JP4607820B2 - Mounting condition determination method - Google Patents

Description

  The present invention relates to a method for determining a mounting condition of a component mounter for mounting a component on a substrate. In particular, the present invention relates to a method for determining mounting conditions individually corresponding to a component mounting machine.

2. Description of the Related Art Conventionally, in a component mounting machine that mounts electronic components on a printed wiring board or the like and produces a mounting board, the component supplied to the component mounting machine is picked up and held by vacuum in order to obtain higher throughput. Each process of the adsorption process which is a process, the transport process which is a process of transporting the lifted parts from the part supply unit to the substrate, and the mounting process which is a process of lowering and placing the transported parts on the substrate surface Software that optimizes mounting conditions such as the arrangement order of component cassettes and component mounting order for component supply to be mounted on a component mounting machine. Measures have been taken (see, for example, Patent Document 1).
JP 2002-50900 A

  However, in terms of hardware, dimensional tolerances are necessary for the production of component mounters, and even though the tolerances are within this tolerance, variations in the accuracy of individual component mounters due to production accuracy are not possible. appear. Furthermore, variations in accuracy peculiar to individual component mounters occur, such as variations due to secular changes such as wear and deterioration of members included in the component mounter, and variations due to temperature changes immediately after the power is turned on until the machine is warmed.

  Therefore, in terms of software, mounting conditions are set so as to absorb the hardware variations and guarantee a certain performance.

  Specifically, for example, as shown in FIG. 14 schematically showing the positional relationship between the electronic component A as a supply component and the suction nozzle 11 for sucking and holding this component, FIG. 14A is ideal. The positional relationship is shown. However, since various variations occur in the component mounter as described above, the electronic component A may be supplied out of the ideal position as shown in FIGS. 14 (b) and 14 (c). . When the supply deviation of the electronic component occurs as described above, when the electronic component A supplied by the suction nozzle 11 is sucked and held, a part of the end of the suction nozzle 11 protrudes from the electronic component A.

  Conventionally, even when the suction nozzle 11 protrudes from the electronic component A as shown in FIG. 14B and there is a slight air leak, the static state remains constant for a while after the suction nozzle 11 contacts the electronic component A. If the time is maintained, the electronic component A can be transported as it is, and the electronic component A can be mounted on the substrate. Absorbed by software.

  As described above, there are many points where variations in hardware are absorbed by mounting conditions, and these factors hinder the improvement of the throughput of the component mounting machine.

  It should be noted that even if an air leak has occurred, if the stationary state is maintained, it can be transported and mounted as it is. Immediately after the occurrence of the leak, the pressure in the suction nozzle 11 is vibrated and the electrons to be sucked and held. This is because the part A flutters, but if the stationary state is maintained for a certain period of time, the vibration of the pressure converges and a stable adsorption force of a certain value or more can be obtained. Further, in the state of FIG. 14 (c), even if the stationary state is maintained, an adsorption force exceeding a certain value cannot be obtained, so that it cannot be covered with software.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an optimal mounting condition according to the hardware situation of each component mounting machine.

  In order to achieve the above object, a mounting condition determination method according to the present invention is a method for determining a mounting condition of a component mounter that mounts a component on a board, and acquires a parameter indicating an operating state of the component mounter. It includes a parameter acquisition step and a mounting condition determination step for determining a mounting condition so that the acquired value of the parameter falls within a predetermined range.

  In the parameter acquisition step indicating the operation state, the suction accuracy based on the amount of deviation between the suction nozzle and the component held by the suction nozzle and the suction nozzle may be acquired as a parameter indicating the operation state. The suction rate based on the number of parts and the number of parts that could not be held by suction may be acquired as a parameter indicating the operating state, and the mounting accuracy based on the amount of deviation between the component mounted on the board and the board is the parameter indicating the operating state The mounting rate based on the number of components to be mounted by the component mounter and the number of components that could not be mounted may be acquired as a parameter indicating the operating state, and the position of the supplied component and a predetermined The supply accuracy based on the amount of deviation from the suction position may be acquired as a parameter indicating the operation state, the time-dependent change of the component mounting machine, the temperature change, or It may be acquired as a parameter indicating at least one operating state of the variability.

  Further, in the mounting condition determining step, the mounting condition may be determined by adjusting a stationary time after the member included in the component mounting machine moves so that the parameter indicating the operation state falls within a predetermined range. The mounting condition may be determined by adjusting the stationary time after the suction nozzle is lowered so that the parameter indicating the operation state falls within a predetermined range. In particular, when the parameter indicating the operating state is better than a predetermined range, the mounting condition may be determined by shortening the stationary time so that the parameter indicating the operating state is within the range. When the parameter indicating the condition is worse than a predetermined range, the mounting condition may be determined by extending the stationary time so that the parameter indicating the operation state falls within the range.

  In the mounting condition determining step, the mounting condition may be determined by adjusting the acceleration generated inside the component mounter so that the parameter indicating the operating state is within a predetermined range. You may adjust the supply speed at the time of supplying a component in the component supply part which supplies components to a component mounting machine so that a parameter may become in a predetermined range.

  Accordingly, when the parameter indicating the operation state is out of the predetermined range, the mounting condition can be determined based on the parameter indicating the operation state. Therefore, it is possible to obtain mounting conditions that flexibly correspond to errors and the like that are individually held by the component mounters to which the mounting condition determination method is applied. In particular, when the parameter indicating the operation state is better than a predetermined range, it is possible to obtain a mounting condition for improving the throughput.

  Further, in the parameter acquisition step indicating the operation state, a parameter indicating the operation state is acquired while the component mounter is producing a mounting board, and in the mounting condition determination step, the component mounting machine is the series of mounting boards. It is desirable to determine the mounting conditions during production.

  As a result, it is possible to successively obtain mounting conditions that can flexibly cope with the state of a component mounting machine that changes every moment during the production of a series of mounting boards.

  In addition, the said objective can be achieved also by the mounting condition determination apparatus provided with the means which implement | achieves each said step, and the program which makes a computer perform each said step, and can obtain the same effect.

  Moreover, even if the component mounting machine includes the mounting condition determination device, the above object can be achieved and the same operational effects can be obtained.

  Mounting conditions can be determined flexibly according to the operating state of the component mounting machine. In particular, even when hardware components such as component cassettes and suction nozzles of component mounters change over time and the operating state may deteriorate, it is possible to cover by changing the mounting conditions so that the operating state does not deteriorate. . Further, when the operating state of the component mounting machine is good, the mounting conditions can be changed so as to improve the throughput by reducing the operating state savings within a normal range.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is an external perspective view showing a part cutout of a component mounting machine 100 according to an embodiment of the present invention.

  The component mounting machine 100 shown in the figure is an apparatus that can be incorporated into a mounting line, mounts an electronic component on a substrate received from upstream, and sends out a mounting substrate, which is a substrate already mounted with electronic components, downstream. A multi-head unit 110 having a plurality of mounting heads that are equipped with a suction nozzle that holds the suctioned and held electronic components and can be mounted on a substrate, and XY that moves the multi-head unit 110 in the horizontal plane direction. A robot 113 and a component supply unit 115 that supplies components to the mounting head are provided.

  Specifically, the component mounting machine 100 is a component mounting machine capable of mounting various electronic components from minute components to connectors on a substrate, and is a variant of a large electronic component of 10 mm square or more, a switch connector or the like. This is a high-speed and multi-function component mounting machine that can mount IC components such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  FIG. 2 is a plan view showing a main internal configuration of the component mounter 100.

  The component mounter 100 further conveys the substrate 120 and a nozzle station 119 in which a replacement suction nozzle that is replaceably attached to the mounting head 112 (see FIG. 3) is stored in order to support various types of component types. Rails 121 constituting a track for mounting, a mounting table 122 on which the board 120 is placed in order to mount the electronic parts on the transported board 120, and an electronic part sucked and held by the multi-head unit 110. In the case of a defect or the like, a component collection device 123 that collects the component and a recognition device 124 that recognizes the state of the electronic component held by the multihead unit 110 by image analysis are provided.

  The recognizing device 124 images the electronic component sucked and held by the suction nozzle provided in the multi-head unit 110, and based on the position of the suction nozzle and the captured image of the electronic component, X, Y, It is a device that acquires a deviation in the θ direction. The component mounter 100 according to this embodiment includes a CCD camera type recognition device 124a that captures an image of an electronic component that is picked up and held by a CCD camera as a recognition device, and irradiates the electronic component with a laser beam. And a line sensor type recognition device 124b for obtaining an image of the electronic component from the reflected light. The two types of recognition devices 124a and 124b can select which one to use depending on the component type. Then, image processing is performed on any image captured by any method, and the recognition device 124 provides an electronic component holding deviation amount and the like.

  The component supply unit 115 is provided in front of and behind the component mounter 100, and is provided with a component supply unit 115a including a supply cassette for supplying electronic components stored in a tape shape and a partition according to the size of the component. And a component supply unit 115b for supplying electronic components stored in the plate.

  FIG. 3 is a perspective view schematically showing the positional relationship between the multi-head unit 110 and the component supply unit 115a including the supply cassette.

  As shown in the figure, the multi-head portion 110 is provided with a plurality of mounting heads 112, and a suction nozzle 111 is replaceably provided at the tip thereof.

On the other hand, the supply cassette constituting the component supply unit 115a shown in the figure includes a component tape 116 for storing a plurality of electronic components of the same component type side by side on a carrier tape, and a supply reel 117 for winding and holding the component tape 116. And a tape feeder 114 that feeds out the component tape 116 from the supply reel 117 as necessary, takes out the electronic component from the component tape 116, and exposes the electronic component to the supply port 118.

  In the case of the present embodiment, the component supply unit 115a holds the supply cassettes arranged in the Z-axis direction, and replaces individual supply cassettes as necessary, such as out of components, and the component tape 116 and supply reel. 117 can be exchanged with 117.

  Next, the component mounter 100 generally mounts electronic components on the board 120 as follows.

  FIG. 4 is a plan view schematically showing the trajectory of the multi-head unit 110 that moves inside the component mounter 100.

  As shown in the figure, first, when the electronic component to be mounted and the suction nozzle 111 provided in the multi-head unit are not compatible, <1> (corresponding to <1> in FIG. > Similar to <5>) The multi-head unit 110 is moved to the nozzle station 119 and replaced with a suitable suction head 111. Then, <2> the multi-head unit 110 is moved to above the component supply unit 115a.

  Next, <3> the multi-head unit 110 is moved to the vicinity of the recognition device 124. <4> The multi-head unit 110 passes above the recognition device 124. Finally, after moving the <5> multi-head part 110 onto the substrate 120, the suction nozzle 111 is moved up and down to mount the electronic component A.

  In order to mount the necessary electronic component A on a single substrate, the steps <1> to <5> are repeated, and each step (<1> to <5>) is performed after positive or negative acceleration or after stopping. It operates based on the mounting conditions including the rest time of.

  Here, the movement of the suction nozzle 111 will be described in detail.

  FIG. 5 is a diagram schematically showing the movement of the suction nozzle 111 when holding the electronic component A by suction, and the line LV indicates the moving speed of the suction nozzle 111 (multihead unit 110) in the horizontal plane direction. . A line LH indicates the height of the suction nozzle 111, and these constitute a timing chart. And the figure described in the lower part of the line LH is a side view which shows the motion of the suction nozzle 111 typically.

  The multi-head unit 110 is decelerated at a constant negative acceleration in the horizontal plane (FIG .: V1). That is, the multi-head unit 110 stops at a predetermined position above the component supply unit 115 while decreasing in speed as time elapses. That is, the speed becomes zero. Since the stop operation is rapid, the multi-head unit 110 vibrates even after the stop. Although the amplitude and decay time of this vibration vary depending on the component mounting machine, a time for standing still for a while until the vibration is settled is set as a mounting condition (D1). That is, a time lag is provided from when the speed becomes zero until the suction nozzle 111 starts to descend. After a certain time (D1) has elapsed, the suction nozzle 111 starts to descend in order to suck and hold the electronic component A supplied by the component supply unit 115. At the lowest point (H2) of the stroke of the suction nozzle 111, that is, at the position where the suction nozzle 111 contacts the electronic component A (hereinafter sometimes referred to as “bottom dead center”), the suction nozzle 111 stops for a while. Is set (D2). The reason why the suction nozzle 111 is stationary at the bottom dead center is that even if a leak occurs due to the deviation between the electronic component A and the suction nozzle 111, the fluttering of the electronic component A that occurs at the beginning of contact is reduced and a constant suction force is obtained. To wait. Thereafter, the suction nozzle 111 ascends and holds the electronic component A. A mounting condition is set in which the suction nozzle 111 stops for a while after reaching the highest point (H1) (hereinafter, sometimes referred to as “top dead center”) (D3). Then, after a certain time (D3) has elapsed, the multi-head unit 110 starts moving at a constant acceleration in the horizontal plane together with the suction nozzle 111 that sucks and holds the electronic component A (V3).

  Note that the time (D1, D2, D3, etc.) for stabilizing vibrations may be 0 seconds. In other words, there is a case where a transition is made from one operation to the next without stopping.

  The movement state of the suction nozzle 111 when the electronic component A is mounted is substantially the same as described above.

  FIG. 6 is a block diagram illustrating each configuration of the component mounter 100.

  As shown in the figure, the component mounter 100 includes a mechanism unit 131 and a mounting condition determination device 200.

  The mechanism unit 131 shows a general mechanism for performing a specific mounting process, and is, for example, a mounting head 112, an XY robot 113, a component supply unit 115, a rail for transporting the substrate 120, or the like.

  The mounting condition determination device 200 is a computer device that calculates an optimal mounting condition based on a parameter indicating the operation state of the component mounter 100, and includes an operation state acquisition unit 201, a mounting condition determination unit 202, a data storage unit 203, and the like. , A display unit 204, an input unit 205, and a mechanism control unit 206. In the case of the present embodiment, the mounting condition determining apparatus 200 is incorporated in the component mounter 100.

  The operation state acquisition unit 201 is a processing unit that can acquire a parameter indicating the operation state during mounting of the electronic component A.

  The parameters indicating the operation state include the amount of deviation between the suction nozzle 111 and the electronic component A observed by the recognition device 124, the number of electronic components A that could not be held or collected by the component collection device 123, and the like. .

  In addition, the operation state acquisition unit 201 has a mounting deviation value of the electronic component A obtained by an inspection device provided in the component mounting machine 100 or an inspection device separate from the component mounting machine 100, and there is a mounting failure. Further, the number of electronic components A and the supply deviation amount of the tape feeder 114 constituting the component supply unit 115, that is, the deviation amount between the supplied electronic component A and a predetermined suction position may be acquired as a parameter indicating an operation state. it can.

  The mounting condition determination unit 202 is a processing unit that determines a condition for the component mounter 100 to mount the electronic component A on the board 120, and in particular, adjusts a parameter indicating the operation state acquired by the operation state acquisition unit 201. It is a processing unit capable of determining mounting conditions.

  Specifically, when the parameter indicating the operation state acquired by the operation state acquisition unit 201 is better than the predetermined range, the parameter indicating the operation state is set so that the parameter indicating the operation state falls within the predetermined range. It is a processing unit that adjusts and determines mounting conditions so that the throughput of the component mounting machine 100 is improved. On the other hand, when the parameter indicating the operation state is worse than the predetermined range, the processing unit is set as a mounting condition for reducing the throughput of the component mounter 100 so that the parameter indicating the operation state falls within the predetermined range.

  The conditions determined by the mounting condition determining unit 202 include positive and negative accelerations generated in the above-described steps (<1> to <5>), a stationary time after stopping, and the like. Positive and negative accelerations that occur when moving and stopping in the horizontal plane (FIG. 5: V1, V3), and the rest time after the movement of the multi-head unit 110 and the suction nozzle 111 stops (FIG. 5: D1 to D3) , The speed at which the component supply unit 115 supplies the electronic component A, and the rest time after the electronic component A is supplied.

  It is desirable that the optimum mounting condition is determined. However, even if the mounting condition is not optimal, it is sufficient if the mounting condition can provide an improvement that shortens the mounting time.

  The data storage unit 203 is a storage device such as a hard disk drive in which information for adjusting and determining each parameter is stored. As shown in FIG. 7, each process (FIG. 4: <1> to <5>) , The standard acceleration in the suction nozzle 111, the movement between the top dead center and the bottom dead center, the speed pattern, and the process data associated with the standard stationary time after reaching a predetermined position are stored. In addition, as shown in FIG. 8, cassette data associated with the individual tape feeders 114 is stored as the standard speed and stationary time when the tape feeder 114 of the supply unit 115 supplies the electronic component A. Yes.

  Information relating to acceleration included in the process data is defined in such a manner that numbers are associated with accelerations determined in stages (for example, stages 1 to 9), and the smaller the number, the higher the acceleration.

  In addition, the speed pattern is, for example, as shown in FIG. 9A, when the multi-head unit 110 is moved at a constant acceleration, or as shown in FIG. This is information for deciding which one of a plurality of speed patterns such as the acceleration is reduced when approaching, and the numbers correspond to the speed patterns.

  The display unit 204 is a CRT, LCD, or the like, and the input unit 205 is a keyboard, mouse, touch panel, or the like. These are used for inputting control data for the component mounter 100 while the component mounter 100 and the operator interact.

  The mechanism control unit 206 is a processing unit that controls the mechanism unit 131 based on the determined mounting condition.

  Next, an outline of the processing operation of the mounting condition determining apparatus 200 having the above configuration will be described.

  FIG. 10 is a flowchart showing the processing operation of the mounting condition determining apparatus 200 according to this embodiment.

  First, the operation state acquisition unit 201 acquires a parameter indicating an operation state provided from other than the component mounter 100 and a parameter indicating a past operation state measured by the component mounter 100 (S901).

  Next, the mounting condition determining unit 203 determines whether or not the acquired parameter indicating the operation state is included in a predetermined range set in advance (S902). If it is included in the predetermined range (S902: Y), the current mounting condition is determined as it is as the mounting condition (S904).

  On the other hand, when it is not included in the predetermined range (S902: N), the mounting condition is adjusted to change the mounting condition from the current mounting condition (S903). Then, the mounting process is performed based on the adjusted mounting condition, and the process is repeated from the step of acquiring the parameter indicating the operation state (S901).

  Next, a specific processing operation of the mounting condition determining apparatus 200 will be described as an example.

  FIG. 11 is a flowchart exemplarily showing a specific processing operation of the mounting condition determining apparatus 200.

  As shown in the figure, this processing operation is a process of acquiring a suction rate as a parameter indicating an operation state and determining a mounting condition based on this.

  First, the operation state acquisition unit 201 acquires a suction rate provided from other than the component mounter 100 and a past suction rate measured by the component mounter 100 (S1001).

  The suction rate acquired in this step is a value obtained by dividing the number of parts that could not be picked up by the number of parts to be picked up by statistical processing by the operation state acquisition unit 201. The number of parts that could not be picked up can be acquired by, for example, recognizing the picked-up state by the recognition device 124 and counting the number of parts that could not be picked up normally. Further, it can be obtained by detecting that the suction pressure is abnormal by a vacuum pressure sensor provided in the suction nozzle and counting the number of parts.

  Next, when the acquired suction rate is better than the preset range (S1002: Y), the mounting condition determination unit 203 adjusts the mounting condition corresponding to the suction rate in a strict direction to improve the throughput. As a result, the mounting conditions are provisionally determined. On the other hand, when the suction rate is worse than the range set in advance (S1002: N), the mounting condition corresponding to the suction rate is adjusted in a loose direction to temporarily determine the mounting condition.

  As a specific example of adjusting the mounting conditions in a strict direction, the time during which the suction nozzle 111 descends and comes into contact with the electronic component A in order to hold the electronic component A by suction in the component supply unit 115 is stopped. After the tape feeder 114 supplies the electronic components, the time during which the suction nozzle 111 is in contact is reduced (S1003).

  On the other hand, when the adsorption rate is worse than the preset range (S1002: N), the stationary time is increased (S1004).

  Examples of the time adjustment method include a method of sequentially adding or subtracting the corresponding still time indicated by the process data by 10%, a method of adding or subtracting 3 msec to the still time, and the like.

  If the suction rate falls within the specified range (S1111: Y), the mounting conditions are determined (S1112). On the other hand, if the adsorption rate does not fall within the specified range (S1111: N), the mounting conditions are adjusted again.

  Next, a process for obtaining the mounting rate and determining the mounting condition based on the mounting rate will be described.

  FIG. 12 is a flowchart exemplarily showing a specific processing operation of the mounting condition determining apparatus 200.

  The mounting condition determining unit 203 acquires the mounting rate (S1113), and when the mounting rate is better than the range set in advance (S1005: Y), the multihead unit 110 moves above the substrate 120. Decreasing the time that is stationary or the time that the suction nozzle 111 is lowered and the substrate 120 and the electronic component A are brought into contact with each other in order to mount the electronic component A held by suction on the substrate 120. (S1006), provisional conditions are provisionally determined. On the other hand, if the mounting rate is worse than the pre-set range (S1005: N), the stationary time is increased (S1007), and the mounting conditions are provisionally determined.

  When the mounting rate falls within the specified range (S1114: Y), the mounting conditions are determined (S1115). On the other hand, if the mounting rate does not fall within the specified range (S1114: N), the mounting conditions are adjusted again.

  Next, a process of acquiring the amount of deviation between the suction nozzle 111 and the electronic component A as a parameter indicating the operation state and determining the mounting condition based on this will be described.

  FIG. 13 is a flowchart exemplarily showing a specific processing operation of the mounting condition determining apparatus 200.

  The operation state acquisition unit 201 acquires the amount of deviation (adsorption accuracy) between the suction nozzle 111 and the electronic component A from the recognition device 124 as a parameter indicating the operation state (S1009), and the electronic component A is picked up by the component supply unit 115. In order to hold, the time during which the suction nozzle 111 is lowered and comes into contact with the electronic component A is adjusted to determine the mounting conditions (S1010).

  This is performed for each task, and the mounting condition for the immediately following task is determined based on the parameter indicating the operation state obtained in the immediately preceding task.

  Here, the task indicates a series of operations in a series of operations of picking, moving, and mounting parts by the multi-head unit 110, and <1> to <5> in FIG. 4 correspond to almost one task. ing.

  The electronic component A is recognized by the recognition device 124 for each task (FIG. 4: <3> to <4>). The amount of deviation between the suction nozzle 111 and the electronic component A is also used as a parameter indicating the operating state for each task. It is possible to get to.

  Through the above processing operation, the mounting condition determining apparatus 200 acquires a parameter indicating an operation state peculiar to the component mounting machine 100, adjusts the mounting condition corresponding to the parameter indicating the operation state, and adjusts the mounting condition to each component mounting machine. Optimal mounting conditions can be obtained. In particular, when the parameter indicating the operating state is better than the set range, it can be converted to improve the throughput.

  Furthermore, even if the component mounting machine changes within a day or changes over time, an optimal mounting condition corresponding to the time is created, and the change can be flexibly handled.

  For example, when the tip of the suction nozzle 111 is worn due to a change with time and a slight leak occurs, it specifically appears as a reduction in the suction rate or a reduction in the mounting rate. In other words, the mounting condition determining apparatus 200 detects (monitors) changes over time of the apparatus, changes in temperature, variations in the component mounting machine 100, and the like based on the suction rate, mounting ratio, mounting deviation, etc., and responds to changes over time. Possible implementation conditions can be determined.

  In the above description, parameters indicating each type of operation state are acquired at arbitrary timings. However, the present invention is not limited to this, and the acquisition timing of parameters indicating a plurality of types of operation states is set to a predetermined board. It may be performed at a time each time the is produced. Further, the timing for determining the mounting condition based on the acquired parameter indicating the operation state and the parameter to be adjusted can be arbitrarily set.

  In addition, the conditions to be adjusted for determining the mounting conditions are exemplified by the acceleration in the horizontal plane of the multi-head unit, the stationary time after stopping the movement, the stationary time at the top and bottom of the stroke of the suction nozzle 111, the supply speed of electronic components, etc. Although described above, the present invention is not limited to this, and other mounting conditions such as the movement acceleration of the entire component supply unit in the rotary type component mounting machine and the stop time after the movement may be used.

  Moreover, although the state in which the mounting condition determining device is provided in the component mounting machine is illustrated, the mounting condition determining device and the component mounting machine may be separated.

  In addition, as the parameter indicating the operation state, the deviation of the supply position measured using an inspection jig in advance with respect to the tape feeder 114 provided in the component mounting machine 100 or a series of mounting boards has already been produced. The amount of mounting displacement between the substrate 120 and the electronic component A measured by a separate inspection device, the amount of suction displacement between the electronic component A and the suction nozzle 111 that has already been measured by the recognition device 124, and the occurrence of suction failure And the number of parts to be picked up. Also, the supply accuracy based on the supply position deviation amount calculated by the operation state acquisition unit 201 performing statistical processing on these, the mounting accuracy based on the attachment deviation amount, the adsorption accuracy based on the adsorption deviation amount, and the component that could not be adsorbed The suction rate obtained by dividing the number by the number of parts to be picked up is also included in the parameter indicating the operation state.

  Furthermore, the recognition error rate, which is the probability of occurrence of an electronic component that cannot be recognized by the recognition device 124, and the operation of mounting the electronic component A on the substrate 120 are performed. However, the electronic component A is attached to the suction nozzle 111 for some reason and is electronic. The component take-out rate, which is the probability of occurrence of a state where the component is brought home, and the operation of mounting the electronic component A on the board 120 are performed, but the occurrence probability of the state where the electronic component A is not mounted on the board 120 for some reason. The product rate is also a parameter indicating the operating state.

  In addition, the mounting conditions that are adjusted when determining the mounting conditions are adjusted in order from the mounting conditions that are closely related to the acquired parameter indicating the operation state.

  For example, the mounting conditions corresponding to the suction accuracy include the time during which the suction nozzle is stationary at the bottom dead center, the speed at which the tape feeder 114 supplies the electronic component A, and the suction nozzle 111 after the electronic component A is supplied. Examples include the timing until the electronic component A comes into contact, the acceleration in the horizontal plane of the multi-head unit 110, the stationary time after the multi-head unit 110 stops.

  Further, the mounting condition corresponding to the recognition error rate can be exemplified by the illumination intensity of the illumination that illuminates the electronic component when the recognition device 124 recognizes the electronic component A. The mounting conditions corresponding to the part take-out rate and the missing part rate include the suction pressure (vacuum pressure) when the electronic component A is sucked by the suction nozzle 111 and the end of the suction nozzle 111 that contacts the electronic component A. The diameter of the opening can be exemplified.

  Further, as a method of adjusting the mounting condition, a method of increasing the illumination intensity by one step when the recognition error rate is higher than a predetermined range can be exemplified. If the part take-out rate or the missing part rate is higher than a predetermined range, a method of changing the diameter of the suction nozzle 111 to one larger or increasing the suction pressure can be exemplified.

  Further, examples of mounting conditions corresponding to mounting accuracy include the time during which the multi-head unit 110 is stationary after moving in a horizontal plane, the acceleration of the multi-head unit 110, and the rest time at the bottom dead center of the suction nozzle 111. .

  The present invention can be applied to a component mounter, and in particular, can be applied to a component mounter that mounts electronic components on a printed circuit board.

1 is an external perspective view showing a part cut out of a component mounter according to an embodiment of the present invention. It is a top view which shows the main internal structures of a component mounting machine. It is a perspective view which shows typically the positional relationship of a multi-head part and a supply part. It is a top view which shows roughly the locus | trajectory of the multi-head part which moves inside a component mounting machine. It is a diagram schematically showing the movement when the suction nozzle sucks and holds the electronic component, the line at the top indicates the moving speed of the multi-head part in the horizontal plane direction, and the line below it indicates the movement of the suction nozzle Shows the height. It is a block diagram which shows the function structure of the component mounting machine 100 containing a mounting condition determination apparatus. It is a figure which illustrates process data. It is a figure which illustrates cassette data. It is a figure which illustrates a speed pattern. It is a flowchart which shows the processing operation of the mounting condition determination apparatus which concerns on embodiment. It is a flowchart which shows the concrete process operation | movement of a mounting condition determination apparatus exemplarily. 10 is a flowchart exemplarily showing another specific processing operation of the mounting condition determining apparatus. It is a flowchart which shows further another specific process operation | movement of a mounting condition determination apparatus. It is a top view which illustrates supply deviation in the conventional parts supply part.

Explanation of symbols

A Electronic component 14 Supply cassette 18 Component supply port 11 Adsorption nozzle 100 Component mounting machine 110 Multihead unit 111 Adsorption nozzle 112 Mounting head 113 XY robot 114 Tape feeder 115 Component supply unit 116 Component tape 117 Supply reel 118 Component supply port 119 Nozzle station 120 Substrate 121 Rail 122 Mounting Table 123 Component Recovery Device 124 Recognition Device 131 Mechanism Unit 200 Mounting Condition Determination Device 201 Operation State Acquisition Unit 202 Mounting Condition Determination Unit 203 Data Storage Unit 204 Display Unit 205 Input Unit 206 Mechanism Control Unit 211 Mounting Timing Data 212 Acceleration data 213 Speed data

Claims (2)

A method for determining mounting conditions of a component mounter for mounting components on a board,
A parameter acquisition step for acquiring a past mounting rate based on the number of components to be mounted by the component mounter and the number of components that could not be mounted ;
If the attachment factor is better than the range that has been set in advance, so that the mounting rate is within the range, by shortening the rest time after the mounting head provided in the component mounting machine is moved,
If worse than the range where the mounting rate has been set in advance, so that the mounting rate is within the range, to include a mounting condition determining step of determining a mounting condition by lengthening the rest time A characteristic mounting condition determination method. A method for determining mounting conditions of a component mounter for mounting components on a board,
A parameter acquisition step for acquiring a past suction rate based on the number of parts to be sucked and held by the suction nozzle and the number of parts that could not be sucked and held ;
When the suction rate is better than the range set in advance, shorten the stationary time after the suction nozzle provided in the component mounting machine is lowered so that the suction rate is within the range,
If worse than the range in which the adsorption rate has been set in advance, the such adsorption ratio is within the range, to include a mounting condition determining step of determining a mounting condition by lengthening the rest time A characteristic mounting condition determination method.

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