JP6154143B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

  An electronic component mounting apparatus for mounting an electronic component on a substrate has a head including a nozzle, holds the electronic component with the nozzle, and mounts the electronic component on the substrate. The electronic component mounting device picks up the components in the electronic component supply device by moving the head nozzle in a direction perpendicular to the surface of the substrate, and then moves the head relatively in a direction parallel to the surface of the substrate. When the picked-up component arrives at the mounting position, the picked electronic component is mounted on the substrate by moving the nozzle of the head in a direction orthogonal to the surface of the substrate and bringing it closer to the substrate.

  Here, as an electronic component to be mounted on the substrate, in addition to the mountable electronic component mounted on the substrate, the electronic device includes a main body and a lead connected to the main body, and is mounted by inserting the lead into an insertion hole provided in the substrate. There are insert-type electronic components. As an electronic component mounting apparatus for mounting an insertion type electronic component on a substrate, for example, there is an apparatus described in Patent Document 1.

  Patent Document 1 discloses an insertion state detection in which a predetermined component insertion force is applied to an insertion head at the time of component insertion, and the insertion amount of the component (lead) is detected by detecting the movement amount and movement time of the insertion head. It is described that a means is provided to detect whether or not a component is inserted depending on whether or not a predetermined insertion amount has been reached within a predetermined time.

Japanese Patent Publication No. 2-26799

  The device described in Patent Literature 1 can detect whether there is a component that cannot be properly inserted by detecting whether or not the component has been inserted. However, if it is determined whether the motor that moves down the chuck of the insertion head that holds the electronic component has reached a predetermined amount of rotation within a predetermined time, some of the leads of the electronic component are bent on the board. Even when the electronic component is incomplete, the electronic component is inclined and mounted, and when the motor that moves down the chuck reaches a predetermined rotation amount, it may be erroneously determined to be normal. In particular, when the electronic component body is a cylindrical capacitor A1 as shown in FIG. 15 and the chuck sandwiches the electronic component body with a pair of arms A2, the component may be mounted on the board in an inclined state. It was. There is a possibility that such an inclined electronic component may fall into the mounting position of the adjacent electronic component to be mounted thereafter, and if the adjacent electronic component is produced as it is while the component is collapsed, the component is mounted on the component. This can cause damage to parts and nozzles.

  The present invention has been made in view of the above, and an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of mounting electronic components efficiently and with high accuracy.

  The present invention relates to an electronic component mounting apparatus that is mounted by holding a main body of a lead-type electronic component with a nozzle provided on the head and inserting a lead into an insertion hole of a substrate, the height sensor being disposed on the head A detection means for moving the height sensor to an inspection point after mounting the lead type electronic component and before mounting an adjacent electronic component, and measuring the height of the mounted lead type electronic component And a control unit that determines whether the lead type electronic component is normally mounted on the substrate based on the height measured by the height sensor.

  Here, the controller is configured so that a difference between a height of the lead type electronic component measured by the height sensor at an inspection point and an original height of the lead type electronic component at the inspection point is within a threshold range. In some cases, it is preferable to determine that the lead-type electronic component is normally mounted on the substrate.

  Moreover, it is preferable that the electronic component mounting apparatus is configured such that one or more inspection points can be set at arbitrary positions for each lead type electronic component mounted on the substrate.

  The height sensor measures a distance to an area on the substrate on which the lead type electronic component is mounted before the lead type electronic component is mounted on the substrate. It is preferable to determine whether another electronic component is normally mounted on the substrate based on the distance measured by the height sensor.

  The present invention is also an electronic component mounting method for mounting a lead type electronic component on a substrate, the step of measuring the height of the lead type electronic component mounted on the substrate with a height sensor, and the height Determining whether the lead-type electronic component is normally mounted on the substrate based on the height measured by a sensor.

  Here, before the lead-type electronic component is mounted on the substrate, a step of measuring a distance to an area on the substrate on which the lead-type electronic component is mounted by the height sensor, and the height sensor It is preferable that the method further includes a step of determining whether another electronic component is normally mounted on the substrate based on the distance measured by.

  The present invention can mount electronic components efficiently and with high accuracy.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 6 is a diagram illustrating an example of an inspection using a height sensor. FIG. 7 is a diagram illustrating an example of an inspection using a height sensor. FIG. 8 is an explanatory diagram illustrating an example of an operation screen. FIG. 9 is an explanatory diagram for explaining setting of inspection points. FIG. 10 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 11 is an explanatory diagram illustrating an example of a confirmation screen. FIG. 12 is a diagram illustrating an example of a collective inspection screen. FIG. 13 is a diagram illustrating another example of the inspection using the height sensor. FIG. 14 is a diagram illustrating another example of the inspection using the height sensor. FIG. 15 is a diagram in which a conventional electronic component is normally or abnormally inserted into a substrate.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of an electronic component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting apparatus of the present invention has a lead, and the lead is inserted into a board hole (insertion hole, hole) of the board to mount an electronic part to be mounted on the board, so-called insertion type electronic part. The electronic component mounting apparatus. The electronic component mounting apparatus has a function of mounting an insertion type electronic component (lead type electronic component). Here, the insertion type electronic component is mounted by inserting a lead into a hole formed in the substrate. Further, electronic components mounted on the substrate without being inserted into the insertion hole (substrate hole), for example, SOP, QFP, etc., are mounted electronic components. The electronic component mounting apparatus may have a function of mounting a mountable electronic component mounted on the substrate. The electronic component mounting apparatus 10 of the following embodiment has a function of mounting both a mountable electronic component and an insertable electronic component.

  Next, an electronic component mounting apparatus 10 capable of mounting both the mountable electronic component and the insertable electronic component of the present embodiment will be described with reference to FIGS. 1 to 7. The electronic component mounting apparatus 10 can mount both a mountable electronic component to be mounted by placing it on a substrate and a lead type electronic component (insertable electronic component) to be mounted by inserting a lead into an insertion hole of the substrate. It is a device that can. The electronic component mounting apparatus 10 can mount both the mounted electronic component and the lead electronic component, or can mount only one of them. That is, the electronic component mounting apparatus 10 can mount both a mounted electronic component and a lead type electronic component, and can be used for various purposes depending on the board to be manufactured and the layout of other electronic component mounting apparatuses. Can do.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at a predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8, and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided. Both the component supply units 14f and 14r of this embodiment supply lead-type electronic components having a main body and leads connected to the main body.

  FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. As shown in FIG. 2, the component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 90 and 90 a.

  Specifically, the component supply unit 14 is mounted with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and held by the electronic component holding tape. An electronic component supply device 90 that cuts a lead of a lead type electronic component at a holding position (second holding position) and can hold the lead type electronic component at the holding position by a suction nozzle provided in the head or a nozzle by a holding nozzle. In addition to mounting a plurality of electronic components holding tape (chip component tape) with a plurality of mounted electronic components fixed to the tape body, the mounting position of the mounted electronic components held by the electronic component holding tape (first 1 holding position), and the mounted electronic component at the holding position is held by the suction nozzle or gripping nozzle provided on the head. Possible to may comprise an electronic component supply device 90a. The component supply unit 14 may install a stick feeder or a tray feeder as the other electronic component supply device 90a. A plurality of component supply apparatuses 90 and 90 a shown in FIG. 2 are held by a support base (bank) 96. Further, the support table 96 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 90 and 90a.

  The component supply unit 14 includes a plurality of types of electronic component supply devices that are different in the types of electronic components to be mounted, the mechanisms for holding the electronic components, or the supply mechanisms. 90, 90a. Further, the component supply unit 14 may include a plurality of electronic component supply devices 90 and 90a of the same type. The component supply unit 14 is preferably configured to be detachable from the apparatus main body.

  The component supply device 90 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by sticking a plurality of radial lead type electronic component leads to the tape. The component supply device 90 holds an electronic component holding tape, sends the held electronic component holding tape, and holds the radial lead type electronic component held by the nozzle of the head 15 (suction position) , Gripping position, holding position). The component supply device 90 cuts and separates the lead of the radial lead type electronic component moved to the holding region, so that the radial lead type electronic component with the lead fixed by the tape can be held in a predetermined position. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15. The component supply device 90 will be described later. The plurality of component supply apparatuses 90 may supply different types of electronic components or separate electronic components. Further, the component supply device 90 is not limited to a plurality of radial lead type electronic components on a tape, and a bowl feeder, an axial feeder, a stick feeder, a tray feeder, or the like can also be used.

  The electronic component supply device 90a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic components can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 90a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder, a tape feeder, or a bulk feeder can be used.

  The head 15 holds (sucks or grips) the electronic component held by the component supply unit 14f or the electronic component held by the component supply unit 14r with a nozzle, and the held electronic component is moved to a predetermined position by the substrate transport unit 12. It is a mechanism for mounting on the moved substrate 8. Further, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. It is a mechanism to do. The configuration of the head 15 will be described later. The chip-type electronic component (mounted electronic component) is a leadless electronic component that does not include a lead that is inserted into an insertion hole (through hole) in which a substrate is formed. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate without inserting the lead into the insertion hole.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and the X-axis driving unit 22 and the Y-axis driving unit 24. Have The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices of the component supply units 14f and 14r on the substrate 8 at predetermined positions (mounting position, mounting position). It becomes a transfer means to transfer to. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image, so that it is adsorbed by the nozzle. Recognize the shape of the electronic component and the holding state of the electronic component by the nozzle. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation. Examples of the operation unit 40 include a keyboard, a mouse, and a touch panel. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker. Examples of the display unit 42 include a touch panel and a vision monitor. The display unit 42 displays various images based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can more efficiently mount electronic components on the substrate by moving the two substrates alternately to the electronic component mounting position by the two substrate transfer units 12 and mounting the components alternately by the two heads 15. can do.

  Next, the configuration of the head 15 will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 3 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 90 of the component supply unit 14r. As shown in FIGS. 3 and 4, the head 15 includes an imaging device (substrate state detection unit) 36, a height sensor (detection means) 37, and an electron held by a nozzle for recognizing marks on the head body 30 and the substrate. A laser recognition device (component state detection unit, state detection unit) 38 that determines the shadow of the component main body or the lead in the horizontal direction of the component.

  As shown in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  The electronic component supply device 90 is a mechanism that supplies the electronic component 80. Here, the electronic component 80 has an electronic component main body (hereinafter simply referred to as “main body”) 82 and two leads 84 arranged in the radial direction of the main body 82. Although the electronic component 80 of this embodiment has two leads 84, the number of leads 84 is not particularly limited. As the electronic component 80, an aluminum electrolytic capacitor is exemplified. In addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. In the electronic component supply device 90, the main body 82 of the electronic component 80 in which the leads 84 are held by the electronic component holding tape (radial component tape) is exposed upward. The electronic component supply apparatus 90 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component supply device 90 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. Similarly, in the case of the electronic component supply apparatus 90a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. As shown in FIG. 4, six nozzles 32 are arranged in a row in the head main body 30 of the present embodiment. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 4, the suction nozzle which adsorbs and hold | maintains the electronic component 80 is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 32a at the tip. The opening 32 a is connected to the nozzle driving unit 34 through an internal cavity and a cavity of the nozzle holding unit 33. The nozzle 32 sucks air from the opening 32a to suck and hold the electronic component 80 at the tip. The nozzle 32 can be attached to and detached from the nozzle holding portion 33, and is stored (stored) in the replacement nozzle holding mechanism 18 when the nozzle 32 is not attached to the nozzle holding portion 33. The nozzle 32 has various shapes and sizes of the opening 32a. In the present embodiment, an adsorption type nozzle having an opening for adsorbing an electronic component is shown. However, an arm that operates by air pressure is used, and a holding type nozzle is used to hold the electronic component by sandwiching it. Can do.

  The nozzle holding unit 33 is a mechanism that holds the nozzle 32 at the end (tip) on the lower side in the vertical direction. For example, the nozzle driving unit 34 is connected to the shaft that moves relative to the head support 31 and the nozzle 32. Socket. The shaft is a rod-shaped member, and is arranged extending in the Z-axis direction. The shaft supports a socket disposed at an end portion on the lower side in the vertical direction. The shaft is supported with respect to the head support 31 in a state where a portion connected to the socket is movable in the Z-axis direction and is rotatable in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane and is a direction orthogonal to the surface of the substrate 8. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit 34 moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32. A portion of the shaft connected to the socket is moved and rotated in the Z-axis direction and the θ direction by the nozzle driving unit 34.

  The nozzle driving unit 34 moves the nozzle holding unit 33 in the Z-axis direction to move the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 a of the nozzle 32. Further, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle holding unit 33 in the θ direction when the electronic component 80 is mounted.

  The nozzle driving unit 34 includes a mechanism having a Z-axis motor 34a, specifically, a linear motion linear motor whose driving direction is the Z-axis direction as a mechanism for moving the nozzle 32 in the Z-axis direction. The nozzle drive unit 34 moves the shaft of the opening 32a at the tip of the nozzle 32 in the Z-axis direction by moving the nozzle 32 in the Z-axis direction together with the nozzle holding unit 33 by the Z-axis motor 34a. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft of the nozzle holding unit 33 as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle driving unit 34 transmits the driving force output from the motor to the shaft of the nozzle holding unit 33 by a transmission element, and rotates the shaft in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 32a of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 32a of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether to suck air from the opening 32a by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks (holds) the electronic component 80 in the opening 32a by sucking air from the opening 32a, and closes the electromagnetic valve and sucks air in the opening 32a by not sucking air from the opening 32a. The electronic component 80 that has been released is released, that is, the electronic component 80 is not sucked (not held) by the opening 32a.

  The head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component. As with the suction nozzle, the gripping nozzle can release and hold the air from the upper side by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. Further, the height sensor 37 detects the height of the facing part, specifically, the electronic component by processing the distance from the facing part using its own position at the time of measurement and the position of the substrate. . The process of detecting the height of the electronic component based on the measurement result of the distance to the electronic component may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 3, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the operation of sucking (holding) / releasing the electronic components of the nozzle 32 and the rotation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, distance sensors). Controls movement and movement in the Z-axis direction.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each of the electronic component supply devices 90 and 90a or may control all the electronic component supply devices 90 and 90a. For example, the component supply control unit 64 controls an electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the electronic component supply device 90. In addition, when the component supply unit 14 includes the electronic component supply device 90a, the component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation) by the electronic component supply device 90a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  Here, in the above embodiment, the case where the suction nozzle is used as the nozzle mounted on the head has been described, but the present invention is not limited to this. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 5 is a diagram illustrating an example of a gripping nozzle (gripper nozzle). A nozzle 201 illustrated in FIG. 5 includes a fixed arm 202 and a movable arm 204. The nozzle 201 is fixed in a state in which the fulcrum 205 of the movable arm 204 is rotatable on the main body of the nozzle 201, and the movable arm 204 has a portion facing the fixed arm 202 with the fulcrum 205 as an axis close to the fixed arm 202. It can move in a direction away from the direction. The movable arm 204 is connected to a drive unit 206 on a side opposite to a portion of the main body of the nozzle 201 and a portion approaching or moving away from the fixed arm 202 via a fulcrum 205. The drive unit 206 is moved by a drive source (air pressure) that drives the gripping nozzle. The movable arm 204 moves in a direction away from the direction in which the portion facing the fixed arm 202 approaches the fixed arm 202 when the driving unit 206 moves.

  The nozzle 201 can grip the electronic component 80 by reducing the distance between the fixed arm 202 and the movable arm 204 in a state where the electronic component 80 is between the fixed arm 202 and the movable arm 204.

  The gripping nozzle is not limited to the nozzle 201 and can have various shapes. The gripping nozzle can have various values for the distance between the fixed arm and the movable arm and the movable range. As described above, the gripping nozzle has different shapes of electronic components that can be gripped for each shape of the nozzle.

  The electronic component mounting apparatus 10 can appropriately hold the electronic component by selecting the type of nozzle that holds the electronic component according to the type of electronic component to be held. Specifically, one electronic component can be mounted by selecting whether to use a suction nozzle or a gripping nozzle according to the electronic component to be held, and switching which nozzle to use among each type of nozzle. More kinds of electronic components can be mounted on the device.

  As described above, the electronic component mounting apparatus 10 can mount the insertion type electronic component at an arbitrary position on the substrate 8 by moving the head 15 in the X-axis direction, the Y-axis direction, and the Z-axis direction. . However, the insertion type electronic component may be inclined and mounted for some reason. The reason why the insertion type electronic component is mounted at an inclination is, for example, that the diameter of the insertion hole is large, the lead is thin, the load is bent during insertion, the lead is bent, etc. included.

  When the insertion-type electronic component is mounted at an angle in this way, there is a high possibility that various failures will occur. For example, a tilted insertion-type electronic component may partially enter a mounting area of another adjacent component, and one of the electronic components may be damaged when the electronic component is inserted or mounted in that area. Such damage is particularly likely to occur when the interval at which electronic components are mounted is narrow.

  In addition, even when there is an insertion error or mounting error other than tilting, an electronic component partially or wholly enters the mounting area of another adjacent component due to the insertion error or mounting error, and the electronic component enters the area. Any electronic component may be damaged when the component is inserted or mounted.

  Therefore, in the present embodiment, after the electronic component is inserted, the mounting state of the electronic component is inspected using the height sensor 37. 6 and 7 are diagrams showing an example of inspection using the height sensor 37. FIG. As shown in FIGS. 6 and 7, the electronic component mounting apparatus 10 uses a height sensor (detection means) 37 after mounting the electronic component 752 on the substrate 8 at an inspection point corresponding to the electronic component 752. Measure the distance to the member at the opposite position. At least one inspection point is designated in advance in the mounting area of the electronic component 752 to be inspected.

  The height sensor 37 includes a light projecting unit 37a and a light receiving unit 37b. The light projecting unit 37a includes a light emitting element and outputs measurement light, for example, an infrared laser. The light receiving unit 37b includes a light receiving element that receives measurement light emitted from the light projecting unit 37a and reflected by a member located at an opposing position. The light receiving unit 37b detects the timing and amount of light received. The height sensor 37 is suitable for inspecting whether or not the electronic component is normally mounted because the distance to the member at the opposing position can be measured at high speed with a small load. In order to measure the height (distance), the height sensor 37 may use radio waves, sound waves, light rays other than the infrared laser, or the like.

  The electronic component mounting apparatus 10 can measure (calculate) the actual height of the electronic component 752 at the inspection point based on the distance thus measured and the previously measured distance from the substrate 8. The electronic component mounting apparatus 10 calculates the original height of the electronic component 752 at the inspection point from manufacturing information (such as the shape and dimensions of the main body of the electronic component) set in advance for manufacturing. If the difference from the actual height is within the threshold value (determination value), it is determined that the electronic component 752 is normally mounted. The manufacturing information may be included in a manufacturing program in which various controls and setting values for mounting the electronic component 752 on the substrate 8 are set.

  In the example shown in FIG. 6, the board 8 is provided with insertion holes 750 for mounting three insertion-type electronic components 752 adjacent to each other. The lead 756 of the electronic component 752 has already been inserted into the insertion hole 750 in the right mounting region, and it is determined by inspection using the height sensor 37 that the electronic component 752 is normally mounted. The electronic component 752 is not yet mounted in the central mounting area. The lead 756 of the electronic component 752 has already been inserted into the insertion hole 750 in the left mounting area, and an inspection using the height sensor 37 has been performed.

  In the example shown in FIG. 6, the right electronic component 752 is inserted at a correct angle, and the height sensor 37 measures the distance to the upper surface of the main body 754 of the electronic component 752 at the inspection point. In this case, since the actual height of the electronic component 752 at the inspection point substantially matches the original height, the electronic component mounting apparatus 10 determines that the right electronic component 752 is normally mounted.

  In the example shown in FIG. 7, the left electronic component 752a is inserted while being inclined toward the unmounted mounting region, and the height sensor 37 is a distance from the inspection point to the side surface of the main body 754a of the electronic component 752a. Is measuring. In this case, since the actual height of the electronic component 752a at the inspection point is considerably lower than the original height, the electronic component mounting apparatus 10 determines that the electronic component 752a is not normally mounted.

  In the example shown in FIG. 7, since the electronic component 752a is mounted at an inclination, a part of the electronic component 752a enters the central mounting region, and the head 15 blocks the path for mounting the electronic component 752b in the central mounting region. It has been. For this reason, if the electronic component mounting apparatus 10 tries to mount the electronic component 752b in the central mounting region in this state, the electronic component 752b or the electronic component 752a is damaged. By measuring the height of the electronic component 752a using the height sensor 37 after mounting the electronic component 752a, it is possible to reduce the possibility that the electronic component 752a is damaged due to such a mounting error. As a result, it is possible to mount the electronic component on the substrate efficiently and with high accuracy.

  The means for measuring the height of the component at the inspection point is not limited to the height sensor 37. The electronic component mounting apparatus 10 can also use the imaging device 36 as means for measuring the height of the component at the inspection point. The electronic component mounting apparatus 10 can measure the height of the component at the inspection point by acquiring an image around the inspection point of the substrate 8 using the imaging device 36 and performing image analysis.

  In the above-described embodiment, the case where the lead type electronic component is mounted has been described. However, the electronic component mounting apparatus 10 may perform the same inspection when the mounted type electronic component is mounted on the substrate. Specifically, the electronic component mounting apparatus 10 measures the height of the mounted electronic component at the inspection point after mounting the mounted electronic component, and the mounted electronic component is normally mounted based on the measurement result. You may make it determine whether it is.

  The electronic component mounting apparatus 10 may always inspect the mounting state after mounting the electronic component, or may inspect the mounting state after mounting the electronic component only when a predetermined condition is satisfied. For example, the electronic component mounting apparatus 10 may inspect the mounting state after mounting the electronic component when there is an unmounted region in which another electronic component is mounted within a predetermined range from the mounting region. As a result, it is possible to inspect the mounting state of only electronic components that may be damaged due to mounting errors, and to reduce the inspection time.

  Hereinafter, an example of more detailed operation of the electronic component mounting apparatus will be described with reference to FIGS. 8 to 11. FIG. 8 is an explanatory diagram illustrating an example of an operation screen. FIG. 9 is an explanatory diagram for explaining setting of inspection points. FIG. 10 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 11 is an explanatory diagram illustrating an example of a confirmation screen.

  First, using FIG. 8 and FIG. 9, a method for setting inspection conditions for processing for inspecting the mounting state based on the height of the mounted electronic component will be described. The electronic component mounting apparatus 10 displays an operation screen 770 illustrated in FIG. 8 on the display unit 42 when a mode for setting the inspection condition of the mounted state of the mounted electronic component is activated. The operation screen 770 displays various input items. The operator can input inspection conditions for each component mounted on the board 8 by performing various operations while the operation screen 770 is displayed.

  The operation screen 770 shown in FIG. 8 includes an input item 772 for inputting whether or not to check the mounting state by detecting the height of the mounted electronic component, and an input item for inputting the number of inspections (number of inspection points). 774 and an input item 776 for inputting a determination value (threshold value) for determining whether the height of the electronic component is in a normal range. Further, the operation screen 770 includes an area 777 in which input items 778 for inputting offsets in the X direction and the Y direction from the reference position in order to specify the position of each inspection point. The number of input items 778 included in the region 777 dynamically changes so as to be the same as the number of inspections input to the input items 774. The operation screen 770 includes an area 779 for graphically displaying the position of the inspection point based on the input result to the input item 778. The input means for each inspection point may be set by designating an arbitrary position as an inspection point on the screen for the part graphic displayed on the operation screen.

  Here, the input item 772 is an item for inputting whether or not to execute the inspection. The input item 774 is an item for inputting the number of inspection points, for example, “1”, “2”, “3”, or “4”. In the example shown in FIG. 8, since “4” is input to the input item 774, the height of the part is measured at four inspection points. In the input item 776, a range in which it is determined that the electronic component is normally mounted on the basis of the original height of the electronic component, that is, a threshold value is input. In the example shown in FIG. 8, since “0.500” is input to the input item 776, if the measured actual height is within a range of ± 0.5 mm based on the original height, the electronic component Is determined to be implemented correctly.

  Eight input items 778 in the region 777 are displayed in two rows and four columns. Each of the four stages corresponds to an inspection point, and two input items 778 in each stage correspond to an X-direction offset and a Y-direction offset, respectively. The numerical value input to the input item 778 is an offset with respect to the reference position. In the present embodiment, the reference position is the center of the electronic component mounting area, but the reference position may be another position such as the lower left corner of the mounting area. The electronic component mounting apparatus 10 calculates a range in which the main body 782 of the electronic component 780 is projected on the XY plane based on manufacturing information set in advance for manufacturing, and the inspection point is set inside this range. In this way, the input of the offset may be limited.

  As shown in FIG. 9, the electronic component mounting apparatus 10 calculates a position offset as indicated by an arrow 788 with the center 784 of the electronic component 780, that is, the center of the mounting area of the electronic component 780 as the reference position. Four inspection points 786a, 786b, 786c, and 786d can be identified. Accordingly, the relative relationship between the main body 782 of the electronic component 780 and the inspection points 786a, 786b, 786c, and 786d is as shown in FIG. An area 779 displays the relative relationship between the main body 782 of the electronic component 780 thus identified and the inspection points 786a, 786b, 786c, and 786d.

  In particular, in FIG. 7, when it is assumed that the (lead type) electronic component 752a is mounted by tilting to the right in the drawing when the lead is inserted into the board hole while being held by the pair of arms of the gripping nozzle, Depending on the degree, when it is considered that there is a possibility of contact with the electronic component 752a when the electronic component 752b mounted adjacent to the right side is mounted, whether or not the electronic component 752b is actually contacted is mounted. In order to make a determination before the determination, the input item 777 or 778 designates the left side surface opposite to the inclination direction (right direction) to be determined with respect to the electronic component 752a as at least one inspection point. At this time, by setting the number of inspection points of the input item 774 to 1, contact with one adjacent component can be measured in a short time. Alternatively, when there are a plurality of adjacent electronic components 752b that may come into contact with each other by being inclined, the number of inspection points is designated as 2 to 4 according to the number of arrangement directions of each electronic component. May be.

  Next, a process executed by the electronic component mounting apparatus 10 for an inspection based on the height of the component will be described with reference to FIG. The process shown in FIG. 10 is executed for each electronic component that is set to be inspected during the manufacturing process of mounting the electronic component on the substrate. Note that the process illustrated in FIG. 10 can be executed by the control device 20 controlling the operation of each control unit.

  In step S <b> 11, the electronic component mounting apparatus 10 is mounted by holding the main body of the lead type electronic component in the electronic component supply apparatus with a nozzle provided in the head and inserting a lead into a predetermined insertion hole of the substrate 8. . Further, the mounted electronic component in the electronic component supply apparatus is held by a nozzle and mounted at a predetermined position on the substrate 8. In step S12, the electronic component mounting apparatus 10 sets the value of a counter n for counting the number of inspection points to 1.

  In step S13, the electronic component mounting apparatus 10 starts moving the height sensor 37 to the nth inspection point corresponding to the electronic component. Specifically, the electronic component mounting apparatus 10 is configured such that after the lead-type electronic component by the head is mounted on the substrate, the head 15 moves to the electronic component supply device to receive the adjacent electronic component before the head 15 The height sensor 37 starts to move to above the inspection point of the electronic component. In step S14, the electronic component mounting apparatus 10 turns on the power of the moving height sensor 37 and activates the height sensor 37.

  When the height sensor 37 reaches the nth inspection point, the electronic component mounting apparatus 10 stops the movement of the height sensor 37 at that position as step S15. And the electronic component mounting apparatus 10 measures the height of the electronic component in an inspection point as step S16. Specifically, the electronic component mounting apparatus 10 uses the height sensor 37 to measure the distance from a member at a position facing the height sensor 37. Then, the electronic component mounting apparatus 10 measures (calculates) the height of the electronic component based on the measured distance and the previously measured distance from the substrate 8.

  Thereafter, the electronic component mounting apparatus 10 turns off the power of the height sensor 37 and cancels the activation of the height sensor 37 in step S17. In step S18, the electronic component mounting apparatus 10 determines whether n is equal to the number of inspections corresponding to the electronic component, that is, whether the height of the component is measured at the number of inspection points corresponding to the number of inspections. When n is not equal to the number of inspection, that is, when the height of the component is not measured at the inspection points for the number of inspection (step S18, No), the electronic component mounting apparatus 10 sets 1 to n as step S19. Add and return to step S13.

  When n is equal to the number of inspection, that is, when the height of the component is measured at the inspection points for the number of inspection (step S18, Yes), the electronic component mounting apparatus 10 proceeds to step S20. In step S20, the electronic component mounting apparatus 10 determines whether the electronic component mounting state is normal based on the measured height. Specifically, the electronic component mounting apparatus 10 calculates the original height of the electronic component for each inspection point based on manufacturing information set in advance for manufacturing, and the measured actual height. Compare. The electronic component mounting apparatus 10 determines that the mounting state of the electronic component is normal when the difference between the original height and the actual height is within the determination value range at all inspection points.

  When the difference between the original height and the actual height is within the determination value range at all inspection points, that is, when the electronic component mounting state is normal (step S21, Yes), the electronic component mounting apparatus 10 The process proceeds to step S22. In step S22, the electronic component mounting apparatus 10 starts preparation for mounting the next electronic component.

  If the difference between the original height and the actual height is greater than the width of the determination value at at least one inspection point, that is, if the mounting state of the electronic component is abnormal (No in step S21), the electronic component mounting apparatus 10 Advances to step S23. In step S23, the electronic component mounting apparatus 10 temporarily stops the electronic component mounting operation by the head 15, and displays the confirmation screen 790 shown in FIG.

  On the confirmation screen 790, a message indicating that there is an inspection point whose height difference exceeds the determination value is displayed. In addition, on the confirmation screen 790, information on electronic components determined to have an abnormal mounting state is displayed in an area 792. By displaying the information of the electronic component in the area 792, it is possible to notify the worker of the position where the electronic component is mounted on the substrate 8 where the error has occurred. On the confirmation screen 790, an input area 794 including a button 796 and a button 798 for inputting an operation to be executed next is displayed. The button 796 describes the characters “start production” and is associated with an operation for restarting the mounting operation. In addition, the button 798 is written with the characters “perform component height inspection again”, and is associated with an operation of re-execution of the mounting state inspection based on the component height. In addition, the electronic component mounting apparatus 10 is configured to stop production when a predetermined operation is performed while the confirmation screen 790 is displayed.

  The electronic component mounting apparatus 10 waits for an operator's instruction while displaying the confirmation screen 790. When the operator's instruction is input, the electronic component mounting apparatus 10 determines whether re-inspection is specified, that is, whether the button 798 is selected as step S24. When the re-inspection is designated, that is, when the button 798 is selected (Step S24, Yes), the electronic component mounting apparatus 10 returns to Step S12. When performing the re-inspection, the electronic component mounting apparatus 10 may inspect only the inspection points where the abnormality is detected without inspecting all the inspection points.

  When the re-inspection is not designated, that is, when the button 798 is not selected (step S24, No), the electronic component mounting apparatus 10 proceeds to step S25. In step S25, the electronic component mounting apparatus 10 determines whether production resumption is designated, that is, whether the button 796 is selected. When the resumption of production is designated, that is, when the button 796 is selected (step S25, Yes), the electronic component mounting apparatus 10 proceeds to step S22. In step S22, the electronic component mounting apparatus 10 starts preparation for mounting the next electronic component.

  If neither re-inspection nor resumption of production is specified, that is, if a predetermined operation for stopping production is performed (No in step S25), the electronic component mounting apparatus 10 proceeds to step S26. The electronic component mounting apparatus 10 stops operation as step S26. That is, the electronic component mounting apparatus 10 ends the production operation without starting preparation for mounting the next electronic component.

  As described above, the electronic component mounting apparatus 10 can determine the mounting state of the electronic component by measuring the height of the mounted electronic component. As a result, it is possible to reduce the possibility of occurrence of a failure such as the operation of mounting another electronic component on the electronic component whose mounting state is not normal and the damage of one of the electronic components. For this reason, an electronic component can be mounted efficiently and with high accuracy. Furthermore, it is possible to reduce the possibility that the board 8 on which electronic components are not normally mounted is shipped as it is, and to improve the quality of the shipped product.

  The electronic component mounting apparatus 10 can also collectively inspect all electronic components that are set to perform inspection after the mounting of the electronic components on the board is completed. FIG. 12 is a diagram illustrating an example of a collective inspection screen. The electronic component mounting apparatus 10 displays a screen such as a collective inspection screen 800 shown in FIG. 12 on the display unit 42 when inspecting electronic components collectively.

  The collective inspection screen 800 includes an area 801 for displaying an overall progress status, an area 802 for displaying information on an electronic part being inspected, and an area 803 provided for arbitrarily specifying an electronic component to be inspected. Including. The area 802 is also used for setting inspection points by teaching.

  In the above embodiment, the head height sensor is moved to the inspection point of the electronic component as soon as the electronic component is mounted on the substrate. However, the present invention is not limited to this. For example, it is an adjacent electronic component mounted after the mounted electronic component, and until the adjacent electronic component that may collide when the mounted electronic component is mounted tilted, The mounting of the electronic component may be continued, and the head height sensor may be moved to the mounted electronic component until the adjacent electronic component is mounted.

  In the above embodiment, the electronic component mounting apparatus 10 determines that the difference between the original component height and the actual component height at the at least one inspection point among the inspection points corresponding to the electronic component is larger than the width of the determination value. If it is larger, it is determined that the mounting state of the electronic component is abnormal. However, the condition for determining that the mounting state of the electronic component is abnormal is not limited to this.

  For example, the direction in which the electronic component is tilted is determined based on the height of the electronic component measured at a plurality of inspection points, and if there is no other component mounting area within a predetermined distance in the direction in which the electronic component is tilted. Even if there is an inspection point where the difference between the height of the original part and the actual part is larger than the width of the determination value, it may be determined that there is no abnormality in the mounting state. Furthermore, even if there is a mounting area for other components within a predetermined distance in the direction in which the electronic component is tilted, if the electronic component has already been mounted in that mounting area, the height of the original component and the actual component Even if there is an inspection point whose difference from the height is larger than the width of the determination value, it may be determined that there is no abnormality in the mounting state. That is, when it is determined that there is no possibility that the electronic component is damaged during mounting due to inclination, it may be determined that there is no abnormality in the mounting state.

  In the above embodiment, the electronic component mounting apparatus 10 detects an electronic component mounting error by measuring the height of the component at an inspection point corresponding to the mounted electronic component. However, the method of detecting an electronic component mounting error is not limited to this. The electronic component mounting apparatus 10 uses the height sensor 37 to measure the distance from the member at the opposing position at the inspection point corresponding to the unmounted electronic component. In this case, if it is normal, there should be no electronic component at the inspection point, so the distance from the substrate 8 is measured as shown in FIG. On the other hand, when another electronic component is present at the inspection point due to a mounting error or the like, a distance shorter than the distance from the substrate 8 measured in advance is measured as shown in FIG. In this way, at the inspection point corresponding to the unmounted electronic component, the distance to the member at the opposite position is measured, and it is determined whether the difference from the original distance is within the threshold value (determination value) In this way, it is possible to detect an abnormality in the mounting state of another electronic component and reduce the possibility of damage to the electronic component during mounting.

  When mounting the electronic component, the electronic component mounting apparatus 10 may measure the distance from the member at the opposite position using the height sensor 37 both before and after mounting. Based on the measurement before mounting, the electronic component mounting apparatus 10 can determine whether another mounted electronic component becomes an obstacle in order to mount the electronic component. From the measurement after mounting, the electronic component mounting apparatus 10 can determine whether the mounted component becomes an obstacle for mounting another electronic component. Thus, when measuring before and after mounting, the inspection point for measurement before mounting may be different from the inspection point for measurement after mounting.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 replacement nozzle holding mechanism, 19 component storage unit, 20 control device, 22 X-axis drive unit, 24 Y-axis drive unit, 30 head body, 31 head support, 32 nozzles, 34 nozzle drive unit, 34a Z-axis motor, 38 laser recognition device, 40 operation unit, 42 display unit , 60 control unit, 62 head control unit, 64 component supply control unit, 80 electronic component, 82 main body (electronic component main body), 84 lead, 90, 90a electronic component supply device, 96 support base

Claims (4)

An electronic component mounting apparatus for mounting by holding a main body of a lead type electronic component with a nozzle provided in a head and inserting a lead into an insertion hole of a substrate,
A height sensor disposed on the head, wherein the lead type electronic component is mounted after moving the height sensor to an inspection point after mounting the lead type electronic component and before mounting an adjacent electronic component. Detection means for measuring the height of the component;
A control unit for determining whether the lead type electronic component is normally mounted on the substrate based on the height measured by the height sensor , and
The height sensor measures a distance to an area on the substrate on which the lead type electronic component is mounted before the lead type electronic component is mounted on the substrate.
Wherein the control unit, the electronic component mounting apparatus you determine the height other electronic components on the basis of the distance measured by the sensor is properly mounted on the substrate.   When the difference between the height of the lead-type electronic component measured by the height sensor at the inspection point and the original height of the lead-type electronic component at the inspection point is within a threshold range, The electronic component mounting apparatus according to claim 1, wherein the lead type electronic component is determined to be normally mounted on the substrate.   The electronic component mounting apparatus according to claim 2, wherein one or more inspection points can be set at arbitrary positions for each lead type electronic component mounted on the substrate. An electronic component mounting method for mounting a lead type electronic component on a substrate,
Measuring the height of the lead-type electronic component mounted on the substrate with a height sensor;
Determining whether the lead-type electronic component is normally mounted on the substrate based on the height measured by the height sensor ;
Measuring the distance to the area on the substrate on which the lead type electronic component is mounted by the height sensor before the lead type electronic component is mounted on the substrate;
Determining whether other electronic components are normally mounted on the substrate based on the distance measured by the height sensor .

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