TW201343286A - Drilling device - Google Patents
Drilling device Download PDFInfo
- Publication number
- TW201343286A TW201343286A TW101148774A TW101148774A TW201343286A TW 201343286 A TW201343286 A TW 201343286A TW 101148774 A TW101148774 A TW 101148774A TW 101148774 A TW101148774 A TW 101148774A TW 201343286 A TW201343286 A TW 201343286A
- Authority
- TW
- Taiwan
- Prior art keywords
- drilling
- printed wiring
- wiring board
- ray
- hole
- Prior art date
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
Description
本發明係關於鑽孔裝置,詳言之,係關於在由搬入口所被搬入的印刷配線板鑽孔的鑽孔裝置。 The present invention relates to a drilling apparatus, and more particularly to a drilling apparatus for drilling a printed wiring board carried in by a loading port.
在電子機器中,隨著IC晶片、電阻、電容器等表面構裝用電子零件的小型化,構裝該等的印刷配線板亦漸高密度化、複雜化。在如此之印刷配線板中,為了將單層的印刷配線板重疊而將各自的配線圖案正確備齊而形成複數層的印刷配線板,或將已完成的一枚較大的印刷配線板分割而獲得複數枚的印刷配線板,有藉由鑽孔裝置等來形成基準孔的情形。 In electronic devices, with the miniaturization of electronic components for surface mounting such as IC chips, resistors, and capacitors, the printed wiring boards having such structures are becoming increasingly denser and more complicated. In such a printed wiring board, in order to superimpose a single-layer printed wiring board, each wiring pattern is correctly prepared to form a plurality of printed wiring boards, or a large printed wiring board is divided. A plurality of printed wiring boards are obtained, and a reference hole is formed by a drilling device or the like.
以往,以在印刷配線板鑽孔的鑽孔裝置而言,已知一種以X線攝影機對形成在印刷配線板的對準標記進行攝像,根據所攝像到的畫像,來決定印刷配線板的穿孔位置,在使對接板由印刷配線板的背面側抵接的狀態下以工具進行鑽孔加工者(參照例如專利文獻1)。在專利文獻1所記載的裝置中,構成為X線照射機與X線攝影機朝鉛直方向對向配置,並且在比X線照射機及X線攝影機更為接近作業人員側(跟前側),鑽孔工具與對接板朝鉛直方向相對向配置,該等藉由來自馬達的輸出而朝水平方向一體移動。 Conventionally, in a drilling apparatus for drilling a printed wiring board, it is known to image an alignment mark formed on a printed wiring board by an X-ray camera, and to determine a perforation of the printed wiring board based on the imaged image. In the position where the butt plate is brought into contact with the back side of the printed wiring board, the tool is drilled by a tool (see, for example, Patent Document 1). In the device described in Patent Document 1, the X-ray irradiator and the X-ray camera are arranged to face each other in the vertical direction, and are closer to the worker side (front side) than the X-ray irradiator and the X-ray camera. The hole tool and the butt plate are disposed to face each other in the vertical direction, and are integrally moved in the horizontal direction by the output from the motor.
[專利文獻1]日本特開2008-227422號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-227422
在專利文獻1所記載之鑽孔裝置中,例如由作業人員等搬入印刷配線板來進行對位,俾使印刷配線板的對準標記在平台之形成有貫穿孔的位置被攝像。在此,尤其搬入較小的印刷配線板時,會有印刷配線板未到達攝像位置之虞,因此以可在離搬入口較近的位置將對準標記進行攝像為佳。 In the drilling apparatus described in Patent Document 1, for example, an operator or the like carries in a printed wiring board to perform alignment, and the alignment mark of the printed wiring board is imaged at a position where the through hole is formed in the stage. Here, in particular, when a small printed wiring board is carried in, the printed wiring board does not reach the imaging position. Therefore, it is preferable to image the alignment mark at a position close to the entrance.
但是,若以可將對準標記在跟前側進行攝像的方式,將X線照射機與X線攝影機配置在作業人員側,將鑽孔工具與對接板配置在裡側時,對接板的替換會變得困難。對接板係必須例如按照每個預定次數的鑽孔加工來進行替換,俾以不會在印刷配線板產生變形或毛邊。 However, if the X-ray irradiator and the X-ray camera are placed on the operator side so that the alignment mark can be imaged on the front side, and the drilling tool and the butt plate are placed on the back side, the replacement of the butt plate It has become difficult. The butt plate system must be replaced, for example, every predetermined number of times of drilling, so as not to cause deformation or burrs on the printed wiring board.
本發明係鑑於上述實際情形而研創者,目的在提供一種可搬入各種大小的印刷配線板來鑽孔,而且可輕易進行對接板的替換的鑽孔裝置。 The present invention has been made in view of the above-described actual circumstances, and an object of the present invention is to provide a drilling apparatus which can carry out drilling of various sizes of printed wiring boards and can easily perform replacement of the butting boards.
為達成上述目的,本發明之鑽孔裝置係在由搬入口所被搬入的印刷配線板鑽孔的鑽孔裝置,其特徵為具備有: 載置台,其係形成有任意數的貫穿孔,供載置前述印刷配線板;攝像單元,其係具有:對被載置於前述載置台的印刷配線板照射X線的X線發生機構;及與該X線發生機構相對向,將被照射在前述印刷配線板的X線的透過像透過前述貫通孔來進行攝像的攝像機構;鑽孔單元,其係具有:透過前述貫穿孔而在前述印刷配線板形成孔的鑽孔機構;及與該鑽孔機構相對向,在鑽孔時抵接於前述印刷配線板的對接板;第1移動機構,其係使前述X線發生機構與前述攝像機構的其中一方與前述鑽孔機構沿著預定的搬送方向一體移動;及第2移動機構,其係使前述X線發生機構與前述攝像機構的另一方與前述對接板沿著前述搬送方向一體移動;前述鑽孔機構係在前述第1移動機構中,被配設在比前述X線發生機構與前述攝像機構的其中一方更為接近前述搬入口的相反側,前述對接板係在前述第2移動機構中,被配設在比前述X線發生機構與前述攝像機構的另一方更為接近前述搬入口側。 In order to achieve the above object, a drilling apparatus according to the present invention is a drilling apparatus for drilling a printed wiring board into which a loading port is carried, and is characterized by comprising: a mounting table having an arbitrary number of through holes for mounting the printed wiring board; and an imaging unit having an X-ray generating mechanism that irradiates the printed wiring board placed on the mounting table with X-rays; and An imaging mechanism that images an X-ray transmitted image of the printed wiring board through the through-hole to face the X-ray generating mechanism, and a drilling unit that transmits the printing through the through-hole a drilling mechanism for forming a hole in the wiring board; and a mating plate that abuts against the drilling mechanism and abuts against the printed wiring board during drilling; the first moving mechanism that causes the X-ray generating mechanism and the imaging mechanism One of the X-ray generating means and the other of the imaging means and the butting plate are integrally moved along the transporting direction; and the second moving means is integrally moved along the predetermined transporting direction; In the first moving mechanism, the drilling mechanism is disposed on a side opposite to the one of the X-ray generating mechanism and the imaging device that is closer to the loading port. The butt plate is disposed closer to the carry-in side than the other of the X-ray generating means and the imaging means in the second moving mechanism.
此外,亦可前述第1移動機構係使前述X線發生機構與前述攝像機構的其中一方與前述鑽孔機構在前述載置面的鉛直上方一體移動,前述第2移動機構係使前述X線發生機構與前述攝像 機構的另一方與前述對接板在前述載置面的鉛直下方一體移動。 Further, in the first moving mechanism, one of the X-ray generating means and the imaging means may be integrally moved with the drilling means vertically above the mounting surface, and the second moving mechanism may cause the X-ray to occur. Agency and the aforementioned camera The other side of the mechanism moves integrally with the mating plate vertically below the mounting surface.
此外,亦可具備有搬送機構,其係使被載置於前述載置台的印刷配線板朝前述搬送方向移動。 Further, a transport mechanism may be provided which moves the printed wiring board placed on the mounting table in the transport direction.
此外,亦可具備有遮蔽手段,其係被配置在前述第1攝像孔與前述搬入口之間,遮蔽來自前述X線發生機構的X線。 Further, a shielding means may be provided which is disposed between the first imaging hole and the transfer port to shield the X-ray from the X-ray generating means.
此外,亦可具備有固定手段,其係將被載置於前述載置台的印刷配線板固定在載置面。 Further, a fixing means may be provided which fixes the printed wiring board placed on the mounting table to the mounting surface.
藉由本發明之鑽孔裝置,可輕易搬入各種大小的印刷配線板而鑽孔,而且可輕易進行對接板的替換。 According to the drilling apparatus of the present invention, it is possible to easily carry in various types of printed wiring boards and drill holes, and the replacement of the butting boards can be easily performed.
以下參照圖示,說明本發明之實施形態之鑽孔裝置。該實施形態之鑽孔裝置10係如圖1的外觀圖、或圖2及圖10的構成概要圖所示,具備有:將內部與外部進行遮斷的外殼11;架台(載置台)12;載置作為鑽孔對象的印刷配線板PCB的作業平台13;按壓印刷配線板PCB的印刷配線板按壓件14;使作業平台13移動的搬送部15;由X線照射機161與X線攝影機162所成之對印刷配線板PCB進行攝像的攝像單元16;在印刷配線板PCB進行鑽孔的鑽孔單元17;將攝像單元16與鑽孔單元17移動的移 動機構18;及控制裝置全體的控制部19。以下,將印刷配線板PCB藉由搬送部15而進行移動的方向(搬送方向)設為X方向,將垂直於X方向且為水平的方向(鑽孔裝置10的寬幅方向)設為Y方向,將鉛直方向設為Z方向。 Hereinafter, a drilling apparatus according to an embodiment of the present invention will be described with reference to the drawings. The drilling apparatus 10 of this embodiment is provided with an outer casing 11 that blocks the inside and the outside, and a gantry (mounting table) 12, as shown in the external view of FIG. 1 or the schematic diagram of the configuration of FIGS. 2 and 10. A work platform 13 on which a printed wiring board PCB to be drilled is placed; a printed wiring board presser 14 that presses the printed wiring board PCB; a transport unit 15 that moves the work platform 13; and an X-ray irradiator 161 and an X-ray camera 162 The imaging unit 16 that images the printed wiring board PCB; the drilling unit 17 that drills the printed wiring board PCB; and moves the imaging unit 16 and the drilling unit 17 The moving mechanism 18; and the control unit 19 of the entire control device. Hereinafter, the direction (transport direction) in which the printed wiring board PCB is moved by the transport unit 15 is set to the X direction, and the direction perpendicular to the X direction (the wide direction of the drilling apparatus 10) is set to the Y direction. , set the vertical direction to the Z direction.
圖1及圖2的白底箭號係作業人員的定位置,作業人員係朝向箭頭方向(X軸的正方向)站立,將印刷配線板PCB搬入至鑽孔裝置10,若鑽孔處理結束,即由鑽孔裝置10取出印刷配線板PCB。印刷配線板PCB的搬入口10a係藉由外殼11的X線遮蔽部(遮蔽手段)11a予以掩蓋。X線遮蔽部11a係以遮蔽由X線照射機161所發生的X線的材質所形成,X線遮蔽部11a的-Z端係以不會妨礙搬入印刷配線板PCB的程度,由作業平台13的+Z端(上面)設置預定距離而配置。在X線遮蔽部11a的-Z端側係配置有例如長條狀的含鉛橡膠製防護簾幕等。該防護簾幕的-Z端(底面)係形成為與作業平台13的+Z端(上面)相接觸,可輕易地搬出入印刷配線板PCB,並且可防止在搬出入印刷配線板PCB時,X線洩漏至外部。 The white arrow of FIG. 1 and FIG. 2 is a fixed position of the operator, and the worker stands in the direction of the arrow (the positive direction of the X-axis), and carries the printed wiring board PCB into the drilling apparatus 10, and if the drilling process is finished, That is, the printed wiring board PCB is taken out by the drilling device 10. The loading port 10a of the printed wiring board PCB is covered by the X-ray shielding portion (shielding means) 11a of the casing 11. The X-ray shielding portion 11a is formed by shielding the material of the X-ray generated by the X-ray irradiation machine 161, and the -Z end of the X-ray shielding portion 11a is controlled by the working platform 13 so as not to interfere with the loading of the printed wiring board PCB. The +Z terminal (above) is configured by setting a predetermined distance. A protective lead curtain made of a lead-containing rubber, for example, is disposed on the -Z end side of the X-ray shielding portion 11a. The -Z end (bottom surface) of the protective curtain is formed in contact with the +Z end (upper surface) of the work platform 13, and can be easily carried out into the printed wiring board PCB, and can be prevented from being carried out into the printed wiring board PCB. The X-ray leaked to the outside.
架台12係被配置在外殼11的內部,形成為鑽孔裝置10中的不動部分。架台12係以藉由搬送部15可朝X方向移動的方式支持作業平台13。作業平台13係上面形成為載置印刷配線板PCB的水平載置面。亦即,在架台12係透過作業平台13載置印刷配線板PCB。架台12係具有與作業平台13的載置面呈平行(亦即水平)的支持面, 在該支持面,如圖3所示,形成有用以進行藉由攝像單元16所為之攝像及藉由鑽孔單元17所為之鑽孔的主貫穿孔(第1攝像孔)12a,並且在比主貫穿孔12a更為接近搬入口10a側(操作者側)形成有子貫穿孔(第2攝像孔)12b。 The gantry 12 is disposed inside the casing 11 and is formed as a stationary portion in the drilling apparatus 10. The gantry 12 supports the work platform 13 so that the transport unit 15 can move in the X direction. The work platform 13 is formed on a horizontal mounting surface on which the printed wiring board PCB is placed. That is, the printed wiring board PCB is placed on the gantry 12 through the work platform 13. The gantry 12 has a support surface that is parallel (ie, horizontal) to the mounting surface of the work platform 13. On the support surface, as shown in FIG. 3, a main through hole (first imaging hole) 12a for imaging by the imaging unit 16 and for drilling the hole by the drilling unit 17 is formed, and is larger than the main A sub-through hole (second imaging hole) 12b is formed in the through hole 12a closer to the inlet 10a side (operator side).
形成在架台12的主貫穿孔12a係依作為鑽孔對象的印刷配線板PCB的Y方向的大小(寬度),以不會對印刷配線板PCB的攝像或鑽孔加工產生障礙的方式形成為朝Y方向延伸存在的長孔狀。此外,子貫穿孔12b係依印刷配線板PCB的X方向及Y方向的大小,以不會對印刷配線板PCB的攝像產生障礙的方式,左右分別形成各1個貫穿孔。在此,子貫穿孔12b之所以由在中央不連續而在左右各1個貫穿孔所構成,係基於主貫穿孔12a將印刷配線板PCB的全部區域作為鑽孔對象及攝像對象,相對於此,子貫穿孔12b係為了將印刷配線板PCB在XY平面上保持為一定的角度,亦即進行對準,若確保用以識別設在印刷配線板PCB上之角部的對準標記所需之充分區域即可之故。因此,子貫穿孔12b並非為朝Y方向延伸存在的長孔狀,而是形成為左右各1個的貫穿孔。 The main through hole 12a formed in the gantry 12 is formed in a size (width) in the Y direction of the printed wiring board PCB to be drilled, so as not to obstruct the imaging or drilling of the printed wiring board PCB. A long hole shape extending in the Y direction. In addition, the sub-through hole 12b is formed in each of the right and left sides so as to be inferior to the imaging of the printed wiring board PCB in the X direction and the Y direction of the printed wiring board PCB. Here, the sub-through hole 12b is formed by one through hole in the left and right sides in the center, and the entire area of the printed wiring board PCB is used as the drilling target and the imaging target based on the main through hole 12a. The sub-through hole 12b is used to maintain the printed wiring board PCB at an angle in the XY plane, that is, to perform alignment, and to ensure alignment marks for identifying the corners provided on the printed wiring board PCB. A sufficient area can be used. Therefore, the sub-through hole 12b is not formed in a long hole shape extending in the Y direction, but is formed as one through hole on the left and right sides.
其中,子貫穿孔12b亦被使用在替換容後詳述的鑽孔單元17的對接板173時,因此與主貫穿孔12a相比,朝X方向為寬幅較大,但是如上所述,子貫穿孔12b由在中央不連續而以左右各1個貫穿孔所構成,因此可一面確保架台12的剛性,一面形成為較大的貫穿孔。其中,若在 規格上沒有問題,子貫穿孔12b亦與主貫穿孔12a同樣地,亦可形成為朝Y方向延伸存在的長孔狀。 Here, the sub-through hole 12b is also used when replacing the butting plate 173 of the drilling unit 17 detailed later, and thus is wider in the X direction than the main through hole 12a, but as described above, Since the through hole 12b is formed by one through hole on the left and right sides in the center discontinuity, it is possible to form a large through hole while ensuring the rigidity of the gantry 12. Among them, if There is no problem in the specification, and the sub-through hole 12b may be formed in a long hole shape extending in the Y direction, similarly to the main through hole 12a.
作業平台13係以可沿著X方向移動的方式被支持在架台12之上。在作業平台13係形成有未圖示之複數貫穿孔,俾以進行藉由攝像單元16所為之攝像及藉由鑽孔單元17所為之鑽孔。此外,在作業平台13亦在載置面形成有未圖示的吸附孔。在作業平台13載置有印刷配線板PCB的狀態下,吸附孔被形成為負壓,藉此印刷配線板PCB係被吸附固定在作業平台13。 The work platform 13 is supported above the gantry 12 in such a manner as to be movable in the X direction. A plurality of through holes (not shown) are formed in the work platform 13 to perform imaging by the imaging unit 16 and drilling by the drilling unit 17. Further, on the work platform 13, an adsorption hole (not shown) is formed on the placement surface. In a state in which the printed wiring board PCB is placed on the work platform 13, the adsorption holes are formed as a negative pressure, whereby the printed wiring board PCB is adsorbed and fixed to the work platform 13.
其中將藉由該吸附所致之印刷配線板PCB的固定稱為臨時固定。 The fixing of the printed wiring board PCB by the adsorption is referred to as temporary fixing.
印刷配線板按壓件14係被配置在架台12的主貫穿孔12a的鉛直上方(參照圖4,在圖3中並未圖示)。印刷配線板按壓件14係以可藉由印刷配線板按壓件上下手段500朝上下的方式予以支持,在印刷配線板PCB進行鑽孔加工時,印刷配線板按壓件14下降而將印刷配線板PCB按壓在作業平台13上來進行固定。其中,將藉由該印刷配線板按壓件14所致之印刷配線板PCB的固定稱為正式固定。 The printed wiring board holder 14 is disposed vertically above the main through hole 12a of the gantry 12 (see FIG. 4, which is not shown in FIG. 3). The printed wiring board pressing member 14 is supported by the printed wiring board pressing member upper and lower means 500 upward and downward. When the printed wiring board PCB is drilled, the printed wiring board pressing member 14 is lowered to press the printed wiring board PCB. Pressing on the work platform 13 is performed. Here, the fixing of the printed wiring board PCB by the printed wiring board pressing member 14 is referred to as a formal fixing.
搬送部15係如圖4所示,具備有:被固定在架台12而朝X方向延伸的一組軌條151;及將朝X方向延伸之未圖示的滾珠螺桿進行旋轉的馬達153。搬送部15係藉由馬達153而使滾珠螺桿旋轉,使作業平台13沿著導軌151朝X方向移動。 As shown in FIG. 4, the conveyance unit 15 includes a set of rails 151 that are fixed to the gantry 12 and extend in the X direction, and a motor 153 that rotates a ball screw (not shown) that extends in the X direction. The conveyance unit 15 rotates the ball screw by the motor 153 to move the work platform 13 in the X direction along the guide rail 151.
攝像單元16係如圖2或圖3所示,具有:被配置在架台12的鉛直上方,對印刷配線板PCB照射X線的X線照射機(X線發生機構)161;及被配置在架台12的鉛直下方,對被照射在印刷配線板PCB的X線的透過像進行攝像的X線攝影機(攝像機構)162。X線照射機161與X線攝影機162係在與架台12的主貫穿孔12a及子貫穿孔12b的任一者相對應的位置,被配置成朝Z方向相對向,透過主貫穿孔12a與子貫穿孔12b的任一者來對印刷配線板PCB進行攝像。在該實施形態中,X線照射機161及X線攝影機162係如圖4或圖5所示,朝Y方向排列設有2組。2組X線照射機161及X線攝影機162係分別藉由移動機構18予以支持而朝X方向及Y方向移動。 As shown in FIG. 2 or FIG. 3, the imaging unit 16 includes an X-ray irradiator (X-ray generating mechanism) 161 that is disposed vertically above the gantry 12 and that irradiates the printed wiring board PCB with X-rays; and is disposed on the gantry An X-ray camera (image pickup mechanism) 162 that images the transmitted image of the X-ray that is irradiated onto the printed wiring board PCB in the vertical direction of 12. The X-ray irradiator 161 and the X-ray camera 162 are disposed to face each other in the main through hole 12a and the sub through hole 12b of the gantry 12 so as to face the Z direction and pass through the main through hole 12a and the sub-hole 12a. The printed wiring board PCB is imaged by any of the through holes 12b. In this embodiment, as shown in FIG. 4 or FIG. 5, the X-ray irradiator 161 and the X-ray camera 162 are arranged in two groups in the Y direction. The two sets of X-ray irradiators 161 and X-ray cameras 162 are respectively moved in the X direction and the Y direction by the movement mechanism 18.
鑽孔單元17係如圖2或圖3所示,具有:被配置在架台12的鉛直上方,使用工具(例如鑽孔機等)在印刷配線板PCB進行鑽孔的鑽孔機構171、172;及被配置在架台12的鉛直下方而抵接於印刷配線板PCB的對接板173(173a、173b)。鑽孔機構171、172與對接板173係如之後說明所示,以1組(set)予以運用,在與架台12的主貫穿孔12a相對應的位置,配置成朝Z方向相對向,藉由未圖示的致動器而朝Z方向予以驅動,透過主貫穿孔12a而在印刷配線板PCB鑽孔。 As shown in FIG. 2 or FIG. 3, the drilling unit 17 has a drilling mechanism 171, 172 disposed vertically above the gantry 12 and drilling a printed wiring board PCB using a tool (for example, a drill or the like); And a butt plate 173 (173a, 173b) which is disposed vertically below the gantry 12 and abuts against the printed wiring board PCB. The drilling mechanisms 171 and 172 and the butting plate 173 are used in one set as described later, and are arranged to face each other in the Z direction at a position corresponding to the main through hole 12a of the gantry 12. The actuator (not shown) is driven in the Z direction and penetrates the main through hole 12a to drill the printed wiring board PCB.
在該實施形態中,鑽孔機構171、172係朝X方向排列而設有2個鑽孔機構171、172。在2個鑽孔機構171、172安裝有例如所開出的孔的直徑不同的工具。此外,當 在印刷配線板PCB鑽孔時,以在印刷配線板PCB不會發生歪斜或毛邊的方式設有對接板173。 In this embodiment, the drilling mechanisms 171 and 172 are arranged in the X direction, and two drilling mechanisms 171 and 172 are provided. For example, tools having different diameters of the opened holes are attached to the two drilling mechanisms 171 and 172. In addition, when When the printed wiring board PCB is drilled, the butting board 173 is provided in such a manner that the printed wiring board PCB does not become skewed or burred.
對接板173係由朝Y方向排列所配置的2個對接板173a、173b所成,對應被安裝在鑽孔機構171、172的工具的直徑,分別與鑽孔機構171或鑽孔機構172形成為1組來使用。此外,鑽孔機構171、172與對接板173係如圖4或圖5所示,朝Y方向排列設有2組。2組鑽孔機構171、172與對接板173係分別藉由移動機構18予以支持而朝X方向及Y方向移動。 The butting plate 173 is formed by two butting plates 173a and 173b arranged in the Y direction, and is formed with the drilling mechanism 171 or the drilling mechanism 172 corresponding to the diameter of the tool attached to the drilling mechanisms 171 and 172, respectively. 1 group to use. Further, as shown in FIG. 4 or FIG. 5, the drilling mechanisms 171 and 172 and the butting plate 173 are arranged in two groups in the Y direction. The two sets of drilling mechanisms 171 and 172 and the butting plate 173 are respectively supported by the moving mechanism 18 to move in the X direction and the Y direction.
對接板173a及對接板173b係如上所述,以防止在鑽孔作業中在PCB發生歪斜或毛邊為目的,例如有一種開出相對於工具的直徑,形成為相同直徑(餘隙0)或以預定量形成為大直徑的孔者。對接板173a及對接板173b係若與工具的直徑為相同直徑時,由於毛邊防止效果為最大,因此理想上以每加工一次即進行替換為宜,但是基於經濟上及作業效率等理由,在沒有故障的期間並不替換,而持續使用相同的對接板173a及對接板173b。 The butt plate 173a and the butt plate 173b are as described above to prevent skewing or burrs on the PCB during the drilling operation, for example, a diameter of the opening relative to the tool is formed to have the same diameter (gap 0) or The predetermined amount is formed as a hole of a large diameter. When the butting plate 173a and the butting plate 173b have the same diameter as the diameter of the tool, since the burr prevention effect is the largest, it is preferable to replace it once per processing, but it is economical and work efficiency, etc., The period of failure is not replaced, and the same docking board 173a and the docking board 173b are continuously used.
鑽孔機構171、172與對接板173相對向時,以被設在對接板的孔中心、與對應於該孔中心的工具的旋轉中心相一致的方式進行定位,但是實際上因機械精度,並沒有各自的中心完全相一致的情形。因此,隨著持續使用,形成在對接板173的孔的直徑會逐漸大於當初的直徑,防止毛邊的效果會降低。 When the drilling mechanisms 171 and 172 are opposed to the butting plate 173, the positioning is performed in such a manner that the center of the hole provided in the butt plate coincides with the center of rotation of the tool corresponding to the center of the hole, but actually due to mechanical precision, There is no situation where the respective centers are completely consistent. Therefore, as the use continues, the diameter of the hole formed in the butt plate 173 gradually becomes larger than the original diameter, and the effect of preventing the burr is lowered.
因此,對接板173係必須在達到例如預定加工次數的 時點替換成新品。此時,藉由使對接板173a或對接板173b、及子貫穿孔12b相對向,可輕易替換。 Therefore, the docking plate 173 must reach, for example, a predetermined number of processing times. Replace the time with a new product. At this time, the butting plate 173a, the butt plate 173b, and the sub-through holes 12b are opposed to each other, and can be easily replaced.
移動機構18係支持攝像單元16與鑽孔單元17而使其朝X方向及Y方向移動。移動機構18係如圖4~圖6所示,具有:在架台12的鉛直上方,支持X線照射機161與鑽孔機構171、172而使其一體移動的上側移動機構18T;在架台12的鉛直下方,支持X線攝影機162與對接板173而使其一體移動的下側移動機構18D。藉由上側移動機構18T所致之X線照射機161與鑽孔機構171、172的移動、及藉由下側移動機構18D所致之X線攝影機162與對接板173的移動係構成為可分別獨立進行。 The moving mechanism 18 supports the imaging unit 16 and the drilling unit 17 to move in the X direction and the Y direction. As shown in FIGS. 4 to 6 , the moving mechanism 18 has an upper moving mechanism 18T that supports the X-ray irradiator 161 and the drilling mechanisms 171 and 172 and moves integrally therethrough in the vertical direction of the gantry 12; The lower side moving mechanism 18D that supports the X-ray camera 162 and the docking plate 173 to move integrally is vertically downward. The movement of the X-ray irradiator 161 and the drilling mechanisms 171 and 172 by the upper moving mechanism 18T and the movement of the X-ray camera 162 and the docking plate 173 by the lower moving mechanism 18D are configured to be respectively separable Conducted independently.
在上側移動機構18T中,如圖5或圖6所示,X線照射機161與鑽孔機構171、172由操作者側依該順序(沿著X方向)排列而予以支持。此外,在下側移動機構18D,對接板173與X線攝影機162由操作者側依該順序(沿著X方向)排列而予以支持。因此,X線照射機161與X線攝影機162朝鉛直方向相對向時,鑽孔機構171、172與對接板173並未相對向,相反地,鑽孔機構171、172與對接板173朝鉛直方向相對向時,X線照射機161與X線攝影機162並未相對向。如上所示,相較於鑽孔機構171、172,X線照射機161被配置於較為跟前側(搬入口10a側),藉此使X線照射機161被配置在裡側(搬入口10a的相反側),與此相比,可使X線照射機161不會干擾X線遮蔽部11a而移動至跟前側,可將子貫穿孔12b 形成在更為跟前側,並且將鑽孔裝置10小型化。此外,對接板173被配置在比X線攝影機162更為跟前側(搬入口10a側),因此對接板173被配置在裡側,與此相比,按照被安裝在鑽孔機構171、172的工具等,可輕易替換對接板173,並且可將鑽孔裝置10小型化。 In the upper side moving mechanism 18T, as shown in FIG. 5 or FIG. 6, the X-ray irradiator 161 and the drilling mechanisms 171 and 172 are supported by the operator side in this order (along the X direction). Further, in the lower side moving mechanism 18D, the docking plate 173 and the X-ray camera 162 are supported by the operator side in this order (along the X direction). Therefore, when the X-ray irradiator 161 and the X-ray camera 162 face each other in the vertical direction, the drilling mechanisms 171, 172 and the butting plate 173 do not face each other, and conversely, the drilling mechanisms 171, 172 and the butting plate 173 face in the vertical direction. In the opposite direction, the X-ray irradiator 161 and the X-ray camera 162 do not face each other. As described above, the X-ray irradiator 161 is disposed on the front side (the side of the carry-in port 10a) as compared with the drilling mechanisms 171 and 172, whereby the X-ray irradiator 161 is disposed on the back side (the entrance 10a is moved) On the opposite side, the X-ray irradiator 161 can be moved to the front side without interfering with the X-ray shielding portion 11a, and the sub-through hole 12b can be It is formed on the front side and the drilling device 10 is miniaturized. Further, the butting plate 173 is disposed on the front side (the side of the loading port 10a) more than the X-ray camera 162, so that the butting plate 173 is disposed on the back side, compared to the mounting of the drilling mechanisms 171, 172. The docking plate 173 can be easily replaced with a tool or the like, and the drilling device 10 can be miniaturized.
在上側移動機構18T,在鑽孔機構10中的不動構件亦即框體181T設有朝Y方向延伸的軌條182T,Y軸架台183T以可移動的方式被支持在該軌條182T。Y軸架台183T係與朝Y方向延伸的滾珠螺桿184T相扣合,藉由被支持在框體181T的馬達185T,滾珠螺桿184T被驅動,藉此沿著軌條182T朝Y方向移動。其中,雖未圖示,馬達185T的旋轉軸與滾珠螺桿184T的旋轉軸係透過例如皮帶而相連結,若馬達185T的旋轉軸旋轉時,滾珠螺桿184T的旋轉軸亦連動旋轉。此外,在上側移動機構18T,在Y軸架台183T形成有朝X方向延伸的軌條186T,支持X線照射機161與鑽孔機構171、172的移動體187T以可移動的方式被支持在該軌條186T。移動體187T係與朝X方向延伸的滾珠螺桿188T相扣合,藉由被支持在Y軸架台183T的馬達189T,滾珠螺桿188T被驅動,藉此沿著軌條186T朝X方向移動。藉由如此構成,在上側移動機構18T,係可驅動馬達185T、189T,而使X線攝影機162與鑽孔機構171、172朝X方向、Y方向移動。上側移動機構18T係以可按每個朝Y方向排列配置的2組X線照射機161與鑽孔機構171、172的各自的成組獨立朝X方 向、Y方向移動的方式,朝Y方向對稱設有2組。 In the upper side moving mechanism 18T, the frame 181T, which is a stationary member in the drilling mechanism 10, is provided with a rail 182T extending in the Y direction, and the Y-axis stand 183T is movably supported by the rail 182T. The Y-axis stand 183T is engaged with the ball screw 184T extending in the Y direction, and the ball screw 184T is driven by the motor 185T supported by the frame 181T, thereby moving in the Y direction along the rail 182T. However, although not shown, the rotation shaft of the motor 185T and the rotation shaft of the ball screw 184T are coupled to each other by, for example, a belt. When the rotation shaft of the motor 185T rotates, the rotation shaft of the ball screw 184T also rotates. Further, in the upper side moving mechanism 18T, a rail 186T extending in the X direction is formed in the Y-axis stand 183T, and the moving body 187T supporting the X-ray irradiator 161 and the drilling mechanisms 171, 172 is movably supported therein. Rail 186T. The moving body 187T is engaged with the ball screw 188T extending in the X direction, and the ball screw 188T is driven by the motor 189T supported by the Y-axis stand 183T, thereby moving in the X direction along the rail 186T. According to this configuration, the upper moving mechanism 18T can drive the motors 185T and 189T to move the X-ray camera 162 and the drilling mechanisms 171 and 172 in the X direction and the Y direction. The upper moving mechanism 18T is independent of the X side of each of the two sets of the X-ray irradiators 161 and the drilling mechanisms 171 and 172 which are arranged in the Y direction. In the way of moving in the Y direction, two sets are symmetrically arranged in the Y direction.
在下側移動機構18D係與上側移動機構18T同樣地,在鑽孔機構10中的不動構件亦即框體181D設有朝Y方向延伸的軌條182D,Y軸架台183D以可移動的方式被支持在該軌條182D。Y軸架台183D係與朝Y方向延伸的滾珠螺桿184D相扣合,藉由被支持在框體181D的馬達185D,滾珠螺桿184D被驅動,藉此沿著軌條182D朝Y方向移動。其中,雖未圖示,馬達185D的旋轉軸與滾珠螺桿184D的旋轉軸係透過例如皮帶而相連結,若馬達185D的旋轉軸旋轉時,滾珠螺桿184D的旋轉軸亦連動旋轉。此外,在下側移動機構18D中,在Y軸架台183D形成有朝X方向延伸的軌條186D,支持對接板173與X線照射機構161的移動體187D以可移動的方式被支持在該軌條186D。移動體187D係與朝X方向延伸的滾珠螺桿188D相扣合,藉由被支持在Y軸架台183D的馬達189D,滾珠螺桿188D被驅動,藉此沿著軌條186D朝X方向移動。藉由如此構成,在下側移動機構18D中,係可驅動馬達185D、189D,而使對接板173與X線攝影機162朝X方向、Y方向移動。下側移動機構18D係以可按每個朝Y方向排列配置的2組X線照射機162與對接板173的各自的成組獨立朝X方向、Y方向移動的方式,與上側移動機構18T同樣地朝Y方向對稱設有2組。 Similarly to the upper moving mechanism 18T, the lower moving mechanism 18D is provided with a rail 182D extending in the Y direction, that is, the housing 181D, which is a stationary member in the drilling mechanism 10, and the Y-axis mounting 183D is movably supported. At the rail 182D. The Y-axis stand 183D is engaged with the ball screw 184D extending in the Y direction, and the ball screw 184D is driven by the motor 185D supported by the frame 181D, thereby moving in the Y direction along the rail 182D. However, although not shown, the rotation shaft of the motor 185D and the rotation shaft of the ball screw 184D are coupled to each other by, for example, a belt. When the rotation shaft of the motor 185D rotates, the rotation shaft of the ball screw 184D also rotates. Further, in the lower side moving mechanism 18D, a rail 186D extending in the X direction is formed in the Y-axis mount 183D, and the movable body 187D supporting the butt plate 173 and the X-ray irradiation mechanism 161 is movably supported on the rail. 186D. The moving body 187D is engaged with the ball screw 188D extending in the X direction, and the ball screw 188D is driven by the motor 189D supported by the Y-axis stand 183D, thereby moving in the X direction along the rail 186D. According to this configuration, in the lower moving mechanism 18D, the motors 185D and 189D can be driven, and the docking plate 173 and the X-ray camera 162 can be moved in the X direction and the Y direction. The lower moving mechanism 18D is the same as the upper moving mechanism 18T so that each of the two sets of the X-ray irradiators 162 and the butting plates 173 arranged in the Y direction can be moved in the X direction and the Y direction independently. The ground is symmetrically arranged in two groups in the Y direction.
控制裝置19係如圖7所示,具備有:控制單元191、主記憶部192、外部記憶部193、操作部194、顯示部 195、及輸出入部196。主記憶部192、外部記憶部193、操作部194、顯示部195、及輸出入部196係均透過內部匯流排198而與控制單元191相連接。 As shown in FIG. 7, the control device 19 includes a control unit 191, a main storage unit 192, an external storage unit 193, an operation unit 194, and a display unit. 195, and the input and output unit 196. The main memory unit 192, the external memory unit 193, the operation unit 194, the display unit 195, and the input/output unit 196 are all connected to the control unit 191 through the internal bus bar 198.
控制單元191係由CPU(Central Processing Unit,中央處理單元)等所構成,按照被記憶在外部記憶部193的程式,執行供後述測定之用的處理。 The control unit 191 is configured by a CPU (Central Processing Unit) or the like, and performs processing for measurement described later in accordance with a program stored in the external storage unit 193.
主記憶部193係由RAM(Random-Access Memory,隨機存取記憶體)等所構成,載入被記憶在外部記憶部193的程式,作為控制單元191的作業區域來使用。 The main memory unit 193 is constituted by a RAM (Random-Access Memory) or the like, and loads a program stored in the external storage unit 193, and is used as a work area of the control unit 191.
外部記憶部193係由快閃記憶體、硬碟、DVD-RAM(Digital Versatile Disc Random-Access Memory)、DVD-RW(Digital Versatile Disc Rewritable)等非揮發性記憶體所構成,預先記憶用以使控制單元191進行前述處理的程式,此外,按照控制單元191的指示,將該程式所記憶的資料供給至控制單元191,記憶由控制單元191所被供給的資料。 The external storage unit 193 is composed of a non-volatile memory such as a flash memory, a hard disk, a DVD-RAM (Digital Versatile Disc Random-Access Memory), or a DVD-RW (Digital Versatile Disc Rewritable), and is memorized in advance to make The control unit 191 performs the above-described processing, and further supplies the data stored in the program to the control unit 191 in accordance with an instruction from the control unit 191, and memorizes the material supplied by the control unit 191.
操作部194係由將鍵盤及滑鼠等指向裝置等、及鍵盤及指向裝置等與內部匯流排198相連接的介面裝置所構成。透過操作部194,輸入處理開始或結束的指令等,且供給至控制單元191。其中,操作部194亦可將顯示部195或其他監視器形成為觸控面板方式,構成為使用使用者的手指或專用輸入筆等來輸入操作指令。 The operation unit 194 is constituted by an interface device that connects a pointing device such as a keyboard and a mouse, and a keyboard and a pointing device to the internal bus bar 198. The operation unit 194 inputs a command for starting or ending the processing, and the like, and supplies it to the control unit 191. The operation unit 194 may form the display unit 195 or another monitor as a touch panel system, and may be configured to input an operation command using a user's finger or a dedicated stylus pen.
顯示部195係由CRT(Cathode Ray Tube,陰極射線管)或LCD(Liquid Crystal Display,液晶顯示器)等所 構成,顯示藉由攝像單元16所為之攝像、或警告、對作業人員的指示等。 The display unit 195 is a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display). The configuration displays an image, a warning, an instruction to an operator, and the like by the imaging unit 16.
輸出入部196係由串列介面或LAN(Local Area Network,區域網路)介面所構成。透過輸出入部196,由攝像單元16所攝像到的畫像訊號等被輸入至控制單元191。此外,透過輸出入部196,驅動作業平台13之未圖示的吸附部或搬送部15、移動機構18的訊號、或驅動攝像單元16、鑽孔單元17的訊號由控制單元191被輸出。其中,搬送部15或移動機構18、攝像單元16、鑽孔單元17並非限定為透過輸出入部196而與控制單元191相連接,亦可構成為例如來自攝像單元16的畫像訊號透過畫像取入板而被輸入至控制單元191等透過專用板而與控制單元191交換訊號。 The input/output unit 196 is composed of a serial interface or a LAN (Local Area Network) interface. The image signal or the like imaged by the imaging unit 16 is input to the control unit 191 through the input/output unit 196. Further, the signal of the adsorption unit, the transport unit 15, and the moving mechanism 18 (not shown) that drives the work platform 13 through the input/output unit 196 or the signal that drives the imaging unit 16 and the drilling unit 17 are output by the control unit 191. The transport unit 15 , the moving unit 18 , the imaging unit 16 , and the drilling unit 17 are not limited to being connected to the control unit 191 via the input/output unit 196 , and may be configured such that the image signal from the imaging unit 16 is transmitted through the image capture board. The control unit 191 or the like is input to the control unit 191 to exchange signals with the control unit 191.
接著,說明鑽孔裝置10的動作。鑽孔裝置10的控制單元191係例如起動時,驅動各種致動器來進行初期處理。在初期處理,係將作業平台13、攝像單元16、鑽孔單元17移動至預定的初期位置。在該實施形態中,作業平台13係被配置在掩蓋架台12的主貫穿孔12a的位置,如圖2或圖3所示,以透過主貫穿孔12a,X線照射機161與X線攝影機162相對向位置的方式配置攝像單元16。其中,此時,如上所述,鑽孔單元17中的鑽孔機構171、172與對接板173並未朝Z方向相對向配置。 Next, the operation of the drilling apparatus 10 will be described. The control unit 191 of the drilling apparatus 10 drives various actuators to perform initial processing, for example, at the time of starting. In the initial processing, the work platform 13, the imaging unit 16, and the drilling unit 17 are moved to a predetermined initial position. In this embodiment, the work platform 13 is disposed at a position of the main through hole 12a of the cover stand 12, as shown in FIG. 2 or FIG. 3, to pass through the main through hole 12a, the X-ray irradiator 161 and the X-ray camera 162. The imaging unit 16 is disposed in a relatively positional manner. Here, at this time, as described above, the drilling mechanisms 171, 172 and the butting plate 173 in the drilling unit 17 are not disposed to face each other in the Z direction.
接著,控制單元191係例如藉由操作者而使始動開關成為ON,以被選擇出作為鑽孔對象的印刷配線板PCB的 初期搬入位置為契機,來執行圖8所示之鑽孔處理。在此,操作者係例如當進行鑽孔的印刷配線板PCB小於預定尺寸時,選擇由操作者觀看為跟前側的初期搬入位置作為初期搬入位置,當印刷配線板PCB大於預定尺寸時,則選擇裡側的初期搬入位置。 Next, the control unit 191 turns the start switch ON by, for example, the operator to select the printed wiring board PCB as the object to be drilled. The initial loading position is an opportunity to perform the drilling process shown in FIG. Here, the operator selects, for example, when the printed wiring board PCB to be drilled is smaller than a predetermined size, selects an initial loading position viewed by the operator as the front side as an initial loading position, and when the printed wiring board PCB is larger than a predetermined size, selects The initial loading position on the back side.
若圖8所示之鑽孔處理開始,控制單元191係首先根據例如事前由作業人員所輸入的印刷配線板PCB的尺寸,來判定所被選擇的印刷配線板PCB的初期搬入位置為跟前側或為裡側(步驟S1)。接著,若為跟前側時,如圖9及圖10所示,使作業平台13移動至掩蓋架台12的子貫穿孔12b的位置,並且使X線照射機161與X線攝影機162透過子貫穿孔12b而相對向(步驟S2),將X線照射機161與X線攝影機162進行ON(步驟S3a)。藉此,X線攝影機162係開始取得印刷配線板PCB的透過畫像。 When the drilling process shown in FIG. 8 is started, the control unit 191 first determines whether the initial loading position of the selected printed wiring board PCB is the front side or based on, for example, the size of the printed wiring board PCB input by the worker in advance. It is the back side (step S1). Next, when it is the front side, as shown in FIGS. 9 and 10, the work platform 13 is moved to the position of the sub-through hole 12b of the mask stand 12, and the X-ray irradiator 161 and the X-ray camera 162 are passed through the sub-through holes. In the opposite direction (step S2), the X-ray irradiator 161 and the X-ray camera 162 are turned on (step S3a). Thereby, the X-ray camera 162 starts to obtain a transmission image of the printed wiring board PCB.
接著,操作者由搬入口10a搬入印刷配線板PCB,一面觀看顯示部195的顯示,一面進行印刷配線板PCB的大概對位。控制單元191係將藉由X線攝影機162所取得的透過畫像,例如圖9所示,顯示於顯示部195(步驟S4a)。在此,顯示20係對位用的照準標記的畫像,顯示M係形成在印刷配線板PCB上的對準標記的畫像。其中,此時在顯示部195係顯示透過子貫穿孔12b所取得的畫像。 Next, the operator carries the printed wiring board PCB from the loading port 10a, and while viewing the display of the display unit 195, the printed wiring board PCB is roughly aligned. The control unit 191 displays the transmitted image obtained by the X-ray camera 162 on the display unit 195 as shown in FIG. 9, for example (step S4a). Here, an image of the alignment mark for the 20-series alignment is displayed, and an image of the alignment mark formed by M on the printed wiring board PCB is displayed. In this case, the image obtained by the penetrating through-hole 12b is displayed on the display unit 195 at this time.
操作者係一面觀看顯示部195的顯示,一面以對準標記M來到照準標記20的中心的方式,將印刷配線板PCB 朝前後(X方向)、橫向(Y方向)移動。控制單元191係例如藉由操作者來按壓開關,藉此若檢測對準標記M位於照準標記20的大致中心而被停止時(步驟S5a:Yes),將作業平台13之未圖示的吸附孔形成為負壓而將印刷配線板PCB固定在作業平台13,根據藉由X線攝影機162所取得的透過畫像,使印刷配線板PCB移動至與主貫穿孔12a相對應的位置(預定的處理區域),並且驅動上側移動機構18T與下側移動機構18D,以透過主貫穿孔12a而相對向的方式使X線照射機161與X線攝影機162移動(步驟S6)。其中,當使X線照射機161與X線攝影機162移動時,亦可將X線照射機161或X線攝影機162進行OFF。 The operator views the display portion 195 while the alignment mark M comes to the center of the alignment mark 20 to print the wiring board PCB. Moves back and forth (X direction) and horizontal (Y direction). The control unit 191 presses the switch, for example, by the operator, thereby detecting that the alignment mark M is stopped at the approximate center of the alignment mark 20 (step S5a: Yes), and the adsorption hole (not shown) of the work platform 13 is used. The printed wiring board PCB is fixed to the work platform 13 by forming a negative pressure, and the printed wiring board PCB is moved to a position corresponding to the main through hole 12a according to the transmission image obtained by the X-ray camera 162 (predetermined processing area) The upper moving mechanism 18T and the lower moving mechanism 18D are driven to move the X-ray irradiator 161 and the X-ray camera 162 so as to pass through the main through hole 12a (step S6). However, when the X-ray irradiator 161 and the X-ray camera 162 are moved, the X-ray irradiator 161 or the X-ray camera 162 may be turned OFF.
控制單元191係接著控制印刷配線板按壓件上下手段500,使印刷配線板按壓件14下降,將印刷配線板PCB按壓在作業平台13來進行正式固定。藉由利用該印刷配線板按壓件14所為之正式固定,印刷配線板PCB係相較於藉由吸附所為之固定,更為強力地被固定在作業平台13。接著透過主貫穿孔12a來對印刷配線板PCB的對準標記M進行攝像,根據所攝像到的對準標記M的位置,特定在印刷配線板PCB鑽孔的位置(步驟S7)。該鑽孔的位置可為對準標記M的位置,亦可為由對準標記M離預定距離的位置,例如根據預先被操作者所設定的資訊來決定即可。 The control unit 191 then controls the printed wiring board presser upper and lower means 500 to lower the printed wiring board presser 14, and presses the printed wiring board PCB against the work platform 13 to perform the main fixing. By the use of the printed wiring board pressing member 14 for the main fixing, the printed wiring board PCB is fixed to the work platform 13 more strongly than the fixing by the suction. Next, the alignment mark M of the printed wiring board PCB is imaged through the main through hole 12a, and the position where the printed wiring board PCB is drilled is specified based on the position of the captured alignment mark M (step S7). The position of the drill hole may be the position of the alignment mark M, or may be a position away from the alignment mark M by a predetermined distance, for example, according to information set in advance by the operator.
若鑽孔位置被特定時,控制單元191係視需要而使印 刷配線板PCB的鑽孔位置位於主貫穿孔12a,將X線照射機161與X線攝影機162進行OFF(步驟S8),在與鑽孔位置相對應的位置,以將預先被選擇出的鑽孔機構171或鑽孔機構172、與對應此的對接板173a或對接板173b朝Z方向相對向的方式,驅動上側移動機構18T與下側移動機構18D,一面使所被選擇出的鑽孔機構171、172的工具旋轉,一面下降而在鑽孔位置鑽孔(步驟S9)。其中,如上所述,此時,X線照射機161與X線攝影機162並未朝Z方向相對向。 If the drilling position is specified, the control unit 191 prints as needed The drilling position of the brush wiring board PCB is located at the main through hole 12a, and the X-ray irradiator 161 and the X-ray camera 162 are turned off (step S8), at a position corresponding to the drilling position, to select the previously selected drill. The hole mechanism 171 or the drilling mechanism 172 drives the upper moving mechanism 18T and the lower moving mechanism 18D while the corresponding butting plate 173a or the butting plate 173b faces in the Z direction, and the selected drilling mechanism is driven. The tools of 171 and 172 are rotated, and one side is lowered to drill holes at the drilling position (step S9). Here, as described above, at this time, the X-ray irradiator 161 and the X-ray camera 162 do not face each other in the Z direction.
接著,若鑽孔完成,控制單元191係使鑽孔機構171或鑽孔機構172上升而停止驅動,控制印刷配線板按壓件上下手段500,使印刷配線板按壓件14上升而解除印刷配線板PCB的正式固定。接著,控制單元191係再次進行初期處理,使作業平台13、攝像單元16、鑽孔單元17移動至初期位置。之後,解除作業平台13的吸附孔的負壓而解除的印刷配線板PCB的臨時固定,而結束鑽孔處理。此時,例如在顯示部195顯示訊息催促印刷配線板PCB卸下,而使作業人員卸下印刷配線板PCB。 Next, when the drilling is completed, the control unit 191 raises the drilling mechanism 171 or the drilling mechanism 172 to stop driving, controls the printed wiring board pressing member upper and lower means 500, and raises the printed wiring board pressing member 14 to release the printed wiring board PCB. Officially fixed. Next, the control unit 191 performs the initial processing again to move the work platform 13, the imaging unit 16, and the drilling unit 17 to the initial position. Thereafter, the printed wiring board PCB that has been released by the negative pressure of the suction holes of the work platform 13 is temporarily fixed, and the drilling process is terminated. At this time, for example, a display message on the display unit 195 urges the printed wiring board PCB to be detached, and the operator removes the printed wiring board PCB.
如上所示,印刷配線板PCB的初期搬入位置被選擇在跟前側時,若將印刷配線板PCB的對準標記M對位在被形成於搬入口10a側(操作者側)的子貫穿孔12b即可,因此操作者係即使為較小的印刷配線板PCB,亦可輕易地進行對準標記M的對位。接著,若在子貫穿孔12b,印刷配線板PCB的對位完成時,控制單元191根據透過子貫穿 孔12b所取得的攝像資訊,使印刷配線板PCB移動至主貫穿孔12a,在主貫穿孔12a中,鑽孔位置被特定來進行鑽孔。藉由如此構成,可對較小的印刷配線板PCB,輕易地進行鑽孔。 As described above, when the initial loading position of the printed wiring board PCB is selected on the front side, the alignment mark M of the printed wiring board PCB is aligned with the sub-through hole 12b formed on the side of the carry-in port 10a (operator side). That is, the operator can easily perform the alignment of the alignment mark M even if it is a small printed wiring board PCB. Next, when the alignment of the printed wiring board PCB is completed in the sub-through hole 12b, the control unit 191 runs through the through-substrate. The imaging information acquired by the hole 12b moves the printed wiring board PCB to the main through hole 12a, and in the main through hole 12a, the drilling position is specified to be drilled. With such a configuration, it is possible to easily drill a small printed wiring board PCB.
另一方面,在步驟S1中,印刷配線板PCB的初期搬入位置被選擇在裡側時,係將X線照射機161與X線攝影機162進行ON(步驟S3b),而開始取得藉由X線攝影機162所得之印刷配線板PCB的透過畫像。如上所述,在該實施形態中,在鑽孔裝置10起動時,X線照射機161與X線攝影機162係以透過架台12的主貫穿孔12a而相對向的方式進行初期配置,因此藉由X線攝影機162來進行透過主貫穿孔12a之印刷配線板PCB的透過畫像的取得。 On the other hand, when the initial loading position of the printed wiring board PCB is selected on the back side in step S1, the X-ray irradiator 161 and the X-ray camera 162 are turned on (step S3b), and the X-ray is started to be acquired. A transmission image of the printed wiring board PCB obtained by the camera 162. As described above, in the embodiment, when the drilling apparatus 10 is started, the X-ray irradiator 161 and the X-ray camera 162 are initially disposed so as to pass through the main through hole 12a of the gantry 12, so that the initial arrangement is performed. The X-ray camera 162 obtains a transmission image of the printed wiring board PCB that has passed through the main through hole 12a.
接著,操作者由搬入口10a搬入印刷配線板PCB,一面觀看顯示部195的顯示,一面進行印刷配線板PCB的大致對位。控制單元191係將藉由X線攝影機162所取得的透過畫像,例如圖9所示,顯示於顯示部195(步驟S4b)。此時係在顯示部195顯示透過主貫穿孔12a所取得的畫像。 Next, the operator carries the printed wiring board PCB from the carry-in port 10a, and while viewing the display of the display unit 195, the printed wiring board PCB is substantially aligned. The control unit 191 displays the transmitted image obtained by the X-ray camera 162 on the display unit 195 as shown in FIG. 9, for example (step S4b). At this time, the image obtained by the main through hole 12a is displayed on the display unit 195.
操作者係與被選擇出跟前側來作為印刷配線板PCB的初期搬入位置時同樣地,一面觀看顯示部195的顯示,一面以對準標記M來到照準標記20的中心的方式,將印刷配線板PCB朝前後(X方向)、橫向(Y方向)移動。接著,控制單元191係檢測對準標記M位於照準標記20的 大致中心而被停止時(步驟S5b:Yes),將作業平台13之未圖示的吸附孔形成為負壓而將印刷配線板PCB固定在作業平台13,接著控制印刷配線板按壓件上下手段500,使印刷配線板按壓件14下降,而將印刷配線板PCB按壓在作業平台13來進行正式固定。之後,根據藉由X線攝影機162所攝像到的對準標記M的位置,特定在印刷配線板PCB鑽孔的位置(步驟S7)。在此,現在係選擇裡側作為印刷配線板PCB的初期搬入位置,透過主貫穿孔12a來對印刷配線板PCB進行攝像,因此根據該攝像資訊,來特定在印刷配線板PCB鑽孔的位置。 In the same manner as when the front side of the printed wiring board PCB is selected as the initial loading position of the printed wiring board PCB, the operator displays the printed wiring by aligning the mark M to the center of the alignment mark 20 while viewing the display of the display unit 195. The board PCB moves in the front and rear (X direction) and the horizontal direction (Y direction). Next, the control unit 191 detects that the alignment mark M is located at the sight mark 20 When the center is substantially stopped (step S5b: Yes), the suction hole (not shown) of the work platform 13 is formed into a negative pressure to fix the printed wiring board PCB to the work platform 13, and then the printed wiring board presser upper and lower means 500 is controlled. The printed wiring board presser 14 is lowered, and the printed wiring board PCB is pressed against the work platform 13 to be formally fixed. Thereafter, the position at which the printed wiring board PCB is drilled is specified in accordance with the position of the alignment mark M imaged by the X-ray camera 162 (step S7). Here, the inside is selected as the initial loading position of the printed wiring board PCB, and the printed wiring board PCB is imaged through the main through hole 12a. Therefore, the position where the printed wiring board PCB is drilled is specified based on the imaging information.
接著,控制單元191係與選擇出跟前側作為印刷配線板PCB的初期搬入位置時同樣地,視需要,使印刷配線板PCB的鑽孔位置位於主貫穿孔12a,將X線照射機161與X線攝影機162進行OFF(步驟S8),在與鑽孔位置相對應的位置,以所被選擇出的鑽孔機構171、172與對應此的對接板173a,173b朝Z方向相對向的方式,驅動上側移動機構18T與下側移動機構18D,藉由鑽孔機構171或鑽孔機構172而在印刷配線板PCB鑽孔(步驟S9),使印刷配線板按壓件14上升而解除印刷配線板PCB的正式固定,再次進行初期處理,而使作業平台13、攝像單元16、鑽孔單元17移動至初期位置後,即結束鑽孔處理。 Next, in the same manner as when the front side is selected as the initial loading position of the printed wiring board PCB, the control unit 191 places the drilling position of the printed wiring board PCB in the main through hole 12a, and the X-ray irradiator 161 and X as needed. The line camera 162 is turned OFF (step S8), and is driven at a position corresponding to the drilling position so that the selected drilling mechanisms 171, 172 and the corresponding butting plates 173a, 173b face each other in the Z direction. The upper moving mechanism 18T and the lower moving mechanism 18D drill holes in the printed wiring board PCB by the drilling mechanism 171 or the drilling mechanism 172 (step S9), and the printed wiring board pressing member 14 is raised to release the printed wiring board PCB. After the initial fixation is performed, the initial processing is performed again, and after the work platform 13, the imaging unit 16, and the drilling unit 17 are moved to the initial position, the drilling process is terminated.
如上所示,印刷配線板PCB的初期搬入位置被選擇為裡側時,若將印刷配線板PCB的對準標記M對位在形成在離搬入口10a為較遠側(離操作者為較遠側)的主貫穿 孔12a即可,因此操作者係即使為較大的印刷配線板PCB,亦可輕易地在搬入初期位置進行對位而進行鑽孔。此外,關於較大的印刷配線板PCB,藉由由搬入口10a插入至裡處來進行對位,可減小鑽孔裝置10中支持印刷配線板PCB的作業空間,可將裝置小型化。 As described above, when the initial loading position of the printed wiring board PCB is selected as the back side, if the alignment mark M of the printed wiring board PCB is aligned on the far side of the separation opening 10a (far from the operator) Main side of the side Since the hole 12a is sufficient, the operator can easily drill the hole at the initial position of the loading even if it is a large printed wiring board PCB. Further, with respect to the large printed wiring board PCB, the alignment is performed by inserting the carry-in port 10a into the inside, and the working space for supporting the printed wiring board PCB in the drilling apparatus 10 can be reduced, and the apparatus can be miniaturized.
如以上說明所示,在該實施形態之鑽孔裝置10中,位於藉由鑽孔單元17進行鑽孔的處理區域的主貫穿孔12a、及位於搬入口10b側的子貫穿孔12b被形成在架台12,因此當將較小的印刷配線板PCB搬入至鑽孔裝置10時,係藉由透過跟前側的子貫穿孔12b對印刷配線板PCB進行攝像,可輕易地進行印刷配線板PCB的鑽孔加工。此外,當將較大的印刷配線板PCB搬入至鑽孔裝置10時,係可透過裡側的主貫穿孔12a對印刷配線板PCB進行攝像,因此可達成裝置的小型化。 As described above, in the drilling apparatus 10 of the embodiment, the main through hole 12a located in the processing region drilled by the drilling unit 17 and the sub through hole 12b located on the side of the inlet 10b are formed. The gantry 12, so when the smaller printed wiring board PCB is carried into the drilling apparatus 10, the printed wiring board PCB can be easily drilled by imaging the printed wiring board PCB through the sub-through hole 12b on the front side. Hole processing. Further, when a large printed wiring board PCB is carried into the drilling apparatus 10, the printed wiring board PCB can be imaged through the main through hole 12a on the back side, so that the size of the apparatus can be reduced.
此外,在該實施形態之鑽孔裝置10中,X線照射機161被配置在比鑽孔機構171、172更為跟前側(搬入口10a側),因此可將子貫穿孔12b形成在跟前側,並且可將鑽孔裝置10小型化,對接板173被配置在比X線攝影機162更為跟前側(搬入口10a側),因此可輕易替換對接板173,並且可將鑽孔裝置10小型化。 Further, in the drilling apparatus 10 of the embodiment, the X-ray irradiation machine 161 is disposed on the front side (the side of the inlet 10a) more than the drilling mechanisms 171 and 172, so that the sub-through hole 12b can be formed on the front side. Moreover, the drilling apparatus 10 can be miniaturized, and the docking board 173 is disposed on the front side (the side of the loading inlet 10a) more than the X-ray camera 162, so that the docking board 173 can be easily replaced, and the drilling apparatus 10 can be miniaturized. .
以上列舉一實施形態來說明本發明,惟本發明並非限定於上述實施形態,其應用及變形等為任意。例如,在上述實施形態中係設為在架台12的鉛直上方,X線照射機161與鑽孔機構171、172被支持在上側移動機構18T,在 架台12的鉛直下方,X線攝影機162與對接板173a、173b被支持在下側移動機構18D,但是亦可在架台12的鉛直下方,X線照射機161與鑽孔機構171被支持在下側移動機構18D,並且在架台12的鉛直上方,X線攝影機162與對接板173a、173b被支持在上側移動機構18T。此外,以在比鑽孔機構171、172更為跟前側配置X線照射機161的方式,鑽孔機構171、172與X線照射機161被支持在上側移動機構18T與下側移動機構18D的其中一方,並且以在比X線攝影機162更為跟前側配置對接板173的方式,對接板173與X線攝影機162被支持在上側移動機構18T與下側移動機構18D的另一方。 The present invention has been described above by way of an embodiment, but the present invention is not limited to the above embodiment, and its application, modifications, and the like are arbitrary. For example, in the above embodiment, the X-ray irradiator 161 and the drilling mechanisms 171 and 172 are supported by the upper moving mechanism 18T in the vertical direction of the gantry 12. Below the gantry 12, the X-ray camera 162 and the docking plates 173a, 173b are supported by the lower side moving mechanism 18D, but the X-ray illuminator 161 and the drilling mechanism 171 are supported by the lower side moving mechanism. 18D, and above the stand 12, the X-ray camera 162 and the docking plates 173a, 173b are supported by the upper side moving mechanism 18T. Further, the X-ray irradiator 161 is disposed on the front side of the drilling mechanisms 171 and 172, and the drilling mechanisms 171 and 172 and the X-ray irradiator 161 are supported by the upper moving mechanism 18T and the lower moving mechanism 18D. One of the upper side moving mechanism 18T and the lower side moving mechanism 18D is supported by the butt plate 173 and the X-ray camera 162 in such a manner that the butting plate 173 is disposed on the front side of the X-ray camera 162.
此外,在上述實施形態中係設為在比鑽孔機構171、172更為搬入口10a側支持X線照射機161,在比對接板173a、173b更為裡側支持X線攝影機162,但是在架台12形成有主貫穿孔12a與子貫穿孔12b者中,係無關於如此之攝像單元16或鑽孔單元17的配置,而可將各種大小的印刷配線板PCB輕易進行鑽孔。此外,並非限定於上側移動機構18T與下側移動機構18D獨立而使被配置在架台12的鉛直上方與鉛直下方的攝像單元16與鑽孔單元17移動,亦可朝Z方向相對向配置的攝像單元16與鑽孔單元17一體朝X方向及Y方向移動。 In addition, in the above-described embodiment, the X-ray irradiator 161 is supported on the side of the inlet 10a from the drilling mechanisms 171 and 172, and the X-ray camera 162 is supported on the back side of the butting plates 173a and 173b. The gantry 12 is formed with the main through hole 12a and the sub through hole 12b. Regardless of the arrangement of the imaging unit 16 or the drilling unit 17, the printed wiring board PCB of various sizes can be easily drilled. Further, the present invention is not limited to the fact that the upper moving mechanism 18T and the lower moving mechanism 18D are independent of each other, and the imaging unit 16 and the drilling unit 17 disposed vertically above and below the gantry 12 are moved, and the imaging unit 16 can be disposed in the Z direction. The unit 16 moves integrally with the drilling unit 17 in the X direction and the Y direction.
此外,在上述實施形態中,攝像單元16係設為具有X線照射機161與X線攝影機162者,但是若為透過貫穿孔來對印刷配線板PCB進行攝像者,則亦可使用任意者。 Further, in the above-described embodiment, the imaging unit 16 is provided with the X-ray irradiator 161 and the X-ray camera 162. However, any image pickup board PCB may be used to pass through the through hole.
此外,在上述實施形態中係設為將作業平台13的吸附孔形成為負壓來將印刷配線板PCB吸附固定在作業平台13者,但是亦可藉由例如將被載置於作業平台13的印刷配線板PCB由鉛直上方按壓等其他手法,使印刷配線板PCB被固定在作業平台13。 Further, in the above-described embodiment, the suction hole of the work platform 13 is formed to have a negative pressure to adsorb and fix the printed wiring board PCB to the work platform 13, but it may be placed on the work platform 13 by, for example. The printed wiring board PCB is pressed by a vertical upper side and the like, so that the printed wiring board PCB is fixed to the work platform 13.
10‧‧‧鑽孔裝置 10‧‧‧Drilling device
10a‧‧‧搬入口 10a‧‧‧Transfer
11‧‧‧外殼 11‧‧‧Shell
11a‧‧‧X線遮蔽部(遮蔽手段) 11a‧‧‧X-ray shielding (shadowing means)
12‧‧‧架台 12‧‧‧ 台台
12a‧‧‧主貫穿孔 12a‧‧‧Main through hole
12b‧‧‧子貫穿孔 12b‧‧‧ child through hole
13‧‧‧作業平台 13‧‧‧Working platform
14‧‧‧治具板 14‧‧‧ fixture board
15‧‧‧搬送部 15‧‧‧Transportation Department
16‧‧‧攝像單元 16‧‧‧ camera unit
17‧‧‧鑽孔單元 17‧‧‧Drilling unit
18‧‧‧移動機構 18‧‧‧Mobile agencies
18D‧‧‧下側移動機構 18D‧‧‧Bottom moving mechanism
18T‧‧‧上側移動機構 18T‧‧‧Upper moving mechanism
19‧‧‧控制部 19‧‧‧Control Department
20‧‧‧顯示 20‧‧‧ display
161‧‧‧X線照射機 161‧‧‧X-ray irradiation machine
162‧‧‧X線攝影機 162‧‧‧X-ray camera
171、172‧‧‧鑽孔機構 171, 172‧‧‧ drilling mechanism
173、173a、173b‧‧‧對接板 173, 173a, 173b‧‧‧ docking board
181D、181T‧‧‧框體 181D, 181T‧‧‧ frame
182D、182T‧‧‧軌條 182D, 182T‧‧ ‧ rails
183D、183T‧‧‧Y軸架台 183D, 183T‧‧‧Y-axis table
184D、184T‧‧‧滾珠螺桿 184D, 184T‧‧‧ ball screw
185D、185T‧‧‧馬達 185D, 185T‧‧ motor
186D、186T‧‧‧軌條 186D, 186T‧‧ ‧ rails
187D、187T‧‧‧移動體 187D, 187T‧‧‧ mobile body
188D、188T‧‧‧滾珠螺桿 188D, 188T‧‧‧ ball screw
189D、189T‧‧‧馬達 189D, 189T‧‧ ‧ motor
191‧‧‧控制單元 191‧‧‧Control unit
192‧‧‧主記憶部 192‧‧‧Main Memory
193‧‧‧外部記憶部 193‧‧‧External Memory Department
194‧‧‧操作部 194‧‧‧Operation Department
195‧‧‧顯示部 195‧‧‧Display Department
196‧‧‧輸出入部 196‧‧‧Import
198‧‧‧內部匯流排 198‧‧‧Internal busbar
500‧‧‧印刷配線板按壓件上下手段 500‧‧‧Printed wiring board pressing parts
圖1係顯示本發明之實施形態之鑽孔裝置之外觀的斜視圖。 Fig. 1 is a perspective view showing the appearance of a drilling apparatus according to an embodiment of the present invention.
圖2係顯示通過圖1所示之鑽孔裝置的寬幅(X方向)的中心部,由右側面方向(-Y方向)觀看平行於與XY平面呈直角的面的剖面時之鑽孔裝置之構成概要的側面圖。 2 is a view showing a drilling apparatus in which a central portion of a wide width (X direction) of the drilling apparatus shown in FIG. 1 is viewed from a right side direction (-Y direction) in a section parallel to a plane at right angles to the XY plane. A side view of the outline of the configuration.
圖3係顯示作業平台或攝像單元、鑽孔單元的斜視圖。 Fig. 3 is a perspective view showing a work platform or an image pickup unit and a drilling unit.
圖4係顯示搬送部或移動部的斜視圖。 Fig. 4 is a perspective view showing a conveying unit or a moving unit.
圖5係顯示移動部的斜視圖。 Fig. 5 is a perspective view showing the moving portion.
圖6係顯示攝像單元與鑽孔單元的位置關係的斜視圖。 Fig. 6 is a perspective view showing the positional relationship between the image pickup unit and the drilling unit.
圖7係控制裝置的說明圖。 Fig. 7 is an explanatory diagram of a control device.
圖8係顯示鑽孔處理之一例的流程圖。 Fig. 8 is a flow chart showing an example of the drilling process.
圖9係用以說明對位的圖。 Figure 9 is a diagram for explaining alignment.
圖10係透過子貫穿孔,X線照射機與X線攝影機相對向時之與圖2相對應的圖。 Fig. 10 is a view corresponding to Fig. 2 when the X-ray irradiator is opposed to the X-ray camera through the through-hole.
圖11係透過子貫穿孔,X線照射機與X線攝影機相對向時之與圖3相對應的圖。 Fig. 11 is a view corresponding to Fig. 3 when the X-ray irradiator is opposed to the X-ray camera through the through-hole.
圖12係透過主貫穿孔,藉由鑽孔單元鑽孔時之與圖2相對應的圖。 Figure 12 is a view corresponding to Figure 2 when drilling through a drilling unit through a main through hole.
11a‧‧‧X線遮蔽部(遮蔽手段) 11a‧‧‧X-ray shielding (shadowing means)
12‧‧‧架台 12‧‧‧ 台台
12a‧‧‧主貫穿孔 12a‧‧‧Main through hole
12b‧‧‧子貫穿孔 12b‧‧‧ child through hole
16‧‧‧攝像單元 16‧‧‧ camera unit
17‧‧‧鑽孔單元 17‧‧‧Drilling unit
18T‧‧‧上側移動機構 18T‧‧‧Upper moving mechanism
18D‧‧‧下側移動機構 18D‧‧‧Bottom moving mechanism
161‧‧‧X線照射機 161‧‧‧X-ray irradiation machine
162‧‧‧X線攝影機 162‧‧‧X-ray camera
171、172‧‧‧鑽孔機構 171, 172‧‧‧ drilling mechanism
173‧‧‧對接板 173‧‧‧ docking board
Claims (5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012076615A JP5952053B2 (en) | 2012-03-29 | 2012-03-29 | Drilling device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201343286A true TW201343286A (en) | 2013-11-01 |
TWI505884B TWI505884B (en) | 2015-11-01 |
Family
ID=49370060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101148774A TWI505884B (en) | 2012-03-29 | 2012-12-20 | Drilling device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5952053B2 (en) |
CN (1) | CN103369841B (en) |
TW (1) | TWI505884B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6739259B2 (en) * | 2016-07-06 | 2020-08-12 | セイコータイムシステム株式会社 | Punching device |
JP6252809B1 (en) * | 2016-09-14 | 2017-12-27 | 株式会社ムラキ | Automatic transfer device applied to multilayer circuit board reference drilling machine |
CN113038708B (en) * | 2021-03-01 | 2022-06-24 | 湖北瀚鼎电路电子有限公司 | Punching device for adding protective plate and pasting adhesive tape on PCB production line |
CN113232087B (en) * | 2021-06-30 | 2024-04-05 | 南通海峰家居用品有限公司 | Pull ring type curtain punching and installing equipment |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2542685B2 (en) * | 1988-09-09 | 1996-10-09 | 凸版印刷株式会社 | Printed wiring board loading device |
JP2873439B2 (en) * | 1995-09-22 | 1999-03-24 | セイコープレシジョン株式会社 | Drilling device and method for printed circuit board |
JP3550462B2 (en) * | 1996-07-31 | 2004-08-04 | セイコープレシジョン株式会社 | Drilling method, drilling device, hole position detecting method, and hole position detecting device for plate-shaped work |
TW381412B (en) * | 1997-03-14 | 2000-02-01 | Seiko Precision Kk | Manufacturing method for multilayer substrate and the manufacturing device thereof |
JP3361251B2 (en) * | 1997-08-28 | 2003-01-07 | セイコープレシジョン株式会社 | Plate work transfer device |
JPH11304726A (en) * | 1998-04-24 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Inspection method by x rays and x-ray inspection device |
JP4502454B2 (en) * | 2000-04-28 | 2010-07-14 | 株式会社ムラキ | Reference hole drilling machine |
JP2001315011A (en) * | 2000-05-10 | 2001-11-13 | Canon Inc | Board working device and board working method |
JP3978462B2 (en) * | 2001-08-15 | 2007-09-19 | Uht株式会社 | Work table for punching device and punching device |
JP3095308U (en) * | 2003-01-17 | 2003-07-31 | 聯星科技股▲ふん▼有限公司 | Push plate moving structure for thin plate drilling of printed circuit board X-ray drilling machine |
KR100674077B1 (en) * | 2004-06-01 | 2007-01-25 | 베아크 가부시끼가이샤 | Hole-punching apparatus |
JP4542046B2 (en) * | 2006-01-30 | 2010-09-08 | セイコープレシジョン株式会社 | Drilling method and drilling device |
JP4210692B2 (en) * | 2006-05-30 | 2009-01-21 | セイコープレシジョン株式会社 | Drilling device |
JP5022069B2 (en) * | 2007-03-15 | 2012-09-12 | セイコープレシジョン株式会社 | Drilling device |
JP4462353B2 (en) * | 2008-01-11 | 2010-05-12 | セイコーエプソン株式会社 | Flexible substrate manufacturing method and flexible substrate punching apparatus |
CN101733438B (en) * | 2009-11-10 | 2011-09-28 | 重庆理工大学 | Robot for punching positioning holes on circuit board |
CN102248556B (en) * | 2011-05-26 | 2013-07-10 | 高文祥 | Full-automatic punching machine |
-
2012
- 2012-03-29 JP JP2012076615A patent/JP5952053B2/en active Active
- 2012-12-20 TW TW101148774A patent/TWI505884B/en active
-
2013
- 2013-03-29 CN CN201310108781.1A patent/CN103369841B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103369841A (en) | 2013-10-23 |
TWI505884B (en) | 2015-11-01 |
CN103369841B (en) | 2016-04-27 |
JP2013207188A (en) | 2013-10-07 |
JP5952053B2 (en) | 2016-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4542046B2 (en) | Drilling method and drilling device | |
TWI505884B (en) | Drilling device | |
TWI505883B (en) | Drilling device | |
TW386047B (en) | Drilling apparatus and method for printed circuit board | |
JP4210692B2 (en) | Drilling device | |
JP2009130014A (en) | Apparatus for obtaining side images of suction nozzle and component to be sucked | |
JP2006253184A (en) | Method of manufacturing substrate unit and component mounting apparatus using the method | |
CN108029231B (en) | Substrate processing machine and recognition method | |
JP6571116B2 (en) | Inspection support device | |
JP2021052144A (en) | Wafer processing method and wafer processing device | |
EP3270677A1 (en) | Mounting device, image processing method and imaging unit | |
JP6010337B2 (en) | Electronic component mounting equipment | |
JP6767625B2 (en) | Parts mounting device | |
JP5512648B2 (en) | X-ray processing equipment | |
JPWO2018096577A1 (en) | Image processing system and image processing method | |
JP2004140161A (en) | Device and method for automatically confirming substrate backup pin erecting position of electronic part mounting device | |
KR20200051368A (en) | The camera and UVW stage system for using in a PCB chamfering automation | |
CN109565952B (en) | Substrate working machine | |
JPH1170436A (en) | Plate shaped work conveying device | |
JP2018014384A (en) | Board working machine | |
JP2002176296A (en) | Mounting data generating device and recording medium of program | |
JP6386588B2 (en) | Solder ball information management system for solder ball feeder | |
JPWO2019069438A1 (en) | Substrate work system | |
JP4417704B2 (en) | Component mounting equipment | |
JP2005349628A (en) | Registering method of plate in screen printing and device therefor |