JP2008277770A - Component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting method enabling mounting a component with high mounting precision even on a substrate having a large size in the conveyance direction of a component mounter. <P>SOLUTION: The mounting method includes a first correction amount calculation step (S4) for calculating the correction amount of component mounting position by recognizing the position of a substrate mark provided in a first mounting region; a first mounting step (S6) for mounting the component in the first mounting region while correcting the mounting position of the component based on a correction amount calculated at the first correction amount calculation step; a second correction amount calculation step (S10) for calculating the correction amount of the component mounting position by recognizing the position of a substrate mark provided in a second mounting region; and a second mounting step (S12) for mounting the component in the second mounting region while correcting the mounting position of the component based on a correction amount calculated at the second correction amount calculation step. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting method by a component mounter that mounts a component on a substrate, and more particularly, to a component mounting method by a component mounter that mounts a component on a substrate that is long in the transport direction.

  In recent years, circuit boards have been highly integrated and miniaturized, and tend to be produced in a variety of small quantities. For this reason, in order to mount components on a small board and perform product type switching at high speed, there is an increasing need for a component mounting machine in which a component mounting stage has a compact design and many component mounting stages are connected. By performing component mounting using such a component mounter, the number of component mounting points per unit area can be improved (area productivity can be improved).

In component mounting by a component mounting machine in which multiple component mounting stages are connected, the component mounting range of one mounting head is limited. For this reason, it is impossible to mount all components on a substrate having a large size in the transport direction by one transport and positioning. Therefore, in a conventional component mounter, component mounting is performed on a substrate having such a large size by moving the substrate in multiple stages in the transport direction (see, for example, Patent Document 1).
JP 2006-287150 A

  However, the conventional component mounting machine cannot correct the mounting position of the component by imaging the board mark provided at the diagonal end of the board for a board having a large size in the transport direction. For this reason, there exists a subject that the mounting precision of components falls.

  The present invention has been made to solve the above-described problems, and provides a component mounting method capable of mounting a component with high mounting accuracy even on a substrate having a large size in the conveyance direction of the component mounting machine. For the purpose.

  In order to achieve the above object, a component mounting method according to an aspect of the present invention is a component mounting method by a component mounter that mounts a component on a substrate, and the substrate includes a mounting head of the component mounter. A first mounting area and a second mounting area that are different from each other corresponding to the component mounting range are defined, and a pair of spaced board marks positioned near both ends of the first mounting area are defined in the first mounting area. The second mounting area is provided with a pair of spaced substrate marks located near both ends of the second mounting area, and the positions of the board marks provided in the first mounting area A first correction amount calculating step of calculating a correction amount of a component mounting position from the shift amount, calculating a shift amount between the recognized position and a predetermined board mark position, and the first correction Quantity calculation step A first mounting step of mounting the component in the first mounting area while correcting the mounting position of the component based on the correction amount calculated in step S, and after mounting the component in the first mounting area, Recognizes the position of the board mark provided in the second mounting area, calculates a deviation amount between the recognized position and a predetermined board mark position, and calculates a correction amount of the component mounting position from the deviation amount A second mounting amount for mounting the component in the second mounting area while correcting the mounting position of the component based on the second correction amount calculating step and the correction amount calculated in the second correction amount calculating step. Steps.

  Substrate marks are provided in both the first mounting region and the second mounting region, the substrate mark is recognized prior to component mounting in the first mounting region, and the substrate is mounted prior to component mounting in the second mounting region. The mark is being recognized. Therefore, it is possible to correct the component mounting position both when mounting the component in the first mounting area and when mounting the component in the second mounting area, and it is possible to mount the component with high positional accuracy. Become. Therefore, in the case of a board having a large size in the transport direction, if the first mounting area and the second mounting area are set along the transport direction, components can be mounted with high mounting accuracy.

  Preferably, the first correction amount calculating step and the first mounting step are executed by a first component mounting machine, and the second correction amount calculating step and the second mounting step are performed by a second component mounting machine. Executed.

  When the board is long in the transport direction, the board protrudes from the component mounter in the transport direction when a component is mounted. For this reason, when components are mounted on the first mounting area and the second mounting area with one component mounting machine, the board protrudes from the left and right sides of the component mounting machine. Therefore, the component mounter must be arranged on the mounting line in consideration of the protrusion of the board, and the length of the mounting line becomes long. However, by performing component mounting while operating two component mounters in a coordinated manner, the board only protrudes to the right from one component mounter, and the board only extends to the left from the other component mounter. You can create a situation that does not protrude. For this reason, it is possible to arrange the component mounter on the mounting line while minimizing a useless area in the mounting line. Therefore, the length of the mounting line can be shortened.

  A mounting condition determining method according to another aspect of the present invention is a mounting condition determining method for determining a mounting condition at the time of component mounting by a component mounting machine that mounts a component on a board, and the board includes the component mounting machine. A first mounting region and a second mounting region which are different from each other corresponding to the component mounting possible range of the mounting head are defined, and the first mounting region has a pair of spaced apart located near both ends of the first mounting region. Board marks are provided, and the second mounting area is provided with a pair of spaced board marks located in the vicinity of both ends of the second mounting area. First, the position of the board mark provided in the region is recognized, a deviation amount between the recognized position and a predetermined board mark position is calculated, and a correction amount of the component mounting position is calculated from the deviation amount. Mounting conditions A first mounting condition determining step for determining, and correcting the mounting position of the component based on the correction amount calculated by executing the first mounting condition on the component mounter; A second mounting condition determining step for determining a second mounting condition to be mounted in one mounting area; and the board mark provided in the second mounting area on the component mounting machine after mounting the component in the first mounting area. The third mounting condition for determining the third mounting condition for calculating the correction amount of the component mounting position from the shift amount. The component is mounted in the second mounting region while correcting the mounting position of the component based on the correction amount calculated by executing the third mounting condition on the component mounting machine in the condition determining step. Causes and a fourth mounting condition determining step of determining a fourth mounting conditions.

  Preferably, the mounting condition determination method further includes: the component mounting machine includes the first mounting area and the mounting operation determining method, wherein a series of operations in one repetition of a series of operations of picking, moving, and mounting the component by the mounting head is used as a turn. When mounting a component in at least one mounting region of the second mounting region, the method includes a step of configuring all the turns with a turn in which the component is sucked by all the suction nozzles provided in the mounting head.

  The turn is configured so that the multi-mounting head always mounts the components in a state where the components are fully loaded in at least one of the first mounting region and the second mounting region. For this reason, it is possible to determine the mounting order of components so that the total value of the number of turns when mounting components in the first mounting area and the number of turns when mounting components in the second mounting area is minimized. it can.

  The present invention can be realized not only as a component mounting method including such characteristic steps, but also as a mounting condition determination method, or a characteristic step included in the mounting condition determination method in a computer. It can also be realized as a program to be executed. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  It is possible to provide a component mounting method capable of mounting a component with high mounting accuracy even on a substrate having a large size in the conveyance direction of the component mounting machine.

  Hereinafter, a production system according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view of a substrate production system according to an embodiment of the present invention. The production system 10 is a system for producing a component mounting board in which components are mounted on a board, and includes a mounting line 200 and a control device 300.

  The mounting line 200 is a system for transporting a board from an upstream production facility to a downstream production facility to produce a board on which components are mounted. The stocker 14 and 30, the solder printer 16, the conveyor 18, 26, an adhesive applicator 21, component mounters 22 and 24, and a reflow furnace 28.

  The stockers 14 and 30 are devices for stocking substrates, and the stocker 14 is located on the uppermost stream of the production line, and the stocker 30 is located on the most downstream side of the production line. That is, the stocker 14 is stocked with a board on which no components are mounted, and the stocker 30 is stocked with a finished product board with components mounted thereon.

  The solder printing device 16 is a device that prints solder on a substrate.

  The conveyors 18 and 26 are apparatuses for transporting the substrate.

  The adhesive applicator 21 is an apparatus that applies an adhesive for temporarily bonding an electronic component on a substrate 20 only to a necessary portion so that a relatively large electronic component is not displaced from the substrate 20 when the substrate is conveyed. It is. For example, the adhesive applicator 21 applies a viscous adhesive pushed out of the tank to the substrate and the substrate, and applies the adhesive onto the substrate so as to be linear or dotted. The adhesive applicator 21 is further provided with an application head for applying red ink having a substrate mark shape to be described later on the substrate 20.

  The component mounters 22 and 24 are devices for mounting components on a board.

  The reflow furnace 28 is an apparatus for fixing a component on the substrate after melting the solder or the like by heating the substrate on which the component is mounted.

  The control device 300 is a computer for controlling each production facility constituting the mounting line 200. The configuration of the control device 300 will be described later.

  FIG. 2 is an external view showing the configuration of the component mounter according to the embodiment of the present invention.

  The component mounter 22 is a device that mounts electronic components while sending a circuit board from upstream to downstream, and two sub-equipment (front sub) that performs component mounting while performing mutual operations in cooperation with each other. A facility 120a and a rear sub-equipment 120b) are provided. The configuration of the component mounter 24 is the same as that of the component mounter 22. Therefore, detailed description thereof will not be repeated.

  The front sub-equipment 120a includes a component supply unit 125a having an arrangement of component cassettes 123 that store component tapes, and a plurality of suction nozzles (hereinafter simply referred to as “suction nozzles”) that can suck electronic components from the component cassettes 123 and mount them on the substrate 20. Multi-mounting head 121 having a “nozzle”), beam 122 to which multi-mounting head 121 is attached, and suction state of components sucked by multi-mounting head 121 are two-dimensionally or three-dimensionally inspected. And a component recognition camera 126.

  The multi mounting head 121 is provided with a camera for recognizing the position of a substrate mark, which will be described later.

  The rear sub-equipment 120b has the same configuration as the front sub-equipment 120a. The rear sub-equipment 120b includes a tray supply unit 128 that supplies tray components, but the tray supply unit 128 and the like may not be provided depending on the sub-equipment.

  Here, the “component tape” is a plurality of components of the same component type arranged on a tape (carrier tape), and is supplied in a state of being wound around a reel (supply reel) or the like. It is mainly used to supply a relatively small size component called a chip component to a component mounter.

  Specifically, the component mounting machine 22 is a mounting apparatus having both functions of a component mounting machine called a high-speed mounting machine and a component mounting machine called a multi-function mounting machine. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 22 is designed to be able to mount almost all kinds of electronic components (from 0.4 mm × 0.2 mm chip resistance to 200 mm connector as components to be mounted) A mounting line can be configured by arranging a required number of the component mounting machines 22.

  FIG. 3 is a plan view showing a main configuration inside the component mounter 22.

  The component mounter 22 includes a front sub-equipment 120a and a rear sub-equipment 120b in the front-rear direction (Y-axis direction) of the component mounter 22 orthogonal to the conveyance direction (X-axis direction) of the substrate 20 therein.

  The front sub-equipment 120a and the rear sub-equipment 120b cooperate with each other to perform a component mounting operation on one board 20.

  The front sub-equipment 120a and the rear sub-equipment 120b each include a component supply unit 125a and a component supply unit 125b. Each of the front sub-equipment 120 a and the rear sub-equipment 120 b includes a beam 122 and a multi-mounting head 121. Further, the component mounter 22 is provided with a pair of rails 129 for transporting the substrate 20 between the front and rear sub-equipment.

  The rail 129 includes a fixed rail 129a and a movable rail 129b. Although the position of the fixed rail 129a is fixed in advance, the movable rail 129b has a Y-axis according to the length of the substrate 20 to be transported in the Y-axis direction. It is configured to be movable in the direction.

  Note that the component recognition camera 126, the tray supply unit 128, and the like are not the main points of the present invention, and are not shown in FIG.

  The beam 122 is a rigid body extending in the X-axis direction (the transport direction of the substrate 20), and is on a track (not shown) provided in the Y-axis direction (a direction perpendicular to the transport direction of the substrate 20). It is possible to move while keeping parallel with. Further, the beam 122 can move the multi-mounting head 121 attached to the beam 122 along the beam 122, that is, in the X-axis direction. The multi mounting head 121 can be moved freely in the XY plane by moving the multi mounting head 121 moving in the Y axis direction in the X axis direction. In addition, a plurality of motors such as a motor (not shown) for driving them are provided in the beam 122, and electric power is supplied to these motors and the like via the beam 122.

  The component mounting machine 22 further includes a first stopper 124 for fixing the substrate 20 conveyed from the conveyance direction. The board | substrate 20 is carried in from the right direction in a figure toward the direction of the arrow 402, and is carried out to the left direction. The first stopper 124 is provided at a position where the left side portion of the substrate 20 comes to the movable region of the multi-mounting head 121. Therefore, by fixing the substrate 20 at the position of the first stopper 124 when the substrate 20 is transported, the multi mounting head 121 can mount components on the left side portion of the substrate 20 (shaded portion of the substrate 20). . In the following description, the left portion of the substrate 20 (the hatched portion of the substrate 20) is referred to as “first mounting region”. The first mounting area corresponds to the component mountable range of the multi mounting head 121.

  FIG. 4 is another plan view showing the main configuration inside the component mounter 22.

  The component mounting machine 22 further includes a second stopper 127 for fixing the substrate 20 conveyed from the conveyance direction. The board | substrate 20 is carried in from the right direction in a figure toward the direction of the arrow 402, and is carried out to the left direction. The second stopper 127 is provided at a position where the right side portion of the substrate 20 comes to the movable region of the multi-mounting head 121. For this reason, by fixing the substrate 20 at the position of the second stopper 127 when the substrate 20 is transported, the multi mounting head 121 can mount components on the right side portion of the substrate 20 (shaded portion of the substrate 20). . In the following description, the right side portion of the substrate 20 (the hatched portion of the substrate 20) is referred to as “second mounting region”. The second mounting area corresponds to the component mountable range of the multi mounting head 121.

  In this way, by stopping the substrate 20 at the positions of the first stopper 124 and the second stopper 127, the substrate 20 can occupy the entire component mountable range of the mounting head in the transport direction (X-axis direction). The substrate 20 is positioned on the substrate. As a result, the distance between the pair of substrate marks can be maximized within the component mountable range of the mounting head. Therefore, the component mount position correction accuracy by the recognition of the board mark can be maximized in the component mounter 22.

  5 and 6 are diagrams for explaining component mounting by the component mounter 22. FIG. The same applies to component mounting by the component mounting machine 24. For this reason, description is not repeated.

  As shown in FIG. 5, the multi mounting head 121 of the rear sub-equipment 120 b performs “suction” of the component from the component supply unit 125 b, “recognition” of the sucked component by the component recognition camera 126, and the substrate of the recognized component. The components are mounted on the substrate 20 by alternately repeating the three operations “mounting” on the substrate 20.

  Similarly, the multi-mounting head 121 of the front sub-equipment 120a similarly mounts components on the substrate 20 by alternately repeating three operations of “suction”, “recognition”, and “mounting”.

  When the two multi-mounting heads 121 simultaneously “mount” components, in order to prevent the multi-mounting heads 121 from colliding with each other, the two multi-mounting heads 121 mount the components on the substrate 20 while performing a cooperative operation. To go. Specifically, as shown in FIG. 6A, when the multi mounting head 121 of the rear sub-equipment 120b performs the “mounting” operation, the multi mounting head 121 of the front sub-equipment 120a ”And“ recognition ”operations. Conversely, as shown in FIG. 6B, when the multi mounting head 121 of the front sub-equipment 120a is performing the “mounting” operation, the multi mounting head 121 of the rear sub-equipment 120b performs the “adsorption” operation. And perform a “recognition” operation. As described above, the “mounting” operation is alternately performed by the two multi mounting heads 121, thereby preventing the multi mounting heads 121 from colliding with each other. Ideally, if the “adsorption” operation and the “recognition” operation by the other multi mounting head 121 are completed while the “mounting” operation by one multi mounting head 121 is being performed, When the “mounting” operation by the multi mounting head 121 is completed, it is possible to move to the “mounting” operation by the other multi mounting head 121 without delay, and the production efficiency can be improved.

  Hereinafter, the substrate that is long in the transport direction will be described using the specific examples shown in FIGS. 7 to 18. However, in the case of the substrate that is long in the transport direction, a predetermined distance is provided in each of the first mounting region and the second mounting region. A feature is that a pair of spaced apart substrate marks are provided.

  FIG. 7 is a diagram illustrating an example of a substrate having a large size in the transport direction.

  The substrate 20 has a pair of substrate marks for calculating a correction amount such as a displacement amount of the first mounting region (shaded portion in FIG. 8) of the substrate 20 when the substrate 20 is fixed by the first stopper 124. 20a and 20b are provided. The board marks 20a and 20b are provided at both ends on the diagonal line of the first mounting region.

  In addition, when the substrate 20 is fixed by the second stopper 127, the substrate 20 has a pair of amounts for calculating a correction amount such as a displacement amount of the second mounting region (shaded portion in FIG. 9) of the substrate 20. Substrate marks 20c and 20d are provided. The board marks 20c and 20d are provided at both ends (near both ends) on the diagonal line of the second mounting region.

  FIG. 10 is a diagram illustrating another example of the substrate having a large size in the transport direction.

  The substrate 20 includes a pair of substrate marks for calculating a correction amount such as a positional deviation amount of the first mounting region (shaded portion in FIG. 11) of the substrate 20 when the substrate 20 is fixed by the first stopper 124. 20e and 20f are provided.

  In addition, when the substrate 20 is fixed to the second stopper 127, the substrate 20 has a pair of amounts for calculating a correction amount such as a displacement amount of the second mounting region (shaded portion in FIG. 12) of the substrate 20. Substrate marks 20f and 20g are provided. In the substrate 20, the substrate mark 20f is shared by the first mounting region and the second mounting region. For this reason, the distance between the substrate marks is slightly shorter than the case where the substrate marks are provided at both ends on the diagonal line in each of the first mounting region and the second mounting region shown in FIGS. However, the number of substrate marks on the substrate 20 can be reduced.

  FIG. 13 is a diagram illustrating another example of a substrate having a large size in the transport direction.

  The substrate 20 has a pair of substrate marks for calculating a correction amount such as a displacement amount of the first mounting region (shaded portion in FIG. 14) of the substrate 20 when the substrate 20 is fixed by the first stopper 124. 20h and 20i are provided.

  In addition, when the substrate 20 is fixed to the second stopper 127, the substrate 20 has a pair of amounts for calculating a correction amount such as a positional deviation amount of the second mounting region (shaded portion in FIG. 15) of the substrate 20. Substrate marks 20j and 20k are provided. As shown in the substrate 20, the pair of substrate marks 20h and 20i are not provided on the diagonal line of the first mounting region. Similarly, the pair of substrate marks 20j and 20k is not provided on the diagonal line of the second mounting region. Note that it is preferable to calculate a correction amount such as misalignment using a pair of substrate marks provided on a diagonal line. However, even if a pair of substrate marks not provided on a diagonal line is used, It is possible to calculate the correction amount.

  FIG. 16 is a diagram illustrating another example of a substrate having a large size in the transport direction.

  The substrate 20 is provided with a region 25 for mounting components. The substrate 20 is provided with individual marks 25a and 25b for recognizing the position of the region 25 when a component is mounted on the region 25. In addition, substrate marks 20l and 20m are provided at the lower left corner and the upper right corner of the substrate 20, respectively.

  When the substrate 20 is fixed by the first stopper 124, the substrate mark 20l and the individual mark 25a are calculated in order to calculate a correction amount such as a displacement amount of the first mounting region (shaded portion in FIG. 17) of the substrate 20. And are used. In addition, when the substrate 20 is fixed by the second stopper 127, in order to calculate a correction amount such as a positional deviation amount of the second mounting region (shaded portion in FIG. 18) of the substrate 20, the substrate mark 20m is individually provided. The mark 25b is used. Thus, by positioning each mounting area using the individual marks, it is possible to position each mounting area without increasing the number of board marks on the substrate 20. Instead of using the substrate mark 20l and the individual mark 25a in calculating the correction amount of the first mounting area, the substrate mark 20l and the individual mark 25b may be used. Similarly, instead of using the substrate mark 20m and the individual mark 25b in calculating the correction amount of the second mounting area, the substrate mark 20m and the individual mark 25a may be used. Of the plurality of individual marks, it is desirable to substitute, as a substrate mark, an individual mark that maximizes the distance between the pair of substrate marks when the individual mark is substituted as a substrate mark. Thereby, the correction accuracy of the component mounting position by the recognition of the board mark and the individual mark can be improved. Also, instead of individual marks, lands that are solder areas of electronic components may be used, or wiring patterns and through holes, etc., as long as they can be used as substrate marks that can be recognized by taking a picture with a camera. Anything can be used. Of these, selection criteria for substituting as a substrate mark are the same as in the case of individual marks. Further, substitutes for substrate marks, such as individual marks, lands, wiring patterns, and through holes, are examples of substrate marks shown in the claims.

  FIG. 19 is an external view of a coating head that coats red ink on a substrate provided in the adhesive coating machine 21.

  The coating head includes a tank 21 b for storing red ink and a discharge unit 21 a that discharges ink onto the substrate 20.

  FIG. 20 is a diagram for explaining application of red ink.

  The red ink 21c stored in the tank 21b is injected into the discharge part 21a by the air 21d and pushed out from the tip of the discharge part 21a. The extruded ink is applied onto the substrate 20.

  FIG. 21 is a block diagram illustrating a functional configuration of the control device 300.

  The control device 300 is a computer that determines component mounting conditions by the component mounting machines 22 and 24 and determines the application position of the board mark by the adhesive applicator 21, and includes an arithmetic control unit 301, a display unit 302, An input unit 303, a memory unit 304, a program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and the like are included.

  The control device 300 is realized by a general-purpose computer system such as a personal computer executing the program according to the present invention, and is not connected to the adhesive applicator 21, the component mounters 22 and 24, and the like. It also functions as a stand-alone simulator (component mounting condition determination tool). The function of the control device 300 may be provided in the adhesive applicator 21, the component mounters 22 and 24, and the like. Moreover, the control apparatus 300 corresponds to the mounting condition determination apparatus shown in the claims of the present invention.

  The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, loads and executes a necessary program from the program storage unit 305 to the memory unit 304 in accordance with an instruction from an operator, and the like. The display unit 302, the input unit 303, the memory unit 304, the program storage unit 305, the communication I / F unit 306, and the database unit 307 are controlled.

  The display unit 302 is a CRT (Cathode-Ray Tube), LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like. Used to interact with the operator.

  The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication between the control device 300 and the adhesive applicator 21, the component mounters 22 and 24, and the like. The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301.

  The database unit 307 includes input data (mounting point data 307a, component library 307b, mounting device information 307c, component mountable range information 307d, etc.) used for component mounting condition determination processing, board mark application position determination processing, and the like by the control device 300. ) Is stored.

  22 to 25 are diagrams illustrating examples of the mounting point data 307a, the component library 307b, the mounting device information 307c, and the component mountable range information 307d, respectively.

  The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 22, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, a mounting angle θi, and control data φi. Here, “component type” corresponds to a component name in the component library 307b shown in FIG. 23, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). Yes, “mounting angle” is the rotation angle of the component at the time of component mounting, and “control data” is constraint information regarding mounting of the component (type of suction nozzle that can be used, maximum moving speed of the multi mounting head 121, etc. ). NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  The component library 307b is a library that collects unique information about all the component types that can be handled by the component mounters 22 and 24. As shown in FIG. 23, the component size and tact for each component type are collected. (Tact peculiar to the component type under a certain condition) and other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 126, a maximum speed level of the multi mounting head 121, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference.

  The mounting apparatus information 307c is information indicating the apparatus configuration for each of the sub-equipment constituting the production line, the above-described restrictions, and the like, and as shown in FIG. 24, the type of the multi mounting head 121, that is, the multi mounting head 121. The head information related to the number of suction nozzles, etc., the nozzle information related to the types of suction nozzles that can be mounted on the multi mounting head 121, the cassette information related to the maximum number of component cassettes 123, etc. It consists of tray information related to the number of trays and the like.

  As shown in FIG. 25, the component mountable range information 307d is obtained when the board 20 is fixed at the position of the first stopper 124 and the position of the second stopper 127. This is information indicating a component mounting possible range. Note that the X and Y coordinates of the component mountable range are coordinates when the upper left corner of the board 20 is the origin, as shown in FIG. When the board A is fixed at the position of the first stopper 124, the X component mounting range is 0 mm or more and 330 mm or less, and when the substrate A is fixed at the position of the second stopper 127, X component mounting is possible. The range is 230 mm or more and 560 mm or less. In addition, the component mountable range in the Y direction is 0 mm or more and 300 mm or less.

  The program storage unit 305 illustrated in FIG. 21 is a hard disk or the like that stores various programs that implement the functions of the control device 300. The program is a program for determining component mounting conditions by the component mounters 22 and 24 and a board mark application position by the adhesive applicator 21, and is functionally a process that functions when executed by the arithmetic control unit 301. As a component mounting condition determination unit 305a, a board mark position determination unit 305b, and the like.

  The component mounting condition determination unit 305 a determines the component mounting conditions for the component mounters 22 and 24.

  The board mark position determination unit 305b determines the board mark application position by the adhesive applicator 21 and the board mark position recognized by the component mounters 22 and 24.

  The component mounting condition determined by the component mounting condition determining unit 305a is mounting data (instruction data) for causing the component mounting machines 22 and 24 to perform an operation as shown in FIG. In other words, the component mounting condition means that the substrate transport positioning is performed twice so that components can be mounted in the first mounting region and the second mounting region, and the substrate mark recognition and component mounting position are performed for each mounting region. This is mounting data (instruction data) for causing the component mounters 22 and 24 to perform correction and component mounting operations.

  More specifically, the board mark position determination unit 305b determines the mounting data described above from the mounting point data 307a, the component library 307b, the mounting device information 307c, and the component mountable range information 307d stored in the database unit 307. The board mark position data and the mounting order data determined by the component mounting condition determination unit 305a are given. The component mounters 22 and 24 recognize the board mark by moving the camera to the position indicated by the board mark position data in the mounting data, and the X coordinate xi, Y coordinate yi and mounting angle in the mounting point data 307a. Correction of θi is performed. Further, the component mounters 22 and 24 mount components on the coordinate position of the mounting point data 307a in the order specified by the mounting order data.

  Hereinafter, a component mounting method when the component mounters 22 and 24 are operated according to the component mounting conditions determined by the component mounting condition determination unit 305a will be described. That is, the component mounting condition determination unit 305a determines the component mounting conditions so that the component mounters 22 and 24 operate as follows.

  FIG. 27 is a flowchart of the component mounting process performed by the component mounter 22 in accordance with the component mounting conditions determined by the component mounting condition determining unit 305a of the control device 300. The component mounter 24 performs the same operation.

  The component mounting machine 22 raises the first stopper 124 and conveys the substrate 20 to the first stopper 124 (S2). As a result, the substrate 20 is fixed at the position of the first stopper 124 as shown in FIG. 3, and the multi-mounting head 121 can move on the first mounting area.

  The camera provided in the multi mounting head 121 of either the front sub-equipment 120a or the rear sub-equipment 120b images the pair of board marks 20a and 20b provided in the first mounting area and recognizes the image. Since the positions of the substrate marks 20a and 20b are obtained by image recognition, correction amounts such as the amount of displacement of the substrate 20 in the planar direction, the amount of rotational displacement of the substrate 20 and the amount of expansion and contraction of the substrate 20 are obtained from these positions ( S4). The obtained correction amount is used to correct the component mounting position by the multi mounting head 121 of the front sub-equipment 120a and the rear sub-equipment 120b. Since the board mark exists at the lower left corner and the upper right corner of the movable area, the position of the board mark is set based on the component mountable range information 307d, and the camera is moved to the position. The setting of the position of the substrate mark and the movement of the camera may be any of the following (a) and (b).

  (A) The position of the board mark is set in advance based on the component mountable range information 307d, and the set position (coordinates) of the board mark is described in the mounting data. The camera moves to the position of the board mark indicated by the mounting data.

  (B) The mounting data describes the coordinates of multiple board marks (board marks, individual marks, through-holes, etc.), and it is possible to mount the component to which board mark position of the board mark to move. This is determined based on the range information 307d. Which substrate mark position the camera is moved to determines the substrate mark that maximizes the distance between the pair of substrate marks. The camera moves to the position of the determined substrate mark.

  The front sub-equipment 120a and the rear sub-equipment 120b mount components in the first mounting area while performing a cooperative operation (S6). The cooperative operation is as described with reference to FIGS. A method of determining the mounting order of components in the first mounting area will be described later.

  Next, the component mounting machine 22 lowers the first stopper 124, raises the second stopper 127, and conveys the board 20 to the position of the second stopper 127 (S8). As a result, the substrate 20 is fixed at the position of the second stopper 127 as shown in FIG. 4, and the multi-mounting head 121 can move on the second mounting area.

  The camera provided in the multi mounting head 121 of either the front sub-equipment 120a or the rear sub-equipment 120b captures a pair of board marks 20c and 20d provided in the second mounting area and recognizes the image. Thus, correction amounts such as the amount of displacement of the substrate 20 in the planar direction, the amount of rotational displacement of the substrate 20 and the amount of expansion / contraction of the substrate 20 are obtained (S10). The obtained correction amount is used to correct the component mounting position by the multi mounting head 121 of the front sub-equipment 120a and the rear sub-equipment 120b. Since the board mark exists at the lower left corner and the upper right corner of the movable area, the position of the board mark is set based on the component mountable range information 307d, and the camera is moved to the position.

  The front sub-equipment 120a and the rear sub-equipment 120b mount components in the second mounting area while performing a cooperative operation (S12). The cooperative operation is as described with reference to FIGS. A method of determining the mounting order of components in the second mounting area will be described later.

  Next, a method for determining the component mounting order in the first mounting area and the second mounting area will be described.

  FIG. 28 is a flowchart of the component mounting order determination process in the first mounting area and the second mounting area.

  For example, when the component mountable range of the board 20 when fixed at the respective positions of the first stopper 124 and the second stopper 127 is defined as component mountable range information 307d shown in FIG. As shown in FIG. 26, the region where the X coordinate of the component mountable range is 230 mm or more and 330 mm or less belongs to both the first mounting region and the second mounting region. That is, the first mounting area and the second mounting area overlap each other. For this reason, as for the components mounted on the overlapping region, the components may be mounted when mounting the components in the first mounting region (S6 in FIG. 27) or when mounting the components in the second mounting region. Components may be mounted on (S12 in FIG. 27).

  The component mounting condition determination unit 305a performs the component mounting order so that the total value of the number of turns when mounting components in the first mounting region and the number of turns when mounting components in the second mounting region is minimized. To decide. Here, the “turn” refers to a series of operations in one repetition of a series of operations such as suction, movement, and mounting of parts by the multi mounting head 121.

  The component mounting condition determination unit 305a determines the mounting order of components in the first mounting area so that the multi mounting head 121 always mounts components in a state where the components are fully loaded (S22).

  Next, the component mounting condition determining unit 305a determines the mounting order of components so that all remaining components are mounted in the second mounting region (S24).

  For example, as shown in FIG. 29, the number of components mounted on the first mounting area of the substrate 20 is 100, and the number of components mounted on the second mounting area is 100. Further, it is assumed that the number of parts to be mounted in the first mounting area that does not overlap with the second mounting area is 80, and in the second mounting area that does not overlap with the first mounting area. It is assumed that the number of parts to be mounted is 80. Furthermore, it is assumed that the number of components mounted in an area where the first mounting area and the second mounting area overlap is 20 pieces. Furthermore, the number of suction nozzles of the multi mounting heads 121 of both the front sub-equipment 120a and the rear sub-equipment 120b is assumed to be eight.

  In this case, in order to mount a component in the first mounting region in a state where the multi-mounting head 121 is full of components, it is necessary to suck a multiple of 8 components. Therefore, the component mounting condition determining unit 305a determines a value 12 obtained by dividing 100 by 8 as the number of turns in the first mounting region. As a result, 96 (= 8 × 12) components are mounted in the first mounting area. Note that 4 (= 100−96) components that are not mounted are mounted in the second mounting area. For this reason, it is assumed that the remaining four components always exist in an area where the first mounting area and the second mounting area overlap.

  The component mounting condition determination unit 305a determines the component mounting order of 96 components, and various methods have been proposed for determining the component mounting order. For this reason, the component mounting condition determination unit 305a determines the component mounting order according to various conventionally proposed methods.

  In addition, the component mounting condition determination unit 305a mounts the remaining four components that overlap the first mounting region and 80 components that do not overlap the first mounting region in the second mounting region. Determine the mounting order of components.

  In order to mount 84 (= 80 + 4) components, since the number of suction nozzles is 8, it is possible to mount components with a minimum of 11 turns. The component mounting condition determining unit 305a determines the component mounting order of 84 components, and various conventional methods have been proposed for determining the component mounting order. For this reason, the component mounting condition determination unit 305a determines the component mounting order according to various conventionally proposed methods.

  Thus, the number of turns in the first mounting area is 12 turns, and the number of turns in the second mounting area is 11 turns. In this way, in the first mounting area, the total value of both turns can be minimized by mounting the components in a state where the multi mounting head 121 is fully loaded with components. If the total value of both turns is minimized, the number of turns in the first mounting area may be 11 and the number of turns in the second mounting area may be 12.

  Note that a region where the first mounting region and the second mounting region overlap is determined based on the component mountable range information 307d. The area to which the component mounted on the board 20 belongs is determined based on the component mountable range information 307d and the mounting point data 307a.

  Next, a method for determining the application position of the substrate mark by the adhesive applicator 21 will be described.

  FIG. 30 is a flowchart of a process for determining the application position of the substrate mark by the adhesive applicator 21.

  The board mark position determining unit 305b acquires the component mountable range information 307d stored in the database unit 307 (S32).

  The board mark position determining unit 305b determines the first mounting area and the second mounting area based on the component mountable range information 307d (S34). For example, based on the component mountable range information 307d shown in FIG. 25, as shown in FIG. 26, the first mounting area is determined to be an area where the X coordinate on the substrate 20 is 0 mm or more and 330 mm or less. The second mounting area is determined to be an area where the X coordinate on the substrate 20 is 230 mm or more and 560 mm or less. Among these, the area where the X coordinate on the substrate 20 is 230 mm or more and 330 mm or less is an area belonging to both the first mounting area and the second mounting area.

  The board mark position determining unit 305b sets the corner on the diagonal line as the board mark application position for each of the first mounting area and the second mounting area (S36). For example, as shown in FIG. 8, from the lower left corner position (the position where the x coordinate is the smallest and the y coordinate is the smallest) and the upper right corner position (the position where the x coordinate is the largest and the y coordinate is the largest) of the first mounting area, A position inside by a predetermined distance is set as a substrate mark application position. Further, as shown in FIG. 9, from the lower left corner position (the position where the x coordinate is minimum and the y coordinate is minimum) and the upper right corner position (the position where the x coordinate is maximum and the y coordinate is maximum) of the second mounting area, A position inside by a predetermined distance is set as a substrate mark application position. The application position of the board mark is determined so as not to overlap with the mounting position of the component. Further, the ranges of the first mounting area and the second mounting area are acquired from the component mountable range information 307d.

  The adhesive applicator 21 applies red ink, that is, a substrate mark, to the determined application position on the substrate 20 before or after applying the adhesive. Information regarding the position of the applied board mark is transmitted to the component mounters 22 and 24. The component mounters 22 and 24 receive this information, and perform recognition processing of the applied board mark based on the received information. The substrate mark may be ink of other colors instead of red ink.

  As described above, according to the present embodiment, the substrate mark for aligning the substrate is provided for each of the first mounting region and the second mounting region. In this way, by providing a substrate mark for each mounting region, correction of misalignment of the substrate, etc., both when the substrate is fixed by the first stopper and when the substrate is fixed by the second stopper. The amount can be determined. For this reason, even if it is a board | substrate with a large size in the conveyance direction of a component mounting machine, it is possible to mount components on a board | substrate with high mounting accuracy.

  In addition, the component mounting conditions are determined so that the component is mounted in a state where the multi mounting head is fully loaded with components in the first mounting region. For this reason, it is possible to determine the mounting order of components so that the total value of the number of turns when mounting components in the first mounting area and the number of turns when mounting components in the second mounting area is minimized. it can.

  Further, a substrate mark is attached by applying ink to the adhesive applicator. For this reason, even if it is a case where the board | substrate which is not attached | subjected the board mark for every mounting area flows from an upstream process, a board | substrate mark can be attached | subjected to a board | substrate.

  Further, the adhesive applicator applies a board mark for obtaining a correction amount of a component mounting position in each mounting area to both the first mounting area and the second mounting area. For this reason, when component mounting is performed in each mounting region, the correction amount of the component mounting position can be obtained by recognizing the position of the board mark. Therefore, even if the board is large in the conveying direction of the component mounting machine, if the first mounting area and the second mounting area are set along the conveying direction, components can be mounted with high mounting accuracy. Can do.

  In addition, by arranging the board marks on the diagonal line, it is possible to accurately obtain the correction amount such as the deviation amount in the plane direction of the board, the rotation deviation amount of the board and the expansion / contraction amount of the board, that is, the correction amount of the component mounting position. it can. For this reason, components can be mounted with high mounting accuracy.

  The production system according to the embodiment of the present invention has been described above, but the present invention is not limited to this embodiment.

  For example, the control device, the adhesive applicator, and the component mounter may exist in different companies. That is, there may be a company that determines component mounting conditions and board mark application positions and provides services that provide the conditions and the positions. In this case, the component mountable range information of the multi mounting head registered in the database unit of the control device may be obtained from a mounting manufacturer that mounts the components on the substrate and produces the circuit board. Further, the component mountable range information of the multi mounting head registered in the database unit of the control device may be obtained from a manufacturer that manufactures the component mounting machine itself. At this time, the adhesive applicator may be provided by the substrate manufacturer, and the substrate manufacturer may manufacture the substrate by applying a substrate mark to the substrate using the adhesive applicator. In addition, when a board manufacturer prints a wiring pattern such as a land on a board, a pair of board marks may be printed in the mounting area. In this case, the substrate mark is printed by a process similar to the process of applying the substrate mark by the adhesive applicator shown in FIG. That is, the wiring pattern printing apparatus prints the substrate mark instead of applying the substrate mark. In this case, the board manufacturer obtains the component mounting range information of the multi mounting head from the manufacturer that manufactures the component mounting machine itself or the mounting manufacturer.

  Further, the component mounter is not limited to a component mounter that mounts components on a single board while operating two multi mounting heads in a coordinated manner. For example, it may be a component mounter that mounts components on a single board with one multi mounting head.

  In the above-described embodiment, one component mounting machine has mounted components on the two mounting areas, the first mounting area and the second mounting area. However, the two component mounting machines cooperate with each other. Component mounting may be performed on two mounting areas. That is, when the description is made using the production system 10 shown in FIG. 1, the component mounter 22 performs component mounting on the first mounting area, and the component mounter 24 mounts components on the second mounting area. You may make it perform. By performing component mounting while cooperatively operating two component mounters, it is only necessary to provide the second stopper in only one component mounter. Since the second stopper is provided at a position protruding beyond the lateral width of the component mounting machine, the length of the production line can be shortened by reducing the number of component mounting machines using the second stopper.

  Further, in the above-described embodiment, when mounting a component in the first mounting area, the component mounting conditions are determined so as to be fully loaded. However, when mounting the component in the second mounting area, the component is You may make it determine the mounting conditions of components so that it may be fully loaded.

  In the above embodiment, the board is stopped at the position of the first stopper or the second stopper provided in the component mounting machine. However, the board stop position is not limited to this. Hereinafter, other substrate stop positions will be described with reference to FIGS. 31 to 34. Here, the description will be given by taking the substrate 20 provided with the substrate marks 20e to 20g at three places as shown in FIG. 10 as an example, but the position and number of substrate marks are not limited to this. Instead, for example, a substrate in which substrate marks are provided at both ends of each of the first mounting region and the second mounting region as shown in FIG. 7 may be used.

  A first modified example of the stop position of the substrate will be described with reference to FIGS. 31 and 32. FIG. First, as shown in FIG. 31, the board 20 is transported in the direction of the arrow 402, the center position in the x-axis direction of the first mounting area (the hatched portion) of the board 20 and the x-axis of the component mounting machine 22. The substrate 20 is stopped at a position where the direction center line 404 coincides. At the stop position, the component is mounted in the first mounting region. After completion of component mounting in the first mounting area, as shown in FIG. 32, the substrate 20 is transported in the direction of the arrow 402, and the center of the second mounting area (shaded portion) of the substrate 20 in the x-axis direction. The board 20 is stopped at a position where the position coincides with the center line 404 in the x-axis direction of the component mounting machine 22. At the stop position, the component is mounted in the second mounting area. By stopping the substrate 20 at such a position and mounting the component, the sum of the distances from the center line 404 to the component mounting position can be shortened. Normally, the home position of the multi mounting head 121 is at the position of the center line 404. For this reason, the moving distance of the multi mounting head 121 can be shortened, and the mounting time can be shortened.

  A second modification of the stop position of the substrate will be described with reference to FIGS. 33 and 34. FIG. First, as shown in FIG. 33, the board 20 is transported in the direction of the arrow 402, and the left end of the first mounting area (hatched portion) of the board 20 is the left end of the component mountable range of the component mounting machine 22. The substrate 20 is stopped at the matching position. At the stop position, the component is mounted in the first mounting region. After completion of component mounting in the first mounting area, as shown in FIG. 34, the substrate 20 is transported in the direction of the arrow 402, and all the areas other than the first mounting area (the white area 406 in FIG. 33) When it is included in the component mountable range of the component mounter 22, the board 20 is stopped. That is, the board 20 is stopped at a position where the right end of the second mounting area (the hatched portion) of the board 20 coincides with the right end of the component mountable range of the component mounter 22. At the stop position, the component is mounted in the second mounting area. By stopping the board 20 at such a position and mounting the components, the board from the board stop position at the time of component mounting to the first mounting area to the board stop position at the time of component mounting to the second mounting area The conveyance distance of 20 can be minimized. That is, the conveyance time of the substrate 20 from the completion of component mounting in the first mounting region to the start of component mounting in the second mounting region can be minimized. On the other hand, simultaneously with the conveyance of the board 20 after the component mounting to the second mounting area, the board 20 on which the component is mounted next is carried into the component mounting machine 22, so that the second mounting area is loaded. The conveyance time of the substrate 20 after the completion of component mounting can be ignored. For this reason, in the situation where the substrate 20 continuously flows into the component mounter 22, as described above, after the component mounting in the first mounting area is completed, the component mounting is started in the second mounting area. By minimizing the transport time of the substrate 20 until the time required, the time required to transport the substrate 20 can be minimized.

  It should be noted that the first modification is effective when employed when the component mounting time is relatively long compared to the substrate 20 transport time, that is, when there are relatively many components to be mounted. Further, the second modification is effective when it is adopted when the component mounting time is relatively small compared to the conveyance time of the substrate 20, that is, when there are relatively few components to be mounted.

  In the above-described embodiment, the component mounting range is obtained from the movable range of the multi mounting head 121. However, the component mounting range is determined from the movable range for each type of suction nozzle provided in the multi mounting head 121. May be. When the type and position of the suction nozzle provided in the multi-mounting head 121 are fixed in advance, depending on the type of component, there may be a region where the component cannot be mounted even within the movable range of the multi-mounting head 121. . For example, as shown in FIG. 35, the types of suction nozzles provided in the multi mounting head 121 are S, S, M, and M from the left, and these suction nozzles are fixed to the multi mounting head 121. Therefore, it cannot be removed. In FIG. 36, the component mountable range 408 of the S type suction nozzle of the multi mounting head 121 and the component mountable range 410 of the M type suction nozzle are shown by broken-line rectangles, and the component mountable range 408 is shown. Is shifted by a predetermined distance to obtain a component mountable range 410. The predetermined distance is equal to the distance between the leftmost S-type suction nozzle and the third M-type suction nozzle from the left in the multi mounting head 121. The S type suction nozzle is located on the left side of the multi mounting head 121, and the M type suction nozzle is located on the right side of the multi mounting head 121. For this reason, in a state where the multi mounting head 121 is moved to the left end of the component mounting machine 22, the S type suction nozzle can mount a component on the left side of the board more, and the M type suction nozzle can mount the component. An area that cannot be created occurs. Similarly, in a state where the multi mounting head 121 is moved to the right side of the component mounting machine 22, the M type suction nozzle can mount the component on the right side of the substrate, and the S type suction nozzle can mount the component. An area that cannot be created occurs. Therefore, the component mountable range is determined for each suction nozzle type as described above. Therefore, for example, if a component is mounted on the substrate 20 using only the S type suction nozzle, the component mountable range of the multi mounting head 121 is set to the component mountable range 408 of the S type suction nozzle. Is done. Further, if the component is mounted on the substrate 20 using only the M type suction nozzle, the component mounting range of the multi mounting head 121 is set to the component mounting range 410 of the M type suction nozzle.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a component mounter that mounts components on a substrate, and in particular, can be applied to a component mounter that fixes a substrate at two stopper positions and mounts the component on a substrate that is long in the transport direction.

1 is an external view of a substrate production system according to an embodiment of the present invention. It is an external view which shows the structure of the component mounting machine which concerns on embodiment of this invention. It is a top view which shows the main structures inside a component mounting machine. It is another top view which shows the main structures inside a component mounting machine. It is a figure for demonstrating the component mounting by a component mounting machine. It is a figure for demonstrating the component mounting by a component mounting machine. It is a figure which shows an example of a board | substrate with a large size of a conveyance direction. It is a figure which shows the 1st mounting area | region of the board | substrate shown in FIG. It is a figure which shows the 2nd mounting area | region of the board | substrate shown in FIG. It is a figure which shows another example of the board | substrate with a large size of a conveyance direction. It is a figure which shows the 1st mounting area | region of the board | substrate shown in FIG. It is a figure which shows the 2nd mounting area | region of the board | substrate shown in FIG. It is a figure which shows another example of the board | substrate with a large size of a conveyance direction. It is a figure which shows the 1st mounting area | region of the board | substrate shown in FIG. It is a figure which shows the 2nd mounting area | region of the board | substrate shown in FIG. It is a figure which shows another example of the board | substrate with a large size of a conveyance direction. It is a figure which shows the 1st mounting area | region of the board | substrate shown in FIG. It is a figure which shows the 2nd mounting area | region of the board | substrate shown in FIG. It is an external view of the application | coating head which apply | coats red ink on the board | substrate provided in the adhesive agent coating machine. It is a figure for demonstrating application | coating of a red ink. It is a block diagram which shows the functional structure of a control apparatus. It is a figure which shows an example of mounting point data. It is a figure which shows an example of a component library. It is a figure which shows an example of mounting apparatus information. It is a figure which shows an example of component mounting | wearing range information. It is a figure which shows the components mounting | wearing possible range of a multi mounting head. It is a flowchart of the component mounting process which a component mounting machine performs according to the component mounting conditions which the component mounting condition determination part of the control apparatus determined. It is a flowchart of the determination process of the component mounting order in a 1st mounting area and a 2nd mounting area. It is a figure which shows the number of the components mounted in each mounting area | region of a board | substrate. It is a flowchart of the process which determines the application position of the board | substrate mark by an adhesive agent coating machine. It is a figure for demonstrating the 1st modification of the stop position of a board | substrate. It is a figure for demonstrating the 1st modification of the stop position of a board | substrate. It is a figure for demonstrating the 2nd modification of the stop position of a board | substrate. It is a figure for demonstrating the 2nd modification of the stop position of a board | substrate. It is a figure which shows an example of the type of the suction nozzle with which a multi mounting head is equipped. It is a figure which shows the components mounting | wearing possible range of the suction nozzle of S type and M type.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Production system 14, 30 Stocker 16 Solder printer 18, 26 Conveyor 20 Board | substrate 20a-20m Board | substrate mark 21 Adhesive application machine 22, 24 Component mounting machine 25 Area | region 25a, 25b Individual mark 28 Reflow furnace 120a Front sub-equipment 120b Rear sub Equipment 121 Multi-mounting head 122 Beam 123 Parts cassette 124 First stoppers 125a and 125b Parts supply part 126 Parts recognition camera 127 Second stopper 128 Tray supply part 129 Rail 129a Fixed rail 129b Movable rail 200 Mounting line 300 Controller 301 Calculation control part 302 Display unit 303 Input unit 304 Memory unit 305 Program storage unit 305a Component mounting condition determination unit 305b Board mark position determination unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 3 7b component library 307c mounting device information 307d component mounting range information

Claims (10)

A component mounting method by a component mounter for mounting components on a board,
The board has a first mounting area and a second mounting area different from each other corresponding to a component mounting range of the mounting head of the component mounting machine.
The first mounting area is provided with a pair of spaced substrate marks located near both ends of the first mounting area,
The second mounting area is provided with a pair of spaced substrate marks located near both ends of the second mounting area,
Recognizing the position of the board mark provided in the first mounting area, calculating a deviation amount between the recognized position and a predetermined board mark position, and calculating a correction amount of the component mounting position from the deviation amount A first correction amount calculating step for calculating;
A first mounting step of mounting the component in the first mounting area while correcting the mounting position of the component based on the correction amount calculated in the first correction amount calculating step;
After mounting the component in the first mounting area, the position of the board mark provided in the second mounting area is recognized, and a deviation amount between the recognized position and a predetermined position of the board mark is calculated, A second correction amount calculating step of calculating a correction amount of the component mounting position from the deviation amount;
A component mounting method comprising: a second mounting step of mounting the component in the second mounting region while correcting the mounting position of the component based on the correction amount calculated in the second correction amount calculating step. The component mounting method according to claim 1, further comprising a moving step of moving the board to a position where the component mounting machine can mount the component in the second mounting area after the first mounting step. The first correction amount calculating step includes:
Obtaining a component mountable range of the mounting head;
Determining the position of the board mark in the first mounting region based on the acquired component mounting possible range;
Moving the camera to the determined position of the substrate mark and recognizing the position of the substrate mark;
The component mounting method according to claim 1, further comprising: calculating a correction amount of the component mounting position from the recognition result. The first correction amount calculating step and the first mounting step are executed by a first component mounter,
The component mounting method according to claim 1, wherein the second correction amount calculating step and the second mounting step are executed by a second component mounting machine. A mounting condition determination method for determining mounting conditions at the time of component mounting by a component mounter for mounting components on a board,
The board has a first mounting area and a second mounting area different from each other corresponding to a component mounting range of the mounting head of the component mounting machine.
The first mounting area is provided with a pair of spaced substrate marks located near both ends of the first mounting area,
The second mounting area is provided with a pair of spaced substrate marks located near both ends of the second mounting area,
Let the component mounter recognize the position of the board mark provided in the first mounting area, calculate the amount of deviation between the recognized position and the position of the predetermined board mark, and use the amount of deviation as a component. A first mounting condition determining step for determining a first mounting condition for calculating a correction amount of the mounting position;
Second mounting condition for causing the component mounter to mount the component in the first mounting area while correcting the mounting position of the component based on the correction amount calculated by executing the first mounting condition. A second mounting condition determining step for determining
After mounting the component in the first mounting area, the component mounter recognizes the position of the board mark provided in the second mounting area, and the recognized position and the position of the predetermined board mark A third mounting condition determining step for determining a third mounting condition for calculating a shift amount and calculating a correction amount of a component mounting position from the shift amount;
Fourth mounting condition for causing the component mounting machine to mount the component in the second mounting area while correcting the mounting position of the component based on the correction amount calculated by executing the third mounting condition. A fourth mounting condition determining step for determining the mounting condition. The first mounting condition determining step includes:
Determining a mounting condition for causing the component mounter to acquire a component mountable range of the mounting head; and
Determining a mounting condition for causing the component mounting machine to set the position of the board mark in the first mounting region based on the acquired component mounting possible range;
Moving the camera to the set position of the board mark and determining mounting conditions for recognizing the position of the board mark;
The mounting condition determining method according to claim 5, further comprising: determining a mounting condition that causes the component mounter to calculate a correction amount of a component mounting position from a recognition result. A series of operations in a series of repetitions of adsorption, movement, and mounting of parts by the mounting head is a turn,
In the mounting condition determination method, when the component mounter mounts a component in at least one of the first mounting area and the second mounting area, all of the mounting conditions are provided in the mounting head. The mounting condition determination method according to claim 5, further comprising a step of forming all the turns with a turn that causes the suction nozzle to suck the component. A component mounter for mounting components on a board,
The board has a first mounting area and a second mounting area different from each other corresponding to a component mounting range of the mounting head of the component mounting machine.
The first mounting area is provided with a pair of spaced substrate marks located near both ends of the first mounting area,
The second mounting area is provided with a pair of spaced substrate marks located near both ends of the second mounting area,
Recognizing the position of the board mark provided in the first mounting area, calculating a deviation amount between the recognized position and a predetermined board mark position, and calculating a correction amount of the component mounting position from the deviation amount First correction amount calculating means for calculating;
Means for mounting the component on the first mounting area while correcting the mounting position of the component based on the correction amount calculated by the first correction amount calculation unit;
After mounting a component in the second mounting area, the position of the board mark provided in the second mounting area is recognized, and a deviation amount between the recognized position and a predetermined position of the board mark is calculated, Second correction amount calculating means for calculating a correction amount of the component mounting position from the deviation amount;
A component mounting machine comprising: means for mounting the component in the second mounting area while correcting the mounting position of the component based on the correction amount calculated by the second correction amount calculating unit. A mounting condition determination device that determines mounting conditions at the time of component mounting by a component mounter that mounts components on a board,
The board has a first mounting area and a second mounting area different from each other corresponding to a component mounting range of the mounting head of the component mounting machine.
The first mounting area is provided with a pair of spaced substrate marks located near both ends of the first mounting area,
The second mounting area is provided with a pair of spaced substrate marks located near both ends of the second mounting area,
Let the component mounter recognize the position of the board mark provided in the first mounting area, calculate the amount of deviation between the recognized position and the position of the predetermined board mark, and use the amount of deviation as a component. Means for determining a first mounting condition for calculating a correction amount of the mounting position;
Second mounting condition for causing the component mounter to mount the component in the first mounting area while correcting the mounting position of the component based on the correction amount calculated by executing the first mounting condition. Means for determining
Means for determining a third mounting condition for causing the component mounter to calculate the correction amount of the component mounting position by recognizing the position of the board mark provided in the second mounting region;
Fourth mounting condition for causing the component mounting machine to mount the component in the second mounting area while correcting the mounting position of the component based on the correction amount calculated by executing the third mounting condition. A mounting condition determining apparatus comprising: means for determining A program for determining mounting conditions at the time of component mounting by a component mounting machine for mounting components on a board,
The board has a first mounting area and a second mounting area different from each other corresponding to a component mounting range of the mounting head of the component mounting machine.
The first mounting area is provided with a pair of spaced substrate marks located near both ends of the first mounting area,
The second mounting area is provided with a pair of spaced substrate marks located near both ends of the second mounting area,
Let the component mounter recognize the position of the board mark provided in the first mounting area, calculate the amount of deviation between the recognized position and the position of the predetermined board mark, and use the amount of deviation as a component. A first mounting condition determining step for determining a first mounting condition for calculating a correction amount of the mounting position;
Second mounting condition for causing the component mounter to mount the component in the first mounting area while correcting the mounting position of the component based on the correction amount calculated by executing the first mounting condition. A second mounting condition determining step for determining
After mounting the component in the first mounting area, the component mounter recognizes the position of the board mark provided in the second mounting area, and the recognized position and the position of the predetermined board mark A third mounting condition determining step for determining a third mounting condition for calculating a shift amount and calculating a correction amount of a component mounting position from the shift amount;
Fourth mounting condition for causing the component mounting machine to mount the component in the second mounting area while correcting the mounting position of the component based on the correction amount calculated by executing the third mounting condition. A fourth implementation condition determining step for determining

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