JP2005322802A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting device accurately reading the attractive position of an electronic component by a suction nozzle from an imaging picture. <P>SOLUTION: The component mounting device 1 comprises image obtaining means 17, 18 for presupposing to suck an electronic component 15 at the pointed end of a suction nozzle 14 at a component supply position 7, to mount the electronic component sucked by the suction nozzle on a printed board 4, and to obtain a two-dimensional image handling the vicinity of the pointed end of the suction nozzle from a side face of the attracting nozzle; a detecting means for detecting a defective attracted state from the two-dimensional image of the vicinity of the pointed end of the suction nozzle obtained by the image obtaining means; and an undeleting means for undeleting the defective state of suction to a normal state when the defective state is detected by the detecting means. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus for mounting an electronic component on a printed circuit board by a work robot, and more particularly to a component mounting apparatus having an inspection mechanism for inspecting the suction posture of the electronic component acquired by the work robot.

Conventionally, a component mounting device is known as a device for mounting an electronic component on a printed circuit board.
In this component mounting device, the printed circuit board is carried into the component mounting device from the upstream side, and the work robot configured in the component mounting device supplies electronic components to the component mounting device with respect to the loaded printed circuit board. An electronic component is mounted at a predetermined position on the printed circuit board from the component supply device.

  This working robot is configured above the printed circuit board carried into the component mounting apparatus, and is disposed on the Y-axis rail horizontally with respect to the printed circuit board. X-axis rail slidably slid on the axis rail, mounting head support tower slidably slid on the X-axis rail, and ascending and descending in the Z-axis direction while being supported by the mounting head support tower And a mounting head that allows self-rotation around the Z axis.

  The X-axis rail slides on the Y-axis rail by a positioning mechanism constituted by, for example, a motor and a ball screw, and the mounting head support tower slides on the X-axis rail by a positioning mechanism having the same configuration as described above. it can. The mounting head includes an adsorption shaft that is allowed to move up and down in the Z-axis direction and self-rotation around the Z-axis, and the adsorption shaft can move up and down and rotate (rotation in the θ direction) by driving a motor.

  Furthermore, a suction nozzle can be attached to the tip of the suction shaft. When mounting electronic components on a printed circuit board, the suction nozzle is attached to the tip of the suction shaft, and positive pressure or negative pressure is selectively applied to the tip from the air pressure control device. Enables suction and release of parts.

  Each of these motors, air pressure applied to the suction nozzle, or electronic component supply processing in the component supply device is controlled by a computer, and based on a predetermined program, the work robot arbitrarily sets a predetermined path in the XYZ and θ directions. Along with this, the electronic component supplied from the component supply device is sucked at the tip of the suction nozzle at a predetermined timing, and the sucked electronic component is released on the printed circuit board.

  In the component mounting apparatus, a component recognition camera is generally provided between paths for transporting electronic components from the component supply device to the printed circuit board, and the electronic components picked up by the suction nozzle are imaged from below by the component recognition camera. Then, the suction position of the suction nozzle with respect to the electronic component is analyzed from the captured image, and the mounting position of the electronic component on the printed circuit board is finely adjusted based on the analysis result.

  Furthermore, in order to inspect the suction state (normal suction state or defective suction state (for example, non-suction state or standing state)) of the electronic component with respect to the suction nozzle between the paths for transporting the electronic component from the component supply device to the printed circuit board. The optical sensor is provided. This optical sensor is composed of a light emitting element that irradiates laser light in parallel between the paths and a light receiving element that receives the light, and a position where the lower end of the electronic component normally sucked by the suction nozzle does not hit the laser light. Placed in. Under such a configuration, when the suction state is in the standing state, the lower end of the electronic component is positioned lower than in the normal suction state. Therefore, since the lower end of the standing electronic component blocks the laser light, the standing state of the electronic component can be detected by detecting the change in the light amount based on the blocking by the light receiving element. Note that the optical sensor must be arranged at a position where the laser beam is not blocked in the normal adsorption state, depending on the thickness of the adsorption component. In the non-adsorbed state, naturally, the laser beam is not blocked, so that it is determined as a normal adsorbed state. For this reason, when taking the detection of the non-adsorption state into consideration, the determination direction for determining the non-adsorption state from the value of the vacuum pressure at the tip of the adsorption nozzle must be used together (see Patent Document 1).

The component mounting apparatus has such an inspection mechanism to prevent an electronic component mounting error on the printed circuit board.
JP-A-6-216484 (paragraphs [0010]-[0015], FIGS. 1 and 2)

  As described above, the component mounting apparatus is provided with the optical sensor that detects the suction state of the electronic component. The optical sensor is configured such that a portion of the electronic component positioned below the normal suction when the electronic component is defectively sucked blocks the laser light of the optical sensor, and the thickness of the electronic component is obtained as one-dimensional information. Can do.

  However, there are various types of electronic components handled by the component mounting device, and the thickness of the electronic components naturally changes due to differences in shape and size, and the lowest point of various electronic components is subtle even during normal adsorption. Will be different.

  For this reason, it is difficult to always stably and accurately detect the defective suction state in various electronic components while the optical sensor is fixed at a predetermined position, and the arrangement of the optical senner is changed according to the type of the electronic component. There was a need.

  In addition, it may be considered to analyze the suction state of the electronic component using a captured image of a component recognition camera for detecting the suction position of the electronic component with respect to the suction nozzle. A tolerance is generated in the width of the component, and for example, a difference between an electronic component in a normal suction state and an electronic component sucked in a state slightly inclined from the normal suction state cannot be detected.

  Accordingly, an object of the present invention is to provide a component mounting apparatus that can detect a defective suction state without depending on the type of electronic component, and can detect a defective suction even with a slight inclination.

In order to solve the above problems, the present invention is configured as follows.
One aspect of the component mounting apparatus of the present invention is based on the premise that the electronic component is sucked to the tip of the suction nozzle at the component supply position, and the electronic component sucked by the suction nozzle is mounted on a printed circuit board. An image acquisition unit that acquires a two-dimensional image targeting the vicinity of the tip of the suction nozzle from the side surface of the nozzle, and a suction failure state is detected from the two-dimensional image near the tip of the suction nozzle obtained by the image acquisition unit And detecting means, and recovery means for recovering the suction failure state to a normal state when the detection failure state is detected by the detection means.

  The suction nozzle is provided in a mounting head support tower that translates with respect to the plane of the printed circuit board, and sucks the electronic component based on an ascending / descending operation from the mounting head support tower. It is desirable that a two-dimensional image near the tip of the suction nozzle is acquired from the side by an imaging camera provided on the mounting head support tower.

  Further, the mounting head support tower includes an illumination device that selectively illuminates the vicinity of the tip of the suction nozzle or an electronic component sucked by the tip, and the image acquisition means is selectively illuminated by the illumination device. A side image in the vicinity of the tip of the suction nozzle or a side image of the electronic component sucked at the tip is acquired by the imaging camera, and the detection means is adapted to a technique (for example, a vertical direction of the electronic component) according to an illumination target by the lighting device. It is desirable to detect the defective adsorption state by an optimal method among the methods such as dimension measurement, inclination measurement, or pattern recognition.

  In the present invention, the component mounting apparatus is configured so that a side image of the vicinity of the tip of the suction nozzle and the electronic component sucked by the tip can be acquired. For this reason, if an image of the vicinity of the tip of the suction nozzle is taken after performing the operation of sucking the electronic component to the suction nozzle, the electronic component is in a normal state (in this case, the electronic component is horizontally sucked by the tip of the suction nozzle. State) or a defective suction state (in this case, the electronic component is not picked up or is picked up in a standing posture at the tip of the suction nozzle), for example, easily by using pattern recognition from the two-dimensional image. Can be judged. In addition, if the vicinity of the tip of the suction nozzle is imaged after the electronic component is mounted on the printed circuit board, the electronic component is in a normal state (in this case, the electronic component is not brought home, the tip of the suction nozzle is consumed or attached). Whether there is no nozzle failure such as the presence of a kimono) or a defective suction state (in this case, a state where an electronic component is brought back or a state where the nozzle failure has occurred) from the two-dimensional image, for example, a pattern Can easily be determined using recognition.

  Further, by configuring the mounting head support tower so that the vicinity of the tip of the suction nozzle can be imaged from the imaging camera configured together with the suction nozzle, the suction head is supported at any time regardless of the position of the component mounting head support tower. An image near the nozzle tip can be acquired. In this case, an image in the vicinity of the suction nozzle tip can be acquired while the component mounting head is moving (for example, at high speed).

  In addition, by using an illumination device that selectively illuminates the illumination in the vicinity of the suction nozzle tip (illumination at the suction nozzle tip, illumination of the electronic component sucked by the suction nozzle, or both of them), Accordingly, a method for detecting a defective suction state (for example, a method for measuring the vertical dimension of an electronic component, a method for measuring an inclination, a pattern recognition, or the like) can be selected as an optimum method.

  As described above, according to the present invention, the suction failure state is determined from the two-dimensional image near the tip of the suction nozzle, so that the tip of the suction nozzle has a slight inclination angle without depending on the type of electronic component. Even if it is adsorbed, the defective adsorbed state can be detected accurately and stably.

Further, since the side image near the tip of the suction nozzle is obtained during the movement of the mounting head support tower, the defective suction state can be detected efficiently without reducing the speed of the component mounting process.
In addition, since the defective suction state can be detected stably with high accuracy, the generation of defective substrates can be suppressed.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.
FIG. 1 is an example of a component mounting apparatus according to an embodiment of the present invention.
FIG. 1A is an external perspective view of the component mounting apparatus.

The component mounting apparatus 1 in FIG. 1A is a component mounting apparatus in a state where the upper cover above the base 2 in FIG.
The upper cover (not shown) includes a display device such as a CRT or a liquid crystal on its upper surface. On this display device, a captured image of an electronic component captured by a component recognition camera or a suction state recognition camera, which will be described later, or various setting screens and information indicating the mounting status of the electronic component are displayed. The upper cover is configured with an input device such as a keyboard and a mouse, and various setting inputs on a setting screen displayed on the display device can be performed from the input device. Furthermore, a notification lamp is formed on the upper surface of the upper cover. For example, when an error is detected during component mounting, the notification lamp can be blinked to notify the operator of the error state. Each part is electrically connected to a control device configured inside the base 2 via a signal cable and controlled.

The internal mechanism can be roughly divided into a work robot, a component supply mechanism, a transport mechanism, and an inspection mechanism.
The conveying mechanism is arranged along the base guide rail 3 extending from the upper left to the lower right in the drawing, from the upstream side (the upper left in the drawing) to the downstream (the right inclination). The printed circuit board 4 is transported while being placed on a transport belt (not shown) in the downward direction. The transport mechanism detects the position of the loaded printed circuit board 4 by sensors installed at a plurality of locations on the transport path of the printed circuit board 4, and detects that the printed circuit board 4 has been transported directly below the component mounting processing execution position. Then, the lifting table is raised from behind the printed board 4 to fix the position of the printed board 4 to the component mounting processing execution position. Then, when it is detected that the mounting of the electronic component on the printed circuit board 4 is completed, the position fixing is released, and the printed circuit board 4 is discharged downstream. The control of the conveyor belt and the position fixing control are executed by driving a corresponding drive motor from the controller via a signal cable.

  The component supply mechanism is simply referred to as a tape cassette type component supply device (generally simply a tape feeder, a cassette type, or a tape component supply device, etc.) on the component supply table 5 formed before and after the base 2. ) 6 is normally mounted in a large number of 50 to 70, and is electrically connected to the control device inside the base 2 so that the electronic components accommodated in the tape cassette type component supply device 6 can be placed at a predetermined timing. It is sent out to the component supply position 7. Note that the timing of supplying the electronic component is controlled by the control device.

  The work robot is configured above the base 2 and carries the electronic components supplied to the component supply position 7 onto the printed circuit board 4. Above the base 2, a pair of left and right fixed rails (Y axis rails) 8 extending in a direction perpendicular to the substrate transport direction (the positive direction of the X axis) are disposed. A moving rail (X-axis rail) 9 crosses the two Y-axis rails 8 vertically, and the moving rail (X-axis rail) 9 is slidable along the Y-axis rail 8. The rail 8 is engaged. Further, a mounting head support tower 10 is suspended on each X-axis rail 9 so as to be slidable along the X-axis rail 9. Each X-axis rail 9 is engaged with a ball screw inside the Y-axis rail 8 via a nut, and the Y-axis direction is driven by the rotational drive of the Y-axis motor 11 of FIG. Has moved to. Similarly, each mounting head support tower 10 is engaged with a ball screw inside the X-axis rail 9 via a nut, and is connected to the ball screw via a coupling (not shown). The movement in the X-axis direction is realized by the rotation of. Each motor is connected to the control device via a signal cable and is driven and controlled. Each motor is provided with an optical encoder, and the movement position in the XY direction of the mounting head support tower 10 that is moved by the rotation of the motor can be transmitted to the control device.

  FIG. 2B is a schematic diagram of the mounting head support tower 10. In addition, the mounting head support tower 10 of the same figure (b) shows typically the various structures of the mounting head support tower 10 shown to the same figure (a) from the AA 'direction.

  As shown in FIG. 4B, the mounting head support tower 10 further includes a mounting head 12. The mounting head 12 includes a suction shaft 13 that extends in the vertical direction (Z-axis direction in the figure). The suction shaft 13 is configured to be movable up and down in the Z-axis direction in the figure, and the suction shaft 13 is moved up and down by driving a Z-axis drive motor (not shown). Further, the suction shaft 13 is configured to be capable of self-rotation (θ rotation in the figure) about its own axis. This self-rotation is realized by driving the θ-axis motor.

  Furthermore, a suction nozzle 14 that directly sucks an electronic component is attached to the tip of the suction shaft 13. The suction nozzle 14 is selectively attached to the tip of the suction shaft 13 from a suction nozzle exchange base (tool changer) (not shown) in which a plurality of types of suction nozzles are arranged in a replaceable manner. The suction shaft 13 and the suction nozzle 14 have a hollow structure inside, and communicate with each other through a connection portion. These internal air pressures are controlled by a control device, and positive pressure and negative pressure are applied to the end portion (suction surface) of the suction nozzle 14. Since the suction nozzle 14 is fixed to the suction shaft 13, when the suction shaft 13 self-rotates, naturally, the suction nozzle attached at the tip thereof also self-rotates. The Z-axis drive motor and the θ-axis motor are connected to the control device via a signal cable and are driven and controlled.

  Thus, the horizontal movement in the Y-axis direction by the X-axis rail 9 and the horizontal movement in the X-axis direction by the mounting head support tower 10 cause the mounting head support tower 10 to arbitrarily move in the horizontal plane. Then, by combining the mounting head support tower 10 with the up-and-down movement of the suction shaft 13 in the Z-axis direction and the rotation in the θ direction, forward / backward, left-right and up-and-down movement between the component supply position 7 and the printed circuit board 4 and 360 in the horizontal plane. The direction of the degree can be adjusted freely.

  When the inspection mechanism carries the electronic component from the component supply position 7 onto the printed circuit board 4, the electronic component is attracted to the suction nozzle 14 (the electronic component 15 in the normal suction state is shown in FIG. 5B). Inspect. In this inspection mechanism, a camera for analyzing the suction position of the suction nozzle 14 with respect to the electronic component (component recognition camera 16 in FIG. 5A) and a camera for checking the suction state of the electronic component with respect to the suction nozzle 14 (same as above). The suction state recognition camera 17) of FIG. The various cameras are constituted by, for example, a CCD (Charge Coupled Device) camera. And the said component recognition camera 16 is arrange | positioned upwards at the base 2, and picks up an adsorption | suction component from the bottom. One suction state recognition camera 17 is disposed sideways in the mounting head support tower 10 and images the suction component from the side. In the configuration of this example, the suction state recognition camera 17 has the suction surface of the suction nozzle 14 and the suction component when the suction shaft 13 moves up and the position of the suction nozzle 14 reaches the uppermost end in the component mounting head 10. Is arranged at a position where an image can be taken from the side. An illumination device 18 that selectively illuminates any one of the suction component, the suction component and the tip of the suction nozzle 14, or the tip of the suction nozzle 14 in the vicinity of the suction state recognition camera 17 via the support member 19. It is configured. The illumination device 18 only needs to be able to effectively illuminate the illumination target, and the form and arrangement thereof may be determined as appropriate. For example, the illumination range 18 may be provided around the imaging lens by hollowing out the view range portion so as not to block the view range of the suction state recognition camera 17. In addition, the suction state recognition camera 17 is desirably arranged as in this example, but may be any arrangement that can image the tip of the suction nozzle 14 (including at least the suction component) from the side surface.

  The component recognition camera 16, the suction state recognition camera 17, and the lighting device 18 are electrically connected to the control device via a signal cable. Under the instruction of the control device, the lighting device emits light and images the suction component. A two-dimensional captured image is transmitted to the control device.

FIG. 2 is a block diagram of the control device.
This control apparatus has a CPU (Central Processing Unit) 20 that controls the entire component mounting apparatus. The CPU 20 has a ROM 22 as a read-only memory and a RAM 23 as a readable / writable memory via a bus 21. An image processing unit 24 for processing a recognized image, a key input unit 25, an I / O control unit 26, and the like are connected.

The ROM 22 stores a program for controlling the above units.
The RAM temporarily stores an area for storing a component mounting program read from an external recording device such as a floppy (registered trademark) disk or a compact disk via the I / O control unit 26, and intermediate data for arithmetic processing. A work area is provided.

  The CPU 20 executes component mounting processing to be described later according to the component mounting program read from the RAM 23 while controlling the above-described units based on the control program read from the ROM 22.

  The image processing unit 24 drives the component recognition camera 16 and the suction state recognition camera 17 in FIG. 1, converts the captured analog signal into a digital signal, and transfers this to the CPU 20. In the CPU 20, based on this signal, information on the normal suction state described in the component mounting program (for example, the thickness of the component in the normal suction state, the inclination of the component, the position of the component shown in the captured image, or the shape pattern) Etc.), and check for misalignment based on the initially planned suction position on the electronic component. If it is determined that it is in a defective suction state, the component mounting process is interrupted and recovery processing is performed. In the case of misalignment, the mounting position at the time of component mounting is corrected.

The key input unit 25 is connected to an input operation key of the input device, and outputs an operation signal from the outside of the input operation key to the CPU 20.
The I / O control unit 26 includes a driver for causing the lighting device 18 of FIG. 1 to emit light, a driver for a belt driving motor for driving the conveyor belt, a driver for a cylinder for raising and lowering a lifting table for fixing the position of the printed board, and each motor Drivers that drive various sensors, such as sensors that detect the state and movement position of printed circuit boards and component mounting heads, and sensors that measure the air pressure applied to the suction surface of suction nozzles, drivers that drive notification lamps, and display devices Various drivers such as a driver for driving and a driver for driving an external storage device are connected.

Next, a component mounting process in the component mounting apparatus will be described with reference to FIG.
When the printed circuit board 4 is carried in from the upstream side of the apparatus 1 by driving the transport belt, the position of the printed circuit board 4 is fixed at a predetermined position. Then, component mounting processing is executed on the printed circuit board 4 in accordance with the mounting order described in the component mounting program and various setting information (also referred to as component master) of the mounted components.

  When the position of the printed circuit board 4 is fixed, first, the drive motor for the X-axis rail and the Y-axis rail is driven to move the mounting head support tower 10 to a tool changer (not shown). Then, the suction shaft is moved up and down by driving the Z-axis drive motor, and the suction nozzle 14 corresponding to the electronic component to be processed is attached to the tip of the suction shaft 13.

  Subsequently, the drive motor for the X-axis rail and the Y-axis rail is driven to move the mounting head support tower 10 to the component supply position 7 of the tape cassette type component supply device 6. Further, the suction shaft 13 is moved downward by driving the Z-axis drive motor, and a negative pressure is applied to the suction surface of the suction surface nozzle 14, so that the electronic components supplied to the component supply position 7 are moved by the suction surface of the suction nozzle 14. Adsorb. Then, with the negative pressure applied to the suction surface, the Z-axis drive motor is driven to raise the suction shaft 13, and the suction nozzle 14 is placed in the mounting head support tower 10 (the arrangement shown in FIG. 1B). ).

  Subsequently, the drive motor for the X-axis rail and the Y-axis rail is driven, and the component mounting head 10 is moved to the printed circuit board 4 via the component recognition camera 16. During this time, the suction shaft 14 and the suction state recognition camera 17 are maintained in the state shown in FIG. 1B, so that the lighting device 18 is driven to illuminate the suction component, and the suction state recognition camera 17 changes the suction state of the electronic component. Take an image. This captured image is transmitted to the control device, and the suction state is determined by, for example, measuring the vertical dimension or inclination of the electronic component or pattern recognition. At this time, if it is determined that it is in a defective suction state (such as an electronic component not picked up or standing), the component mounting process is interrupted and recovery processing is performed to bring the electronic component into a normal suction state. Continue the loading process. When the component mounting head 10 reaches above the component recognition camera 16, the back surface of the electronic component is illuminated by a lighting device (not shown), and the back surface of the electronic component is imaged by the component recognition camera 16. This captured image is transmitted to the control device, and from this captured image and the position information of the component mounting head 10 at the time of imaging, the displacement amount of the suction position with respect to the electronic component and the rotation angle with respect to the component mounting position are calculated. The initial planned position on the printed circuit board 4 on which the electronic component is mounted and the initial planned rotation angle θ of the suction nozzle are corrected.

  When the component mounting head 10 reaches the component mounting position of the printed circuit board 4, the Z-axis drive motor is driven to lower the suction shaft 13, and a positive pressure is applied to the suction surface of the suction surface nozzle 14 at the component mounting position. Release the part. Then, the suction shaft 13 is moved up by driving the Z-axis drive motor, and the suction nozzle 14 is placed in the mounting head support tower 10 (the arrangement shown in FIG. 1B). At this time, since the suction shaft 14 and the suction state recognition camera 17 are maintained in the state of FIG. 1B, the illumination device 18 is driven to illuminate the suction nozzle, and the suction state recognition camera 17 uses the tip of the suction nozzle 14. Image. This captured image is transmitted to the control device. For example, the suction part tip is not released, the suction surface of the suction nozzle is worn, or the solder is attached (nozzle failure) by measuring the size or inclination of the suction nozzle or pattern recognition. Determined. At this time, if it is determined that the component is not released, the component mounting process is interrupted, the recovery process is performed, and the above process is repeated for the next electronic component. If it is determined that the nozzle is faulty, for example, if the nozzle is consumed and its length is shortened, the drive amount of the Z-axis motor that is driven to pick up and release the electronic component changes, so the component mounting process is performed. Suspend, change the drive amount of the Z-axis drive motor, replace the suction nozzle 14, and if there is a deposit on the tip of the suction nozzle, wipe off the deposit and remove the next electronic component Repeat the above process.

  If the image pickup by the suction state recognition camera 17 and the processing based on the picked-up image are arranged as shown in the figure, the suction surface or suction component of the suction nozzle 14 is within the imaging range of the suction state recognition camera 17. Can be run whenever you are located. For this reason, if it is executed after the electronic component is sucked, the defective suction state can be found immediately, and the electronic component is not mounted on the printed circuit board in the defective suction state, and the generation of the defective substrate can be prevented. Further, if the above-described processing is executed after the electronic component is mounted on the printed circuit board, it is possible to immediately find the electronic component to be taken home or a suction surface failure, thereby preventing the generation of a defective substrate. Naturally, if the suction nozzle is moved to the arrangement shown in FIG. 1B and the suction state recognition camera 17 is driven when the component mounting process is stopped, the state of the suction surface of the suction nozzle 14 can be inspected.

  FIG. 3 is a diagram for explaining an image captured when the electronic component sucked by the suction nozzle 14 is picked up by the suction state recognition camera 17. In this example, a suction state inspection from when an electronic component is sucked to when the electronic component is mounted on a printed board will be described as an example.

  The arrangement configuration of the suction nozzle 14, the illumination device 18, and the suction state recognition camera 17 is shown on the left side of the figure, and the captured image of the suction state recognition camera 17 is shown on the right side. Electronic parts are indicated by hatching.

FIG. 5A shows an example of a normal adsorption state.
As shown in the picked-up image in the figure, the electronic component is picked up in parallel with a predetermined thickness in the normal suction state. Therefore, the control device can determine the normal suction state from the preset thickness of the electronic component.

FIG. 2B is an example of the first standing state.
In the first standing state, the electronic component is sucked by the suction nozzle 14 in a state where the electronic component is inclined toward the front side or the back side with respect to the imaging direction of the suction state recognition camera 17.

  In this example, the front side of the electronic component is sucked up with respect to the imaging direction, and the back side is inclined downward. When the captured image is viewed, the electronic parts are shown in parallel, but the thickness is larger than normal. For this reason, the control device can determine that the standing state is larger than the preset thickness of the electronic component. Needless to say, contrary to this example, even when the back side of the electronic component is sucked up with respect to the imaging direction and the front side is inclined downward, the captured image is the same as this example, and the control device It can be determined to be standing.

FIG. 10C shows an example of the second standing state.
In the second standing state, the electronic component is sucked by the suction nozzle 14 in a state where the electronic component is tilted left and right with respect to the imaging direction of the suction state recognition camera 17.

  In this example, the left side of the electronic component is sucked up with respect to the imaging direction, and the right side is inclined downward. Looking at the captured image, the electronic component appears to be tilted. For this reason, in the control device, it can be determined that the electronic component is in a standing state that is inclined with respect to a preset inclination (usually the inclination angle is 0 degree). Needless to say, contrary to the present example, a case where the right side is sucked up with respect to the imaging direction and the left side is inclined downward can be similarly determined as a standing state.

  If the captured images in FIGS. 4A to 4C are captured after the electronic component is mounted on the printed circuit board, the control device performs pattern recognition of the tip shape of the suction nozzle. Then, it can be determined that the part is taken home.

FIG. 4D shows an example of an unadsorbed state.
When the object illuminated by the illumination device is set to an electronic component, nothing is captured, and therefore the control device can determine that the object is not attracted. In addition, when the suction nozzle is also included in the illumination target as shown in this example, the tip of the suction nozzle is copied, so the pattern recognition between the shape of the suction nozzle tip and the shape of the electronic component to be suctioned is performed. The unadsorbed state can be determined by the control device.

  If the captured image in FIG. 4D is captured after the electronic component is mounted on the printed circuit board, for example, the pattern recognition of the tip shape of the suction nozzle is performed according to the object illuminated by the illumination device. For example, the control device can determine that the electronic component is normally mounted.

  In the embodiment of the present invention, the suction state recognition camera 17 is fixed to the component mounting head 10, and the suction state recognition camera 17 moves along the XY plane together with the component mounting head 12 that performs Z-axis movement or θ rotation. Therefore, the suction state recognition camera 17 can appropriately check the suction state of the suction nozzle and the suction state of the electronic component sucked by the suction nozzle tip. For example, if the suction state recognition camera 17 is arranged in an arrangement in which the suction component is imaged from right side (preferably right side, but may be at a slightly angled side), the suction part and the suction nozzle A two-dimensional image from the side of the tip is obtained, and by comparing and analyzing the shape, thickness, inclination angle, and the like of the suction component from the two-dimensional image, the suction state and the suction surface state can be detected with high accuracy.

  Then, without changing the arrangement of the suction state recognition camera 17, each suction failure state can be detected accurately and stably even when there is a variation in the suction failure state or the shape of the electronic component. Even a slight failure can be detected with high accuracy, and an electronic component mounting error on a printed circuit board can be prevented in advance, and as a result, generation of a defective board can be prevented. Furthermore, electronic parts can be prevented from being taken home.

  From the above, it becomes possible to increase the production efficiency of the component mounting process on the printed circuit board.

It is an example of the component mounting apparatus which is embodiment of this invention. It is a block diagram of the control apparatus of this component mounting apparatus. It is explanatory drawing of the image picked up by the adsorption | suction state recognition camera 17. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Base 4 Printed circuit board 7 Component supply position 10 Mounting head support tower 12 Component mounting head 13 Suction shaft 14 Suction nozzle 15 Electronic component 17 Suction state recognition camera 18 Illumination device

Claims (3)

A component mounting device that sucks an electronic component at the tip of a suction nozzle at a component supply position and mounts the electronic component sucked by the suction nozzle on a printed circuit board,
An image acquisition means for acquiring a two-dimensional image for the vicinity of the tip of the suction nozzle from the side surface of the suction nozzle;
Detection means for detecting a suction failure state from a two-dimensional image near the tip of the suction nozzle obtained by the image acquisition means;
A recovery means for restoring the suction failure state to a normal state when the suction failure state is detected by the detection means;
A component mounting apparatus characterized by comprising: The suction nozzle is provided in a mounting head support tower that translates relative to the plane of the printed circuit board, and sucks the electronic component based on a lifting operation from the mounting head support tower.
The image acquisition means acquires from the side surface a two-dimensional image of the vicinity of the tip of the suction nozzle by an imaging camera provided in the mounting head support tower.
The component mounting apparatus according to claim 1. The mounting head support tower is provided with an illumination device that selectively illuminates the vicinity of the tip of the suction nozzle or an electronic component sucked at the tip.
The image acquisition means acquires a side image near the tip of the suction nozzle selectively illuminated by the lighting device or a side image of an electronic component sucked by the tip by the imaging camera,
The detection means detects a defective adsorption state by a method according to an illumination target by the lighting device.
The component mounting apparatus according to claim 2.

Images