Japanese Patent Laid-Open No. 2003-8204 JP 62-117389 A Japanese Patent Laid-Open No. 62-132394 Japanese Patent Laid-Open No. 7-170032 JP 2004-186505 A JP 2004-326024 A

  As described above, generally used coverlay films are formed using a thin resin film (polymer film) as a base material, and a window is provided in advance in a portion corresponding to the exposed portion of the conductor pattern. When affixing this coverlay film to the surface of the insulating substrate on which the conductor pattern is formed, temporarily affix the coverlay film to the surface of the insulating substrate with the window portion accurately aligned with the exposed portion of the conductor pattern. Has been done. However, it is difficult to automate the process of accurately aligning the window part of the coverlay film made of a thin resin film (polymer film) with the exposed part of the conductor pattern, and the above temporary application process is currently almost a manual process. What is being done is the actual situation. Therefore, the temporary sticking process has poor work efficiency and has been one factor that hinders the reduction in manufacturing costs of flexible substrates.

  In this respect, in Patent Documents 3 and 4, a tape-shaped insulating substrate on which a conductor pattern is formed and a tape-shaped coverlay film in which a window is provided in advance in a portion corresponding to the exposed portion of the conductor pattern are respectively sent to a laminating machine. It is conveyed and pasted together with a laminating machine, but it is inevitable that the coverlay film will be deformed due to the tension during feeding and feeding to the thin tape-like coverlay film provided with windows. Therefore, it is practically impossible to accurately match both positions by controlling the feed motor.

  When using a photosensitive cover lay film, there is little difficulty in alignment as in the case of the cover lay film. Recently, however, the cover lay film may be divided into a plurality of sheets on the surface of one insulating substrate. In such a case, even if it is a photosensitive cover lay film, it is necessary to temporarily affix each film to a predetermined position on the surface of the insulating substrate. There is a problem similar to ray film.

  In addition, in pasting a reinforcing plate, Patent Document 5 discloses that a work in which a flexible printed board, a reinforcing plate, and a cushion plate are sandwiched between a pair of molds is prepared. There is no description on how to align the flexible printed circuit board and the reinforcing plate. Further, Patent Document 6 discloses that the reinforcing plate is positioned by pattern matching based on image recognition or mechanical positioning means. However, the same document discloses a positioning mark that is provided on a tape-like flexible substrate. It relates to the form, and there is no description about the specific mode of the positioning and sticking process.

  An object of the present invention is to automatically and temporarily attach a sheet material (coverlay, reinforcing plate) to a flexible substrate in a manufacturing process of a flexible substrate in which a conductor pattern is formed on the surface of a flexible insulating substrate. It is to provide a device that can.

  In order to solve the above problems, the present invention is an apparatus for temporarily adhering a sheet material to a flexible substrate having a conductive pattern formed on the surface of a flexible insulating substrate, the first table for fixing the flexible substrate, and a sheet A second table for fixing the material, a position detecting means for detecting the position of the flexible substrate fixed to the first table and the position of the sheet material fixed to the second table, and at least one of the first table and the second table A flexible substrate and a second table fixed to the first table by adjusting the position of at least one of the first table and the second table based on the detection result of the driving means for moving and driving the one and the position detection means A misalignment correcting means for correcting misalignment with the sheet material fixed to the first sheet, a first table whose position is adjusted by the misalignment correcting means, and a first table The flexible substrate and the sheet material are driven in proximity to each other in the opposite direction by the driving means, and the flexible substrate fixed to the first table and the sheet material fixed to the second table are overlapped with each other. And a thermocompression bonding means for temporarily affixing and temporarily bonding a plurality of components at a plurality of locations.

  With the flexible substrate fixed to the first table and the sheet material fixed to the second table, the respective positions are detected by the position detecting means, and based on the detection results, the first table and The position of at least one of the second tables is adjusted to correct the positional deviation between the flexible substrate and the sheet material, and then the first table and the second table are driven closer to each other in the opposite direction by the driving means to be flexible. Since the substrate and the sheet material are overlapped with each other, they can be overlapped in a state where they are accurately aligned. And while maintaining the superposition state of the both, the thermocompression bonding means thermocompression bonding the two at a plurality of locations and temporarily affixing the sheet material without causing misalignment of both at the time of thermocompression bonding It can be temporarily attached to a predetermined position with high accuracy.

  Here, the “flexible substrate” includes a single-sided flexible substrate in which a conductor pattern is formed on one surface of a flexible (soft) insulating substrate, and a double-sided surface in which a conductor pattern is formed on both the one surface and the other surface of the insulating substrate. Both flexible substrates are included.

  In addition, the “sheet material” is a cover plate that is attached to the surface of the insulating substrate on which the conductor pattern is formed, or a reinforcing plate that is attached to a surface opposite to the surface of the insulating substrate on which the conductor pattern is formed. In addition to a coverlay film in which an adhesive such as a thermosetting adhesive such as epoxy or acrylic is applied to one surface of a resin film (polymer film) such as a polyimide film, a coverlay film (photosensitive) A dry film resist).

  In addition, the “position detecting means” may be individually disposed for detecting the position of the flexible substrate fixed to the first table and detecting the position of the sheet material fixed to the second table. By adopting a configuration in which both position detection is performed by a common position detection means, the device configuration can be simplified.

  The thermocompression bonding means may include a thermocompression bonding jig that performs thermocompression bonding through one of the first table and the second table.

  According to the present invention, a sheet material (cover lay, reinforcement plate) can be automatically and temporarily attached to a flexible substrate with high accuracy.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIGS. 1-7 has shown notionally the example of the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment.

  In this embodiment, the flexible substrate (FRC) 1 is a film made of a resin (polymer polymer) such as polyimide, polyester, or liquid crystal polymer, for example, a conductor pattern formed on the surface of a polyimide film by a known method. The flexible substrate 1 may be either a single-sided flexible substrate in which a conductor pattern is formed on one surface 1a of an insulating substrate, or a double-sided flexible substrate in which a conductor pattern is formed on both surfaces of one side and the other side of the insulating substrate. The flexible substrate 1 is a single-sided flexible substrate in which a conductor pattern is formed on one surface 1a. Further, the sheet material 2 is a cover lay, in this embodiment, a film made of a resin (polymer polymer) such as polyimide, polyester, liquid crystal polymer, for example, a thermosetting adhesive such as epoxy or acrylic on one surface 2a of the polyimide film. It is a coverlay film coated with an agent. The cover lay film 2 is provided with a window (opening) in advance in a portion corresponding to the exposed portion of the conductor pattern, and is adhered to the one surface 1a on which the conductor pattern of the flexible substrate 1 is formed with the above adhesive. In addition, the flexible substrate 1 and the coverlay film 2 are provided with a plurality of alignment marks (not shown) that serve as references for alignment.

  As shown in FIG. 1, the flexible substrate 1 is fixed (for example, suction-fixed) to the fixing surface 3a of the first table 3 with the one surface 1a on which the conductor pattern is formed facing upward. Is fixed (for example, suction fixed) to the fixed surface 4a of the second table 4 with the one surface 2a applied thereto facing up. A release film (separator) is usually attached to one surface 2a of the cover lay film 2 to protect the adhesive layer. The release film fixes the cover lay film 2 to the second table 4. After fixing to the surface 4a, it peels from the one surface 2a.

  FIG. 8 is a view of the second table 4 as viewed from above. A number of suction holes 4a1 are opened in the fixed surface 4a of the second table 4, and a negative pressure is applied to the coverlay film 2 placed on the fixed surface 4a through these suction holes 4a1. The cover lay film 2 can be sucked and fixed onto the fixed surface 4a. The second table 4 is positioned and driven in the X direction, the Y direction, and the θ direction shown in the figure by driving means (not shown) (for example, a servo motor and a ball screw mechanism). The θ direction is a direction in which the second table 4 rotates around the table center O1 in the XY plane. Further, the fixed surface 4a of the second table 4 is provided with, for example, notches 4a2 and 4a3 at both ends along the Y direction. When the coverlay film 2 is fixed to the fixed surface 4a of the second table 4, the alignment marks provided on the coverlay film 2 are positioned at the notches 4a2 and 4a3.

  As shown in FIG. 1, the second table 4 is mounted on a table base 5, and the table base 5 is moved in the X direction along the guide mechanism (not shown) of the base 6 by the driving means in the X direction. Driven. The second table 4 is driven to move in the Y direction and θ direction with respect to the table base 5 by the driving means in the Y direction and θ direction.

  The first table 3 is rotatably supported by the support arm 7. The support arm 7 is driven to move in the Z direction shown in the drawing along a guide mechanism (not shown) of the support column 8 by a driving means (not shown) (for example, a servo motor and a ball screw mechanism). The first table 3 is rotationally driven in a direction along the XZ plane with the rotational center O2 as the center by a driving means (for example, a stepping motor) not shown. A number of suction holes (not shown) are formed in the fixed surface 3a of the first table 3, and negative pressure is applied to the flexible substrate 1 placed on the fixed surface 3a through these suction holes. By doing so, the flexible substrate 1 can be sucked and fixed onto the fixing surface 3a.

  Below the first table 3 supported by the support arm 7, position detection means, for example, a solid-state imaging camera 9 such as a CCD camera is disposed. In this embodiment, the position detection of the flexible substrate 1 and the position detection of the coverlay film 2 are performed by one solid-state imaging camera 9.

  1, when the flexible substrate 1 is fixed to the fixing surface 3a of the first table 3 and the coverlay film 2 is fixed to the fixing surface 4a of the second table 4, as shown in FIG. The first table 3 is moved up to a predetermined position by the movement of the arm 7 in the Z direction, and then the first table 3 is rotated 180 degrees around the rotation center O2 and turned upside down.

  Thereafter, as shown in FIG. 3, the first table 3 is lowered to a predetermined position by the movement of the support arm 7 in the Z direction, and the flexible substrate 1 fixed to the fixed surface 3 a of the first table 3 is moved from the solid-state imaging camera 9. A measurement position above a predetermined distance is reached. At this measurement position, one surface 1a of the flexible substrate 1 is photographed from below by the solid-state imaging camera 9, and the position of the flexible substrate 1 is detected. This position detection is performed by, for example, recognizing the positions of the alignment marks from the image data of one surface 1a of the flexible substrate 1 photographed by the solid-state imaging camera 9, and determining the position of the flexible substrate 1 from the position data of these alignment marks. The calculation is performed by calculating the position coordinates in the X direction, the Y direction, and the θ direction (image processing and coordinate calculation are performed by image processing means not shown).

  When the position of the flexible substrate 1 is detected as described above, the first table 3 is temporarily raised to a predetermined position by the movement of the support arm 7 in the Z direction as shown in FIG. Due to the movement in the X direction, the second table 4 moves to the right in the figure and reaches a predetermined position directly below the first table 3. Due to the movement of the second table 4, the flexible substrate 1 fixed to the fixed surface 3a of the first table 3 and the coverlay film 2 fixed to the fixed surface 4a of the second table 4 face each other in the Z direction. become. At this position, the position of the coverlay film 2 is detected by the solid-state imaging camera 9. As described above, when the coverlay film 2 is fixed to the fixing surface 4a of the second table 4, the alignment marks provided on the coverlay film 2 are notched portions 4a2, 4a3 of the fixing surface 4a of the second table 4. The cover lay film 2 (the portion provided with the alignment mark) is photographed from below the second table 4 through the notches 4a2, 4a3 by the solid-state imaging camera 9. Can do. This position detection is performed by, for example, recognizing the positions of the alignment marks (plurality) from the image data of the coverlay film 2 (the portion provided with the alignment marks) taken by the solid-state imaging camera 9. The position data of the coverlay film 2 in the X direction, the Y direction, and the θ direction are calculated from the position data (image processing and coordinate calculation are performed by an image processing means not shown).

  Measurement in which the flexible substrate 1 fixed to the fixed surface 3a of the first table 3 and the coverlay film 2 fixed to the fixed surface 4a of the second table 4 face each other in the Z direction as described above. At the position, the common solid-state imaging camera 9 is used to detect both positions, and the position coordinates in the X, Y, and θ directions are calculated, and then the amount of positional deviation between the two is calculated from the position coordinates. To do. Based on the calculated displacement amount, the second table 4 is positioned and driven in the X direction, the Y direction, and the θ direction by the above drive means, and is fixed to the fixed surface 4 a of the second table 4. The position of the coverlay film 2 is adjusted (calculation of the amount of misalignment and the positioning drive command for the second table 4 are performed by misalignment correcting means not shown). Thereby, the amount of positional deviation between the flexible substrate 1 fixed to the fixed surface 3a of the first table 3 and the coverlay film 2 fixed to the fixed surface 4a of the second table 4 is corrected.

  Thereafter, as shown in FIG. 5, the first table 3 is lowered to a position immediately above the second table 4 by the movement of the support arm 7 in the Z direction, and the flexible substrate 1 fixed to the fixing surface 3 a of the first table 3 The coverlay film 2 fixed to the fixed surface 4a of the second table 4 is superposed on each other. And in this state, the flexible substrate 1 and the coverlay film 2 are thermocompression-bonded by the thermocompression-bonding means 10 at a plurality of locations and temporarily attached.

  In this embodiment, the thermocompression bonding means 10 includes a thermocompression bonding jig, for example, a rod-shaped electric iron 10a. A plurality of electric irons 10a are arranged along the Y direction and are movable in the X direction and the Z direction. Further, as shown in an enlarged view in the one-dot chain line circle in FIG. 5, the first table 3 is provided with a plurality of through holes 3b into which the electric iron 10a is inserted along the Y direction. After the flexible substrate 1 fixed to the fixed surface 3a of the first table 3 and the coverlay film 2 fixed to the fixed surface 4a of the second table 4 are overlapped with each other in the above-described manner, the current is applied. The tip of the electric iron 10a that has generated heat at a predetermined temperature is in pressure contact with the flexible substrate 1 through the through-hole 3b by the X-direction movement to the right and the Z-direction movement to the lower side in FIG. As a result, the thermosetting adhesive applied to the one surface 2a of the cover lay film 2 receives the amount of heat from the electric trowel 10a and is locally cured, and the flexible substrate 1 and the cover lay film 2 are temporarily bonded at that location. It is pasted. The position and number of locations to be temporarily attached (position and number of locations to be thermocompression bonded) may be appropriately determined according to various conditions. In this example, as shown in FIG. 9, the peripheral portion along the Y direction. Are temporarily attached at two locations (two points) P1 and P2. In this case, it is good to perform temporary sticking by operating two electric irons 10a arranged along the Y direction simultaneously in the above-described manner. The number of electric irons 10a and through-holes 3b may be the same as the number of places to be temporarily attached, or a larger number than that. In the latter case, the number of temporary ironing points 10a is activated to perform temporary sticking. However, when the number of temporary sticking points needs to be increased, or the number of temporary sticking points is large. There is an advantage that it is possible to cope with a flexible substrate.

  When the flexible substrate 1 and the coverlay film 2 are temporarily attached in the above-described manner, the first table 3 releases the fixing force (suction fixing force) to the flexible substrate 1, and then, as shown in FIG. 7 is moved up to a predetermined position by movement in the Z direction. Thereafter, the second table 4 is moved to the left side in FIG. In the case where only the above-mentioned two places (two points) P1 and P2 are used as the temporary pasting places between the flexible substrate 1 and the coverlay film 2, the second table 4 can be moved as it is and returned to the initial position shown in FIG. However, in this embodiment, as shown in the figure, the second table 4 is temporarily stopped at a midway position until reaching the initial position, and the electric iron 10a is operated at that position, and further portions are arranged. But I try to stick it temporarily. The temporary sticking location at this time may be arbitrarily set. For example, it may be temporarily attached to the other peripheral portion along the Y direction in the same manner as P1 and P2.

  When the above temporary attachment is completed, as shown in FIG. 7, the second table 4 is further moved to the left side by the movement of the table base 5 in the X direction and returned to the initial position, and the fixing force (suction fixing force) to the coverlay film 2 is reached. ) Is canceled. Then, the flexible substrate 1 on which the coverlay film 2 is temporarily attached is discharged from the second table 4 and sent to the next step such as main attachment. Further, the first table 3 is rotated 180 degrees around the rotation center O2 and turned upside down, and further lowered to the initial position by the movement of the support arm 7 in the Z direction. Thereby, one cycle of a temporary sticking process is complete | finished, and this cycle is repeated thereafter.

  In the case of a double-sided flexible substrate, after the provisional sticking step is completed, the flexible substrate is fixed to the first table 3 with the front and back reversed, and the temporary attachment step is repeated again.

  In addition, when the coverlay film is attached to the surface of one flexible substrate in a plurality of pieces, the above temporary attaching step is repeated for the number of coverlay films.

  Furthermore, temporary sticking of the reinforcing plate to the flexible substrate can also be performed according to the above embodiment.

It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is a figure which shows notionally the sheet material temporary sticking process using the sheet material temporary sticking apparatus which concerns on embodiment. It is the figure which looked at the 2nd table from the upper part. It is the figure which looked at the flexible substrate which temporary sticking was complete | finished from upper direction (insulation board | substrate side).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible substrate 1a The one surface in which the conductor pattern was formed 2 Cover-lay film 3 1st table 4 2nd table 9 Solid-state imaging camera 10 Thermocompression-bonding means 10a Electric iron

Claims (4)

An apparatus for temporarily attaching a sheet material to a flexible substrate having a conductor pattern formed on the surface of a flexible insulating substrate,
A first table for fixing the flexible substrate;
A second table for fixing the sheet material;
Position detecting means for detecting the position of the flexible substrate fixed to the first table and the position of the sheet material fixed to the second table;
Driving means for moving and driving at least one of the first table and the second table;
Based on the detection result of the position detection means, the position of at least one of the first table and the second table is adjusted to be fixed to the flexible substrate fixed to the first table and the second table. A misalignment correcting means for correcting misalignment with the sheet material;
The first table and the second table, the positions of which are adjusted by the misalignment correcting unit, are driven closer to each other in the opposite direction by the driving unit, and the flexible substrate fixed to the first table and the second table In the state where the sheet material fixed to the table is overlapped with each other, the flexible substrate and the sheet material are provided with thermocompression bonding means for thermo-compression bonding at a plurality of locations and temporarily attached. A flexible substrate sheet material sticking device.   2. The flexible substrate sheet according to claim 1, wherein the thermocompression bonding means includes a thermocompression bonding jig that performs the thermocompression bonding through one of the first table and the second table. Temporary material sticking device.   The said sheet | seat material is a coverlay affixed on the surface of the said insulated substrate in which the said conductor pattern was formed, The sheet | seat material temporary sticking apparatus of the flexible substrate of Claim 1 characterized by the above-mentioned.   2. The sheet material temporary sticking device for a flexible substrate according to claim 1, wherein the sheet material is a reinforcing plate that is attached to a surface opposite to the surface of the insulating substrate on which the conductor pattern is formed.

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