WO2017006437A1 - Controller mounted on component mounting machine - Google Patents

Controller mounted on component mounting machine Download PDF

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Publication number
WO2017006437A1
WO2017006437A1 PCT/JP2015/069557 JP2015069557W WO2017006437A1 WO 2017006437 A1 WO2017006437 A1 WO 2017006437A1 JP 2015069557 W JP2015069557 W JP 2015069557W WO 2017006437 A1 WO2017006437 A1 WO 2017006437A1
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Prior art keywords
partial ring
ring buffer
size
tasks
task
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PCT/JP2015/069557
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French (fr)
Japanese (ja)
Inventor
陽祐 寺西
和弘 浅田
文則 伊藤
秀幸 熊澤
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富士機械製造株式会社
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2017527012A priority Critical patent/JP6584506B2/en
Priority to PCT/JP2015/069557 priority patent/WO2017006437A1/en
Publication of WO2017006437A1 publication Critical patent/WO2017006437A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/34Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment

Definitions

  • the technology disclosed in this specification relates to a component mounter that mounts electronic components on a circuit board, and more particularly, to a controller that is mounted on the component mounter.
  • Patent Document 1 Japanese Patent Publication No. 2012-018617 discloses an electronic component mounting apparatus for mounting electronic components on a substrate.
  • the electronic component mounting apparatus includes a control device having a ring buffer memory.
  • the control device executes the control program and controls each part of the electronic component mounting apparatus to mount the electronic component on the board.
  • the control device stores log data, which is execution history information of the control program, in the ring buffer memory.
  • a processor executes a plurality of tasks and stores log information related to each of the plurality of tasks in a ring buffer.
  • the operator diagnoses the abnormality of the component mounter from each state of a plurality of tasks using log information stored in the ring buffer. For this reason, in order to diagnose the state of the component mounter, log information regarding all tasks is preferably stored in the ring buffer.
  • log information related to a plurality of tasks is stored in a single ring buffer. According to such a configuration, the log information of one task may be overwritten by the log information of another task. As a result, the log information of all tasks may not be stored in the ring buffer. In this case, there is a problem that there is a task that cannot confirm the state at the time of occurrence of the abnormality.
  • the controller disclosed in this specification is mounted on a component mounter that mounts electronic components on a circuit board, and controls the operation of at least a part of the component mounter.
  • the controller includes a processor that executes a plurality of tasks and a ring buffer that stores log information related to the tasks executed by the processor.
  • the ring buffer is divided into partial ring buffers for storing log information when the processor executes the task for each of a plurality of tasks, and the processor performs the task for each of the plurality of tasks for each processing cycle. Is stored in a partial ring buffer corresponding to the task.
  • the ring buffer that stores log information is divided into a partial ring buffer that stores log information related to the task for each of a plurality of tasks. That is, only log information related to a specific task is stored in the partial ring buffer. According to such a configuration, it is possible to prevent log information relating to one task from being overwritten by log information relating to another task. As a result, log information regarding each of the plurality of tasks is stored in the ring buffer.
  • FIG. 10 is a diagram illustrating a flowchart of ring buffer division processing according to the second embodiment. It is a conceptual diagram explaining the main RAM of a modification.
  • the processor may be configured to store time information corresponding to the log information in the partial ring buffer when the log information is stored in the partial ring buffer. According to such a configuration, the operator can confirm the time when the log information is stored by confirming the time information.
  • the processor calculates, for each of a plurality of tasks, the occupation ratio of the task in the total processing capacity of the processor for each predetermined setting period, and each of the plurality of tasks for each setting period.
  • the ring buffer may be divided into partial ring buffers having a size corresponding to the occupation rate calculated for the task. According to such a configuration, the size of the partial ring buffer is determined based on the task occupancy ratio in the total processing capacity of the processor. As a result, the ring buffer can be divided into partial ring buffers having appropriate sizes.
  • the processor calculates the information size of the log information stored in each of the plurality of partial ring buffers during the set period for each set period and sets a plurality of tasks for each set period. For each of these, a partial ring buffer having a size corresponding to a ratio between the information size calculated for the task and the information size of all the log information stored in the set period may be divided. According to such a configuration, the partial ring buffer is divided based on the information size of the log information stored in each of the plurality of partial ring buffers during a predetermined setting period. As a result, the ring buffer can be divided into partial ring buffers having appropriate sizes.
  • a sub-memory for storing a plurality of log information may be further provided.
  • the processor saves log information stored in each of the plurality of partial ring buffers to the sub memory, and then saves the log information to the sub memory.
  • the log information saved in the sub memory is saved in each of the multiple partial ring buffers. May be.
  • the log information before the change is saved in the sub memory, and the log information saved in the sub memory after the size change is divided. Return to buffer. Thereby, the log information is appropriately rewritten before and after the size change, and the log information related to the task corresponding to the partial ring buffer can be stored in the divided partial ring buffer.
  • the component mounter 10 is a device for mounting the electronic component 4 on the circuit board 2.
  • the component mounter 10 is also referred to as a surface mounter or a chip mounter.
  • the component mounting machine 10 is provided together with a solder printer, other component mounting machines, and a board inspection machine, and constitutes a series of mounting lines.
  • the component mounter 10 includes a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging unit 20, and a moving device 18 that moves the mounting head 16 and the imaging unit 20.
  • Each component feeder 12 accommodates a plurality of electronic components 4.
  • the component feeder 12 is detachably attached to the feeder holding unit 14 and supplies the electronic component 4 to the mounting head 16.
  • the specific configuration of the component feeder 12 is not particularly limited.
  • Each component feeder 12 is, for example, a tape feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. Any of the bulk type feeders that accommodates the ink at random.
  • the moving device 18 is an example of a moving device that moves the mounting head 16 and the imaging unit 20 between the component feeder 12 and the circuit board 2.
  • the moving device 18 of the present embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction.
  • the moving device 18 includes a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, and a servo motor 30 (shown in FIG. 2) that drives the moving mechanism. .
  • the moving device 18 is disposed above the component feeder 12 and the circuit board 2.
  • the mounting head 16 and the imaging unit 20 are attached to the moving base 18a.
  • the mounting head 16 and the imaging unit 20 are moved above the component feeder 12 and above the circuit board 2 by the moving device 18.
  • the mounting head 16 includes a suction nozzle 6 that sucks the electronic component 4.
  • the suction nozzle 6 is detachable from the mounting head 16.
  • the suction nozzle 6 is attached to the mounting head 16 so as to be movable in the Z direction (vertical direction in the drawing).
  • the suction nozzle 6 is configured to be moved up and down by a servo motor 30 (shown in FIG. 2) accommodated in the mounting head 16 and to suck the electronic component 4.
  • a servo motor 30 shown in FIG. 2
  • the suction nozzle 6 is moved downward until the lower surface (suction surface) of the suction nozzle 6 contacts the electronic component 4 accommodated in the component feeder 12. Move.
  • the electronic component 4 is sucked by the suction nozzle 6 and the suction nozzle 6 is moved upward.
  • the mounting head 16 is positioned with respect to the circuit board 2 by the moving device 18.
  • the electronic component 4 is mounted on the circuit board 2 by lowering the suction nozzle 6 toward the circuit board 2.
  • the above operation by the mounting head 16 is referred to as mounting processing.
  • the imaging unit 20 is attached to the moving base 18a. For this reason, when the mounting head 16 moves, the imaging unit 20 also moves together.
  • the imaging unit 20 includes a camera support unit 22 and a camera 24.
  • the camera support unit 22 is attached to the moving base 18a.
  • a camera 24 is attached to the camera support portion 22.
  • the camera 24 is disposed on the side of the suction nozzle 6 (the Y direction in the drawing) and captures a side image of the suction nozzle 6.
  • the area of the suction nozzle 6 included in the imaging area of the camera 24 can be adjusted by moving the suction nozzle 6 up and down by the mounting head 16.
  • the board conveyor 26 is a device that carries the circuit board 2 into the component mounter 10, positions it on the component mounter 10, and carries it out of the component mounter 10.
  • the substrate conveyor 26 of this embodiment includes, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit board 2 from below, and a servo motor 30 that drives the belt conveyor (FIG. 2). Can be configured.
  • the operation panel 28 is an input device that receives an instruction from the worker and an interface device that displays various types of information to the worker.
  • the controller 40 is connected to the host controller 110, the servo motor 30, and the camera 24.
  • the controller 40 controls the plurality of servo motors 30 based on the command input from the host control device 110 and the side image input from the camera 24 and mounts the electronic component 4 on the circuit board 2.
  • the controller 40 includes a CPU 50, a ROM 60, a main RAM 70, and a sub RAM 80.
  • the CPU 50 is a processor that controls the operation of the controller 40.
  • the CPU 50 is connected to the ROM 60, the main RAM 70, and the sub RAM 80.
  • a plurality of tasks 62 are stored in the ROM 60.
  • the plurality of tasks 62 include a servo processing task 62 a that controls the operation (such as torque) of the servo motor 30, a camera processing task 62 b that processes a side image transmitted from the camera 24, and inputs from the host controller 110 and the camera 24.
  • An IO processing task 62c for processing information and output information to the servo motor 30 is included.
  • the CPU 50 mounts the electronic component 4 on the circuit board 2 by executing a plurality of tasks 62 stored in the ROM 60. Note that the occupation ratio of each of the plurality of tasks 62 occupying the entire processing capacity of the CPU 50 changes dynamically depending on the processing contents executed by the CPU 50.
  • the main RAM 70 includes a ring buffer.
  • Log data 74 corresponding to the task 62 executed by the CPU 50 is stored in the ring buffer of the main RAM 70.
  • the main RAM 70 records information about log data 74 and addresses 72 (A 1 , A 2 ,..., A n ) where the log data 74 is stored.
  • the log data 74 includes log information 74a (L 1 , L 2 ,..., L n ) related to the task 62, and time information 74b (T 1 , T2,..., T n corresponding to the log information 74a. )It is included.
  • the CPU 50 transmits the log data 74 stored in the main RAM 70 to the host controller 110 based on a command input from the host controller 110.
  • the operator can confirm the state of the task 62 (that is, the state of the component mounter 10) by analyzing the log data 74 transmitted to the host controller 110.
  • the ring buffer of the main RAM 70 includes a plurality of partial ring buffers 76a for storing log data 74 when the CPU 50 executes the tasks 62a to 62c for each of the tasks 62a to 62c. It is divided into 76b and 76c. Specifically, the ring buffer of the main RAM 70 includes a first partial ring buffer 76a corresponding to the servo processing task 62a, a second partial ring buffer 76b corresponding to the camera processing task 62b, and a first partial ring buffer 76c corresponding to the IO processing task 62c. It is divided into three partial ring buffers 76c.
  • the plurality of partial ring buffers 76a, 76b, and 76c have the same structure except for the size.
  • partial ring buffer 76 when any one of the plurality of partial ring buffers 76a, 76b, and 76c is expressed without distinction, it is expressed as “partial ring buffer 76”.
  • the CPU 50 executes a plurality of tasks 62 for each processing cycle, and for each of the plurality of tasks 62 executed for each processing cycle, the log data 74 corresponding to the task 62 is a portion corresponding to the task 62. Save in the ring buffer 76. That is, only the log data 74 of the task 62 corresponding to the partial ring buffer 76 is stored in the partial ring buffer 76.
  • the log data 74 is stored in the partial ring buffer 76a.
  • the CPU 50 transmits log data 74 stored in the main RAM 70 to the upper control device 110 based on a command from the upper control device 110.
  • the worker confirms the state of the task 62 being executed by the component mounter 10 by analyzing the log data 74 received by the host controller 110.
  • main RAM 70 includes a plurality of partial ring buffers 76, log data 74 corresponding to each of the plurality of tasks 62a to 62c is reliably transmitted to the host control device 110. Thereby, the worker can appropriately determine the state of each of the plurality of tasks 62a to 62c.
  • the occupation ratio of each of the plurality of tasks 62a to 62c occupying the entire processing capacity of the CPU 50 changes dynamically.
  • a task 62 with a higher occupation rate generates more log data 74 than a task 62 with a lower occupation rate.
  • the size of the partial ring buffer 76 can be dynamically changed according to the occupation ratio of the task 62 in the ring buffer division processing described later.
  • the size of the partial ring buffer 76 at the start of operation of the component mounter 10 (default) is preferably set based on the occupation rate of each task in the operation start process of the component mounter 10.
  • the sub RAM 80 includes a ring buffer.
  • log data 74 stored in the partial ring buffers 76a to 76c is temporarily stored during ring buffer division processing described later.
  • the size of the sub RAM 80 is preferably larger than the size of the main RAM 70.
  • Ring buffer division process is a process executed in the first every set period t 1.
  • the first setting period t 1 may be set in advance or may be configured to be input from the operation panel 28. The shorter the first setting period t 1 , the easier it is to deal with when the occupation rate of each task changes abruptly, for example, when the component mounter 10 fails.
  • the size of the ring buffer of the main RAM 70 is, for example, 100 Mbytes, and the sizes of the partial ring buffers 76a, 76b, 76c before the ring buffer division processing are, for example, 20 Mbytes, 30 Mbytes, and 50 Mbytes.
  • the size of the partial ring buffers 76a to 76c before the ring buffer division processing is set as the first division size
  • the size of the partial ring buffers 76a to 76c after the ring buffer division processing is set as the second division size.
  • step S12 CPU 50, for each of a plurality of tasks 62a ⁇ 62c of executing the first set time period t 1, to calculate the occupation ratio of each task 62a ⁇ 62c to the total capacity of the CPU 50.
  • step S14 the CPU 50 sets the second divided sizes of the partial ring buffers 76a to 76c based on the occupation ratios of the tasks 62a to 62c calculated in step S12. As described above, the tasks 62a to 62c having a high occupation rate of the CPU 50 generate more log data 74 than the tasks 62a to 62c having a low occupation rate.
  • the CPU 50 makes the size of the partial ring buffers 76a to 76c corresponding to the tasks 62a to 62c having a high occupation ratio larger than the size of the partial ring buffers 76a to 76c corresponding to the tasks 62a to 62c having a low occupation ratio.
  • the second division size is set. Specifically, the CPU 50 sets the second divided size of the partial ring buffer 76 by multiplying the size of the ring buffer of the main RAM 70 by the occupation rates of the tasks 62a to 62c.
  • the partial ring buffers 76a and 76b , 76c are set to 60 Mbytes, 20 Mbytes, and 20 Mbytes, respectively.
  • step S ⁇ b> 16 the CPU 50 saves the log data 74 stored in the ring buffer of the main RAM 70 in the sub RAM 80.
  • the log data 74 stored in the partial ring buffers 76a to 76c is saved in the sub RAM 80 for each of the partial ring buffers 76a to 76c. That is, the sub RAM 80 is divided into a plurality of areas according to the tasks 62a to 62c, and the log data 74 of the task 62 corresponding to each divided area is stored.
  • step S18 the CPU 50 divides the ring buffer of the main RAM 70 into the second division size set in step S14. Note that when the ring buffer of the main RAM 70 is divided into the second division size, the log data 74 secured in the ring buffer of the main RAM 70 is cleared.
  • step S20 the CPU 50 determines whether or not the second division size of the partial ring buffer 76 is equal to or larger than the first division size. If the second division size of the partial ring buffer 76 is greater than or equal to the first division size (YES in S20), the CPU 50 proceeds to step S22.
  • step S22 the CPU 50 re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub RAM 80 in the partial ring buffer 76 (for example, the partial ring buffer 76a in FIG. 6). In this case, all log data 74 stored in the partial ring buffer 76 before the ring buffer division processing can be stored in the partial ring buffer 76 after changing to the second division size.
  • step S24 the CPU 50 selectively re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub-RAM 80 in the partial ring buffer 76 (for example, the partial ring buffer 76b, FIG. 76c). In this case, all of the log data 74 stored before the ring buffer division processing cannot be stored in the partial ring buffer 76 changed to the second division size. Specifically, the CPU 50 preferentially stores the new log data 74 of the time information 74b.
  • the ring buffer of the main RAM 70 is divided into a plurality of partial ring buffers 76 that store the log data 74 of the plurality of tasks 62a to 62c. .
  • the log data 74 stored in the partial ring buffer 76 is overwritten by the log data 74 related to the task 62 corresponding to the other partial ring buffer 76.
  • the worker can appropriately determine the states of the plurality of tasks 62.
  • the controller 40 executes a ring buffer division process every first setting period t 1 .
  • the controller 40 divides the ring buffer of the main RAM 70 according to the occupation ratio of each task 62.
  • the size of the partial ring buffer 76 can be adjusted to an appropriate size by matching the size of the partial ring buffer 76 with the dynamic change of the occupation ratio of each task 62 by the ring buffer division processing.
  • the controller 40 saves the log data 74 in the sub RAM 80 before changing the size of the partial ring buffer 76, and the log data 74 stored in the ring buffer of the main RAM 70 before the change. Has cleared.
  • logs corresponding to a plurality of tasks 62 are stored in the partial ring buffer 76 after the size change.
  • Data 74 may be stored.
  • the log data 74 is saved in the sub RAM 80 before the size of the partial ring buffer 76 is changed.
  • a component mounter 10 according to the second embodiment will be described with reference to FIG.
  • symbol is attached
  • the ring buffer dividing process is different from the ring buffer dividing process of the first embodiment.
  • Ring buffer division process of the second embodiment is the processing executed in the second every set period t 2. Note that the second set time period t 2 can be set similarly to the first setting period t 1.
  • step S112 CPU 50, during the second set time period t 2, and calculates the information size of the log data 74 stored in each of the plurality of partial ring buffers 76a ⁇ 76c.
  • step S114 CPU 50 has a ring buffer of the main RAM70 during the second set time period t 2 (i.e., partial ring buffers 76a ⁇ 76c) information size of the saved log data 74 (hereinafter, the first information size
  • the ratio of the information size of the log data 74 stored in each of the partial ring buffers 76a to 76c is calculated.
  • the first information size is a value obtained by adding the information sizes of the partial ring buffers 76a, 76b, and 76c.
  • step S116 the CPU 50 calculates the second division size of the partial ring buffers 76a to 76c based on the information size ratio of the partial ring buffers 76a to 76c. Specifically, the CPU 50 calculates the second divided size of the partial ring buffers 76a to 76c by multiplying the size of the ring buffer of the main RAM 70 by the ratio of the partial ring buffers 76a to 76c calculated in step S114. . For example, a case will be described in which the size of the ring buffer of the main RAM 70 is 100 Mbytes and the information sizes of the partial ring buffers 76a, 76b, and 76c are 6 Mbytes, 2 Mbytes, and 2 Mbytes, respectively.
  • the first information size is 10 Mbytes
  • the ratios of the partial ring buffers 76a, 76b, and 76c are calculated as 60%, 20%, and 20%. Therefore, the second division sizes of the partial ring buffers 76a, 76b, and 76c are calculated as 60 Mbytes, 20 Mbytes, and 20 Mbytes (see FIG. 6).
  • step S 118 the CPU 50 saves the log data 74 stored in the ring buffer of the main RAM 70 in the sub RAM 80.
  • step S120 the CPU 50 changes the partial ring buffers 76a to 76c to the second division size set in step S116.
  • step S122 the CPU 50 determines for each of the partial ring buffers 76a to 76c whether or not the second divided size of the partial ring buffers 76a to 76c is equal to or larger than the first divided size. If the second division size of the partial ring buffer 76 is greater than or equal to the first division size (YES in S122), the CPU 50 proceeds to step S124. In step S124, the CPU 50 re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub RAM 80 in the partial ring buffer 76 (for example, the partial ring buffer 76a in FIG. 6).
  • step S126 the CPU 50 selectively re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub RAM 80 so that the data amount corresponds to the size of the partial ring buffer 76 ( For example, the partial ring buffers 76b and 76c in FIG. Specifically, the CPU 50 preferentially stores the new log data 74 of the time information 74b.
  • the controller 40 of the second embodiment the second every set period t 2, performing a ring buffer division process.
  • the controller 40 calculates the second division size of the partial ring buffers 76a to 76c based on the ratio of the information sizes of the partial ring buffers 76a to 76c can also dynamically change the log output amount of each task 62a to 62c. Can be matched. Thereby, the size of the partial ring buffers 76a to 76c can be adjusted to an appropriate size.
  • the controller 40 includes two RAMs, a main RAM 70 and a sub RAM 80.
  • the controller 40 may be composed only of the main RAM 70.
  • the main RAM 70 is divided into a program area 172, a main log area 174, and a sub log area 178.
  • the size of the main RAM is 2 Gbytes
  • the size of the program area 172, the main log area 174, and the sublog area 178 is divided into 1 Gbyte, 500 Mbyte, and 500 Mbyte.
  • the program area 172 information regarding the processing of the tasks 62a to 62c is stored.
  • the main log area 174 is divided into a plurality of partial ring buffers 176a to 176c, and log data 74 corresponding to each of the tasks 62a to 62a is stored.
  • the sizes of the plurality of partial ring buffers 176 are dynamically changed by ring buffer division processing.
  • Log data 74 stored in the main log area 174 (specifically, the partial ring buffers 176a to 176c) is temporarily stored in the sub-log area 178 during the ring buffer division processing. According to this configuration, the same effects as those of the embodiments can be obtained.

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Abstract

A controller that is mounted on a component mounting machine for mounting electronic components on a circuit substrate, and that controls at least some operations of the component mounting machine, wherein: said controller is provided with a processor for executing a plurality of tasks, and a ring buffer for storing log information relating to the tasks executed by the processor; the ring buffer is divided into partial ring buffers, each of which stores log information relating to execution of one of the plurality of tasks by the processor; and the processor is configured to store log information relating to each task of the plurality of tasks in the corresponding one of the partial ring buffers on a per processing cycle basis.

Description

部品実装機に装備されるコントローラController equipped on component mounter
 本明細書に開示する技術は、電子部品を回路基板に実装する部品実装機に関し、詳しくは、部品実装機に装備されるコントローラに関する。 The technology disclosed in this specification relates to a component mounter that mounts electronic components on a circuit board, and more particularly, to a controller that is mounted on the component mounter.
 特許文献1(日本国特許公開公報2012-018617号公報)には、電子部品を基板に実装する電子部品実装用装置が開示されている。電子部品実装用装置は、リングバッファメモリを有する制御装置を備えている。制御装置は、制御プログラムを実行し、電子部品実装用装置の各部を制御することで、電子部品を基板に実装する。制御装置は、制御プログラムの実行履歴情報であるログデータを、リングバッファメモリに保存する。 Patent Document 1 (Japanese Patent Publication No. 2012-018617) discloses an electronic component mounting apparatus for mounting electronic components on a substrate. The electronic component mounting apparatus includes a control device having a ring buffer memory. The control device executes the control program and controls each part of the electronic component mounting apparatus to mount the electronic component on the board. The control device stores log data, which is execution history information of the control program, in the ring buffer memory.
 一般的に、部品実装機では、プロセッサは複数のタスクを実行し、複数のタスクのそれぞれに関するログ情報をリングバッファに保存する。部品実装機に異常が発生した時は、作業者は、リングバッファに保存されているログ情報を用いて、複数のタスクのそれぞれの状態から部品実装機の異常を診断する。このため、部品実装機の状態を診断するためには、リングバッファに全てのタスクに関するログ情報が保存されていることが好ましい。特許文献1の電子部品実装用装置においては、単一のリングバッファに、複数のタスクに関するログ情報が保存される。このような構成によると、1つのタスクのログ情報が、他のタスクのログ情報により上書きされてしまう場合がある。これにより、リングバッファに、全てのタスクのログ情報が保存されていない場合が生じる。この場合、異常発生時の状態を確認することができないタスクがあるという問題が生じる。 Generally, in a component mounter, a processor executes a plurality of tasks and stores log information related to each of the plurality of tasks in a ring buffer. When an abnormality occurs in the component mounter, the operator diagnoses the abnormality of the component mounter from each state of a plurality of tasks using log information stored in the ring buffer. For this reason, in order to diagnose the state of the component mounter, log information regarding all tasks is preferably stored in the ring buffer. In the electronic component mounting apparatus disclosed in Patent Document 1, log information related to a plurality of tasks is stored in a single ring buffer. According to such a configuration, the log information of one task may be overwritten by the log information of another task. As a result, the log information of all tasks may not be stored in the ring buffer. In this case, there is a problem that there is a task that cannot confirm the state at the time of occurrence of the abnormality.
 本明細書に開示するコントローラは、電子部品を回路基板に実装する部品実装機に装備され、部品実装機の少なくとも一部の動作を制御する。コントローラは、複数のタスクを実行するプロセッサと、プロセッサが実行したタスクに関するログ情報を記憶するリングバッファと、を備えている。リングバッファは、複数のタスク毎に、当該タスクをプロセッサが実行したときのログ情報を記憶する部分リングバッファに分割されており、プロセッサは、処理周期毎に、複数のタスクのそれぞれについて、当該タスクに関するログ情報を、当該タスクに対応する部分リングバッファに保存するように構成されている。 The controller disclosed in this specification is mounted on a component mounter that mounts electronic components on a circuit board, and controls the operation of at least a part of the component mounter. The controller includes a processor that executes a plurality of tasks and a ring buffer that stores log information related to the tasks executed by the processor. The ring buffer is divided into partial ring buffers for storing log information when the processor executes the task for each of a plurality of tasks, and the processor performs the task for each of the plurality of tasks for each processing cycle. Is stored in a partial ring buffer corresponding to the task.
 上記のコントローラでは、ログ情報を記憶するリングバッファが、複数のタスク毎に、当該タスクに関するログ情報を記憶する部分リングバッファに分割されている。すなわち、部分リングバッファには、特定のタスクに関するログ情報のみが記憶される。このような構成によると、1つのタスクに関するログ情報が、他のタスクに関するログ情報によって上書きされることを防止することができる。この結果、リングバッファには、複数のタスクのそれぞれに関するログ情報が保存される。 In the above controller, the ring buffer that stores log information is divided into a partial ring buffer that stores log information related to the task for each of a plurality of tasks. That is, only log information related to a specific task is stored in the partial ring buffer. According to such a configuration, it is possible to prevent log information relating to one task from being overwritten by log information relating to another task. As a result, log information regarding each of the plurality of tasks is stored in the ring buffer.
コントローラが装備されている部品実装機の構成を模式的に表す側面図である。It is a side view which represents typically the structure of the component mounting machine with which the controller is equipped. コントローラの構成を示すブロック図である。It is a block diagram which shows the structure of a controller. メインRAMに保存されるタスクに関する情報を説明する図である。It is a figure explaining the information regarding the task preserve | saved at main RAM. 部分リングバッファを説明する概念図である。It is a conceptual diagram explaining a partial ring buffer. 実施例1のリングバッファ分割処理のフローチャートを示す図である。It is a figure which shows the flowchart of the ring buffer division | segmentation process of Example 1. FIG. リングバッファ分割処理により分割される前後の部分リングバッファの状態を説明する概念図である。It is a conceptual diagram explaining the state of the partial ring buffer before and behind divided | segmented by a ring buffer division | segmentation process. 実施例2のリングバッファ分割処理のフローチャートを示す図である。FIG. 10 is a diagram illustrating a flowchart of ring buffer division processing according to the second embodiment. 変形例のメインRAMを説明する概念図である。It is a conceptual diagram explaining the main RAM of a modification.
 以下に記載する技術要素は、それぞれ独立した技術要素であって、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時請求項記載の組合せに限定されるものではない。 The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.
(特徴1)プロセッサは、ログ情報を部分リングバッファに保存するときに、当該ログ情報に対応する時刻情報を、当該部分リングバッファに保存するように構成されていてもよい。このような構成によると、作業者は、時刻情報を確認することで、ログ情報が保存された時刻を確認することができる。 (Feature 1) The processor may be configured to store time information corresponding to the log information in the partial ring buffer when the log information is stored in the partial ring buffer. According to such a configuration, the operator can confirm the time when the log information is stored by confirming the time information.
(特徴2)プロセッサは、予め定められた設定期間毎に、複数のタスクのそれぞれについて、当該プロセッサの全処理能力に占める当該タスクの占有率を算出し、設定期間毎に、複数のタスクのそれぞれについて、当該タスクについて算出された占有率に応じたサイズの部分リングバッファに前記リングバッファを分割してもよい。このような構成によると、プロセッサの全処理能力に占めるタスクの占有率に基づいて、部分リングバッファのサイズが決定される。これにより、リングバッファを、適切なサイズの部分リングバッファに分割することができる。 (Characteristic 2) The processor calculates, for each of a plurality of tasks, the occupation ratio of the task in the total processing capacity of the processor for each predetermined setting period, and each of the plurality of tasks for each setting period. The ring buffer may be divided into partial ring buffers having a size corresponding to the occupation rate calculated for the task. According to such a configuration, the size of the partial ring buffer is determined based on the task occupancy ratio in the total processing capacity of the processor. As a result, the ring buffer can be divided into partial ring buffers having appropriate sizes.
(特徴3)プロセッサは、予め定められた設定期間毎に、当該設定期間の間に複数の部分リングバッファのそれぞれに保存されたログ情報の情報サイズを算出し、設定期間毎に、複数のタスクのそれぞれについて、当該タスクについて算出された情報サイズと、当該設定期間に保存された全てのログ情報の情報サイズとの比に応じたサイズの部分リングバッファに分割してもよい。このような構成によると、予め定められた設定期間の間に複数の部分リングバッファのそれぞれに保存されたログ情報の情報サイズに基づいて、部分リングバッファが分割される。これにより、リングバッファを、適切なサイズの部分リングバッファに分割することができる。 (Feature 3) The processor calculates the information size of the log information stored in each of the plurality of partial ring buffers during the set period for each set period and sets a plurality of tasks for each set period. For each of these, a partial ring buffer having a size corresponding to a ratio between the information size calculated for the task and the information size of all the log information stored in the set period may be divided. According to such a configuration, the partial ring buffer is divided based on the information size of the log information stored in each of the plurality of partial ring buffers during a predetermined setting period. As a result, the ring buffer can be divided into partial ring buffers having appropriate sizes.
(特徴4)複数のログ情報を記憶するサブメモリをさらに備えていてもよい。プロセッサは、複数の部分リングバッファのいずれかのサイズを変更するときは、複数の部分リングバッファのそれぞれに保存されているログ情報をサブメモリに退避し、ログ情報を前記サブメモリに退避した後に、複数の部分リングバッファのサイズを変更し、複数の部分リングバッファのサイズを変更した後に、サブメモリに退避されているログ情報を、複数の部分リングバッファのそれぞれに保存するように構成されていてもよい。このような構成によると、いずれかの部分リングバッファのサイズを変更するときは、変更前のログ情報がサブメモリに退避され、サイズ変更後にサブメモリに退避されているログ情報が分割されたリングバッファに復帰する。これにより、サイズ変更の前後でログ情報が適切に書き換えられ、分割後の部分リングバッファに、当該部分リングバッファに対応するタスクに関するログ情報を保存することができる。 (Feature 4) A sub-memory for storing a plurality of log information may be further provided. When changing the size of any of the plurality of partial ring buffers, the processor saves log information stored in each of the plurality of partial ring buffers to the sub memory, and then saves the log information to the sub memory. After changing the size of multiple partial ring buffers and changing the size of multiple partial ring buffers, the log information saved in the sub memory is saved in each of the multiple partial ring buffers. May be. According to such a configuration, when changing the size of any partial ring buffer, the log information before the change is saved in the sub memory, and the log information saved in the sub memory after the size change is divided. Return to buffer. Thereby, the log information is appropriately rewritten before and after the size change, and the log information related to the task corresponding to the partial ring buffer can be stored in the divided partial ring buffer.
 次に、図1~図4を用いて、コントローラ40を装備する部品実装機10について説明する。部品実装機10は、回路基板2に電子部品4を実装する装置である。部品実装機10は、表面実装機やチップマウンタとも称される。通常、部品実装機10は、はんだ印刷機、他の部品実装機及び基板検査機とともに併設され、一連の実装ラインを構成する。 Next, the component mounter 10 equipped with the controller 40 will be described with reference to FIGS. The component mounter 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounter 10 is also referred to as a surface mounter or a chip mounter. Usually, the component mounting machine 10 is provided together with a solder printer, other component mounting machines, and a board inspection machine, and constitutes a series of mounting lines.

 図1に示すように、部品実装機10は、複数の部品フィーダ12と、フィーダ保持部14と、実装ヘッド16と、撮像ユニット20と、実装ヘッド16及び撮像ユニット20を移動させる移動装置18と、基板コンベア26と、操作パネル28と、コントローラ40を備える。

As shown in FIG. 1, the component mounter 10 includes a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging unit 20, and a moving device 18 that moves the mounting head 16 and the imaging unit 20. A substrate conveyor 26, an operation panel 28, and a controller 40.
 各々の部品フィーダ12は、複数の電子部品4を収容している。部品フィーダ12は、フィーダ保持部14に着脱可能に取り付けられ、実装ヘッド16へ電子部品4を供給する。部品フィーダ12の具体的な構成は特に限定されない。各々の部品フィーダ12は、例えば、巻テープ上に複数の電子部品4を収容するテープ式フィーダ、トレイ上に複数の電子部品4を収容するトレイ式フィーダ、又は、容器内に複数の電子部品4をランダムに収容するバルク式フィーダのいずれであってもよい。 Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding unit 14 and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. Any of the bulk type feeders that accommodates the ink at random.
 移動装置18は、部品フィーダ12と回路基板2との間で実装ヘッド16及び撮像ユニット20を移動させる移動装置の一例である。本実施例の移動装置18は、移動ベース18aをX方向及びY方向に移動させるXYロボットである。移動装置18は、移動ベース18aを案内するガイドレールや、移動ベース18aをガイドレールに沿って移動させる移動機構や、その移動機構を駆動するサーボモータ30(図2に図示)によって構成されている。移動装置18は、部品フィーダ12及び回路基板2の上方に配置されている。移動ベース18aに対して実装ヘッド16及び撮像ユニット20が取付けられている。実装ヘッド16及び撮像ユニット20は、移動装置18によって部品フィーダ12の上方及び回路基板2の上方を移動する。 The moving device 18 is an example of a moving device that moves the mounting head 16 and the imaging unit 20 between the component feeder 12 and the circuit board 2. The moving device 18 of the present embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction. The moving device 18 includes a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, and a servo motor 30 (shown in FIG. 2) that drives the moving mechanism. . The moving device 18 is disposed above the component feeder 12 and the circuit board 2. The mounting head 16 and the imaging unit 20 are attached to the moving base 18a. The mounting head 16 and the imaging unit 20 are moved above the component feeder 12 and above the circuit board 2 by the moving device 18.

 実装ヘッド16は、電子部品4を吸着する吸着ノズル6を備えている。吸着ノズル6は、実装ヘッド16に対して着脱可能とされている。吸着ノズル6は、Z方向(図面上下方向)に移動可能に実装ヘッド16に取り付けられている。吸着ノズル6は、実装ヘッド16に収容されたサーボモータ30(図2に図示)によって上下方向に昇降すると共に、電子部品4を吸着可能に構成されている。実装ヘッド16により電子部品4を回路基板2に実装するには、まず、部品フィーダ12に収容された電子部品4に吸着ノズル6の下面(吸着面)が当接するまで、吸着ノズル6を下方に移動させる。次いで、吸着ノズル6に電子部品4を吸着し、吸着ノズル6を上方に移動させる。次いで、移動装置18により実装ヘッド16を回路基板2に対して位置決めする。次いで、吸着ノズル6を回路基板2に向かって下降させることで、回路基板2に電子部品4を実装する。本明細書では、実装ヘッド16による上記の動作を実装処理という。

The mounting head 16 includes a suction nozzle 6 that sucks the electronic component 4. The suction nozzle 6 is detachable from the mounting head 16. The suction nozzle 6 is attached to the mounting head 16 so as to be movable in the Z direction (vertical direction in the drawing). The suction nozzle 6 is configured to be moved up and down by a servo motor 30 (shown in FIG. 2) accommodated in the mounting head 16 and to suck the electronic component 4. In order to mount the electronic component 4 on the circuit board 2 by the mounting head 16, first, the suction nozzle 6 is moved downward until the lower surface (suction surface) of the suction nozzle 6 contacts the electronic component 4 accommodated in the component feeder 12. Move. Next, the electronic component 4 is sucked by the suction nozzle 6 and the suction nozzle 6 is moved upward. Next, the mounting head 16 is positioned with respect to the circuit board 2 by the moving device 18. Next, the electronic component 4 is mounted on the circuit board 2 by lowering the suction nozzle 6 toward the circuit board 2. In the present specification, the above operation by the mounting head 16 is referred to as mounting processing.
 撮像ユニット20は、移動ベース18aに取り付けられている。このため、実装ヘッド16が移動すると、撮像ユニット20も一体となって移動する。撮像ユニット20は、カメラ支持部22とカメラ24を備えている。カメラ支持部22は、移動ベース18aに取り付けられている。カメラ支持部22には、カメラ24が取付けられている。カメラ24は、吸着ノズル6の側方(図面Y方向)に配置されており、吸着ノズル6の側面画像を撮像する。なお、実装ヘッド16により、吸着ノズル6を上下方向に昇降することで、カメラ24の撮像領域に含まれる吸着ノズル6の領域を調整することができる。 The imaging unit 20 is attached to the moving base 18a. For this reason, when the mounting head 16 moves, the imaging unit 20 also moves together. The imaging unit 20 includes a camera support unit 22 and a camera 24. The camera support unit 22 is attached to the moving base 18a. A camera 24 is attached to the camera support portion 22. The camera 24 is disposed on the side of the suction nozzle 6 (the Y direction in the drawing) and captures a side image of the suction nozzle 6. In addition, the area of the suction nozzle 6 included in the imaging area of the camera 24 can be adjusted by moving the suction nozzle 6 up and down by the mounting head 16.

 基板コンベア26は、回路基板2の部品実装機10への搬入、部品実装機10への位置決め、及び部品実装機10からの搬出を行う装置である。本実施例の基板コンベア26は、例えば、一対のベルトコンベアと、ベルトコンベアに取り付けられると共に回路基板2を下方から支持する支持装置(図示省略)と、ベルトコンベアを駆動するサーボモータ30(図2に図示)により構成することができる。操作パネル28は、作業者の指示を受け付ける入力装置であるとともに、作業者に対して各種の情報を表示するインターフェース装置でもある。

The board conveyor 26 is a device that carries the circuit board 2 into the component mounter 10, positions it on the component mounter 10, and carries it out of the component mounter 10. The substrate conveyor 26 of this embodiment includes, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit board 2 from below, and a servo motor 30 that drives the belt conveyor (FIG. 2). Can be configured. The operation panel 28 is an input device that receives an instruction from the worker and an interface device that displays various types of information to the worker.
 図2に示すように、コントローラ40は、上位制御装置110、サーボモータ30、カメラ24に接続されている。コントローラ40は、上位制御装置110から入力される指令及びカメラ24から入力される側面画像に基づいて、複数のサーボモータ30を制御し、電子部品4を回路基板2に実装する。 As shown in FIG. 2, the controller 40 is connected to the host controller 110, the servo motor 30, and the camera 24. The controller 40 controls the plurality of servo motors 30 based on the command input from the host control device 110 and the side image input from the camera 24 and mounts the electronic component 4 on the circuit board 2.
 コントローラ40は、CPU50と、ROM60と、メインRAM70と、サブRAM80を備えている。CPU50は、コントローラ40の動作を制御するプロセッサである。CPU50は、ROM60、メインRAM70、サブRAM80に接続されている。ROM60には、複数のタスク62が記憶されている。複数のタスク62には、サーボモータ30の動作(トルクなど)を制御するサーボ処理タスク62a、カメラ24から送信される側面画像を処理するカメラ処理タスク62b、上位制御装置110及びカメラ24からの入力情報及びサーボモータ30への出力情報を処理するIO処理タスク62cが含まれている。CPU50は、ROM60に記憶されている複数のタスク62を実行することで、電子部品4を回路基板2に実装する。なお、CPU50の全処理能力に占める複数のタスク62のそれぞれの占有率は、CPU50が実行する処理内容によって、動的に変化する。 The controller 40 includes a CPU 50, a ROM 60, a main RAM 70, and a sub RAM 80. The CPU 50 is a processor that controls the operation of the controller 40. The CPU 50 is connected to the ROM 60, the main RAM 70, and the sub RAM 80. A plurality of tasks 62 are stored in the ROM 60. The plurality of tasks 62 include a servo processing task 62 a that controls the operation (such as torque) of the servo motor 30, a camera processing task 62 b that processes a side image transmitted from the camera 24, and inputs from the host controller 110 and the camera 24. An IO processing task 62c for processing information and output information to the servo motor 30 is included. The CPU 50 mounts the electronic component 4 on the circuit board 2 by executing a plurality of tasks 62 stored in the ROM 60. Note that the occupation ratio of each of the plurality of tasks 62 occupying the entire processing capacity of the CPU 50 changes dynamically depending on the processing contents executed by the CPU 50.
 メインRAM70は、リングバッファを備えている。メインRAM70のリングバッファには、CPU50が実行したタスク62に対応するログデータ74が保存される。図3に示すように、メインRAM70には、ログデータ74とログデータ74が保存されるアドレス72(A、A、・・・、A)に関する情報が記録される。ログデータ74には、タスク62に関するログ情報74a(L、L、・・・、L)、及び、ログ情報74aに対応する時刻情報74b(T、T2、・・・、T)が含まれている。CPU50は、上位制御装置110から入力される指令に基づいて、メインRAM70に保存されているログデータ74を、上位制御装置110に送信する。作業者は、上位制御装置110に送信されるログデータ74を解析することで、タスク62の状態(すなわち、部品実装機10の状態)を確認することができる。 The main RAM 70 includes a ring buffer. Log data 74 corresponding to the task 62 executed by the CPU 50 is stored in the ring buffer of the main RAM 70. As shown in FIG. 3, the main RAM 70 records information about log data 74 and addresses 72 (A 1 , A 2 ,..., A n ) where the log data 74 is stored. The log data 74 includes log information 74a (L 1 , L 2 ,..., L n ) related to the task 62, and time information 74b (T 1 , T2,..., T n corresponding to the log information 74a. )It is included. The CPU 50 transmits the log data 74 stored in the main RAM 70 to the host controller 110 based on a command input from the host controller 110. The operator can confirm the state of the task 62 (that is, the state of the component mounter 10) by analyzing the log data 74 transmitted to the host controller 110.
 また、図4に示すように、メインRAM70のリングバッファは、複数のタスク62a~62c毎に、当該タスク62a~62cをCPU50が実行したときのログデータ74を記憶する複数の部分リングバッファ76a、76b、76cに分割されている。具体的には、メインRAM70のリングバッファは、サーボ処理タスク62aに対応する第1部分リングバッファ76aと、カメラ処理タスク62bに対応する第2部分リングバッファ76bと、IO処理タスク62cに対応する第3部分リングバッファ76cに分割されている。なお、複数の部分リングバッファ76a、76b、76cは、サイズ以外は、同一の構造を有している。以下では、複数の部分リングバッファ76a、76b、76cのいずれか1つを区別なく表す場合に「部分リングバッファ76」と表記する。CPU50は、処理周期毎に複数のタスク62を実行し、かつ、処理周期毎に、実行した複数のタスク62のそれぞれについて、当該タスク62に対応するログデータ74を、当該タスク62に対応する部分リングバッファ76に保存する。すなわち、部分リングバッファ76には、当該部分リングバッファ76に対応するタスク62のログデータ74のみが保存される。例えば、CPU50がサーボ処理タスク62aを実行したときは、そのログデータ74は部分リングバッファ76aに保存される。このような構成によると、部分リングバッファ76a~76cに保存されているログデータ74が、異なる部分リングバッファ76a~76cに対応するログデータ74によって上書きされることを防止することができる。CPU50は、上位制御装置110からの指令に基づいて、メインRAM70に保存されているログデータ74を、上位制御装置110に送信する。作業者は、上位制御装置110が受信するログデータ74を解析することで、部品実装機10が実行しているタスク62の状態を確認する。メインRAM70が、複数の部分リングバッファ76で構成されているため、上位制御装置110には、複数のタスク62a~62cのそれぞれに対応するログデータ74が、確実に送信される。これにより、作業者は、複数のタスク62a~62cのそれぞれの状態を、適切に判断することができる。 As shown in FIG. 4, the ring buffer of the main RAM 70 includes a plurality of partial ring buffers 76a for storing log data 74 when the CPU 50 executes the tasks 62a to 62c for each of the tasks 62a to 62c. It is divided into 76b and 76c. Specifically, the ring buffer of the main RAM 70 includes a first partial ring buffer 76a corresponding to the servo processing task 62a, a second partial ring buffer 76b corresponding to the camera processing task 62b, and a first partial ring buffer 76c corresponding to the IO processing task 62c. It is divided into three partial ring buffers 76c. The plurality of partial ring buffers 76a, 76b, and 76c have the same structure except for the size. Hereinafter, when any one of the plurality of partial ring buffers 76a, 76b, and 76c is expressed without distinction, it is expressed as “partial ring buffer 76”. The CPU 50 executes a plurality of tasks 62 for each processing cycle, and for each of the plurality of tasks 62 executed for each processing cycle, the log data 74 corresponding to the task 62 is a portion corresponding to the task 62. Save in the ring buffer 76. That is, only the log data 74 of the task 62 corresponding to the partial ring buffer 76 is stored in the partial ring buffer 76. For example, when the CPU 50 executes the servo processing task 62a, the log data 74 is stored in the partial ring buffer 76a. According to such a configuration, it is possible to prevent the log data 74 stored in the partial ring buffers 76a to 76c from being overwritten by the log data 74 corresponding to different partial ring buffers 76a to 76c. The CPU 50 transmits log data 74 stored in the main RAM 70 to the upper control device 110 based on a command from the upper control device 110. The worker confirms the state of the task 62 being executed by the component mounter 10 by analyzing the log data 74 received by the host controller 110. Since the main RAM 70 includes a plurality of partial ring buffers 76, log data 74 corresponding to each of the plurality of tasks 62a to 62c is reliably transmitted to the host control device 110. Thereby, the worker can appropriately determine the state of each of the plurality of tasks 62a to 62c.
 上述のように、CPU50の全処理能力に占める複数のタスク62a~62cのそれぞれの占有率は、動的に変化する。一般的に、占有率が大きいタスク62の方が、占有率が小さいタスク62よりも多くのログデータ74を生成する。このため、部分リングバッファ76のサイズは、後述するリングバッファ分割処理において、タスク62の占有率に応じて、動的に変化することが可能に構成されている。なお、部品実装機10の運転開始時(デフォルト)の部分リングバッファ76のサイズは、部品実装機10の運転開始処理における各タスクの占有率に基づいて、設定されることが好ましい。 As described above, the occupation ratio of each of the plurality of tasks 62a to 62c occupying the entire processing capacity of the CPU 50 changes dynamically. In general, a task 62 with a higher occupation rate generates more log data 74 than a task 62 with a lower occupation rate. For this reason, the size of the partial ring buffer 76 can be dynamically changed according to the occupation ratio of the task 62 in the ring buffer division processing described later. Note that the size of the partial ring buffer 76 at the start of operation of the component mounter 10 (default) is preferably set based on the occupation rate of each task in the operation start process of the component mounter 10.
 サブRAM80は、リングバッファを備えている。サブRAM80のリングバッファには、後述するリングバッファ分割処理中に、部分リングバッファ76a~76cに記憶されているログデータ74が一時的に記憶される。なお、サブRAM80のサイズは、メインRAM70のサイズよりも大きいことが好ましい。 The sub RAM 80 includes a ring buffer. In the ring buffer of the sub-RAM 80, log data 74 stored in the partial ring buffers 76a to 76c is temporarily stored during ring buffer division processing described later. Note that the size of the sub RAM 80 is preferably larger than the size of the main RAM 70.
 次に、図5、6を用いて、CPU50が実行するリングバッファ分割処理について説明する。リングバッファ分割処理は、第1設定期間t毎に実行される処理である。第1設定期間tは、予め設定されていてもよいし、操作パネル28から入力されるように構成されていてもよい。第1設定期間tが短いほうが、各タスクの占有率が急変した場合、例えば、部品実装機10が故障した場合などに、対応しやすくなる。なお、メインRAM70のリングバッファのサイズは、例えば、100Mbyteであり、リングバッファ分割処理前の部分リングバッファ76a、76b、76cのサイズは、例えば、20Mbyte、30Mbyte、50Mbyteとする。また、リングバッファ分割処理前の部分リングバッファ76a~76cのサイズを第1分割サイズとし、リングバッファ分割処理後の部分リングバッファ76a~76cのサイズを第2分割サイズとする。 Next, the ring buffer division processing executed by the CPU 50 will be described with reference to FIGS. Ring buffer division process is a process executed in the first every set period t 1. The first setting period t 1 may be set in advance or may be configured to be input from the operation panel 28. The shorter the first setting period t 1 , the easier it is to deal with when the occupation rate of each task changes abruptly, for example, when the component mounter 10 fails. The size of the ring buffer of the main RAM 70 is, for example, 100 Mbytes, and the sizes of the partial ring buffers 76a, 76b, 76c before the ring buffer division processing are, for example, 20 Mbytes, 30 Mbytes, and 50 Mbytes. Further, the size of the partial ring buffers 76a to 76c before the ring buffer division processing is set as the first division size, and the size of the partial ring buffers 76a to 76c after the ring buffer division processing is set as the second division size.
 まず、ステップS12において、CPU50は、第1設定期間t内に実行した複数のタスク62a~62cのそれぞれについて、CPU50の全処理能力に占める各タスク62a~62cの占有率を算出する。次いで、ステップS14において、CPU50は、ステップS12で算出した各タスク62a~62cの占有率に基づいて、部分リングバッファ76a~76cの第2分割サイズを設定する。上述したように、CPU50の占有率が高いタスク62a~62cは、占有率が低いタスク62a~62cよりも、多くのログデータ74を生成する。このため、CPU50は、占有率が高いタスク62a~62cに対応する部分リングバッファ76a~76cのサイズが、占有率が低いタスク62a~62cに対応する部分リングバッファ76a~76cのサイズよりも大きくなるように、第2分割サイズを設定する。具体的には、CPU50は、メインRAM70のリングバッファのサイズにタスク62a~62cの占有率を乗じることで、部分リングバッファ76の第2分割サイズを設定する。例えば、タスク62a、62b、62cのそれぞれの占有率が、60%、20%、20%と算出された場合において、メインRAM70のリングバッファのサイズが100Mbyteであるとすると、部分リングバッファ76a、76b、76cの第2分割サイズは、それぞれ60Mbyte、20Mbyte、20Mbyteと設定される。 First, in step S12, CPU 50, for each of a plurality of tasks 62a ~ 62c of executing the first set time period t 1, to calculate the occupation ratio of each task 62a ~ 62c to the total capacity of the CPU 50. Next, in step S14, the CPU 50 sets the second divided sizes of the partial ring buffers 76a to 76c based on the occupation ratios of the tasks 62a to 62c calculated in step S12. As described above, the tasks 62a to 62c having a high occupation rate of the CPU 50 generate more log data 74 than the tasks 62a to 62c having a low occupation rate. For this reason, the CPU 50 makes the size of the partial ring buffers 76a to 76c corresponding to the tasks 62a to 62c having a high occupation ratio larger than the size of the partial ring buffers 76a to 76c corresponding to the tasks 62a to 62c having a low occupation ratio. As described above, the second division size is set. Specifically, the CPU 50 sets the second divided size of the partial ring buffer 76 by multiplying the size of the ring buffer of the main RAM 70 by the occupation rates of the tasks 62a to 62c. For example, if the occupation ratios of the tasks 62a, 62b, and 62c are calculated as 60%, 20%, and 20%, and the size of the ring buffer of the main RAM 70 is 100 Mbytes, the partial ring buffers 76a and 76b , 76c are set to 60 Mbytes, 20 Mbytes, and 20 Mbytes, respectively.
 次いで、ステップS16において、CPU50は、メインRAM70のリングバッファに保存されているログデータ74を、サブRAM80に退避させる。この際、部分リングバッファ76a~76c毎に、当該部分リングバッファ76a~76cに記憶されているログデータ74をサブRAM80に退避させる。すなわち、サブRAM80は、タスク62a~62cに応じて複数の領域に分割されており、分割された各領域に対応するタスク62のログデータ74が格納される。次いで、ステップS18において、CPU50は、メインRAM70のリングバッファを、ステップS14で設定した第2分割サイズに分割する。なお、メインRAM70のリングバッファを第2分割サイズに分割する際には、メインRAM70のリングバッファに確保されていたログデータ74がクリアされる。 Next, in step S <b> 16, the CPU 50 saves the log data 74 stored in the ring buffer of the main RAM 70 in the sub RAM 80. At this time, the log data 74 stored in the partial ring buffers 76a to 76c is saved in the sub RAM 80 for each of the partial ring buffers 76a to 76c. That is, the sub RAM 80 is divided into a plurality of areas according to the tasks 62a to 62c, and the log data 74 of the task 62 corresponding to each divided area is stored. Next, in step S18, the CPU 50 divides the ring buffer of the main RAM 70 into the second division size set in step S14. Note that when the ring buffer of the main RAM 70 is divided into the second division size, the log data 74 secured in the ring buffer of the main RAM 70 is cleared.
 次いで、ステップS20において、CPU50は、部分リングバッファ76の第2分割サイズが、第1分割サイズ以上か否かを判定する。部分リングバッファ76の第2分割サイズが第1分割サイズ以上の場合(S20でYES)、CPU50は、ステップS22に進む。ステップS22において、CPU50は、サブRAM80に退避されている当該部分リングバッファ76に対応するログデータ74を、当該部分リングバッファ76に再保存する(例えば、図6の部分リングバッファ76a)。この場合、リングバッファ分割処理前の部分リングバッファ76に保存されていた全てのログデータ74を、第2分割サイズに変更後の部分リングバッファ76に保存することができる。一方、部分リングバッファ76の第2分割サイズが第1分割サイズより小さい場合(S20でNO)、CPU50は、ステップS24に進む。ステップS24において、CPU50は、サブRAM80に退避されている当該部分リングバッファ76に対応するログデータ74を、当該部分リングバッファ76に選択的に再保存する(例えば、図6の部分リングバッファ76b、76c)。この場合、リングバッファ分割処理前に保存されていたログデータ74の全てを、第2分割サイズに変更された部分リングバッファ76に保存することができないためである。具体的には、CPU50は、時刻情報74bの新しいログデータ74を優先的に保存する。 Next, in step S20, the CPU 50 determines whether or not the second division size of the partial ring buffer 76 is equal to or larger than the first division size. If the second division size of the partial ring buffer 76 is greater than or equal to the first division size (YES in S20), the CPU 50 proceeds to step S22. In step S22, the CPU 50 re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub RAM 80 in the partial ring buffer 76 (for example, the partial ring buffer 76a in FIG. 6). In this case, all log data 74 stored in the partial ring buffer 76 before the ring buffer division processing can be stored in the partial ring buffer 76 after changing to the second division size. On the other hand, if the second division size of the partial ring buffer 76 is smaller than the first division size (NO in S20), the CPU 50 proceeds to step S24. In step S24, the CPU 50 selectively re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub-RAM 80 in the partial ring buffer 76 (for example, the partial ring buffer 76b, FIG. 76c). In this case, all of the log data 74 stored before the ring buffer division processing cannot be stored in the partial ring buffer 76 changed to the second division size. Specifically, the CPU 50 preferentially stores the new log data 74 of the time information 74b.
 上述の説明から明らかなように、本実施例のコントローラ40において、メインRAM70のリングバッファは、複数のタスク62a~62cのそれぞれのログデータ74を記憶する複数の部分リングバッファ76に分割されている。これにより、部分リングバッファ76に保存されているログデータ74が、他の部分リングバッファ76に対応するタスク62に関するログデータ74により上書きされることを防止することができる。この結果、作業者は、複数のタスク62の状態を適切に判断することができる。 As is apparent from the above description, in the controller 40 of this embodiment, the ring buffer of the main RAM 70 is divided into a plurality of partial ring buffers 76 that store the log data 74 of the plurality of tasks 62a to 62c. . As a result, it is possible to prevent the log data 74 stored in the partial ring buffer 76 from being overwritten by the log data 74 related to the task 62 corresponding to the other partial ring buffer 76. As a result, the worker can appropriately determine the states of the plurality of tasks 62.
 また、コントローラ40は、第1設定期間t毎に、リングバッファ分割処理を実行する。リングバッファ分割処理において、コントローラ40は、各タスク62の占有率に応じて、メインRAM70のリングバッファを分割する。これにより、CPU50の全処理能力に占める各タスク62の占有率の動的な変化に対応することができる。すなわち、リングバッファ分割処理により、部分リングバッファ76のサイズを、各タスク62の占有率の動的な変化に合わせることで、部分リングバッファ76のサイズを適切なサイズに調整することができる。 Further, the controller 40 executes a ring buffer division process every first setting period t 1 . In the ring buffer dividing process, the controller 40 divides the ring buffer of the main RAM 70 according to the occupation ratio of each task 62. Thereby, it is possible to cope with a dynamic change in the occupation ratio of each task 62 occupying the entire processing capacity of the CPU 50. That is, the size of the partial ring buffer 76 can be adjusted to an appropriate size by matching the size of the partial ring buffer 76 with the dynamic change of the occupation ratio of each task 62 by the ring buffer division processing.
 また、コントローラ40は、リングバッファ分割処理において、部分リングバッファ76のサイズを変更する前に、サブRAM80にログデータ74を待避させ、変更前のメインRAM70のリングバッファに記憶されているログデータ74をクリアしている。部分リングバッファ76に保存されるログデータ74を、サブRAM80に退避させることなく、部分リングバッファ76のサイズを変更する場合、サイズ変更後の部分リングバッファ76に、複数のタスク62に対応するログデータ74が保存される場合がある。一方、本実施例では、部分リングバッファ76のサイズを変更する前に、サブRAM80にログデータ74を待避させているため、部分リングバッファ76に対応するタスク62のログデータ74のみが、サイズ変更後の部分リングバッファ76に保存される。これによって、作業者は、部品実装機10の複数のタスク62の状態を適切に判断することができる。 In addition, in the ring buffer division processing, the controller 40 saves the log data 74 in the sub RAM 80 before changing the size of the partial ring buffer 76, and the log data 74 stored in the ring buffer of the main RAM 70 before the change. Has cleared. When the size of the partial ring buffer 76 is changed without saving the log data 74 stored in the partial ring buffer 76 to the sub RAM 80, logs corresponding to a plurality of tasks 62 are stored in the partial ring buffer 76 after the size change. Data 74 may be stored. On the other hand, in the present embodiment, the log data 74 is saved in the sub RAM 80 before the size of the partial ring buffer 76 is changed. Therefore, only the log data 74 of the task 62 corresponding to the partial ring buffer 76 is changed in size. It is stored in the subsequent partial ring buffer 76. Thus, the worker can appropriately determine the states of the plurality of tasks 62 of the component mounter 10.
 図7を用いて、実施例2の部品実装機10について説明する。なお、実施例間で共通する構成については、同じ符号を付して説明を省略する。実施例2では、リングバッファ分割処理が実施例1のリングバッファ分割処理とは異なる。実施例2のリングバッファ分割処理は、第2設定期間t毎に実行される処理である。なお、第2設定期間tは、第1設定期間tと同様に設定することができる。 A component mounter 10 according to the second embodiment will be described with reference to FIG. In addition, about the structure which is common between Examples, the same code | symbol is attached | subjected and description is abbreviate | omitted. In the second embodiment, the ring buffer dividing process is different from the ring buffer dividing process of the first embodiment. Ring buffer division process of the second embodiment is the processing executed in the second every set period t 2. Note that the second set time period t 2 can be set similarly to the first setting period t 1.
 まず、ステップS112において、CPU50は、第2設定期間tの間に、複数の部分リングバッファ76a~76cのそれぞれに保存されたログデータ74の情報サイズを算出する。次いで、ステップS114において、CPU50は、第2設定期間tの間にメインRAM70のリングバッファ(すなわち、部分リングバッファ76a~76c)に保存されたログデータ74の情報サイズ(以下、第1情報サイズという)に対して、各部分リングバッファ76a~76cに保存されたログデータ74の情報サイズの割合を算出する。第1情報サイズは、部分リングバッファ76a、76b、76cの情報サイズを足し合わせた値である。 First, in step S112, CPU 50, during the second set time period t 2, and calculates the information size of the log data 74 stored in each of the plurality of partial ring buffers 76a ~ 76c. Then, in step S114, CPU 50 has a ring buffer of the main RAM70 during the second set time period t 2 (i.e., partial ring buffers 76a ~ 76c) information size of the saved log data 74 (hereinafter, the first information size The ratio of the information size of the log data 74 stored in each of the partial ring buffers 76a to 76c is calculated. The first information size is a value obtained by adding the information sizes of the partial ring buffers 76a, 76b, and 76c.
 次いでステップS116において、CPU50は、部分リングバッファ76a~76cの情報サイズの割合に基づいて、部分リングバッファ76a~76cの第2分割サイズを算出する。具体的には、CPU50は、メインRAM70のリングバッファのサイズにステップS114で算出された各部分リングバッファ76a~76cの割合を乗じることで、部分リングバッファ76a~76cの第2分割サイズを算出する。例えば、メインRAM70のリングバッファのサイズが100Mbyteであり、部分リングバッファ76a、76b、76cの情報サイズがそれぞれ6Mbyte、2Mbyte、2Mbyteである場合について説明する。この場合、第1情報サイズは、10Mbyteとなり、部分リングバッファ76a、76b、76cの割合は、60%、20%、20%と算出される。したがって、部分リングバッファ76a、76b、76cの第2分割サイズは、60Mbyte、20Mbyte、20Mbyteと算出される(図6参照)。 Next, in step S116, the CPU 50 calculates the second division size of the partial ring buffers 76a to 76c based on the information size ratio of the partial ring buffers 76a to 76c. Specifically, the CPU 50 calculates the second divided size of the partial ring buffers 76a to 76c by multiplying the size of the ring buffer of the main RAM 70 by the ratio of the partial ring buffers 76a to 76c calculated in step S114. . For example, a case will be described in which the size of the ring buffer of the main RAM 70 is 100 Mbytes and the information sizes of the partial ring buffers 76a, 76b, and 76c are 6 Mbytes, 2 Mbytes, and 2 Mbytes, respectively. In this case, the first information size is 10 Mbytes, and the ratios of the partial ring buffers 76a, 76b, and 76c are calculated as 60%, 20%, and 20%. Therefore, the second division sizes of the partial ring buffers 76a, 76b, and 76c are calculated as 60 Mbytes, 20 Mbytes, and 20 Mbytes (see FIG. 6).
 次いで、ステップS118において、CPU50は、メインRAM70のリングバッファに保存されているログデータ74を、サブRAM80に退避させる。次いで、ステップS120において、CPU50は、部分リングバッファ76a~76cを、ステップS116で設定した第2分割サイズに変更する。 Next, in step S 118, the CPU 50 saves the log data 74 stored in the ring buffer of the main RAM 70 in the sub RAM 80. Next, in step S120, the CPU 50 changes the partial ring buffers 76a to 76c to the second division size set in step S116.
 次いでステップS122において、CPU50は、各部分リングバッファ76a~76cに対して、当該部分リングバッファ76a~76cの第2分割サイズが、第1分割サイズ以上か否かを判定する。部分リングバッファ76の第2分割サイズが第1分割サイズ以上の場合(S122でYES)、CPU50は、ステップS124に進む。ステップS124において、CPU50は、サブRAM80に退避されている当該部分リングバッファ76に対応するログデータ74を、当該部分リングバッファ76に再保存する(例えば図6の部分リングバッファ76a)。この場合、リングバッファ分割処理前の部分リングバッファ76に保存されていた全てのログデータ74が、第2分割サイズに変更後の部分リングバッファ76に保存される。一方、部分リングバッファ76の第2分割サイズが第1分割サイズより小さい場合(S122でNO)、CPU50は、ステップS126に進む。ステップS126において、CPU50は、サブRAM80に退避されている当該部分リングバッファ76に対応するログデータ74を、当該部分リングバッファ76のサイズに応じたデータ量となるように選択的に再保存する(例えば、図6の部分リングバッファ76b、76c)。具体的には、CPU50は、時刻情報74bの新しいログデータ74を優先的に保存する。 Next, in step S122, the CPU 50 determines for each of the partial ring buffers 76a to 76c whether or not the second divided size of the partial ring buffers 76a to 76c is equal to or larger than the first divided size. If the second division size of the partial ring buffer 76 is greater than or equal to the first division size (YES in S122), the CPU 50 proceeds to step S124. In step S124, the CPU 50 re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub RAM 80 in the partial ring buffer 76 (for example, the partial ring buffer 76a in FIG. 6). In this case, all the log data 74 stored in the partial ring buffer 76 before the ring buffer division processing is stored in the partial ring buffer 76 after being changed to the second division size. On the other hand, when the second division size of the partial ring buffer 76 is smaller than the first division size (NO in S122), the CPU 50 proceeds to step S126. In step S126, the CPU 50 selectively re-saves the log data 74 corresponding to the partial ring buffer 76 saved in the sub RAM 80 so that the data amount corresponds to the size of the partial ring buffer 76 ( For example, the partial ring buffers 76b and 76c in FIG. Specifically, the CPU 50 preferentially stores the new log data 74 of the time information 74b.
 上述の説明から明らかなように、第2実施例のコントローラ40は、第2設定期間t毎に、リングバッファ分割処理を実行する。リングバッファ分割処理において、コントローラ40は、第2設定期間tの間に、部分リングバッファ76a~76cに保存されたログデータ74の情報サイズの割合に基づいて、部分リングバッファ76a~76cのサイズを変更する。このため、部分リングバッファ76a~76cの情報サイズの割合に基づいて、部分リングバッファ76a~76cの第2分割サイズを算出することでも、各タスク62a~62cのログ出力量の動的な変化に合わせることができる。これにより、部分リングバッファ76a~76cのサイズを、適切なサイズに調整することができる。 As apparent from the above description, the controller 40 of the second embodiment, the second every set period t 2, performing a ring buffer division process. In the ring buffer division processing, the controller 40, during a second predetermined time period t 2, based on the proportion of the information size of the partial ring buffers 76a ~ log data 74 stored in 76c, the size of the partial ring buffers 76a ~ 76c To change. For this reason, calculating the second division size of the partial ring buffers 76a to 76c based on the ratio of the information sizes of the partial ring buffers 76a to 76c can also dynamically change the log output amount of each task 62a to 62c. Can be matched. Thereby, the size of the partial ring buffers 76a to 76c can be adjusted to an appropriate size.
 以上、本明細書に開示の技術に係る実施例について詳細に説明したが、これらは例示に過ぎず、特許請求の範囲を限定するものではない。特許請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。 As mentioned above, although the Example which concerns on the technique disclosed by this specification was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
 上記の各実施例では、コントローラ40は、メインRAM70とサブRAM80の2つのRAMを備えている。しかしながら、コントローラ40は、メインRAM70のみで構成されていてもよい。この場合、図8のように、メインRAM70を、プログラム領域172と、メインログ領域174と、サブログ領域178に分割する。例えば、メインRAMのサイズが2Gbyteである場合に、プログラム領域172、メインログ領域174、サブログ領域178のサイズを、1Gbyte、500Mbyte、500Mbyteに分割するなどである。プログラム領域172には、タスク62a~62cの処理に関する情報が保存される。メインログ領域174は、複数の部分リングバッファ176a~176cに分割されており、タスク62a~62aのそれぞれに対応するログデータ74が保存される。複数の部分リングバッファ176のそれぞれのサイズは、リングバッファ分割処理によって動的に変化する。サブログ領域178には、リングバッファ分割処理中に、メインログ領域174(詳細には、部分リングバッファ176a~176c)に記憶されているログデータ74が一時的に記憶される。この構成によれば、各実施例と同様の効果を奏することができる。 In each embodiment described above, the controller 40 includes two RAMs, a main RAM 70 and a sub RAM 80. However, the controller 40 may be composed only of the main RAM 70. In this case, as shown in FIG. 8, the main RAM 70 is divided into a program area 172, a main log area 174, and a sub log area 178. For example, when the size of the main RAM is 2 Gbytes, the size of the program area 172, the main log area 174, and the sublog area 178 is divided into 1 Gbyte, 500 Mbyte, and 500 Mbyte. In the program area 172, information regarding the processing of the tasks 62a to 62c is stored. The main log area 174 is divided into a plurality of partial ring buffers 176a to 176c, and log data 74 corresponding to each of the tasks 62a to 62a is stored. The sizes of the plurality of partial ring buffers 176 are dynamically changed by ring buffer division processing. Log data 74 stored in the main log area 174 (specifically, the partial ring buffers 176a to 176c) is temporarily stored in the sub-log area 178 during the ring buffer division processing. According to this configuration, the same effects as those of the embodiments can be obtained.

Claims (5)

  1.  電子部品を回路基板に実装する部品実装機に装備され、前記部品実装機の少なくとも一部の動作を制御するコントローラであって、
     複数のタスクを実行するプロセッサと、
     前記プロセッサが実行した前記タスクに関するログ情報を記憶するリングバッファと、を備えており、
     前記リングバッファは、前記複数のタスク毎に、当該タスクを前記プロセッサが実行したときのログ情報を記憶する部分リングバッファに分割されており、
     前記プロセッサは、処理周期毎に、前記複数のタスクのそれぞれについて、当該タスクに関するログ情報を、当該タスクに対応する前記部分リングバッファに保存するように構成されている、コントローラ。
    A controller that is mounted on a component mounter that mounts electronic components on a circuit board and controls the operation of at least a part of the component mounter,
    A processor that performs multiple tasks;
    A ring buffer for storing log information relating to the task executed by the processor,
    The ring buffer is divided into a partial ring buffer for storing log information when the processor executes the task for each of the plurality of tasks.
    The controller is configured to store, for each of the plurality of tasks, log information related to the task in the partial ring buffer corresponding to the task for each processing cycle.
  2.  前記プロセッサは、前記ログ情報を前記部分リングバッファに保存するときに、当該ログ情報に対応する時刻情報を、当該部分リングバッファに保存するように構成されている、請求項1に記載のコントローラ。 The controller according to claim 1, wherein the processor is configured to store time information corresponding to the log information in the partial ring buffer when the log information is stored in the partial ring buffer.
  3.  前記プロセッサは、予め定められた設定期間毎に、前記複数のタスクのそれぞれについて、当該プロセッサの全処理能力に占める当該タスクの占有率を算出し、
     前記設定期間毎に、前記複数のタスクのそれぞれについて、当該タスクについて算出された占有率に応じたサイズの部分リングバッファに前記リングバッファを分割する、請求項1又は2に記載のコントローラ。
    The processor calculates, for each of the plurality of tasks, the occupation ratio of the task in the total processing capacity of the processor for each predetermined setting period,
    3. The controller according to claim 1, wherein, for each of the plurality of tasks, the ring buffer is divided into partial ring buffers having a size corresponding to an occupation rate calculated for the task for each of the plurality of tasks.
  4.  前記プロセッサは、予め定められた設定期間毎に、当該設定期間の間に前記複数の部分リングバッファのそれぞれに保存された前記ログ情報の情報サイズを算出し、
     前記設定期間毎に、前記複数のタスクのそれぞれについて、当該タスクについて算出された情報サイズと、当該設定期間に保存された全てのログ情報の情報サイズとの比に応じたサイズの部分リングバッファに分割する、請求項1又は2に記載のコントローラ。
    The processor calculates an information size of the log information stored in each of the plurality of partial ring buffers during the setting period for each predetermined setting period,
    For each of the plurality of tasks, a partial ring buffer having a size corresponding to the ratio between the information size calculated for the task and the information size of all log information stored in the setting period is set for each of the plurality of tasks. The controller according to claim 1, wherein the controller is divided.
  5.  前記複数のログ情報を記憶するサブメモリをさらに備えており、
     前記プロセッサは、前記複数の部分リングバッファのいずれかのサイズを変更するときは、前記複数の部分リングバッファのそれぞれに保存されている前記ログ情報を前記サブメモリに退避し、
     前記ログ情報を前記サブメモリに退避した後に、前記複数の部分リングバッファのサイズを変更し、
     前記複数の部分リングバッファのサイズを変更した後に、前記サブメモリに退避されているログ情報を、前記複数の部分リングバッファのそれぞれに保存するように構成されている、請求項1から4のいずれか1項に記載のコントローラ。
     
    A sub memory for storing the plurality of log information;
    When changing the size of any of the plurality of partial ring buffers, the processor saves the log information stored in each of the plurality of partial ring buffers to the sub-memory,
    After saving the log information to the sub-memory, change the size of the plurality of partial ring buffers,
    The log information saved in the sub-memory after changing the size of the plurality of partial ring buffers is configured to be saved in each of the plurality of partial ring buffers. The controller according to claim 1.
PCT/JP2015/069557 2015-07-07 2015-07-07 Controller mounted on component mounting machine WO2017006437A1 (en)

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JPWO2021064951A1 (en) * 2019-10-03 2021-04-08

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JP2003168895A (en) * 2001-12-03 2003-06-13 Juki Corp Surface-mounting device
JP2008171119A (en) * 2007-01-10 2008-07-24 Nec Saitama Ltd System, method and program for detecting failure of terminal device

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JP2003168895A (en) * 2001-12-03 2003-06-13 Juki Corp Surface-mounting device
JP2008171119A (en) * 2007-01-10 2008-07-24 Nec Saitama Ltd System, method and program for detecting failure of terminal device

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Publication number Priority date Publication date Assignee Title
JPWO2021064951A1 (en) * 2019-10-03 2021-04-08
WO2021064951A1 (en) * 2019-10-03 2021-04-08 株式会社Fuji Motor drive device and component mounting macine equipped with motor drive device
JP7464617B2 (en) 2019-10-03 2024-04-09 株式会社Fuji Component mounter equipped with a motor drive unit

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