KR100651789B1 - Chip mounter and method for mounting chips - Google Patents

Abstract

According to the present invention, there is provided a component feeder for supplying a component by holding a plurality of components, a conveyor for transferring a printed circuit board, and an adsorption nozzle for adsorbing the component from the component feeder and mounting the component to the printed circuit board on the conveyor. And a head unit movably installed, an image sensor movably installed and capable of sensing an image of a component adsorbed to the adsorption nozzle, and when the image sensor senses a component adsorbed to the adsorption nozzle, There is provided a component mounting apparatus having one or more reference portions provided on one side of the head unit so that image sensing is sensed without being disturbed by the component.

Description

Component mounter and component mounting method {Chip mounter and method for mounting chips}

1 is a schematic configuration diagram of a conventional component mounting apparatus.

2 schematically shows the movement path of the head unit shown in FIG. 1.

3 shows an image obtained by recognizing a state in which a part is adsorbed by the suction nozzle through an image recognition device.

4A is a configuration diagram schematically showing a component mounting apparatus according to the present invention.

4B is a perspective view schematically showing a part of the component mounting apparatus shown in FIG. 4A.

Figure 5 schematically shows a first embodiment of a component mounting method according to the present invention.

6 is a flowchart for explaining a first embodiment of the component mounting method of FIG.

7 schematically shows a second embodiment of the component mounting method according to the present invention.                 

8 is a flowchart for explaining a second embodiment of the component mounting method of FIG.

9 and 10 show a state of recognizing an error in adsorbing components on the monitor of the apparatus according to the present invention.

11 is a flowchart showing a method for calibrating an error in component adsorption according to the present invention.

12 is a plan view of a component mounting apparatus of the double gantry type to which the present invention is applied.

The present invention relates to a component mounting apparatus and a component mounting method, and more particularly, a component mounting apparatus and a component mounting method capable of shortening the time and path required for component mounting and accurate position recognition of the component. It is about.

Typically, a component mounting apparatus is used to mount electronic components such as semiconductor packages on a printed circuit board. The component mounting apparatus vacuum-adsorbs an electronic component supplied through a component supply unit such as a tray feeder or a tape feeder and mounts the same at a predetermined position on a printed circuit board. At this time, the head unit takes the parts to the image sensor in order to obtain information about the attitude of the parts in the adsorption nozzle that has absorbed the electronic parts. The image sensor is, for example, a vision camera (line CCD, area CD, etc.), and the image sensor senses the state in which the component is adsorbed on the component adsorption unit, thereby adjusting the posture of the component. Information can be obtained. The component adsorption unit corrects the attitude of the absorbed component according to the image information, and then mounts the component on the printed circuit board.

1 shows a schematic configuration diagram of a conventional component mounting apparatus.

Referring to the drawings, the component mounting apparatus may move along the first Y axis 12 and the second Y axis 13 and the first and second Y axes 12 and 13 disposed in parallel with each other. The X-axis 11 provided and the head unit 14 provided so that the movement along the X-axis 11 is provided. The head unit 14 is provided with an adsorption nozzle 15 provided to be rotatable and liftable. The printed circuit board 25 is transferred to the component mounting position by the conveyor 19. The head unit 14 reciprocates between the component feeders 18a, 18b, 18c, 18d, 18e and the printed circuit board 25, and the suction nozzle 15 is lifted, The components are adsorbed through the rotating action and mounted on the printed circuit board 25. One or more component feeders 18a, 18b, 18c, 18d, 18e may be, for example, tape feeders or trays. During the mounting process, the head unit 14 moves through the top of the image sensor 16. The image sensor 16 remains fixed on one side of the component mounting apparatus, and senses the components adsorbed by the adsorption nozzle 15 to allow data to be calibrated to position errors generated when the components are adsorbed onto the adsorption nozzle 15. To provide. The image sensor 16 is, for example, those having an image pickup device such as a vision camera line CD, an area CD, or the like.

2 schematically shows the movement path of the head unit shown in FIG. 1.

Referring to the drawings, the suction nozzle provided in the head unit first sucks the parts from the part feeders 18a, 18b, 18c, 18d, and 18e, and then moves to the upper portion of the image sensor 16. The image sensor 16 senses the components adsorbed by the adsorption nozzle. Through the imaging operation, it is possible to recognize an error generated when the part is adsorbed to the adsorption nozzle. The head unit then moves to the upper portion of the mounting position P on the printed circuit board 25. The suction nozzle of the head unit is lowered to mount the component at the mounting position P of the printed circuit board 25. In this case, in order to calibrate the error recognized through the sensing operation, the head unit is displaced in the rectangular coordinate system or the suction nozzle is rotated, and then the component is mounted.

In the component mounting apparatus having the above configuration, the head unit 14 is always mounted on the printed circuit board 25 via the image sensor 16 from the component feed feeders 18a, 18b, 18c, 18d, and 18e. 25), there is a problem that the movement path is long and complicated. That is, since the image sensor 16 is fixed at one specific point, the head unit 14 has a problem that the head unit 14 must always move directly above the image sensor 16 in order to sense the suction state of the component.

3 illustrates a state in which a part is adsorbed by the adsorption nozzle through the image recognition device.                         

Referring to the drawing, the center of the suction nozzle 14 coincides with the center point A of the image 121 of the recognized portion. That is, when the suction nozzle 14 sucks the component 111 and moves to the upper portion of the image sensor 16, the center of the suction nozzle 14 and the center of the image sensor 16 are designed to coincide. . Therefore, when the sensing operation is performed by the image sensor 16, the center point A of the image 121 and the center of the suction nozzle 14 substantially coincide with each other. This is because the image recognition device is usually fixed to one side of the component supply part of the component mounter and positions the head unit along a predetermined path, that is, the nozzle and the center of the image coincide with each other.

When the adsorption nozzle recognizes the part and then performs image sensing, the position information of the center point O of the part is first recognized with the size and shape information of the part. Subsequently, the distortion information of the part is recognized through the shape information of the part. As shown in FIG. 3, the distance between the center point A of the image 121 and the center point O of the component 111 in the X direction and the Y direction, and the rotation angle θ are recognized. To calibrate such separation distance and rotation angle.

However, there is a problem that the image sensor 16 should always be kept in a fixed state in order to calibrate the error during the adsorption of components as described above. This is because the center point A of the sensed adsorption nozzle 14 and the center point A of the monitor 121 must coincide with each other in order to recognize an error during component adsorption. Therefore, if the center point of the suction nozzle 14 and the center point of the monitor 121 do not coincide with each other during the sensing operation, calibration becomes impossible. This is done under the assumption that the positional information about the nozzle is obtained indirectly and satisfies the above conditions. It is also achieved that at least one of the image sensor or the head unit is fixed.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a component mounting method and a device in which the component mounting operation can be made quickly.

Another object of the present invention is to provide a component mounting apparatus and a method thereof capable of accurately calibrating an error in component adsorption.

In order to achieve the above object, according to the present invention, a component feeder for holding a plurality of components to supply components, a conveyor for transferring a printed circuit board, and a component feeder for absorbing components from the component feeder to print the printed circuit board on the conveyor. A head unit installed to be movable, an image sensor capable of sensing an image of a component adsorbed to the adsorption nozzle, and the image sensor adsorbed to the adsorption nozzle; When sensing a component, there is provided a component mounting apparatus having one or more reference portions provided on one side of the head unit so that the sensing of the image is not disturbed by the component.

According to one aspect of the invention, the image sensor is a rotary motor for providing a driving force, a ball screw rotated by the servo motor, and installed on one side of the image sensor and the bushing and linear guide member coupled to the ball screw It is movable by.

According to another feature of the present invention, the head unit is provided to be movable along an X axis which is installed to be movable along a first Y axis and a second Y axis which are provided in parallel with each other.

According to another feature of the invention, the head unit is provided with two to be movable along each X axis on a pair of X axes installed to be movable along the second Y axis and the first Y axis installed in parallel to each other, the image sensor is Two are provided close to both sides of the conveyor.

Further, according to the present invention, when performing the sensing of the suction nozzle of the head unit in which the component is adsorbed by the image sensor to obtain the center of the suction nozzle by sensing the position of the reference portion that is not covered by the component, the image of the Obtaining a center position of the component in the sensed image through sensing; obtaining a calibration value of the component by obtaining an offset of the component from a displacement between the center of the adsorbed component and the center of the suction nozzle; and the calibration value According to the present invention, there is provided a component mounting method comprising controlling the component mounting position of the suction nozzle.

Hereinafter, with reference to an embodiment shown in the accompanying drawings the present invention will be described in more detail.

4A is a configuration diagram schematically illustrating an apparatus for implementing a component mounting method according to the present invention. The same reference numerals as those shown in FIG. 1 among the reference numerals shown in FIG. 4A denote the same components.

Referring to the drawings, the component mounting apparatus is provided with a first Y axis 12 and a second Y axis 13 arranged in parallel with each other, and the X axis provided to be movable along the first and second Y axis 12, 13 (11), a head unit (14) provided to move along the X axis (11), a suction nozzle (15) mounted on the head unit (14) and capable of rotation and lifting, and a printed circuit board (25). ) Is provided with a conveyor (19) for conveying to the component mounting position. The head unit 14 reciprocates between the component feeders 18a, 18b, 18c, and 18d and the printed circuit board 25, and the suction nozzle 15 lifts and rotates. The component is sucked through and mounted on the printed circuit board 25.

According to one feature of the invention, the image sensor 46 for picking up the components adsorbed on the adsorption nozzle 15 installed in the head unit 14 is provided to be movable. The image sensor 46 is installed to be able to move close to a particular part feeder to which the part is to be adsorbed among the one or more provided part feeders 18a, 18b, 18c, 18d, and 18e. After the adsorption nozzle 15 descends to adsorb the part, the head unit 14 moves to the upper portion of the image sensor 46 that has previously reached a position close to the part feeder on which the part is placed, so that sensing is performed. . Afterwards, the component is mounted on the printed circuit board 25.

On the other hand, according to another feature of the invention, the movement path of the image sensor 46 for picking up the components adsorbed to the suction nozzle 15 of the head unit 14 is the head unit 14 is the component feeder 18a And 18b, 18c, 18d, and 18e can be set to intersect with the straight paths moving from the component mounting position.                     

Furthermore, the component head unit 14 moves in a straight line of the shortest distance connecting between the component feeders 18a, 18b, 18c, 18d, and 18e and the component mounting position, and the movement path of the image sensor 46 and By moving the image sensor 46 to a point where the movement path of the head unit 14 crosses, the component adsorbed by the suction nozzle 15 can be captured.

In the apparatus shown in FIG. 4A, the servo motor 33 and the ball screw 35 are applied to move the image sensor 46. As the servo motor 33 rotates, the ball screw 35 rotatably supported by the bearing 34 rotates, and the ball screw 35 is coupled to the bushing 32 installed in the image sensor 46. Thus, the image sensor 46 can move closer to any one of the component feeders 18a, 18b, 18c, 18d, and 18e. In the controller (not shown), the suction nozzle 15 of the head unit 14 controls the driving of the servo motor 33 so that the component is removed from one of the component feeders 18a, 18b, 18c, 18d, and 18e. During or before the adsorption, the image sensor 46 is moved to a position proximate to the component feeder in advance to wait. In another example, the linear motion of the image sensor may be achieved by using a linear motor instead of a ball screw.

4b is a perspective view schematically showing a part of the head unit provided in the apparatus of FIG. 4a.

Referring to the drawings, one side of the head unit 14 is provided with at least one reference portion (132a, 132b). In addition, when the component 135 adsorbed by the suction nozzle 15 is sensed by the image sensor, at least one reference part 132a and 132b which is not covered by the component 135 is installed.

The provision of the reference portions 132a and 132b is important for recognizing errors in component adsorption with the moving image sensor 46 (FIG. 4A). Since the position between the positions of the reference portions 132a and 132b and the center of the nozzle 15 is a known value, when the image sensor 46 senses at least one of the reference portions 132a and 132b, the reference From the positions of the portions 132a and 132b, the position of the center of the suction nozzle 15 can be determined, and the relative position between the position and the center of the part can be known. These values make it possible to recognize errors in component adsorption. The error recognition method at the time of component adsorption will be described later in more detail.

5 schematically shows a first embodiment of a component mounting method according to the present invention. The same reference numerals as those shown in FIG. 4A among the reference numerals shown in FIG. 5 denote the same components.

With reference to the drawings, the part feeder is a tray feeder, a stick feeder or a feeder generally wound on a reel, which is indicated by the reference numerals 18a, 18b, 13c, 13d and 13e in the embodiment shown in the drawings. 5 are provided as shown. In addition, as shown in the figure, the image sensor may move to a position near each component supply unit, and the image sensor positions at this time are represented as 31A, 31B, 31C, 31D, and 31E, respectively. The image sensor can linearly reciprocate along the normal guide member (linear motion guide in the example shown in the drawing) when the ball screw 35 rotates by the drive of the servo motor 33.                     

If the adsorption head attempts to mount the component at the point indicated by P2 of the printed circuit board 25 by attracting the part from the specific part feeder 18B, the image sensor 46 (FIG. 4A) is indicated by the reference numeral 31B. Moving to will reach the position closest to the part feeder 18B. Therefore, the movement path of the suction head 14 can be shortened from the component feeder 18B to the shortest distance from the position 31B of the image sensor, and the shortest from the position 31B of the image sensor to the component mounting point P2. Can be shortened to a distance. Similarly, if another component supply 18e is to pick up the component and mount it at the point P5 of the substrate 25, the image sensor will move to the position indicated by 31E. Thereafter, after the adsorption nozzle of the head unit sucks the part, it moves to the position 31E of the image sensor to take an image of the part, and then the head unit moves to the part mounting point P5 by the shortest distance. Can be. This operation is the same for the other points P1, P3, P4 and other component feeders 18a, 18c, 18d.

In practice, the head unit may be equipped with a plurality of suction nozzles, so that the head unit may be interposed between the multiple part feeders before the head unit moves directly above the image sensor so that the parts may be sucked at each suction nozzle. Will move. In this case, the image sensor moves close to the component feeder in which the final component adsorption occurs, and imaging is performed by each suction nozzle of the head unit passing through the image sensor. Thus, the calibration of the components is performed by the imaging information obtained from the imaging of the components adsorbed by the respective adsorption nozzles, and the adsorption nozzles are moved onto the printed circuit board to mount the components.                     

FIG. 6 is a flowchart illustrating a component mounting method described with reference to FIG. 5.

Referring to the drawings, first, a specific part feeder in which a part to be mounted among the plurality of part feeders is placed prior to each part mounting (step 51). The head unit is then moved to the suction position of the part feeder (step 52). The image sensor is then moved to the position closest to the particular part feeder (step 53). Next, it is checked whether the image sensor has moved to the correct position (step 54). If the image sensor is not approaching the position closest to a particular part feeder, it starts again from recognizing a particular part feeder. If the image sensor is approaching the position closest to the particular part feeder, then the adsorption nozzle causes the part placed in the particular part feeder to adsorb (step 55). The component feeder which has absorbed the component is moved to the upper part of the image sensor (step 56), and then sensing is performed (step 57). The image signal of the sensed part will be used as data for calibration of the error in the part adsorption and for determining the location of the part through data processing. The adsorption head is moved from the image sensor back to the printed circuit board (step 58), and the part mounting position is determined by calibrating the error at the time of component adsorption to mount the part on the printed circuit board (step 59).

7 schematically shows a second embodiment of the component mounting method according to the present invention. The same reference numerals as those shown in FIG. 4A among the reference numerals shown in FIG. 7 denote the same components.                     

Referring to the drawings, component feeders are indicated by reference numerals 18a, 18b, 18c, 18d, and 18e. In addition, the image sensor can linearly reciprocate along the normal guide member when the ball screw 35 rotates by the drive of the servo motor 33.

If the head unit attempts to mount the component at the point indicated by 61B of the printed circuit board 25 by absorbing the component from the component feeder 18b, the moving path of the head unit is different from the component adsorption position of the component feeder 18b. The path connecting the component mounting positions 61B on the printed circuit board 25 in a straight line will be selected. At this time, since the image sensor will move along the ball screw 35, the moving path of the image sensor coincides with the length direction of the ball screw 35. While the head unit moves from the component feeder 18b to the component mounting position 61B of the printed circuit board 25, at the moment when the head unit crosses the moving path of the image sensor, the image sensor is directly below the head unit. Will move, and the location of such an image sensor is indicated by reference numeral 31B 'in FIG.

Also, when the components are sucked from the other component feeders 13A, 13C, and 13D and mounted at different positions 61A, 61C, and 61D on the printed circuit board 25, the line and image sensor connecting the two positions ( The image sensor moves to the point where the movement path of 31) crosses, and these points are marked 31A ', 31C', 31D 'and 31E', respectively.

On the other hand, in the case of sensing the components adsorbed on the adsorption nozzle, it may be necessary to perform the calibration in consideration of the angle between the image sensor 31 and the adsorption nozzle. This case occurs in the component mounting apparatus using the articulated robot, not the gantry type component mounting apparatus illustrated in FIG. 4A. For example, in the case where the head unit is moved along the straight path from the component feeder 18a to the component mounting position 61A on the printed circuit board 25, the head is imaged at the position of 31A '. An angle of θ may be formed between the rectangular coordinate of the unit and the rectangular coordinate of the image sensor. Therefore, it is necessary to calculate the angle so that calibration can be performed in consideration of this angle. The angle [theta] can be automatically calculated by creating a database of the component mounting position on the substrate, the position of the component feeder, and the current position on the moving path of the image sensor. As another method, by passing the component adsorption part which adsorb | sucked a component over an image sensor, the image information can be input and an angle can be calculated.

In order to compensate the calculated angle θ, the suction nozzle may be rotated to compensate the angle θ, or the image sensor may be rotated. For example, the suction nozzle may be compensated for the angle of θ by rotating by the power of the servo motor, or in another example, the image sensor may be configured to be capable of rotating as well as linear reciprocating motion, thereby compensating the angle of θ. have.

8 is a flowchart illustrating a component mounting method described with reference to FIG. 7.

Referring to the drawings, first, the controller of the component mounting apparatus calculates an optimal moving path between the component adsorption position of the component feeder and the printed circuit board component mounting position (step 71). The head unit is then moved to the component adsorption position of the component feeder (step 72). Next, the intersection of the image sensor movement path and the head unit movement path is calculated (step 73), and the image sensor is moved to the intersection point (step 74). Next, it is checked whether or not the head unit has moved to the intersection point (step 75). At this time, if the head unit does not exactly move to the intersection point, the process of repeating the process of moving the adsorption head to the intersection point by calculating the intersection point again.

When it is confirmed that the head unit is at the intersection, the part is sucked by the suction nozzle of the head unit (step 76), and the head unit is moved directly above the image sensor (step 77). Next, an image of the adsorbed component is sensed (step 78). The sensed image signal will be processed in a predetermined manner and used as information about the determination of the component mounting position that calibrated the error in component adsorption. Next, the head unit is moved to the mounting position on the printed circuit board (step 79), and the components are aligned and mounted at the predetermined position on the substrate together with the calibration (step 80).

On the other hand, in the case where a head unit having a plurality of component adsorption nozzles is provided, the image sensor intersects the shortest distance between the component adsorption position of the component feeder and the mounting position of the component in which the final component adsorption is to be made. It is located at the point. The head unit moves along a straight path of the shortest distance from the final component adsorption position to the component mounting position, and acquires the calibration information of the component by sensing the image as it passes directly above the image sensor located on the path. The adsorption nozzle of the head unit rotates the component according to the calibration information obtained through the image sensing during the movement, and then mounts the component on the substrate.

9 illustrates an image of an image sensed by an image sensor.                     

Referring to the drawings, assuming that the center of the monitor 97 is B, the center B of the image displayed by the monitor 97 coincides with the center of the adsorption nozzle 94 adsorbing the component 91. to be. Designated by reference numerals 92 and 93 on the monitor 97, the reference portions 132a and 132b of FIG. 4B are displayed on the monitor 97 through image sensing. Since the center of the nozzle 94 which adsorbed the component 91 may be determined by the reference portions 92 and 93, the center of the suction nozzle 94 and the center O of the component 91 may be determined. Displacement can also be calculated.

That is, as shown in FIG. 4B, at least one reference part 132a and 132b is displayed in a block 137 in which the suction nozzle 94 is not covered by the component when the component is sucked. The displacement between the reference portions 132a and 32b and the center of the suction nozzle 15 is already determined. Therefore, the centers of the suction nozzles 13 can be obtained on the monitor 97 by sensing the reference portions 132a and 132b, and the displacement of the component center O can be easily obtained therefrom.

10 illustrates another example of displaying an image sensed by an image sensor on a monitor.

Referring to the drawing, assuming that the center of the monitor 97 is C, the center C of the image displayed by the monitor 97 and the center of the suction nozzle 94 that sucks the component 95 do not coincide. to be. Thus, even when the center C of the monitor 97 and the center of the suction nozzle 94 do not correspond, it is possible to measure the position error of the component 95. In this case, even if the fixed coordinate of the image sensor is not set, the mounting position of the component can be accurately known by calculating the relative position value of the center coordinate of the component and the suction nozzle.

In other words, the center of the adsorption nozzle 94 on which the component 95 is adsorbed is hidden from the component 31 on the monitor 97. However, by sensing the reference portions 132a and 132b, the center positions of the suction nozzles 94 are obtained from the reference portions 92 and 93 displayed on the monitor 97 in the image, and the center positions of the parts from the sensed images. And calculate the displacement between the two centers. This displacement can be expressed as a displacement in the rectangular coordinate system and a displacement in the angular coordinate system.

FIG. 11 is a flowchart illustrating a method of calibrating an error in absorbing a component by image sensing described with reference to FIGS. 9 and 10.

Referring to the drawing, first, the component adsorbed by the adsorption nozzle 94 is moved to pass through the image sensor directly and sense an image of the component (step 210).

Subsequently, the position of the reference portions 92 and 93 not covered by the components 91 and 95 is used to detect how much the components 91 and 95 are displaced from the center of the suction nozzle 94. By calculating the center position of the adsorption nozzle 94, the comparative position value Rp is calculated | required (step 220).

Next, the center position value Cp of the component is obtained from the image of the component in order to calculate the center of the components 91 and 95 (step 230).

Subsequently, the comparison position value Rp and the component position value Cp are compared to obtain an offset value of the component 31 to obtain a calibration value of the components 91 and 95 (step 240).

Finally, the controller operates according to the calibration value, whereby control is performed in which the suction nozzle 94 aligns the components 91 and 95 (step 250), followed by component mounting.

As described above, the relative position of the nozzle can be known only by the at least one reference part because the head unit itself is not rotated in the gantry-type component mounter, and between the reference part and the suction nozzle center on the initially set head unit. This is because the relative position of does not change. Therefore, the value can be calculated with at least one reference part. However, if the measurement is performed with two reference parts, even if there is a change in the relative angle between the axes that move the head unit XY in the gantry-type part mounter, the current position of the adsorbed parts and parts and the relative position of the adsorption nozzle can be calculated. Can be. It is also possible to calculate the value even if the head unit itself rotates.

12 shows a double gantry type component mounting apparatus implemented according to the present invention.

Referring to the drawings, the first X-axis 330 and the second X-axis 320 are installed to be movable on the first Y-axis 330 and the second Y-axis 340 installed in parallel to each other. The first head unit 380 is installed on the first X axis 310 so as to be movable along the first X axis 310, and the second head unit 390 is mounted on the second X axis 320. It is installed to be movable along the 320. The printed circuit board 400 is moved by the conveyor 370, and component feeders 410 and 420 for each head unit are installed in proximity to both sides of the conveyor 370.

In the case of the double gantry type as shown in FIG. 12, two image sensors are installed. That is, as shown in the figure, the first image sensor 350 and the second image sensor 360 are installed in proximity to both sides of the conveyor 370. When each head unit 38 picks up a component from the component feeders 410 and 420, each image sensor 350 and 360 moves to the nearest position of each component feeder to perform image sensing, whereby the component mounting speed is increased. Can be improved.

The component mounting method according to the present invention shortens the movement path of the component feeder by moving the image sensor closer to a specific component feeder or intersecting with the movement path of the component adsorption part, thereby increasing the component mounting speed. As a result, the mounting efficiency is improved. In addition, there is an advantage that can easily be calibrated with the moving image sensor errors occurring during component adsorption.

While the invention has been described with reference to one embodiment shown in the accompanying drawings, it will be understood that various modifications and other embodiments are possible to those skilled in the art. Therefore, the protection scope of the present invention should be defined only by the appended claims.

Claims (5)

A part feeder for supplying parts by holding a plurality of parts, Conveyor for conveying printed circuit boards, A head unit provided with a suction nozzle which sucks a part from the part feeder and mounts it on a printed circuit board on the conveyor; An image sensor installed to be movable and capable of sensing an image of a component adsorbed to the suction nozzle; And a plurality of reference parts provided on one side of the head unit such that when the image sensor senses the component adsorbed to the suction nozzle, the sensing of the component is not interrupted by the component. The image sensor of claim 1, wherein the image sensor is moved by a rotary motor providing a driving force, a ball screw rotated by the servo motor, and a bushing and a linear guide member installed on one side of the image sensor and coupled to the ball screw. Component mounting apparatus, characterized in that possible. The component mounting apparatus according to claim 1, wherein the head unit is installed to be movable along an X axis that is installed to be movable along a first Y axis and a second Y axis that are provided in parallel with each other. According to claim 1, The head unit is provided with two to be movable along each X axis on a pair of X axis that is installed to be movable along the second Y axis and the first Y axis installed in parallel with each other, The image mounting apparatus, characterized in that the two are provided in close proximity to both sides of the conveyor. Obtaining the center of the suction nozzle by sensing the position of the reference portion that is not covered by the component when performing the sensing of the suction nozzle of the head unit in which the component is adsorbed by the image sensor, Obtaining a center position of the component in the sensed image through the image sensing; Obtaining a calibration value of the component by obtaining an offset of the component from the displacement between the center of the sucked component and the center of the suction nozzle, and And controlling the component mounting position of the suction nozzle in accordance with the calibration value.

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