JP2006294655A - Component mounting apparatus - Google Patents

Component mounting apparatus Download PDF

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JP2006294655A
JP2006294655A JP2005109216A JP2005109216A JP2006294655A JP 2006294655 A JP2006294655 A JP 2006294655A JP 2005109216 A JP2005109216 A JP 2005109216A JP 2005109216 A JP2005109216 A JP 2005109216A JP 2006294655 A JP2006294655 A JP 2006294655A
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substrate
component
mounting
camera
component mounting
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JP4587861B2 (en
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Kimihiko Hiroi
公彦 廣井
Tsutomu Kataigi
勉 片居木
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Juki Corp
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Juki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To correctly position a second component and mount it on a first component mounted on a substrate. <P>SOLUTION: A component mounting apparatus is provided with: a substrate supporting device 12 for positioning and supporting a substrate S for mounting a component; a substrate recognizing camera 18 in which its focal distance H matches the top surface of the supported substrate S and a reference position on the top surface of the substrate is set, so that image can be recognized; a transfer head 20 for transferring a component held with a nozzle 22 to a predetermined position on the substrate, on the basis of the reference position whose image is recognized with the camera; and a structure 14 for integrally moving the transfer head 20 and the camera 18 in a plane direction. The apparatus is provided with a lowering means 24 for lowering the device 12. The apparatus drives the lowering means 24 to enable the focal distance H of the camera 18 to match the top surface of a first component P<SB>1</SB>on the upper part than the top surface of the substrate S supported by the device 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、部品搭載装置、特に配線基板上に電子部品を重ねて搭載する際に適用して好適な部品搭載装置に関する。   The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus suitable for application when electronic components are stacked and mounted on a wiring board.

一般に、電子部品を配線基板に搭載する際には、電子部品実装装置が用いられている(例えば、特許文献1参照)。   Generally, when mounting an electronic component on a wiring board, an electronic component mounting apparatus is used (see, for example, Patent Document 1).

従来の電子部品実装装置は、図5に概要を示すように、基板搬送装置10により部品搭載用の基板Sを矢印方向に搬送し、その一部を構成する基板支持装置12上に位置決めし、固定・支持する。その後、上方に配設されている構造体14に支持され、XY方向に移動自在な搭載ユニット16に固定されているCCDカメラ18により、部品を搭載する際の指標とする基板S上のXY方向の絶対座標としての基準マークを認識した後、同ユニット16に固定されている搭載ヘッド20に上下動と軸中心回転とが可能に取付けられている吸着ノズル22により電子部品Pを保持し、保持された電子部品Pを図示しない認識機能カメラにより画像認識したり、図示しないレーザ認識装置により位置認識して、該保持部品の位置決めを行なった後、該部品Pを二次元的に移動させ、基板S上の所定座標位置に搭載する。以上の動作により目的とする全部品を搭載後、基板Sを更に矢印方向に搬送し、搭載作業が終了する。   As shown in FIG. 5, the conventional electronic component mounting apparatus conveys a component mounting board S in the direction of an arrow by the board carrying apparatus 10, and positions the board on a board supporting apparatus 12 constituting a part thereof. Fix and support. Thereafter, the CCD camera 18 supported by the structure 14 disposed above and fixed to the mounting unit 16 movable in the XY directions is used as an index for mounting components on the substrate S in the XY directions. After recognizing the reference mark as an absolute coordinate of the electronic component P, the electronic component P is held and held by the suction nozzle 22 attached to the mounting head 20 fixed to the unit 16 so as to be able to move up and down and rotate around the axis. The recognized electronic component P is image-recognized by a recognition function camera (not shown) or position-recognized by a laser recognition device (not shown) to position the holding component, and then the component P is moved two-dimensionally to form a substrate. Mounted at a predetermined coordinate position on S. After mounting all the desired components by the above operation, the substrate S is further transported in the direction of the arrow, and the mounting operation is completed.

なお、前記構造体14は、便宜上簡略化して図示してあるが、搭載ユニット16をX方向に移動させるX駆動ガイドと、該ガイドと搭載ユニット16を一体でY軸方向に移動させるY駆動ガイドを備えた構成になっている。   Although the structure 14 is illustrated in a simplified manner for convenience, an X drive guide for moving the mounting unit 16 in the X direction, and a Y drive guide for moving the guide and the mounting unit 16 in the Y-axis direction integrally. It has a configuration with.

特開2003−258497号公報JP 2003-258497 A

しかしながら、前記図5に併記したように、従来の電子部品実装装置では、CCDカメラ18が搭載ユニット16に固定されているために、該CCDカメラ18の焦点距離Hが一致する高さは、基板支持装置12に支持されている基板Sの上面に固定されている。従って、基板S上に搭載されている第1部品の上に、更に第2部品を重ねて搭載したいという要請があった場合には、CCDカメラ18の焦点距離Hが基板S上の第1部品の上面に一致していないために、該部品上に設けられている基準マークの位置を認識できないことになり、結果として第1部品上には正確な位置に第2部品を搭載することができないという問題がある。   However, as shown in FIG. 5, in the conventional electronic component mounting apparatus, since the CCD camera 18 is fixed to the mounting unit 16, the height at which the focal lengths H of the CCD camera 18 coincide is the substrate. It is fixed to the upper surface of the substrate S supported by the support device 12. Therefore, when there is a request for mounting a second component on the first component mounted on the substrate S, the focal length H of the CCD camera 18 is set to the first component on the substrate S. The position of the reference mark provided on the component cannot be recognized, and as a result, the second component cannot be mounted at an accurate position on the first component. There is a problem.

本発明は、前記従来の問題点を解決するべくなされたもので、基板上に搭載された第1部品の上に、更に第2部品を重ねて搭載する際に、該第2部品を第1部品上に正確に位置決めして搭載することができる部品搭載装置を提供することを課題とする。   The present invention has been made to solve the above-described conventional problems. When the second component is further stacked on the first component mounted on the substrate, the second component is replaced with the first component. It is an object of the present invention to provide a component mounting apparatus that can be accurately positioned and mounted on a component.

本発明は、部品搭載用の基板を位置決めし、支持する基板支持装置と共に、支持された基板の上面に焦点距離が一致され、該基板上面の基準位置を画像認識可能に設定された基板認識カメラと、該カメラにより画像認識した基準位置に基づいて、ノズルに保持された部品を基板上の所定位置に搭載する搭載ヘッドと、該搭載ヘッド及び前記基板認識カメラを一体で平面方向に移動させる構造体とを備えている部品搭載装置において、前記基板支持装置を下降させる下降手段又は前記構造体を上昇させる上昇手段のいずれか一方を備え、下降手段又は上昇手段を駆動させ、前記基板支持装置に支持されている基板の上面より上方の任意高さ位置に、前記基板認識カメラの焦点距離を一致させることを可能にしたことにより、前記課題を解決したものである。   The present invention relates to a substrate recognition camera in which a focal length is matched to the upper surface of a supported substrate and a reference position on the upper surface of the substrate is set so that an image can be recognized together with a substrate support device that positions and supports a component mounting substrate. A mounting head for mounting the component held by the nozzle at a predetermined position on the substrate based on the reference position recognized by the camera, and a structure for moving the mounting head and the substrate recognition camera integrally in a plane direction In the component mounting apparatus comprising a body, the substrate mounting apparatus includes either a lowering unit that lowers the substrate support device or a lifting unit that raises the structure, and drives the lowering unit or the lifting unit to The above problem has been solved by making it possible to match the focal length of the substrate recognition camera to an arbitrary height position above the upper surface of the supported substrate. Than it is.

本発明によれば、基板を支持している基板支持装置を下降させるか、又は、基板認識カメラ等を平面方向に移動させる構造体を上昇させるかにより、予め基板上面に一致されていた該カメラの焦点距離を、該基板の上面より上方の任意高さ位置に一致させることを可能としたので、基板上に第1部品を搭載した後、その焦点距離を該部品の上面に一致させることが可能となる。従って、前記カメラにより第1部品の上面に設けられている部品用基準マーク(原点)を画像認識することが可能となるため、該部品上の正確な位置に第2部品を搭載することが可能となる。   According to the present invention, the camera previously matched with the upper surface of the substrate by lowering the substrate supporting device supporting the substrate or raising the structure for moving the substrate recognition camera or the like in the plane direction. It is possible to make the focal length coincide with the arbitrary height position above the upper surface of the substrate, so that after the first component is mounted on the substrate, the focal length can coincide with the upper surface of the component. It becomes possible. Accordingly, the camera can recognize the image of the component reference mark (origin) provided on the upper surface of the first component, so that the second component can be mounted at an accurate position on the component. It becomes.

又、本発明によれば、上記のように基板より上方に位置する第1部品の上に第2部品を搭載する際、カメラ自体を動かさずに焦点距離が一致する高さを変更することが可能となるため、カメラと搭載ヘッドの位置関係を常に一定に維持することができることから、カメラを上昇させて変更する場合に比べ、部品の搭載精度が低下することを防止できる。   In addition, according to the present invention, when the second component is mounted on the first component positioned above the substrate as described above, the height at which the focal lengths match can be changed without moving the camera itself. Therefore, since the positional relationship between the camera and the mounting head can always be kept constant, it is possible to prevent the component mounting accuracy from being lowered as compared with the case where the camera is raised and changed.

図1は、本発明に係る第1実施形態の電子部品実装装置の制御系を含む概要を示すブロック図、図2はその要部を抽出して示す概略正面図である。なお、以下の説明では、前記図5に示した要素と実質的に同一のものについては同一の符号を使用し、その詳細な説明を省略する。   FIG. 1 is a block diagram showing an outline including a control system of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 2 is a schematic front view showing an essential part extracted. In the following description, the same reference numerals are used for substantially the same elements as those shown in FIG. 5, and detailed descriptions thereof are omitted.

本実施形態の電子部品実装装置においては、図2に示されるように、上流側と下流側の基板搬送装置10の中間に位置する基板支持装置12は、搬送方向前方と後方に配設されている基板昇降装置24により、通常の部品搭載位置(高さ)より下方に移動可能になっている。   In the electronic component mounting apparatus according to the present embodiment, as shown in FIG. 2, the substrate support device 12 positioned between the upstream and downstream substrate transfer devices 10 is disposed forward and backward in the transfer direction. The board lifting / lowering device 24 is movable downward from the normal component mounting position (height).

この基板昇降装置24は、基板支持装置12の前端部と後端部をそれぞれ支持する取付け部24Aと、これに螺合されているボールねじ24Bと、該ボールねじ24Bを回転させるモータ24Cとを備えている。   The substrate lifting device 24 includes an attachment portion 24A that supports the front end portion and the rear end portion of the substrate support device 12, a ball screw 24B screwed to the mounting portion 24A, and a motor 24C that rotates the ball screw 24B. I have.

本実施形態においては、装置全体を制御するためのCPU、RAM及びROM等を含むコントローラ(コンピュータ)30を備え、該コントローラ30によりCCDカメラ18と搭載ヘッド20を一体でX方向、Y方向にそれぞれ移動させるX軸モータ32、Y軸モータ34、部品Pを保持した吸着ノズル22を上下動させるZ軸モータ36、該ノズル22を軸中心に回転させるθ軸モータ38、吸着ノズル22内を負圧にするバキューム機構40、前記基板昇降装置24のモータ24Cを駆動する昇降モータドライバ42が、それぞれ制御されるようになっている。このコントローラ30には、主記憶装置44、ディスプレイ46、キーボード48A、マウス48B等が接続されている。   In the present embodiment, a controller (computer) 30 including a CPU, RAM, ROM and the like for controlling the entire apparatus is provided, and the CCD camera 18 and the mounting head 20 are integrated in the X direction and the Y direction respectively by the controller 30. An X-axis motor 32 to be moved, a Y-axis motor 34, a Z-axis motor 36 for moving the suction nozzle 22 holding the component P up and down, a θ-axis motor 38 for rotating the nozzle 22 around the axis, and a negative pressure in the suction nozzle 22 The vacuum mechanism 40 and the elevating motor driver 42 for driving the motor 24C of the substrate elevating device 24 are controlled. The controller 30 is connected to a main storage device 44, a display 46, a keyboard 48A, a mouse 48B, and the like.

又、本実施形態においては、CCDカメラ18に画像処理装置50が接続され、該カメラ18から入力される画像信号がA/D変換器50Aによりデジタル変換された後、CPU50Bにより画像処理され、その結果がメモリ50Cにより記憶されると共に、主記憶装置44から入力される情報を元に各種演算処理が実行され、その結果をディスプレイ46に表示することが可能になっている。   In this embodiment, the image processing apparatus 50 is connected to the CCD camera 18, and the image signal input from the camera 18 is digitally converted by the A / D converter 50A, and then the image is processed by the CPU 50B. The results are stored in the memory 50C, and various arithmetic processes are executed based on information input from the main storage device 44, and the results can be displayed on the display 46.

次に、本実施形態の作用を説明する。   Next, the operation of this embodiment will be described.

まず、前記図5に示した従来の場合と同様に、基板S上に第1部品P1を搭載し、これを親部品とする。 First, as in the conventional case shown in FIG. 5, the first component P 1 is mounted on the substrate S, and this is used as the parent component.

次いで、基板S上に搭載された第1部品P1上に、第2部品P2を搭載するために、第1部品P1自体の原点として基準マークの座標をコントローラ30に教示する。これは予め教示しておいてもよい。 Next, in order to mount the second component P 2 on the first component P 1 mounted on the substrate S, the coordinates of the reference mark are taught to the controller 30 as the origin of the first component P 1 itself. This may be taught in advance.

前述した如く、CCDカメラ18は搭載ユニット16に固定されているため、CCDカメラ18の焦点距離H(mm)は、基板Sの上面に一致し、常に一定となっている。   As described above, since the CCD camera 18 is fixed to the mounting unit 16, the focal length H (mm) of the CCD camera 18 coincides with the upper surface of the substrate S and is always constant.

そこで、図2に示したように高さh(mm)の第1部品P1が基板S上に搭載されている場合には、基板昇降装置24によりこのh(mm)分だけ基板支持装置12を下降させることにより、該部品P1の上面にCCDカメラ18の焦点距離Hを一致させる。 Therefore, when the first component P 1 having the height h (mm) is mounted on the substrate S as shown in FIG. 2, the substrate supporting device 12 is provided by the substrate lifting device 24 by the amount corresponding to this h (mm). Is lowered so that the focal length H of the CCD camera 18 coincides with the upper surface of the component P 1 .

次に、CCDカメラ18により、図3(A)に拡大して示す第1部品P1の上面に設けられている基準マークMを撮像し、画像処理装置50により画像データとしての濃淡情報を取得し、電子部品実装装置本体における主記憶装置44に、濃淡情報及び撮像したときのカメラ18の中心座標を記憶する。 Next, the CCD camera 18 takes an image of the reference mark M provided on the upper surface of the first component P 1 shown enlarged in FIG. 3A, and the image processing apparatus 50 obtains the grayscale information as image data. Then, the density information and the center coordinates of the camera 18 when the image is taken are stored in the main storage device 44 in the electronic component mounting apparatus main body.

次いで、吸着ノズル22により第2部品P2を吸着し、既に主記憶装置44に記憶してある基板S上に搭載されている第1部品P1上の基準マークMの座標に移動し、該基準マークMの指定された領域を撮像し、前段階の教示で装置メモリ上に格納されている基準マークMの座標との相関をとり、最も相関値が高い位置を照合位置とする。 Next, the suction nozzle 22 sucks the second component P 2 and moves to the coordinates of the reference mark M on the first component P 1 mounted on the substrate S already stored in the main storage device 44. The designated area of the reference mark M is imaged and correlated with the coordinates of the reference mark M stored in the apparatus memory by the previous teaching, and the position with the highest correlation value is set as the collation position.

その後、吸着ノズル22に保持されている第2部品P2は、この照合された基準マークMの中心座標を基準(原点)として、図3(B)に示すように予め入力されている座標(x,y)の位置に該第2部品P2の中心が一致するように搭載する。 After that, the second component P 2 held by the suction nozzle 22 has coordinates (preliminarily input) as shown in FIG. 3B, with the center coordinate of the collated reference mark M as a reference (origin). It is mounted so that the center of the second part P 2 coincides with the position of x, y).

以降、同様の搭載工程では、最初に行なった教示工程の情報に基づいて、第1部品P1と同種の部品を搭載すると共に、搭載された部品上に第2部品P2と同種の部品を搭載する。 Thereafter, in the same mounting process, the same type of component as the first component P 1 is mounted based on the information of the teaching process performed first, and the same type of component as the second component P 2 is mounted on the mounted component. Mount.

以上詳述した本実施形態においては、XY方向の位置精度は基板支持装置12により維持されており、しかも、CCDカメラ18の焦点距離が一致する位置を変更するために、該カメラ18自体を移動させないようにしていることから、吸着ノズル22との位置関係を常に一定に保持することが可能となり、部品の搭載精度を向上することが可能となる。   In the present embodiment described above in detail, the positional accuracy in the XY directions is maintained by the substrate support device 12, and the camera 18 itself is moved in order to change the position where the focal length of the CCD camera 18 matches. Therefore, the positional relationship with the suction nozzle 22 can always be kept constant, and the component mounting accuracy can be improved.

以上説明した如く、本実施形態によれば、基板支持装置12を下降させることにより、基板S上に搭載されている第1部品の上面に、搭載ヘッド20に固定されているCCDカメラ18の焦点を合わせることが可能となる。このように焦点を合わせることにより、第1部品P1の基準マークMの認識が可能となることから、基板S上に第1部品を搭載した後、該基板とは高さが異なる第1部品上に第2部品を高精度に搭載することが可能となる。 As described above, according to the present embodiment, the focus of the CCD camera 18 fixed to the mounting head 20 on the upper surface of the first component mounted on the substrate S is lowered by lowering the substrate support device 12. Can be combined. By focusing in this way, the reference mark M of the first component P 1 can be recognized. Therefore, after mounting the first component on the substrate S, the first component having a height different from that of the substrate is mounted. It becomes possible to mount the second component on the top with high accuracy.

図4には、本発明に係る第2実施形態の電子部品実装装置の要部を示す。   In FIG. 4, the principal part of the electronic component mounting apparatus of 2nd Embodiment which concerns on this invention is shown.

本実施形態の電子部品実装装置は、搭載ユニット16を保持している、XY方向に移動が可能な構造体14自体を、図示しない上昇手段により部品Pの厚さ分のh(mm)だけ、前記図5の位置aより上昇させるようにした以外は、前記第1実施形態と実質的に同一である。   The electronic component mounting apparatus according to the present embodiment is configured so that the structure 14 itself holding the mounting unit 16 and capable of moving in the XY direction is h (mm) corresponding to the thickness of the component P by a lifting means (not shown). The first embodiment is substantially the same as the first embodiment except that the position is raised from the position a in FIG.

これにより、搭載ユニット16に固定されているCCDカメラ18から基板S上に装着されている部品P1の上面までを、前記第1実施形態の場合と同様に焦点距離H(mm)に一致させることが可能となり、第1部品P1の上面にある基準マークMを認識し、これを基準として搭載ヘッド20により第2部品P2を第1部品P1上に搭載することが可能となることから、同様の効果を得ることができる。 Thereby, the CCD camera 18 fixed to the mounting unit 16 and the upper surface of the component P 1 mounted on the substrate S are matched with the focal length H (mm) as in the case of the first embodiment. it becomes possible, the reference mark M in the first upper surface of the component P 1 recognizes that it is possible to mount the mounting head 20 which, based on the second part P 2 on a first part P 1 Therefore, the same effect can be obtained.

本発明に係る第1実施形態の電子部品実装装置の概要を示すブロック図The block diagram which shows the outline | summary of the electronic component mounting apparatus of 1st Embodiment which concerns on this invention. 第1実施形態の電子部品実装装置の要部を抽出して示す概略正面図The schematic front view which extracts and shows the principal part of the electronic component mounting apparatus of 1st Embodiment 第1部品と第2部品の関係を模式的に示す平面図A plan view schematically showing the relationship between the first part and the second part 本発明に係る第2実施形態の電子部品実装装置の要部を示す概略正面図The schematic front view which shows the principal part of the electronic component mounting apparatus of 2nd Embodiment which concerns on this invention. 従来の電子部品実装装置の要部を示す概略正面図Schematic front view showing the main part of a conventional electronic component mounting apparatus

符号の説明Explanation of symbols

10…基板搬送装置
12…基板支持装置
14…構造体
16…搭載ユニット
18…CCDカメラ
20…搭載ヘッド
22…吸着ノズル
24…基板昇降装置
24A…取付け部
24B…ボールねじ
24C…モータ
30…コントローラ
S…基板
P…部品
1…第1部品
2…第2部品
DESCRIPTION OF SYMBOLS 10 ... Board | substrate conveyance apparatus 12 ... Board | substrate support apparatus 14 ... Structure 16 ... Mounting unit 18 ... CCD camera 20 ... Mounting head 22 ... Adsorption nozzle 24 ... Substrate raising / lowering device 24A ... Mounting part 24B ... Ball screw 24C ... Motor 30 ... Controller S ... Board P ... Part P 1 ... First part P 2 ... Second part

Claims (1)

部品搭載用の基板を位置決めし、支持する基板支持装置と、
支持された基板の上面に焦点距離が一致され、該基板上面の基準位置を画像認識可能に設定された基板認識カメラと、
該カメラにより画像認識した基準位置に基づいて、ノズルに保持された部品を基板上の所定位置に搭載する搭載ヘッドと、
該搭載ヘッド及び前記基板認識カメラを一体で平面方向に移動させる構造体とを備えている部品搭載装置において、
前記基板支持装置を下降させる下降手段又は前記構造体を上昇させる上昇手段のいずれか一方を備え、
下降手段又は上昇手段を駆動させ、前記基板支持装置に支持されている基板の上面より上方の任意高さ位置に、前記基板認識カメラの焦点距離を一致させることを可能にしたことを特徴とする部品搭載装置。
A substrate support device for positioning and supporting a component mounting substrate;
A substrate recognition camera in which the focal length coincides with the upper surface of the supported substrate and the reference position of the upper surface of the substrate is set so as to enable image recognition;
A mounting head for mounting a component held by the nozzle at a predetermined position on the substrate based on the reference position recognized by the camera;
In the component mounting apparatus comprising the mounting head and the structure for moving the board recognition camera integrally in a plane direction,
Either one of a lowering means for lowering the substrate support device or a raising means for raising the structure,
The lowering means or the raising means is driven, and the focal length of the substrate recognition camera can be made to coincide with an arbitrary height position above the upper surface of the substrate supported by the substrate supporting device. Component mounting device.
JP2005109216A 2005-04-05 2005-04-05 Component mounting device Expired - Fee Related JP4587861B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573440A (en) * 2010-12-28 2012-07-11 富士机械制造株式会社 Electronic device installing machine and electronic device distribution method
JP2013545259A (en) * 2010-09-15 2013-12-19 マイクロニック マイデータ アーベー Method and apparatus for generating a pattern on a workpiece

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423198U (en) * 1990-06-15 1992-02-26
JP2001203500A (en) * 2000-01-21 2001-07-27 Yamaha Motor Co Ltd Operation device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423198U (en) * 1990-06-15 1992-02-26
JP2001203500A (en) * 2000-01-21 2001-07-27 Yamaha Motor Co Ltd Operation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013545259A (en) * 2010-09-15 2013-12-19 マイクロニック マイデータ アーベー Method and apparatus for generating a pattern on a workpiece
US9648795B2 (en) 2010-09-15 2017-05-09 Mycronic AB Pick-and-place tool
CN102573440A (en) * 2010-12-28 2012-07-11 富士机械制造株式会社 Electronic device installing machine and electronic device distribution method
JP2012142378A (en) * 2010-12-28 2012-07-26 Fuji Mach Mfg Co Ltd Electronic component mounting machine and electronic component assignment method

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