JPH06285750A - Image recognition distortion correcting method for punching device - Google Patents

Abstract

PURPOSE:To improve the precision of image recognition by slitting a recognized image into quadrantal parts make correction for each quadrantal parts in accordance with respective correction data. CONSTITUTION:In such a state that a punching means is moved preset distance away from an initial position, a measurement hole is punched in a measurement substrate and image-recognized by using an electromagnetic wave irradiating means 8 and an image-pickup means 26 for position detection. Such action is taken for each quadrantal part into which an image area is split with an X-axis and a Y-axis perpendicular to each other around the initial position. In accordance with the result, correcting data is originated for each quadrantal part. A work is set on the punch and image-recognized by the electromagnetic wave irradiating means 8 and the image pickup means 26, the recognized image is split into quadrantal parts and correction is made for each quadrantal part in accordance with the correction data.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of correcting image distortion that occurs when performing image recognition in a punching device.

[0002]

2. Description of the Related Art Conventionally, as a punching device, there is one which has an electromagnetic wave irradiating means and an image pickup means, and performs punching by detecting an identification mark position of a work by image recognition. That is, the work is irradiated with electromagnetic waves such as X-rays, and the image is X-rayed.
An image is picked up by an image pickup means such as a line camera, the image is recognized, the position of the identification mark is detected based on the image recognition result, and the position to be punched is determined based on that, and the hole is punched.

[0003]

SUMMARY OF THE INVENTION In the above conventional method,
It is premised that the identification mark is accurately image-recognized by the electromagnetic wave irradiation means and the imaging means, and based on this premise, the target object is irradiated with electromagnetic waves to perform image recognition. However, if the accuracy of the irradiation means or the imaging means is low, distortion occurs during image recognition, and the measurement of the position and dimensions of the target object will be totally wrong.

In particular, when an irradiation means for irradiating X-rays is used, the vidicon camera used as the image pickup means cannot be expected to have very high accuracy due to its structure, and it may be distorted to some extent under the influence of external magnetism. Inevitable. Therefore, the accuracy of image recognition becomes low, which hinders the subsequent work such as punching.

Conventionally, there has been an attempt to obtain the actual positional relationship from the recognized image by obtaining the expansion / contraction ratio in the X-axis direction or the Y-axis direction, but the distortion caused by the structure of the vidicon camera is the X-axis. Since there is a tendency that the distortion is not uniform along the Y-axis and is relatively non-uniform along the Y-axis, proper correction cannot be performed by the conventional method.

Therefore, an object of the present invention is to correct the distortion generated at the time of image recognition in the punching device so that the accuracy of the electromagnetic wave irradiation means and the image pickup means is not affected.
It is an object of the present invention to provide a method that enables extremely accurate image recognition and that can easily and effectively correct uneven distortion.

Another object of the present invention is to enable such distortion correction at the time of image recognition to be accurately performed without including a manual operation error.

[0008]

In order to achieve the above object, the present invention provides a punching device having an electromagnetic wave irradiating means, an imaging means, a punching means, and a punching means moving mechanism for moving the punching means. Using, set the error measurement substrate to the punching device, in the state of moving the punching means by the punching means moving mechanism by a predetermined distance set in advance from the initial position, punching the error measuring hole in the error measuring substrate, The position of the error measuring hole is detected by recognizing the image using the electromagnetic wave irradiating means and the image pickup means. The error measuring hole punching step and the position detecting step are performed in each of the four quadrants in which the image area is divided by the X axis and the Y axis orthogonal to each other with the initial position as the center, and based on the result, each quadrant Create the correction data for. And
The work is set in the punching device, the work is image-recognized by the electromagnetic wave irradiation means and the imaging means, the recognized image is divided into four quadrants, and correction is performed for each quadrant based on the correction data.

The error measuring holes include holes drilled at positions corresponding to the vertices of a square centered on the initial position and holes drilled at positions corresponding to the bisectors between the adjacent vertices.

[0010]

According to the present invention, the error measuring hole is punched and the position of the error measuring hole recognized on the image is measured. In particular, it is measured not only on the X-axis and Y-axis, but how much error is included in the position of each vertex of a square centered on the initial position for image recognition. And this is X
Since the correction data is calculated for each of the four quadrants divided by the axis and the Y-axis, extremely effective correction data can be obtained.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an example of a punching device according to the present invention. In this punching device, an image pickup means, a punching means, and the like, which will be described later, are housed in the main body case 1, and the work table 4 is arranged on the upper part thereof so that the printed circuit board 56 and the like can be placed. Protective covers 6 and 7 are provided on the work table 4 via a pedestal 5, and electromagnetic wave irradiation means for irradiating electromagnetic waves is built in the protective covers 6 and 7. In this embodiment, the X-ray generator 8 is used as the electromagnetic wave irradiation means. Further, an operation panel 9 is provided, and various switches 10 for the user to perform work such as punching and image recognition, and C for displaying an image.
An RT display 11 is provided.

2 to 4 and a block diagram of the punching device are shown in FIGS. The upper part of the drawing shows the inside of the protective cover 6, and includes an X-ray generator 8, a protective cylinder 13 fixed below the protective cover 13 and having an X-ray passage portion 13a, the X-ray generator 8 and the protective cylinder 13. A support member 14 is provided that supports and is vertically movable by a drive mechanism (not shown). The protective covers 6 and 7 and the protective cylinder 13 prevent the X-ray 12 from leaking to the outside.

The inside of the body case 1 is shown at the bottom of the drawing. As shown in FIG. 3, on a pair of legs 15 fixed to the main body case 1, a support plate 1 having a hole in the center is formed.
6 and 17 are fixed. As shown in FIG. 2, the motor holding member 1 is attached to one end portion (left side in FIG. 2) of the support plates 16 and 17.
8 is fixed, and the motor 19 is held by the motor holding member 18. A lead screw 21 is connected to a drive shaft of the motor 19 via a coupling 20, and the lead screw 21 is rotatably supported by a support plate 17. This lead screw 21
A base plate 22 is disposed above the base plate 22, and a nut 23 fixed to the lower surface of the base plate 22 is screwed into the lead screw 21. Further, as shown in FIG. 3, rails 24 are laid on the support plate 17, and the base plate 2
A slider 25 fixed to the lower surface of the rail 2 is fitted to the rail 24. With such a configuration, the motor 19
Drive the lead screw 21 to rotate, and the nut 2
3 and the slider 25, the base plate 22 moves in the left-right direction in FIG.

On the base plate 22, image pickup means for displaying an image of an object to be irradiated with electromagnetic waves is provided on the support plates 27, 2.
It is fixed via 8, 29. Since X-rays are used as electromagnetic waves in this embodiment, the X-ray camera 26 is used as the image pickup means. The X-ray camera 26 is connected to an image processing circuit (see FIG. 5) 30.

Further, on the base plate 22, an XY table mechanism 31 as a punching means transfer mechanism is arranged.
The configuration will be described below. A motor holding member 32 is fixed to one end portion (left side in FIG. 2) of the base plate 22, and a motor 33 is held on the motor holding member 32. An X-axis lead screw 35 is connected to the drive shaft of the motor 33 via a coupling 34, and the X-axis lead screw 35 is rotatably supported by support members 36 and 37. An X table 38 is disposed above the X axis lead screw 35, and a nut 39 fixed to the lower surface of the X table 38 is screwed onto the X axis lead screw 35. Further, as shown in FIG. 3, a rail 40 is laid on the base plate 22,
A slider 41 fixed to the lower surface of the table 38 is fitted to the rail 40. With such a configuration,
The X-axis lead screw 35 is rotated by the drive of the motor 33, and the X table 38 is integrally moved with the nut 39 and the slider 41 in the horizontal direction in FIG.

As shown in FIG. 3, the motor 43 is similarly fixed to the X table 38 by the motor holding member 42.
Y-axis lead screw 4 via timing belt 44
6 are connected. The Y-axis lead screw 46 is rotatably supported by support members 47 and 48, and
A nut 50 fixed to the table 49 is screwed. Further, a pair of rails 51 is laid on both sides of the Y-axis lead screw 46, and a slider 52 fixed to a Y-table 49 is fitted therein. With such a configuration, the Y-axis lead screw 46 is rotated by the drive of the motor 43, and the Y table 49 is integrally moved with the nut 50 and the slider 52 in the horizontal direction in FIG. In this way, the XY table mechanism 31 is configured, and Y
The table 49 is movable with respect to the base plate 22.

A punching means 55 is attached to the Y table 49 via a holding frame 53 and a chip cover 54. This punching means 55 is a spindle motor 55.
a and a collet chuck 55b fixed to the upper end thereof
And a drill 55c held by the collet chuck 55b
And the perforating member. Then, by driving the spindle motor 55a, the drill 55c is raised while rotating and punches a work such as a printed circuit board 56 described later.

With the above construction, the X-ray camera 26 and the punching means 55 are movable in the left-right direction (X-axis direction) in FIG. Is further movable on the base plate 22.

A work table 4 is provided on the main body case 1.
Is provided, on which the printed circuit board 56, which is a work to be perforated, is placed. The work table 4 is provided with a hole 4a, and the X-ray camera 26 or the punching means 55 can face the above-mentioned X-ray generator 8 through the hole 4a and the printed board 56. That is, in FIG. 4, the X-ray camera 26 is in a state of facing the X-ray generator 8 via the hole 4a and the printed circuit board 56, and in this state, the motor 19 is operated to move the base plate 22 for punching. The means 55 is provided for the hole 4a and the printed board 56.
FIG. 4 shows a state of being opposed to the X-ray generator 8 via the. In FIG. 4, the support member 14 is moved down by a drive mechanism (not shown) to bring the protective cylinder 13 into close contact with the printed circuit board 56. As a result, the printed circuit board 56 is held so as not to move during punching. Passage 13
Since a is cylindrical, there is no risk of damage by the drill 55c.

Next, a method of creating distortion correction data for image recognition in this punching device will be described with reference to FIGS. First, it is confirmed whether or not the drill 55c is at an accurate origin position (position facing the center of the X-ray generator 8). If the drill 55c is displaced, the motors 19 and 3 are
3 and 43 are driven to move the drill 55c so as to face the center of the X-ray generator 8 and set again as the initial position (A). As a result, the origin in the image processing and the origin (initial position) of the punching means 55 are matched.

Next, the position of the hole to be drilled in the error measuring substrate 70 (see FIG. 7) is selected (B). Specifically, in this embodiment, as shown in FIG. 8, four points (71a to 71d) forming the vertices of a square centered on the origin 71i and four points (71e to 71e to the bisector of adjacent vertices). 71h), a total of 8 points of data are obtained, and correction data is created based on the data. Therefore, the user inputs from the switch 10 (see FIG. 1) which of the above eight points is to be punched and the coordinates are to be recognized, and is stored in the storage circuit 60 (see FIG. 5).

The error measuring substrate 70 (see FIG. 7)
Is placed on the work table 4 (C), and the substrate 70 is perforated by the perforation means 55 (D). For example, when the error measuring hole 71a is selected in step B, the origin position 71
The position moved a predetermined distance from i to the upper right (as shown in FIG. 7,
In the present embodiment, the XY table mechanism 31 is operated so that the drill 55c is located at a position 2 mm to the right and 2 mm above. Then, the spindle motor 55a is actuated, and the error measuring board 70 is punched with the error measuring hole 71a shown in FIG. 7 by the drill 55c. After drilling, the drill 55c is returned to the initial position set in step A.

Next, the motor 19 is actuated so that the X-ray camera 26 faces the X-ray generator 8 and the base plate 22.
To move. Then, the error measuring substrate 70 is irradiated with X-rays from the X-ray generator 8 and the X-ray image is taken by the X-ray camera 26.
The image processing circuit 30 captures an image with the error measurement hole 71a.
(E).

In the present embodiment, the error measuring holes 71a as described above are formed on a predetermined number (n) of error measuring substrates, and the coordinates of the holes are averaged. Therefore, it is judged whether or not the punching of n error measuring substrates is completed (F), and if not completed, the next error measuring substrate (not shown) is set in the punching device. (C), drilling (D), and hole coordinate recognition (E) are performed. In this way, steps C to E are repeated while exchanging the error measurement substrate, and the perforation and hole coordinate recognition of n substrates are completed.
In step F, when it is confirmed that the drilling and hole coordinate recognition of n substrates are completed, the coordinates of the holes obtained for these n substrates are averaged, and the average of these coordinates is used as the error measuring hole. The position 71a is stored in the storage circuit 60 (G). This completes the perforation and image recognition of the error measuring hole 71a.

Next, all the error measuring holes (8 in this embodiment)
It is determined whether or not perforation and image recognition have been completed (H). If the drilling of all the error measurement holes and the image recognition have not been completed yet, the process returns to step B to select the next hole position. Here, the error measuring hole 71b (see FIG. 8)
Select. Then, the error measuring board is set by exchanging (C), and the drill 55c is moved to a position where the hole 71b should be drilled (a position 2 mm to the right in the X direction from the origin 71i in this embodiment), and the error measuring board 70 is moved. An error measuring hole 71a is drilled in (D). After drilling, the drill 55c is returned to the initial position. Then, using the X-ray generator 8, the X-ray camera 26 and the image processing circuit 30, the coordinates of the error measuring hole 71b are obtained (E). Then, the number of punched substrates is confirmed (F), and when the predetermined number n is reached, the coordinates of the error measuring holes 71b are determined by averaging the respective coordinates (E), and this is stored in the storage circuit (FIG. 5). ).

In this manner, steps B to H are repeated to perform coordinate recognition on all the error measuring holes 71a to 71h. Since the motors 19, 33, and 43 can be controlled accurately (with an error of about several μm), the positions of the error measurement holes 71a to 71h that are actually punched are shown on the assumption that they are punched on one substrate. Equal spacing L as 8
(2 mm in the present embodiment), and they are located side by side along a square contour. That is, the holes 71a, 71b, 71c,
71d is provided at a position corresponding to each vertex of the square, and the holes 71a, 71b, 71c, 71d are used as the vertex,
A square 72 having a side length of 2 L (4 mm) is formed. Then, the holes 71e, 7 are formed so as to divide the space between adjacent vertices into two equal parts, that is, to divide the four sides of the square 72 into two equal parts.
1f, 71g, and 71h are located, respectively. The origin 71i is located at the center of this square.

However, as described above as a conventional problem, the coordinates on the image of the holes 71a to 71h recognized in step E and averaged in step G due to the distortion generated by the X-ray camera 26 are accurate squares. , And a distorted array state is formed as shown in FIG.
Therefore, based on this coordinate data, correction data for correcting the image distortion is created (I). The method will be described below. In the following description, the holes 71
The positions of a to 71i on the image are shown by adding "'" like 71a' to 71i '.

As shown in FIG. 9, cross-shaped reference lines (X-axis, Y-axis) 26a, 2 which are preset in the X-ray camera 26.
6b, the image is displayed in the first quadrant 72a and the second quadrant 72.
b, the third quadrant 72d, and the fourth quadrant 72c. Hereinafter, a method of obtaining correction data (correction formula) in the first quadrant 72a will be described with reference to FIGS. In addition,
For convenience, let P be the point at which image recognition is to be performed, and assume that this is recognized at the position P ′ due to distortion in image recognition. Then, the coordinates of P are (X, Y), and the coordinates of P'are (X ', Y').

In the X-axis direction, a distance dx1 from the origin 71i 'to the bisector 71f' and a distance dx2 from the bisector 71e 'to the apex 71a' are obtained. And
About the Y-axis direction, the bisector 71e 'from the origin 71i'
Distance dy1, bisector 71f 'to vertex 71a'
Find the distance dy2 to. Based on this, first, a correction formula in the X-axis direction is obtained. When obtaining the correction formula in the X-axis direction, the error in the Y-axis direction is omitted.

FIG. 10 shows the actual positional relationship of each point (state without distortion), and FIG. 11 shows the positional relationship of image recognition including distortion. In FIG. 10, a straight line 72 that passes through the point P and is parallel to the X axis is drawn, the intersection of this straight line 72 and the Y axis 26b is R, and the straight line 73 and the straight line 72 that pass through the apex 71a and the bisector 71f. The intersection is represented by Q. Similarly in FIG. 11, a straight line 74 passing through the point P ′ and parallel to the X-axis is drawn, and the origin 71i ′ and the bisector 71e are drawn.
It is assumed that the intersection of the straight line 75a and the straight line 74 passing through ′ is R ′, and the intersection of the straight line 75b passing through the apex 71a ′ and the bisecting point 71f ′ and the straight line 74 is Q ′.

Here, the following relational expressions hold. RP / RQ = R'P '/ R'Q' ... (1) X / L = X '/ R'Q' ... (2) By the way, in this calculation, the distortion in the Y-axis direction is ignored. , The distance between the origin 71i ′ and the bisector 71e ′ is L
Equal to (2 mm). That is, the point R'is a line segment connecting the origin 71i 'and the bisector 71e', and Y ':
It is a point that is internally divided into (L−Y ′), and similarly, the point Q ′ is a line segment connecting the bisecting point 71f ′ and the apex 71a ′.
It is regarded as a point that is internally divided into (L-Y '). Therefore, the following equation holds. R'Q '= {Y' * dx2 + (L-Y ') * dx1} / L ... (3) Then, if Formula (3) is substituted into Formula (2), the coordinate X of the point P'will be set.
'Is required. X = X '* L2 / (Y' * dx2 + (L-Y ') * dx
1} Thereby, the coordinate X of the actual point P is obtained from the coordinates (X ', Y') of the point P'obtained by the image recognition and the distances dx1 and dx2.

When the coordinate Y of the point P is calculated by the same method, the following relation is obtained. Y = Y '* L2 / (X' * dy2 + (L-X ') * dy
1} Note that this calculation can be easily performed by simply replacing the X axis and the Y axis in the example of obtaining the correction data in the X axis direction. And here, the error in the X-axis direction is ignored.

Since the errors on the X-axis and the Y-axis are minute, as described above, when obtaining the coordinates in the X-axis direction, the error in the Y-axis direction is ignored and the coordinates in the Y-axis direction are calculated. When obtaining the error, there is practically no problem even if the error in the X-axis direction is ignored.

Next, a method of obtaining correction data (correction formula) in the fourth quadrant 72c will be described with reference to FIGS. Similarly to the above, it is assumed that the point at which image recognition is to be performed is U, and this is recognized at the position of U ′ due to distortion in image recognition. Then, let the coordinates of U be (X1, Y
1) and the coordinates of U ′ are (X′1, Y′1). Since it is in the fourth quadrant, Y1 and Y'1 are negative values.

In the X-axis direction, the above-mentioned distance dx1
The distance dx3 from the bisector 71g 'to the vertex 71b' is obtained. Then, in the Y-axis direction, the distance dy3 from the origin 71i 'to the bisector 71g', the bisector 71f '.
The distance dy4 from the top to the vertex 71b 'is obtained.

FIG. 12 shows the actual positional relationship between the respective points, and FIG. 13 shows the positional relationship in which the image is recognized including distortion. In FIG. 12, a straight line 76 passing through the point U is drawn, and the intersection of this straight line 76 and the Y axis 26b is S, and the vertex 7
Let T be the intersection of a straight line 77 and a straight line 76 passing through 1b and the bisector 71f. Also in FIG. 13, similarly, a straight line 78 passing through the point U ′ is drawn, and an intersection point of the straight line 79a passing through the origin 71i ′ and the bisecting point 71g ′ and the straight line 78 is S ′, and the vertex 71.
A straight line 79b and a straight line 78 passing through b'and the bisector 71f '
Let the intersection with and be T '.

Therefore, when the same calculation as in the first quadrant 72a is performed, the following relational expression is established. X1 = X'1 * L2 / (-Y'1 * dx3 + (L + Y '
1) xdx1} Y1 = Y'1xL2 / {X'1xdy4 + (L-X '
1) × dy3} In this way, the coordinates (X'1, Y'1) of the point U'obtained by image recognition and the distances dx1, dx3, dy
The coordinates (X1, Y1) of the actual point U are obtained from 3 and dy4. Similarly, with respect to the second quadrant and the third quadrant, a calculation formula for correcting the distortion can be obtained.

As described above, the image processing circuit 3 shown in FIG.
When 0, the image recognition of the error measuring holes 71a to 71h is performed,
Each of the quadrants 72a, 72b, 72c, 7 by the arithmetic circuit 63
The respective correction expressions of 2d are obtained and stored in the storage circuit 60. In addition, these circuits and the motors 19 and 3
Control of 3, 43 and 25a is performed by a control circuit (CPU) 62.

These steps are performed as an initial operation at the start of use of the punching device, and then the printed circuit board 56 to be actually punched is punched. A flow chart of this punching process is shown in FIG.

First, as in step A described above, the center of the drill 55c is aligned with the origin on the image (a). Then, as shown in FIG. 2, the printed board 56 is set on the work table 4 (b), and the identification mark 61 is image-recognized by the X-ray generator 8, the X-ray camera 26, and the image processing circuit 58 ( c). At this time, since the image is distorted, the image is divided into four quadrants 72a, 72b, 72c, 72d by the X axis 26a and the Y axis 26b as in FIG. Then, the arithmetic circuit 63 corrects each quadrant based on the correction data stored in the storage circuit 60 (d).

After that, the punching means 55 is moved to the center of the mark 61 recognized as a result of this correction. That is, as shown in FIG.
Is moved by a predetermined distance (a distance between the X-ray camera and the punching means), and the motors 33 and 43 are driven to move the X table 38 and the Y table 49. The piercing means 55 is moved to the piercing position. Then, the printed board 56 is perforated by the drill 55c driven by the spindle motor 55a (e). This completes the accurate perforation of the positioning mark 61 at the origin. Therefore, it is determined whether or not the drilling work is continued (f), and when it is continued, steps b to e are repeated, and when it is determined in step f that the drilling work is not continued, all the processes are finished.

As described above, according to the method of the present invention, accurate image recognition can be performed by correcting the distortion at the time of image recognition due to the structural problem of the image pickup means such as the X-ray camera 26. it can. In particular, the distortion due to the vidicon camera is not uniform along the X-axis and the Y-axis and is often non-uniform, but since the correction is performed based on the correction data set for each of the four quadrants, Effective correction can be performed and extremely accurate image recognition is possible.

Moreover, since it is not necessary to use a standard gauge or the like and the correction data is created based on the error measuring hole punched by the punching means provided in the punching device, it is not necessary to use any other member. Since there is no step to set the standard gauge, there will be no error due to manual work.

Further, an error caused when the central axis of the image pickup means and the axis of the XY table are relatively inclined,
Correction can be made based on the method of the present invention, and image recognition can be accurately performed.

If the operation for obtaining the correction data is performed at the start of use of the image recognition device, it is not necessary to perform it for a while after that, and accurate image recognition can be performed based on the initially obtained correction data.

The present invention can achieve the same effect with respect to the perforation apparatus as a whole for performing image recognition using the electromagnetic wave irradiation means and the image pickup means. Although it is particularly effective when using X-rays, it can also be applied to a device that irradiates light. Further, the method for obtaining the correction data is not limited to the calculation method in the present embodiment, and any calculation method may be used as long as appropriate correction data can be calculated for each of the four quadrants.

In the above embodiment, one error measurement substrate is provided with one error measurement hole, but the number of error measurement holes is not limited to this, and a large number of error measurement holes are provided on one substrate. You may provide a hole. Further, in the above-described embodiment, the accuracy is improved by forming holes in the same place of a plurality of substrates and averaging the holes, but the present invention is not limited to this.

[0048]

As described above, according to the present invention, even if distortion occurs during image recognition, it is possible to perform accurate image recognition by correcting it, and in particular, correction set for each of four quadrants. Since correction is performed based on the data, extremely effective correction can be performed, and the accuracy of image recognition is greatly improved.

Further, since the correction data is created based on the holes punched by the punching means, the risk of error is small.

[Brief description of drawings]

FIG. 1 is a reduced perspective view showing a punching device according to an embodiment.

FIG. 2 is a sectional view of a main part of a punching device.

3 is a sectional view taken along line WW of FIG.

FIG. 4 is a sectional view of an essential part of the punching device when the base plate is moved.

FIG. 5 is a block diagram of a punching device.

FIG. 6 is a flowchart for creating correction data.

FIG. 7 is an explanatory view showing an error measuring hole.

FIG. 8 is an explanatory diagram showing an actual positional relationship of error measurement holes.

FIG. 9 is an explanatory diagram showing a recognition image of an error measuring hole.

FIG. 10 is an explanatory diagram showing the actual positional relationship of the error measurement holes in the first quadrant.

FIG. 11 is an explanatory view showing a recognition image in the first quadrant of the hole for error measurement.

FIG. 12 is an explanatory diagram showing the actual positional relationship of the error measurement hole in the third quadrant.

FIG. 13 is an explanatory diagram showing a recognition image of a third quadrant of the hole for error measurement.

FIG. 14 is a flowchart for punching a printed circuit board.

[Explanation of Codes] 8 Electromagnetic Wave Irradiation Means (X-ray Generator) 26 Imaging Means (X-ray Camera) 26a X Axis 26b Y Axis 55 Perforation Means 56 Work (Printed Circuit Board) 70 Error Measurement Substrates 71a to 71h Error Measurement Holes 72a 1st quadrant 72b 2nd quadrant 72c 4th quadrant 72d 3rd quadrant

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 3/00 K 6921-4E

Claims (2)

[Claims] 1. A perforation apparatus having an electromagnetic wave irradiation means, an imaging means, a perforation means, and a perforation means movement mechanism for moving the perforation means is used, and an error measurement substrate is set in the perforation apparatus, and the perforation is performed. Using the means for moving the punching means from the initial position by a predetermined distance set in advance to punch an error measuring hole in the error measuring substrate; And recognizing the position of the hole for error measurement by detecting the position of the hole for error measurement in each of the four quadrants in which the image area is divided by the X-axis and the Y-axis orthogonal to the initial position. The hole punching step and the position detecting step are performed, and based on the results, correction data is created for each quadrant, and the workpiece is set in the punching device. The workpiece is image-recognized by the electromagnetic wave irradiation means and the imaging means, the recognized image is divided into the four quadrants, and correction is performed for each quadrant based on the correction data. Distortion correction method for image recognition in punching device. 2. The hole for error measurement is a hole drilled at a position corresponding to each vertex of a square centered on the initial position, and a hole drilled at a position corresponding to a bisector between adjacent vertexes. The distortion correction method for image recognition in a punching device according to claim 1, further comprising: