JPH0818299A - Optimizing method of mounting process - Google Patents
Optimizing method of mounting processInfo
- Publication number
- JPH0818299A JPH0818299A JP14370494A JP14370494A JPH0818299A JP H0818299 A JPH0818299 A JP H0818299A JP 14370494 A JP14370494 A JP 14370494A JP 14370494 A JP14370494 A JP 14370494A JP H0818299 A JPH0818299 A JP H0818299A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- tact
- time
- line
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板を生産す
る時間の短縮およびプリント基板生産時に発生する不良
を防止する実装工程最適化方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of optimizing a mounting process for shortening the time for producing a printed circuit board and preventing defects occurring during the production of the printed circuit board.
【０００２】[0002]
【従来の技術】近年、実装工程最適化法は実装する設備
単体の輝度、性能向上だけでは生産効率向上や不良防止
は実現しないことから、それらを実現する方法として重
要視されるようになった。2. Description of the Related Art In recent years, since the mounting process optimization method cannot realize the improvement of production efficiency and the prevention of defects only by improving the brightness and performance of the equipment to be mounted alone, it has become important as a method for realizing them. .
【０００３】以下に従来の実装工程最適化法について説
明する。図３は従来の実装工程最適化法の構成を示す図
である。図３において、１はＣＡＤデータ、２は実装デ
ータベース、４は最適な実装ラインを決定する実装工程
最適化機能、８は実装ラインの装着機のタクトを算出す
るタクト算出機能である。また、５は装着機以外の実装
設備を示し、印刷機、リフロー機や検査機である。６は
装着機、７は１つの実装ラインを示す。A conventional mounting process optimizing method will be described below. FIG. 3 is a diagram showing a configuration of a conventional mounting process optimization method. In FIG. 3, 1 is CAD data, 2 is a mounting database, 4 is a mounting process optimizing function for determining an optimum mounting line, and 8 is a tact calculating function for calculating the tact of the mounting machine of the mounting line. Reference numeral 5 denotes mounting equipment other than the mounting machine, which is a printing machine, a reflow machine, or an inspection machine. 6 is a mounting machine, and 7 is one mounting line.
【０００４】以上のように構成された実装工程最適化法
について、以下その動作について図４を参照しながら説
明する。まず、＃９でＣＡＤデータ１と実装データベー
ス２よりタクト算出機能８において対象となる実装ライ
ン７の全装着機６のタクトを算出する。この工程では装
着動作時に標準タクト内で稼働部が移動できない場合に
生じるロス時間を標準タクトに加算することおよび基板
認識時間と基板ローディング時間などからタクトを算出
することを含む。次に、＃１０で対象実装ラインの全装
着機のタクトのうち最大のタクトをラインタクトとす
る。これを＃１１、＃１３で全ての実装ラインについて
求めるまで繰り返す。＃１２で実装工程最適化機能４に
より、全ての実装ラインのタクトが求められるとそのう
ち最小のタクトであるラインを最適な実装ラインと決定
する。The operation of the mounting process optimizing method configured as described above will be described below with reference to FIG. First, in # 9, the tact of all mounting machines 6 of the target mounting line 7 is calculated in the tact calculating function 8 from the CAD data 1 and the mounting database 2. This step includes adding the loss time generated when the moving part cannot move within the standard tact during the mounting operation to the standard tact, and calculating the tact from the substrate recognition time and the substrate loading time. Next, in # 10, the maximum tact among the tacts of all the mounting machines on the target mounting line is set as the line tact. This is repeated until all mounting lines are obtained in # 11 and # 13. When the tact of all the mounting lines is obtained by the mounting process optimizing function 4 in # 12, the line having the smallest tact among them is determined as the optimum mounting line.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記の従
来の実装工程最適化法では、プリント基板に部品を装着
する接着機のみのタクト算出を行い、印刷機、リフロー
機や検査機のタクトを算出していないためにタクトの最
大値がラインタクトにならない場合が発生し、それが最
適なライン決定に誤った判断をしてしまうという問題点
を有していた。また、装着機だけでラインのタクトを最
小にすることを考えるため部品装着速度を最大限に上げ
ることにより、部品の装着ずれを発生し易くし、不良を
生み出す原因ともなり、部品吸着ミスも多発し、部品を
捨てるという資源のムダ使いとなるという問題点も有し
ていた。However, in the conventional method of optimizing the mounting process described above, the tact of only the bonding machine that mounts the components on the printed circuit board is calculated, and the tact of the printing machine, the reflow machine or the inspection machine is calculated. There is a problem that the maximum value of the tact does not become the line tact because it has not been done, which causes an erroneous determination for the optimum line determination. In addition, in order to minimize the tact of the line by using only the mounting machine, increasing the component mounting speed makes it easier to cause component misalignment, causing defects, and frequent component pick-up errors. However, it also has a problem that it wastes resources by discarding parts.
【０００６】本発明は上記従来の問題点を解決するもの
で、最適なラインを的確に決定し、生産時間の短縮と生
産プリント基板不良を防止する実装工程最適化法を提供
するものである。The present invention solves the above-mentioned problems of the prior art, and provides a mounting process optimization method for accurately determining the optimum line, shortening the production time, and preventing defective production printed boards.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明の実装工程最適化法は、複数の実装ラインにお
いて実装位置情報を有するＣＡＤデータおよび各設備の
動作情報を有する実装データベースより、所望のプリン
ト基板に対する各設備のタクトを算出する工程と、それ
らのタクトから各実装ライン毎のタクトを計算する工程
と、当該プリント基板を実装するのに最小タクトの実装
ラインを決定する工程を備えたものである。In order to solve the above problems, the mounting process optimizing method of the present invention uses CAD data having mounting position information in a plurality of mounting lines and a mounting database having operation information of each facility. It has the steps of calculating the tact of each equipment for the desired printed circuit board, the step of calculating the tact for each mounting line from those tacts, and the step of determining the minimum tact mounting line for mounting the printed circuit board. It is a thing.
【０００８】また、各設備のタクト算出において、装着
機については装着動作時に標準タクト内で稼働部が移動
できない場合に生じるロス時間を標準タクトに加算し、
かつ基板認識時間と基板ローディング時間などからタク
トを算出する工程を、印刷機については基板のサイズお
よび印刷速度と基板認識時間と基板ローディング時間な
どからタクトを算出する工程を、リフロー機については
コンベア速度と基板サイズとコンベア長さおよびコンベ
ア速度と基板ローディング時間などからタクトを算出す
る工程を、検査機については検査位置の移動時間と全エ
リア認識時間と基板ローディング時間などからタクトを
算出する工程を備えたものである。Further, in the tact calculation of each equipment, for the mounting machine, the loss time generated when the operating part cannot move within the standard tact during the mounting operation is added to the standard tact,
In addition, the step of calculating the tact time from the board recognition time and the board loading time, the step of calculating the takt time from the board size and printing speed, the board recognition time and the board loading time for the printing machine, and the conveyor speed for the reflow machine. And the step of calculating the tact from the board size, the conveyor length, the conveyor speed, the board loading time, etc., and the step of calculating the tact from the inspection position moving time, the total area recognition time, the board loading time, etc. for the inspection machine. It is a thing.
【０００９】また、１つのラインにおいて、算出した各
設備のタクトを比較する工程と、最大のタクトである設
備を特定する工程と、その最大タクトの範囲内で各設備
の動作速度を調整する工程を備えたものである。Further, in one line, a step of comparing the calculated tact of each equipment, a step of identifying the equipment having the maximum tact, and a step of adjusting the operating speed of each equipment within the range of the maximum tact. It is equipped with.
【００１０】[0010]
【作用】本発明は上記構成によって、プリント基板に部
品を装着する装着機および装着機以外の印刷機、リフロ
ー機や、検査機のタクトを算出するためにタクトの最大
値がラインタクトになり、それが最適なライン決定を正
しくすることになる。また、装着機だけでラインのタク
トを最小にすることを考えないため、装着機以外のタク
トが装着機よりも大きい場合は部品装着速度を最大限に
上げる必要もなくなり、部品の装着ずれを防ぎ、部品吸
着ミスも防ぐこととなる。According to the present invention, with the above configuration, the maximum value of the tact becomes the line tact in order to calculate the tact of the mounting machine for mounting the components on the printed circuit board, the printing machine other than the mounting machine, the reflow machine, and the inspection machine. That will make the right line decisions correct. In addition, since we do not consider minimizing the tact of the line only with the mounting machine, it is not necessary to maximize the component mounting speed when the tact other than the mounting machine is larger than the mounting machine, preventing component misalignment. It also prevents component pick-up mistakes.
【００１１】[0011]
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。図１において、１はＣＡＤデータ、
２は実装データベース、４は最適な実装ラインを決定す
る実装工程最適化機能、３は実装ラインの各設備である
装着機、印刷機、リフロー機、検査機のタクトを算出す
るタクト算出機能である。また、５は装着機以外の実装
設備を示し、印刷機、リフロー機や検査機である。６は
装着機、７は１つの実装ラインを示す。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is CAD data,
Reference numeral 2 is a mounting database, 4 is a mounting process optimizing function for determining an optimum mounting line, and 3 is a tact calculation function for calculating tact of a mounting machine, a printing machine, a reflow machine, and an inspection machine, which are each facility of the mounting line. . Reference numeral 5 denotes mounting equipment other than the mounting machine, which is a printing machine, a reflow machine, or an inspection machine. 6 is a mounting machine, and 7 is one mounting line.
【００１２】以上のように構成された実装工程最適化法
について、図２、図５、図６、図７を用いてその動作を
説明する。まず、＃１でＣＡＤデータ１と実装データベ
ース２よりタクト算出機能３において対象となる実装ラ
イン７の全装着機６のタクトを算出する。＃２で対象実
装ラインにおいて全ての装着機の各タクトと装着機以外
の最大タクトとを比較し、全ての装着機の各タクトが装
着機以外の最大タクトより小さい場合は、＃３で装着機
以外の最大タクトより小さいタクトの範囲で最も大きく
なるようになるまで装着速度を落とす。全ての装着機の
各タクトが装着機以外の最大タクトより大きいか等しい
場合は、＃４で各装着機間でタクト最小のバランスをと
る。＃５で対象実装ラインの全実装設備のタクトのうち
最大のタクトをラインタクトとする。これを＃６、＃８
で全ての実装ラインについて求めるまで繰り返す。＃７
で実装工程最適化機能４により、全ての実装ラインのタ
クトが求められるとそのうち最小のタクトであるライン
を最適な実装ラインと決定する。The operation of the mounting process optimizing method configured as described above will be described with reference to FIGS. 2, 5, 6, and 7. First, in # 1, the tact of all mounting machines 6 of the target mounting line 7 is calculated in the tact calculating function 3 from the CAD data 1 and the mounting database 2. In # 2, compare each tact of all the mounting machines with the maximum tact other than the mounting machine in the target mounting line, and if each tact of all the mounting machines is smaller than the maximum tact of other mounting machines, mount the machine in # 3. Decrease the mounting speed until it becomes the largest in the range of tact smaller than the maximum tact other than. When each tact of all the mounting machines is greater than or equal to the maximum tact of all the mounting machines, the minimum tact is balanced among the mounting machines in # 4. In # 5, the maximum tact among the tacts of all the mounting equipment on the target mounting line is set as the line tact. This is # 6, # 8
Repeat until all mounting lines are obtained. # 7
When the tact of all the mounting lines is obtained by the mounting process optimizing function 4, the line having the smallest tact among them is determined as the optimum mounting line.
【００１３】ここで、印刷機の特徴を考慮したタクト算
出法について図５を参照して説明する。＃１４でＣＡＤ
データよりプリント基板長さを取得する。＃１５で実装
データベースよりスキージによる印刷速度を取得する。
＃１６で実装データベースより基板ローディング時間ｔ
ｓ１を取得する。＃１７で実装データベースより基板認
識時間ｔｓ２を取得する。＃１８で実装データベースよ
り版のクリーニング時間ｔｓ３を取得する。＃１９で印
刷時間ｔｓ４の計算を ｔｓ４＝基板長さ／印刷速度 の式により行う。最後に＃２０で印刷機のタクトｔｓを ｔｓ＝ｔｓ１＋ｔｓ２＋ｔｓ３＋ｔｓ４ の式により計算する。A tact calculation method considering the characteristics of the printing press will be described with reference to FIG. CAD in # 14
Obtain the printed circuit board length from the data. In # 15, the printing speed of the squeegee is acquired from the mounting database.
Board loading time t from mounting database in # 16
Get s1. In # 17, the board recognition time ts2 is acquired from the mounting database. In # 18, the plate cleaning time ts3 is acquired from the mounting database. In # 19, the printing time ts4 is calculated according to the equation: ts4 = substrate length / printing speed. Finally, in # 20, the tact ts of the printing press is calculated by the equation: ts = ts1 + ts2 + ts3 + ts4.
【００１４】次に、リフロー機の特徴を考慮したタクト
算出法について図６を参照して説明する。＃２１でＣＡ
Ｄデータよりプリント基板長さを取得する。＃２２で実
装データベースよりコンベア長さを取得する。＃２３で
実装データベースよりコンベア速度を取得する。＃２４
で実装データベースより基板ローディング時間ｔｒ１を
取得する。＃２５でリフロー時間ｔｒ２の計算を ｔｒ２＝（基板長さ＋コンベア長さ）／コンベア速度 の式により行う。最後に＃２６でリフロー機のタクトｔ
ｒを ｔｒ＝ｔｒ１＋ｔｒ２ の式により計算する。Next, a tact calculation method considering the characteristics of the reflow machine will be described with reference to FIG. CA at # 21
The printed circuit board length is acquired from the D data. In # 22, the conveyor length is acquired from the mounting database. In # 23, the conveyor speed is acquired from the mounting database. # 24
The board loading time tr1 is acquired from the mounting database. In step # 25, the reflow time tr2 is calculated by the formula: tr2 = (substrate length + conveyor length) / conveyor speed. Finally, at # 26, the tact t of the reflow machine
Calculate r by the formula tr = tr1 + tr2.
【００１５】次に、検査機の特徴を考慮したタクト算出
法について図７を参照して説明する。＃２７で実装デー
タベースより基板ローディング時間ｔｉ１を取得する。
＃２８で実装データベースより基板認識時間ｔｉ２を取
得する。＃２９で実装データベースよりエリア内認識時
間を取得する。＃３０でＣＡＤデータよりエリア数を取
得する。＃３１で全エリア認識時間ｔｉ３を ｔｉ３＝エリア内認識時間×エリア数 の式により算出する。＃３２でＣＡＤデータよりエリア
間の移動距離を算出する。＃３３で実装データベースよ
りエリア間移動速度を取得する。＃３４でエリア間移動
時間ｔｉ４の計算を ｔｉ４＝エリア間移動距離／エリア間移動速度 の式により行う。最後に＃３５で検査機のタクトｔｉを ｔｉ＝ｔｉ１＋ｔｉ２＋ｔｉ３＋ｔｉ４ の式により計算する。Next, a tact calculation method considering the characteristics of the inspection machine will be described with reference to FIG. In # 27, the board loading time ti1 is acquired from the mounting database.
In step # 28, the board recognition time ti2 is acquired from the mounting database. In # 29, the in-area recognition time is acquired from the mounting database. In # 30, the number of areas is acquired from the CAD data. In # 31, the total area recognition time ti3 is calculated by the following formula: ti3 = in-area recognition time × area number. In # 32, the moving distance between areas is calculated from the CAD data. In # 33, the movement speed between areas is acquired from the mounting database. In # 34, the inter-area moving time ti4 is calculated by the formula: ti4 = area moving distance / area moving speed. Finally, in # 35, the takt time ti of the inspection machine is calculated by the following equation: ti = ti1 + ti2 + ti3 + ti4.
【００１６】以上のように本実施例によれば、実装ライ
ンにおいて実装位置情報を有するＣＡＤデータおよび各
設備の動作情報を有する実装データベースより、プリン
ト基板に対する各設備のタクトを算出し、それらのタク
トからラインのタクトを決定し、プリント基板を実装す
るのに最適な実装ラインを決定する機能を備え、また、
各設備のタクト算出において装着機、印刷機、リフロー
機、検査機の各特徴を考慮したことで、最適なライン決
定を正しくし、部品の装着ずれを防ぎ、部品吸着ミスも
防ぐことができる。As described above, according to the present embodiment, the tact of each facility with respect to the printed circuit board is calculated from the CAD data having the mounting position information on the mounting line and the mounting database having the operation information of each facility, and these tacts are calculated. It has a function to determine the tact of the line from, and to determine the most suitable mounting line for mounting the printed circuit board.
By considering the features of the mounting machine, the printing machine, the reflow machine, and the inspection machine in the tact calculation of each equipment, it is possible to correct the optimal line determination, prevent component misalignment, and prevent component suction errors.
【００１７】[0017]
【発明の効果】以上のように本発明によれば、複数の実
装ラインにおいて実装位置情報を有するＣＡＤデータお
よび各設備の動作情報を有する実装データベースより、
所望のプリント基板に対する各設備のタクトを算出する
工程と、それらのタクトから各実装ライン毎のタクトを
計算する工程と、当該プリント基板を実装するのに最小
タクトの実装ラインを決定する工程を備え、また、各設
備のタクト算出において、装着機については装着動作時
に標準タクト内で稼働部が移動できない場合に生じるロ
ス時間を標準タクトに加算しかつ基板認識時間と基板ロ
ーディング時間などからタクトを算出する工程を、印刷
機については基板のサイズおよび印刷速度と基板認識時
間と基板ローディング時間などからタクトを算出する工
程を、リフロー機についてはコンベア速度と基板サイズ
とコンベア長さおよびコンベア速度と基板ローディング
時間などからタクトを算出する工程を、検査機について
は検査位置の移動時間と全エリア認識時間と基板ローデ
ィング時間などからタクトを算出する工程を備え、ま
た、１つのラインにおいて、算出した各設備のタクトを
比較する工程と、最大のタクトである設備を特定する工
程と、その最大タクトの範囲内で各設備の動作速度を調
整する工程を備えることにより、最適なライン決定を正
しくし、部品の装着ずれを防ぎ、部品吸着ミスも防ぐこ
とができる優れた実装工程最適化法を実現できるもので
ある。As described above, according to the present invention, CAD data having mounting position information in a plurality of mounting lines and a mounting database having operation information of each facility
It has the steps of calculating the tact of each equipment for the desired printed circuit board, the step of calculating the tact for each mounting line from those tacts, and the step of determining the minimum tact mounting line for mounting the printed circuit board. In addition, in the tact calculation of each equipment, for the mounting machine, the loss time that occurs when the moving part cannot move within the standard tact during the mounting operation is added to the standard tact, and the tact is calculated from the board recognition time and the board loading time. For the printing machine, the tact is calculated from the size and printing speed of the board, the board recognition time, and the board loading time.For the reflow machine, the conveyor speed, the board size, the conveyor length, the conveyor speed, and the board loading time. The process of calculating tact from time, etc. And a step of calculating the tact time from the total area recognition time and the substrate loading time, and a step of comparing the calculated tact of each equipment in one line and a step of identifying the equipment having the maximum tact. By providing a process that adjusts the operating speed of each equipment within the range of its maximum takt time, it is possible to correct the optimal line determination, prevent component misalignment, and prevent component pick-up errors. Can be realized.
【図１】本発明の一実施例における実装工程最適化法の
構成図FIG. 1 is a configuration diagram of a mounting process optimization method according to an embodiment of the present invention.
【図２】本発明の一実施例における実装工程最適化法の
動作説明のための処理フロー図FIG. 2 is a process flow chart for explaining the operation of the mounting process optimization method in the embodiment of the present invention.
【図３】従来の実装工程最適化法の構成図FIG. 3 is a block diagram of a conventional mounting process optimization method.
【図４】従来の実装工程最適化法の動作説明のための処
理フロー図FIG. 4 is a processing flow chart for explaining the operation of a conventional mounting process optimization method.
【図５】本発明の一実施例における実装工程最適化法の
印刷機のタクト算出フロー図FIG. 5 is a tact calculation flow chart of a printing press of a mounting process optimization method according to an embodiment of the present invention.
【図６】本発明の一実施例における実装工程最適化法の
リフロー機のタクト算出フロー図FIG. 6 is a tact calculation flow chart of the reflow machine of the mounting process optimization method in the embodiment of the present invention.
【図７】本発明の一実施例における実装工程最適化法の
検査機のタクト算出フロー図FIG. 7 is a tact calculation flow chart of the inspection machine of the mounting process optimization method in the embodiment of the present invention.
１ ＣＡＤデータ ２ 実装データベース ３ 実装ラインの各設備のタクトを算出するタクト算出
機能 ４ 最適な実装ラインを決定する実装工程最適化機能 ５ 装着機以外の実装設備 ６ 装着機 ７ 実装ライン1 CAD data 2 Mounting database 3 Tact calculation function to calculate the tact of each equipment on the mounting line 4 Mounting process optimization function to determine the optimum mounting line 5 Mounting equipment other than the mounting machine 6 Mounting machine 7 Mounting line
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 健一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenichi Sato 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (3)
を有するＣＡＤデータおよび各設備の動作情報を有する
実装データベースより、所望のプリント基板に対する各
設備のタクトを算出する工程と、それらのタクトから各
実装ライン毎のタクトを計算する工程と、当該プリント
基板を実装するのに最小タクトの実装ラインを決定する
工程とを備えた実装工程最適化方法。1. A step of calculating the tact of each equipment with respect to a desired printed circuit board from CAD data having mounting position information and a mounting database having operation information of each equipment in a plurality of mounting lines, and each mounting from those tacts. A mounting step optimizing method including a step of calculating a tact for each line and a step of determining a mounting line having a minimum tact for mounting the printed circuit board.
ついては装着動作時に標準タクト内で稼働部が移動でき
ない場合に生じるロス時間を標準タクトに加算し、かつ
少なくとも基板認識時間と基板ローディング時間からタ
クトを算出する工程を、印刷機については少なくとも基
板のサイズおよび印刷速度と基板認識時間と基板ローデ
ィング時間からタクトを算出する工程を、リフロー機に
ついては少なくとも基板サイズとコンベア長さおよびコ
ンベア速度と基板ローディング時間からタクトを算出す
る工程を、検査機については少なくとも検査位置の移動
時間と全エリア認識時間と基板ローディング時間からタ
クトを算出する工程を備えた請求項１記載の実装工程最
適化方法。2. In the tact calculation of each equipment, for the mounting machine, the loss time generated when the moving part cannot move within the standard tact during the mounting operation is added to the standard tact, and at least from the board recognition time and the board loading time. For the printing machine, at least the board size and printing speed, the board recognition time, and the board loading time for the reflow machine, and at least the board size, the conveyor length, the conveyor speed, and the board. 2. The mounting step optimizing method according to claim 1, further comprising a step of calculating the tact time from the loading time, and a step of calculating the tact time from at least the moving time of the inspection position, the entire area recognition time and the board loading time for the inspection machine.
のタクトを比較する工程と、最大のタクトである設備を
特定する工程と、その最大タクトの範囲内で各設備の動
作速度を調整する工程とを備えた請求項１または請求項
２記載の実装工程最適化方法。3. In one line, a step of comparing the calculated tact of each facility, a step of identifying the facility having the maximum tact, and a step of adjusting the operating speed of each facility within the range of the maximum tact. The mounting process optimization method according to claim 1 or 2, further comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14370494A JP3461574B2 (en) | 1994-06-27 | 1994-06-27 | Mounting process optimization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14370494A JP3461574B2 (en) | 1994-06-27 | 1994-06-27 | Mounting process optimization method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0818299A true JPH0818299A (en) | 1996-01-19 |
| JP3461574B2 JP3461574B2 (en) | 2003-10-27 |
Family
ID=15345038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14370494A Expired - Fee Related JP3461574B2 (en) | 1994-06-27 | 1994-06-27 | Mounting process optimization method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3461574B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997047170A1 (en) * | 1996-06-06 | 1997-12-11 | Matsushita Electric Industrial Co., Ltd. | Facility operating method |
| JPH11112137A (en) * | 1997-10-08 | 1999-04-23 | Matsushita Electric Ind Co Ltd | Setting method for bond coating cycle time |
| JP2006287047A (en) * | 2005-04-01 | 2006-10-19 | Yamaha Motor Co Ltd | Substrate recognizing method and component mounting system |
| JP2008028262A (en) * | 2006-07-24 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Production control method |
| JP2009111103A (en) * | 2007-10-29 | 2009-05-21 | Panasonic Corp | Component mounting condition determining method, component mounting apparatus and program |
| CN102789213A (en) * | 2011-05-18 | 2012-11-21 | 富士机械制造株式会社 | Production management device and method for component installing production line |
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| JP2018157122A (en) * | 2017-03-21 | 2018-10-04 | 日本電気株式会社 | Manufacturing installation, manufacturing method, and program |
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1994
- 1994-06-27 JP JP14370494A patent/JP3461574B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997047170A1 (en) * | 1996-06-06 | 1997-12-11 | Matsushita Electric Industrial Co., Ltd. | Facility operating method |
| JPH11112137A (en) * | 1997-10-08 | 1999-04-23 | Matsushita Electric Ind Co Ltd | Setting method for bond coating cycle time |
| JP2006287047A (en) * | 2005-04-01 | 2006-10-19 | Yamaha Motor Co Ltd | Substrate recognizing method and component mounting system |
| JP2008028262A (en) * | 2006-07-24 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Production control method |
| JP2009111103A (en) * | 2007-10-29 | 2009-05-21 | Panasonic Corp | Component mounting condition determining method, component mounting apparatus and program |
| JP2012243894A (en) * | 2011-05-18 | 2012-12-10 | Fuji Mach Mfg Co Ltd | Production management device and production management method for component mounting line |
| CN102789213A (en) * | 2011-05-18 | 2012-11-21 | 富士机械制造株式会社 | Production management device and method for component installing production line |
| CN103570783A (en) * | 2013-11-19 | 2014-02-12 | 南京工业大学 | Crystal transformation method of disodium guanylate |
| JP2017199144A (en) * | 2016-04-26 | 2017-11-02 | ファナック株式会社 | Manufacturing management device for reducing operation load of manufacturing machine |
| CN107315394A (en) * | 2016-04-26 | 2017-11-03 | 发那科株式会社 | The manufacturing management device of the operating duty of reduction manufacture machinery |
| US10185292B2 (en) | 2016-04-26 | 2019-01-22 | Fanuc Corporation | Manufacturing management apparatus which reduces operational load of manufacturing machines |
| CN107315394B (en) * | 2016-04-26 | 2020-06-02 | 发那科株式会社 | Manufacturing management device for reducing operation load of manufacturing machine |
| JP2018157122A (en) * | 2017-03-21 | 2018-10-04 | 日本電気株式会社 | Manufacturing installation, manufacturing method, and program |
Also Published As
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|---|---|
| JP3461574B2 (en) | 2003-10-27 |
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