JP6697929B2 - Device for optimizing mounting process and electronic component mounting machine - Google Patents

Description

  The present invention relates to a mounting process optimizing apparatus and an electronic component mounting machine.

  The optimization device optimizes the mounting process by the electronic component mounting machine. In the electronic component mounting machine, in the above-mentioned mounting process for transferring the electronic component to the specified position of the circuit board, when the mounting error in which the electronic component is not properly transferred is detected, a recovery process is tried in which the transfer is tried again. There is something to do. For example, Patent Document 1 discloses a configuration in which, when a suction error in which an electronic component is not sucked in the suction operation is detected as a mounting error, a recovery process is performed to suck the electronic component by another suction operation.

JP, 2015-159330, A

  In the recovery processing as described above, after the electronic component mounting machine performs the suction operation again, the transfer operation of transferring the electronic component held by the suction operation to the circuit board is performed. Therefore, the pick-and-place cycle increases due to the execution of the recovery process, and the cycle time required for the mounting process is extended. Therefore, depending on the frequency of occurrence of the recovery process, there is a possibility that productivity may be reduced.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an apparatus for optimizing a mounting process and an electronic component mounting machine that can suppress a decrease in productivity associated with execution of a recovery process for a mounting error. And

An apparatus for optimizing a mounting process according to claim 1 optimizes a mounting process by an electronic component mounting machine. The electronic component mounting machine repeats a pick and place cycle (hereinafter, PP cycle) in which various electronic components designated by a control program are held on a plurality of holding members and then transferred to a circuit board, a plurality of times. The mounting process is executed, and when a mounting error in which the electronic component is not properly transferred is detected during the execution of the mounting process, a recovery process is performed to try the transfer again.
The optimizing device sets a part of the plurality of holding members to be in an undesignated state in which the holding of the electronic component is not designated in at least one of the PP cycles other than the first and last of all the PP cycles. And an operation setting unit that sets a transfer operation in the mounting process, mounting error information indicating the frequency of occurrence of the mounting error for each component type, or transfer difficulty of the electronic component set in advance for each component type. A storage device for storing the mounting difficulty information . The operation setting unit sets a part of the plurality of holding members in the non-designated state in a predetermined PP cycle, so that the undesignated state is detected when the mounting error is detected in the previous PP cycle. The holding member is designated to hold the electronic component, and the recovery process for the mounting error can be performed. The operation setting unit is based on the occurrence frequency of the mounting error related to the component type of the electronic component transferred in the front PP cycle of the two different PP cycles, or the transfer difficulty of the electronic component. , The number of the holding members in the unspecified state in the rear PP cycle is calculated.

An apparatus for optimizing a mounting process according to a fifth aspect optimizes a mounting process by an electronic component mounting machine. When the electronic component mounting machine detects a mounting error in which the electronic components are not properly transferred during execution of the mounting process of transferring various electronic components to the circuit board, the electronic component mounting machine tries to transfer again. A plurality of processing circuits are arranged in parallel in the circuit board transport direction to form a production line for producing board products. Of the mounting processes that can be simultaneously executed by a plurality of electronic component mounting machines, the one having the longest cycle time for each mounting process is defined as a bottleneck process.
The optimizing device is a storage device that stores mounting error information indicating the frequency of occurrence of the mounting error for each component type, or transfer difficulty information preset for each component type of the transfer difficulty of the electronic component, A process design unit that allocates a component type and quantity of the electronic component transferred in the mounting process by the plurality of electronic component mounting machines, a component type that frequently causes the mounting error, or a transfer difficulty of the electronic component And a line balance adjusting unit that adjusts so that the electronic component of a high component type is preferentially transferred in the mounting process different from the bottleneck process.

Electronic component mounting apparatus according to claim 8, pick-and-place cycle (hereinafter, PP cycle) for transferring the circuit board after holding by various electronic components plurality of holding members which is designated by the control program into a plurality of times A mounting control unit that executes a mounting process that is repeated over a period of time, and a recovery process that attempts transfer again when a mounting error in which the electronic component is not properly transferred during the mounting process is detected. A recovery control unit and a replacement control unit that performs a replacement process of replacing at least a part of the plurality of holding members with another holding member during execution of the mounting process .
The mounting control unit, based on the control program, a part of the plurality of holding members does not hold the electronic component in at least one of the PP cycles other than the first and last of all the PP cycles. The transfer operation in the mounting process is controlled so that the designated state is achieved. When the mounting error is detected, the recovery control unit instructs the holding member in the unspecified state to hold the electronic component in the subsequent PP cycle, and executes the recovery process for the mounting error. To do. The recovery control unit executes the recovery process for the mounting error before executing the replacement process when the mounting error is detected before executing the replacement process.

According to the configuration of the inventions according to claims 1, 3 , 7 , and 8 , when a mounting error is detected in a predetermined PP cycle of the mounting process, the electronic component mounting machine holds the unspecified state in the subsequent PP cycles. The member can be used to execute the recovery process for the mounting error. That is, the operation that also serves as the recovery process is added to the PP cycle to be executed. Accordingly, when the mounting error is recovered in the PP cycle, it is not necessary to add a new PP cycle for the recovery process, and the time required for the recovery process can be shortened. Therefore, it is possible to suppress a decrease in productivity due to the execution of the recovery process for the mounting error.

  According to the configuration of the fifth aspect of the invention, the electronic component of the component type that is likely to require the recovery process is assigned to the mounting process different from the bottleneck process. As a result, even if a mounting error is detected in the mounting process different from the bottleneck process and the recovery process is executed, if the cycle time of the mounting process including the time required for the recovery process is shorter than the cycle time of the bottleneck process. The influence on the whole production process can be prevented, and the influence on the whole production process can be reduced even if it is long. As a result, it is possible to suppress a decrease in productivity associated with the execution of the recovery process for a mounting error.

It is a top view which shows the production line in embodiment typically. It is a schematic diagram which shows the structure of the electronic component mounting machine in FIG. It is a block diagram which shows the control apparatus and management apparatus of the electronic component mounting machine in FIG. 4 is a table showing various data stored in the management device of FIG. 3. It is a flowchart which shows the optimization process by an optimization device. It is a graph which shows the relationship between each mounting process and cycle time. It is a table showing the designated state of the suction nozzle in each PP cycle. It is a flow chart which shows mounting processing.

  Hereinafter, an embodiment in which an apparatus for optimizing a mounting process and an electronic component mounting machine according to the present invention are embodied will be described with reference to the drawings. The optimization device optimizes the mounting process by the electronic component mounting machine. The electronic component mounting machine is a device that holds an electronic component by a holding member such as a suction nozzle or a chuck device, and mounts the electronic component at a predetermined coordinate position on a circuit board. A plurality of electronic component mounting machines are arranged side by side in the direction in which the circuit board is transported, and form a production line that produces board products.

<Embodiment>
(Structure of production line 1)
As shown in FIG. 1, the production line 1 is configured by arranging a plurality of electronic component mounting machines 10 side by side in the transport direction (X direction) of the circuit board Bd. The production line 1 may include, for example, a screen printing machine, a mounting inspection machine, a reflow oven, or the like. The plurality of electronic component mounting machines 10 are communicatively connected to the management device 70 via a network.

  As illustrated in FIG. 3, the management device 70 includes a production control unit 71, a storage device 72, and an optimization device 80. The production control unit 71 monitors the operation status of the production line 1 and controls the components of the production line 1 including the plurality of electronic component mounting machines 10. Further, the production control unit 71 collects the time required for the mounting process by the electronic component mounting machine 10, the error that occurred during the execution of the mounting process, and the like.

  The storage device 72 is configured by an optical drive device such as a hard disk device or a flash memory. The storage device 72 stores various data for controlling the electronic component mounting machine 10. The various data described above include a production plan including the type and production amount of the board product to be produced, and a control program for operating the electronic component mounting machine 10.

  The optimizing device 80 is built in the management device 70 in the present embodiment. The optimizing device 80 optimizes the above control program based on various data. The detailed configuration of the optimizing device 80 will be described later.

(Configuration of electronic component mounting machine 10)
As shown in FIG. 2, the electronic component mounting machine 10 includes a substrate transfer device 20, a component supply device 30, a component transfer device 40, a component camera 51, a substrate camera 52, a nozzle station 55, and a control device. And 60. In the following description, the horizontal width direction of the electronic component mounting machine 10 (horizontal direction in FIG. 2) is the X-axis direction, and the horizontal depth direction of the electronic component mounting machine 10 (the vertical direction in FIG. 2) is the Y-axis direction, The vertical direction (front-back direction in FIG. 2) perpendicular to the X-axis and the Y-axis is the Z-axis direction.

  The board transfer device 20 is configured by a belt conveyor or the like, and sequentially transfers the circuit boards Bd in the transfer direction (in the present embodiment, the X-axis direction). The board transfer device 20 positions the circuit board Bd at a predetermined position in the electronic component mounting machine 10. Then, the board transfer device 20 carries the circuit board Bd out of the electronic component mounting machine 10 after the mounting processing by the electronic component mounting machine 10 is executed.

  The component supply device 30 supplies the electronic components mounted on the circuit board Bd at the plurality of supply positions Ps. The component supply device 30 has a plurality of slots 31 and a plurality of reel holders 32 arranged side by side in the X-axis direction. A feeder 33 is detachably set in each of the plurality of slots 31. The component supply device 30 feeds and moves a carrier tape containing a large number of electronic components by a feeder 33, and supplies the electronic components in a releasable manner at a supply position Ps located on the tip side of the feeder 33. The reel holding section 32 holds the reel around which the carrier tape is wound in a replaceable manner.

  The component transfer device 40 is configured to be movable in the X-axis direction and the Y-axis direction. The component transfer device 40 is arranged from the rear side (upper side in FIG. 2) in the longitudinal direction of the electronic component mounting machine 10 to the upper side of the component supply device 30 on the front side. The component transfer device 40 includes a head drive device 41, a moving base 42, a mounting head 43, and a suction nozzle 44. The head drive device 41 is configured to be able to move the moving table 42 in the XY axis directions by a linear movement mechanism.

  The mounting head 43 is fixed to the movable table 42 by a clamp (not shown). A plurality of suction nozzles 44 are detachably attached to the mounting head 43. The mounting head 43 supports the suction nozzles 44 so as to be rotatable about an R axis parallel to the Z axis and capable of moving up and down. The suction nozzle 44 is controlled in an ascending/descending position with respect to the mounting head 43, an angle, and a supply state of negative pressure. The suction nozzle 44 is a holding member that sucks and holds the electronic component supplied at the supply position Ps of the feeder 33 by being supplied with a negative pressure.

  The component camera 51 and the substrate camera 52 are digital image pickup devices having image pickup elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor). The component camera 51 and the board camera 52 perform imaging of a range within the field of view of the camera based on a control signal from the control device 60 communicatively connected, and send the image data acquired by the imaging to the control device 60.

  The component camera 51 is fixed to the base of the electronic component mounting machine 10 so that the optical axis thereof is directed upward in the vertical direction (Z-axis direction), and is configured to be capable of capturing an image from below the component transfer device 40. More specifically, the component camera 51 is configured to be able to image the lower surface of the electronic component held by the suction nozzle 44. The board camera 52 is provided on the moving base 42 of the component transfer device 40 so that the optical axis thereof is directed downward in the vertical direction (Z-axis direction). The board camera 52 is configured to be able to image the circuit board Bd.

  The nozzle station 55 is installed on the base of the electronic component mounting machine 10. The nozzle station 55 detachably holds the plurality of suction nozzles 44. In the replacement process of the suction nozzle 44, the nozzle station 55 holds the suction nozzle 44 removed from the mounting head 43 and holds another suction nozzle 44 so that it can be taken out. Accordingly, the electronic component mounting machine 10 is configured to be capable of automatically exchanging the suction nozzle 44 according to the type of the electronic component to be mounted during the mounting process.

(Configuration of control device 60)
The control device 60 is mainly composed of a CPU, various memories, and a control circuit. The control device 60 controls the mounting process of electronic components. The mounting process is a process in which a pick-and-place cycle (hereinafter referred to as a PP cycle) in which various electronic components designated by a control program are held by a plurality of holding members and then transferred to a circuit board is repeated a plurality of times. The details of the mounting process by the electronic component mounting machine 10 will be described later. As shown in FIG. 3, the control device 60 includes a mounting control unit 61, a storage device 62, an error detection unit 63, a recovery control unit 64, and a replacement control unit 65.

  The mounting control unit 61 controls the position of the mounting head 43 and the operation of the suction mechanism. In the mounting process, the mounting control unit 61 inputs information output from various sensors provided in the electronic component mounting machine 10 and a result of recognition processing by image processing and the like. Then, the mounting control unit 61 sends a control signal to the component transfer device 40 based on the control program stored in the storage device 62, the information from various sensors, and the results of various recognition processes. As a result, the position and the rotation angle of the suction nozzle 44 supported by the mounting head 43 are controlled.

  The storage device 62 is configured by an optical drive device such as a hard disk device or a flash memory. The storage device 62 stores a control program, control information, image data, temporary data of various processes by image processing, and the like. In addition, the storage device 62 stores a threshold value that serves as a reference for whether or not to execute the recovery process.

  The error detection unit 63 detects a mounting error in which the electronic components are not properly transferred during the mounting process of transferring various electronic components supplied at the plurality of supply positions Ps to the circuit board Bd in the production process. The above-mentioned "mounting error" includes a suction error of the electronic component, a defect of the electronic component in the suction state, a posture abnormality of the electronic component in the suction state, and an abnormality of the electronic component after mounting. In the present embodiment, the error detection unit 63 recognizes the state of the sucked electronic component based on the image data obtained by the image pickup by the component camera 51.

  The error detection unit 63 determines whether or not the suction nozzle 44 holds the electronic component, whether or not the electronic component is good, and whether or not the posture of the electronic component is appropriate, by recognizing the state of the electronic component. The error detection unit 63 determines that a suction error has occurred, for example, when the suction nozzle 44 that should hold the electronic component does not hold the electronic component. It should be noted that the cause of the suction error may be a shortage of parts in the feeder 33 or a reduction in the suction force due to an abnormality in the tip of the suction nozzle 44.

  The recovery control unit 64 executes a recovery process in which a transfer is tried again when an installation error in which an electronic component is not properly transferred is detected during the mounting process. For example, when the number of consecutive suction errors in the suction operation performed a plurality of times is less than the threshold value, the recovery control unit 64 executes the recovery process of sucking the electronic component by the suction operation again. In the recovery process, the electronic component related to the adsorption error is tried to be adsorbed, and when the electronic component is normally adsorbed, the electronic component is mounted on the circuit board Bd.

  In this way, the recovery process, which is one of the mounting error handling processes including the suction error, attempts automatic recovery assuming that the suction error occurs accidentally, and interrupts the mounting process (electronic component This is a process that does not involve the stop of the mounting machine 10. However, depending on the cause of the mounting error, recovery work by the operator, such as replacement of the carrier tape in the feeder 33, may be required.

  Therefore, the recovery control unit 64 executes the recovery process using the same supply position Ps when the number of consecutive identical mounting errors in the suction operation performed a plurality of times as described above is less than the threshold value. The above threshold is a set value that serves as a reference for whether or not to execute the recovery process. An initial value is preset for the threshold value by the operator and is stored in the storage device 62. Then, when the number of consecutive identical mounting errors reaches the threshold value, the recovery control unit 64 suspends the mounting process because recovery work is required to recover the mounting errors.

  With the above-described configuration, the electronic component mounting machine 10 repeats the mounting process in which the PP cycle in which various electronic components designated by the control program are held by the plurality of holding members and then transferred to the circuit board is repeated a plurality of times. To execute. Further, the electronic component mounting machine 10 is configured to be able to execute a recovery process in which the electronic component is properly transferred during the mounting process, and when a mounting error in which the electronic component is not properly transferred is detected, the electronic component mounting machine 10 tries the transfer again.

  The replacement control unit 65 executes a replacement process of replacing at least a part of the plurality of suction nozzles 44 with another suction nozzle 44 during the mounting process. More specifically, the replacement control unit 65 holds a part or all of the plurality of suction nozzles 44 supported by the mounting head 43 during consecutive PP cycles in the suction station 55, based on the control program. Replace with 44. This replacement process is executed in order to make the nozzle type of the suction nozzle 44 correspond to the size and shape of the electronic component to be mounted, for example.

(Detailed configuration of the optimization device 80)
The mounting process optimizing device 80 executes the optimizing process for the control programs sent to the plurality of electronic component mounting machines 10. The optimizing device 80 optimizes the control program from the viewpoint of reducing the cycle time required for the mounting process and from the viewpoint of suppressing the decrease in productivity due to the execution of the recovery process. As a result, the cycle time can be shortened and a recovery process can be performed against accidental mounting errors, resulting in an improvement in production efficiency.

  As shown in FIG. 3, the optimizing device 80 includes a storage device 72 of the management device 70 that is also used by the optimizing device 80, a process designing unit 81, a line balance adjusting unit 82, and an operation setting unit 83. .. The storage device 72 stores the mounting error information Ie and the transfer difficulty information Ic. The mounting error information Ie is information indicating the frequency of occurrence of mounting errors for each component type. The occurrence frequency of the mounting error of the predetermined component type is, for example, an actual value calculated by totaling the mounting errors detected in the mounting process by each of the plurality of electronic component mounting machines 10. The frequency of occurrence of the mounting error is indicated by the number of times of the mounting error, the number of times of the mounting error with respect to the mounting number, the reciprocal of the mounting success rate indicating the probability of being properly mounted without executing the recovery process, and the like. Further, the mounting error information Ie may be configured to include a mounting condition (type of suction nozzle used, transfer operation speed, etc.) when a mounting error occurs.

  The transfer difficulty information Ic is information in which the transfer difficulty of electronic components is preset for each component type. The transfer difficulty of a predetermined component type is set for the purpose of urging the optimizing device 80 to be cautious in mounting the component type, for example, and can be arbitrarily set by the operator based on experience or the like. It is a value. As shown in FIG. 4, the transfer difficulty information Ic is generated between the size and shape of the electronic component and between the holding member (suction nozzle 44, chuck device) used to hold the electronic component in the mounting process and the electronic component. At least one of the values indicating the frictional force to be set may be set as the transfer difficulty of the electronic component. Accordingly, in addition to the method in which the operator directly inputs the transfer difficulty level, the transfer difficulty level can be automatically calculated in consideration of the dimensions and the like of the electronic component.

  The process design unit 81 allocates the component type and quantity of electronic components transferred in the mounting process by the plurality of electronic component mounting machines 10. Specifically, the process designing unit 81 mounts the electronic components according to the number of the electronic component mounting machines 10 configuring the production line 1 based on the design information including the component type and the mounting position of the electronic components mounted on the board product. Determine the number of processing steps. At this time, the process design unit 81 considers the line balance so that the cycle time required for the mounting process by each electronic component mounting machine 10 is averaged, and the component type and quantity of the electronic components to be mounted in each process. To design.

  However, the bottleneck process occurs due to the fact that the distance from the electronic component supply position Ps to the mounting position in the component supply device 30 is different for each electronic component, and the transfer operation speed is limited depending on the component type. .. The above-mentioned “bottleneck process” refers to a mounting process (each process) that can be simultaneously executed by a plurality of electronic component mounting machines 10 and has the longest cycle time for each mounting process.

  The line balance adjusting unit 82 prioritizes the transfer of electronic components of component types with a high mounting error frequency or of electronic component types with a high degree of difficulty in transferring electronic components in a mounting process different from the bottleneck process. adjust. Specifically, the line balance adjusting unit 82 first extracts a bottleneck process from each process designed by the process designing unit 81. Then, if the bottleneck process includes a component type that is likely to require recovery processing due to the occurrence of a mounting error, the line balance adjusting unit 82 attaches the component type to another process. Then, the mounting of another component type that is to be mounted in another process is moved to the bottleneck process instead.

  According to each mounting process optimized as described above, even if a mounting error is detected in the mounting process different from the bottleneck process and the recovery process is executed, the cycle time of the mounting process including the time required for the recovery process If is shorter than the cycle time of the bottleneck process, the influence on the entire production process can be prevented. Even if the cycle time of the mounting process including the time required for the recovery process is longer than the cycle time of the bottleneck process, the maximum cycle time is smaller than that of executing the recovery process in the bottleneck process. The impact on the whole is reduced.

  In the optimization processing, the operation setting unit 83 sets the transfer operation in the mounting processing by the electronic component mounting machine 10 and optimizes the control program used in the mounting processing. In addition, in the present embodiment, the operation setting unit 83 uses a plurality of PP cycles in at least one of all PP cycles other than the first and last PP cycles in order to suppress a decrease in productivity accompanying the execution of the recovery process. The transfer operation in the mounting process is set so that a part of the holding member (suction nozzle 44) is in an undesignated state in which holding of the electronic component is not designated.

  Here, the above-mentioned "all PP cycles" are PP cycles that are performed in one step performed by one electronic component mounting machine 10 that constitutes the production line 1 in the mounting process required for the production of board products. .. One electronic component mounting machine 10 executes a mounting process (one step) for each circuit board to be transported, and repeats the same mounting process according to the number of board products produced.

  Here, the mounting head 43 of the electronic component mounting machine 10 is configured to support, for example, eight suction nozzles 44, and the number of electronic components mounted in one process is set to 68 by the process designing unit 81. And In this case, in the normal optimization process, eight electronic components are transferred in the first to eighth PP cycles, and the remaining four electronic components are transferred in the final (ninth) cycle. The transfer operation is set so as to be mounted. At this time, in the final PP cycle, four of the eight suction nozzles 44 are set to an undesignated state in which no electronic component is held.

  When a mounting error is detected in the mounting process according to the control program generated by the normal optimization process as described above, the recovery control unit 64 of the electronic component mounting machine 10 detects the PP in which the mounting error is detected. Immediately after the cycle or after the last PP cycle, a PP cycle for recovery processing is added, and an attempt is made to retransfer the electronic component related to the mounting error in the PP cycle. In other words, the number of PP cycles increases from the initially scheduled number (9 in total in the above example) with the execution of the recovery process.

  On the other hand, the operation setting unit 83 of the present embodiment, as described above, in order to suppress the decrease in productivity due to the execution of the recovery process, the PP cycle except the first and last PP cycles among all the PP cycles. In at least one of the above, the control program is optimized so that some of the plurality of suction nozzles 44 are in the unspecified state. In this way, the operation setting unit 83 sets a part of the plurality of suction nozzles 44 in a non-designated state in a predetermined PP cycle, so that when the mounting error is detected in the previous PP cycle, the operation setting section 83 is in the non-designated state. The suction nozzle 44 is designated to hold the electronic component, and the recovery process for the mounting error can be executed.

  Specifically, in the above example, a total of four suction nozzles 44 in a non-designated state are set in the second to final (9th) PP cycles. As a result, when a mounting error is detected between the first time and the eighth time, the recovery control unit 64 holds the electronic component of the component type related to the mounting error in the suction nozzle 44 in the unspecified state in the subsequent PP cycles. It is possible to execute a recovery process that also serves as a normal PP cycle. As a result, when the mounting error is recovered in the PP cycle, it is not necessary to add the PP cycle for the recovery processing, and the decrease in productivity due to the execution of the recovery processing is suppressed.

  In addition, the operation setting unit 83 allocates the component types for all PP cycles based on the mounting error information Ie and the transfer difficulty information Ic, and calculates the number of suction nozzles 44 that are in an undesignated state. As a result, the operation setting unit 83 secures a trial opportunity of the recovery processing for a component type that is more likely to require the recovery processing, and suppresses the addition of the PP cycle for the recovery processing, thereby performing the recovery processing. We are trying to control the decline in productivity associated with execution.

(Control program optimization process)
The optimization processing of the control program by the optimization device 80 will be described with reference to FIGS. Here, the production line 1 includes a plurality of electronic component mounting machines 10 including a first mounting machine M1, a second mounting machine M2, a third mounting machine M3, and a fourth mounting machine M4, which are electronic component mounting machines 10. Shall be done. In addition, the first mounting machine M1 is configured to support eight suction nozzles 44 by the mounting head 43 and to be able to hold a maximum of eight electronic components in one PP cycle.

  In the optimization process, the process design unit 81 of the optimization device 80 first acquires various data as shown in FIG. 5 (step 11 (hereinafter, “step” is referred to as “S”)). Specifically, the process design unit 81 acquires the board product design information, the mounting error information Ie, and the transfer difficulty information Ic stored in the storage device 72. Next, the process design unit 81 designs each process by allocating the component type and quantity of electronic components transferred in the mounting process by the plurality of electronic component mounting machines 10 based on the acquired various data. The process is executed (S12).

  Here, the electronic parts necessary for the production of board products include special parts that have a special shape and size and require a corresponding holding member, or require a pass/fail judgment before mounting. Sometimes In addition, there may be restrictions on the mounting order due to the positional relationship between electronic components. Therefore, in the above process design processing (S12), the mounting of the special component is assigned to the electronic component mounting machine 10 capable of mounting the special component, and the electronic component having a constraint in the mounting order is set in another process. The cycle time of each process is designed to be averaged.

  Subsequently, the line balance adjustment unit 82 identifies the bottleneck process in each mounting process set by the process design process (S12) (S13). Specifically, as shown in FIG. 6, the line balance adjusting unit 82 calculates the cycle time when each mounting process is executed by the electronic component mounting machine 10. Then, the line balance adjustment unit 82 identifies the mounting process that becomes the maximum in each cycle time as the bottleneck process. Here, it is assumed that the mounting process set in the third mounting machine M3 is the bottleneck process.

  The line balance adjustment unit 82 identifies a component type having a high occurrence frequency of the attachment error based on the attachment error information Ie, and also identifies a component type having a high transfer difficulty of the electronic component based on the transfer difficulty information Ic. Then, the line balance adjusting unit 82 preferentially transfers the electronic component of the component type specified as described above in the mounting process different from the bottleneck process, and the cycle time of each mounting process is averaged. (S14). That is, the line balance adjustment unit 82 exchanges the component type that is likely to require recovery processing due to the occurrence of a mounting error in the bottleneck process and the component type assigned to the mounting process other than the bottleneck process. And adjust it.

  The line balance adjustment unit 82 recalculates the cycle time of each mounting process that varies due to the above adjustment (S14), and determines whether these line balances are within the specified range (S15). When the current line balance is not within the specified range (S15: No), the line balance adjustment unit 82 repeats the bottleneck process identification (S13) and the adjustment process (S14). As a result, when the adjusted line balance is within the specified range (S15: Yes), the cycle time of each mounting process is averaged, and the component type that tends to cause a mounting error is the bottleneck. It is allocated to the mounting process other than the process.

  The operation setting unit 83 specifies a component type having a high frequency of occurrence of a mounting error based on the mounting error information Ie among the component types of the electronic components assigned to the predetermined mounting process, or based on the transfer difficulty information Ic. Then, the component type having a high degree of difficulty in transferring the electronic component is specified (S21). In other words, the operation setting unit 83 grasps at least one of the frequency of occurrence of mounting error and the degree of transfer difficulty of each of a plurality of component types allocated for each mounting process by the electronic component mounting machine 10. In the present embodiment, the operation setting unit 83 specifies a component type having a high value in either the mounting error occurrence frequency or the transfer difficulty level.

  Then, the operation setting unit 83 sets the transfer operation in the mounting process so that the electronic component of the component type specified as described above is transferred with priority in the mounting process (S22). That is, the operation setting unit 83 sets the number of PP cycles based on the number of electronic components that can be held in one PP cycle and the number of electronic components allocated to the mounting process, and in all PP cycles. It is set so that electronic components of component types (component types that are likely to cause mounting errors) that are likely to require recovery processing are transferred in the PP cycle on the front side.

  Accordingly, when a mounting error is detected in the mounting process, the number of remaining PP cycles increases as the component type is likely to need the recovery process. In this way, in the remaining PP cycle, the recovery process for the mounting error can be executed by using the suction nozzle 44 in the unspecified state, and the recovery process trial opportunity is secured.

  Next, the operation setting unit 83 causes the occurrence frequency of the mounting error relating to the component type of the electronic component transferred in the front PP cycle of the two different PP cycles in all the set PP cycles, or the electronic component Based on the transfer difficulty, the number of suction nozzles 44 that are not specified in the rear PP cycle is calculated (S23). Further, the operation setting unit 83, based on the occurrence frequency of the mounting error relating to the component type of the electronic component transferred in a predetermined PP cycle, or the transfer difficulty of the electronic component, the plurality of suctions in the subsequent PP cycles. The number of PP cycles in which a part of the nozzles 44 is in the undesignated state is calculated (S24).

  That is, the operation setting unit 83 includes, for example, the electronic components set in the PP cycle on the front side of the electronic component of the component type having the occurrence frequency of the mounting error more than the regulation or the component type having the regulation transfer difficulty. If so, the suction nozzles 44 that are in the undesignated state in the rear PP cycle are calculated according to the number (S23), and the number of PP cycles that partially include the undesignated suction nozzles 44 is determined. Calculate (S24).

  Then, the operation setting unit 83 adjusts all the PP cycles so that the number of unspecified suction nozzles 44 calculated in S23 and S24 is included in the initially set transfer operation ( S25). At this time, the operation setting unit 83 may increase the number of PP cycles if necessary. Specifically, if the maximum number of electronic components that the first mounting machine M1 can hold in one PP cycle is eight, and the number of electronic components mounted by the mounting process by the first mounting machine M1 is 68 pieces, For example, the minimum number of PP cycles is 9.

  When the PP cycle is the minimum number of 9, as described above, the number of suction nozzles 44 in the undesignated state is four. On the other hand, when the number of the suction nozzles 44 to be set in the unspecified state calculated in S23 and S24 exceeds 4, the mounting process by the first mounting machine M1 is performed 10 times or more. Cycles are secured, and each PP cycle is appropriately adjusted so that the undesignated suction nozzle 44 is included (S25). As a result, the control program used for the mounting process by the first mounting machine M1 is optimized (see FIG. 7).

  As a result, the number of suction nozzles 44 in the non-designated state in a plurality of PP cycles is set unevenly according to the frequency of occurrence of mounting errors or the like, or as a result, is set averagely. Further, since the number of the suction nozzles 44 in the undesignated state is set according to the necessity of the recovery process, it is possible to execute the recovery process corresponding to the case where a plurality of mounting errors are detected. Further, since the suction nozzle 44 in the unspecified state is secured in the PP cycle according to the necessity of the recovery process, it is possible to execute the recovery process corresponding to the case where the mounting error is detected again.

  The operation setting unit 83 determines whether or not the setting of the PP cycle has been completed for the mounting processing by all the electronic component mounting machines 10 (S26). When the setting of the PP cycle is not completed (S26: No), the operation setting unit 83 repeats the above processing (S21 to S25). As a result, the control program used to execute each mounting process is optimized.

(Electronic component mounting process)
Electronic component mounting processing by the electronic component mounting machine 10 will be described with reference to FIGS. 7 and 8. Here, it is assumed that the above-mentioned mounting process is executed by the first mounting machine M1 which is one of the plurality of electronic component mounting machines 10 constituting the production line 1. The control program optimized by the optimizing device 80 is sent to the first mounting machine M1 before the mounting process is executed.

  In the mounting process, the mounting control unit 61 of the first mounting machine M1 executes the PP cycle as shown in FIGS. 7 and 8 according to the control program (S30). Specifically, the mounting control unit 61 first executes a suction process of holding various electronic components designated by the control program by the plurality of suction nozzles 44 (S31). As a result, the suction operation of suctioning and holding the electronic components supplied by the feeder 33 is sequentially executed for each of the plurality of suction nozzles 44.

  Next, the mounting control unit 61 executes recognition processing of the holding state of the electronic component held by the suction nozzle 44 while the mounting head 43 is moving above the mounting position on the circuit board Bd ( S32). Specifically, the mounting control unit 61 acquires the image data obtained by the imaging of the component camera 51, determines whether or not the electronic component is held in each suction nozzle 44, and the attitude of the held electronic component. The quality of is recognized by image processing.

  After that, the mounting control unit 61 executes a transfer process of sequentially transferring the plurality of held electronic components to the circuit board Bd (S33). At this time, the mounting control unit 61 corrects the position and angle of the suction nozzle 44 according to the holding state of the electronic component recognized by the state recognition process (S32), and controls the transfer operation of the electronic component.

  Subsequently, the control device 60 determines whether or not the recovery process is necessary, based on whether or not a mounting error is detected (S40). Specifically, for example, in the state recognition process (S32), the control device 60 detects a suction error in which some of the suction nozzles 44 do not suck the electronic component, or the electronic component in the suction state is defective. If the component type is wrong, it is determined that the recovery process is necessary (S40: Yes).

  In addition, depending on a specific component type, the control device 60 may obtain image data obtained by laterally capturing an electronic component in a sucked state, or capturing the electronic component after mounting with the board camera 52. More detailed state recognition processing may be performed based on the image data, and the necessity of the recovery processing may be determined based on the result of the processing.

  On the other hand, when the control device 60 determines that one PP cycle (S30) is normally executed and the recovery process is unnecessary (S40: No), it is determined whether or not all PP cycles have ended. A determination is made (S50). When all the PP cycles have not been completed (S50: No), the process proceeds to the execution of the PP cycle (S30) from the next time.

  As described above, the recovery process is not necessary when the mounting error does not occur, and the PP cycle (S30) is repeated until the mounting of all electronic components is completed. Thereby, the mounting control unit 61 gives priority to the electronic component of the component type having a high frequency of occurrence of the mounting error or the electronic component of the component type having a high degree of difficulty in transferring the electronic component in the mounting process based on the optimized control program. The transfer operation in the mounting process is controlled so that the transfer is performed.

  On the other hand, when the mounting error is detected and it is determined that the recovery process is necessary (S40: Yes), the recovery control unit 64 executes the corresponding process according to the content of the mounting error (S60). Here, description will be made assuming a case where the electronic component supplied by the component supply device 30 is not sucked and it is determined in the state recognition process (S32) that the electronic component is not held.

  The recovery control unit 64 first compares the number N of consecutive suction errors in a plurality of suction operations using the same feeder 33 to reach the threshold Tr stored in the storage device 62 (S61). ). The threshold value Tr is a set value that serves as a reference for whether or not to execute the recovery process. When the number N of consecutive suction errors is less than the threshold value Tr (S61: Yes), the recovery control unit 64 determines whether or not the suction nozzle 44 in the unspecified state is set in the subsequent PP cycle (S30). A determination is made (S62).

  In the subsequent PP cycle (S30), if the suction nozzle 44 to be in the undesignated state is set (S62: Yes), the recovery controller 64 includes the PP cycle including the suction nozzle 44 set to the undesignated state. It is determined whether or not (S30) is before execution of the replacement process of the suction nozzle 44 (S63). Before the exchange process is executed, or when the exchange program of the suction nozzle 44 is not included in the control program in the first place (S63: Yes), the suction nozzle 44 in the unspecified state is electronically operated in the subsequent PP cycle (S30). Designate to hold the component (S64).

  Further, in the case where the suction nozzle 44 to be in the undesignated state is not set in the subsequent PP cycle (S30), for example, when the PP cycle in which the mounting error is detected is the final cycle (S62: No), the recovery is performed. The control unit 64 newly adds a PP cycle (S65), and instructs the predetermined suction nozzle 44 to hold the electronic component of the component type related to the mounting error in the PP cycle (S64).

  Further, when the PP cycle in which the suction nozzle 44 in the undesignated state is set is after the execution of the replacement processing of the suction nozzle 44 (S63: No), the recovery control unit 64 determines that before the replacement processing. A new PP cycle is added to (S65), and in the PP cycle, a predetermined suction nozzle 44 is designated to hold the electronic component of the component type related to the mounting error (S64). In this way, the recovery control unit 64 controls so that the recovery process for the mounting error is executed before the replacement process.

  Then, after the completion determination (S50: No), in the subsequent PP cycle (S30), the suction nozzle 44, which is initially in the undesignated state, sucks the electronic component of the component type related to the mounting error, and the transfer is performed again. Will be tried. In this way, the recovery control unit 64 attempts to recover the mounting error by adding the operation also serving as the recovery process to the PP cycle (S30) after the PP cycle (S30) in which the mounting error is detected.

  According to such a configuration, the recovery control unit 64 uses the undesignated suction nozzle 44 in the subsequent PP cycle to detect an electronic component when a mounting error is detected again in the recovery process for the detected mounting error. Is held, and the recovery process for the mounting error is executed again. When the number N of consecutive identical mounting errors reaches the threshold Tr (S61: No), the recovery controller 64 suspends the mounting process without executing the recovery process.

  At this time, when the control device 60 determines that, for example, the mounting error is caused by the component shortage, it interrupts the mounting process and notifies the operator to prompt the operator to replenish the electronic components. At this time, the control device 60 may display the error content on the display unit of the control device 60, for example, to guide the operator to perform the recovery work.

(Effects of the configuration of the embodiment)
The optimizing device 80 optimizes the mounting process by the electronic component mounting machine 10. The electronic component mounting machine 10 has a plurality of pick-and-place cycles (hereinafter referred to as PP cycles) in which various electronic components designated by the control program are held by a plurality of holding members (suction nozzles 44) and then transferred to the circuit board Bd. A mounting process that is repeated a number of times is executed, and when a mounting error in which electronic components are not properly transferred during the mounting process is detected, a recovery process that attempts transfer again is executed.
The optimizing device 80 specifies that some of the plurality of holding members (suction nozzles 44) hold the electronic component in at least one of the PP cycles (S30) except the first and last PP cycles (S30). An operation setting unit 83 that sets the transfer operation in the mounting process so as to be in the unspecified state that is not performed. When the operation setting unit 83 detects a mounting error in the previous PP cycle (S30) by setting a part of the plurality of holding members (suction nozzles 44) in the unspecified state in a predetermined PP cycle (S30). In addition, the undesignated holding member (suction nozzle 44) is designated to hold the electronic component, and the recovery process for the mounting error can be executed.

The electronic component mounting machine 10 holds a variety of electronic components designated by the control program by a plurality of holding members (suction nozzles 44) and then transfers them to the circuit board Bd (hereinafter referred to as a PP cycle (S30)). ) Is performed a plurality of times, and a mounting control unit 61 that executes a mounting process, and a recovery that tries to transfer the electronic component again when a mounting error in which electronic components are not properly transferred during the mounting process are detected. And a recovery control unit 64 that executes processing.
Based on the control program, the mounting control unit 61 determines that a part of the plurality of holding members (suction nozzles 44) does not exist in at least one of all PP cycles (S30) except the first and last PP cycles (S30). The transfer operation in the mounting process is controlled so that the electronic component is not held and is in an unspecified state. When a mounting mistake is detected, the recovery control unit 64 designates that the holding member (suction nozzle 44) in the undesignated state holds the electronic component in the subsequent PP cycle (S30), and the recovery processing for the mounting mistake is performed. To execute.

With such a configuration, when a mounting error is detected in a predetermined PP cycle (S30) of the mounting process, the electronic component mounting machine 10 sets the suction nozzle 44 in the unspecified state in the subsequent PP cycle (S30). It is possible to use this to execute a recovery process for a mounting error. That is, the operation also serving as the recovery process is added to the PP cycle (S30) to be executed. As a result, when the mounting error is recovered in the PP cycle (S30), it is not necessary to add a new PP cycle (S30) for the recovery processing, and the time required for the recovery processing can be shortened. Therefore, it is possible to suppress a decrease in productivity due to the execution of the recovery process for the mounting error.
Further, since the recovery process is executed in the PP cycle (S30) after the mounting error is detected, for example, the recovery process is executed after all the PP cycles (S30) scheduled for the control program are executed. As compared with the configuration described above, the mounting error is recovered earlier. According to such an immediate recovery, it is easy to cope with, for example, a case where the mounting order of electronic components is restricted. Further, when the mounting process includes nozzle replacement, the occurrence of nozzle replacement for the recovery process is suppressed, and the time required for the recovery process can be reliably shortened.

The optimizing device 80 also stores the mounting error information Ie indicating the frequency of occurrence of mounting errors for each component type, or the transfer difficulty information Ic preset for each electronic component transfer difficulty level. 72 is further provided. The operation setting unit 83 performs the transfer operation in the mounting process so that the electronic parts of the component type in which the mounting error frequently occurs or the component type in which the electronic component is difficult to transfer are preferentially transferred in the mounting process. Is set (S22).
Further, the mounting control unit 61 of the control device 60 in the electronic component mounting machine 10 mounts an electronic component of a component type having a high mounting error frequency or a component type having a high transfer difficulty of the electronic component based on the control program. The transfer operation in the mounting process is controlled so that the transfer is given priority in the process.
According to such a configuration, the electronic components of the component types that are likely to require the recovery processing in all PP cycles (S30) are mounted with priority. As a result, when a mounting error is detected, the number of remaining PP cycles (S30) increases as the component type is likely to require recovery processing. Therefore, in the remaining PP cycle (S30), the recovery process for the above mounting error can be executed by using the suction nozzle 44 in the unspecified state, and the chance of trial of the recovery process can be increased. As a result, it is possible to suppress an increase in the PP cycle (S30) accompanying the execution of the recovery process.

The optimizing device 80 also stores the mounting error information Ie indicating the frequency of occurrence of mounting errors for each component type, or the transfer difficulty information Ic preset for each electronic component transfer difficulty level. 72 is further provided. The operation setting unit 83 is based on the occurrence frequency of the mounting error relating to the component type of the electronic component transferred in the front PP cycle (S30) of the two different PP cycles (S30) or the transfer difficulty of the electronic component. Then, the number of holding members (suction nozzles 44) that are not designated in the rear PP cycle (S30) is calculated (S23).
According to such a configuration, the number of the suction nozzles 44 in the undesignated state in the plurality of PP cycles (S30) is biasedly set according to the occurrence frequency of the mounting error or the like, or as a result, set averagely. It will be. As a result, the number of the suction nozzles 44 in the unspecified state is set according to the necessity of the recovery process, so that it is possible to deal with the case where a plurality of mounting errors are detected, and to quickly recover the mounting errors. You can

The optimizing device 80 also stores the mounting error information Ie indicating the frequency of occurrence of mounting errors for each component type, or the transfer difficulty information Ic preset for each electronic component transfer difficulty level. 72 is further provided. The operation setting unit 83 determines whether the subsequent PP cycle (S30) is based on the occurrence frequency of the mounting error relating to the component type of the electronic component transferred in the predetermined PP cycle (S30) or the transfer difficulty of the electronic component. The number of PP cycles (S30) in which some of the plurality of holding members (suction nozzles 44) are in the unspecified state is calculated (S24).
According to such a configuration, when a mounting error is detected again in the recovery process, the recovery is performed again for the mounting error by using the undesignated suction nozzle 44 set in the subsequent PP cycle (S30). Processing can be performed. As a result, the suction nozzles 44 in the unspecified state can be secured in the PP cycle (S30) according to the necessity of the recovery process, and it is possible to deal with the case where a mounting error is detected again, and the mounting error can be corrected. The mistake can be recovered early.

The optimizing device 80 optimizes the mounting process by the electronic component mounting machine 10. When the electronic component mounting machine 10 detects a mounting error in which the electronic components are not properly transferred during execution of the mounting process for transferring various electronic components to the circuit board Bd, the recovery process tries the transfer again. And a plurality of circuit boards Bd are arranged in parallel in the transport direction of the circuit board Bd to form a production line 1 for producing board products. Of the mounting processes that can be simultaneously executed by the plurality of electronic component mounting machines 10, the one having the longest cycle time for each mounting process is defined as a bottleneck process.
The optimizing device 80 includes a storage device 72 that stores mounting error information Ie that indicates the frequency of occurrence of mounting errors for each component type, or transfer difficulty information Ic that presets the transfer difficulty of electronic components for each component type. , A process design unit 81 for allocating the component type and quantity of electronic components transferred in the mounting process by a plurality of electronic component mounting machines 10, a component type with a high mounting error frequency, or a high degree of difficulty in transferring electronic components. A line balance adjusting unit 82 that adjusts so that electronic components of different component types are transferred with priority in a mounting process different from the bottleneck process.

  According to such a configuration, the electronic component of the component type that is likely to require the recovery process is allocated to the mounting process different from the bottleneck process. Thereby, even if a mounting error is detected in a mounting process different from the bottleneck process and the recovery process is executed, if the cycle time of the mounting process including the time required for the recovery process is shorter than the cycle time of the bottleneck process. The influence on the whole production process can be prevented, and the influence on the whole production process can be reduced even if it is long. As a result, it is possible to suppress a decrease in productivity due to the execution of the recovery process for a mounting error.

The transfer difficulty information Ic is among the values indicating the size and shape of the electronic component and the frictional force generated between the electronic component and the holding member (suction nozzle 44) used for holding the electronic component in the mounting process. At least one is set as the transfer difficulty of the electronic component.
According to such a configuration, the size and shape of the electronic component are set as the transfer difficulty of the electronic component, so that the optimization that reflects the transfer difficulty is performed. Accordingly, in addition to the method in which the operator directly inputs the transfer difficulty level, the transfer difficulty level can be automatically calculated in consideration of the dimensions and the like of the electronic component. Further, for example, even if electronic components of the same component type use different suction nozzles 44, the transfer difficulty is changed according to the type of the suction nozzles 44 to optimize the mounting process with higher accuracy. be able to.

Further, the electronic component mounting apparatus 10 executes a replacement process of replacing at least a part of the plurality of holding members (suction nozzles 44) with another holding member (suction nozzles 44) during the mounting process. Is further provided. When the mounting error is detected before the replacement process is performed, the recovery control unit 64 executes the recovery process for the mounting error before the replacement process is performed.
According to such a configuration, when the electronic nozzle mounting machine 10 executes the replacement process of the suction nozzle 44 during the continuous PP cycles (S30), one or a plurality of mounting errors are performed before the replacement process is executed. If is detected, the recovery process for the mounting error is executed before the replacement process. As a result, as compared with the configuration in which the recovery process is executed after every PP cycle (S30) scheduled for the control program, the occurrence of the exchange process for the recovery process is suppressed, and the time required for the recovery process is ensured. Can be shortened.

<Modification of Embodiment>
(About the holding member)
In the embodiment, the holding member that holds the electronic component is the suction nozzle 44 that sucks the electronic component by negative pressure. On the other hand, as the holding member, if a plurality of electronic components are supported by the mounting head 43 and can simultaneously hold a plurality of electronic components in one PP cycle, in addition to the suction nozzle 44, a chuck for gripping the electronic components. It may be a device. Even in such a configuration, the same effect as that of the embodiment is achieved.

(Recovery process and exchange process of suction nozzle 44)
In the embodiment, when the mounting process includes the replacement process of the suction nozzle 44, the recovery control unit 64 performs the recovery process before the replacement process for the mounting error detected before the execution of the replacement process. It was composed. On the other hand, if the recovery control unit 64 can hold the electronic component of the component type associated with the mounting error even after executing the replacement process of the suction nozzle 44, for example, the determination of S63 can be omitted.

1: Production line 10: Electronic component mounting machine 20: Substrate transfer device 30: Component supply device 31: Slot, 32: Reel holder, 33: Feeder 40: Component transfer device 41: Head drive device, 42: Moving table, 43: Mounting head 44: Suction nozzle (holding member)
51: Component camera, 52: Substrate camera, 55: Nozzle station 60: Control device 61: Mounting control unit, 62: Storage device 63: Error detection unit, 64: Recovery control unit, 65: Exchange control unit 70: Management device 71 : Management control part, 72: Storage device 80: Optimization device 81: Process design part, 82: Line balance adjusting part, 83: Operation setting part M1: First mounting machine, M2: Second mounting machine, M3: Third Mounting machine, M4: Fourth mounting machine Bd: Circuit board, Ps: Supply position Ie: Mounting error information, Ic: Transfer difficulty information

Claims (9)

An optimization device for optimizing the mounting process by an electronic component mounting machine,
The electronic component mounting machine repeats a pick and place cycle (hereinafter, PP cycle) in which various electronic components designated by a control program are held on a plurality of holding members and then transferred to a circuit board, a plurality of times. The mounting process is performed, and when a mounting error is detected in which the electronic component is not properly transferred during the execution of the mounting process, a recovery process is performed to try the transfer again,
The optimization device is
In at least one of the PP cycles except the first and last PP cycles among all the PP cycles, a part of the plurality of holding members is moved in the mounting process so as to be in a non-designated state where the holding of the electronic component is not designated. An operation setting section that sets the loading operation ,
Mounting error information indicating the frequency of occurrence of the mounting error for each component type, or a storage device that stores transfer difficulty information preset for each electronic component transfer difficulty level ,
The operation setting unit sets a part of the plurality of holding members in the non-designated state in a predetermined PP cycle, so that the undesignated state is detected when the mounting error is detected in the previous PP cycle. The holding member is designated to hold the electronic component to enable execution of the recovery process for the mounting error ,
The operation setting unit is based on the occurrence frequency of the mounting error related to the component type of the electronic component transferred in the front PP cycle of the two different PP cycles, or the transfer difficulty of the electronic component. , An apparatus for optimizing a mounting process for calculating the number of the holding members to be in the unspecified state in the rear PP cycle . The operation setting unit, based on the occurrence frequency of the mounting error related to the component type of the electronic component transferred in the predetermined PP cycle or the transfer difficulty of the electronic component, of the subsequent PP cycles. The mounting processing optimizing device according to claim 1, wherein the number of times of the PP cycle in which a part of the plurality of holding members is in the unspecified state is calculated. An optimization device for optimizing the mounting process by an electronic component mounting machine,
The electronic component mounting machine repeats a pick and place cycle (hereinafter, PP cycle) in which various electronic components designated by a control program are held on a plurality of holding members and then transferred to a circuit board, a plurality of times. The mounting process is performed, and when a mounting error is detected in which the electronic component is not properly transferred during the execution of the mounting process, a recovery process is performed to try the transfer again,
The optimization device is
In at least one of the PP cycles except the first and last PP cycles among all the PP cycles, a part of the plurality of holding members is moved in the mounting process so as to be in a non-designated state where the holding of the electronic component is not designated. An operation setting section that sets the loading operation ,
Mounting error information indicating the frequency of occurrence of the mounting error for each component type, or a storage device that stores transfer difficulty information preset for each electronic component transfer difficulty level ,
The operation setting unit sets a part of the plurality of holding members in the non-designated state in a predetermined PP cycle, so that the undesignated state is detected when the mounting error is detected in the previous PP cycle. The holding member is designated to hold the electronic component to enable execution of the recovery process for the mounting error,
The operation setting unit, based on the occurrence frequency of the mounting error related to the component type of the electronic component transferred in the predetermined PP cycle or the transfer difficulty of the electronic component, of the subsequent PP cycles. An apparatus for optimizing a mounting process for calculating the number of times of the PP cycle in which a part of the plurality of holding members is in the unspecified state . The operation setting unit performs the mounting so that the electronic component of the component type having a high occurrence frequency of the mounting error or the component type having a high transfer difficulty of the electronic component is transferred preferentially in the mounting process. setting the transfer operation in the process, the optimization apparatus of the mounting process according to any one of claims 1 -3. An optimization device for optimizing the mounting process by an electronic component mounting machine,
The electronic component mounting machine,
When a mounting error is detected in which the electronic components are not properly transferred during execution of the mounting process of transferring various electronic components to a circuit board, a recovery process is performed to try transfer again.
A plurality of circuit boards are arranged side by side in the carrying direction to form a production line for producing board products,
Of the mounting processes that can be simultaneously executed by the plurality of electronic component mounting machines, the one having the longest cycle time for each mounting process is defined as a bottleneck process,
The optimization device is
Mounting error information indicating the occurrence frequency of the mounting error for each component type, or a storage device that stores the transfer difficulty information preset for each electronic component transfer difficulty level,
A process design unit for allocating the component type and quantity of the electronic components transferred in the mounting process by the plurality of electronic component mounting machines;
Adjustment is made so that the electronic component of the component type with a high frequency of occurrence of the mounting error or the component type of the electronic component having a high transfer difficulty is transferred with priority in the mounting process different from the bottleneck process. Line balance adjustment part,
A device for optimizing the mounting process. The transfer difficulty information is at least one of a size and a shape of the electronic component and a value indicating a frictional force generated between the electronic component and a holding member used for holding the electronic component in the mounting process. the is set as the transfer level of difficulty for the electronic component, the optimization apparatus of the mounting process according to any one of claims 1 -5. An optimization device for optimizing the mounting process by an electronic component mounting machine,
The electronic component mounting machine repeats a pick and place cycle (hereinafter, PP cycle) in which various electronic components designated by a control program are held on a plurality of holding members and then transferred to a circuit board, a plurality of times. The mounting process is performed, and when a mounting error is detected in which the electronic component is not properly transferred during the execution of the mounting process, a recovery process is performed to try the transfer again,
The optimization device is
In at least one of the PP cycles except the first and last PP cycles among all the PP cycles, a part of the plurality of holding members is moved in the mounting process so as to be in a non-designated state where the holding of the electronic component is not designated. An operation setting section that sets the loading operation ,
Mounting error information indicating the frequency of occurrence of the mounting error for each component type, or a storage device that stores transfer difficulty information preset for each electronic component transfer difficulty level ,
The operation setting unit sets a part of the plurality of holding members in the non-designated state in a predetermined PP cycle, so that the undesignated state is detected when the mounting error is detected in the previous PP cycle. The holding member is designated to hold the electronic component to enable execution of the recovery process for the mounting error ,
The operation setting unit performs the mounting so that the electronic component of the component type having a high occurrence frequency of the mounting error or the component type having a high transfer difficulty of the electronic component is transferred preferentially in the mounting process. Set the transfer operation in processing,
The transfer difficulty information is at least one of a size and a shape of the electronic component and a value indicating a frictional force generated between the electronic component and a holding member used for holding the electronic component in the mounting process. An apparatus for optimizing the mounting process , wherein the electronic component transfer difficulty level is set . A mounting control unit that executes a mounting process in which a pick and place cycle (hereinafter referred to as a PP cycle) in which various electronic components designated by a control program are held by a plurality of holding members and then transferred to a circuit board is repeated. When,
When a mounting error in which the electronic component is not properly transferred is detected during execution of the mounting process, a recovery control unit that executes a recovery process that attempts transfer again,
A replacement control unit that executes a replacement process of replacing at least a part of the plurality of holding members with another holding member during the mounting process ,
The mounting control unit, based on the control program, a part of the plurality of holding members does not hold the electronic component in at least one of the PP cycles other than the first and last of all the PP cycles. Control the transfer operation in the mounting process so as to be in the designated state,
When the mounting error is detected, the recovery control unit instructs the holding member in the unspecified state to hold the electronic component in the subsequent PP cycle, and executes the recovery process for the mounting error. Then
The recovery control unit is an electronic component mounting machine, which executes the recovery process for the mounting error before executing the replacement process when the mounting error is detected before executing the replacement process . Based on the control program, the mounting control unit preferentially transfers the electronic component of a component type with a high frequency of occurrence of the mounting error or a component type with a high transfer difficulty of the electronic component in the mounting process. 9. The electronic component mounting machine according to claim 8 , wherein the transfer operation in the mounting process is controlled so as to be performed.

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