JP4884032B2 - Nozzle type recognition control method and component mounting apparatus - Google Patents

Description

  The present invention relates to a nozzle type recognition control method and a component mounting apparatus for recognizing the type of a suction nozzle that sucks a component.

  2. Description of the Related Art Conventionally, an electronic component mounting apparatus (hereinafter, referred to as “component board”) that automatically mounts chip-shaped electronic components (hereinafter simply referred to as “components”) on a circuit board (hereinafter simply referred to as “substrate”) that is carried into the apparatus. Simply “component mounting device”). The component mounting apparatus includes an adsorption nozzle, and the adsorption nozzle absorbs the component from the component supply apparatus and mounts it on the substrate.

In the component mounting apparatus described above, a technique is used that includes a nozzle station that accommodates a plurality of suction nozzles and uses the suction nozzles according to the components. (For example, refer to Patent Document 1.)
The suction nozzle is mounted on a work head that can move at least in the X-axis and Y-axis directions. In addition, in order to confirm that this mounting is correctly performed, a technique for recognizing the negative pressure when vacuuming the suction nozzle, the shape of the nozzle suction port, and the like is known.

Since most of the components mounted on the substrate are minute components, the component work head is provided with a spring in order to absorb an impact caused by contact between the suction nozzle and the component. The spring is disposed above the suction nozzle in the working head, but there is a case where another spring is built in the suction nozzle.
JP 2001-345543 A (paragraph [0032], FIG. 1)

  By the way, since the component mounting apparatus holds a plurality of suction nozzles in the nozzle station as described above and uses the suction nozzles according to the components, there are cases where unintended suction nozzles are mounted. Thus, if the structure of the suction nozzle is different, the impact on the component at the time of component suction will also change.

  Here, as an example in which the impact on the parts is remarkably different, there is a difference in structure as to whether or not a spring is built in the suction nozzle as described above. This is because when the suction nozzle has a built-in spring, it is particularly easy to absorb an impact caused by contact with a component during component suction. Note that whether or not the spring is built in the suction nozzle could not be recognized by the negative pressure at the time of vacuuming the conventional suction nozzle, the shape of the nozzle suction port, or the like.

When the impact applied to the components as described above increases, the suction posture of the components by the suction nozzle becomes unstable, and the mounting accuracy of the components on the board has deteriorated.
In view of the above-described conventional situation, an object of the present invention is to provide a nozzle type recognition control method and a component mounting apparatus that increase component mounting accuracy.

  In order to solve the above-described problem, the nozzle type recognition control method of the present invention is a component type device that automatically mounts components on a substrate, and is a nozzle type that recognizes the type of suction nozzle that is mounted on a work head and sucks components. A recognition control method, comprising: a recognition step of recognizing a type of suction nozzle in a state of being attached to the work head; and a control step of controlling displacement of the suction nozzle according to the recognized type of suction nozzle. Like that.

  According to the above configuration, by controlling the displacement of the suction nozzle according to the recognized type of the suction nozzle, the suction is performed in consideration of the change in the impact on the component at the time of part suction due to the difference in the structure of the suction nozzle. The displacement of the nozzle can be controlled. Therefore, it is possible to suppress a change in impact to the component at the time of component adsorption and to stabilize the component adsorption posture.

Preferably, the control step controls a displacement speed of the suction nozzle in the Z-axis direction according to the recognized kind of the suction nozzle.
According to the above configuration, by controlling the displacement speed of the suction nozzle in the Z-axis direction according to the recognized type of suction nozzle, it is possible to effectively suppress a change in impact to the component during component suction.

Preferably, the recognition step recognizes the type of the suction nozzle by imaging the suction nozzle.
Preferably, the recognition step recognizes whether or not a spring is built in the suction nozzle.

According to the above configuration, it is possible to suppress a change in impact on the component when the component is sucked in consideration of whether or not the spring is significantly different in the structure of the suction nozzle.
Preferably, the recognition step recognizes whether or not a spring is built in the suction nozzle based on the presence or absence of the counterbore of the suction nozzle.

  In order to solve the above-described problems, a component mounting apparatus according to the present invention includes a suction nozzle that is mounted on a work head and sucks a component, a recognition unit that recognizes the type of the suction nozzle, and a control that controls the displacement of the suction nozzle. The recognition means recognizes the type of suction nozzle in a state of being mounted on the work head, and the control means determines the suction according to the recognized suction nozzle type. The displacement of the nozzle is controlled.

  Preferably, the control means is configured to control a displacement speed of the suction nozzle in the Z-axis direction according to the recognized kind of the suction nozzle.

  In the present invention, by controlling the displacement of the suction nozzle according to the type of the suction nozzle recognized in the state of being mounted on the work head, the impact on the component at the time of component suction due to the structure being different for each suction nozzle The speed and position of the suction nozzle can be controlled in consideration of changes in Therefore, it is possible to suppress a change in impact to the component at the time of component adsorption and to stabilize the component adsorption posture. Therefore, according to the present invention, the component mounting accuracy can be increased.

  In addition, by controlling the displacement speed of the suction nozzle in the Z-axis direction according to the recognized suction nozzle type, if the suction nozzle easily absorbs an impact, the displacement speed in the Z-axis direction is set high. While mounting efficiency can be improved, the change of the impact to the component at the time of component adsorption | suction can be suppressed effectively, and component mounting accuracy can be raised more.

  In addition, for example, by recognizing whether or not the suction nozzle has a built-in spring based on whether or not the suction nozzle is countersunk, it is necessary to take into account the presence or absence of a spring having a significantly different structure of the suction nozzle. It is possible to suppress a change in impact to the component at the time of suction, and to further improve the component mounting accuracy.

Hereinafter, a nozzle type recognition control method and a component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1A is an external perspective view showing a component mounting apparatus according to an embodiment of the present invention, and FIG. 1B is a perspective view schematically showing an internal configuration by removing upper and lower protective covers of the component mounting. is there.

  As shown in FIG. 1A, the component mounting device 1 includes a monitor device 2 and 2 each composed of a CRT display before and after the ceiling cover, and alarm lamps 3 for notifying the operation state on the left and right on the ceiling cover, respectively. 3 is provided. In addition, on the front and rear surfaces of the upper protective cover 4, a small display input panel 5, which is composed of a liquid crystal display and a touch input device and can input various instructions by an external operation, is disposed. (The display input panel 5 at the rear, which is diagonally upward to the right in the figure, is shaded and cannot be seen).

  On the lower base 6, a pair of parallel and fixed substrate guide rails 7 in the center are arranged in the center in the conveying direction (X-axis direction) of the printed circuit board (hereinafter simply referred to as “substrate”) 8 shown in FIG. 1B. , Extending horizontally from the diagonally lower right to the diagonally upper left). In addition, a loop-shaped transport belt (conveyor belt) that is not visible in the drawing is disposed so as to be in contact with the lower portion of the board guide rails 7.

  The conveyor belt is driven by a belt drive motor (not shown) with the side of the belt having a width of several millimeters seen from below the substrate guide rail 7 into the substrate conveyance path, and runs in the substrate conveyance direction. The board 8 before component mounting is carried into the apparatus main body from the upstream side of the line while being supported from below, and the boards 8 on which the components are mounted are sequentially discharged downstream of the line. In the component mounting apparatus 1, two substrates 8 are always carried in, positioned, and fixed until the component mounting is completed.

  Electronic component supply bases 9 are respectively formed on the front and rear sides of the base 6 (in FIG. 1A, the rear electronic component supply base 9 which is obliquely upward to the right in the drawing is hidden and cannot be seen. The illustration of the rear electronic component supply base 9 is omitted). The electronic component supply base 9 is provided with a large number of tape cassette type electronic component supply devices 10.

  In addition, above the base 6, there are four X-axis rails 11 and two X-axis rails 11 on the two X-axis rails 11, respectively. A total of two Y-axis rails 12 that are slidably supported in an obliquely upward direction) are arranged on the left and right.

  On each of the four X-axis rails 11, one work head support tower 13 is suspended so as to be slidable in the X-axis direction. That is, a total of four work head support towers 13 are arranged in the component mounting apparatus 1 shown here.

  In the illustrated example, two work heads 14 are arranged on each work head support tower 13 so as to be movable up and down (Z direction) and rotatable in a 360 degree direction (referred to as the θ direction). That is, a total of eight work heads 14 are arranged in the component mounting apparatus 1. Each work head 14 is moved by the Y-axis rail 12 in the Y-axis direction of the X-axis, the work head support tower 13 is moved in the X-axis direction by the X-axis, and the work head 14 itself is moved in the Z-axis direction. By rotating in the θ direction, the position in the front / rear, left / right, up / down and θ direction can be freely controlled.

  These work heads 14 suck a predetermined component supplied to the suction unit by the tape feeder 10 or a tray-type electronic component supply device by a suction nozzle 15 described later, and the sucked component is a predetermined mounting position of the substrate 8. To be installed. The suction nozzle 15 is appropriately selected from the nozzle stations 36 arranged at a plurality of locations in accordance with the changed component when the component to be supplied is changed, and is attached to the work head 14. Although the nozzle station 36 in the figure has a shape capable of accommodating two suction nozzles 15, it is of course possible to arrange a nozzle station capable of accommodating three or more suction nozzles 15 instead. is there.

  The base 6 is provided with a substrate positioning device, a substrate fixing mechanism for fixing the substrate between the two substrate guide rails 7, a control device for controlling each part, etc., although not particularly shown. ing.

  FIG. 2 is a block diagram showing a system configuration of the component mounting apparatus. As shown in the figure, the component mounting apparatus 1 includes a CPU 16 as a recognition unit and a control unit, an i / o (input / output) control unit 18 as a recognition unit and a control unit connected to the CPU 16 via a bus 17, and A control unit including an image processing unit 19 as a recognition unit is provided. A memory 20 is connected to the CPU 16. The memory 20 includes a program area and a data area (not shown).

  The i / o control unit 18 is connected to a lighting device 23 that illuminates the suction nozzle 15 in order to recognize the component 22 sucked by the suction nozzle 15 of the work head or the type of the suction nozzle 15. In addition to the illumination device 23 for illuminating the component 22 or the suction nozzle 15, the i / o control unit 18 is connected to an illumination device 21 for illuminating the board mark of the substrate 8 and the component mounting position. Yes.

  Further, an X-axis motor 24, a Y-axis motor 25, a Z-axis motor 26, and a θ-axis motor 27 are connected to the i / o control unit 18 via respective amplifiers (AMP). The X-axis motor 24 drives the working head left and right, the Y-axis motor 25 drives the X-axis rail back and forth, the Z-axis motor 26 drives the working head up and down, and the θ-axis motor 27 drives the suction nozzle 15. Rotate 360 degrees.

  Although not shown in particular, each of the amplifiers is provided with an encoder, and the encoders of the motors (X-axis motor 24, Y-axis motor 25, Z-axis motor 26, and θ-axis motor 27) are provided by these encoders. An encoder value corresponding to the rotation is input to the CPU 16 via the i / o control unit 18. Thereby, the CPU 16 can confirm the current position of the suction nozzle 15.

  Further, a vacuum unit 28 is connected to the i / 0 control unit 18. The vacuum unit 28 is pneumatically connected to the suction nozzle 15 via the vacuum tube 29 and further via the work head support tower 13 and the work head 14 shown in FIG. 1B. An air pressure sensor 30 is disposed in the vacuum tube 29. The vacuum unit 28 causes the suction nozzle 15 to suck the component 22 by vacuum, or releases suction by vacuum release, air blow, and vacuum break (vacuum break). At this time, air pressure data in the vacuum tube 29 is output from the air pressure sensor 30 to the CPU 16 as an electrical signal via the i / o control unit 18. As a result, the CPU 16 can recognize the state of air pressure in the vacuum tube 29 and thus the current state of air pressure of the suction nozzle 15.

  Further, the i / o control unit 18 is connected to a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp, and the like via respective drivers. The positioning device is disposed below the board guide rail inside the base of the component mounting apparatus, and positions the board 8 guided into the apparatus. The belt drive motor circulates and drives the substrate transport belt that is integrally disposed on the guide rail. The substrate sensor detects loading and unloading of the substrate 8. The abnormality display lamp is turned on or blinks to notify the operator of the occurrence of an abnormality when there is an abnormality in the operation of the component mounting device or an abnormality such as the entry of foreign matter in the work area.

  The i / o control unit 18 is connected to a communication i / o interface 31, the display input panel 5 and the recording device 32 shown in FIG. 1A. The communication i / o interface 31 can communicate with the CPU 16 by connecting to these processing devices by wire or wireless when, for example, teaching or other processing is performed by another processing device such as a personal computer. It is configured as follows.

  The display input panel 5 displays an image of the substrate 8 (substrate mark) captured by the image processing unit 19 with the imaging device 33 on the work head side on the display device when the component mounting operation is executed. When the teaching process is executed, a graph image and a parameter input window are displayed on the screen.

  The recording device 32 is loaded with various recording media such as HD (Hard Disk), FD (Floppy (registered trademark) Disk), MO (Magneto Optical disk), CD-ROM / RW, card or stick type flash memory. It is possible to record and hold various types of data such as the component mounting process of the component mounting apparatus, the component mounting teaching process performed in advance, the data of the component library, and the NC data from CAD. These programs are loaded into the program area of the memory 20 by the CPU 16 and used for the control processing of each unit, and the data is also read into the data area of the memory 20 to be subjected to a predetermined process. The processed and updated data is stored and stored in a predetermined data area of a predetermined recording medium.

  In the component mounting apparatus 1 having such a configuration, in the production of a board unit, two boards may be carried in, or a parent board in which a plurality of small boards (child boards) are connected may be carried in. However, normally, one substrate is handled as the minimum unit. First, the imaging means 33 and the illumination device for imaging the substrate, which are arranged on the work head support tower 13 by driving the X-axis motor 24 and the Y-axis motor 25 at the substrate mark position of the substrate 8 positioned in hardware. The means 21 is moved and the substrate mark is imaged. This substrate mark is usually formed with a copper pattern or the like having a shape of a square, a regular triangle, a circle, or a rhombus having a size of an outer diameter of about 1 mm.

  The captured image of the board mark is captured by a frame grabber, converted from an analog signal to digital data, and an image of the board mark obtained by this conversion is stored in advance. Image recognition is performed by using the information and device information of the recognition main unit. Then, when the image recognition of the substrate mark is completed, the displacement and inclination of the substrate 8 are recognized, and the pre-registered mounting coordinate correction amount is determined.

  Thereafter, the component 22 to be mounted on the board 8 is taken out from the component supply device, the component 22 is moved to the component recognition point above the imaging device 35 for component recognition, and the component 22 is imaged from below. The captured image of the component 22 is captured by a frame grabber, converted from an analog signal into digital data, and the library information and recognition of the component 22 registered in advance with respect to the image of the component 22 obtained by this conversion. Image recognition is performed by using the device information of the main body device. By this image recognition, the positional deviation and inclination of the component 22 are recognized, and the pre-registered mounting coordinate position is obtained from the image recognition of the component 22 to the mounting position correction amount obtained from the image recognition of the board mark. The correction is made in consideration of the correction amount, and the component is mounted at the corrected mounting position. Such mounting operation of the components 22 on the substrate 8 is repeated by the number of the components 22 mounted on the substrate 8.

  Here, in the component mounting apparatus 1, the recognition of the type of the suction nozzle 15 and the control related to the displacement of the suction nozzle in the state of being mounted on the work head 14 shown in FIG. 1 will be described with reference to FIGS. 2 and 3.

FIG. 3 is a simplified flowchart showing recognition and control of the suction nozzle of the component mounting apparatus.
First, when the suction nozzle 15 is attached to the work head 14 shown in FIG. 1, the i / o control unit 18 controls the X-axis motor 24 and the Y-axis motor 25 to move the work head 14 above the imaging device 15. Let Then, the suction nozzle 15 before picking up the component 22 is imaged. The image processing unit 19 acquires information on the suction nozzle 15 by converting the image obtained by this into digital data as described above by the image processing unit 19 (S1).

  Note that the above-described imaging of the suction nozzle 15 may be performed simultaneously with the center teaching performed for the suction nozzle 15 to suck the center of the component 22 and the confirmation of whether or not the suction nozzle 15 is correctly mounted.

  Then, based on the information on the suction nozzle 15 (here, image data), the CPU 16 recognizes the type of the suction nozzle 15 (S2). In recognizing the type of the suction nozzle 15 from the image data, the shape and diameter of the opening of the suction nozzle 15 can be considered, but a spring is applied to the suction nozzle 15 which causes the most impact on the sucked component 22. It is desirable to recognize the difference in structure whether it is built in or not. However, the presence or absence of the spring in the suction nozzle 15 cannot often be recognized by the above method. Therefore, as will be described in detail later, the suction nozzle 15 may be recognized by a spot facing formed on the suction nozzle 15 or the like. In addition, in order to recognize whether the suction nozzle 15 has a built-in spring, there are other methods such as a method of attaching a mark to the suction nozzle 15 and a method of making the shape of the suction nozzle 15 different depending on whether the spring is built-in. .

  Assuming that the type of the suction nozzle 15 is A type by the above-described nozzle type recognition (S2), the CPU 16 and the i / o control unit 18 perform motor control for the A type (S3). Specifically, the i / o control unit 18 controls the displacement of the suction nozzle 15 by rotating the Z-axis motor 26 under Type A conditions. Examples of the type A condition include a speed and a suction position. If the A-type suction nozzle 15 has a characteristic that it easily absorbs an impact, the component mounting efficiency is increased by increasing the displacement speed of the suction nozzle 15 in the Z-axis direction or the like.

  Similarly, if the type of the suction nozzle 15 is the B type, the CPU 16 and the i / o control unit 18 control the Z axis motor 26 for the B type (S4). In many cases, three or more types of suction nozzles 15 are used. In this case, the recognition and control patterns are increased as type C, type D,.

If the type of the suction nozzle 15 cannot be recognized, a warning is displayed by the monitor devices 2 and 2, the alarm lamps 3 and 3 and the display input panel 5 shown in FIG. 1 (S4).
The control unit according to the present invention is not limited to the CPU 16 or the i / o control unit 18 as long as it controls at least the displacement of the suction nozzle 15. The recognition means according to the present invention is not limited to the CPU 16 and the image processing unit 19 (imaging device 35) shown in FIG. 2 because it only needs to recognize the type of the suction nozzle 15 in the state of being attached to the work head 14. For example, the type of the suction nozzle 15 may be determined by arranging a load measuring element such as a load cell in the component mounting apparatus 1.

Hereinafter, an example of the difference for recognizing whether the suction nozzle 15 has a built-in spring will be described with reference to FIGS. 4, 5A, 5B, 6A, and 6B.
FIG. 4 is a side view showing a working head of the component mounting apparatus. FIG. 5A is an enlarged cross-sectional view of a part A in FIG. 4 showing a suction nozzle that does not incorporate a spring of the component mounting device. FIG. 5B is a cross-sectional view showing a suction nozzle incorporating a spring of the component mounting apparatus.

  In FIG. 4, a suction nozzle 15 is attached to the lower end of the work head 14. Further, a spring 36-1 is disposed above the suction nozzle 15. Here, the spring 36-1 is disposed in order to absorb the impact received by the suction nozzle 15-1 when the component is picked up, and thus to reduce the impact on the component sucked by the suction nozzle 15-1, and the suction nozzle 15-1. -1 is pressed.

  As shown in FIG. 5A (enlarged view of part A in FIG. 4), the suction nozzle 15-1 without a built-in spring includes a base 37 and a nozzle tip 38 that is disposed so as to be fitted to the base 37. The base portion 37 and the nozzle tip portion 38 are provided with pneumatic circuits 37a and 38a communicating with each other, and these pneumatic circuits 37a and 38a are pneumatically connected to the vacuum unit 28 shown in FIG. The suction nozzle 15-1 sucks components at the lower end of the nozzle tip 38 with the air pressure generated by the vacuum unit 28.

  On the other hand, the suction nozzle 15-2 incorporating the spring 36-2 shown in FIG. 5B includes a base 39, a nozzle tip 40, a sleeve 41, and the like. The sleeve 41 has a substantially cylindrical shape, and is fixed by a fixing tool 43 from a counterbore 39b formed on the base 39 so as to be slidable in the Z-axis direction within a predetermined range. Further, the nozzle tip 40 is fixed by a pin 42 so as to be slidable within the sleeve 41 within a predetermined range in the Z-axis direction.

  The spring 36-2 is interposed between the nozzle tip 40 and the sleeve 41 in order to increase the shock absorption at the time of suction of the suction nozzle 15-2, and presses the nozzle tip 40 with a predetermined pressing load. is doing. It is assumed that pneumatic circuits 39a and 40a are also provided at the base 39 and the nozzle tip 40, and these pneumatic circuits 39a and 40a are also pneumatically connected to the vacuum unit 28 shown in FIG.

  Here, the difference between the suction nozzle 15-1 without a spring shown in FIG. 5A and the suction nozzle 15-2 with a spring 36-2 shown in FIG. The cross-sectional shape of the pneumatic circuits 38a and 40a) and the negative vacuum pressure at the time of suction by the suction nozzles 15-1 and 15-2 are often not recognized. Therefore, as a method for determining whether or not the suction nozzle 15 includes the spring 36-2, it may be determined as follows.

FIG. 6A is a bottom view of the suction nozzle that does not incorporate the spring, and FIG. 6B is a bottom view of the suction nozzle that incorporates the spring.
When the imaging device 35 shown in FIG. 2 images the suction nozzle 15-1 shown in FIG. 5A from below, it becomes like the suction nozzle 15-1 shown in FIG. 6A. Similarly, when the suction nozzle 15-2 shown in FIG. 5B is imaged from below, the suction nozzle 15-2 shown in FIG. 6B is obtained.

  Here, the suction nozzle 15-1 and the suction nozzle 15-2 are greatly different in appearance depending on whether or not the base 39 has a spot facing 39 b. Therefore, when the illumination device 23 is operated by the i / o control unit 18 shown in FIG. 2 and an image is acquired so that the spot facing 39b is emphasized, the suction nozzle 15-2 easily incorporates the spring 36-2. Can be recognized.

  In this embodiment, by controlling the displacement of the suction nozzle according to the type of the suction nozzle 15 recognized in the state of being attached to the work head 14, the component 22 suction caused by the structure being different for each suction nozzle 15. The displacement of the suction nozzle 15 can be controlled in consideration of the change in impact to the component 22 at the time. Therefore, it is possible to suppress a change in impact to the component 22 when the component 22 is attracted and to stabilize the component attracting posture. Therefore, according to the present embodiment, the component mounting accuracy can be increased.

  Further, by controlling the displacement speed of the suction nozzle 15 in the Z-axis direction according to the recognized kind of the suction nozzle 15, when the suction nozzle 15 easily absorbs an impact, the displacement speed in the Z-axis direction is set high. Thus, the component mounting efficiency can be increased, and the change in the impact on the component 22 when the component 22 is attracted can be effectively suppressed, and the component mounting accuracy can be further increased.

  Further, by recognizing the type of the suction nozzle 15 by imaging the suction nozzle 15, the CPU 16 and the like can easily recognize the suction nozzle 15, and the component mounting efficiency can be increased.

  In addition, by recognizing whether or not a spring is built in the suction nozzle 15 based on the presence or absence of a counterbore 39, for example, the structure of the suction nozzle 15 is significantly different from that of the spring when the component 22 is picked up. The change in impact on the component 22 can be suppressed, and the component mounting accuracy can be further increased.

1 is an external perspective view showing a component mounting apparatus according to an embodiment of the present invention. It is a perspective view which shows typically an internal structure by removing the upper and lower protective covers of the said component mounting. It is a block diagram which shows the system configuration | structure of the said component mounting apparatus. It is a simple flowchart which shows recognition and control of the suction nozzle of the said component mounting apparatus. It is a side view which shows the working head of the said component mounting apparatus. It is the A section expanded sectional view of Drawing 4 showing the adsorption nozzle which does not incorporate the spring of the above-mentioned component mounting device. It is sectional drawing which shows the suction nozzle which incorporates the spring of the said components mounting apparatus. It is a bottom view of the suction nozzle which does not incorporate the spring. It is a bottom view of the suction nozzle incorporating the spring.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Monitor apparatus 3 Alarm lamp 4 Upper protective cover 5 Display input panel 6 Base 7 Board | substrate guide rail 8 Board | substrate 9 Electronic component supply stand 10 Tape cassette type electronic component supply apparatus (tape feeder)
11 X-axis rail 12 Y-axis rail 13 Working head support tower 14 Working head 15 Suction nozzle 16 CPU
17 bus 18 i / o control unit 19 image processing unit 20 memory 21 lighting device 22 parts 23 lighting device 24 X-axis motor 25 Y-axis motor 26 Z-axis motor 27 θ-axis motor 28 vacuum unit 29 vacuum tube 30 air pressure sensor 31 communication i / o interface 32 recording device 33 imaging device 35 imaging device 36 spring 37 base 37a pneumatic circuit 38 nozzle tip 38a pneumatic circuit 39 base 39a pneumatic circuit 39b counterbore 40 nozzle tip 40a pneumatic circuit 41 sleeve 42 pin 43 Stopper

Claims (4)

In a component mounting apparatus that automatically mounts a component on a substrate, a nozzle type recognition control method for recognizing the type of suction nozzle that is mounted on a work head and sucks the component,
A recognition step for recognizing whether or not a spring is built in the suction nozzle in a state of being mounted on the working head;
Controlling the displacement of the suction nozzle according to whether or not a spring is built in the recognized suction nozzle ,
In the control step, the suction nozzle that has been recognized in the recognition step as having the built-in spring has a higher displacement speed in the Z-axis direction than the suction nozzle in which the spring has not been built in. ,
Nozzle type recognition control method according to claim and this. The recognition step, the nozzle type recognition control method according to claim 1 Symbol placement and recognizes whether the spring to the suction nozzle is incorporated by imaging the suction nozzle. 3. The nozzle type recognition control method according to claim 1, wherein the recognition step recognizes whether or not a spring is built in the suction nozzle based on the presence or absence of the spotting of the suction nozzle. A component mounting apparatus comprising: a suction nozzle that is attached to a work head and sucks a component; a recognition unit that recognizes a type of the suction nozzle; and a control unit that controls the displacement of the suction nozzle.
The recognizing means recognizes whether or not a spring is built in the suction nozzle in a state of being mounted on the working head;
The control means increases the displacement speed in the Z-axis direction of the suction nozzle recognized by the recognition means as having the built-in spring as compared to the suction nozzle recognized as having no built-in spring. A component mounting device characterized by that.