JP2006287047A - Substrate recognizing method and component mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system for smoothly producing a circuit board while streamlining substrate recognizing processing of each apparatus included in a component mounting line. <P>SOLUTION: Each apparatus in the component mounting line is provided with a dispenser 1, an application inspecting device 2, first and second mounting devices 3, 4, a mounting inspecting device 5, and a curing device. In each apparatus, a tact time of each of the devices 1-6 is compared to specify a device controlling the speed of a line tact. If the specified device is a device using a local mark to be attached on a substrate, that means, the device for recognizing an image of the mark to create correction data, an operation of recognizing one part or entire of the mark to be image-recognized in this device is allocated to one or a plurality of devices in a process in an upstream of this device and executed, and the allocation is performed in a range where the tact time of each device does not delay compared to the tact time of the curing device 6. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting system including a plurality of devices such as a solder printing device, a dispenser, a mounting device, a reflow furnace, and various inspection devices in series, and more particularly to a method and device for rationally recognizing a board. It is.

  2. Description of the Related Art Conventionally, a plurality of mounting machines (referred to as unit mounting machines) are arranged as mounting devices, and component mounting is performed in a distributed manner on a circuit board.

  In this type of mounting device, each device performs mounting processing in a state where the circuit board is positioned at a predetermined position by the positioning means. At this time, the positional deviation of the circuit board with respect to the main body of the apparatus and the printed wiring pattern on the circuit board Due to the displacement of the relative position, the mounting point (worked part) on the circuit board may be slightly deviated from the normal position. Therefore, a recognition mark (local fiducial mark) of each part such as a mounting point is attached on the circuit board in advance, and the position of the board is determined by examining the position and inclination of the entire circuit board prior to component mounting. In addition to recognizing and detecting the position of each mark by imaging the mark with a mobile camera and examining the positional deviation of the mounting point or the like based on these results, a correction amount (correction data) corresponding to that is obtained. It is made from.

  However, in the conventional mounting apparatus, in order to ensure mounting accuracy in all the unit mounting machines, the above-described mark imaging and the correction amount calculation are performed for each unit mounting machine. A lot of time was spent on this work, which was a great detriment to shortening the tact time.

Therefore, the applicant of the present application has proposed a substrate recognition method (apparatus) as disclosed in Patent Document 1 regarding the above-described mounting apparatus composed of a plurality of unit mounting machines. In this method, the first unit mounting machine among the unit mounting machines constituting the mounting apparatus recognizes the mark on the circuit board, and also recognizes the position of the board by examining the position and inclination of the entire board, and recognizes these. From the result, the correction data corresponding to the positional deviation of the mounting point (point where the component is mounted) handled by the first unit mounting machine is created, and the relative value between the mark and the mounting point (processed part) on the circuit board Create adjustment data according to the positional relationship. The subsequent unit mounter only recognizes the posture of the board, and based on the recognition result and the above adjustment data, creates correction data corresponding to the positional deviation of the mounting point that the unit mounter in the lower process is responsible for I tried to do it. In other words, by using the adjustment data obtained by the first unit mounting machine to create correction data for mounting points on the subsequent unit mounting machine, it is possible to omit mark recognition on the subsequent unit mounting machine, and as a result As a whole, the time required for substrate recognition work can be shortened for the entire mounting apparatus.
JP 2002-9494 A

  By the way, in order to efficiently perform component mounting processing in a mounting apparatus composed of a plurality of unit mounting machines, it is necessary to reduce the processing load of the unit mounting machine and shorten the tact time. It is also important to equalize the processing load of the mounting machine. That is, if the processing load is biased and the processing time of any device (process) becomes extremely long, the tact time of the entire mounting device depends on the processing time of the mounting device (the required mounting device is the As a result, the smooth mounting process is hindered. In this regard, according to the method (apparatus) of Patent Document 1, it is possible to reduce the time required for the substrate recognition work as the entire mounting apparatus, but the processing load on the first unit mounting machine tends to increase. It is necessary to improve this point for smooth implementation.

  Such a situation is not limited to the mounting apparatus as described above. For example, apparatuses with different processing contents such as a printing apparatus, a dispenser, and a mounting apparatus are arranged in a line and an inspection apparatus is provided downstream of each processing apparatus. The same applies to the arranged component mounting lines. In other words, since this type of component mounting line also often performs the above-described mark imaging and correction data calculation based on each of these devices, the tact time can be shortened by rationally doing this. It is desirable to do.

  The present invention has been made in view of the above circumstances, and in a component mounting system configured to perform predetermined work on a circuit board in each apparatus while sequentially transferring the circuit board to a plurality of apparatuses, The purpose is to make it possible to produce more smoothly.

  In order to solve the above-mentioned problems, the present invention comprises a plurality of system component devices, and as the system component devices, a predetermined operation is performed on the substrate while the substrate conveyed by the conveying means is stopped at a predetermined position. Prior to this work, the board recognition of the component mounting system including a plurality of specific devices that recognizes the image of the mark on the board and obtains the correction data according to the deviation of the work part based on the result. A method for identifying the system component device having the slowest tact time by comparing in advance the tact time of each system component device when performing the image recognition work of the mark in the identifying device that uses the mark, When this system component device is the specific device, image recognition of part or all of the mark to be recognized by the specific device And assigning the work to one or more specific devices above the specific device, and the allocation is performed in such a range that the tact time of each specific device does not become slower than the tact time of the system component device other than the specific device. (Claim 1).

  According to this method, when there is a specific device whose tact time is extremely slow, the image recognition work of the mark used in the specific device is performed by being assigned to another specific device in the upper process. Correction data is created in the specific device based on the image recognition result of the marked mark. At this time, the above-described assignment is performed in such a range that the tact time of each specific device is not delayed compared to the system component devices other than the specific device, so that the tact time of each system component device can be shortened and made uniform.

  In the above method, more specifically, when the specific device that is the system configuration device with the slowest tact time is the first specific device, a part or all of the marks to be recognized by the first specific device The image recognition work is assigned to the second specific device in the upper process than the specific device to compare the tact times of the respective system component devices, and the system component device having the slowest tact time is specified. In the case of the two specifying device, the image recognition work for a part or all of the mark assigned to the second specifying device is further performed at a device higher than the first specifying device and below the second specifying device. By assigning the specific device to the process specific device and making the specific device a new second specific device and then comparing and assigning the tact time in the same manner, the first specific device is assigned. A part or all of the image recognition tasks marks to be recognized Te may be assigned to a particular device above process than the first specific apparatus (claim 2).

  According to this method, it is possible to efficiently assign the mark image recognition work, and the work burden of the assignment work is reduced.

  In this case, it is preferable that the allocation is performed by using the uppermost specific device among the specific devices included in the component mounting system as the first second specific device.

  In this way, since all the specific devices arranged in the upper process than the first specific device are to be allocated, the degree of freedom of the allocation is increased.

  On the other hand, the component mounting system according to the present invention includes a plurality of system component devices, and the system component device performs a predetermined operation on the substrate while the substrate conveyed by the conveying means is stopped at a predetermined position. Prior to this work, a component mounting system including a plurality of specific devices that recognize images of a mark on a substrate and obtain correction data according to a deviation of a work part based on the result. A specifying means for comparing a tact time of each system component apparatus when the image recognition operation of the mark is performed in a specific apparatus using the mark, and specifying a system component apparatus having the slowest tact time; and the specifying means When the system component device specified by the above is the specific device, a part of the mark used in the specific device or Assignment data creation means for creating assignment data for assigning and executing all image recognition work to one or more specific devices in a process higher than the specific device, wherein the data creation means The tact time of the mark is determined so that the tact time does not become slower than the tact time of the system component device other than the specific device, and each specific device recognizes the image of the mark based on the assignment data created by the assigned data creation means. It is configured to perform work (claim 4).

  According to this component mounting system, the method according to claims 1 to 3 is effectively executed.

  According to the substrate recognition method according to claims 1 to 3 and the component mounting system according to claim 4, the tact time of each specific device can be preferably shortened, and the tact time of each system component device is uniform. Can also be achieved. For this reason, the image recognition processing of the on-board mark used in each specific device included in the component mounting system can be rationally advanced, while the circuit board can be produced more smoothly.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1A schematically shows a component mounting line (a component mounting system in which the board recognition method according to the present invention is implemented), which is a component mounting system according to the present invention. This line includes a dispenser 1, a coating inspection device 2, a first mounting device 3, a second mounting device 4, a mounting inspection device 5, and a system (line) constituent device between a loader and an unloader (both not shown). The curing device 6 is arranged in series. Then, while carrying a circuit board (hereinafter, simply referred to as a board), each process of solder paste application, component mounting, and paste curing is sequentially performed. Thus, each of the substrates after the mounting process is inspected. In this embodiment, the dispenser 1 to the mounting inspection device 5 correspond to the specific device of the present invention.

  Each of the devices 1 to 6 is an autonomous device having a control device, and the operations of the devices 1 to 6 are individually controlled by the control devices 1A to 6A (see FIG. 4). It has become. However, in this component mounting line, a central management device 8 that is connected online to each of the devices 1 to 6 is further provided, and production (processing) of the dispenser 1, both mounting devices 3 and 4, and the curing device 6 is performed. Various kinds of information such as information on the information are stored in a storage device in the central management device 8, and necessary information can be transmitted and received between the central management device 8 and the devices 1 to 6.

  Next, the configuration of the dispenser 1, the mounting devices 3 and 4, the curing device 6, and the inspection devices 2 and 5 that constitute the component mounting line will be described. The first mounting device 3 and the second mounting device 4, the coating inspection device 2 and the mounting inspection device 5 have the same configuration, and the dispenser 1 and the mounting devices 3 and 4 have a similar configuration. Therefore, in the following description, the configuration of the first mounting device 3, the mounting inspection device 5, and the curing device 6 will be described. The dispenser 1 and the second mounting device 4 are different from the first mounting device 3 and the like. I will mention.

  FIG. 2 schematically shows the configuration of the first mounting apparatus 3 in a plan view.

  As shown in the figure, on the base 10 of the first mounting apparatus 3, a printed board transport conveyor 11 is arranged, and the board P is transported to the conveyor 11 and a predetermined mounting work position (shown position). It is supposed to be stopped at. Although not shown, a positioning mechanism for the substrate P is provided at the mounting work position. When the substrate P is loaded along the conveyor 11, the positioning mechanism is activated to bring the substrate P to the mounting work position. It is comprised so that positioning may be fixed.

  Component supply units 12 are arranged on both sides of the conveyor 11, and multiple rows of tape feeders 12a capable of supplying small chip components such as ICs, transistors and capacitors are arranged in these component supply units 12. Yes.

  A head unit 15 for mounting components is provided above the base 10. The head unit 15 is movable across the component supply unit 12 and the substrate P at the mounting work position, and moves in the X-axis direction (direction parallel to the conveyor 11) and the Y-axis direction (direction orthogonal to the conveyor 11). Be able to.

  That is, a fixed rail 16 in the Y-axis direction and a ball screw shaft 17 that is rotationally driven by a Y-axis servomotor 13 are disposed on the base 10, and a head unit support member 14 is disposed on the fixed rail 16. (Hereinafter abbreviated as support member 14) is arranged, and a nut portion (not shown) provided on the support member 14 is screwed onto the ball screw shaft 17. The support member 14 is provided with a guide member (not shown) in the X-axis direction and a ball screw shaft 19 driven by the X-axis servo motor 20, and the head unit 15 can move to the guide member. And a nut portion (not shown) provided on the head unit 15 is screwed onto the ball screw shaft 19. The support member 14 is moved in the Y-axis direction by the operation of the Y-axis servo motor 13, and the head unit 15 is moved in the X-axis direction with respect to the support member 14 by the operation of the X-axis servo motor 20. ing.

  A plurality of mounting heads 21 for mounting components are mounted on the head unit 15, and in this embodiment, three mounting heads 21 are mounted in a line at equal intervals in the X-axis direction. . Each mounting head 21 can be moved in the Z-axis direction and rotated around the R-axis (nozzle center axis) with respect to the frame of the head unit 15. It is driven by. In addition, each mounting head 21 is provided with a nozzle at its tip (lower end), and the negative pressure is supplied from the negative pressure supply means (not shown) to the tip of the nozzle to hold the components by suction. ing.

  The head unit 15 further includes an imaging unit 23 for substrate recognition. This image pickup unit 23 is integrally provided with a camera and a lighting device incorporating a solid-state image pickup device such as a CCD area sensor, and is fixed downward to the head unit 15, and is positioned at the mounting work position as the head unit 15 moves. The postscript mark on the printed board P is imaged, and the image data is output to the control device 3A of the first mounting device 3.

  In addition, on the base 10, imaging units 22 having the same configuration as the imaging unit 23 are respectively disposed between the two component supply units 12 and the conveyor 11. These imaging units 22 are fixed upward on the base 10 so that the parts adsorbed by the mounting heads 21 of the head unit 15 are imaged from below and the image data is output to the control device 3A. It is configured.

  With the above configuration, the component mounting process proceeds in the first mounting apparatus 3 as follows. First, prior to the component mounting operation, the head unit 15 moves to the mounting work position and images a predetermined mark among the main marks M1 and M2 and the local marks m1 and m2 described later on the board P, thereby mounting. A positional deviation of the component mounting position with respect to the apparatus main body is obtained, and correction data (correction amount) corresponding to the positional deviation is obtained. This point will be described in detail later.

  Next, the head unit 15 moves to the component supply unit 12, and the components are adsorbed by the mounting heads 21. Specifically, after the mounting head 21 moves above the target tape feeder 12a, the components in the tape are picked up and taken out by the nozzle as the mounting head 21 moves up and down.

  Then, the head unit 15 moves from the component supply unit 12 onto the substrate P, and during this movement, the components adsorbed by the mounting heads 21 (nozzles) by passing over the imaging unit 22 are respectively imaged. Based on the image, the suction state (suction displacement) of the component by each mounting head 21 is examined.

  When the head unit 15 arrives on the board P at the mounting work position, the first component is mounted on the board P as the mounting head 21 moves up and down, and thereafter, the head unit 15 moves intermittently to the mounting point sequentially. The remaining suction components are mounted on the substrate P. At this time, the head unit 15 is driven and controlled according to the correction data and the component adsorption deviation, so that the component is mounted on each mounting point with high accuracy.

  Here, a mark provided on the substrate P and a process of recognizing the mark by the imaging unit 23 will be described with reference to FIG.

  As shown in the figure, fiducial marks M1 and M2 (main marks M1 and M2) are provided on the diagonal line on the substrate P. In the mark recognition process, the imaging unit 23 is moved to move these marks. By imaging the marks M1 and M2, a positional deviation ΔP (Xp, Yp, θp) of the substrate P corresponding to the deviation of each component mounting position with respect to the apparatus main body of the first mounting apparatus 3 is obtained from the image data. Correction data corresponding to the positional deviation ΔP is obtained. That is, it is checked how much the center of the line connecting the marks M1 and M2 is shifted in the X-axis direction and the Y-axis direction with respect to a predetermined normal position, and the line is a normal line (image center). It is examined how much it is displaced in the rotation direction with respect to the line connecting the two;

  On the board P, fiducial marks m1 and m2 (referred to as local marks m1 and m2) are individually provided as shown in FIG. In the mark recognition process, the marks m1 and m2 are further picked up by the image pickup unit 23, and the position shift of the component mounting position with respect to the apparatus main body of the first mounting apparatus 3 is determined from the image data in the same manner as the main marks M1 and M2. ΔF (Xf, Yf, θf) is obtained, and correction data corresponding to the positional deviation ΔF is obtained.

  In the following description, the component mounting position is referred to as a mounting point, and when it is necessary to particularly distinguish, the mounting point as described above for obtaining correction data based on image recognition of the local marks m1 and m2 is referred to as a specific point. The other points are called normal points.

  The above is the configuration of the first mounting device 3, but as described above, the second mounting device 4 also basically has a common configuration with the first mounting device 3.

  Next, the configuration of the mounting inspection apparatus 5 will be described with reference to FIG.

  This figure schematically shows the configuration of the mounting inspection apparatus 5 in a plan view. As shown in this figure, a conveyor 32 is provided on the base 30 of the mounting inspection apparatus 4, and the inspection work position (position shown in the figure) is provided at the approximate center of the base 30 where the board P is loaded from the left side of the apparatus. ) And then carried out to the next process from the right side of the device. In addition, the conveyance direction (left-right direction in FIG. 3) of the board | substrate P by the said conveyor 32 is made into the X-axis direction similarly to the mounting apparatus 3. FIG.

  A part of the conveyor 32, specifically, a part corresponding to the inspection work position (hereinafter referred to as a movable part 32a) can be separated from other conveyor parts, and can be moved independently in the Y-axis direction. ing. That is, a pair of fixed rails 33 extending in the Y-axis direction and a ball screw shaft 35 that is rotationally driven by a servo motor 34 are disposed on the base 30, and a table 36 is disposed on the fixed rails 33. In addition, a nut portion (not shown) provided on the table 36 is screwed onto the ball screw shaft 35. The movable portion 32a of the conveyor 32 is mounted on the table 36, and when the ball screw shaft 35 is rotationally driven by the operation of the servo motor 34, the movable portion 32a is integrated with the table 36 in the Y-axis direction. It is supposed to move.

  Although not shown in the figure, the table 36 is provided with a positioning mechanism for the substrate P. When the substrate P is carried along the conveyor 11, the positioning mechanism is activated to place the substrate P in the inspection work position. It is comprised so that it may be positioned and fixed to.

  A gate-shaped support base 40 is further erected on the base 30. The support base 40 is provided at a position slightly rearward with respect to the central portion of the base 30 in the front-rear direction (vertical direction in FIG. 3), and the support base 40 is a leg standing from both ends in the left-right direction. It consists of a column portion 41 and a beam portion 42 that bridges the upper end portions of the leg column portion 41.

  An imaging unit 45 for imaging the substrate P is disposed on the beam portion 42 of the support base 40, and the imaging unit 45 moves in the X axis direction along the beam portion 42. That is, a ball screw shaft 48 connected to the output shaft of the servo motor 47 and extending in the left-right direction is formed on the upper surface portion of the beam portion 42, and a pair of fixed members installed on the beam portion 42 in parallel with the ball screw shaft 48. The image pickup unit 45 is disposed on the fixed rail 49, and a nut portion (not shown) provided on the frame 50 of the image pickup unit 45 is screwed to the ball screw shaft 48. . As a result, the image pickup unit 45 moves in the X-axis direction along the beam portion 42 by the rotational drive of the ball screw shaft 48.

  The imaging unit 45 is integrally provided with a camera and a lighting device incorporating a solid-state imaging device such as a CCD area sensor, images the substrate P on the table 36 (movable part 32a) from the upper side, and controls the image data to the control device 5A. (Shown in FIG. 4).

  In the above configuration, the mounting inspection apparatus 5 proceeds with the inspection of the substrate P as follows. First, the board | substrate P is carried in by the action | operation of the conveyor 32, and the board | substrate P is positioned and fixed to the predetermined position of the movable part 32a. At this time, the table 36 is set at the home position, that is, the position where the movable portion 32a is arranged side by side with the other portions of the conveyor 32 (the position shown in the figure). Can be brought in.

  Then, with the board P positioned and fixed on the table 36, the board P is recognized prior to the component mounting state inspection. Specifically, the main marks M1 and M2 on the substrate P are imaged by the imaging unit 45 by operating the servo motors 34 and 47 and the like, and based on the image data as in the first mounting apparatus 3 described above. The correction data is obtained.

  When the correction data is obtained in this manner, imaging of the mounting points on the board P is sequentially performed while the imaging unit 45 moves relative to the board P, and the mounting state of the component at each mounting point is determined based on the imaging result. Inspected. At this time, the imaging unit 45 or the table 36 is driven and controlled based on the correction data, so that the component mounting state is inspected with high accuracy.

  Although not shown, the curing device 6 has a substrate transporting conveyor, a hot air blower, and the like, and heats the substrate P after component mounting to cure the solder and the like so that the component is mounted on the substrate P. It is configured to be firmly fixed on top.

  On the other hand, the dispenser 1 has a configuration similar to that of the first mounting device 3 as described above. Specifically, the dispenser head is mounted on the head unit instead of the mounting head 21 of the first mounting device 3. It has been configured. And while moving the head unit 15 relatively with respect to the board | substrate P, this is apply | coated on the board | substrate P, extruding a solder paste etc. to the front-end | tip of the nozzle provided in this dispenser head.

  The head unit of the dispenser 1 is also equipped with an image recognition unit for mark recognition similar to the first mounting device 3, and prior to the paste application operation, the main marks M1, M2 and the local marks m1, m2 on the substrate P. , The positional deviation of the mounting point (= application point) with respect to the apparatus main body is obtained, and correction data corresponding to the positional deviation is obtained. In the paste application operation, the head unit is driven and controlled based on the correction data, so that the solder paste is applied onto the substrate P with high accuracy. Needless to say, on the base of the dispenser 1, the component supply unit 12 such as the first mounting device 3, the imaging unit 22 for suction component recognition, and the like are not provided.

  Next, a control system for the component mounting line configured as described above will be described.

  FIG. 4 is a block diagram showing the configuration of the central management apparatus 8 that monitors the component mounting line in an integrated manner. As shown in this figure, the central management device 8 has a control unit main body 60 for controlling the operation. The control unit main body 60 includes a well-known CPU 61 that executes logical operations, a ROM 62 that stores various programs for controlling the CPU 61 in advance, a RAM 63 that temporarily stores various data during operation of the apparatus, and various application software. The HDD 64 and the I / O controller (IOC) 65 are stored, and the CPU 61 and the like are connected to each other via an internal bus.

  The IOC 65 is connected to input means 67 such as a keyboard and a mouse, and display means 68 such as a CRT monitor or LCD monitor, and to the control devices 1A to 6A of the devices 1 to 6, respectively. As a result, the control unit main body 60 receives predetermined instruction information input according to the operation of the input means 67 and various signals from the devices 1 to 6 (control devices 1A to 6A). General control such as monitoring is performed.

  The control unit main body 60 is further provided with an external storage device 66 such as a magneto-optical disk. The external storage device 66 relates to various data necessary for the operations of the devices 1 to 6, such as components. Data, data on the substrate P, and the like are stored.

  As shown in a block diagram in FIG. 5, the control unit main body 60 includes a main control unit 601, an allocation data creation unit 602, a data communication unit 603, and the like as functional configurations.

  The main control unit 601 performs necessary arithmetic processing and the like while monitoring the operations of the devices 1 to 6 according to a predetermined program. In particular, at the time of product type switching of the production board P, a device that controls the tact time (referred to as line tact) of the component mounting line based on the tact time data transmitted from each of the devices 1 to 6, that is, the most of the devices 1 to 6 A device that requires time for the work (referred to as a rate-limiting device if necessary) is specified. In the present embodiment, the main control unit 601 corresponds to the specifying unit of the present invention.

  The allocation data creation unit 602 (corresponding to the allocation data creation means of the present invention) is when the rate-limiting device specified by the main control unit 601 is any one of the coating inspection device 2, the mounting devices 3 and 4, and the mounting inspection device 5. In addition, data (allocation data) for causing a part of the mark recognition work in the speed-limiting device, specifically, part or all of the recognition work of the local marks m1 and m2 to be performed by a device upstream of the device. When the allocation data is generated, the main control unit 601 transmits a command signal to each of the devices 1 to 6 in order to proceed with the production of the substrate P according to this data.

  The data communication unit 603 transmits and receives various data between the control unit main body 60 and the devices 1 to 6 (control devices 1A to 6A).

  FIG. 6 shows a functional configuration of the control devices 1A to 6A of the devices 1 to 6 in a block diagram. This figure shows only the functional components related to the present invention extracted from the functional configurations of the control devices 1A to 6A.

  As shown in the figure, each of the control devices 1A to 6A includes a main control unit 701, a program storage unit 702, an imaging unit drive control unit 703, an image processing unit 704, a correction data creation unit 705, and data communication as functional configurations. (Note that the control device 6A of the curing device 6 is not subjected to recognition processing of the main marks M1, M2, etc., and therefore has a functional configuration indicated by reference numerals 703 to 705 surrounded by broken lines in FIG. Is not provided).

  The main control unit 701 includes a CPU, a ROM, a RAM, and the like, and controls operations of the devices 1 to 6 according to a predetermined program and performs various arithmetic processes related to the operations. In particular, when changing the type of the production board P, the initial tact time data after the type change is calculated based on the production program and board data, and the result is transmitted to the central management device 8 via the data communication unit 706. Here, the initial tact time data is a tact time when the work is executed according to a predetermined program, and an apparatus (local mark m1) that requires creation of correction data based on the local marks m1 and m2 at the time of the work. , The device using m2) is the tact time when the recognition operation of the local marks m1 and m2 is performed in the device using the local marks m1 and m2.

  The program storage unit 702 stores various processing programs of the devices 1 to 5 and various data regarding components and boards.

  The imaging unit drive control unit 703 controls driving of the imaging unit 23 and the like mounted in each of the devices 1 to 5, and the image processing unit 704 performs predetermined processing on the image data output from the imaging unit. Is.

  The correction data creation unit 705 creates correction data corresponding to the displacement of the mounting point based on the image data of the main marks M1 and M2 and the local marks m1 and m2 processed by the image processing unit 704. That is, based on the recognition of the main marks M1 and M2, the positional deviation ΔP (Xp, Yp, θp) of the substrate P corresponding to the positional deviation of the mounting point with respect to the apparatus body is obtained, while the local marks m1 and m2 are recognized, Based on the result, the positional deviation ΔF (Xf, Yf, θf) at a specific point with respect to the apparatus main body is obtained, and correction data corresponding to these positional deviations ΔP, ΔF is created.

  In addition, when the number of local marks m1 and m2 to be recognized is increased (added) by assignment of mark recognition work described later, the correction data creation unit 705 recognizes the added local marks m1 and m2. The positional deviation ΔF (Xf, Yf, θf) of the specific point relating to the marks m1 and m2 is obtained based on the above, and the relative deviation of the specific point with respect to the substrate P based on the positional deviation ΔF and the deviation ΔP of the substrate P. A positional deviation ΔG (Xg, Yg, θg) is obtained from the following equation.

Xg = Xf−Xp, Yg = Yf−Yp, θg = θf−θp
That is, the specific point displacement ΔF (Xf, Yf, θf) obtained based on the recognition of the local marks m1 and m2 on the substrate P includes the positional displacement of the substrate P in the positioning state. Is subtracted from the positional deviation ΔP (Xp, Yp, θp) of the substrate P from the positional deviation ΔF (Xf, Yf, θf) of the relative position ΔG (Xg, Yg, θg) with respect to the substrate P. ) Is required. In the following description, this positional deviation ΔG is referred to as relative position data (ΔG) as necessary.

  On the contrary, when the recognition work of the local marks m1 and m2 is omitted by the assignment of the mark recognition work as described above, the correction data creation unit 705 obtains the relative position data (ΔG) from the upper process device. Based on this reading, based on the relative position data (ΔG) and the positional deviation ΔP, a deviation ΔF (Xf, Yf, θf) of a specific point with respect to the apparatus main body is obtained from the following equation.

Xf = Xg + Xp, Yf = Yg + Yp, θf = θg + θp
That is, the positional deviation ΔP of the substrate P with respect to the apparatus main body changes for each apparatus, but the relative positional deviation ΔG (Xg, Yg, θg) of the specific point with respect to the substrate P only changes for each substrate P and changes for each apparatus. There is nothing. Therefore, the relative position data ΔG (Xg, Yg, θg) obtained by the upper process apparatus and the positional deviation ΔP (Xp, Yp, θp) of the substrate P are used. Yg, θg) is obtained.

  The data communication unit 706 transmits and receives various data between the devices 1 to 6 (control devices 1A to 6A) and the central management device 8.

  Next, substrate recognition processing control by the central management device 8 (control unit main body 60) will be described with reference to the flowchart of FIG. 8 and FIG. FIG. 1B shows the tact time of each of the devices 1 to 6 and corresponds to FIG. In the following description, an example in which different local marks (m1, m2 and m1 ′, m2 ′) are used in the first mounting apparatus 3 and the second mounting apparatus 4 will be described.

  This flowchart starts when, for example, the type of the production board P is changed in the component mounting line. The control unit main body 60 first transmits a tact time data request signal to each of the devices 1 to 6 and waits until transmission of the tact time data from each of the devices 1 to 6 is completed (steps S1 and S2). The tact time data here is the above-described initial tact time data, that is, the first mounting device 3 recognizes the local marks m1 and m2, and the second mounting device 4 stores the local marks m1 ′ and m2 ′. This is tact time data when the recognition work is performed, and the upper part of FIG. 1B shows an example of the initial tact time data.

  When all the initial time data are obtained, the main control unit 601 compares these data, identifies the device that controls the line tact among the devices 1 to 6, and further determines whether the rate controlling device uses a local mark. It is determined whether or not the first mounting device 3 or the second mounting device 4 determines the line tact (step S3). In this case, whether or not the rate is limited is determined by whether or not this time is exceeded based on the takt time of the curing device 6. This is because, in this embodiment, the takt time of the curing device 6 is a fixed value, so that if it is less than this time, the line tact will eventually depend on the takt time of the curing device 6. .

  For example, in the example in the upper part of FIG. 1B, it can be said that the tact time of the mounting apparatuses 3 and 4 is slower than the time of the curing apparatus 6 so that the line tact is rate-determined. In this case, YES is determined in step S3. To do.

  If YES is determined in the step S3, the allocation data creating unit 602 creates local mark recognition work allocation data.

  Specifically, first, allocation data is generated when the recognition work of all the local marks m1, m2, m1 ′, m2 ′ is allocated to the leading machine, that is, the dispenser 1, and each device in accordance with this data is created. A tact time of 1 to 6 is calculated, and it is determined whether or not the dispenser 1 corresponds to a device that controls the line tact (steps S4 and S5).

  The middle part of FIG. 1 (b) shows all the recognition work of the local marks m1, m2 used in the first mounting device 3 and the local marks m1 ′, m2 ′ used in the second mounting device 4 (each working time is 3 sec). The takt times of the respective devices 1 to 6 when assigned to the dispenser 1 are shown. In this case, since the dispenser 1 determines the line tact, it is determined YES in step S5. If NO is determined in step S5, the process proceeds to step S8.

  If YES is determined in step S5, based on the tact time data of each device 1-6 determined according to the allocation data, between the dispenser 1 and the first mounting device 3 identified as the rate limiting device in step S3. Of the mark recognition work assigned to the dispenser 1 in step S4 is selected. Allocation data for assigning a part to the device is created (steps S6 and S7).

  In the example in the middle part of FIG. 1B, the tact time of the coating inspection apparatus 2 has a margin, and as shown in the lower part of FIG. 1B, part of the mark recognition work assigned to the dispenser 1 (mounting apparatuses 3 and 4). Even if the local mark recognition operation) is assigned to the coating inspection apparatus 2, the line tact is not rate-determined. Therefore, in this case, the recognition operations of the local marks m1 and m2 used in the first mounting device 3 and the local marks m1 ′ and m2 ′ used in the second mounting device 4 are performed on the dispenser 1 and the coating inspection device 2, respectively. Create data to allocate.

  Next, the allocation data creation unit 602 calculates the tact time of each of the devices 1 to 6 based on the allocation data, and the line tact in the case of following the allocation data based on the tact time data and the initial tact time data of step S2. It is determined whether or not is slower than the initial line tact (initial state) (step S8). If NO is determined here, the process proceeds to step S10, where the allocation data is reset to restore the local mark recognition work allocation to the initial state (the upper state in FIG. 1B) as originally programmed.

  In step S9, a command signal is transmitted from the central management device 8 to each device 1-6, and each device 1-6 is operated. At this time, if the allocation data has been created (in the case of YES at step S8), a command signal is transmitted to each of the devices 1 to 6 to perform the mark recognition work according to the data, and the allocation data has been created. If NO, that is, if NO in step S3, or if the allocation data is reset in step S10, a command signal is transmitted to each of the devices 1 to 6 in order to perform local mark recognition work according to the initial program. Thus, this flowchart is finished.

  Here, the operation of the dispenser 1 to the second mounting apparatus 4 when the data as shown in the lower part of FIG.

  When the allocation data as described above is created, for example, the recognition work of the local marks m1 and m2 used in the first mounting device 3 is the dispenser 1, and the local marks m1 ′ and m2 used in the second mounting device 4 are used. 'Is recognized by the coating inspection apparatus 2.

  Specifically, in the dispenser 1, after the substrate P is positioned at a predetermined mounting work position, the main marks M1, M2 and the local marks m1, m2 are imaged by the imaging unit, and the image data of the main marks M1, M2 The position deviation ΔP of the substrate P relative to the apparatus main body corresponding to the position deviation of the mounting point (= application point) is obtained based on the above, and the correction data corresponding to this position deviation P is obtained, whereby the paste application operation is performed with high accuracy. .

  Further, the positional deviation ΔF of the specific point with respect to the apparatus main body is obtained based on the image data of the local marks m1 and m2, and the relative position of the specific point with respect to the substrate P is determined based on the positional deviation ΔF and the positional deviation ΔP of the substrate P. The deviation ΔG is obtained, and the relative position data (ΔG) is stored in a storage unit (not shown) in the control device 1A.

  Further, in the coating inspection apparatus 2, the main marks M1 and M2 and the local marks m1 'and m2' are imaged, and this corresponds to the positional deviation of the inspection point (= mounting point) with respect to the apparatus main body based on the image data of the main marks M1 and M2. Since the positional deviation ΔP of the substrate P to be obtained is obtained, and correction data corresponding to the positional deviation ΔP is obtained, the inspection operation for the inspection point is performed with high accuracy. Further, the positional deviation ΔF of the specific point with respect to the apparatus body is obtained based on the imaging results of the local marks m1 ′ and m2 ′, and the specific position relative to the substrate P is determined based on the positional deviation ΔP of the substrate P and the positional deviation ΔF of the specific point. The relative deviation ΔG ′ of the points is obtained, and the relative position data (ΔG ′) is stored in a storage unit (not shown) in the control device 1A.

  Then, in the first mounting apparatus 3, the local marks m1 and m2 are not recognized, and only the main marks M1 and M2 of the board P positioned at a predetermined mounting work position are imaged by the imaging unit 23, and the imaging result is obtained. Based on this, the deviation ΔP of the substrate P with respect to the apparatus main body, that is, the positional deviation of the normal point among the mounting points is obtained, and correction data corresponding to this positional deviation ΔP is obtained. Further, the relative position data (ΔG) is read from the dispenser 1, and a position deviation ΔF of a specific point with respect to the apparatus main body is obtained from the position deviation ΔP and the relative position data (ΔG), and correction according to the position deviation is performed. Data is required. As a result, the component mounting operation for each mounting point is accurately performed in the first mounting apparatus 3.

  Similarly, in the second mounting apparatus 4, the local marks m1 ′ and m2 ′ are not recognized, and only the main marks M1 and M2 of the substrate P positioned at a predetermined mounting work position are imaged by the imaging unit 23. Based on the imaging result, a positional deviation ΔP of the substrate P with respect to the apparatus main body is obtained, and correction data corresponding to this is obtained. Further, relative position data (ΔG ′) is read from the coating inspection apparatus 2, and a position deviation ΔF of a specific point with respect to the apparatus main body is obtained based on the data (ΔG) and the position deviation ΔP, and according to this position deviation. By obtaining the correction data, the component mounting operation for each mounting point is accurately performed in the second mounting apparatus 4.

  As described above, in this component mounting line, devices that use local marks among the devices 1 to 6 constituting the line (in the example of FIG. 1B, the first mounting device 3 and the second mounting device 4). When the line tact is rate-determined from the initial tact time data, the local mark recognition work is assigned to the upper process device and executed. Therefore, the line tact can be reduced by shortening the tact time of the device using the local mark. Can be improved effectively. In addition, when assigning the local mark recognition work, as described above, assignment is made to one or a plurality of devices having a sufficient tact time so that the assigned device does not rate-limit the line tact. The tact times of the devices 1 to 6 can be made uniform.

  Therefore, it is used in each of the devices 1 to 5 included in the component mounting line as compared with the conventional configuration (method) in which the mark recognition work in the lower process is simply performed by a specific device (one device) in the upper process. While rationally recognizing the local mark image recognition process, the circuit board can be produced more smoothly.

  The component mounting line described above is an embodiment of a component mounting line according to the present invention (a component mounting system in which the board recognition method according to the present invention is implemented). Modifications can be made as appropriate without departing from the scope of the invention.

  (1) In the embodiment, when the recognition work of the local marks m1 and m2 used in the first mounting device 3 is assigned to the dispenser 1 in the upper process, the relative displacement ΔG ( Xg, Yg, θg) is obtained and stored, and the correction data is obtained by reading the relative position data (ΔG) by the first mounting apparatus 3. Of course, the substrate obtained by the dispenser 1 is obtained. The first mounting device 3 reads the data of the positional deviation ΔP (Xp, Yp, θp) of P and the positional deviation ΔF (Xf, Yf, θf) of the specific point, and the first mounting device 3 reads the data based on these data. Relative position data (ΔG) may be obtained. Alternatively, the image data acquired by the dispenser 1 may be read by the first mounting apparatus 3, and the first mounting apparatus 3 may obtain the positional deviations ΔP and ΔF from the image data, and may further obtain the relative positional deviation ΔG.

  (2) In the embodiment, when assigning the recognition work of the local mark, first, the recognition work is assigned to the dispenser 1 which is the head device, and after this assignment, when the tact time of the dispenser 1 determines the line tact, A part of the recognition work is further assigned to the coating inspection apparatus 2 (steps S4 to S6 in FIG. 8). This is one method (procedure) for efficiently assigning the mark recognition work. The specific method of allocation may be other than this. For example, if a device that is an upper process and has the shortest tact time is checked and a recognition work is assigned to the device, and the tact time of the device determines the line tact, the recognition work is further performed. You may make it allocate a part to another apparatus.

  In the description of FIG. 8, there is no device between the coating inspection device 2 and the first mounting device 3. For convenience of explanation, when the tact time of the dispenser 1 determines the line tact, the recognition work is performed. The description is stopped at the stage of assigning a part of the coating inspection apparatus 2 to the coating inspection apparatus 2. For example, there are a plurality of apparatuses between the coating inspection apparatus 2 and the first mounting apparatus 3, and the coating inspection apparatus 2. In the case where the line tact is limited, the mark recognition is repeated while repeating the same process of assigning part or all of the mark recognition work to the lower process apparatus of the coating inspection apparatus 2 and comparing the tact time. A recognition task may be assigned.

  (3) In the above embodiment, a component mounting system (line) including the dispenser 1, the coating inspection device 2, the first mounting device 3, the second mounting device 4, the mounting inspection device 5, and the curing device 6 is taken as an example of the system configuration device. Although the present invention has been described above, the specific configuration of the component mounting system may be other than this. For example, instead of (or in addition to) the dispenser 1, a configuration including a printing device that prints solder or the like may be used.

It is a schematic diagram which shows the component mounting line (system) based on this invention (1 (a) is a process figure, 1 (b) is a figure which showed an example of the tact time for every process). It is a schematic plan view which shows the structure of the mounting apparatus integrated in a component mounting line. It is a schematic plan view which shows the structure of the coating inspection apparatus incorporated in a component mounting line. It is a block diagram which shows the structure of a central management apparatus. It is a block explaining the functional composition contained in the control part main part of a central management apparatus. It is a block diagram which shows the function structure of each control apparatus of a dispenser, a coating inspection apparatus, a 1st mounting apparatus, a 2nd mounting apparatus, and a mounting inspection apparatus. It is a plane schematic diagram of a circuit board showing the types of marks provided on the circuit board. It is a flowchart which shows an example of the board | substrate recognition process control by a central management apparatus (control part main body).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Dispenser 2 Application | coating inspection apparatus 3 1st mounting apparatus 4 2nd mounting apparatus 5 Mounting inspection apparatus 6 Curing apparatus 8 Central management apparatus

Claims (4)

As a system component device, a plurality of system component devices are used, and the substrate conveyed by the conveying means is stopped at a predetermined position, and each substrate is subjected to a predetermined operation, and prior to this operation, on the substrate A method for recognizing a board of a component mounting system including a plurality of specific devices that recognizes an image of a mark and obtains correction data according to a shift of a work part based on the result of the image recognition,
The system component device having the slowest tact time is identified by comparing in advance the tact time of each system component device when the image recognition work for the mark is performed in the specific device that uses the mark. In the case of the specific device, a part or all of the image recognition work to be recognized by the specific device is assigned to one or a plurality of specific devices in an upper process than the specific device and is performed. A substrate recognition method, wherein the assignment is performed in a range in which the tact time of the apparatus does not become slower than the tact time of a system component apparatus other than the specific apparatus. The substrate recognition method according to claim 1,
When the specific device that has the slowest tact time is the first specific device, a part or all of the image recognition work to be recognized by the first specific device is performed higher than the specific device. If the system configuration device assigned to the second specific device of the process is compared with the tact time of each system configuration device, and the system configuration device with the slowest tact time is specified. (2) All or part of the image recognition work of the mark assigned to the specific device is assigned to a specific device that is an upper process than the first specific device and is lower than the second specific device. By comparing and assigning the tact time in the same manner as the new second specifying device, a part or all of the marks to be recognized by the first specifying device are used. Substrate recognition method characterized by assigning an image recognition task to a particular device above process than the first specific device. The substrate recognition method according to claim 2,
A board recognition method characterized in that the assignment is performed with the uppermost specific device among the specific devices included in the component mounting system as the first second specific device. As a system component device, a plurality of system component devices are used, and the substrate conveyed by the conveying means is stopped at a predetermined position, and each substrate is subjected to a predetermined operation, and prior to this operation, on the substrate A component mounting system including a plurality of specific devices that recognizes an image of a mark and obtains correction data according to a shift of a work part based on a result thereof,
Identifying means for identifying the system component device having the slowest tact time by comparing the tact times of each system component device when the image recognition operation of the mark is performed in each of the identifying devices using the mark;
When the system component device specified by the specifying means is the specific device, one or a plurality of specific devices that perform part or all of the image recognition work of the mark used in the specific device above the specific device Assignment data creating means for creating assignment data to be assigned to and executed,
The data creation means performs the assignment in a range in which the tact time of each specific device does not become slower than the tact time of a system component device other than the specific device,
Each of the specific devices performs a mark image recognition operation based on the assignment data created by the assignment data creation means.

Images