JP4328274B2 - Component mounting order optimization method and component mounting order optimization apparatus - Google Patents

Description

  The present invention relates to a component mounting order optimization method for a component mounter, and more particularly to a component mounting order optimization method on a board including a plurality of patterns.

  In a component mounting system in which a plurality of component mounting machines for mounting electronic components on a printed circuit board or the like are arranged on a mounting line, it is necessary to balance the lines so that the tact times in each component mounting machine are equal. In such a component mounting system, conventionally, based on the tact time assigned to each component and the number of components to be mounted, the components in charge of each component mounter are allocated to optimize the mounting order (for example, (See Patent Document 1 and Patent Document 2.)

  That is, as shown in FIG. 20, when a component is mounted on a substrate 20 including a plurality of patterns 12, a component mounter (for example, a component mounter 14a) in an upstream process among the component mounters 14a to 14d. The mounting order is optimized so that a smaller component is mounted, and a larger component is mounted on a component mounter (for example, component mounter 14d) in the downstream process.

At the time of component mounting, each of the component mounting machines 14a to 14d recognizes an image of the board mark 16 provided at the corner of the board 20, and corrects the deviation in the plane direction of the board, the rotation deviation of the board 20, and the expansion and contraction of the board 20. To do. Next, the pattern mark 18 provided for each pattern 12 is image-recognized and the pattern 12 is positioned. Thereafter, component mounting is performed. Thus, it is possible to perform highly accurate positioning by recognizing an image of the pattern mark 18 provided for each pattern 12.
Japanese Patent Laid-Open No. 9-18199 Japanese Patent Laid-Open No. 10-209697

  However, in the conventional component mounting system, the component mounting machines 14 a to 14 d mount components on all the patterns 12 provided on the substrate 20. For this reason, each component mounting machine 14a-14d must image-recognize the pattern marks of all the patterns 12, and must spend a lot of time before starting the component mounting. Therefore, there is a problem that the tact time of the component mounting system as a whole increases. For example, when 100 patterns 12 are included in one substrate 20 and each pattern 12 includes two pattern marks 18, 200 (= 100) is included in one substrate 20. X2) The pattern marks 18 are included. Each of the component mounters 14a to 14d must recognize all the 200 pattern marks 18.

  Further, in the conventional component mounting system, each component mounter 14a to 14d performs component mounting on all the patterns 12, so that the mounting order is optimized when viewed as the whole board. For this reason, there is a problem that it takes a calculation processing time for optimization because the types of components and the number of mounting points to be optimized are increased.

Furthermore, when there is a change in the number of component mounting machines on the mounting line, optimization has to be performed again from the beginning, and there is a problem that it is not possible to flexibly cope with changes in the line organization.
The present invention has been made to solve the above-described problems, and an object thereof is to provide a component mounting order optimization method for optimizing the component mounting order so that the tact time at the time of component mounting is reduced.

It is another object of the present invention to provide a component mounting order optimization method that does not take time to optimize the mounting order.
It is another object of the present invention to provide a component mounting order optimizing method that can flexibly cope with a change in line organization due to a change in the number of component mounters.

To achieve the above object, the component mounting order optimization method of the present invention is a component mounting order optimization method for optimizing the component mounting order in a component mounting system including a plurality of component mounting machines for mounting components on a board. And each of the component mounting machines for each pattern so that the substrate includes a plurality of patterns having the same component arrangement configuration and each component mounting machine mounts all the components in the pattern. Includes an assigning step of assigning parts included in the pattern .

  Each of the plurality of patterns is assigned to one of the plurality of component mounters. For this reason, when component mounting is performed, each component mounter recognizes an image of only the pattern mark of the pattern assigned to itself and mounts only the pattern. For this reason, it is not necessary to recognize images of pattern marks of all patterns, and it does not take much time to start mounting components. Therefore, the tact time of the entire component mounting system can be reduced.

  In addition, the same electronic component is mounted on each component mounting machine. For this reason, for example, even when there are many large sized components and few small sized components, the line balance of the component mounting system can be kept constant.

  Furthermore, even if the number of component mounters changes in the component mounting system due to a change in production plan, etc., each component is not changed without changing the optimization of the component mounting order within the pattern. The optimization is completed only by changing the pattern assigned to the mounting machine and the stopper position. For this reason, even when the number of component mounting machines fluctuates, optimization can be easily performed again, and a change in line organization can be flexibly handled.

Preferably, component mounting order optimization method described above, further, the rows that have the optimization of mounting order of the components in a plurality of the pattern to be assigned to any one of the component mounting apparatus of the pattern, to be optimized A step of using the result for mounting order of components in a pattern assigned to all other component mounting machines .
By including this step, the mounting order of the components can be optimized within one pattern, and the optimization result can be used in all the component mounting machines. For this reason, the time required for optimization can be shortened.

  More preferably, the allocating step determines the number of patterns allocated to each component mounter so as to be substantially equal from the total number of patterns included in the board and the number of the component mounters. A pattern allocating step of allocating any of the plurality of component mounters as a component mounter for mounting a component for each of the determined number of patterns.

By equalizing the number of patterns assigned to each component mounter, line balance can be maintained.
More preferably, the step of determining the number of patterns includes a step of calculating a quotient and a remainder obtained by dividing the total number of patterns included in the board by the number of the component mounting machines, and if the remainder is 0, the quotient is calculated. When the number of patterns allocated to each component mounter and the remainder is 1 or more, 1 is added to the quotient for the same number of component mounters from the most upstream process. The number of patterns to be assigned, and for other component mounters, the quotient is assigned to the number of patterns to be assigned.

  Even if the number of patterns assigned to each component mounter cannot be equalized, an unprocessed board does not stagnate in the downstream process by assigning many patterns to the component mounter in the upstream process. .

  More preferably, the step of determining the number of patterns includes a step of calculating a quotient and a remainder obtained by dividing the total number of patterns included in the board by the number of the component mounters, and a number of patterns to allocate the quotient to each component mounter. And a step of setting the remainder to the number of patterns assigned to a plurality of component mounters in common. Preferably, the plurality of component mounters are all component mounters provided in a component mounting system.

Even when the above-mentioned remainder occurs, the remainder pattern is assigned to all the component mounting machines. For this reason, the line balance between component mounting machines can be made constant.
More preferably, in the pattern assigning step, the number of the patterns is assigned to each component mounter as a component mount target so that a pattern boundary of a pattern assigned to each component mounter is provided in a direction orthogonal to the traveling direction of the substrate. Assign a pattern. In the component mounting order optimization method, the distance from the standard position of the head for mounting components on the board to the assigned pattern is constant for all component mounters for each component mounter. Thus, the step of determining the position of the board at the time of component mounting is included.

  By assigning the pattern in such a direction and determining the fixed position of the board, the movement distance from the head to the pattern becomes constant in each component mounting machine, and the line balance becomes constant. In the component mounting order optimization method, the distance from the arrangement position of the component cassette used for component mounting to the assigned pattern is constant for all component mounting machines. Thus, the step of determining the arrangement position of the component cassette may be included.

  The present invention can be realized not only as such a component mounting order optimization method, but also as a program for causing a computer to execute the characteristic steps of this method, or to perform the characteristic steps of this method. It can also be realized as a component mounting order optimization device as means. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM or a transmission medium such as the Internet.

According to the present invention, the tact time of the component mounting system is reduced.
In addition, the component mounting order can be optimized in a short time.
Furthermore, the line balance between the component mounting machines can be achieved.

  In addition, it is possible to flexibly cope with fluctuations in the number of component mounters.

(Embodiment 1)
Hereinafter, a component mounting system according to Embodiment 1 of the present invention will be described with reference to the drawings.
(Component mounting system)
FIG. 1 is an external view showing the overall configuration of a component mounting system 10 according to the present invention. The component mounting system 10 includes a plurality of component mounters 100 and 200 constituting a production line for mounting electronic components while sending the circuit board 20 from upstream to downstream, and various databases for starting production. Based on the optimization device 300, the mounting order of necessary electronic components is optimized, and the obtained NC (Numeric Control) data is downloaded to the component mounting machines 100 and 200 to be set and controlled.

  The component mounter 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently or in cooperation with each other (or in an alternate operation). Each sub-equipment 110 (120) is an orthogonal robot type mounting stage, and includes two component supply units 115a and 115b composed of an array of a maximum of 48 component cassettes 114 for storing component tapes, and a maximum of 10 from these component cassettes 114. A multi mounting head 112 (10 nozzle head) having 10 suction nozzles (hereinafter also simply referred to as “nozzles”) capable of sucking and mounting individual components on the substrate 20, and moving the multi mounting head 112 An XY robot 113, a component recognition camera 116 for two-dimensionally or three-dimensionally inspecting the suction state of the components sucked by the multi-mounting head 112, a tray supply unit 117 for supplying tray components, and the like. Each sub-equipment performs component mounting on the board independently of (in parallel with) the other sub-equipment.

  The “component tape” is actually a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound around a reel (supply reel) or the like. . It is mainly used to supply a relatively small size component called a chip component to a component mounter. However, in the optimization process, the “component tape” is data that specifies a set of components belonging to the same component type (a plurality of components arranged on a virtual tape). In a process called “part division”, a part group (one part tape) belonging to one part type may be divided into a plurality of part tapes. The “component type” indicates the type of electronic component such as a resistor or a capacitor.

A part supplied by the part tape is called a taping part.
Specifically, the component mounter 100 is a mounter having the functions of both a component mounter called a high-speed mounter and a component mounter called a multi-function mounter. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 100 is designed to mount almost all kinds of electronic components (from 0.6 mm × 0.3 mm chip resistance to 200 mm connector as components to be mounted) A production line can be configured by arranging a required number of the component mounting machines 100. In the present embodiment, it is assumed that a production line is configured by arranging four component mounters 100 side by side.

(Component mounter configuration)
FIG. 2 is a plan view showing a main configuration of the component mounter 100 which is a target of component mounting order optimization according to the present invention.

  The shuttle conveyor 118 is a moving table for placing the components taken out from the tray supply unit 117 and transporting them to a predetermined position where they can be picked up by the multi-loading head 112. The nozzle station 119 is a table on which replacement nozzles for accommodating various types of component types are placed.

  The two component supply units 115a and 115b constituting each sub-equipment 110 (or 120) are respectively arranged on the left and right with the component recognition camera 116 interposed therebetween. Therefore, the multi-mounting head 112 that has picked up the components in the component supply unit 115a or 115b moves to the mounting point of the board 20 after passing through the component recognition camera 116, and performs an operation of sequentially mounting all of the sucked components. repeat. “Mounting point” refers to a coordinate point on a board on which a component is to be mounted, and components of the same component type may be mounted at different mounting points. The total number of components (mounting points) arranged on the component tape relating to the same component type matches the number of components of that component type (total number of components to be mounted).

  Here, a single operation (suction / moving / mounting) in a repetition of a series of operations of picking / moving / mounting components by the multi-mounting head 112, or a group of components mounted by such a single operation is described as “ This is called “task”. For example, according to the 10 nozzle head 112, the maximum number of components mounted by one task is 10. Here, “suction” includes all suction operations from when the head starts to pick up components until it moves. For example, 10 suction operations (up and down operation of the multi-mounted head 112). This includes not only the case of picking up these parts, but also the case of picking up 10 parts by a plurality of picking operations.

  FIG. 3 is a schematic diagram showing the positional relationship between the multi-mounting head 112 and the component cassette 114. The multi-mounting head 112 is a working head called “gang pickup system”, and can mount a maximum of ten suction nozzles 112a to 112b. At this time, a component from each of a maximum of ten component cassettes 114 can be mounted. Can be adsorbed simultaneously (by a single up-and-down motion).

  Note that only one component tape is loaded into the component cassette 114 called “single cassette”, and two component tapes are loaded into the component cassette 114 called “double cassette”. The position of the component cassette 114 (or component tape) in the component supply units 115a and 115b is referred to as “value on the Z axis” or “position on the Z axis”, and the leftmost end of the component supply unit 115a is “1”. A serial number or the like is used. Therefore, determining the mounting order for the taping components is equivalent to determining the arrangement (position on the Z axis) of the component type (or component tape or component cassette 114 storing the component tape). The “Z-axis” refers to a coordinate axis (or a coordinate value thereof) that specifies an arrangement position of a component cassette mounted for each component mounter (or a sub-equipment when a sub-equipment is provided).

  As shown in FIG. 4A, each component supply unit 115a, 115b, 215a, 215b can mount a maximum of 48 component tapes (the positions are Z1 to Z48, Z49 to Z96, Z97 to Z144, Z145 to Z192). Specifically, as shown in FIG. 4B, a maximum of 48 types can be provided for each component supply unit (A block to D block) by using a double cassette containing two component tapes having a tape width of 8 mm. Can be mounted. The larger the tape width (component cassette), the smaller the number of cassettes that can be mounted in one block.

  It should be noted that the left part supply units 115a and 215a (A block, C block) toward each sub-equipment are “left block”, and the right part supply units 115b and 215b (B block and D block) toward each sub-equipment. Is also called “right block”.

  FIGS. 5A and 5B are a diagram and a table showing an example of the position (Z axis) of the component supply unit that can be sucked by the 10 nozzle head. In addition, H1-H10 in a figure points out the nozzle (position) mounted in the 10 nozzle head.

  Here, the interval between the nozzles of the 10-nozzle head corresponds to the width (21.5 mm) of one double cassette, so the Z numbers of parts picked up by one up-and-down movement are every other number (only odd numbers) (Or even number only). Furthermore, due to the movement restriction of the 10 nozzle head in the Z-axis direction, as shown in FIG. 5B, the nozzle that cannot adsorb to the component (Z-axis) constituting one end of each component supply unit ("-" In the figure) exists.

Next, the detailed structure of the component cassette 114 will be described with reference to FIGS.
Various chip-type electronic components 423a to 423d as shown in FIGS. 6 (a) to 6 (d) are stored in a storage recess 424a continuously formed at a constant interval on the carrier tape 424 shown in FIG. Cover tape 425 is pasted and packaged, and the tape is supplied to the user in a taping form (component tape) in which a predetermined quantity is wound around supply reel 426. However, the shape of the component in which the electronic component is stored is not limited to the concave shape. Other than the carrier tape 424 as shown in FIG. 7, there are an adhesive tape in which components are adhesively fixed to the tape, a paper tape, and the like.

  Such a taping electronic component 423d is used by being mounted on a component cassette 114 as shown in FIG. 8, and in FIG. 8, a supply reel 426 is rotatable on a reel side plate 428 coupled to a main body frame 427. It is attached. The carrier tape 424 pulled out from the supply reel 426 is guided by a feed roller 429, and is provided in the apparatus in conjunction with an operation of an electronic component automatic mounting device (not shown) on which the electronic component supply device is mounted. The feed lever 430 of the electronic component supply device is moved in the direction of arrow Y1 in the drawing by a feed lever (also not shown), and the ratchet 432 is rotated by a constant angle via a link 431 attached to the feed lever 430. Then, the feed roller 429 interlocked with the ratchet 432 is moved by a constant pitch (for example, a feed pitch of 2 mm or 4 mm). The carrier tape 424 may be sent out by motor driving or cylinder driving.

  Further, the carrier tape 424 is peeled off from the cover tape 425 by the cover tape peeling portion 433 in front of the feed roller 429 (supply reel 426 side), and the peeled cover tape 425 is wound around the cover tape take-up reel 434. The carrier tape 424 from which the cover tape 425 has been peeled off is conveyed to an electronic component take-out unit 435, and from the electronic component take-out unit 435 that opens in conjunction with the ratchet 432 simultaneously with the feeding roller 429 carrying the carrier tape 424. The chip-type electronic component 423d stored in the storage recess 424a is sucked and taken out by a vacuum suction head (not shown). Thereafter, the feed lever 430 is released from the pushing force by the feed lever and returns to the Y2 direction, that is, to the original position by the urging force of the tension spring 436.

The operational characteristics of the component mounter 100 are summarized as follows.
(1) Nozzle replacement When the nozzle required for the next mounting operation is not in the multi mounting head 112, the multi mounting head 112 moves to the nozzle station 119 and performs nozzle replacement. As types of nozzles, there are, for example, types S, M, and L, depending on the size of the parts that can be picked up.
(2) Component adsorption The multi-mounting head 112 moves to the component supply units 115a and 115b and adsorbs electronic components. When 10 parts cannot be picked up at the same time, a maximum of 10 parts can be picked up by moving the picking position up and down several times.
(3) Recognition Scan The multi mounting head 112 moves on the component recognition camera 116 at a constant speed, captures images of all electronic components sucked by the multi mounting head 112, and accurately detects the suction position of the components.
(4) Component mounting Electronic components are sequentially mounted on the substrate 20.

  By repeating the operations (1) to (4), all electronic components are mounted on the substrate 20. The operations (2) to (4) are basic operations in mounting a component by the component mounter 100, and correspond to “tasks”. That is, a maximum of 10 electronic components can be mounted on the board in one task.

(Restrictions on component mounters)
The purpose of optimizing the mounting order of components is to maximize the number of boards produced per unit time by the component mounting machine 100. Therefore, as a preferable optimization method (optimization algorithm), as can be understood from the above functional and operational characteristics of the component mounting machine 100, ten electronic components that can be efficiently mounted on the board are selected, The algorithm is such that they are simultaneously sucked from the component supply unit and are sequentially mounted by the shortest path. The component mounting order determined by such an optimization algorithm can ideally improve productivity by about 10 times compared to the case of component mounting using only one nozzle.

  However, any component mounting machine has a limiting factor for determining the mounting order of components from the viewpoints of mechanism, cost, and operation. Therefore, practically, optimizing the mounting order of components means maximizing the number of boards produced per unit time as much as possible while complying with various restrictions.

Hereinafter, main restrictions in the component mounter 100 are listed.
(Multi-mounted head)
The multi mounting head 112 includes 10 mounting heads that perform independent suction and mounting operations in a row, and a maximum of 10 suction nozzles can be attached and detached. Up to 10 parts can be picked up at the same time by one pick up and down action.

In addition, when referring to “individual working heads (working heads that pick up one component)” constituting the multi-mounting head, they are simply referred to as “mounting heads (or“ heads ”)”.
Due to the structure in which the ten mounting heads constituting the multi mounting head 112 are arranged in a straight line, there are restrictions on the movable range of the multi mounting head 112 during component adsorption and component mounting. Specifically, as shown in FIG. 5B, when the electronic component is adsorbed at both ends of the component supply unit (near the left end of the left block 115a and the right end of the right block 115b), there is an accessible mounting head. Limited.

  Also, when the electronic component is mounted on the substrate, the movable range of the multi mounting head 112 is limited.

(Part recognition camera)
The component mounter 100 includes a 2D camera that captures a two-dimensional image and a 3D camera that can also detect height information as the component recognition camera 116. 2D cameras include 2DS cameras and 2DL cameras depending on the size of the field of view that can be captured. The 2DS camera has a small field of view but can perform high-speed imaging, and the 2DS camera is characterized by a large field of view up to 60 × 220 mm. The 3D camera is used to three-dimensionally check whether all leads of the IC component are bent.

  The recognition scanning speed when imaging an electronic component varies depending on the camera. If a part using a 2DS camera and a part using a 3D camera exist in the same task, the recognition scan needs to be performed twice at each speed.

(Parts supply department)
There are two types of electronic component packages: a method called taping for storing electronic components in a tape shape, and a method called a tray for storing them in a plate with partitions according to the size of the components.

Supply of components by taping is performed by the component supply units 115a and 115b, and supply by a tray is performed by the tray supply unit 117.
Taping of electronic parts is standardized, and taping standards from 8 mm to 72 mm exist depending on the size of the parts. By setting such a tape-shaped component (component tape) in a component cassette (tape feeder unit) corresponding to the tape width, it is possible to continuously take out the electronic components in a stable state.

  The component supply unit for setting the component cassette is designed so that component tapes up to a width of 12 mm can be mounted at a 21.5 mm pitch without any gap. When the tape width is 16 mm or more, the gap is set by a necessary amount according to the tape width. In order to pick up a plurality of electronic components simultaneously (by one up-and-down movement), the pitches in the arrangement of the mounting head and the component cassette need only match. For parts with a tape width of up to 12 mm, simultaneous suction of 10 points is possible.

  Note that a maximum of 48 component tapes up to a width of 12 mm can be mounted on each of the two component supply units (the left block 115a and the right block 115b) constituting the component supply unit.

(Parts cassette)
The component cassette includes a single cassette that can store only one component tape and a double cassette that can store a maximum of two component tapes. The two component tapes stored in the double cassette are limited to component tapes having the same feed pitch (2 mm or 4 mm).

(Other restrictions)
The constraints in the component mounter 100 include not only the constraints resulting from the structure of the component mounter 100 as described above, but also the following operational limitations arising from circumstances at the production site where the component mounter 100 is used. is there.
(1) Arrangement fixing For example, in order to reduce manual replacement work of component tapes, a specific component tape (or a component cassette storing it) is positioned at the component supply unit to be set (on the Z-axis). Position) may be fixed.
(2) Resource restrictions The number of component tapes that can be prepared for the same component type, the number of component cassettes that store component tapes, the number of double cassettes, the number of suction nozzles (number for each type), etc. are limited to a certain number. May be.

(Optimizer)
The optimization apparatus 300 is provided as much as possible when a production target (a board and a component to be mounted thereon) and a production tool (a component mounter and sub-equipment with limited resources) are given. This is an apparatus for determining a component mounting order for manufacturing a substrate in a short time (increasing the number of substrates that can be manufactured per unit time).

  Specifically, in order to minimize the mounting time per board, a component cassette containing any component tape is placed at which position (Z axis) of which component mounting machine (sub-equipment). The mounting machine (sub-equipment) multi-mounting head picks up as many parts as possible from the component cassette in any order and places the picked-up parts on any position (mounting point) on the board in any order. This is a device that determines on a computer (searches for an optimal solution).

  At this time, it is required to strictly observe the above-described restrictions of the target component mounter (sub-equipment).

(Hardware configuration of optimization device)
The optimization apparatus 300 is realized by a general-purpose computer system such as a personal computer executing the optimization program according to the present invention, and is a stand-alone simulator (component mounting) in a state where it is not connected to the actual component mounting machine 100. It also functions as an order optimization tool.

  FIG. 9 is a block diagram showing a hardware configuration of the optimization apparatus 300 shown in FIG. This optimization device 300 is subject to line tact (in the tact for each sub-equipment constituting the line, the maximum tact for the component mounting of the target board under various restrictions based on the specifications of each equipment constituting the production line. In order to minimize the (tact), determine the parts to be mounted in each sub-equipment and the mounting order of the parts in each sub-equipment for all the parts given by the component mounting CAD device, etc. A computer device that generates data, and includes an arithmetic control unit 301, a display unit 302, an input unit 303, a memory unit 304, an optimization program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and the like. The

The “tact” is the total time required to mount the target component.
The arithmetic control unit 301 is a CPU, a numerical processor, or the like, and loads and executes a necessary program from the optimization program storage unit 305 to the memory unit 304 in accordance with an instruction from the user and the like. 302 to 307 are controlled.

  The display unit 302 is a CRT, an LCD, or the like, and the input unit 303 is a keyboard, a mouse, or the like, and these optimizer 300 and the operator interact with each other under the control of the arithmetic control unit 301. Used for.

The communication I / F unit 306 is a LAN adapter or the like, and is used for communication between the optimization apparatus 300 and the component mounters 100 and 200.
The memory unit 304 is a RAM or the like that provides a work area for the arithmetic control unit 301. The optimization program storage unit 305 is a hard disk or the like that stores various optimization programs that realize the functions of the optimization apparatus 300.

  A database unit 307 stores input data (mounting point data 307a, component library 307b, and mounting device information 307c) used for optimization processing by the optimization device 300, a mounting point data generated by optimization, and the like. It is.

10 to 12 show examples of the mounting point data 307a, the component library 307b, and the mounting apparatus information 307c, respectively.
The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 10, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, a mounting angle θi, and control data φi. Here, “component type” corresponds to a component name in the component library 307b shown in FIG. 11, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). Yes, “mounting angle θi” is the rotation angle of the head at the time of component mounting, and “control data” is constraint information on mounting of that component (type of suction nozzle that can be used, maximum moving speed of multi mounting head 112) Etc.). The NC data to be finally obtained is an arrangement of mounting points that minimizes the line tact. Note that the X-axis direction is the traveling direction of the substrate 20, and the Y-axis direction is a direction orthogonal thereto.

  The component library 307b is a library in which unique information about all the component types that can be handled by the component mounters 100 and 200 is collected. As shown in FIG. 11, the component size and tact ( And other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 116, a maximum speed ratio of the multi-mounting head 112, and the like). In the drawing, the external appearance of the components of each component type is also shown for reference.

  The mounting apparatus information 307c is information indicating the apparatus configuration for each of the sub-equipment constituting the production line, the above-described restrictions, and the like. As shown in FIG. 12, the unit ID indicating the equipment number, the type of the multi mounting head, Head information relating to the above, nozzle information relating to types of suction nozzles that can be mounted on the multi-mounting head, cassette information relating to the maximum number of component cassettes 114, tray information relating to the number of trays stored in the tray supply unit 117, etc. Become.

  These pieces of information are data called as follows. That is, equipment option data (for each sub-equipment), resource data (number of cassettes and nozzles available for each equipment), nozzle station arrangement data (for each sub-equipment with nozzle station), initial nozzle pattern data (for each sub-equipment) Z-axis arrangement data (for each sub-equipment).

(Optimization process)
Next, the operation of the optimization apparatus 300 in the component mounting system 10 configured as described above will be described.

  As described above, it is assumed that the component mounting system 10 includes four component mounters 100. These four component mounters 100 are shown as a component mounter 100a, a component mounter 100b, a component mounter 100c, and a component mounter 100d from the upstream process as shown in FIG. In the optimization processing in the present embodiment, each component mounting machine 100 mounts all electronic components in the pattern 12. That is, a component is assigned to each component mounter 100 for each pattern 12 or in units of a group of patterns 12 including a plurality of patterns 12. Note that it is desirable to use the same four component mounters 100 in order to align the tact time in each component mounter. Note that in this specification, the “pattern” refers to one substrate in a multi-sided substrate.

  FIG. 14 is a flowchart of the optimization process of the component mounting system 10 by the optimization device 300. The optimization apparatus 300 determines the optimal component mounting order within one pattern 12 (S2). The conventional method can be applied as it is to this component mounting determination method. For this reason, detailed description thereof will not be repeated here. For example, components are mounted in order from components having a smaller component size, or within a component set having almost the same size, so that the moving distance of the multi mounting head 112 is reduced. Determine the order of implementation.

  After the mounting order of electronic components within one pattern 12 is determined, the optimization apparatus 300 divides the total number of patterns 12 included in one board 20 by the number of component mounting machines 100, and obtains the quotient A and the remainder. B is also obtained (S4). Next, the number of allocation patterns of each component mounter 100 is set to A (S6). If the remainder B is not 0 (YES in S8), the B patterns 12 are assigned one by one from the component mounter 100 located in the upstream process (S10). By doing so, the load is lighter in the component mounting machine 100 in the downstream process, and the unprocessed board 20 is not stagnated in the downstream process.

  Next, according to the number of assigned patterns of each component mounter 100, it is determined in which position of the pattern 12 on the board 20 each component mounter 100 actually mounts the component (S12). The pattern 12 is allocated so that the X coordinates of the pattern 12 allocated to one component mounter 100 are as much as possible. By allocating the pattern 12 in this way, the movement distance from the component suction position of the component supply unit to the pattern 12 for the multi-mounting head 112 of the component mounting machine 100 is constant in each component mounting machine 100, and the line balance is constant. It becomes constant. This specific example will be described later.

  At the time of component mounting, the substrate 20 is transported on the rail and fixed at a certain position by a component called a stopper. The position of the stopper is determined based on the position of the assigned pattern (S14). This specific process will also be described later.

  Next, the above optimization process will be described in detail with a specific example. For example, when a board 20 including 12 patterns 12 as shown in FIG. 15A is considered, the quotient A is 3 when the number of patterns 12 is divided by the number 4 of the component mounters 100a to 100d. The remainder B is 0 (S4 in FIG. 14). For this reason, the number of patterns assigned to each of the component mounting machines 100a to 100d is 3 (S6). Next, a pattern is assigned to each of the component mounting machines 100a to 100d, but the X coordinate is set to be as similar as possible (S12). Therefore, as shown in FIG. 15B, three patterns 12 from the first group to the fourth group are assigned to the component mounters 100a to 100d, respectively. By performing such assignment, the X coordinate of the pattern 12 in each group becomes the same. Therefore, although the X coordinate of the pattern 12 can be aligned in the same group, it is better not to dispose the X coordinate as shown in FIG. 15C. In FIG. 15A, the pattern 12 is assigned so that the X coordinate becomes smaller as the component mounting machine 100 in the upstream process, but it is not always necessary to follow such a rule.

  Next, considering a board 20 including 10 patterns 12 as shown in FIG. 16A, dividing the number of patterns 10 by the number 4 of the component mounting machines 100a to 100d results in a quotient A of 2. The remainder B is 2 (S4 in FIG. 14). For this reason, first, the number of allocation patterns of each of the component mounting machines 100a to 100d is set to 2 (S6). Next, since the remainder B is not 0 (YES in S8), the number of patterns is assigned to each of the component mounting machines 100a and 100b in the upstream process (S10). Therefore, the number of allocation patterns of the two component mounting machines 100a and 100b from the upstream process is three, and the number of allocation patterns of the component mounting machines 100c and 100d in the subsequent processes is two.

  Next, the pattern 12 is assigned to each of the component mounting machines 100a to 100d, but the X coordinates are set to be the same as described above (S12). For this reason, as shown in FIG. 16B, the pattern 12 is assigned such that the X coordinate becomes smaller as the component mounting machine 100 in the upstream process becomes smaller.

  After the pattern 12 is assigned to each of the component mounting machines 100a to 100d, the position of the stopper is determined (S14). FIG. 17A shows the position of the stopper of the component mounting machine 100b, and FIG. 17B shows the position of the stopper of the component mounting machine 100d.

  As shown in FIGS. 17A and 17B, the substrate 20 is conveyed on the rail 23 and fixed at the position of the stopper 22, and then component mounting is performed. The position of the stopper 22 is determined so that the distance from the component suction position of the multi-mounting head 112 to the position of the pattern 12 assigned to each of the component mounting machines 100a to 100d is substantially equal in each of the component mounting machines 100a to 100d. It is done.

As described above, the component mounting order is optimized.
After the component mounting order is optimized in the optimization device 300, the component mounting machines 100a to 100d perform component mounting based on the mounting order. Each component mounter 100a to 100d has a pattern 12 in charge. For this reason, as shown in FIG. 13, when components are mounted, the board marks 16 provided at the corners of the substrate 20 are image-recognized, corrected for misalignment, etc., and then assigned to the component mounting machines 100a to 100d. The pattern mark 18 of the inner pattern 12 is recognized and component mounting is performed.

  As shown in FIG. 18, a mark called a bad mark 19 is attached to a part of the pattern 12 in the substrate 20. The pattern 12 with the bad mark 19 is a defect in the previous process. For this reason, the component mounters 100a to 100d do not perform component mounting for the pattern 12 in which the bad mark 19 is recognized.

(Effect of embodiment)
As described above, according to this embodiment, in a multi-sided board, a single component mounting machine does not mount components on all patterns on the substrate, but mounts components only on pre-assigned patterns. Do. For this reason, it is not necessary for each component mounting machine to perform image recognition of the pattern marks of all patterns. Therefore, since it does not take much time to start component mounting, the tact time of the entire component mounting system can be reduced.

  For example, if 200 pattern marks are included in one board and there are four component mounters, in the conventional component mount system, each component mounter must recognize 200 pattern marks. However, in the component mounting system according to the present embodiment, each component mounter only needs to recognize 50 (= 200/4) pattern marks.

  Further, according to the present embodiment, the optimization of the component mounting order is performed within one pattern, which is used by all the component mounting machines. For this reason, the time required for optimization can be shortened.

  Further, the same electronic component is mounted on each component mounting machine. For this reason, for example, even when there are many large sized components and few small sized components, the line balance of the component mounting system can be kept constant.

  Furthermore, even if the number of component mounters changes in the component mounting system due to a change in the production plan, etc., the optimization of the component mounting order in the pattern is not performed, The optimization is completed only by changing the pattern assigned to the component mounting machine and changing the position of the stopper. For this reason, even when the number of component mounting machines fluctuates, optimization can be easily performed again, and a change in line organization can be flexibly handled.

  In addition, the position of the stopper is determined so that the distance from the component suction position of the multi mounting head to the pattern to be mounted is constant between the component mounting machines. For this reason, the movement distance and mounting time of the multi-mounting head are substantially constant in each component mounting machine, and the line balance is constant.

  In addition, the pattern is assigned so that the X coordinate of the pattern assigned to the component mounter is the same as possible for each component mounter. For this reason, the moving distance from the component suction position of the component supply unit to the pattern for the multi mounting head of the component mounting machine is constant in each component mounting machine, and the line balance is constant.

(Embodiment 2)
Next, a component mounting system according to Embodiment 2 of the present invention will be described.

  The component mounting system according to the second embodiment has the same hardware configuration as the component mounting system according to the first embodiment. However, the component mounter 100 according to the present embodiment is different from the component mounter 100 shown in FIG. 2 in that it does not include the front sub-equipment 110 and the rear sub-equipment 120, but the left sub-unit as shown in FIG. It is assumed that the facility 410 and the right sub facility 420 are provided. In the component mounter shown in FIG. 21, a reference pin 202 for positioning the board is installed on the center side in order to reduce the lateral size of the space necessary for component mounting. The board 20 enters from the right direction in the figure, and components are mounted on the right sub-equipment 420. Then, the board | substrate 20 is conveyed to the left sub-equipment 410, and components are mounted in the left sub-equipment 410.

  FIG. 22 is a flowchart of the optimization process of the component mounting system 10 by the optimization apparatus 300. In the optimization process according to the first embodiment shown in FIG. 14, the remaining B patterns 12 when the total number of patterns 12 included in one board 20 is divided by the number of component mounting machines 100 are processed in the upstream process. Are assigned one by one from the component mounting machines 100 located in (S10 in FIG. 14). In the optimization processing according to the present embodiment, component mounting on the B patterns 12 is performed by all the component mounting machines 100 in a shared manner.

  The processing from S2 to S8 is the same as that shown in FIG. When the remainder B is not 0 (YES in S8), the optimization apparatus 300 selects B patterns at positions where all the component mounters 100 can be mounted among the patterns 12 included in the board 20. . Further, the optimization apparatus 300 optimizes the component mounting order when components are mounted on the B patterns 12 selected using all the component mounters 100 (S20). The method for optimizing the component mounting order is a well-known technique. Therefore, detailed description thereof will not be repeated here.

  In the process of S20, selection of B patterns at positions where all the component mounters 100 can be mounted is performed as follows. For example, as shown in FIG. 23, consider a case where the substrate 20 protrudes from the transport rail. In such a case, regarding the pattern included in the protruding portion, the left sub-equipment 410 or the left sub-equipment 410 cannot mount a part. That is, as shown in FIG. 24, when one board 20 is considered, a part 402 in which a component cannot be mounted by the left sub-equipment 410 and a part 406 in which a component cannot be mounted by the right sub-equipment 420 Occurs. Therefore, the optimization apparatus 300 selects B patterns 12 from the portion 404 excluding these portions.

  Next, the optimization apparatus 300 performs the processes of S12 and S14. Since these processes are the same as those described with reference to FIG. 14, detailed description thereof will not be repeated here.

  As shown in FIG. 25A, it is assumed that ten patterns 12 are included on the substrate 20, and component mounting is performed by two component mounting machines 100 (four sub-equipment) on the ten patterns. Suppose you are thinking of In this case, when the number of patterns 10 is divided by the number of sub-equipment 4, the quotient A becomes 2 and the remainder B becomes 2 (S4 in FIG. 22). For this reason, two patterns are assigned to each sub-equipment (from the first group to the fourth group in FIG. 25B). For the remaining two patterns 12, component mounting is performed using all four sub-equipment (shared group in FIG. 25B).

  Note that the pattern 12 included in the shared group is selected from the patterns 12 arranged at positions where all of the four sub-equipment can be mounted as described above. For this reason, the pattern 12 located in the middle of the X-axis direction among the substrates 20 is selected as the pattern 12 included in the shared group. For other groups, the pattern 12 at a position that can be mounted by each sub-equipment is selected.

  As described above, according to the present embodiment, in addition to the effects of the first embodiment, when there is a remainder in the pattern, all the component mounters are in charge of mounting the remainder on the pattern. ing. For this reason, the line balance can be further improved, and the substrate 20 can be prevented from staying in the upstream process. It should be noted that component mounting on the remaining pattern is not necessarily performed by all the component mounting machines, and any allocation may be used as long as the pattern allocation allows a line balance. For example, if the number of sub-equipment is 4 and there are more than two patterns, two sub-equipment in the upstream process of the production line will be responsible for one pattern, and two sub-equipment in the downstream process will remain. You may be in charge of one pattern.

  It is obvious that the line balance can be equalized by sharing the surplus pattern with all the facilities, whether it is the equipment of the two-stage configuration shown in FIG. 2 or the equipment of the one-stage configuration. It is.

As mentioned above, although the component mounting system of this invention was demonstrated based on embodiment, a component mounting system is not limited to this embodiment.
For example, the optimization apparatus 300 performs the optimization process for one pattern 12 at the beginning of the optimization process illustrated in FIG. 14, but is not necessarily performed at the beginning. It may be performed after the pattern is assigned, may be performed after the stopper position is determined, or may be performed at other processing positions. Further, the optimization process itself may not be performed. Even if it does in this way, the significance of this invention is not lost, and all the above-mentioned modifications are included in this invention.

  Further, the stopper position determination process (S14 in FIG. 14, FIG. 17) is not necessarily performed. However, by performing this process, there is an effect that the line balance can be easily maintained as described above.

  Further, the pattern assignment processing to the component mounters (S12 in FIG. 14, FIG. 15, and FIG. 16) is not necessarily performed so that the Z position (X coordinate) is as equal as possible. Needless to say, any other allocation method may be used as long as the tact time can be made constant.

  Alternatively, the position of the stopper may be the same in all the component mounting machines, and the position of the component cassette set in the component supply unit may be changed instead. FIG. 19 is a diagram illustrating an installation position of the component cassette 114 used in the component mounter 100b and the component mounter 100d. As shown in FIGS. 19A and 19B, the positions of the stoppers 22 of the component mounter 100b and the component mounter 100d are the same. However, the position of the component cassette 114 used at the time of component mounting is arranged near the pattern that each component mounter takes charge of. For this reason, the movement distance and mounting time of the multi mounting head 112 during component mounting are substantially constant for each component mounting machine, and the line balance is constant.

  Further, the number of component mounters is not limited to four, and may be more or less than this.

  The present invention can be applied to an apparatus for optimizing a component mounting order in a component mounting machine, and particularly applicable to a case where a plurality of patterns are included on one substrate.

1 is an external view showing a configuration of an entire component mounting system according to the present invention. It is a top view which shows the main structures of the component mounting machine in the component mounting system. It is a schematic diagram which shows the positional relationship of the working head and component cassette of the component mounting machine. (A) shows a configuration example of a total of four component supply units included in each of the two mounting units provided in the component mounting machine, and (b) shows the number of various component cassettes mounted in the configuration and the position on the Z axis. It is a table | surface which shows. It is a figure and table | surface which show the example of the position (Z-axis) of the component supply part which 10 nozzle head can adsorb | suck. It is a figure which shows the example of the various chip-type electronic components used as mounting object. It is a figure which shows the example of the carrier tape which accommodated components, and its supply reel. It is a figure which shows the example of the components cassette with which the taping electronic component was mounted | worn. It is a block diagram which shows the hardware constitutions of an optimization apparatus. It is a figure which shows the example of the content of the mounting point data shown by FIG. It is a figure which shows the example of the content of the components library shown by FIG. It is a figure which shows the example of the content of the mounting apparatus information shown by FIG. It is a figure for demonstrating how to allocate the pattern in the component mounting system which concerns on this Embodiment. It is a flowchart of the optimization process of the component mounting system by an optimization apparatus. It is a figure for demonstrating how to assign the pattern to each component mounting machine. It is a figure for demonstrating the allocation of the pattern when the number of patterns differs between component mounting machines. It is a figure which shows the position of the stopper for every component mounting machine. It is a figure for demonstrating the mark attached | subjected on the board | substrate. It is a figure which shows the position of the component cassette for every component mounting machine. It is a figure for demonstrating how to allocate the pattern in the conventional component mounting system. It is a top view which shows the main structures of the component mounting machine in a component mounting system. It is a flowchart of the optimization process of the component mounting system by an optimization apparatus. It is a top view which shows the main structures of the component mounting machine in a component mounting system. It is a figure which shows the mountable position of a board | substrate. It is a figure for demonstrating the shared allocation to all the component mounting machines of a predetermined number of patterns.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 12 Pattern 14a-14d, 100, 100a-100d Component mounting machine 16 Board mark 18 Pattern mark 19 Bad mark 20 Circuit board 22 Stopper 23 Rail 110 Front sub-equipment 112 Multi mounting head 112a-112b Adsorption nozzle 113 XY robot 114 Component cassette 115a, 115b Component supply unit 116 Component recognition camera 117 Tray supply unit 118 Shuttle conveyor 119 Nozzle station 120 Sub-equipment 300 Optimization device 301 Operation control unit 302 Display unit 303 Input unit 304 Memory unit 305 Optimization program storage unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 307b Component library 307c Mounting device information 308 Component array data storage unit 4 23d Taping electronic components 424, 441, 442 Carrier tape 424a Storage recess 425 Cover tape 426 Reel for supply 427 Body frame 428 Reel side plate 429 Feed roller 430 Feed lever 431 Link 432 Ratchet 433 Cover tape peeling part 434 Cover tape take-up reel 435 Electronic Parts take-out part 436 Tension spring 445 Seam 450 Switch 452 Seam detection sensor

Claims (6)

In a component mounting system including a plurality of component mounters for mounting components on a board, a component mounting order optimization method for optimizing the mounting order of components,
The substrate includes a plurality of patterns having the same component arrangement configuration,
Optimizing the component mounting order, including an allocation step for assigning the components included in the pattern to each component mounter so that each component mounter mounts all the components in the pattern. Method. Further, the component mounting order in the pattern assigned to any one of the plurality of patterns is optimized, and the result of the optimization is assigned to all other component mounting machines. The component mounting order optimizing method according to claim 1, further comprising a step of using the mounting order of the components in the device. The assigning step includes
From the total number of patterns included in the substrate and the number of the component mounters, a pattern number determination step for determining the number of patterns assigned to each component mounter so as to be substantially equal;
The component allocation order optimization according to claim 1, further comprising: a pattern allocation step for allocating any of the plurality of component mounters as a component mounter for mounting a component for each pattern of the determined number of patterns. Method. A program for a component mounting system including a plurality of component mounters for mounting components on a board,
The substrate includes a plurality of patterns having the same component arrangement configuration,
A program for causing a computer to execute an assigning step for assigning a component included in the pattern to each component mounter for each pattern so that each component mounter mounts all the components in the pattern. A component mounter that mounts components on a board according to a mounting order optimized by a component mounting order optimization method that optimizes the mounting order of components in a component mounting system that includes a plurality of component mounters that mount components on the board. And
The substrate includes a plurality of patterns having the same component arrangement configuration,
A component mounting machine comprising: an assigning step for assigning a component included in the pattern to each component mounting machine for each pattern so that each component mounting machine mounts all the components in the pattern. In a component mounting system including a plurality of component mounters for mounting components on a board, a component mounting order optimization device that optimizes the mounting order of components,
The substrate includes a plurality of patterns having the same component arrangement configuration,
Means for assigning components included in the pattern to each component mounter so that each component mounter mounts all the components in the pattern. Device.

Images