KR100955449B1 - Boring method and boring device - Google Patents

Abstract

The drilling accuracy is improved by eliminating the movement error that occurs when the drill moves.

The jig plate has two imaging holes and a jig hole. This relative arrangement relationship is the same as the relationship between two predetermined marks on a substrate to be punctured and a predetermined puncture position.

The positioning of the drill (1) coincides with the centers of the two imaging holes of the jig plate and the imaging centers of the two imaging means, respectively, and (2) uses the drill passed through the jig hole to the correction substrate placed on the jig plate. (3) move the position of the drilled hole to the imaging center, measure the error of the center of the drilling position relative to the jig hole center, (4) correct the error, and determine the position of the drill relative to the imaging means. Is done. After that, the drill is not moved.

Drilling a hole with respect to the substrate by adjusting the position of the perforation target substrate on which the two predetermined marks are recorded and matching the two predetermined reference marks with the imaging centers of the two imaging means, respectively Conduct.

Description

Drilling method and drilling device {BORING METHOD AND BORING DEVICE}

The present invention relates to a drilling device for processing a reference hole in a printed circuit board and the like.

Electronic devices include electronic components for surface mounting such as IC chips, resistors, and capacitors. In recent years, with the miniaturization of such components, there has also been a demand for higher density of printed circuit boards on which these components are mounted. As a result, printed circuit boards are often multilayered. Multilayer printed circuit boards consist of a conductor layer exposed on the outside of two surfaces and a conductor layer of several unexposed inner layers. An insulating substrate is inserted between the conductor layers, and the substrate is bonded to each other by such a substrate.

In the multilayer printed circuit board, for example, at least two reference holes for positioning are provided in advance on the double-sided wiring board, and patterns on the front and back surfaces thereof are formed based on the reference holes. The pattern of the front and back surfaces of the double-sided printed circuit board is fixed to each other in planar manner. In this way, the plurality of double-sided wiring boards form patterns and the like using reference holes at the same coordinate positions. In addition to the pattern of a single wiring board, a plurality of guide marks for the reference holes for newly installed reference marks, guide marks for indicating the position of the reference holes for front and rear identification, and the like are prepared in the pattern formed on the double-sided printed circuit board serving as the inner layer board. This guide mark is formed by an etching process.

 A plurality of inner-layer double-sided printed circuit boards which have been etched are repeated, and the arrangement of the positional relationship of the patterns formed on the conductor portions of the respective wiring boards is called lay up. In order to perform a layup, the jig board on which several pin is planted is prepared. In general, the pin is installed at a position corresponding to the reference hole provided in advance. In order to more accurately arrange the pattern of each layer of the completed multilayer wiring board, a new reference hole for layup may be provided.

In the one-etched double-sided wiring board, the pin of the jig plate is inserted into the reference hole and placed on the jig plate. On it, a reference hole is drilled and a substrate material (called a prepreg) before heating is placed. In addition, another double-sided wiring board is superposed on the jig plate by inserting a pin of the jig plate into the reference hole. In this step, the lay-up is completed by fixing the two-sided wiring boards and the outer periphery of the prepreg disposed therebetween.

When the copper foil of the prepreg and the conductor material are placed on both sides of the two-sided double-sided printed circuit board and pressurized and heated by hot press, the prepreg inserted between the copper foil or the double-sided wiring board is thermally cured (insulated). ) The substrate is changed to complete adhesion between the conductors. Thereafter, the reference hole corresponding to the inner layer pattern of the multilayer wiring board is drilled. The outermost conductor wiring pattern is etched, the through hole is drilled, and the like based on the reference hole. In addition, a plating process, a waterproofing process, and the like are carried out, and a single printed circuit board is divided by a machining, thereby completing a multilayer printed circuit board cut into a required outer shape.

In the manufacturing process of a multilayer printed circuit board, two types of reference holes for laying up and reference holes formed after a hot press process are used as reference holes. As mentioned above, in the double-sided printed circuit board forming the inner layer of the multilayered printed circuit board, a plurality of guide marks and the like for reference holes are prepared in addition to the pattern of the single wiring board, and the guide marks are also etched by the etching process. Since the coordinates of the guide marks are determined to maintain the positional relationship with the pattern of the single wiring board, the coordinates of the patterns constituting the circuit are found when the position of these guide marks is measured. A puncturing apparatus is generally used to observe a plurality of guide marks and the like, obtain a coordinate of a new reference hole based on a result calculated from such observations, and process the drilling of the reference hole.

The object of processing of the punching device is a multilayer printed circuit board, first of which the layup process and the hot press process are completed, and secondly, a double-sided printed circuit board before the layup process, which is a member constituting the multilayer printed circuit board. That is, there are a multilayer and a double-sided printed circuit board as a work of the reference hole punching device, and these two may be collectively referred to as a work or simply a printed circuit board.

As described above, the front and back surfaces of the multilayer printed circuit board pressurized and heated by hot press are covered by a pure conductor layer, and it is impossible to clearly see the guide marks formed on the inner layer using visible light with the naked eye. In order to cope with such a case, various observation means that do not use visible light have been studied. For example, ultrasonic waves may be used. At present, observation means using weak X-rays is prominent, and X-ray (reference hole) perforator using this is widely used. By the use of such X-rays, it becomes possible to see through the multilayer wiring board and observe the guide marks formed on the inner conductor layer.

The processing precision of the printed circuit board depends on the precision of the reference hole. Patent documents 1 and 2 are examples of techniques for improving the processing accuracy of a printed circuit board.

Patent document 1 describes a technique for the purpose of accurate puncturing of a printed board with a simple configuration. The technique of patent document 1 prepares the jig board in which the some hole part was formed in the jig board on the worktable. The transmission images of the plurality of hole portions are picked up by two imaging means, and the positional difference between the center position and the image center is obtained. Since the space | interval between hole parts is known previously, the space | interval of both imaging means can be calculated. Then, the printed circuit board is set, and both of the imaging means pick up both identification marks and perform image processing to find the positional difference between the center position and the image center. The space between the marks for identification is calculated from the space between the two imaging means. Subsequently, a correction is made as much as an error between the interval between the marks for identification and the interval between the spaces to be punctured, the puncturing position is set, and the holes are drilled therein.

Moreover, the technique of patent document 2 is equipped with the press roller which a rotating shaft is installed in the center part of a wiring board press at right angle with the moving direction of a movable table, and rotates by the movement of a movable table. The pressing roller holds the workpiece on the movable table until the end of the machining to prevent positional deviation.

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-85693

[Patent Document 2] Japanese Patent Application Laid-Open No. 2001-310208

[Problems that the invention tries to solve]

The conventional drilling apparatus measures the positional relationship between the camera and the drill, and obtains the center position deviation of both as a correction value in advance (zero set). And when the hole was actually drilled, the mark which shows the punching position with which the workpiece was equipped was measured using image processing, the correction value was added to the center coordinate, the drill was moved, and the hole was drilled.

In this method, there is no means for confirming whether the drill has moved precisely to the place where the hole of the work is to be drilled, resulting in open loop control. Due to the movement error which occurs when the drill moves, it has caused a decrease in the drilling accuracy.

The present invention has been made in view of the above circumstances, and an object thereof is to improve the drilling accuracy by eliminating the movement error occurring when the drilling means moves.

[Means for solving the problem]

In order to achieve the above object, a perforation method according to the first aspect of the present invention includes a table in which a printed wiring board having a hole is placed and moved in a horizontal direction;

Drilling means for drilling a hole in the printed wiring board, comprising a drill, lifting means for moving the drill in a vertical direction, and fixing means for fixing the printed wiring board;

At least two imaging means for measuring a puncturing position or a reference point position of the printed wiring board;

Moving means for simultaneously moving both in the horizontal direction while maintaining a distance between the imaging means and the puncturing means; And

A drilling method for a drilling device comprising a drill moving means for moving the drill in a horizontal direction with respect to the imaging means on the moving means,

The drilling device,

A jig plate having an imaging hole for imaging a reference mark of a printed wiring board with the imaging means and a jig hole for drilling the hole with the drilling means at a predetermined drilling position of the printed wiring board,

The distance between the centers of the two imaging holes is equal to the distance of the two predetermined reference marks of the printed wiring board, and the positional relationship of the center of the jig hole with respect to the position of the center of the two imaging holes is the printing. The jig plate is provided with the two imaging holes and the jig hole so as to be equal to the relationship between the two predetermined reference marks on the wiring board and the predetermined puncturing position,

The punching method includes: an imaging means position determining step of setting positions of imaging centers of the two imaging means so as to be equal to a relationship between two predetermined reference marks of the printed wiring board; A drill position deciding step of setting the positions of the puncturing means with respect to the two imaging means so as to be equal to the relation of the predetermined puncturing positions with respect to the two predetermined reference marks of the printed wiring board; An imaging position adjusting step of adjusting the moving means and the table so that the centers of the two imaging holes and the imaging centers of the two imaging means coincide with the jig plate placed on the table; After drilling a hole in the substrate for correcting the puncturing position on the jig plate by using the punching means, the table is operated to move the position of the hole drilled by the punching means to the imaging center, and thus the jig hole center and the An error measuring step of measuring a position of the center of the hole drilled in the hole position correction substrate and measuring an error of the center of the hole position relative to the center of the jig hole; A drill positioning step of setting the position of the drill relative to the imaging means by operating the drill moving means to correct an error of the puncture position center with respect to the jig hole center measured by the error measuring process; A substrate for operating the table with respect to the printed wiring board to be punched on which at least two predetermined reference marks placed on the table are recorded so as to match the two predetermined reference marks to the positions of the imaging centers of the two imaging means, respectively. Positioning process; And a punching step of punching holes in a predetermined position of the printed wiring board by the punching means with respect to the printed wiring board to be punched in which at least two predetermined reference marks placed on the table are recorded.

According to a second aspect of the present invention, there is provided a drilling apparatus comprising: a table on which a printed wiring board having a hole is placed, and which moves in a horizontal direction;

Drilling means comprising a drill, lifting means for moving the drill in an up and down direction, and fixing means for fixing the printed wiring board, for drilling a hole in the printed wiring board;

At least two imaging means for measuring a puncturing position or a reference point position of the printed wiring board;

Moving means for simultaneously moving both in the horizontal direction while maintaining a distance between the imaging means and the puncturing means; And

A drilling apparatus comprising a drill moving means for moving the drill in a horizontal direction with respect to the imaging means on the moving means,

A jig board having an imaging hole for imaging a reference mark of a printed wiring board with the imaging means and a jig hole for drilling a hole in a predetermined drilling position of the printed wiring board, wherein the distance between the centers of the two imaging holes is different from each other. The relationship of the position of the center of the jig hole with respect to the position of the center of the two imaging holes is equal to the distance of the two predetermined reference marks of the printed wiring board, and the two predetermined reference marks of the printed wiring board are predetermined. A jig plate in which the two imaging holes and the jig hole are formed so as to be equal to the relationship between the puncturing positions of the two; Imaging means position-determining means for setting the positions of the imaging centers of the two imaging means so as to be equal to the relationship between the two predetermined reference marks of the printed wiring board; Drill position deciding means for setting the positions of the puncturing means with respect to the two imaging means so as to be equal to the relationship of the predetermined puncturing positions with respect to the two predetermined reference marks of the printed wiring board; Imaging position adjusting means for adjusting the moving means and the table so that the centers of the two imaging holes and the imaging position centers of the two imaging means coincide with the jig plate placed on the table; After drilling a hole in the substrate for correcting the puncturing position on the jig plate by using the punching means, the table is operated to move the position of the hole drilled by the punching means to the imaging center, and thus the jig hole center and the Error measuring means for measuring a position of the center of the hole drilled on the substrate for puncturing position correction, and measuring an error of the center of the drilling position relative to the center of the jig hole; Drill positioning means for operating the drill moving means to set the position of the drill with respect to the imaging means so as to correct an error in the center of the drilling position relative to the jig hole center measured by the error measuring means; A substrate for operating the table with respect to the printed wiring board to be punched on which at least two predetermined reference marks placed on the table are recorded so as to match the two predetermined reference marks to the positions of the imaging centers of the two imaging means, respectively. Positioning means; And a perforation means for punching a hole at a predetermined position of the printed wiring board by the perforation means with respect to the printed wiring board to be punched on which at least two predetermined reference marks set on the table are recorded.

Preferably, the substrate positioning means includes substrate moving means for moving the printed wiring board in the longitudinal direction and the width direction, and the substrate moving means further includes width moving means for moving the printed wiring board in the width direction. It may be configured to include.

In the structure provided with such a board | substrate movement means and a width direction movement means, More preferably, the said width direction movement means rotates the said printed wiring board about the other end by linearly moving one end of the said printed wiring board. You may comprise so that it may be made.

Alternatively, the width direction moving means includes two small table means for moving one end and the other end of the printed wiring board independently of each other, and the width direction moving means is driven by one of the two small table means. One end or the other end of the printed wiring board may be linearly moved while the other stops, whereby the printed wiring board may be rotated about the other of the small table means.

In addition, the above-mentioned "length direction and the width direction" are typically set so that the former may be in the direction of the X axis and the latter is the direction of the Y axis that intersects them. In this case, more specifically, the "width direction moving means" may correspond to a driving mechanism having a table movable in the Y direction, and the "small table means" is a drive having two tables movable in the Y direction. The apparatus may be applicable. As a matter of course, the above-described setting regarding the axial direction (that is, the setting of the coordinate system) is basically arbitrary, so that the "length direction and the width direction" may be set to the Y-axis and the X-axis, respectively. In this case, more specifically, the "width direction moving means" may correspond to a driving mechanism having a table movable in the X direction, and the "small table means" is a drive having two tables movable in this X direction. The apparatus may be applicable.

Alternatively, the printed wiring board may be configured to include a double-sided printed circuit board on which a pattern constituting a predetermined electric circuit is formed.

Preferably, the printed wiring board may be configured to include a multilayer printed circuit board in which a plurality of double-sided printed circuit boards on which a pattern constituting a predetermined electric circuit is formed are laminated.

In a configuration including such a multilayer printed circuit board, more preferably, the surface and the rear surface of the multilayer printed circuit board may be covered with a conductor layer.

Preferably, the imaging means may be configured to include an X-ray camera.

In a configuration including such an X-ray camera, more preferably, the imaging means further includes an X-ray generator, and the moving means may be configured to move both the X-ray camera and the X-ray generator.

In the configuration including the X-ray camera, more preferably, the imaging means may be configured to further include X-ray protection means.

Moreover, you may comprise so that the conveyance means which supplies the said printed wiring board to the said table and carries out from the said table may be further provided.

Preferably, the number of holes drilled by the error measuring means with respect to the substrate for puncturing position correction and the number of holes drilled by the puncturing means with respect to the printed wiring board are both two or more and the same number as each other. The perforation of the perforation position correcting substrate by the error measuring means is performed simultaneously or sequentially in the predetermined order with respect to the two or more holes. In the same order as for the perforation, the two or more holes may be configured simultaneously or sequentially in a predetermined order.

Further, preferably, the moving means may be configured to include a ball screw.

[Effects of the Invention]

According to the drilling method of the present invention, in the case of correcting the drill position, by adjusting the position of the drill to actually drill the drill at a predetermined position, the drill having been adjusted is no longer removed from the position while maintaining the position. not moving.

In the drilling device of the present invention, a jig hole is provided on the movable table on which the printed wiring board is placed. By feeding back the movement result on the basis of the jig hole, it becomes possible to determine the position while verifying that the movement has been made to the correct position. By this method, the error at the time of moving the punching position of a printed wiring board to a drill position can be eliminated.

By using the closed loop control, it is possible to perform a higher precision drilling by eliminating an error related to the movement of the drill than the conventional open loop control.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structural example of the perforation apparatus which concerns on embodiment of this invention.

It is a figure which shows the other structural example of the perforation apparatus which concerns on embodiment of this invention.

It is a figure which shows the main internal structural example of the drilling apparatus which concerns on embodiment of this invention.

4 is a block diagram showing an example of a hardware configuration of a control apparatus according to the embodiment of the present invention.

It is a figure which shows the detail of the jig board which concerns on embodiment of this invention.

It is a figure which shows the movement of the movable table of the drilling apparatus which concerns on embodiment of this invention.

7 is a flow chart showing an example of the operation of the drilling device according to the embodiment of the present invention.

It is a figure which shows the mode which correct | amends a position of a drill using the board | substrate for correction about the drilling apparatus which concerns on embodiment of this invention.

It is a figure which shows the example of the error of a jig hole and a perforation.

It is a figure which shows the process of making a reference hole in a printed wiring board with respect to the perforation apparatus which concerns on embodiment of this invention.

[Description of the code]

1 drilling device

2 case

3 chairs

4 X-ray generator

5 X-ray protective tube

6 X-ray camera

7 Drill

7a drill drill rack

7b drill bits

9 clamper

9a air cylinder

10 X mobile mount

11 Y mobile stand

12 operation table

10a, 11a, 12a Linear Guide (LM Guide)

10 b, 11 b, 12 b b Ball screw

17 Worker's position (arrow)

50 jig board

51 Suction part

52 shooting hole

53 Jig Hole

60 printed wiring board

60h standard hole

60m mark

61 Calibration Board

61h ear hole

The drilling apparatus 1 which concerns on embodiment of this invention is demonstrated with reference to drawings.

1 shows the inside through which the case 2 of the punching device 1 is viewed. In addition, the machine coordinate system (origin O, X, Y, Z) written in FIG. 1 is a coordinate system fixed to the non-moving part (for example, case 2 or mount 3) of the punching device 1. As shown in FIG. The direction of movement of the various machine parts of the transmission device is parallel to this coordinate axis. In addition, the position on the figure of the arrow 17 of FIG. 1 is a fixed position of an operator. The worker is located in the direction of the arrow (forward direction of the Y axis), and puts a printed wiring board (not shown) in which the work exists, and removes it from the punching device 1 after finishing the processing. Supply and acquisition of a workpiece may be performed by a conveying apparatus. The conveying apparatus can be comprised, for example with the robot arm provided with the adsorber which adsorb | sucks by air.

The mount 3 is fixed inside the case 2 of the drilling device 1. The left and right X moving mounts 10 are formed in a substantially handle shape and have a symmetrical relationship from side to side. This X moving mount 10 is supported by the linear guide 10a disposed on the upper end of the mount 3. The X moving mount 10 is movable in the X-axis direction by a ball nut (not shown) mounted on the lower surface thereof and a ball screw 10b coupled thereto. The ball screw 10b is arrange | positioned for every X moving mount 10 in order to drive each X moving mount 10 separately. The X-ray camera 6 is placed on the X moving mount 10.

The X moving mount 10 waits at a position where the X-ray camera 6 can observe the mark (described later) on the wiring board. In order to realize such an atmosphere, the X moving mount 10 utilizes the possibility of movement in the X axis direction by the above-described ball screw 10b or the like. In addition, such a standby operation is appropriately performed or performed in advance corresponding to the size of the wiring board.

The X-ray generator 4 is fixed to the upper portion of the X moving mount 10. Moreover, the X-ray protective tube 5 is arrange | positioned at the upper part of the X moving mount 10, and the air cylinder 9a which moves the clamper 9 and the clamper 9 up and down is provided with this.

The linear guide 11a is attached to the lower part of the said X moving mount 10. FIG. The Y moving mount 11 is supported by this straight guide 11a. By the ball screw 11b and the ball nut (not shown) attached to the lower surface of the Y movable mount 11 which engages with this, the Y movable mount 11 is movable parallel to a Y axis.

The drill moving mount 7a (refer FIG. 3) and the X-ray camera 6 which mounted the drill 7 are being fixed to the Y moving mount 11.

The movable table 12 mounts a substrate such as a multilayer printed circuit board. This movable table 12 is supported by the linear guide 12a and the ball screw 12b parallel to the Y-axis fixed to the center part of the case 2. As a result, the movable table 12 moves in parallel with the Y axis. The movable table 12 puts the printed wiring board 60 which perforates the reference hole 60h at the position of 12A of FIG. 1 in which a workpiece | work exists, moves along a Y-axis, and measures a mark and introduce | transduces into a reference hole punching position. In addition, although not shown in FIG. 1, the movable table 12 moves in parallel with the X axis by a straight guide and a ball screw arranged in parallel with the X axis.

In addition, one end of the movable table 12 moves in parallel with the Y axis independently of the ball screw 12b by another relatively small linear guide and ball screw arranged parallel to the Y axis. As a result, the movable table 12 can be rotated about an axis parallel to the Z axis, but this point will be described later.

The drill 7 is able to move with respect to the Y-moving mount 11 in the X-axis and Y-axis directions. The horizontal position of the drill 7 can be adjusted with respect to the X-ray camera 6.

Moreover, the control apparatus which drives the ball screw 10b, 11b, 12b, etc., and controls the movement of the X moving mount 10, the Y moving mount 11, and the movable table 12 is not shown in FIG.

On the premise of the above description, it can be concluded that the main components of the drilling device 1 are composed of an observation mechanism, a drilling mechanism, and a driving mechanism. That is, the observation mechanism includes the X-ray generator 4, the X-ray protective tube 5, and the X-ray camera 6. The drilling tool includes a drill 7 and a clamper 9. The drive mechanism includes an X moving mount 10, a Y moving mount 11, a movable table 12, linear guides 10a, 11a, 12a for supporting and driving them, ball screws 10b, 11b, 12b, and the like. It includes. In addition, the control device which is not shown in FIG. 1 performs control of the above-mentioned various devices according to a series of drilling operation sequences.

In FIG. 1, although the X-ray generator 4 is provided in the upper part of the X movable mount 10, as shown in FIG. 2, the X-ray generator 4 is installed in the upper part of the Y movable mount 11, It may be configured integrally with the X-ray protective tube 5. 2 is a diagram illustrating another configuration example of the drilling device according to the present embodiment. In the configuration of FIG. 2, since the X-ray generator 4 moves together with the Y moving mount 11, the position captured by the X-ray camera 6 is not limited to any place in the Y direction.

3 is an elevation view of the interior of the drilling device 1 as viewed in the Y-axis direction. In FIG. 3, the case 2 and the mount 3 are omitted. In addition, the X moving mount 10 is omitted in the form of a channel.

Two X moving mounts 10 arranged to the left and right move independently in the X direction (left and right direction in FIG. 3). The Y-moving mount 11 disposed on the X-moving mount 10 moves along the straight guide 11a in the Y direction (the direction perpendicular to the ground in FIG. 3). Since the X-ray camera 6 is fixed to the Y-moving mount 11, it moves in accordance with the movement of the X-moving mount 10 and the Y-moving mount 11.

The drill moving mount 7a supporting the drill 7 is fixed to the Y moving mount 11 so that the drill 7 can be mounted on the Y moving mount 11 (that is, with respect to the X-ray camera 6). It can be moved in the axial and y-axis directions. Further, the drill 7 is elevated in the Z-axis direction by an air cylinder (not shown). As the drill 7 moves up and down, a hole is drilled in the printed wiring board 60 with the drill bit 7b attached to the end of the drill 7.

The movable table 12 moves in the X-axis and Y-axis directions independently of the X-moving mount 10 and the Y-moving mount 11.

The jig plate 50 is provided on the movable table 12. At the center of the jig plate 50, an adsorption portion 51 for adsorbing and fixing the printed wiring board 60 or the like is provided. Although omitted in FIG. 3, the vicinity of the puncturing position of the printed wiring board 60 is fixed by the clamper 9 and the air cylinder 9a so that the printed wiring board 60 does not move when a hole is drilled with the drill bit 7b. It is. The jig plate 50 is provided with a jig hole 53 so that the drill 7 and the drill bit 7a do not interfere when the hole is drilled in the printed wiring board 60.

The control apparatus 20 inputs imaging of the X-ray camera 6, and measures the position of a hole and a mark from imaging. The control apparatus 20 drives the electric motor (not shown) of the X moving stand 10, the Y moving stand 11, the movable table 12, and the drill moving stand 7a, and rotates a ball screw to each stand. And move the table. In addition, the controller 20 is the position information (and speed information) of each mount or table from the linear scale of the X moving mount 10, the Y moving mount 11, the movable table 12, and the drill moving mount 7a. ) Feedback control.

4 is a block diagram illustrating an example of a hardware configuration of the control device 20. As shown in FIG. 4, the control device 20 includes a control unit 21, a main memory unit 22, an external storage unit 23, an operation unit 24, a display unit 25, and an input / output unit 26. The main memory unit 22, the external storage unit 23, the operation unit 24, the display unit 25, and the input / output unit 26 are all connected to the control unit 21 via the internal bus 28.

The control unit 21 is constituted by a CPU (Central Processing Unit) or the like and executes processing for drilling, which will be described later, in accordance with a program stored in the external storage unit 23.

The main memory section 22 is composed of a RAM (Random-Access Memory) or the like and loads a program stored in the external storage section 23 to be used as a work area of the control section 21.

The external storage unit 23 is composed of a nonvolatile memory such as a flash memory, a hard disk, a digital versatile disc random-access memory (DVD-RAM), and a digital versatile disc rewritable (DVD-RW). The external storage unit 23 stores in advance a program for causing the control unit 21 to perform the above-described processing. In addition, the external storage unit 23 supplies data stored in the program to the control unit 21 according to the instruction of the control unit 21, and stores the data supplied from the control unit 21.

The operation unit 24 is composed of an interface device for connecting a pointing device such as a keyboard and a mouse and the like with a keyboard and a pointing device to the internal bus 28. Instructions for starting or ending processing are input through the operation unit 24 and supplied to the control unit 21.

The display unit 25 is composed of a CRT (Cathode Ray Tube) or LCD (Liquid Crystal Display), etc., to capture the X-ray camera 6, the position coordinates of the X-ray camera 6 and the drill 7, and the measured printed wiring board. The mark 60m (refer FIG. 5) of 60, the hole coordinates, etc. are displayed.

The input / output unit 26 is composed of a serial interface or a local area network (LAN) interface. The image signal picked up from the X-ray camera 6 is input through the input / output unit 26. Moreover, the signal which drives the electric motor of the X moving mount 10, the Y moving mount 11, the movable table 12, and the drill moving mount 7a is output. Then, through the input / output unit 26, position information of each mount or table from the linear scale of the X moving mount 10, the Y moving mount 11, the movable table 12, and the drill moving mount 7a (and the speed). Information).

In addition, when the above-mentioned conveying apparatus (not shown) of the workpiece | work is provided, in order to adjust operation | movement and synchronous with the conveying apparatus, the instruction | command of an operation is output to the conveying apparatus via the input / output part 26, and conveyance is carried out. An instruction to complete the operation from the device may be input.

5 is a diagram illustrating a detailed configuration of the jig plate 50. 5A is a plan view of the jig plate 50, (b) is a state in which the printed wiring board 60 is placed on the jig plate 50, and (c) is a sectional view taken along the line A-A of (b).

In the present embodiment, two marks 60m exist at both ends of the printed wiring board 60, and the positions of two holes having a constant interval are distributed around these marks 60m to drill four holes in total. The case will be described by way of example.

As shown in Fig. 5A, the jig plate 50 has two imaging holes 52 at both ends thereof for photographing the mark 60m of the printed wiring board 60 with the X-ray camera 6. In addition, the jig plate 50 has jig holes 53 distributed two by two around each of the two imaging holes 52. The positions at which the two imaging holes 52 and the four jig holes 53 are formed coincide with the positions at which the two marks 60m and the reference holes 60h of the printed wiring board 60 are drilled. . That is, the distance between the centers of the two imaging holes 52 substantially coincides with the distance between the two marks 60m. In addition, the relative arrangement relationship between the imaging hole 52 and the jig hole 53 substantially coincides with the relative arrangement relationship between the position of the mark 60m and the position of the hole where the reference hole 60 is drilled.

As described above, the jig plate 50 is provided with an adsorption portion 51 in the center portion. The plate 51b through which the hole 51a was drilled is inserted in the adsorption | suction part 51 (refer FIG.5 (c)). The work (printed wiring board 60 or the correction substrate 61) placed on the jig plate 50 sucks air from the suction pipe 51c connected to a suction device (not shown), whereby the hole 51a is provided. Air is sucked in and adsorb | sucked from. The printed wiring board 60 is placed so that the mark 60m almost coincides with the center of the imaging hole 52 (see Fig. 5B).

6 is a diagram illustrating the movement of the movable table 12. 6 (a) is a plan view of the movable table 12, (b) is a plan view showing how the movable table 12 rotates, and (c) is an elevation view of the movable table 12. As shown in FIG.

The movable table 12 is supported by the X1 table 12c and the X1 table 12d moving in the X direction. The X1 table 12c moves in the X-axis direction by the ball screw and the ball nut. The X1 table 12d moves freely in the X direction along the X guide 12d2. Since the X1 table 12c and the X1 table 12d are connected by the frame 12g, the X1 table 12d cooperates with the movement of the X1 table 12c.

The Y1 table 12e is provided on the X1 table 12c. The Y2 table 12f is provided on the X1 table 12d. The Y1 table 12e and the Y2 table 12f independently move in the Y-axis direction. The frame 12g is rotatably coupled to the Y1 table 12e, and is also rotatably coupled to the Y2 table 12f.

By simultaneously operating the Y1 table 12e and the Y2 table 12f in the same direction, the frame 12g moves in parallel in the Y-axis direction.

On the other hand, for example, if the Y2 table 12f is moved while the Y1 table 12e is fixed, the X1 table 12d can move freely in the X direction, so that the frame 12g rotates about the Y1 table 12e. do.

For example, as shown in Fig. 6B, when the frame 12g is rotated by θ radians, if the distance between the Y1 table axis and the Y2 table axis of the frame 12g is L, the Y2 table 12f is set to L. Just move Lsinθ. At that time, the X1 table 12d moves by L (1-cosθ). The position and angle of the frame 12g can be measured by observing the two holes 12h and 12i provided in the frame 12g.

Since the movable table 12 does not need to move at a large angle, the rotary motion can be sufficiently realized by the linear operation of the Y1 table 12e or the Y2 table 12f as described above. By substituting the linear motion of the Y2 table 12f or Y1 table 12e for realization of the rotational movement of the movable table 12, high precision and desired angular displacement can be obtained with a simple mechanism.

Next, the operation of the punching device 1 will be described with reference to FIGS. 7 to 10. As described above, the operation of the drilling device 1 is performed by the control unit 21 by the main memory unit 22, the external storage unit 23, the operation unit 24, the input / output unit 26, the X-ray camera 6, and the X. It implements in cooperation with the movable mount 10, the Y movable mount 11, the movable table 12, and the drill movable mount 7a.

In advance, the position of the X moving mount 10 is determined so that the interval between the two X-ray cameras 6 is equal to the interval between the marks 60m of the printed wiring board (hereinafter also referred to as a substrate) 60. In addition, the position of the drill 7 is set with respect to the X-ray camera 6 so that the position of the reference hole 60h with respect to the mark 60m (that is, the position of the drill 7 is set to the drill 7). The relative arrangement relationship with the low X camera 6 is set to match the relative arrangement relationship with the mark 60m and the reference hole 60h). Thereby, when the X-ray camera 6 is located in the center of the imaging hole 52, the drill 7 will be located in the jig hole 53. As shown in FIG.

First, the center of the imaging hole 52 of the jig board 50 is exactly aligned with the imaging center of the X-ray camera 6 (step S1). At this time, only the movable table 12 may be moved, and the X moving mount 10 and the Y moving mount 11 may be moved. However, the relative positional relationship of the X-ray camera 6 and the drill 7 is not changed.

Next, the correction substrate 61 is placed on the jig plate 50, and the drill 7 is placed in a state in which the center of the imaging hole 52 of the jig plate 50 is exactly aligned with the imaging center of the X-ray camera 6. To elevate the hole 61h (step S2). The state at this time is shown in FIG. The hole 61h is drilled in four places where the jig hole 53 of the correction substrate 61 is located in the state where the imaging center of the X-ray camera 6 and the imaging hole 52 coincide.

Drilling the holes 61h into the correction substrate 61 with the drill 7 may be performed by lifting the drill 7 one by one and drilling all one at a time. It is preferable to make the same operation | movement also when the reference hole 60h is drilled in the printed wiring board 60 mentioned later.

The movable table 12 is moved, and the punching position is moved to the imaging center of the X-ray camera 6, and the error between the jig hole 53 and the hole 61h drilled in the correction substrate 61 is measured ( Step S3). FIG. 8B shows a case where the distant perforation position is moved to the imaging center of the X-ray camera 6. FIG. 8C shows a case where the near hole position is moved to the imaging center of the X-ray camera 6. In this embodiment, since the position of the hole 61h is symmetrical, the left and right can be measured simultaneously. When the position of the hole 61h is not symmetrical, it measures by one according to the imaging position of the X-ray camera 6.

9 is a diagram illustrating an example of an error between the jig hole 53 and the hole 61h. In FIG. 9, the center of the hole 61h is shifted by Δx in the X-axis direction and Δy in the Y-axis direction with respect to the center of the jig hole 53. At the same time, the error between the imaging center of the X-ray camera 6 and the center of the jig hole 53 is also measured (in the figure, these errors are indicated by ΔX and ΔY). The error between the X-ray camera imaging center and the jig hole center is a movement error of the movable table 12.

Returning to the flowchart of FIG. 7, the position of the drill 7 (drill bit 7b) is corrected next (step S4). The hole 61h is preferably drilled such that its center coincides with the jig hole center. Therefore, the position of the drill 7 with respect to the X-ray camera 6 is corrected so that the center error of the jig hole center and the hole 61h can be eliminated. For example, as shown in Fig. 9, if the errors are Δx and Δy, the position of the drill 7 is corrected by the amount of -Δx and -Δy.

The errors are corrected for all drills 7 in the same manner as above. That is, if the error correction of all the drills 7 is not completed (step S5; No), step S3 and step S4 are repeated.

When the error correction is completed for all the drills 7 (step S5; Yes), it is determined whether such an error is within an allowable range (step S6), and when the error is not within the allowable range (step S6; No) The correction substrate 61 is placed on the jig plate 50 to correct the drill position (steps S2 to S6 are repeated).

The tolerance of the center of the jig hole 53 and the center of the hole 61h is determined by, for example, the resolution of the X-ray camera 6 and the movement capability of the drill moving mount 7a.

When the error between the center of the jig hole 53 and the center of the hole 61h is within the allowable range (step S6; Yes), the imaging center of the X-ray camera 6 and the puncture position by the drill 7 The relationship will coincide within the range of the relationship between the position of the imaging hole center of the jig plate 50 and the position of the jig hole center and the tolerance.

In this state, the reference hole 60h is drilled into the printed wiring board 60 with the position of the X-ray camera 6 and the drill 7 fixed at this time. That is, the printed wiring board 60 with which the reference hole 60h is perforated is placed on the jig board 50, the movable table 12 is adjusted, and the mark 60m of the printed wiring board 60 is moved by the X-ray camera 6 ) To the imaging center (step S7). At this time, it is also important to keep the X moving mount 10, the Y moving mount 11, and the drill moving mount 7a in a state where the above calibration is completed, basically, in the subsequent steps.

And while maintaining such a state, the drill 7 is raised and lowered and the reference hole 60h is drilled (step S8). At this time, as described above, it is preferable to drill the reference hole 60h by the same operation as drilling the hole 61h in the correction substrate 61 by correcting the drill position.

FIG. 10 shows a step of placing the printed wiring board 60 on the jig plate 50 to align the mark 60m with the imaging center of the X-ray camera 6 to drill the reference hole 60h with the drill 7. FIG. 10A is a state after placing the printed wiring board 60 on the jig plate 50, and shows the state where the imaging center of the X-ray camera 6 is displaced from the mark 60m. FIG. 10B shows the state where the mark 60m of the printed wiring board 60 coincides with the imaging center of the X-ray camera 6 by adjusting the movable table 12. FIG. 10C shows a state in which the reference hole 60h is drilled through the drill 7 in a state where the mark 60m of the printed wiring board 60 coincides with the imaging center of the X-ray camera 6.

To align the mark 60m of the printed wiring board 60 with the imaging center of the X-ray camera 6, the X-Y-Y function of the movable table 12 described in FIG. 6 is used. First, the movable table 12 is moved in parallel in the X-axis and Y-axis directions so that, for example, the left mark 60m is aligned with the imaging center of one X-ray camera 6. Next, the angle formed by the two X-ray cameras 6 and the mark 60m on the right side is measured by image measurement, and the Y2 table 12f in FIG. 6 is adjusted so that the angle error is eliminated. At this time, the mark 60m does not necessarily correspond to the point of the frame 12g of the movable table 12. Therefore, by moving the Y2 table 12f, the left mark 60m may be shifted from the imaging center of the X-ray camera 6. Therefore, the amount of such deviation is calculated in advance to adjust the X1 table 12c and the Y1 table 12e. That is, the movable table 12 is controlled so that the rotation center of the movable table 12 becomes the center of the mark 60m which is already coincident with the imaging center of the X-ray camera 6.

Returning to the flow chart of FIG. 7, after the reference hole 60h is drilled through the printed wiring board 60, it is determined whether there are other printed wiring boards 60 to which the reference hole 60h is to be drilled (step S9). ). If there is a printed wiring board 60 through which the reference hole 60h is to be drilled (step S9; Yes), the flow returns to step S7 to drill the reference hole 60h of the printed wiring board 60. When the printed wiring board 60 which needs to be drilled out disappears (step S9; No), operation | movement is complete | finished.

By such a process, unless the conditions of the drilling device 1, for example, the conditions, such as the abrasion and temperature of the drill bit 7b, do not change, the position of the drill 7 is correct | amended once by several With respect to the lot of printed wiring board 60, the reference hole 60h can be drilled correctly.

Since the drilling apparatus 1 of this invention is feedback-controlled according to the jig plate 50, the drilling precision of the drilling apparatus 1 of this invention is proportional to the precision of the jig plate 50. FIG. When the precision of the imaging hole 52 and the jig hole 53 of the jig board 50 is raised, the precision of the reference hole 60h of the printed wiring board 60 will increase by that much.

According to the drilling method of the present invention, when correcting the drill position, the position of the drill 7 is actually moved and adjusted to drill at a predetermined position, and when the adjustment is completed, the drill 7 remains the position. It no longer moves from that position. Therefore, the position of the reference hole 60h does not shift by the error at the time of moving the drill 7.

In the punching device of the present invention, the jig hole 53 is provided on the movable table 12 on which the printed wiring board 60 is placed. By feeding back the movement result on the basis of the jig hole 53, it becomes possible to perform positioning while verifying that the movement to the correct position is performed. By this method, the error in the case where the punching position of the printed wiring board 60 is moved to a drill position can be eliminated.

In addition, the configuration of the hardware and the flow chart (flow chart) described above are just examples, and can be arbitrarily changed and modified. In the above-mentioned embodiment, although the mark of the printed wiring board is two at both ends, the case where two reference holes are drilled at the same interval with respect to each mark was demonstrated, but this invention is not limited to this. For example, the positions of the marks may not be symmetrical, and the reference holes may not be equally spaced. The reference holes for the marks may not be two but may be one or three or more.

This application is based on Japanese Patent Application No. 2006-20783 for which it applied on January 30, 2006. In this specification, the specification of Japanese Patent Application No. 2006-20783, the scope of a patent claim, and the whole drawing shall be included in this application as a reference.

Industrial Applicability The present invention provides efficient manufacturing processes in the semiconductor manufacturing industry or the electronics manufacturing industry for pattern formation on substrates based on a constant reference point, or lamination (multilayering) of printed circuit boards, high quality of manufactured products, and high reliability. Contribute.

Claims (14)

A printed wiring board on which the holes are perforated is placed and moved in a horizontal direction; Drilling means for drilling a hole in the printed wiring board, comprising a drill, lifting means for moving the drill in a vertical direction, and fixing means for fixing the printed wiring board; At least two imaging means for measuring a puncturing position or a reference point position of the printed wiring board; Moving means for simultaneously moving both in the horizontal direction while maintaining a distance between the imaging means and the puncturing means; And A drill moving means for moving the drill in a horizontal direction with respect to the imaging means on the moving means; In the drilling method in the drilling device provided with, The drilling device, A jig plate having an imaging hole for imaging a reference mark of a printed wiring board with the imaging means and a jig hole for drilling the hole with the drilling means at a predetermined drilling position of the printed wiring board, The distance between the centers of the two imaging holes is equal to the distance of two predetermined reference marks of the printed wiring board, and the relationship of the center position of the jig hole with respect to the center positions of the two imaging holes is the printed wiring board. The two imaging holes and the jig hole are formed in the jig plate so as to be equal to the relationship between the two predetermined reference marks and the predetermined punching position of The drilling method, An imaging means position determining process for setting positions of imaging centers of the two imaging means so as to be equal to the relationship between two predetermined reference marks of the printed wiring board; A drill position deciding step of setting the positions of the puncturing means with respect to the two imaging means so as to be equal to the relation of the predetermined puncturing positions with respect to the two predetermined reference marks of the printed wiring board; An imaging position adjusting step of adjusting the moving means and the table so that the centers of the two imaging holes and the imaging centers of the two imaging means coincide with the jig plate placed on the table; After drilling a hole in the substrate for correcting the puncturing position on the jig plate by using the punching means, the table is operated to move the position of the hole drilled by the punching means to the imaging center, and thus the jig hole center and the An error measuring step of measuring a position of the center of the hole drilled in the hole position correction substrate and measuring an error of the center of the hole position relative to the center of the jig hole; A drill positioning step of setting the position of the drill relative to the imaging means by operating the drill moving means to correct an error of the puncture position center with respect to the jig hole center measured by the error measuring process; A substrate for operating the table with respect to the printed wiring board to be punched on which at least two predetermined reference marks placed on the table are recorded so as to match the two predetermined reference marks to the positions of the imaging centers of the two imaging means, respectively. Positioning process; And A punching step of punching a hole at a predetermined position of the printed wiring board by the punching means with respect to the printed wiring board to be punched on which at least two predetermined reference marks placed on the table are recorded. Drilling method characterized in that it comprises a. A printed wiring board on which the holes are perforated is placed and moved in a horizontal direction; Drilling means comprising a drill, lifting means for moving the drill in an up and down direction, and fixing means for fixing the printed wiring board, for drilling a hole in the printed wiring board; At least two imaging means for measuring a puncturing position or a reference point position of the printed wiring board; Moving means for simultaneously moving both in the horizontal direction while maintaining a distance between the imaging means and the puncturing means; And A drill moving means for moving the drill in a horizontal direction with respect to the imaging means on the moving means; In the drilling device provided with, A jig board having an imaging hole for imaging a reference mark of a printed wiring board with the imaging means and a jig hole for drilling a hole in a predetermined drilling position of the printed wiring board, wherein the distance between the centers of the two imaging holes is different from each other. The relationship of the position of the center of the jig hole with respect to the position of the center of the two imaging holes is equal to the distance of the two predetermined reference marks of the printed wiring board, and the two predetermined reference marks of the printed wiring board are predetermined. A jig plate on which the two imaging holes and the jig hole are formed so as to be equal to the relationship between the puncturing positions of the two holes; Imaging means position-determining means for setting positions of imaging centers of said two imaging means so as to be equal to the relationship between two predetermined reference marks of said printed wiring board; Drill position provision means for setting a position of said puncturing means with respect to said two imaging means so as to be equal to a relationship of a predetermined puncturing position with respect to two predetermined reference marks of said printed wiring board; Imaging position adjusting means for adjusting the moving means and the table so that the centers of the two imaging holes and the imaging position centers of the two imaging means coincide with the jig plate placed on the table; After drilling a hole in the substrate for correcting the puncturing position on the jig plate by using the punching means, the table is operated to move the position of the hole drilled by the punching means to the imaging center, and thus the jig hole center and the Error measuring means for measuring a position of a hole center punctured on the puncturing position correction substrate and measuring an error of the center of the puncturing position with respect to the jig hole center; Drill positioning means for operating the drill moving means to set the position of the drill with respect to the imaging means so as to correct an error in the center of the drilling position relative to the jig hole center measured by the error measuring means; A substrate for operating the table with respect to the printed wiring board to be punched on which at least two predetermined reference marks placed on the table are recorded so as to match the two predetermined reference marks to the positions of the imaging centers of the two imaging means, respectively. Positioning means; And Perforation means which drills a hole in the predetermined position of the said printed wiring board with the said perforation means with respect to the printed wiring board of the perforation object in which the at least 2 predetermined reference mark set in the said table was recorded. Perforation apparatus comprising a. The method of claim 2, The substrate positioning means, It includes a substrate moving means for moving the printed wiring board in the longitudinal direction and the width direction, The substrate moving means also, And a width direction moving means for moving the printed wiring board in the width direction. The method of claim 3, The said width direction movement means can rotate the said printed wiring board about the other end by linearly moving the one end of the said printed wiring board, The puncturing apparatus characterized by the above-mentioned. The method of claim 3, The width direction moving means includes two small table means for moving one end and the other end of the printed wiring board independently of each other, The width direction moving means, The printed wiring board can be rotated about the other side of the small table means by linearly moving one end or the other end of the printed wiring board by driving one of the two small table means, and stopping the other. Drilling device. The method of claim 2, And the printed wiring board comprises a double-sided printed circuit board on which a pattern constituting a predetermined electric circuit is formed. The method of claim 2, And the printed wiring board includes a multilayer printed circuit board comprising a plurality of stacked double-sided printed circuit boards having a pattern constituting a predetermined electric circuit. The method of claim 7, wherein And a front surface and a back surface of the multilayer printed circuit board are covered with a conductor layer. The method of claim 2, And the imaging means includes an X-ray camera. The method of claim 9, The imaging means further includes an X-ray generator, And the moving means moves both the X-ray camera and the X-ray generator. The method of claim 9, And the imaging means further comprises an X-ray protection means. The method of claim 2, And a conveying means for supplying the printed wiring board to the table and carrying it out of the table. The method of claim 2, The number of holes punched by the error measuring means with respect to the substrate for puncturing position correction and the number of holes drilled by the punching means with respect to the printed wiring board are both two or more and the same number. The perforation of the perforation position correcting substrate by the error measuring means is performed on the two or more holes simultaneously or sequentially in a predetermined order, And the perforation of the printed wiring board by the perforation means is performed in the same order as the perforation of the substrate for puncturing the perforation position, or sequentially for the two or more holes in a predetermined order. The method of claim 2, And said moving means comprises a ball screw.

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