JP3783260B2 - Through-hole drilling machine for multilayer printed wiring boards - Google Patents

Description

[0001]
【Technical field】
The present invention relates to a through-hole drilling machine that simultaneously drills through-holes in a plurality of multilayer printed wiring boards.
[0002]
[Prior art]
Multilayer printed wiring boards are laminated after forming an inner layer pattern, and an outer layer pattern is formed after through holes are drilled.
As shown in FIG. 6, a through-hole drilling machine that simultaneously drills through-holes of a plurality of multilayer printed wiring boards includes a plurality of sub-tables 91 for mounting the multilayer printed wiring boards 81 to be drilled one by one, and a plurality of sub-tables 91 A main table 92 for attaching the sub-table 91 to the upper surface, and a tool table 93 for attaching a plurality of drills 94 corresponding to each sub-table 91 and moving in both vertical and horizontal directions.
[0003]
The tool table 93 moves in the lateral (X) direction using a drive motor 931 and a ball screw 932, while the main table 92 is longitudinal (Y) using a drive motor 921 and a ball screw 922 as shown in FIG. Move in the direction. Then, after the tool table 93 and the main table 92 are moved to predetermined positions, the spindle 941 of the drill 94 is lowered, and a through hole is formed in the substrate 81. In FIG. 6, reference numerals 942 and 943 denote a drive motor and a ball screw for lowering the spindle 941, and reference numeral 95 denotes a base on which the main table 92 and the tool base 93 are installed.
[0004]
In the multilayer printed wiring board 81, a reference hole 811 (FIG. 6) is formed in advance during the manufacturing process, and by fitting the reference hole 811 to the pin 911 of the sub-table 91, The coordinates of the drill 94 and the coordinates of the pattern of the multilayer printed wiring board 81 are aligned. The reference hole 811 uses a pin hole formed in the substrate 81 as it is when the substrates are laminated by the pin lamination method, and the reference pattern provided in the inner layer pattern is seen through with X-rays, and a hole is separately formed. There are drilled ones.
[0005]
That is, when the multilayer printed wiring board 81 is multi-layered by the pin lamination method, the same pin hole is made in each of the outer layer substrate and the inner layer substrate, and the pin hole of each substrate is inserted into the reference pin. The pin hole is also used as a reference hole 811 for drilling a through hole. In the latter method, a reference pattern for positioning is provided in advance in the inner layer pattern, this reference pattern is detected by fluoroscopy with the X-ray, the position of the detected reference pattern is used as reference coordinates, and the reference hole 811 is formed. It is drilled separately. In the latter case, the reference pattern may be found by sitting through the detection hole on the substrate instead of seeing through with X-rays.
[0006]
[Problems to be solved]
However, the conventional drilling method using the above-described drilling machine is not sufficient in drilling accuracy because more precise drilling is required especially with the miniaturization of multilayer printed wiring boards.
In other words, an error occurs in the drilling position due to the following factors, and the required accuracy cannot always be obtained.
[0007]
In the first method using the pin hole formed at the time of pin lamination as the reference hole, thermal contraction occurs in the substrate during thermocompression bonding, thereby causing variations in the pitch between the pin holes and displacement. For this reason, when this pin hole is set on a pin of a drilling machine, the position of the multilayer printed wiring board varies, and the accuracy of alignment of the inner layer pattern and the through hole is deteriorated.
[0008]
The second method of drilling the reference hole in the substrate using the reference pattern is very accurate in the positional relationship between the inner layer pattern on the substrate side and the reference hole, but the sub-table on the drilling machine side. There is an error between this pin and the spindle of the drill, and this error varies from subtable to subtable. Therefore, the error of the through hole position due to this cannot be avoided. For example, even if the relationship between the pin and the spindle in a certain sub-table is appropriate, it is impossible to avoid a variation in accuracy such that the positions of the other sub-tables are misaligned.
[0009]
It should be noted that the latter error due to the positional deviation between the pin of the sub table and the spindle of the drill is also caused in the same manner by being weighted in the first method.
The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a multilayer printed wiring board through-hole drilling machine that can drill holes with high accuracy.
[0010]
[Means for solving problems]
The present invention is a through-hole drilling machine that simultaneously drills through-holes of a plurality of multilayer printed wiring boards,
In the inner layer pattern of the multilayer printed wiring board, a plurality of reference patterns indicating a plurality of positions serving as a reference for the inner layer pattern are formed in advance.
A plurality of sub-tables provided in the above-mentioned through-hole drilling machine, to which the multilayer printed wiring boards to be drilled are attached one by one;
A main table for mounting a plurality of the sub-tables on the top surface;
A drill corresponding to each of the sub-tables is attached, a tool table facing the main table,
An X-ray light source and an X-ray sensor provided for each sub-table;
A detection device for detecting the position of the reference pattern in which the positional relationship between the spindle coordinates of the corresponding drill and the coordinates of the X-ray sensor is defined in advance;
The detection signal of the reference pattern detection device is received, and the detected coordinate positions of a plurality of reference patterns belonging to a single multilayer printed wiring board are all matched with the predetermined reference coordinate position or averaged at the predetermined reference coordinate position. Control means for controlling the position of the sub-table on the main table so as to approach
A driving means located between the tool table and the main table and relatively moving both in the vertical and horizontal directions;
Position adjusting means provided on the sub-table for adjusting the mounting position on the main table;
An X-ray transmission hole provided in the sub-table and the main table and forming an optical path from the X-ray light source to the X-ray sensor;
And a through-hole drilling machine for multilayer printed wiring boards.
[0011]
The first point that should be particularly noted in the present invention is that the inner layer pattern is formed with a plurality of reference patterns indicating the reference position of the inner layer pattern in advance, and a detecting device for detecting the position of the inner layer pattern. Is provided for each sub-table, and the positional relationship between the spindle coordinates of the drill and the coordinates of the X-ray sensor is defined in advance.
[0012]
In the above description, the positional relationship between the coordinates of the spindle and the coordinates of the X-ray sensor is specified in advance. The relationship between the coordinates of the X-ray sensor and the coordinates of the spindle is accurately suppressed. By detecting the position of the reference pattern, the positional relationship between the reference pattern and the spindle can be accurately grasped. Therefore, for example, an X-ray sensor is attached to the tool table so that the relationship between the coordinates of the spindle of the tool table and the coordinates of the X-ray sensor can be accurately grasped.
[0013]
And since the said detection apparatus uses X-ray | X_line, the reference pattern which exists in an inner layer pattern can be correctly grasped | ascertained by X-ray fluoroscopy without damaging a board | substrate. In order to detect the reference pattern by the X-ray sensor, the sub table and the main table are appropriately provided with X-ray transmission holes for forming an optical path from the X-ray light source to the X-ray sensor. . The conditions of the light beam used for the sensor are not particularly limited as long as they have a large difference between the transmittance of the substrate material and the transmittance of the pattern material and do not damage the substrate. Not necessarily.
In addition, since the detection device is provided for each sub-table, it is possible to detect the positional deviation of each reference pattern separately for all the substrates attached to the sub-table.
[0014]
The second point to be particularly noted in the present invention is that a position adjusting means for adjusting the mounting position on the main table is provided for the sub-table, and the control means is a single unit detected by the detecting means. Adjusting the positions of the sub-tables on the main table so that the coordinate positions of a plurality of reference patterns belonging to the multilayer printed wiring board coincide with the predetermined reference coordinate positions or approach the predetermined reference coordinate positions on average. It is.
[0015]
As a result, the positional relationship between the reference pattern of all the multilayer printed wiring boards and the corresponding spindle of the drill can be adjusted with high accuracy. It is ideal that the coordinate positions of the reference pattern completely coincide with the predetermined reference coordinate positions. However, there is a positional deviation between the reference patterns as shown in FIG. Therefore, each reference pattern is brought close to the reference coordinate position on average so that the positional deviation between the reference patterns is not shifted.
[0016]
As described above, according to the drilling machine according to the present invention, the positional relationship between the reference pattern (substrate) and the drill is directly and individually adjusted. There is no problem even if the pin hole position accuracy is low.
[0017]
According to the second aspect of the present invention, the control means drills a through hole for inspection in the printed wiring board periodically or based on a command from the outside, and the actual drilling position, command value, It is preferable that the amount of deviation (ΔX, ΔY) is detected and the reference coordinate position of the reference pattern of the sub-table corresponding to the drill is corrected by an amount (−ΔX, −ΔY) obtained by inverting the sign of the amount of deviation. .
In the invention according to claim 1, when a deviation ΔD occurs with respect to the shaft center of the spindle due to, for example, bending or deformation of the cutting edge of the drill as shown in FIG. A deviation of ΔD will occur at the drilling position.
[0018]
However, according to the second aspect, the deviation of the drill blade tip from the reference position can be corrected. That is, as described above, drilling is instructed to the drill, the hole is actually drilled, and the position of the hole is detected by the detection device. The deviation (ΔX, ΔY) of this hole indicates the deviation from the spindle axis of the drill. Therefore, the positional deviation of the cutting edge is corrected by moving the substrate in the opposite direction by this deviation (ΔX, ΔY). I can do it.
In addition, in order to detect the said hole position for an inspection clearly with an X-ray detector, it is preferable to open the said hole for an inspection in the position with the pattern of an inner layer pattern.
[0019]
Note that a plurality of detection devices may be provided corresponding to the number of a plurality of reference patterns belonging to the multilayer printed wiring board. However, as described in claim 3, the sensing positions of the detection devices are made variable to be the same. It is preferable that the position of the plurality of reference patterns belonging to the multilayer printed wiring board is detected by a single detection device. This is because the configuration of the apparatus becomes simple and can be made inexpensive.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIGS. 1 and 2, this example is a through-hole drilling machine 1 that simultaneously drills through-holes of a plurality of multilayer printed wiring boards 83. In FIG. 3, a plurality of reference patterns 84 (FIG. 3) indicating positions serving as references for the inner layer pattern are formed in advance.
[0021]
The through-hole drilling machine 1 corresponds to a plurality of sub-tables 15 to which the multilayer printed wiring boards 83 to be drilled one by one, a main table 11 to which the plurality of sub-tables 15 are mounted on the upper surface, and each sub-table 15. A detection device 30 that includes a tool table 20 to which a drill 21 is attached and is opposed to the main table 11, an X-ray light source 31 and an X-ray sensor (camera) 32, and detects the position of the reference pattern 84. And a control means (not shown) for receiving a detection signal of the reference pattern detection device 30 and a positional relationship between the coordinates of the spindle 211 of the corresponding drill 21 and the coordinates of the X-ray sensor 32. And have.
[0022]
Driving means (first driving means 12 and second driving means 22 to be described later) capable of relative movement in both the vertical and horizontal directions is provided between the tool table 20 and the main table 11, and the sub table. 15, position adjusting means 161 to 164 (FIG. 2) for adjusting the mounting position on the main table 11 are provided.
Further, in the sub table 15 and the main table 11, as shown in FIG. 3, transmission holes 151 and 111 are provided in the X-ray optical path located below the reference pattern 84.
[0023]
Then, the control means averages the coordinate positions of the plurality of reference patterns 84 belonging to the single multilayer printed wiring board 83 detected by the detection means 30 so as to all coincide with the predetermined reference coordinate positions. The position adjusting means 161 to 164 are operated so that the position of the sub table 15 on the main table 11 is adjusted.
[0024]
Further, the control means can designate the coordinate position of drilling and cause the drill 31 to drill the substrate 83. Then, a through hole for inspection is drilled in the printed wiring board for inspection periodically or based on a command from the outside, and the deviation (ΔX, ΔY) between the actual drilling position and the command position is calculated. The position adjustment means 161-164 are detected by the detecting device 30 and the reference coordinate position of the reference pattern 84 of the sub-table 15 corresponding to the drill 21 is the amount (−ΔX, −ΔY) obtained by reversing the sign of the deviation amount. To correct (ΔX, ΔY indicate the displacement of the horizontal or vertical coordinates perpendicular to each other).
[0025]
The detection device 30 can change the position of sensing by changing the positions of the X-ray light source 31 and the X-ray sensor 32, and the positions of the plurality of reference patterns 84 belonging to the same multilayer printed wiring board 83. Can be detected by a single unit.
The following is a supplementary explanation for each.
[0026]
As shown in FIG. 3, a reference pattern 84 of the same size is formed at the same designated position on the inner layer of the multilayer printed wiring board 83, and due to manufacturing errors or the like, the reference pattern 84 is slightly positioned as shown in FIG. There may be misalignment, but they are in approximately the same position.
The sub-table 15 to which the multilayer printed wiring board 83 is attached is provided with four position adjusting means 161 to 164 composed of a motor and a ball screw, and the sub-table 15 is moved or rotated in parallel by changing the driving amount of each. You can exercise. In FIG. 3, reference numeral 17 denotes a pin that is inserted and fixed through a pin hole of the multilayer printed wiring board 83, and reference numeral 18 denotes a clamp member that firmly holds the multilayer printed wiring board 83 so that the multilayer printed wiring board 83 does not move.
[0027]
As shown in FIG. 2, the main table 11 is provided with first driving means 12 including a motor 121 and a ball screw 122, and translates the main table 11 in the longitudinal (Y) direction. On the other hand, as shown in FIG. 1, the tool table 20 is provided with second drive means 22 including a motor 221 and a ball screw 222, which translates the tool table 20 in the lateral (X) direction.
[0028]
Then, by operating the first and second driving means 12 and 22, the position of the drill 21 can be moved to a position where a through hole is formed. Then, the spindle motor 212 shown in FIG. 1 is driven to lower the drill 31 so that a through hole is formed in the substrate 83.
[0029]
In addition, a slide table 33 to which an X-ray light source 31 is attached is mounted on the base 10 to which the main table 11 and the tool table 20 are attached. The slide table 33 is a third drive means 34 including a motor 341 and a ball screw 342. And can move in the lateral direction. Similarly, the X-ray sensor (camera) 32 can move laterally together with the tool table 20 via the second driving means 22. Further, since the main table 11 can be moved in the vertical direction by the first driving means 12, the first to third driving means 12, 22, and 34 are driven to set the X-ray light source 31 and the X-ray sensor 32 as a reference. It can move freely to the position of the pattern 84 (transmission holes 151, 111).
[0030]
Then, the reference pattern 84 formed in the inner layer pattern is detected. Subsequently, the control unit controls the position of the sub-table 15 by operating the position adjusting units 161 to 164 so that the center position of the reference pattern 84 matches a predetermined coordinate position. For example, as shown in FIG. 4, the sub-table 15 is moved so that the gravity center positions G1 and G2 of the three reference patterns 84 at the two locations approach the predetermined positions O1 and O2 in a well-balanced manner (parallel movement arrow P and rotation). Motion arrow R).
Since the alignment of the reference pattern 84 is performed separately for the substrates 83 of the sub-tables 15, the positional accuracy of the through holes becomes uniform.
[0031]
As described above, according to the drilling machine 1 of the present example, the positional relationship between the reference pattern 84 (substrate 83) and the drill 21 is adjusted directly and individually with high accuracy. Therefore, there is no problem even if the positional accuracy of the pin 17 of the sub-table 15 for mounting the substrate 83 and the pin hole of the substrate 83 is low.
Further, the control means periodically drills through holes for inspection in the printed wiring board 83, detects the amount of deviation (ΔX, ΔY) between the actual drilling position and the command position, and based on that, Since the correction is performed, it is possible to cope with a change in the characteristics of the drill 31, for example, the bending ΔD of the cutting edge 210 shown in FIG.
[0032]
【The invention's effect】
As described above, according to the present invention, it is possible to obtain a through-hole drilling machine for multilayer printed wiring boards capable of drilling with high accuracy.
[Brief description of the drawings]
FIG. 1 is a front view of a through-hole drilling machine according to a first embodiment.
FIG. 2 is a plan view taken along the line AA in FIG.
FIG. 3 is a partially enlarged view of a main part of FIG.
4 is a schematic plan view of a reference pattern of a multilayer printed wiring board as seen through X-rays from above. FIG.
FIG. 5 is a schematic diagram showing a modified example of the cutting edge of a drill.
FIG. 6 is a front view of a conventional through-hole drilling machine.
7 is a plan view taken along line BB in FIG. 6;
[Explanation of symbols]
11. . . Main table,
111,151. . . Through holes,
15. . . Sub-table,
161, 162, 163, 164. . . Position adjusting means,
20. . . Tool table,
30. . . Reference pattern detector,
31. . . X-ray light source,
32. . . X-ray sensor,
83. . . Multilayer printed wiring board,

Claims (3)

A through-hole drilling machine that drills through holes in multiple multilayer printed wiring boards simultaneously.
In the inner layer pattern of the multilayer printed wiring board, a plurality of reference patterns indicating a plurality of positions serving as a reference for the inner layer pattern are formed in advance.
A plurality of sub-tables provided in the above-mentioned through-hole drilling machine, to which the multilayer printed wiring boards to be drilled are attached one by one;
A main table for mounting a plurality of the sub-tables on the top surface;
A drill corresponding to each of the sub-tables is attached, a tool table facing the main table,
An X-ray light source and an X-ray sensor provided for each sub-table;
A detection device for detecting the position of the reference pattern in which the positional relationship between the spindle coordinates of the corresponding drill and the coordinates of the X-ray sensor is defined in advance;
The detection signal of the reference pattern detection device is received, and the detected coordinate positions of a plurality of reference patterns belonging to a single multilayer printed wiring board are all matched with the predetermined reference coordinate position or averaged at the predetermined reference coordinate position. Control means for controlling the position of the sub-table on the main table so as to approach
A driving means located between the tool table and the main table and relatively moving both in the vertical and horizontal directions;
Position adjusting means provided on the sub-table for adjusting the mounting position on the main table;
An X-ray transmission hole provided in the sub-table and the main table and forming an optical path from the X-ray light source to the X-ray sensor;
And a through-hole drilling machine for multilayer printed wiring boards.   The control means can specify the coordinate position of the drilling and cause the drill to drill the board. The control means can be used for inspection periodically or based on an external command. A through-hole is drilled in the printed wiring board, and the deviation amount (ΔX, ΔY) between the actual drilling position and the command value is detected via the detection device, and the reference pattern of the sub-table corresponding to the drill 2. The through-hole drilling machine for a multilayer printed wiring board according to claim 1, wherein the reference coordinate position is corrected by an amount (−ΔX, −ΔY) obtained by reversing the sign of the shift amount.   3. The through-hole of a multilayer printed wiring board according to claim 1 or 2, wherein the detecting device detects a position of a plurality of reference patterns belonging to the same multilayer printed wiring board by changing a sensing position. Hole drilling machine.

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