JP2003304095A - Electronic circuit component holding power acquiring program of suction nozzle and electronic circuit component handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electronic circuit component handler imparted with a function for testing the electronic circuit component sucking and holding power of a suction nozzle. <P>SOLUTION: The electronic circuit component handler comprising a nozzle holder for holding suction nozzles, a nozzle holder moving unit, a unit for imaging an electronic circuit component held by the suction nozzles, and a controller for controlling the moving unit and the imaging unit is imparted with a function for testing the sucking and holding power. A sucking and holding power test program is stored in a computer constituting the main body of the controller. The program urges the moving unit to move the nozzle holder more violently than usual (S70) and urges the imaging unit to image the electronic circuit component held by the suction nozzles before and after movement (S58, S72). Image data acquired by imaging before and after movement is then processed and if there is no variation in the relative position of the electronic circuit component to the suction nozzles before and after movement, a decision is made that the suction nozzle has a sufficient electronic circuit component holding power (S75). <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handling device for electronic circuit parts which are constituent parts of an electronic circuit, and more particularly to acquisition of electronic circuit part suction ability and electronic circuit part holding ability of a suction nozzle. Is.

[0002]

2. Description of the Related Art Electronic circuit component handling devices are used, for example, in electronic circuit component mounting machines for mounting electronic circuit components on a circuit board such as a printed wiring board. Many electronic circuit component mounting machines are equipped with a suction nozzle that suctions and holds electronic circuit components by negative pressure. Electronic circuit component mounting depends on the ability of the suction nozzle to suction and hold electronic circuit components. Significantly affects the work efficiency of the machine.
The electronic circuit component suction capability is the capability of the suction nozzle to suction the electronic circuit components supplied from the component supply device. It is the ability to prevent relative movement of electronic circuit components and keep them when they are caused to move.

Conventionally, when the suction nozzle sucks an electronic circuit component, a suction error such as the electronic circuit component is not held, or a suction defect such as an abnormal suction that is sucked but not in a normal posture. When it actually occurs, it is considered that the electronic circuit component suction capacity is insufficient, and as a result of the suction nozzle holding the electronic circuit component being moved, the electronic circuit component falls off or becomes in an abnormal holding state. When such a holding failure actually occurs, it is considered that the electronic circuit component holding ability is insufficient, and necessary measures have been taken. However, the occurrence of a suction failure or a holding failure during the operation of the electronic circuit component handling device is not desirable because it easily causes defective products and lowers work efficiency. Also,
Due to clogging of the suction nozzle or abrasion of the suction end surface, the suction ability and holding ability of the suction nozzle may decrease, and as a result, suction failure or retention failure may occur during operation of the electronic circuit component handling device. . Therefore, conventionally,
Acceleration and deceleration during movement of the suction nozzle are often set to be unnecessarily small, which has been one of the important causes of hindering the improvement of work efficiency.

[0004]

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention reduces the work efficiency of an electronic circuit component handling device and causes a suction failure and a holding failure during work. It is an object of the present invention to avoid both of them as much as possible, and according to the present invention, an electronic circuit component holding ability acquisition program, an electronic circuit component adsorption ability acquisition program, and an electronic circuit component handling device of the following aspects are provided. Etc. are obtained. Similar to the claims, each mode is divided into paragraphs, each paragraph is numbered, and the numbers of other paragraphs are referred to as necessary. This is merely for facilitating the understanding of the present invention, and the technical features and combinations thereof described in the present specification should not be construed as being limited to those described in the following respective sections. . Further, when a plurality of items are described in one section, it is not always necessary to adopt the plurality of items together. It is also possible to select and use only some of the items.

In each of the following items, item (1) corresponds to item 1, item (2) and item (3) are combined to item 2, and item (5) is included. In claim 3, claim (15) is claim 4
And (18) corresponds to claim 5, respectively.

(1) An electronic circuit including a suction nozzle for suctioning an electronic circuit component by negative pressure, a moving device for moving the suction nozzle, and an image pickup device for picking up an image of the electronic circuit component held by the suction nozzle. A program executed by a computer for testing an electronic circuit component holding ability in a component handling device, wherein the electronic circuit component is relative to the suction nozzle before and after the movement of the suction nozzle holding the electronic circuit component by the moving device. A holding capacity acquisition program including a relative position change detection step of detecting a position change. If the suction nozzle has a sufficient ability to hold the electronic circuit component, the relative position change, which is the change in the relative position of the electronic circuit component with respect to the suction nozzle, does not occur even if the suction nozzle is moved by the moving device. On the other hand, if it is insufficient, the relative position changes, and if it is extreme, the electronic circuit component falls off. Therefore, if the change in the relative position of the electronic circuit component with respect to the suction nozzle before and after the movement of the suction nozzle is detected,
It is possible to determine whether the suction nozzle has a sufficient ability to hold electronic circuit components. Compared with the normal operation of the electronic circuit component handling device, the acceleration, deceleration, and maximum speed of the movement of the suction nozzle by the moving device can be increased, or the negative pressure supplied to the suction nozzle can be weakened. If the position change is detected, it can be tested whether or not the suction capacity has a margin. The movement of the suction nozzle can be performed in the direction parallel to the suction end face that sucks electronic circuit components (direction orthogonal to the nozzle axis), in the direction perpendicular to it, in the direction including components in both directions, or in the nozzle. Rotation about an axis,
It may be a swivel about a swivel axis parallel to the nozzle axis, a combined motion of those rotations and swivel or parallel movement, or the like. (2) In an electronic circuit component handling device including a suction nozzle that suctions an electronic circuit component by negative pressure, a moving device that moves the suction nozzle, and an image pickup device that picks up an image of the electronic circuit component held by the suction nozzle. A program executed by a computer for testing an electronic circuit component holding capacity, the first imaging step of performing an image pickup of the electronic circuit component held by the suction nozzle in a direction directly facing the suction nozzle; It includes a moving step of moving the suction nozzle holding the circuit component, and a second imaging step of imaging the electronic circuit component held by the suction nozzle after the moving step is performed in a direction facing the suction nozzle. A retention capacity acquisition program characterized by the following. If the imaging device images the electronic circuit component held by the suction nozzle before and after the movement of the suction nozzle by the moving device, the relative position change of the electronic circuit component with respect to the suction nozzle based on the position change of the image of the electronic circuit component. Can be obtained. (3) A relative position change detection step of detecting a change in the relative position of the electronic circuit component held by the suction nozzle with respect to the suction nozzle from the image processing results of the first imaging step and the second imaging step (2 ) Section retention capacity acquisition program. (4) The holding ability acquisition according to (1) or (3), which includes a holding ability pass / fail determination step for determining whether the suction nozzle electronic circuit component holding ability is good or bad based on the detected relative position change. program. For example, when the relative position change amount, which is the relative position change amount, is larger than the preset threshold change amount, it is determined that the holding capacity is insufficient. When the relative position change amount is detected by making the moving state of the suction nozzle and the negative pressure supply state of the suction nozzle more disadvantageous than during normal operation of the electronic circuit component handling device, and the relative position change amount is larger than the threshold change amount. It is also possible to determine that the holding capacity margin is small. (5) The holding capacity acquisition program according to any of (2) to (4), wherein the moving condition in the moving step can be set arbitrarily. (6) The holding ability according to any one of (2) to (5), wherein the holding ability acquisition program includes a movement repeating step in which the moving step is repeated a set number of times after the first imaging step is completed. Acquisition program. The movement repeating step may be one in which only the moving step is repeated, but after the first imaging step is completed, the moving / imaging repeating step that repeats the movement step, the second imaging step, and the relative position change detection step a set number of times obtains the holding capacity. It may be included in the program. By repeating the moving step and the like a plurality of times, it is possible to more reliably detect whether or not the holding capacity of the suction nozzle is sufficient. Further, if the conditions of the movement of a plurality of times are made different from each other, more information can be obtained regarding the holding capacity. (7) The holding capacity acquisition program includes a holding state confirmation step for checking whether the holding state of the electronic circuit component by the suction nozzle held by the nozzle holder is normal or not (1) to (6) The retention capacity acquisition program according to any one of the items. When the holding state of the electronic circuit component by the suction nozzle is not normal, if the holding ability is acquired, an erroneous result will be obtained. Therefore, it is desirable that the holding capacity acquisition step be executed after the holding state confirmation step is executed. (8) The holding capacity acquisition program according to any of (1) to (7), wherein the holding capacity acquisition program performs similar processing on a plurality of the electronic circuit components. The plurality of electronic circuit components may be a plurality of electronic circuit components of the same type or a plurality of electronic circuit components of different types. According to the former, it is possible to reduce the influence of the individual difference of the electronic circuit component on the detection of the holding capability of the suction nozzle, and according to the latter, it is possible to reduce the influence of the type of the electronic circuit component. (9) The holding capacity acquisition program according to any one of (2) to (8), including a dimension acquisition step of acquiring a component dimension that is a dimension of a preset portion of the electronic circuit component.
If the image pickup device picks up an image of the electronic circuit component and performs image processing, it is possible to obtain the dimensions of a predetermined portion of the electronic circuit component, and the obtained dimensions can be used for various purposes. The items described in (10) below are examples. The portion of the electronic circuit component whose size is to be obtained may be the length or width of the component or the length of a specific portion. (10) Based on the number of occurrences of holding failure acquired by executing the holding capacity acquisition program and the component size acquired when the holding failure occurs, the holding failure is detected when the set allowable value is applied. Based on the retention failure detection rate acquisition step for obtaining the detected rate, the number of cases that were normally held, and the part dimensions that were acquired during the normal holding, the holding state is normal when the set allowable value is applied. The holding capacity acquisition program according to the item (9), including at least one of a holding state false positive rate acquisition step of obtaining a ratio of electronic circuit components determined to be poorly held despite the existence. The allowable value is, for example, a value that defines an upper limit and a lower limit of the vertical or horizontal length of the electronic circuit component to be tested, the length of a specific portion, or the like. At the time of production, for example, an electronic circuit component after picking up is imaged, and if the component size obtained by the image processing is out of the allowable value range, the electronic circuit component is determined to be in a suction failure state and discarded. (11) A component recognition test program for testing whether or not at least one of an image pickup condition of an electronic circuit component and an image processing result of a captured image is included (3) to (10) Retention ability acquisition program. When the electronic circuit component holding capacity of the suction nozzle is acquired by imaging and image processing, it is premised that imaging and image processing are properly performed. According to the component recognition test program of this section, the holding ability can be acquired after confirming that the preconditions are satisfied. (12) The component recognition test program includes an image processing result comparing step of comparing image processing results of a plurality of images obtained by imaging the electronic circuit component in the same state a plurality of times under different imaging conditions (11). ) Section retention capacity acquisition program. If the electronic circuit components in the same state are imaged under different imaging conditions and the processing results of the obtained images are compared, the states of the imaging device and the image processing device can be clearly understood. (13) The holding capacity acquisition program according to the item (12), wherein the component recognition test program includes a minute movement step in which the electronic circuit component is moved within a range of being located in the imaging range. When it is necessary to minutely move the electronic circuit component, it is difficult to realize the minute movement accurately, and it is also possible to accurately detect the minute movement amount of the electronic circuit component by imaging and image processing. It's difficult. According to the feature of this section, it is possible to test whether or not the minute movement, the imaging, and the image processing are appropriately performed. It should be noted that in the fine movement, at least one of horizontal movement and rotational movement may be performed, or both may be performed individually or simultaneously. (14) In the item (13), the component recognition test program includes a micro-movement / test image-capturing repeating step of repeating a test imaging step of capturing an image of the electronic circuit component for a component recognition test and the micro-moving step. The retention capacity acquisition program described. By repeating the micro-movement and the imaging a plurality of times and processing the data of the plurality of images obtained as a result, the reliability of the test as to whether or not the micro-movement, the imaging and the image processing are appropriately performed can be improved. .. (15) A suction nozzle that sucks and holds an electronic circuit component by negative pressure, and a moving device that moves the suction nozzle.
A program for testing the electronic circuit component suction capability of the suction nozzle in an electronic circuit component handling device including a component supply device that supplies the electronic circuit component and an imaging device that captures an image of the electronic circuit component held by the suction nozzle. A suction step of sucking the electronic circuit component supplied by the component supply device to the suction nozzle; a first imaging step of capturing an image of the electronic circuit component that is sucked and held by the suction nozzle; A suction capacity acquisition program, comprising: a suction failure detection step of determining whether or not suction of an electronic circuit component is normally performed by the suction nozzle from the image processing result of the first imaging step. (16) The adsorption capacity acquisition program according to item (15), wherein the adsorption capacity acquisition program includes an adsorption condition changing step for changing the adsorption condition in the adsorption step. The suction conditions include, for example, a negative pressure supply start timing, which is a relationship between a negative pressure supply start time to the suction nozzle and a time when the suction nozzle starts contacting the electronic circuit component, the strength of the supply negative pressure, There is a nozzle dwell time, which is the time from when the suction nozzle contacts the electronic circuit component to when the suction nozzle starts to rise. (17) The suction capacity acquisition program according to the item (16), wherein the suction condition in the suction step is changed to a plurality, and the suction step, the first imaging step, and the suction failure detection step are executed. According to the feature of this section, the suction capability of the suction nozzle for the electronic circuit component can be obtained more clearly. Therefore, the suction condition may be changed to perform the test a plurality of times, or the suction condition may be changed every time the set number of electronic circuit components are sucked. A mode in which the above programs are recorded in a recording medium in a computer-readable state is also an embodiment of the present invention. Especially removable (FD, CD-ROM, H
D, MO, etc.) is desirable. (18) A nozzle holder that holds a suction nozzle that sucks an electronic circuit component by negative pressure, a moving device that moves the nozzle holder, an imaging device that images the electronic circuit component held by the suction nozzle, and A control device that moves the nozzle holder to a moving device and causes the image pickup device to image the electronic circuit component held by the suction nozzle before and after the movement, and an image obtained as a result of the image pickup before and after the movement. An electronic circuit component handling device including: a relative position change acquisition unit that acquires a change in the relative position of an electronic circuit component with respect to a suction nozzle before and after the movement by processing the data. The features described in each of the above items (4) to (14) are also applicable to the electronic circuit component handling device of this item. (19) A nozzle holder that holds a suction nozzle that suctions and holds an electronic circuit component by negative pressure, a moving device that moves the nozzle holder, and a component supply device that supplies the electronic circuit component.
An image pickup device for picking up an image of the electronic circuit component held by the suction nozzle, and moving the nozzle holder to the moving device to cause the suction nozzle to suck the electronic circuit component supplied by the component supply device, A suction condition changing unit including a control device for causing the image pickup device to image the sucked electronic circuit component, and the control device changing the suction condition of the electronic circuit component by the suction nozzle to a plurality of types, and Adsorbed to the suction nozzle by each of a plurality of types of suction conditions changed by the suction condition changing unit,
An electronic circuit component handling device, comprising: a suction capability acquisition unit that acquires the suction capability of the electronic circuit component by the suction nozzle by processing the data of the image of the electronic circuit component acquired by the imaging device. The features described in each of the items (1) to (14) are also applicable to the electronic circuit component handling device of this item, whereby the electronic circuit component adsorption capability and the electronic circuit component retention capability of the suction nozzle It is possible to obtain an electronic circuit component handling device having a function of acquiring both of the above.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic circuit component mounting machine including an electronic circuit component handling device according to an embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows an electronic circuit component mounting machine, and reference numeral 10 shows a base. Base 10
A printed wiring board 12, which is a type of circuit board, is placed above
Wiring board conveyor 14 that conveys in the axial direction (left and right direction in FIG. 1), component mounting apparatus 18 and component mounting apparatus 18 that mount electronic circuit component 16 (see FIG. 2), which is a type of electrical component, on printed wiring board 12. Component supply devices 20, 22 and the like for supplying the electronic circuit component 16 are provided. Of these, the component mounting device 18 is an example of an electronic circuit component handling device as an embodiment of the present invention.

The printed wiring board 12 has an electronic circuit component 16 by a wiring board holding device 24 as a board holding device.
The mounted surface on which the is mounted is held in a horizontal posture. The X-axis direction is a direction parallel to the mounting surface and parallel to one coordinate axis of the horizontal XY coordinate plane. Parts supply device 20, 22
Are provided on both sides of the wiring board conveyor 14 so as to be separated from each other in the Y-axis direction orthogonal to the X-axis direction. The component supply devices 20 and 22 are ones in which a large number of feeders 70 are arranged in the X-axis direction and installed on a table. Taping electronic circuit components are set in each feeder 70. In the taping electronic circuit component, the electronic circuit component 16 is accommodated in each of the component accommodating recesses formed at equal intervals in the carrier tape, and the openings of the component accommodating recesses are closed by the cover film attached to the carrier tape. Allows the electronic circuit component 16 when feeding the carrier tape, etc.
It is prevented from jumping out from the component accommodating recess. The carrier tape is fed in the Y-axis direction by a predetermined pitch, the cover film is peeled off, and the carrier tape is fed to the component supply position. The electronic circuit component 16 supplied by the feeder 70 includes an electronic circuit component having a lead and an electronic circuit component having no lead. In any case, since the electronic circuit component 16 is accommodated in the component accommodating concave portion having a size capable of ensuring an appropriate clearance, the component mounting device 18 holds the electronic circuit component 16 substantially at the center of the component mounting recess 18 and rotates the electronic circuit component 16 in a substantially correct rotation. It can be taken out in a posture.

A storage box 80, which is a collecting device for collecting the discarded electronic circuit components 16, is located between the wiring board conveyors 14, and is located at a position more than the holding position when the electronic circuit components 16 are mounted on the printed wiring board 12. It is provided on the positive side of the X axis. In this embodiment, a storage box 80, which is a general box, is used as the recovery device, but a transfer device such as a belt conveyor is provided on the bottom surface of the box so that the discarded electronic circuit components 16 can be automatically discharged. And so on.

The component mounting device 18 moves the holding device 100 (see FIG. 2) in a direction having components in the X-axis direction and the Y-axis direction which are orthogonal to each other so that the movement distance becomes as short as possible. The electronic circuit component 16 is conveyed and mounted on the mounting surface, which is the surface or the upper surface of the printed wiring board 12. Therefore, as shown in FIG.
Ball screws 104 as feed screws are provided on both sides of the wiring board conveyor 14 in the Y-axis direction parallel to the X-axis direction, and a nut 108 provided on the X-axis slide 106 (only one in FIG. 2 is provided). (Shown)
Are respectively screwed through a plurality of balls, and these ball screws 104 are rotated in synchronization with each other by the X-axis slide drive motor 110, so that the X-axis slide 106 is parallel to the X-axis. It can be moved to any position in the direction. As shown in FIG. 1, the X-axis slide 106 moves from the component supply device 20 to the wiring board conveyor 14
Has a length that extends beyond the component supply device 22. A guide rail 112 (see FIG. 2), which is a guide member, is provided below the two ball screws 104 on the base 10, and a guide block 114, which is a draft member fixed to the X-axis slide 106, is provided. It is fitted through a large number of balls. Above, nut 108, ball screw 1
04, the X-axis slide driving motor 110, and the like constitute an X-axis slide moving device 116.

As shown in FIG. 2, a ball screw 120 is provided on the X-axis slide 106 in parallel with the Y-axis direction, and a nut 124 fixed to the Y-axis slide 122 is screwed through a large number of balls. Has been done. This ball screw 120 is a Y-axis slide drive motor 126 (see FIG. 1).
By being rotated by the gears (128, 130), the Y-axis slide 122 is guided by a pair of guide rails 132, which are guide members, and moved to an arbitrary position in the Y-axis direction. Above, nut 124, ball screw 1
20 and the Y-axis slide drive motor 126 (see FIG. 1) constitute a Y-axis slide moving device 134, and the X-axis slide 106, the X-axis slide moving device 116, and the Y-axis slide moving device 134.
The XY moving device 136 is configured with the shaft slide 122, and the holding device 100 uses the XY moving device 136.
It can be moved to any position in the horizontal plane.

As shown in FIG. 2, a vertical side surface 140 of the Y-axis slide 122 is provided with an elevating device 144 for elevating the holding device 100 and a rotating device 146 for rotating the holding device 100 around its axis. The holding device 100 and the like constitute a component mounting unit 148. In this embodiment, three sets of component mounting units 1
The 48 are arranged side by side in one row in the Y-axis direction, but the arrangement is not limited to this, and the component mounting unit 1 is also provided.
The number of sets of 48 is also arbitrary, and only one set may be provided.
Each of the three sets of component mounting units 148 has a similar structure, and here only one will be described as a representative. Also,
To facilitate understanding in operation, one component mounting unit 148 will be representatively described.

Each of the component mounting units 148 of this embodiment has the same structure as the component mounting unit described in Japanese Patent Laid-Open No. 4-372199, and will be briefly described. Y
Support portion 15 provided on the side surface 140 of the shaft slide 122
As shown in FIG. 2, a hollow rod 156 that penetrates the support portion 150 in the vertical direction is provided at 0. Gears 158 and 160 are provided coaxially with the hollow rod 156,
Each of them is individually rotatably held by the upper part and the lower part of the support part 150. The gear 158 is the hollow rod 15
6 rotates integrally with a nut screwed with a male screw portion (not shown) of FIG. 6, and the gear 160 rotates integrally with a spline member fitted with a spline portion (not shown) of the hollow rod 156.

When the gear 158 is rotated by the nozzle elevating motor 164 (see FIG. 2), the hollow rod 156 is rotated.
Is moved in the axial direction and moved up and down. The nut, the gear 158, the nozzle elevating motor 164 and the like constitute the elevating device 144. The rotation angle of the nozzle lifting motor 164 is detected by the encoder 170. Further, if the gear 160 is rotated by the nozzle rotation motor 174 (see FIG. 3) and at the same time the gear 158 is rotated at the same speed by the nozzle lifting motor 164, the hollow rod 156 does not move up and down around the axis. Is rotated.

A holding device 100 is removably attached to the lower end of the hollow rod 156, and the holding device 1 rotates as the hollow rod 156 rotates about its axis.
00 is also rotated around its axis, and the holding device 100
The electronic circuit component 16 held by is also rotated about the same axis. The rotation angle of the nozzle rotation motor 174 is detected by the encoder 176 (see FIG. 3). The holding device 100 includes a holder 186 that detachably holds the suction nozzle 184 and a suction nozzle 184. Suction nozzle 1
84 includes a disc-shaped background forming portion 206 and an adsorption tube 192. The surface of the background forming portion 206 (the surface on the suction tube 192 side) and the suction tube 192 are matte black so that the reflectance with respect to the illumination light becomes low. It should be noted that the surface of the background forming portion 206 and the suction tube 192 may not be matte black, but may be another color as long as the reflectance with respect to the illumination light is low.

The suction nozzle 184 sucks the electronic circuit component 16 by negative pressure and mounts it on the printed wiring board 12 as a mounting target member. Therefore, the three suction nozzles 184
Are individually connected to the pressure supply device 210 via the connected hollow rods 156 (see FIG. 2), and three sets of directional control valve devices (not shown) provided in the pressure supply device 210 are switched. Thus, the negative pressure, the positive pressure, and the atmospheric pressure are selectively and individually supplied to the respective adsorption tubes 192. The suction pipe 192 adsorbs the electronic circuit component 16 on the upper surface of the electronic circuit component 16 by supplying negative pressure, and releases the electronic circuit component 16 by supplying atmospheric pressure. Positive pressure is supplied only for a short time to achieve a quick switch from negative pressure to atmospheric pressure. In this embodiment, the suction nozzle 184 suctions and holds the electronic circuit component 16 in a horizontal posture.

A lighting device 23 for illuminating the electronic circuit component 16.
0 and the electronic circuit component 16 are image pickup devices 248 in two sets, and the component supply device 2 in the X-axis slide 106 is provided.
They are fixed by brackets (not shown) between 0 and 22 and the wiring board conveyor 14, and move in the X-axis direction together with the X-axis slide 106 (only one set is shown in FIG. 2). That is, even if the X-axis slide 106 is moved in the X-axis direction when the electronic circuit component is mounted, the lighting device 230
The relative position between the image pickup device 248 and the X-axis slide 106 does not change, and the relative position between the illumination device 230 and the image pickup device 248 and the holding device 100 that can move only in the Y-axis direction does not change. The image pickup device 248
Includes a component camera 250 for capturing an image of the electronic circuit component 16 and a light guide device 251. The light guide device 251 has reflecting mirrors 252 and 254 as reflecting devices.

The illuminating device 230 and the reflecting mirror 252 are fixed to the X-axis slide 106 so as to be located between the component supplying devices 20 and 22 and the wiring board conveyor 14 and below the movement track of the holding device 100. Has been done. In the present embodiment, the lighting device 230 is provided above the reflecting mirror 252.

When the electronic circuit component 16 and the like are imaged, the electronic circuit component 16 is illuminated upward by the illumination device 230 located below them. The illumination device 230 is configured to illuminate the electronic circuit component 16 and the like from the facing direction. The illumination device 230 has a tapered cylindrical shape with a diameter increasing toward the top, and the illumination light emits the electronic circuit component 16
Is radiated toward. The lighting device 230 has a through hole in the center, and the light reflected by the electronic circuit component 16 passes through the through hole in the center.

As shown in FIG. 2, the component camera 250 has an X
It is attached to the shaft slide 106. The position between the wiring board conveyor 14 and the component supply devices 20, 22 and the opposite side to the holding device 100 with the X-axis slide 106 sandwiched therebetween is attached downward. The reflecting mirrors 252 and 254 are respectively the holding device 100.
Of the holding device 10 are located directly below the movement trajectory of the component camera 250 and at the same height as each other.
When the electronic circuit component 16 held at 0 is stopped at the image pickup position which is directly above the reflecting mirror 252, the light forming the image of the electronic circuit component 16 is guided to the component camera 250.

As shown in FIG. 1, the holding device 100 is moved by the XY moving device 136 when the electronic circuit component 16 is mounted, and the electronic circuit component 16 on the component supply device 20 or 22 is adsorbed on the printed wiring board 12. When you move to the
It is possible to easily stop the mirror 252 just above the reflecting mirror 252 regardless of the coordinates, and it is possible to stop the component camera 250 and take an image while moving the electronic circuit component 16 in the X-axis direction. it can. In this embodiment,
The component camera 250 is a surface imaging device and is a CCD camera. It is also possible to omit the reflecting mirror 254 and dispose the component camera 250 at a position facing the reflecting mirror 252 in a horizontal posture. Also, the component camera 250
Can be a line scan camera.

The electronic circuit component mounting machine is provided with a control device 300 shown in FIG. 3 as a control means. The control device 300 is mainly composed of a computer having a PU 302, a ROM 304, a RAM 306, and a bus 308 connecting them. An input / output interface 320 is connected to the bus 308, and the host computer 32
2. The image processing computer 324 and the encoder 176 for detecting the rotation angle of the nozzle rotation motor 174 are connected. The input / output interface 320 is also provided with a component camera 250, a lighting device 230, and a pressure supply device 21 via drive circuits 326, 328, and 329, respectively.
0 is connected. Furthermore, the image processing computer 3
24 and the component camera 250 are connected to each other, and the image data picked up by the component camera 250 is transmitted to the image processing computer 324 for image processing. The lighting device 230 is caused to emit light when power is supplied from the drive circuit 328 in accordance with the output signal of the input / output interface 320, and the luminance at the time of light emission can be changed by changing the supply voltage.

A servo interface 330 is also connected to the bus 308, and drive circuits 340, 342 and 34 are provided.
Various actuators such as an X-axis slide driving motor 110, a Y-axis slide driving motor 126, a nozzle elevating motor 164, and a nozzle rotating motor 174 are connected to each other via 4, 346, and their rotation angles are encoders. Detected by 350, 352, 170, 176. The nozzle rotation motor 174 and the like is a kind of electric motor as a drive source, and is a servo motor in the present embodiment, but any motor that can control the rotation angle can be adopted, and a step motor or the like can be used. You can also The RAM 306 stores various programs such as a mounting machine control program (not shown), an electronic circuit component imaging program, an electronic circuit component mounting program, and the like, as well as a suction / holding capacity test program shown in FIGS. 4 to 6. Has been done.

Next, the operation will be described. In this electronic circuit component mounting machine, the holding device 100 including the holder 186 and the suction nozzle 184 is moved to an arbitrary position in the horizontal plane by the XY moving device 136, and moved up and down by the elevating device 144 to supply the component. The electronic circuit component 16 is suction-held from the devices 20 and 22 by negative pressure, is positioned on the reflecting mirror 252, and is imaged by the imaging device 248.
The printed wiring board 12 held by the wiring board holding device 24 is mounted on the mounting position (see FIGS. 1 and 2). In that case,
XY moving device 136 by control device 300 (see FIG. 3)
It is necessary to control the position of the holding device 100 by the control of 1., but the position of the holding device 100 is defined by the position of the rotation axis of the holding device 100. That is, it is defined by the position of the rotation axis of the suction nozzle 184 held by the holding device 100.

When the electronic circuit component 16 sucked and held by the suction nozzle 184 is picked up and the obtained image is supplied to the image processing computer 324, image processing is performed,
The relative center position between the rotation axis position of the suction nozzle 184 and the center position of the electronic circuit component 16 (hereinafter referred to as the component center position) is acquired in a state where the holder 186 and the suction nozzle 184 are located at the rotation origin, and the electronic circuit is obtained. Part 16
The rotational position (hereinafter referred to as the component rotational position) of is acquired as the relative rotational position. In addition, the dimensions (hereinafter referred to as component dimensions) of predetermined portions such as the vertical and horizontal lengths of the electronic circuit component 16 are also acquired. When mounting the electronic circuit component 16, the suction nozzle 184 is rotated by the rotating device so that the component rotation position becomes equal to the regular rotation position, and the component center position at the component rotation position is moved to the regular mounting position.

When the suction nozzle 184 moves while holding the electronic circuit component 16, the suction nozzle 184 is selected, the negative pressure is supplied to the suction nozzle 184,
The electronic circuit parts 16 are not moved at the time of movement due to improper setting of acceleration / deceleration at the time of movement or the fact that the electronic circuit part mounting machine does not exhibit the ability to actually correspond to the set values due to the deterioration of the capacity. The relative center position and the relative rotational position of the suction nozzle 184 may change or the electronic circuit component 16 may drop. In addition, the electronic circuit component 1 is not adsorbed properly, and the electronic circuit component 16 is adsorbed in an unstable state (abnormal posture).
The relative center position and the relative rotation position of the No. 6 with respect to the suction nozzle 184 may change, or the electronic circuit component 16 may drop.

The suction / holding capacity test program is a program for testing or inspecting the suction capacity or holding capacity of the electronic circuit component 16 by negative pressure in the electronic circuit component mounting machine. For example, every day, every week, Every month, etc.
The suction nozzle 18 having a high incidence of suction failure or mounting failure is inspected whether or not the suction capacity and the holding capacity are appropriately maintained at regular time intervals, or from production information up to the present.
Inspecting whether or not the suction capacity and the holding capacity are appropriately maintained for the combination of 4 and the electronic circuit component 16,
Alternatively, it is possible to test whether the currently adopted conditions for adsorption and retention are appropriate, or to change the conditions to multiple types to determine the appropriate conditions. is there. It can also be said that the adsorption / holding capacity test program is a data collection program for determining a place requiring maintenance. Further, it is also used for measuring the dimensions of the electronic circuit component 16 which is used for the first time. The test also includes a test for inspection. The suction condition and the holding and moving condition will be described later.

This adsorption / holding capacity test program can carry out tests and inspections for various purposes as described above.
Although the execution condition should be set and used according to the purpose, here, a specific one component mounting unit 1 is used.
A case will be described as an example in which whether or not the adsorption condition, the holding and moving condition at the time of production are appropriately maintained is tested for 48.

The flow chart of the adsorption / holding capacity test program is shown in FIG. Step 1 (hereinafter abbreviated as S1,
The same applies to other steps), initialization of variables and memory, reading of various threshold values, model number, size, weight of electronic circuit component 16 set in component supply devices 20 and 22, Reading of various set values during production is performed.

In various settings of S2, the input screen is displayed on the display device, and the electronic circuit component 16 used for the test is selected according to the guidance of the screen. At this time, the selectable electronic circuit component 16 is limited to the type set in the component supply device 20, 22. Further, the test items include a component recognition test, a suction capacity test, and a holding capacity test, and various conditions for performing each test are set. This condition setting is performed according to the purpose of the test, and the setting items for the various conditions are shown in Tables 1 and 2, the contents of which will be described in the explanation of the subsequent steps. In the initial setting, the test item to be executed is in a non-selected state, and by selecting execution for any of the test items, the selected test item is executed.

[0031]

[Table 1]

[0032]

[Table 2]

In the component recognition test of S3, the suction nozzle 18
A test is performed as to whether or not the image pickup and image processing of the electronic circuit component 16 held in No. 4 are appropriately performed. Since the suction / holding capacity test is performed based on the analysis processing result of the image acquired by the image pickup of the electronic circuit component 16 held by the suction nozzle 184 after the suction or the movement, the image pickup and the image processing are appropriately performed. Because it is essential to be done. If the imaging conditions in S3 are not appropriate, S4
Is determined to be NO, the imaging condition is changed in S2, and then the component recognition test is performed again. Although the image processing method can be selected in S2, the one used at the time of production is selected here. Further, when a plurality of image processing methods are selected, a plurality of image processing results are obtained from the captured images, and differences in acquired data due to different image processing methods can be compared. Details of S3 will be described later. Note that this S3 corresponds to the main part of the component recognition test program.

In the holding movement / imaging, etc. of S5, the number of occurrences of suction failure when the electronic circuit component 16 is suctioned by the suction nozzle 184 is counted, and the suction capability is tested. Further, the suction nozzle 184 holding the electronic circuit component 16 is caused to perform a preset test operation, and images are taken before and after the test operation. The image obtained by the image pickup is subjected to image processing, and the electronic circuit component 16 is dropped,
The number of occurrences of a relative position change, which is a change in the relative center position and the relative rotation position between the suction nozzle position and the electronic circuit component 16, is counted and the holding ability is tested. After the process of S5 is performed for the set number of electronic circuit components 16, S6 is performed.
Various test results such as a suction failure occurrence rate, a drop rate of the electronic circuit component 16 held in the suction nozzle 184 due to the test operation, a relative position change occurrence rate, and the like are displayed in the test result display of FIG. Further, those test results are compared with respective preset threshold values, and if it is less than the threshold value, it is determined that the suction capacity or the holding capacity is maintained.
When it is determined that the suction capacity or the holding capacity is lowered, the operator performs maintenance of the electronic circuit component mounting machine or changes of various conditions. Also,
In S7, a screen for selecting whether to perform the test again or to finish is displayed, and if it is selected to perform the test, S2
If the process from is executed again and the end is selected, S8
After the end processing of (1) is executed, the adsorption / holding capacity test program is ended. Details of each of the above steps will be described below.

In the component recognition test of S3, the suction nozzle 18
The electronic circuit component 16 held in 4 is finely moved or rotated in the horizontal direction within the range of the imaging screen, and the calculated component center position and component rotation position of the electronic circuit component 16 by the designated movement, The captured image is image-processed and the component center position and the component rotation position are compared, respectively, and the recognition test center position error and the recognition test rotation position error, which are the errors in the image processing result during minute movement, are detected. Desired. Hereinafter, these two errors are collectively referred to as a position error during recognition test.

Imaging and image processing in S3 are performed a plurality of times under different conditions. For example, it is possible to perform imaging under the imaging conditions at the time of production and imaging under the imaging conditions in which the amount of light incident on the imaging surface is increased or decreased by adjusting the diaphragm of the component camera 250 and the imaging time while keeping the intensity of the illumination light unchanged. Then, the position error during the recognition test and the change in the image processing error occurrence rate are examined. In addition, the change of the imaging condition is performed by the lighting device 230
The illumination light amount may be increased or decreased. The image processing error is a state in which the boundary line between the electronic circuit component 16 and the background cannot be recognized by the image processing computer 324, the electronic circuit component 16 is not located within the imaging range, that is, is not held. Will be output if When an image processing error is output, it is determined that a suction failure such as a suction error or abnormal suction has occurred, and an operation of discarding the electronic circuit component 16 is performed regardless of whether or not the electronic circuit component 16 is held. The electronic circuit component 16 is newly adsorbed and held by the component supply devices 20 and 22. It should be noted that the suction condition for sucking the electronic circuit component 16 is set to a value that is less likely to cause suction failure,
As the movement condition, the set value at the time of production is used. Details of the suction condition and the transfer condition will be described later.

Regarding the amount of light incident on the image pickup surface, for example,
The imaging conditions that are the incident light amount at the time of production, the imaging conditions that reduce the incident light amount by a predetermined amount (for example, 20%), and the imaging conditions that increase the incident light amount by a predetermined amount (for example, 20%) are imaged three times in total, and the respective imaging conditions are performed. The position error and the image processing error occurrence rate during the recognition test are compared. Among these multiple imaging conditions, the position error and image processing error occurrence rate during recognition test are the lowest, and the threshold value is the threshold error and the image processing error occurrence ratio during threshold recognition test. If the condition is small, the imaging condition is appropriate. If the position error during recognition test and the image processing error occurrence rate are larger than the respective threshold values under all three imaging conditions, the imaging conditions are changed and the component recognition test is performed again. Execution of one set of imaging / image processing in S3 means that imaging is performed a plurality of times under mutually different imaging conditions, and the suitability of the imaging conditions is determined based on these.

As described above, it is desirable that a plurality of different image pickup conditions be set during the component recognition test. However, if the reference data for the target electronic circuit component 16 has been acquired in the past test, that It is also possible to compare the position error during recognition test or image processing error occurrence rate with the position error during recognition test or image processing error occurrence rate obtained by imaging under the same single imaging condition as the past test. .

FIG. 5 is a flow chart of the component recognition test of S3.
Shown in. The variable N is set to 0 (S21), and the electronic circuit component 1
6 is adsorbed (S22). The electronic circuit component 16 held by the suction nozzle 184 is moved to the image pickup position and one set of image pickup is performed (S23). The acceleration and deceleration of the movement and rotation of the suction nozzle 184 at this time are made equal to or smaller than those when the electronic circuit component 16 is mounted, and the component position (component center position and component rotation position) that is the position of the electronic circuit component is set. ) Is less likely to occur. The data of the image obtained by the image pickup is processed, and the position and the component size of the electronic circuit component 16 are obtained. At this time, in the image processing results under all imaging conditions, if the component dimensions are out of the set range or if the electronic circuit component 16 is not recognized, it is determined that the suction is defective, and the suction nozzle 1
After the electronic circuit component 16 held by 84 is discarded in the storage box 80 (S25), a new electronic circuit component 16 is adsorbed and a set of images is taken (S22, 23). In the suction / holding capacity test program, when the captured image is image-processed, the part size is acquired and S
The image pickup / image processing such as 23 includes a dimension acquisition step.

The component dimensions and allowable values will be described. In the actual image pickup and image processing at the time of production, the component position and the dimension of each part of the component are acquired, and when the component dimension is out of the range of the allowable value, it is determined as abnormal suction and the electronic circuit component 16 held at that time is held. Are discarded. For example, the upper limit and the lower limit of the vertical and horizontal dimensions of the part are set as the vertical upper limit threshold, the vertical lower limit threshold, the horizontal upper limit threshold, and the horizontal lower limit threshold. If at least one of the vertical and horizontal dimensions of the electronic circuit component 16 is out of the allowable range, it is determined that the electronic circuit component 16 is in the abnormal suction state. However, when the electronic circuit component 16 has a large variation in component dimensions, when the image pickup and the image processing are performed,
Although the electronic circuit component 16 having a large dimensional error is normally suction-held, it is discarded as abnormal suction. In the component recognition test of the suction / holding capacity test program, the allowable value is set to the same value as that at the time of production, and even if the component size of the electronic circuit component 16 is outside the allowable value range, it is determined to be abnormal suction. It

Electronic circuit component 16 by suction nozzle 184
If it is determined that the adsorption failure of No. has occurred, the variable M becomes 0.
(S26), a minute movement and one set of imaging / image processing for each minute movement are performed, and a recognition test position error for each imaging condition is obtained (S27, 28). S27-30
At the set horizontal movement and 1 for each movement
A set of images and one set of images for each set rotation and each rotation are set. In the setting of the minute movement in S2, if the movement of the Y axis in the positive direction (upward in FIG. 1) is expressed by + and the movement in the negative direction is expressed by −, for example, it is assumed that the movement is performed 6 times, +1 mm, +2 mm. , -3mm,-
1 mm, -2 mm, +3 mm are specified in order by the movement amount. It is only necessary to set one or more movement amounts, and when the value is 0, one set of imaging is performed at the same position. For the setting of rotation, the electronic circuit component 16 is rotated by a set angle, and the setting of the angle is, for example, 5, 5, 5, 5 is performed by rotating 5 degrees four times. In this case, the horizontal movement is performed 6 times and the rotation is performed 4 times, so that a total of 9 times of minute movements and one set of imaging for each are performed. Further, it may be set so that at least one of the size and direction of the rotating angle changes, for example, 1 degree, −3.
The settings include degrees, 5 degrees, -7 degrees, and 9 degrees.

In the present embodiment, the image pickup device 2
48 is provided on the X-axis slide, and the suction nozzle 18
Since the relative position between the image pickup device 4 and the imaging device 248 in the X-axis direction cannot be changed, it is impossible to move the electronic circuit component 16 in the X-axis direction within the imaging range. However, electronic circuit components 16
It is also possible to use it in a device having a versatility in which the image pickup device 248 and the suction nozzle 184 can move relative to each other in the X-axis direction and the Y-axis direction. . Further, in the present embodiment, the movement amount of the minute movement is set, but it may be set by coordinates. For example, the XY coordinates of the imaging center are (0, 0), and the movement coordinates are (-3, -3), (-2, -2), (-1,-).
1), (0,0), (1,1), (2,2), (3
It is possible to set 3) and move them in that order, or move them in the reverse order. Further, the above-mentioned two types of movement may be performed together (reciprocating movement) or may be repeated. Further, it may be moved randomly. The minute movement may be performed in the X-axis direction or the Y-axis direction, or may be performed simultaneously in the X-axis direction and the Y-axis direction as described above. Furthermore, the component center position and the component rotation position may be corrected and moved to preset coordinates (for example, image pickup center position) and rotation position (for example, an angle at which a horizontal side is horizontal). .

When such one movement or rotation and one set of image pickup and image processing are performed on one electronic circuit component 16, the value of the variable M is increased by 1 (S27-2).
9), until the value of the variable M becomes equal to the set sum of the number of horizontal movements and the number of rotations, the determination in S30 becomes NO and S2.
The processing of 7 to 30 is repeated. YES in S30
Then, the process for one electronic circuit component 16 is finished, and the variable N is incremented by 1 (S31), and then the electronic circuit component 16 is discarded in the storage box 80 (S32), and the variable N indicating the number of processed items is stored. If the value is less than the set number (S
33), the next new electronic circuit component 16 is adsorbed and held, and a set of images is taken. When such a series of processes is performed on the set number (for example, 5) of electronic circuit components 16, the other processes of S34 are performed.
In the other processing of S34, for example, the average value of the obtained position errors during the recognition test and the image processing error occurrence rate are displayed. This part can be considered as a recognition test result display step. If the position error during the recognition test is obviously large only for the result of the specific electronic circuit component 16, the electronic circuit component 16 is sucked in an unstable state (abnormal posture) by the suction nozzle 184 in an abnormal suction state. It is presumed that the electronic circuit component 16 is present, and the result data of the electronic circuit component 16 is excluded without being used for obtaining the average value of the position error during the recognition test and the image processing error occurrence rate. The steps S27 to S30 correspond to the minute movement / test imaging repeating step, and the image processing result comparing step is included in S34.

The amount of light incident on the image pickup surface is appropriate due to changes in the position error and the image processing error occurrence rate during the recognition test, and
Positioning error during recognition test and image processing error occurrence rate are preset values respectively.Imaging conditions that are lower than position error during threshold recognition test and threshold image processing error occurrence rate are determined to be appropriate conditions. The imaging conditions are applied to the subsequent tests. Even if it is determined that the incident light amount is insufficient due to changes in the position error and the image processing error occurrence rate during the recognition test, and the test is performed again after increasing the incident light amount, the position error during the recognition test and the image processing error occurrence rate remain. If it does not fall below the threshold value, it is assumed that the amount of light emitted from the lighting device 230 is insufficient. In this case, if maintenance of the lighting device 230 is performed by the operator, such as replacement of the light emitting body, and then the component recognition test is selected again, the operation shown in FIG.
The determination is NO in S4, the imaging condition is set again in S2, and then the component recognition test is performed again to set an appropriate imaging condition.

On the other hand, when the end of the component recognition test is selected, the test operation / imaging of S5 is performed. In the test operation / imaging, etc., when the electronic circuit component 16 supplied from the component supply device 20, 22 is adsorbed by the adsorption nozzle 184, the adsorption capacity test for acquiring the number and occurrence rate of the adsorption failure of the electronic circuit component 16, A holding and moving test is performed to acquire a relative position change caused by moving the electronic circuit component 16 held by the suction nozzle 184. At least one of when the relative center position change is greater than the threshold relative center position change value, which is a preset value, and when the relative rotational position change is greater than the threshold relative rotational position change value. It is determined that the relative position change has occurred.

The suction condition for sucking the electronic circuit component 16 in the suction capability test is that the suction nozzle 184 is lowered and the negative pressure is supplied shortly before the tip of the suction nozzle 184 contacts the electronic circuit component 16. Negative pressure supply time, which is the time for which the suction nozzle 184 is performed, the nozzle dwell time, which is the time when the tip of the suction nozzle 184 contacts the electronic circuit component 16, and the acceleration when the suction nozzle 184 rises after the suction of the electronic circuit component 16. There is a rising acceleration after adsorption. By setting these adsorption conditions, it is easy to adsorb, conditions that are used during production and have a sufficient adsorption capacity (adsorption conditions during production), adsorption is possible, but there is no adsorption capacity. The test can be performed under conditions (conditions where adsorption is not easy), conditions where adsorption failure is likely to occur (conditions where adsorption is difficult), and the like. Since the rate of occurrence of adsorption failure is low under the conditions where the adsorption is easy and the adsorption conditions at the time of production, the electronic circuit component 16 to be processed must be processed in order to obtain accurate adsorption capacity test results.
There is no choice but to increase the number of. Therefore, in S2,
If the conditions under which the suction failure is likely to occur are set, it is possible to perform a test in which the number of processed electronic circuit components 16 to be tested is at least accurate or a test for confirming the suction capacity margin. Whether or not the incidence of adsorption failure is higher than the past test results, and the incidence of adsorption failure obtained in the adsorption capacity test is a predetermined threshold value. It can be determined whether or not When the occurrence rate of adsorption failure is not much different from the past test results, it is determined that the adsorption capacity has not deteriorated. If the suction failure occurrence rate is less than or equal to the threshold suction failure occurrence rate, it is assumed that the suction failure occurrence rate during production is even lower, and even if the suction capacity of the electronic circuit component mounting machine is slightly reduced,
The suction failure occurrence rate in that state is estimated to be equal to or lower than the suction failure occurrence rate under the condition where suction is difficult, and it is determined that the suction capacity has a margin. As described above, the effect of stricter conditions when performing the adsorption capacity test is almost the same as in the retention capacity test.

For the reasons described above, in S2, a value such that adsorption failure is more likely to occur (for example, the preceding negative pressure supply time and the nozzle dwell time are 80% or 60% of the value during production).
It is desirable to set the acceleration after adsorption to 120%). In order to confirm the margin at the time of picking up the electronic circuit component 16, the suction capacity test is performed under the condition that the suction failure is more likely to occur than in the production. Also, if it is estimated that the adsorption capacity is insufficient, or if the retention capacity test is more important than the adsorption capacity test, the adsorption capacity test will be performed at a set value at which adsorption failure is less likely to occur than during production. It is also possible to do. In addition, since the suction ability is not tested in the component recognition test of S3, it is better that the suction failure does not occur as much as possible. For example, the preceding negative pressure supply time is the set value at the time of production, and the nozzle retention time is the time at the time of production. 150% of the set value,
It is desirable to set the suction acceleration condition to be 50% of the set value at the time of production so that the suction becomes easy.

FIG. 6 shows the processing performed in the test operation / imaging of S5. In this S5, for example,
The allowable value is set to a large value such as between 80% and 120% of the standard value of each side, and almost all the electronic circuit components 16 normally held by the suction nozzle 184 are determined to be within the allowable range. To be done. Only when the acquired component sizes are significantly different, such as when standing up and holding, it is determined that the size is out of the allowable range. This prevents the electronic circuit component 16 whose component size is out of the allowable range due to variations even though it is normally held, from being erroneously recognized as being in a state of poor suction or poor holding and discarded. This is because When the electronic circuit component 16 is picked up and image-processed after being sucked, it is determined that the electronic circuit component 16 has not been sucked, and if the electronic circuit component 16 has an abnormal suction such as a suction error or a vertical suction holding, the electronic circuit component 16 is not defective. When the component is dropped or the relative position is changed by the image pickup and the image processing after the movement of the suction nozzle 184 that holds the component, it is determined that the component is not properly held.

The variable L is set to 0 in S51. The electronic circuit component 16 is adsorbed by the adsorption nozzle 184, moved to the imaging position and imaged (S52, 53). As a result of the image processing, the electronic circuit component 16 is not held in the adsorption nozzle 184 or the component size is reduced. If it is out of the allowable range, it is determined that the suction is defective (S54). In this way, the determination as to whether or not the suction has been performed is performed each time a new electronic circuit component 16 is sucked, and when the suction failure occurs, the variable C0 is set to 1
The number of occurrences of suction failure is increased (S55). After that, the electronic circuit component 16 is discarded in the storage box 80 (S56), and then a new electronic circuit component 1 is again provided.
6 is adsorbed. These steps S52 to S56 correspond to a part of the adsorption capacity test. If it is determined that the suction failure has not occurred, S57 is executed.

The holding / moving conditions when the holding / moving test is performed include the shape and inner diameter of the suction nozzle 184 as holding conditions, and the acceleration / deceleration and maximum speed when moving in the horizontal / vertical directions as moving conditions, and the suction. The angular acceleration / deceleration and the maximum rotation speed when the nozzle 184 rotates are applicable.
Note that, here, the suction nozzle 184 is selected to be the same as that used at the time of production for the electronic circuit component 16 used for the test.

In the test operation 1 of S57, it is confirmed whether or not the holding state of the electronic circuit component 16 by the suction nozzle 184 is normal. Therefore, the test operation 1 in S57
Is performed on the storage box 80 shown in FIG.
The electronic circuit component 16 in a state in which the holding is incomplete is dropped. FIG. 7 shows the electronic circuit component 1 on the storage box 80.
6 shows an example of the movement route of 6. First, the imaged electronic circuit component 16 is positioned at point a. Next, it is moved horizontally to point b, and then c point, b point, d point, b point, a point, c
It can be moved to point a. After the horizontal movement, the set number of descending and ascending movements are performed at the point a, and the set angle is rotated and the set angle is inversely rotated. In addition,
When moving between the imaging position and point a, the acceleration / deceleration is reduced. For example, it is 50% of that at the time of production, and the electronic circuit component 16 is prevented from dropping at a place other than the storage box 80. The same applies to the test operation 2 described later.

In the test operation 1 of S57, for confirmation of the holding state, for example, the acceleration / deceleration and maximum speed during horizontal movement and vertical movement, and the angular acceleration / deceleration and maximum rotation speed during rotation are produced. The holding movement condition similar to that at the time is set and the above-described operation is performed.
Further, for example, the descending / ascending movement is performed once, and the rotation with the rotation angle of 90 degrees and the reverse rotation are performed once.
As a result of imaging after the test operation, if the electronic circuit component 16 is not held by the suction nozzle 184 or if the component dimension obtained by the image processing is outside the allowable value range, the electronic circuit is not tested during the test operation. It is considered that the component 16 has fallen or is in an abnormal holding state, it is determined that the first type holding failure has occurred, and the variable C1 is incremented by 1 (S58, 5).
9, 60). Then, after the electronic circuit component 16 is discarded (S61), the new electronic circuit component 16 is adsorbed from the component supply devices 20 and 22, and the holding state is confirmed again by the test operation 1 (S52 to 57). ). When the relative position change is detected, it is determined that the second type holding failure has occurred and the variable C2 is increased by 1 (S62, 63), and the suction nozzle 1
The electronic circuit component 16 held by 84 is discarded in the accommodation box 80 (S64), and the holding state of the newly adsorbed electronic circuit component 16 is confirmed. If no relative position change is found, it is determined that the holding state is normal, and the process proceeds to S70. Note that S57 and S58 correspond to the holding state confirmation step.

In the test operation 2 of S70, the movement route is the same as that of the test operation 1 of S57, but the holding and moving conditions are made stricter than in the actual production. For example, in S2, the acceleration / deceleration at the time of horizontal movement, descending / ascending movement, and the angular acceleration / deceleration at the time of rotation are set to 130% of those at the time of production, and the electronic circuit component 16 is displaced or dropped from the suction nozzle 184. The condition is such that it is easy to do, and three sets of descending and ascending movements at point a and three sets of 90-degree rotation and reverse rotation are performed. Set number of times (eg 3
When the second test operation 2 is completed, the electronic circuit component 16 is imaged, and the relative position change is detected by image processing (S71, 72). After that, the variable N is incremented by 1.

When it is determined that the electronic circuit component 16 has dropped, the variable C3 is incremented by 1 (S73, 7).
4) If the relative position change occurs, the variable C4 is incremented by 1 (S75, 76). It should be noted that if the component size is determined to be outside the allowable range due to standing suction and holding, or if an image processing error occurs, it is considered that the electronic circuit component 16 has dropped. When the determination based on the image processing result is completed, the electronic circuit component 16 held by the suction nozzle 184 is discarded and the variable L is incremented by 1 (S77,
78). If the value of the variable L is less than the number of processed electronic circuit components 16 (for example, 30 or 60) set in S2, the process proceeds to A and a new electronic circuit component 16 is adsorbed and the electronic circuit component is picked up. A series of processing is performed on 16. If the value of the variable L becomes equal to the set number of processes,
After the end processing of S80 is performed, the processing returns to the adsorption / holding capacity test program of FIG. Note that S70 to S76 correspond to the holding capacity acquisition step, and the relative position change detection step is included in the imaging / image processing of S58 and S72.

In the suction capacity / holding capacity test, the greater the number of electronic circuit parts 16 to be processed, the higher the test accuracy. In particular, it is desirable to process many electronic circuit components 16 when testing a newly introduced type of electronic circuit component 16. The number to be processed varies depending on the occurrence rate of adsorption failure, retention failure, insufficient holding capacity, etc., so it is desirable to reduce the number of processings by strictly setting adsorption conditions and holding transfer conditions and conducting tests. It is also possible to perform the test until at least one of the number of occurrences of adsorption failure, the number of occurrences of retention failure, the number of occurrences of insufficient holding capacity, or the total of these occurrences reaches a preset number. . Even in the component recognition test, the accuracy increases as the number of processed objects increases.

In the test operation / imaging of S5, the test operation 2 of S70 is repeated a set number of times and then the image / image processing of S72 is performed. The image / image processing is executed each time the test operation 2 is performed. You can also do so. And
If the moving / imaging repeating step is performed in which the test operation 2 and the imaging / image processing are repeated a set number of times, the test operation 2
It is possible to determine whether the relative position change has occurred or the electronic circuit component 16 has fallen, and it is possible to evaluate the holding capacity in more detail.

When the test operation / imaging of S5 is completed, S
The test result display of 6 and the like are executed. The test results include the following items. Adsorption failure occurrence rate, holding failure occurrence rate, dimensional statistics, dimensional statistics of defective holding products, relative position change occurrence rate that is the occurrence rate of relative position change equal to or greater than the threshold relative position change value that occurred in test operation 2, test operation 2) Failure retention detection that is calculated by estimating the rate at which an abnormal holding state can be detected by applying the component drop rate, which is the rate at which the electronic circuit component 16 has dropped, etc. Rate, a holding state error rate estimated by calculation as to how much of the normally held electronic circuit component 16 is falsely recognized as an abnormal holding state when the allowable value at the time of production is applied. It is acquired and displayed.

The suction failure occurrence rate is calculated by taking the number of suction failure occurrences (variable C0) as the total number of times of suction (setting processing number + C0 + C1 + C).
Calculated by dividing by 2). The number of setting processings is equal to the number of test operations 2 and imaging performed. The variable C1 is the number of drops of the electronic circuit component 16 due to the test operation 1, and the variable C2 is the number of occurrences of relative position change due to the test operation 1. The retention failure occurrence rate is the number of type 1 retention failure occurrences (variable C1) and the number of type 2 retention failure occurrences (variable C
2), which is the sum of the number of defective holding occurrences (C1 + C2), divided by the difference between the total number of adsorption times and the number C0 of defective adsorption occurrences (number of set processing + C1 + C2). In addition,
If the retention failure is regarded as a suction failure in a broad sense, the suction failure occurrence rate in a broad sense is obtained by dividing the suction failure in a broad sense (variable C0 + C1 + C2) by the total number of suctions. By comparing these results with the past test results and the test results when the target electronic circuit component 16 is introduced, it is possible to determine whether or not the suction capability of the electronic circuit component mounting machine has changed. Also, when the suction failure occurrence rate or the retention failure occurrence rate is equal to or higher than the threshold value set for each, it is desirable to change the suction condition or inspect the negative pressure supply device and the supply path. Is done.

The component drop rate is obtained by dividing the number of drops (variable C3) by the test operation 2 by the set processing number. The relative position change occurrence rate is obtained by dividing the number of relative position change occurrences (variable C4) by the test operation 2 by the setting processing number. Further, the fact that the electronic circuit component 16 held by the suction nozzle 184 drops due to the test operation and that the relative position change occurs indicate that the holding capacity is insufficient, so the number of drops (variable C3) and the relative position change occurrence count (variable C4), which is the sum of the holding capacity shortage status occurrences (C3 + C4), can be divided by the set processing number to obtain the holding capacity shortage rate indicating the lack of holding capacity. . Based on at least one of these three results, it is possible to judge whether the holding capacity is sufficient or the holding and moving conditions are appropriate, and at that time, the preset threshold values are set. It is effective to compare the threshold component drop rate, the relative threshold position change rate, and the threshold retention capacity shortage rate.

For the dimensional statistics, the average value, the maximum value, the minimum value, the standard deviation, etc. of the vertical and horizontal lengths of the electronic circuit component 16 are obtained. As the dimensional statistics at the time of poor holding, the average value, the maximum value, the minimum value, and the standard deviation of the vertical and horizontal lengths of the electronic circuit component 16 determined to be poor holding are obtained. The defective holding detection rate is defined as the number of electronic circuit components 16 having a component size out of the range when the allowable value at the time of production is applied, out of the (C1 + C2) electronic circuit components 16 determined to be defective holding. It is obtained by dividing the number of occurrences of retention failures (C1 + C2). The holding state error rate is out of the range when the allowable value at the time of production is applied to the set number of electronic circuit components 16 which are not defective holding, that is, the electronic circuit components 16 for which the test operation 2 is performed. It is obtained by dividing the number of parts 16 by the setting processing number.

The retention failure detection rate and the retention state erroneous rate will be supplementarily described. If it is desired to eliminate the electronic circuit component 16 that is not properly held,
The allowable value may be set so that the allowable range of the vertical and horizontal dimensions is narrowed so that the component dimension acquired when the holding failure is actually caused is not permitted as much as possible. However, if the allowable range is simply narrowed, the possibility that a holding failure will be detected will certainly increase, but since the holding state is normal but the part dimensions are outside the allowable range, it is judged as a holding failure. The number of electronic circuit components 16 that are disposed of and discarded is also increased. Therefore, if the statistical data of the dimensions of the electronic circuit component 16 and the statistical data of the dimensions in the poor holding state (abnormal holding state) are acquired in advance, the allowable range of the dimensions is appropriately determined based on them. be able to. The permissible range can be set so that the holding state error rate can be kept relatively low and a relatively high holding failure detection rate can be obtained. Further, in addition, when the same allowable value is applied to the electronic circuit components 16 having the same nominal size, the electronic circuit components 16 having a large dimensional variation are determined to be out of the allowable range and are discarded. Therefore, it is disadvantageous in terms of cost. The holding state false positive rate is one of the indexes to be considered when selecting the electronic circuit component 16 to be purchased. The holding failure detection rate acquisition step, the holding state false recognition rate acquisition step, and the holding ability pass / fail judgment step are included in S6.

In the test result display of S6 and the like, it is possible to change the set values of various conditions at the time of production in accordance with the guidance of the display. The changed set value is supplied to the host computer 322 through the input / output interface 320, and the data of the host computer 322 is rewritten. In response to the display asking whether to perform the test again, when the test execution is selected again, the determination in S7 is NO, and in S2, the selection of the electronic circuit component 16 is started and various settings are performed. A series of tests is executed again. When the end of the test is selected, the end process of S8 is performed, and then the process returns to the higher-level placement machine control program (not shown).

The above description is for one component mounting unit 1.
Although the test is performed for 48, it is possible to test all the mounted component mounting units 148.
For example, a series of tests may be performed individually for each component mounting unit 148, or for all component mounting units 148.
Alternatively, the electronic circuit component 16 may be adsorbed and held by the tester.

The above explanation is that when confirming by tests whether the adsorption capacity and the retention capacity are normally maintained,
That is, this is a description of the case of inspecting the adsorption ability and the retention ability, but other than that, various tests can be performed according to the purpose. For example, it is difficult to suck and hold the curved surface of the electronic circuit component 16 on the surface sucked and held by the suction nozzle 184, but in such a case, suitable conditions for suction and holding movement are preferable. The following preliminary conditions can be determined based on the results of the adsorption / retention capacity test program. For the electronic circuit component 16 that is difficult to be sucked and held, for example, a test is performed by setting conditions that make it easy to suck, conditions that make it easy to hold, and conditions that make it difficult to drop, etc.
By referring to the result and repeating the test while tightening various conditions, it is possible to set various conditions to optimum set values. The preliminary condition is not the optimum condition, but is a condition of the adsorption and holding movement that is temporarily used when the adsorption and holding and moving operation under the optimal condition is impossible. For example, in actual production, it is not always possible to use the suction nozzle 184 having the optimum shape and inner diameter for the electronic circuit component 16 to be suction-held, and there is a case where the non-optimal suction nozzle 184 is used. In this case, if the suction condition and the holding movement condition are set in advance, the electronic circuit component mounting machine can perform the mounting work as efficiently as possible within a range in which the suction failure, the holding failure, and the like do not occur.

Further, for example, when the acquired component position, component size, etc. are different due to the difference in the image processing method,
It can be used to compare those differences and to test newly adopted image processing methods. In the component recognition test of S3, if one or a plurality of image processing methods to be tested are selected in S2, the images acquired by one image capturing are processed by the selected image processing method, In addition to the component position and the component size, the position error during the recognition test and the image processing error occurrence rate are obtained. If these image processing methods having a low position error rate in the recognition test and the image processing error occurrence rate are applied as the image processing method of the tested electronic circuit component 16, a higher precision image processing result can be obtained. Further, it is possible to set a plurality of image pickup conditions and determine the optimum image pickup condition in each image processing method.

Further, if various settings are made in S2 so that the component position, the component size, etc. are acquired by using a plurality of image processing methods in the test operation / imaging in S5, the holding failure for each image processing method will occur. The detection rate and the false alarm rate of the holding state are obtained,
By comparing them, it is possible to determine the optimum image processing method for detecting the retention failure of the electronic circuit component 16 to be tested. In this case, the optimum imaging conditions do not vary greatly depending on the image processing method, but it is desirable to determine the optimum imaging conditions for each image processing method in the component recognition test in S3.

The image pickup method of this embodiment uses the electronic circuit component 16
The front image of the electronic circuit component 16 is obtained by illuminating the electronic circuit component 16 from the direction opposite to the suction nozzle 184, but the electronic circuit component 16 is illuminated from the rear side to obtain the silhouette image of the electronic circuit component 16. Even so, the adsorption / holding capacity test program can be applied.

Although the embodiment of the present invention has been described in detail above, this is merely an example, and the present invention is described in the section [Problems to be solved by the invention, problem solving means and effects]. It can be carried out in various modified and improved forms based on the knowledge of those skilled in the art.

[Brief description of drawings]

FIG. 1 is a plan view showing an electronic circuit component mounting machine including an electronic circuit component handling device according to an embodiment of the present invention.

FIG. 2 is a side view (partially sectional view) showing the electronic circuit component mounting machine.

FIG. 3 is a block diagram showing a part deeply related to the present invention in the control device of the electronic circuit component mounting machine.

FIG. 4 is a flowchart of an adsorption / holding capacity test program that is an embodiment of the present invention.

FIG. 5 is a flowchart showing a component recognition test of the above program.

FIG. 6 is a flowchart showing a preceding stage of test operation / imaging, etc. in the program.

FIG. 7 is a diagram showing a path of horizontal movement in the test operation during the test operation / imaging and the like.

[Explanation of symbols]

12: Printed wiring board 14: Wiring board conveyor 1
6: electronic circuit component 18: component mounting device 20, 22: component supply device
24: Wiring board holding device 80: Storage box 100: Holding device 106: X-axis slide 116: X-axis slide moving device 122:
Y-axis slide 134: Y-axis slide moving device 136: XY moving device 144: Lifting device 14
6: Rotating device 148: Component mounting unit 18
4: Suction nozzle 186: Holder 192: Suction tube 206: Background forming unit 230: Lighting device 2
48: Imaging device 250: Component camera 251: Light guide device 252
254: Reflecting mirror 300: Control device 324: Image processing computer

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 3C007 BS03 DS01 FS01 KS05 KT01                       KT06 KV01 MT02 NS17                 5E313 AA03 AA11 AA18 CC03 CC04                       DD01 DD02 DD03 DD13 DD50                       EE01 EE02 EE03 EE24 EE25                       EE35 EE50 FF31 FF33 FG01                       FG02

Claims (5)

[Claims] 1. An electronic circuit component including a suction nozzle for sucking an electronic circuit component by negative pressure, a moving device for moving the suction nozzle, and an image pickup device for picking up an image of the electronic circuit component held by the suction nozzle. A program executed by a computer for testing an electronic circuit component holding capability of a handling device, the relative position of the electronic circuit component with respect to the suction nozzle before and after the movement of the suction nozzle holding the electronic circuit component by the moving device. Holding capacity acquisition program, characterized in that it includes a relative position change detection step of detecting a change in. 2. An electronic circuit component handling including a suction nozzle for sucking an electronic circuit component by negative pressure, a moving device for moving the suction nozzle, and an image pickup device for picking up an image of the electronic circuit component held by the suction nozzle. A first imaging step, which is a program executed by a computer to test an electronic circuit component holding capacity of the device, and which performs an image pickup of the electronic circuit component held by the suction nozzle in a direction directly facing the suction nozzle, A moving step of moving the suction nozzle holding the electronic circuit component, and a second imaging step of imaging the electronic circuit component held by the suction nozzle after the moving step is performed in a direction directly facing the suction nozzle. An electronic circuit held in the suction nozzle based on the image processing results of the first imaging step and the second imaging step Retention acquisition program, which comprises a relative position change detecting step of detecting a relative positional change to the serial suction nozzle goods. 3. The holding capacity acquisition program according to claim 2, wherein the moving condition in the moving step can be arbitrarily set. 4. A suction nozzle for sucking and holding an electronic circuit component by negative pressure, a moving device for moving the suction nozzle, a component supply device for supplying the electronic circuit component, and a suction nozzle held by the suction nozzle. A program for testing the electronic circuit component suction capability of the suction nozzle in an electronic circuit component handling device including an image pickup device for picking up an electronic circuit component, wherein the electronic circuit component supplied by the component supply device is transferred to the suction nozzle. Adsorption step of adsorbing, a first imaging step of imaging the electronic circuit component which is adsorbed by the adsorption nozzle and held, and the electronic circuit component is normally adsorbed by the adsorption nozzle from the image processing result of the first imaging step. And an adsorption failure detection step of determining whether or not it has been performed. 5. A nozzle holder that holds a suction nozzle that sucks an electronic circuit component by negative pressure, a moving device that moves the nozzle holder, and an imaging device that images the electronic circuit component held by the suction nozzle. A control device that moves the nozzle holder to the moving device and causes the imaging device to image the electronic circuit component held by the suction nozzle before and after the movement, and a result of the imaging before and after the movement. An electronic circuit component handling device including: a relative position change acquisition unit that acquires a change in relative position of an electronic circuit component with respect to a suction nozzle before and after movement of the image data.