JP2006294655A - Component mounting apparatus - Google Patents

Component mounting apparatus Download PDF

Info

Publication number
JP2006294655A
JP2006294655A JP2005109216A JP2005109216A JP2006294655A JP 2006294655 A JP2006294655 A JP 2006294655A JP 2005109216 A JP2005109216 A JP 2005109216A JP 2005109216 A JP2005109216 A JP 2005109216A JP 2006294655 A JP2006294655 A JP 2006294655A
Authority
JP
Japan
Prior art keywords
substrate
component
mounting
camera
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005109216A
Other languages
Japanese (ja)
Other versions
JP4587861B2 (en
Inventor
Kimihiko Hiroi
公彦 廣井
Tsutomu Kataigi
勉 片居木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP2005109216A priority Critical patent/JP4587861B2/en
Publication of JP2006294655A publication Critical patent/JP2006294655A/en
Application granted granted Critical
Publication of JP4587861B2 publication Critical patent/JP4587861B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To correctly position a second component and mount it on a first component mounted on a substrate. <P>SOLUTION: A component mounting apparatus is provided with: a substrate supporting device 12 for positioning and supporting a substrate S for mounting a component; a substrate recognizing camera 18 in which its focal distance H matches the top surface of the supported substrate S and a reference position on the top surface of the substrate is set, so that image can be recognized; a transfer head 20 for transferring a component held with a nozzle 22 to a predetermined position on the substrate, on the basis of the reference position whose image is recognized with the camera; and a structure 14 for integrally moving the transfer head 20 and the camera 18 in a plane direction. The apparatus is provided with a lowering means 24 for lowering the device 12. The apparatus drives the lowering means 24 to enable the focal distance H of the camera 18 to match the top surface of a first component P<SB>1</SB>on the upper part than the top surface of the substrate S supported by the device 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、部品搭載装置、特に配線基板上に電子部品を重ねて搭載する際に適用して好適な部品搭載装置に関する。   The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus suitable for application when electronic components are stacked and mounted on a wiring board.

一般に、電子部品を配線基板に搭載する際には、電子部品実装装置が用いられている（例えば、特許文献１参照）。   Generally, when mounting an electronic component on a wiring board, an electronic component mounting apparatus is used (see, for example, Patent Document 1).

従来の電子部品実装装置は、図５に概要を示すように、基板搬送装置１０により部品搭載用の基板Ｓを矢印方向に搬送し、その一部を構成する基板支持装置１２上に位置決めし、固定・支持する。その後、上方に配設されている構造体１４に支持され、ＸＹ方向に移動自在な搭載ユニット１６に固定されているＣＣＤカメラ１８により、部品を搭載する際の指標とする基板Ｓ上のＸＹ方向の絶対座標としての基準マークを認識した後、同ユニット１６に固定されている搭載ヘッド２０に上下動と軸中心回転とが可能に取付けられている吸着ノズル２２により電子部品Ｐを保持し、保持された電子部品Ｐを図示しない認識機能カメラにより画像認識したり、図示しないレーザ認識装置により位置認識して、該保持部品の位置決めを行なった後、該部品Ｐを二次元的に移動させ、基板Ｓ上の所定座標位置に搭載する。以上の動作により目的とする全部品を搭載後、基板Ｓを更に矢印方向に搬送し、搭載作業が終了する。   As shown in FIG. 5, the conventional electronic component mounting apparatus conveys a component mounting board S in the direction of an arrow by the board carrying apparatus 10, and positions the board on a board supporting apparatus 12 constituting a part thereof. Fix and support. Thereafter, the CCD camera 18 supported by the structure 14 disposed above and fixed to the mounting unit 16 movable in the XY directions is used as an index for mounting components on the substrate S in the XY directions. After recognizing the reference mark as an absolute coordinate of the electronic component P, the electronic component P is held and held by the suction nozzle 22 attached to the mounting head 20 fixed to the unit 16 so as to be able to move up and down and rotate around the axis. The recognized electronic component P is image-recognized by a recognition function camera (not shown) or position-recognized by a laser recognition device (not shown) to position the holding component, and then the component P is moved two-dimensionally to form a substrate. Mounted at a predetermined coordinate position on S. After mounting all the desired components by the above operation, the substrate S is further transported in the direction of the arrow, and the mounting operation is completed.

なお、前記構造体１４は、便宜上簡略化して図示してあるが、搭載ユニット１６をＸ方向に移動させるＸ駆動ガイドと、該ガイドと搭載ユニット１６を一体でＹ軸方向に移動させるＹ駆動ガイドを備えた構成になっている。   Although the structure 14 is illustrated in a simplified manner for convenience, an X drive guide for moving the mounting unit 16 in the X direction, and a Y drive guide for moving the guide and the mounting unit 16 in the Y-axis direction integrally. It has a configuration with.

特開２００３−２５８４９７号公報JP 2003-258497 A

しかしながら、前記図５に併記したように、従来の電子部品実装装置では、ＣＣＤカメラ１８が搭載ユニット１６に固定されているために、該ＣＣＤカメラ１８の焦点距離Ｈが一致する高さは、基板支持装置１２に支持されている基板Ｓの上面に固定されている。従って、基板Ｓ上に搭載されている第１部品の上に、更に第２部品を重ねて搭載したいという要請があった場合には、ＣＣＤカメラ１８の焦点距離Ｈが基板Ｓ上の第１部品の上面に一致していないために、該部品上に設けられている基準マークの位置を認識できないことになり、結果として第１部品上には正確な位置に第２部品を搭載することができないという問題がある。   However, as shown in FIG. 5, in the conventional electronic component mounting apparatus, since the CCD camera 18 is fixed to the mounting unit 16, the height at which the focal lengths H of the CCD camera 18 coincide is the substrate. It is fixed to the upper surface of the substrate S supported by the support device 12. Therefore, when there is a request for mounting a second component on the first component mounted on the substrate S, the focal length H of the CCD camera 18 is set to the first component on the substrate S. The position of the reference mark provided on the component cannot be recognized, and as a result, the second component cannot be mounted at an accurate position on the first component. There is a problem.

本発明は、前記従来の問題点を解決するべくなされたもので、基板上に搭載された第１部品の上に、更に第２部品を重ねて搭載する際に、該第２部品を第１部品上に正確に位置決めして搭載することができる部品搭載装置を提供することを課題とする。   The present invention has been made to solve the above-described conventional problems. When the second component is further stacked on the first component mounted on the substrate, the second component is replaced with the first component. It is an object of the present invention to provide a component mounting apparatus that can be accurately positioned and mounted on a component.

本発明は、部品搭載用の基板を位置決めし、支持する基板支持装置と共に、支持された基板の上面に焦点距離が一致され、該基板上面の基準位置を画像認識可能に設定された基板認識カメラと、該カメラにより画像認識した基準位置に基づいて、ノズルに保持された部品を基板上の所定位置に搭載する搭載ヘッドと、該搭載ヘッド及び前記基板認識カメラを一体で平面方向に移動させる構造体とを備えている部品搭載装置において、前記基板支持装置を下降させる下降手段又は前記構造体を上昇させる上昇手段のいずれか一方を備え、下降手段又は上昇手段を駆動させ、前記基板支持装置に支持されている基板の上面より上方の任意高さ位置に、前記基板認識カメラの焦点距離を一致させることを可能にしたことにより、前記課題を解決したものである。   The present invention relates to a substrate recognition camera in which a focal length is matched to the upper surface of a supported substrate and a reference position on the upper surface of the substrate is set so that an image can be recognized together with a substrate support device that positions and supports a component mounting substrate. A mounting head for mounting the component held by the nozzle at a predetermined position on the substrate based on the reference position recognized by the camera, and a structure for moving the mounting head and the substrate recognition camera integrally in a plane direction In the component mounting apparatus comprising a body, the substrate mounting apparatus includes either a lowering unit that lowers the substrate support device or a lifting unit that raises the structure, and drives the lowering unit or the lifting unit to The above problem has been solved by making it possible to match the focal length of the substrate recognition camera to an arbitrary height position above the upper surface of the supported substrate. Than it is.

本発明によれば、基板を支持している基板支持装置を下降させるか、又は、基板認識カメラ等を平面方向に移動させる構造体を上昇させるかにより、予め基板上面に一致されていた該カメラの焦点距離を、該基板の上面より上方の任意高さ位置に一致させることを可能としたので、基板上に第１部品を搭載した後、その焦点距離を該部品の上面に一致させることが可能となる。従って、前記カメラにより第１部品の上面に設けられている部品用基準マーク（原点）を画像認識することが可能となるため、該部品上の正確な位置に第２部品を搭載することが可能となる。   According to the present invention, the camera previously matched with the upper surface of the substrate by lowering the substrate supporting device supporting the substrate or raising the structure for moving the substrate recognition camera or the like in the plane direction. It is possible to make the focal length coincide with the arbitrary height position above the upper surface of the substrate, so that after the first component is mounted on the substrate, the focal length can coincide with the upper surface of the component. It becomes possible. Accordingly, the camera can recognize the image of the component reference mark (origin) provided on the upper surface of the first component, so that the second component can be mounted at an accurate position on the component. It becomes.

又、本発明によれば、上記のように基板より上方に位置する第１部品の上に第２部品を搭載する際、カメラ自体を動かさずに焦点距離が一致する高さを変更することが可能となるため、カメラと搭載ヘッドの位置関係を常に一定に維持することができることから、カメラを上昇させて変更する場合に比べ、部品の搭載精度が低下することを防止できる。   In addition, according to the present invention, when the second component is mounted on the first component positioned above the substrate as described above, the height at which the focal lengths match can be changed without moving the camera itself. Therefore, since the positional relationship between the camera and the mounting head can always be kept constant, it is possible to prevent the component mounting accuracy from being lowered as compared with the case where the camera is raised and changed.

図１は、本発明に係る第１実施形態の電子部品実装装置の制御系を含む概要を示すブロック図、図２はその要部を抽出して示す概略正面図である。なお、以下の説明では、前記図５に示した要素と実質的に同一のものについては同一の符号を使用し、その詳細な説明を省略する。   FIG. 1 is a block diagram showing an outline including a control system of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 2 is a schematic front view showing an essential part extracted. In the following description, the same reference numerals are used for substantially the same elements as those shown in FIG. 5, and detailed descriptions thereof are omitted.

本実施形態の電子部品実装装置においては、図２に示されるように、上流側と下流側の基板搬送装置１０の中間に位置する基板支持装置１２は、搬送方向前方と後方に配設されている基板昇降装置２４により、通常の部品搭載位置（高さ）より下方に移動可能になっている。   In the electronic component mounting apparatus according to the present embodiment, as shown in FIG. 2, the substrate support device 12 positioned between the upstream and downstream substrate transfer devices 10 is disposed forward and backward in the transfer direction. The board lifting / lowering device 24 is movable downward from the normal component mounting position (height).

この基板昇降装置２４は、基板支持装置１２の前端部と後端部をそれぞれ支持する取付け部２４Ａと、これに螺合されているボールねじ２４Ｂと、該ボールねじ２４Ｂを回転させるモータ２４Ｃとを備えている。   The substrate lifting device 24 includes an attachment portion 24A that supports the front end portion and the rear end portion of the substrate support device 12, a ball screw 24B screwed to the mounting portion 24A, and a motor 24C that rotates the ball screw 24B. I have.

本実施形態においては、装置全体を制御するためのＣＰＵ、ＲＡＭ及びＲＯＭ等を含むコントローラ（コンピュータ）３０を備え、該コントローラ３０によりＣＣＤカメラ１８と搭載ヘッド２０を一体でＸ方向、Ｙ方向にそれぞれ移動させるＸ軸モータ３２、Ｙ軸モータ３４、部品Ｐを保持した吸着ノズル２２を上下動させるＺ軸モータ３６、該ノズル２２を軸中心に回転させるθ軸モータ３８、吸着ノズル２２内を負圧にするバキューム機構４０、前記基板昇降装置２４のモータ２４Ｃを駆動する昇降モータドライバ４２が、それぞれ制御されるようになっている。このコントローラ３０には、主記憶装置４４、ディスプレイ４６、キーボード４８Ａ、マウス４８Ｂ等が接続されている。   In the present embodiment, a controller (computer) 30 including a CPU, RAM, ROM and the like for controlling the entire apparatus is provided, and the CCD camera 18 and the mounting head 20 are integrated in the X direction and the Y direction respectively by the controller 30. An X-axis motor 32 to be moved, a Y-axis motor 34, a Z-axis motor 36 for moving the suction nozzle 22 holding the component P up and down, a θ-axis motor 38 for rotating the nozzle 22 around the axis, and a negative pressure in the suction nozzle 22 The vacuum mechanism 40 and the elevating motor driver 42 for driving the motor 24C of the substrate elevating device 24 are controlled. The controller 30 is connected to a main storage device 44, a display 46, a keyboard 48A, a mouse 48B, and the like.

又、本実施形態においては、ＣＣＤカメラ１８に画像処理装置５０が接続され、該カメラ１８から入力される画像信号がＡ／Ｄ変換器５０Ａによりデジタル変換された後、ＣＰＵ５０Ｂにより画像処理され、その結果がメモリ５０Ｃにより記憶されると共に、主記憶装置４４から入力される情報を元に各種演算処理が実行され、その結果をディスプレイ４６に表示することが可能になっている。   In this embodiment, the image processing apparatus 50 is connected to the CCD camera 18, and the image signal input from the camera 18 is digitally converted by the A / D converter 50A, and then the image is processed by the CPU 50B. The results are stored in the memory 50C, and various arithmetic processes are executed based on information input from the main storage device 44, and the results can be displayed on the display 46.

次に、本実施形態の作用を説明する。   Next, the operation of this embodiment will be described.

まず、前記図５に示した従来の場合と同様に、基板Ｓ上に第１部品Ｐ1を搭載し、これを親部品とする。 First, as in the conventional case shown in FIG. 5, the first component P 1 is mounted on the substrate S, and this is used as the parent component.

次いで、基板Ｓ上に搭載された第１部品Ｐ1上に、第２部品Ｐ2を搭載するために、第１部品Ｐ1自体の原点として基準マークの座標をコントローラ３０に教示する。これは予め教示しておいてもよい。 Next, in order to mount the second component P 2 on the first component P 1 mounted on the substrate S, the coordinates of the reference mark are taught to the controller 30 as the origin of the first component P 1 itself. This may be taught in advance.

前述した如く、ＣＣＤカメラ１８は搭載ユニット１６に固定されているため、ＣＣＤカメラ１８の焦点距離Ｈ（ｍｍ）は、基板Ｓの上面に一致し、常に一定となっている。   As described above, since the CCD camera 18 is fixed to the mounting unit 16, the focal length H (mm) of the CCD camera 18 coincides with the upper surface of the substrate S and is always constant.

そこで、図２に示したように高さｈ（ｍｍ）の第１部品Ｐ1が基板Ｓ上に搭載されている場合には、基板昇降装置２４によりこのｈ（ｍｍ）分だけ基板支持装置１２を下降させることにより、該部品Ｐ1の上面にＣＣＤカメラ１８の焦点距離Ｈを一致させる。 Therefore, when the first component P 1 having the height h (mm) is mounted on the substrate S as shown in FIG. 2, the substrate supporting device 12 is provided by the substrate lifting device 24 by the amount corresponding to this h (mm). Is lowered so that the focal length H of the CCD camera 18 coincides with the upper surface of the component P 1 .

次に、ＣＣＤカメラ１８により、図３（Ａ）に拡大して示す第１部品Ｐ1の上面に設けられている基準マークＭを撮像し、画像処理装置５０により画像データとしての濃淡情報を取得し、電子部品実装装置本体における主記憶装置４４に、濃淡情報及び撮像したときのカメラ１８の中心座標を記憶する。 Next, the CCD camera 18 takes an image of the reference mark M provided on the upper surface of the first component P 1 shown enlarged in FIG. 3A, and the image processing apparatus 50 obtains the grayscale information as image data. Then, the density information and the center coordinates of the camera 18 when the image is taken are stored in the main storage device 44 in the electronic component mounting apparatus main body.

次いで、吸着ノズル２２により第２部品Ｐ2を吸着し、既に主記憶装置４４に記憶してある基板Ｓ上に搭載されている第１部品Ｐ1上の基準マークＭの座標に移動し、該基準マークＭの指定された領域を撮像し、前段階の教示で装置メモリ上に格納されている基準マークＭの座標との相関をとり、最も相関値が高い位置を照合位置とする。 Next, the suction nozzle 22 sucks the second component P 2 and moves to the coordinates of the reference mark M on the first component P 1 mounted on the substrate S already stored in the main storage device 44. The designated area of the reference mark M is imaged and correlated with the coordinates of the reference mark M stored in the apparatus memory by the previous teaching, and the position with the highest correlation value is set as the collation position.

その後、吸着ノズル２２に保持されている第２部品Ｐ2は、この照合された基準マークＭの中心座標を基準（原点）として、図３（Ｂ）に示すように予め入力されている座標（ｘ，ｙ）の位置に該第２部品Ｐ2の中心が一致するように搭載する。 After that, the second component P 2 held by the suction nozzle 22 has coordinates (preliminarily input) as shown in FIG. 3B, with the center coordinate of the collated reference mark M as a reference (origin). It is mounted so that the center of the second part P 2 coincides with the position of x, y).

以降、同様の搭載工程では、最初に行なった教示工程の情報に基づいて、第１部品Ｐ1と同種の部品を搭載すると共に、搭載された部品上に第２部品Ｐ2と同種の部品を搭載する。 Thereafter, in the same mounting process, the same type of component as the first component P 1 is mounted based on the information of the teaching process performed first, and the same type of component as the second component P 2 is mounted on the mounted component. Mount.

以上詳述した本実施形態においては、ＸＹ方向の位置精度は基板支持装置１２により維持されており、しかも、ＣＣＤカメラ１８の焦点距離が一致する位置を変更するために、該カメラ１８自体を移動させないようにしていることから、吸着ノズル２２との位置関係を常に一定に保持することが可能となり、部品の搭載精度を向上することが可能となる。   In the present embodiment described above in detail, the positional accuracy in the XY directions is maintained by the substrate support device 12, and the camera 18 itself is moved in order to change the position where the focal length of the CCD camera 18 matches. Therefore, the positional relationship with the suction nozzle 22 can always be kept constant, and the component mounting accuracy can be improved.

以上説明した如く、本実施形態によれば、基板支持装置１２を下降させることにより、基板Ｓ上に搭載されている第１部品の上面に、搭載ヘッド２０に固定されているＣＣＤカメラ１８の焦点を合わせることが可能となる。このように焦点を合わせることにより、第１部品Ｐ1の基準マークＭの認識が可能となることから、基板Ｓ上に第１部品を搭載した後、該基板とは高さが異なる第１部品上に第２部品を高精度に搭載することが可能となる。 As described above, according to the present embodiment, the focus of the CCD camera 18 fixed to the mounting head 20 on the upper surface of the first component mounted on the substrate S is lowered by lowering the substrate support device 12. Can be combined. By focusing in this way, the reference mark M of the first component P 1 can be recognized. Therefore, after mounting the first component on the substrate S, the first component having a height different from that of the substrate is mounted. It becomes possible to mount the second component on the top with high accuracy.

図４には、本発明に係る第２実施形態の電子部品実装装置の要部を示す。   In FIG. 4, the principal part of the electronic component mounting apparatus of 2nd Embodiment which concerns on this invention is shown.

本実施形態の電子部品実装装置は、搭載ユニット１６を保持している、ＸＹ方向に移動が可能な構造体１４自体を、図示しない上昇手段により部品Ｐの厚さ分のｈ（ｍｍ）だけ、前記図５の位置ａより上昇させるようにした以外は、前記第１実施形態と実質的に同一である。   The electronic component mounting apparatus according to the present embodiment is configured so that the structure 14 itself holding the mounting unit 16 and capable of moving in the XY direction is h (mm) corresponding to the thickness of the component P by a lifting means (not shown). The first embodiment is substantially the same as the first embodiment except that the position is raised from the position a in FIG.

これにより、搭載ユニット１６に固定されているＣＣＤカメラ１８から基板Ｓ上に装着されている部品Ｐ1の上面までを、前記第１実施形態の場合と同様に焦点距離Ｈ（ｍｍ）に一致させることが可能となり、第１部品Ｐ1の上面にある基準マークＭを認識し、これを基準として搭載ヘッド２０により第２部品Ｐ2を第１部品Ｐ1上に搭載することが可能となることから、同様の効果を得ることができる。 Thereby, the CCD camera 18 fixed to the mounting unit 16 and the upper surface of the component P 1 mounted on the substrate S are matched with the focal length H (mm) as in the case of the first embodiment. it becomes possible, the reference mark M in the first upper surface of the component P 1 recognizes that it is possible to mount the mounting head 20 which, based on the second part P 2 on a first part P 1 Therefore, the same effect can be obtained.

本発明に係る第１実施形態の電子部品実装装置の概要を示すブロック図The block diagram which shows the outline | summary of the electronic component mounting apparatus of 1st Embodiment which concerns on this invention. 第１実施形態の電子部品実装装置の要部を抽出して示す概略正面図The schematic front view which extracts and shows the principal part of the electronic component mounting apparatus of 1st Embodiment 第１部品と第２部品の関係を模式的に示す平面図A plan view schematically showing the relationship between the first part and the second part 本発明に係る第２実施形態の電子部品実装装置の要部を示す概略正面図The schematic front view which shows the principal part of the electronic component mounting apparatus of 2nd Embodiment which concerns on this invention. 従来の電子部品実装装置の要部を示す概略正面図Schematic front view showing the main part of a conventional electronic component mounting apparatus

符号の説明Explanation of symbols

１０…基板搬送装置
１２…基板支持装置
１４…構造体
１６…搭載ユニット
１８…ＣＣＤカメラ
２０…搭載ヘッド
２２…吸着ノズル
２４…基板昇降装置
２４Ａ…取付け部
２４Ｂ…ボールねじ
２４Ｃ…モータ
３０…コントローラ
Ｓ…基板
Ｐ…部品
Ｐ1…第１部品
Ｐ2…第２部品 DESCRIPTION OF SYMBOLS 10 ... Board | substrate conveyance apparatus 12 ... Board | substrate support apparatus 14 ... Structure 16 ... Mounting unit 18 ... CCD camera 20 ... Mounting head 22 ... Adsorption nozzle 24 ... Substrate raising / lowering device 24A ... Mounting part 24B ... Ball screw 24C ... Motor 30 ... Controller S ... Board P ... Part P 1 ... First part P 2 ... Second part

Claims (1)

部品搭載用の基板を位置決めし、支持する基板支持装置と、
支持された基板の上面に焦点距離が一致され、該基板上面の基準位置を画像認識可能に設定された基板認識カメラと、
該カメラにより画像認識した基準位置に基づいて、ノズルに保持された部品を基板上の所定位置に搭載する搭載ヘッドと、
該搭載ヘッド及び前記基板認識カメラを一体で平面方向に移動させる構造体とを備えている部品搭載装置において、
前記基板支持装置を下降させる下降手段又は前記構造体を上昇させる上昇手段のいずれか一方を備え、
下降手段又は上昇手段を駆動させ、前記基板支持装置に支持されている基板の上面より上方の任意高さ位置に、前記基板認識カメラの焦点距離を一致させることを可能にしたことを特徴とする部品搭載装置。 A substrate support device for positioning and supporting a component mounting substrate;
A substrate recognition camera in which the focal length coincides with the upper surface of the supported substrate and the reference position of the upper surface of the substrate is set so as to enable image recognition;
A mounting head for mounting a component held by the nozzle at a predetermined position on the substrate based on the reference position recognized by the camera;
In the component mounting apparatus comprising the mounting head and the structure for moving the board recognition camera integrally in a plane direction,
Either one of a lowering means for lowering the substrate support device or a raising means for raising the structure,
The lowering means or the raising means is driven, and the focal length of the substrate recognition camera can be made to coincide with an arbitrary height position above the upper surface of the substrate supported by the substrate supporting device. Component mounting device.
JP2005109216A 2005-04-05 2005-04-05 Component mounting device Expired - Fee Related JP4587861B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005109216A JP4587861B2 (en) 2005-04-05 2005-04-05 Component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005109216A JP4587861B2 (en) 2005-04-05 2005-04-05 Component mounting device

Publications (2)

Publication Number Publication Date
JP2006294655A true JP2006294655A (en) 2006-10-26
JP4587861B2 JP4587861B2 (en) 2010-11-24

Family

ID=37414936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005109216A Expired - Fee Related JP4587861B2 (en) 2005-04-05 2005-04-05 Component mounting device

Country Status (1)

Country Link
JP (1) JP4587861B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573440A (en) * 2010-12-28 2012-07-11 富士机械制造株式会社 Electronic device installing machine and electronic device distribution method
JP2013545259A (en) * 2010-09-15 2013-12-19 マイクロニック マイデータ アーベー Method and apparatus for generating a pattern on a workpiece

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423198U (en) * 1990-06-15 1992-02-26
JP2001203500A (en) * 2000-01-21 2001-07-27 Yamaha Motor Co Ltd Operation device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423198U (en) * 1990-06-15 1992-02-26
JP2001203500A (en) * 2000-01-21 2001-07-27 Yamaha Motor Co Ltd Operation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013545259A (en) * 2010-09-15 2013-12-19 マイクロニック マイデータ アーベー Method and apparatus for generating a pattern on a workpiece
US9648795B2 (en) 2010-09-15 2017-05-09 Mycronic AB Pick-and-place tool
CN102573440A (en) * 2010-12-28 2012-07-11 富士机械制造株式会社 Electronic device installing machine and electronic device distribution method
JP2012142378A (en) * 2010-12-28 2012-07-26 Fuji Mach Mfg Co Ltd Electronic component mounting machine and electronic component assignment method

Also Published As

Publication number Publication date
JP4587861B2 (en) 2010-11-24

Similar Documents

Publication Publication Date Title
JP6166069B2 (en) Die bonder and collet position adjustment method
JP5318334B2 (en) Method and apparatus for detecting position of object
JP2009044044A (en) Method and apparatus for mounting electronic-component
JP4809799B2 (en) Mounting machine, mounting method thereof, and moving method of board imaging means in mounting machine
JP4943300B2 (en) Component mounting equipment
CN101666957A (en) Automatic focal point regulation process in imaging apparatus
US20130276989A1 (en) Paste applying apparatus and paste applying method, and die bonder
JP4587861B2 (en) Component mounting device
JP2009117488A (en) Component mounting device and component suction method and component mounting method
JP2009010167A (en) Part transfer equipment
JP6475264B2 (en) Component mounter
JP5145200B2 (en) Component mounting apparatus and component mounting method
JP2011161395A (en) Apparatus and method for discharging droplet
JP4927776B2 (en) Component mounting method
JP2007266330A (en) Electronic component mounter and mounting method
JP6753744B2 (en) Board work equipment
JP5100484B2 (en) Automatic focus adjustment method
JP2011258875A (en) Method for mounting component of component mounting device and component mounting device
JP4713287B2 (en) Electronic component mounting apparatus and mounting method
JP4704218B2 (en) Component recognition method, apparatus and surface mounter
JP4421987B2 (en) Component mounting method and component mounting apparatus
JP6621639B2 (en) Image processing apparatus for substrates
JP2872765B2 (en) Chip component mounting device
JPH07162200A (en) Method and apparatus for mounting electronic part
JP2005093490A (en) Part mounting method, device, and method of recognizing position of part

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080327

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100513

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100518

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100720

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100817

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100907

R150 Certificate of patent or registration of utility model

Ref document number: 4587861

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130917

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees