WO2021001962A1

WO2021001962A1 - Component mounter

Info

Publication number: WO2021001962A1
Application number: PCT/JP2019/026460
Authority: WO
Inventors: 公夫藤井
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-07-03
Filing date: 2019-07-03
Publication date: 2021-01-07
Also published as: JP7129566B2; JPWO2021001962A1

Abstract

When a mounting operation assigned to a predetermined holding member is determined to be inexecutable on the basis of the result of a recognition process, a control device of this component mounter sets the mounting operation as a skip operation and executes a change process for changing the mounting position of the mounting action assigned to another holding member that has picked the same type of component according to a picking operation in the same PP cycle as the skip operation, into a mounting position of the skip operation.

Description

Parts mounting machine

The present invention relates to a component mounting machine.

The parts mounting machine executes a mounting process for mounting parts on the board. In the above mounting process, a PP cycle (pick and place cycle) including a collecting operation for collecting parts and a mounting operation for mounting parts on a substrate is repeatedly executed. When a sampling error occurs in a predetermined PP cycle, the component mounting machine skips the component mounting operation related to the sampling error. Then, the component mounting machine executes a recovery process for retrying mounting at the previously skipped mounting position in, for example, the next and subsequent PP cycles (see Patent Document 1).

JP-A-2010-10496

By the way, the mounting position and mounting order in a plurality of PP cycles are preset so as to improve the efficiency and accuracy of the mounting process, for example. Therefore, the timing of executing the recovery process is particularly important because it affects the efficiency of the mounting process and the like. In addition, various aspects may be applied to the mounting process in order to cope with the production of various substrate products. For example, when the same PP cycle includes the mounting operation of the same type of parts, if any of the mounting operations is skipped, it may affect the subsequent mounting operation of the same type of parts. ..

An object of the present specification is to provide a component mounting machine capable of improving the efficiency of production of a substrate product by immediately executing the recovery process in an executing PP cycle in which the recovery process is required. To do.

In the present specification, a plurality of holding members for holding the collected parts, a state recognition unit for executing a process of recognizing the holding state of the parts held by each of the plurality of holding members, a mounting position of the parts, and A control program indicating the mounting order and a control device that repeatedly executes a pick-and-place cycle (hereinafter, “PP cycle”) including a picking operation and a mounting operation of the parts based on the result of the recognition process are provided. The plurality of holding members are assigned the picking operation and the mounting operation of the same type of the parts in at least one of the PP cycles executed over a plurality of times, and the control device receives the control device. When it is determined that the mounting operation assigned to the predetermined holding member is infeasible based on the result of the recognition process, the mounting operation is set as the skip operation and in the same PP cycle as the skip operation. A component mounting machine that executes a change process for changing the mounting position of the mounting operation assigned to one of the other holding members that have collected the same type of component to the mounting position of the skip operation. Disclose.

According to such a configuration, the mounting position change processing is executed in the executing PP cycle in which some mounting operations become infeasible and recovery processing is required. As a result, the recovery process is immediately executed before the next and subsequent PP cycles are executed. Therefore, in a predetermined PP cycle in which a plurality of parts of the same type are mounted, priority is given to mounting the skip operation at the mounting position. In the production of a type of substrate product in which the mounting order for a plurality of mounting positions is affected by the required time, the efficiency of the production can be improved.

It is a schematic diagram which shows the structure of the component mounting machine in an embodiment. It is a schematic view which looked at the mounting head which holds a plurality of suction nozzles in an annular shape from above. It is a schematic view which looked at the mounting head which holds a plurality of suction nozzles in a straight line from above. It is a schematic view which looked at the mounting head which holds a plurality of suction nozzles in a matrix form from above. It is a top view which shows the substrate in FIG. 1 enlarged. It is a flowchart which shows the mounting process by a component mounting machine 1. It is explanatory drawing which shows the relationship between the mounting position and the holding member used before and after the execution of the first change process. It is explanatory drawing which shows the relationship between the mounting position and the holding member used before and after the execution of the 2nd change process. It is explanatory drawing which shows the relationship between the mounting position and the holding member used before and after the execution of the first complementary process. It is explanatory drawing which shows the relationship between the mounting position and the holding member used before and after the execution of the 2nd complement process. It is a flowchart which shows the production process. It is a schematic diagram which shows the structure of the component mounting machine in the modification of embodiment.

1. 1. Outline of the component mounting machine Hereinafter, an embodiment in which the component mounting machine is embodied will be described with reference to the drawings. The component mounting machine constitutes a production line for producing board products together with a plurality of types of board-to-board working machines including, for example, other component mounting machines. The board-to-board working machine that constitutes the above production line includes a printing machine, an inspection device, a reflow furnace, and the like. Further, the configuration of the production line can be appropriately added or changed according to, for example, the type of substrate product to be produced. Specifically, the production line includes a buffer device, a board supply device, a board reversing device, various inspection devices, a shield mounting device, a mold forming device, an adhesive coating device, and an ultraviolet irradiation device that temporarily hold the transferred board. An anti-board working machine such as an apparatus can be appropriately installed.

2. 2. Configuration of Component Mounting Machine 1 The component mounting machine 1 executes a mounting process for mounting components on the substrate 90. As shown in FIG. 1, the component mounting machine 1 includes a board transfer device 10, a component supply device 20, a component transfer device 30, a component camera 41, a board camera 42, and a control device 50. The substrate transfer device 10 is composed of a belt conveyor, a positioning device, and the like. The substrate transfer device 10 sequentially conveys the substrate 90 in the transfer direction, and positions the substrate 90 at a predetermined position in the machine. The board transfer device 10 carries the board 90 out of the component mounting machine 1 after the mounting process is completed.

The component supply device 20 supplies components to be mounted on the substrate 90. The component supply device 20 includes feeders 22 set in a plurality of slots 21. The feeder 22 feeds and moves a carrier tape containing a large number of parts so that the parts can be collected. Further, the parts supply device 20 supplies, for example, relatively large parts in a state of being arranged on a tray 25 placed on the pallet 24. The storage device 23 of the parts supply device 20 stores a plurality of pallets 24, and pulls out a predetermined pallet 24 according to the mounting process to supply the parts.

The parts transfer device 30 transfers the parts supplied by the parts supply device 20 to a predetermined mounting position on the board 90 carried into the machine by the board transfer device 10. The head drive device 31 of the component transfer device 30 moves the moving table 32 in the horizontal direction (X direction and Y direction) by a linear motion mechanism. The mounting head 33 is interchangeably fixed to the moving table 32 by a clamp member (not shown). The mounting head 33 rotatably and vertically supports a plurality of suction nozzles 34.

The suction nozzle 34 is a holding member that holds the collected parts. The suction nozzle 34 sucks the parts supplied by the feeder 22 by the supplied negative pressure air. As the holding member, a chuck or the like that holds the component by gripping it can be adopted. Here, various types can be adopted for the mounting head 33, for example, as shown in FIGS. 2A-2C. The mounting head 33 of FIG. 2A has a rotary head 35 rotatably provided around an R axis parallel to the vertical axis (Z axis). A plurality of holding members (eight suction nozzles 34 in this embodiment) are arranged on the rotary head 35 at equal intervals in the circumferential direction.

The mounting head 33 holds a plurality of suction nozzles 34 in a straight line or an annular shape, and rotates the rotary head 35 to determine the suction nozzles 34 to one or more elevating positions. Then, the mounting head 33 raises and lowers the suction nozzle 34 by driving the lifting device 36. In the mounting head 3 of FIGS. 2B and 2C, a plurality of holding members (eight suction nozzles 34 in this embodiment) are arranged linearly or in a matrix at predetermined positions. The mounting head 33 raises and lowers the suction nozzle 34 by driving an elevating device 36 that can be driven independently.

The component camera 41 and the substrate camera 42 are digital image pickup devices having an image pickup element such as CMOS. The component camera 41 and the substrate camera 42 take an image based on the control signal and send out the image data acquired by the image pickup. The component camera 41 is configured to be able to image a component held by the suction nozzle 34 of the mounting head 33 from below. The substrate camera 42 is configured so that the substrate 90 can be imaged from above.

The control device 50 is mainly composed of a CPU, various memories, and a control circuit. The control device 50 controls the mounting process of mounting the components on the substrate 90. The control device 50 includes a storage device 51. The storage device 51 is composed of an optical drive device such as a hard disk device, a flash memory, or the like. The storage device 51 stores various data such as a control program Rc used for controlling the mounting process. The control program Rc indicates the mounting position and mounting order of the components mounted on the substrate 90 in the mounting process.

Here, the mounting process includes a collecting operation of collecting the parts supplied by the component supply device 20 by the plurality of suction nozzles 34 and a mounting operation of mounting the collected parts at a predetermined mounting position on the substrate 90. A process of repeating a pick-and-place cycle (hereinafter referred to as a “PP cycle”) a plurality of times is included. The control device 50 controls the operation of the component transfer device 30 based on the information output from various sensors, the result of image processing, the control program Rc, and the like in the mounting process. As a result, the positions and angles of the plurality of suction nozzles 34 supported by the mounting head 33 are controlled.

The control device 50 includes a state recognition unit 52. The state recognition unit 52 executes a process of recognizing the holding state of the parts held by each of the plurality of holding members (suction nozzles 34). Specifically, the state recognition unit 52 performs image processing on the image data acquired by the imaging of the component camera 41 after the collection operation in the PP cycle and before the mounting operation, and refers to the reference position of the mounting head 33. Recognize the position and angle of each part. In addition to the component camera 41, the state recognition unit 52 captures image data acquired by, for example, a head camera unit integrally provided with the mounting head 33, capturing the components from the side, the lower side, or the upper side. It may be processed.

According to the result of the recognition process by the state recognition unit 52, it is possible to determine not only the position and angle of the component with respect to the reference position of the mounting head 33, but also whether or not the component has been normally sampled by the sampling operation. For example, in the control device 50, when a predetermined suction nozzle 34 among a plurality of suction nozzles 34 cannot collect a part (when the part cannot be recognized) or when the collected part is not normal (a part of the part). It is determined that the mounting operation assigned to the predetermined suction nozzle 34 in this PP cycle cannot be performed due to a defect, deformation, or a state in which the part is turned inside out).

The control device 50 includes a recovery control unit 53. When various errors occur during the execution of the mounting process, the recovery control unit 53 appropriately executes the recovery process corresponding to the error so that the mounting process can be continued. In the above recovery process, the infeasible mounting operation is tried again between the current PP cycle and the next PP cycle, or the mounting operation in which all PP cycles are completed or becomes infeasible. When the number reaches a predetermined number, it is conceivable to aggregate and try again.

Here, depending on the type of board product, a mounting process for mounting a plurality of parts of the same type on one board may be executed. The mounting process as described above includes, for example, mounting the same type of parts on each of a plurality of unit boards in the multi-chamfered board described later, mounting LED parts and the like side by side in a straight line or a curved line, and the like. Is done. In such a mounting process, the plurality of suction nozzles 34 are assigned the same type of component collecting operation and mounting operation in at least one PP cycle among the PP cycles executed a plurality of times.

In this embodiment, an embodiment of recovery processing applicable when a collection error occurs in a PP cycle in which a plurality of parts having the same part type as described above are tried to be mounted is illustrated. The PP cycle to which the above recovery process is applied may include two or more mounting operations of the same type of parts, and may partially include mounting operations of different types of parts. Further, when a collection error occurs, for example, the collected parts are not normal, countermeasures corresponding to the collection error such as disposal of the parts can be appropriately taken.

In the present embodiment, when the recovery control unit 53 determines that the mounting operation assigned to the predetermined suction nozzle 34 is infeasible based on the result of the recognition process, the mounting operation is skipped. Further, the recovery control unit 53 sets the mounting position of the mounting operation assigned to one of the other suction nozzles 34 for collecting the same type of parts by the sampling operation in the same PP cycle as the skip operation to the mounting position of the skip operation. Execute the change process to be changed.

That is, the recovery control unit 53 conventionally tries the mounting operation again in another PP cycle for the skip operation, but utilizes the fact that the PP cycle in which the collection error occurs includes the collection operation of the same type of parts. Execute the recovery process. That is, the recovery control unit 53 gives priority to the mounting operation at a predetermined mounting position among the mounting positions in the current PP cycle in which the collection error has occurred. The priority mounting position can be arbitrarily set. For example, the earlier the mounting order specified by the control program Rc, the higher the priority may be set.

Further, when the recovery control unit 53 executes the above-mentioned change processing of the mounting position, the recovery control unit 53 executes the complementary processing in order to perform the mounting operation for the changed mounting position. The complement processing may employ, for example, changing the mounting position of the PP cycle from the next time onward, or executing an additional supplement PP cycle at an appropriate timing. Details of the change process and the complement process in the recovery process will be described in the mounting process by the component mounting machine 1.

3. 3. Configuration of Multi-Chamfered Substrate Here, as shown in FIG. 3, the substrate 90 in the present embodiment is a multi-chamfered substrate composed of a plurality of unit substrates 91 (in this embodiment, 30 unit substrates 91). May be good. The substrate 90, which is a multi-chamfered substrate, is mounted with various components 81 by executing a PP cycle for each of a plurality of unit substrates 91, and is subsequently divided into individual substrate products. In the present embodiment, the mounting process includes at least one PP cycle in which a plurality of components 81 of the same type are mounted over a plurality of unit substrates 91.

Further, as shown in FIG. 3, the substrate 90 has an identification code 92 and two reference marks 93. The identification code 92 indicates an identification code (ID) unique to the substrate 90. As the identification code 92, a bar code, a two-dimensional code, or the like can be applied. In the present embodiment, the identification code 92 employs a barcode configured by arranging a plurality of bars having different line widths and intervals between the lines in parallel. The control device 50 reads the ID of the substrate 90 based on the image data acquired by photographing the identification code 92 with the substrate camera 42.

The control device 50 determines, for example, the type of the substrate 90, the type of the substrate product to be produced, the type of the mounting process to be executed, and the like, based on the data in which the ID of the substrate 90 and various information are associated in advance. Further, the identification code 92 may include information indicating the type of the substrate product produced. Each of the two reference marks 93 indicates a reference position of the substrate 90. The control device 50 recognizes the reference mark 93 based on the image data obtained by photographing the reference mark 93 with the substrate camera 42. Then, the control device 50 recognizes the reference position of the substrate 90 positioned by the substrate transfer device 10 based on the position of the recognized reference mark 93.

4. Mounting process by the component mounting machine 1 The mounting process by the component mounting machine 1 will be described with reference to FIGS. 4 to 10. Here, a mounting process in which the substrate 90 is a multi-chamfered substrate will be illustrated. Further, in the configuration of the component mounting machine 1 of the present embodiment, one PP cycle means from the start of a series of collecting operations by at least two or more of the plurality of suction nozzles 34 to the end of the series of mounting operations. It shall be an operation.

In the mounting process for multi-chamfered boards, parts are required to be mounted at all mounting positions specified by the control program Rc, and only the required quantity or the quantity that can be produced is mounted according to the actual mounting condition. There is something. Specifically, instead of mounting the components on all the unit boards 91 of one board 90, which is a multi-chamfered board, the components are mounted only on the unit boards 91 according to the required quantity or the quantity that can be produced. I have something to do. As a result, after the execution of the mounting process as described above, the unit board 91 in which the parts are not mounted is generated. The unit board 91 on which no component is mounted is discarded after the board 90 is divided.

The above-mentioned "mounting actual condition" includes, for example, trying to mount as many parts as the number of parts supplied on the current tray 25 on one substrate 90 which is a multi-chamfered substrate. Specifically, for example, when 21 parts are supplied on the tray 25 for 30 unit substrates 91, the control device 50 uses eight suction nozzles 34 to perform PP three times. Execute the cycle. At this time, the control device 50 executes the subsequent collection operation and the mounting operation because the 22nd and subsequent parts are not supplied regardless of whether or not 30 mounting positions are specified in the control program Rc. Is omitted. Further, if a defect such as a component is found during the execution of the mounting process, the component may be mounted only on the unit board 91 which is smaller than the quantity supplied by the tray 25.

In the following, the mounting process for mounting parts according to the actual mounting conditions as described above will be illustrated. That is, the control device 50 attempts to mount as many parts as the number of parts supplied on the tray 25. The control device 50 recognizes the type, remaining number, and position of the parts supplied on the current tray 25. As a result, the control device 50 can grasp in advance the maximum number of PP cycles to be tried for the substrate 90 to be mounted this time and the maximum number of mounting operations to be tried in each PP cycle.

First, the board transfer device 10 of the component mounting machine 1 executes the carry-in process of the board 90 as shown in FIG. 4 (S11). As a result, the substrate 90 is carried into the machine and is positioned at a predetermined position in the machine. Next, the control device 50 executes the PP cycle (S20). In the PP cycle, the control device 50 repeatedly executes a sampling operation of sampling parts using the plurality of suction nozzles 34 (S21). Here, in order to mount the same type of parts on each of the plurality of unit substrates 91, the plurality of suction nozzles 34 collect the same type of parts from the tray 25. In this collection operation (S21), when the complement processing described later is set, the operation is performed according to the mode of the complement processing.

Subsequently, the state recognition unit 52 executes a process of recognizing the holding state of the parts held by the plurality of suction nozzles 34 (S22). Specifically, the control device 50 moves the mounting head 33 above the component camera 41 and sends an imaging command to the component camera 41. The state recognition unit 52 performs image processing on the image data acquired by the imaging of the component camera 41, and recognizes the posture (position and angle) of the component held by each of the plurality of suction nozzles 34.

The recovery control unit 53 determines whether or not it is necessary to execute the recovery process based on the result of the recognition process (S22) (S23). Specifically, the recovery control unit 53 determines from the result of the recognition process (S22) whether or not each of the one or more suction nozzles 34 that have tried to suck the parts among the plurality of suction nozzles 34 properly holds the parts. judge. Specifically, the recovery control unit 53 holds the parts in an inverted state when the predetermined suction nozzle 34 does not collect the parts, or when the collected parts are tilted with respect to the vertical axis. In some cases, it is determined that the mounting operation by the predetermined suction nozzle 34 is infeasible.

When the recovery control unit 53 determines that the mounting operation assigned to the predetermined suction nozzle 34 cannot be executed and it is necessary to execute the recovery process (S23: Yes), the recovery control unit 53 sets the mounting operation as the skip operation (S24). ). Specifically, for example, as shown in FIG. 5, when the mounting operation by the second and fifth suction nozzles 34 out of the eight suction nozzles 34 is infeasible, the recovery control unit 53 performs the respective suctions. The mounting operation at the mounting positions P12 and P15 assigned to the nozzle 34 is defined as a skip operation.

Subsequently, the recovery control unit 53 executes a change process related to the mounting operation in the same PP cycle (S25). The above-mentioned change process sets the mounting position of the mounting operation assigned to one of the other suction nozzles 34 from which the same type of parts are collected when at least one of the plurality of mounting operations in the PP cycle is a skip operation. It is a process of changing to the mounting position of the skip operation. As a result, the recovery control unit 53 immediately executes the recovery process in the PP cycle in which the collection error occurs, for example.

For the above change process, for example, the following two types of modes can be adopted. As shown in FIG. 5, the first change process is scheduled to execute the mounting positions (P13, P14, P16, ...) Of the mounting operation scheduled to be executed after the skip operation in the same PP cycle immediately before each. Change to the mounting position of the mounting operation of the same type of parts. Here, the numerical values in ○ in the figure indicate the numbers of the suction nozzles 34 from the first to the eighth, and it is assumed that the mounting operation is executed in the order from the top to the bottom in the figure (in FIG. 6). the same).

Also, the first change process is repeated for the skip operation included in the same PP cycle. As a result, when two or more skip operations are included, the mounting position (P16-P18) of the mounting operation scheduled to be executed after the second and subsequent skip operations is the mounting scheduled to be executed two or more times before. It is changed to the mounting position (P14-P16) of the operation. The first change process as described above is a type in which the parts are preferentially mounted at the mounting position in which the mounting order is earlier specified by the control program Rc.

As shown in FIG. 6, the second change process is the mounting position (P17, P17,) of the mounting operation of the same type of component that is scheduled to be executed last among the mounting operations scheduled to be executed after the skip operation in the same PP cycle. P18) and the change process for changing the mounting order to the mounting position (P12, P15) and the mounting order of the skip operation are executed. When two or more skip operations are included in the same PP cycle, the above-mentioned "last execution schedule" corresponds to the execution schedule of the mounting operation for two times from the end as described above. The second change process as described above is a type in which parts are mounted with priority given to maintaining the mounting order specified by the control program Rc.

Here, according to the first change process and the second change process, when the unit board 91 on which the component is mounted is continuous based on the control program Rc, the unit on which the component is mounted even if the skip operation occurs. The substrate 91 can be made continuous. In addition, the first change process can maintain the order of the suction nozzles 34 used for the mounting operation in the same PP cycle. Therefore, the first change process is particularly useful when applied to a configuration in which a plurality of suction nozzles 34 are sequentially indexed to an elevating position, such as a mounting head 33 having a rotary head 35 (see FIG. 2A).

In addition, the second change process can minimize the number of changes in the mounting position. Thereby, for example, the mounting operation of each suction nozzle 34 specified by the optimized control program Rc can be maintained as much as possible. Therefore, the second change process is applied to a configuration in which a plurality of suction nozzles 34 can be independently moved up and down, such as a mounting head 33 (see FIG. 2B) in which a plurality of suction nozzles 34 are linearly arranged. Especially useful.

In the second change process, both the mounting position and the mounting order are changed, but for example, only the mounting position may be changed and the mounting order may not be changed. That is, the recovery control unit 53 uses the first, third, fourth, and sixth suction nozzles 34, which are not related to the skip operation, to perform the mounting operation at the mounting position (P11, P13, P14, P16). Do it first. Then, the recovery control unit 53 uses the seventh and eighth suction nozzles 34 to perform the mounting operation at the mounting positions (P12, P15) to be changed later.

As described above, in the change process (S25), the production efficiency may vary depending on which mode is applied according to the mechanical configuration of the mounting head 33 and the mounting position in one PP cycle. Therefore, the recovery control unit 53 may select and execute a change process that shortens the required time of the PP cycle to which the first change process and the second change process are applied, respectively. According to such a configuration, it is possible to suppress a decrease in production efficiency due to execution of recovery processing (mounting position change processing).

Here, when the change process is executed, the recovery control unit 53 was scheduled to be executed in this PP cycle, but the mounting position where the parts were not mounted due to the change in the mounting position (in the above example). Regarding the mounting positions P17 and P18), it is set that complementary processing is required later. Subsequently, the control device 50 mounts the component using the plurality of suction nozzles 34 after the change process (S25) is executed or when it is determined that the recovery process does not need to be executed (S23: No). The mounting operation is repeatedly executed (S26). In this mounting operation (S26), when the complement processing described later is set, the operation is performed according to the mode of the complement processing.

Subsequently, the recovery control unit 53 determines whether or not it is necessary to set the complementary process (S27). Specifically, the recovery control unit 53 determines that it is necessary to set the complementary process when the change process (S25) is executed in the current mounting process (S27: Yes). The complementary process is a process of mounting a component at a mounting position where the component was not mounted due to a change in the mounting position in the previous PP cycle. In the setting of the complement process (S28), the mode of the complement process to be executed in the subsequent PP cycle is set. For the above complementary processing, for example, the following two types of modes can be adopted.

As shown in FIG. 7, in the first complementary process, when the mounting position change process (S25) is executed in a predetermined PP cycle, a component mounting operation of the same type as the skip operation is performed in the PP cycle scheduled to be executed thereafter. The mounting position of is changed to the mounting position of the mounting operation of the same type of parts scheduled to be executed immediately before each. Specifically, it is assumed that two skip operations occur in the Nth PP cycle, and the mounting positions P17 and P18 are complemented by changing the mounting position. It is assumed that the part type A is specified to be mounted at the mounting positions P17 and P18.

In this case, in the N + 1th PP cycle, the mounting position (mounting position P22-P26 in FIG. 7) of the component mounting operation of the same type (part type A) as the skip operation is set to the same type scheduled to be executed immediately before each. It is changed to the mounting position (mounting positions P17, P18, P22-P24 in FIG. 7) of the mounting operation of the parts of. Further, when the complement processing is executed, the recovery control unit 53 is scheduled to be executed in the N + 1th PP cycle of this time, but the mounting position where the parts are not mounted due to the change of the mounting position (the above). Regarding the mounting positions P25 and P26) in the example of the above, it is set that complementary processing is required later.

In the N + 1th PP cycle, the mounting position and mounting order of the mounting operation of parts of different types (part types B and C) from the skip operation are not changed. In the N + 2nd and subsequent PP cycles, the mounting positions for the same type (part type A) are changed in the same manner as described above. Further, the recovery control unit 53 may add a collection operation and a mounting operation (mounting operation to the mounting positions Pe-1 and Pe in FIG. 7) according to the number of skip operations in the final PP cycle. If the remaining number of parts on the tray 25 is 0, the collecting operation and the mounting operation may be omitted.

As shown in FIG. 8, the second complementary process is included in the predetermined PP cycle before the PP cycle scheduled to be executed thereafter when the mounting position change process (S25) is executed in the predetermined PP cycle. The number of parts to be skipped is collected, and the mounting operation to the mounting position that has not been mounted due to the change of the mounting position is executed. Specifically, it is assumed that two skip operations occur in the Nth PP cycle, and the mounting positions P17 and P18 are complemented by changing the mounting position.

In this case, before the N + 1th PP cycle to be executed, the number of parts to be picked up (the part type A is to be picked up) and the mounting position are changed, which is the number of skipping operations included in the Nth PP cycle. The mounting operation to the mounting positions P17 and P18, which have not been mounted in accordance with the above, is executed. As a result, the PP cycle after the N + 1th time becomes the mounting operation instructed by the control program Rc unless a new skip operation occurs.

Here, according to the first complement processing, it is possible to complement without adding a new PP cycle, and the order of the suction nozzles 34 used for the mounting operation in the PP cycle after the PP cycle in which the skip operation occurs. Can be maintained. Therefore, when the mounting head 33 has the rotary head 35, a decrease in production efficiency can be particularly suppressed. Further, according to the second complement processing, it is possible to prevent the influence of the change processing and the complement processing on the PP cycle after the PP cycle in which the skip operation occurs. Thereby, for example, control based on the optimized control program Rc can be maintained.

Here, the production efficiency and the like may vary depending on which mode is set according to the mechanical configuration of the mounting head 33 and the position of the suction nozzle 34 in a plurality of PP cycles. Therefore, the recovery control unit 53 may switch various modes of the first complement processing and the second complement processing from the viewpoint of production efficiency and quality and appropriately select them. Here, one or more PP cycles scheduled to be executed after the predetermined PP cycle in which the mounting position change process is executed are designated as the scheduled PP cycle group Gc (see FIGS. 7 and 8). Next, the recovery control unit 53 selects and executes a complement process that shortens the required time of the scheduled PP cycle group Gc when the first complement process and the second complement process are separately applied to the scheduled PP cycle group Gc. ..

According to such a configuration, it is possible to suppress a decrease in production efficiency due to execution of complementary processing of recovery processing (mounting position change processing). Further, the recovery control unit 53 may switch various modes again when the skip operation occurs again after starting the complement processing. For example, when the number of skip operations generated in one mounting process is less than or equal to a predetermined value, the first complementary process that can be complemented without adding a new PP cycle is selected, and as the number of subsequent skip operations increases. The second complementary process that adds a new PP cycle may be selected.

When the recovery control unit 53 sets the complement processing as described above (S28), the setting contents of the complement processing are reflected in the collection operation (S21) and the mounting operation (S26) in the subsequent PP cycle. Specifically, for example, when the first complementary process is selected, the mounting position in the subsequent PP cycle is appropriately changed, and when the second complementary process is selected, for example, an additional PP is added before the next PP cycle to be executed. The cycle is inserted. In the additional PP cycle, the holding state recognition process (S22), the necessity determination of the recovery process (S23), and the necessity determination of the further complementary process (S27) are executed in the same manner as in the normal PP cycle.

The control device 50 determines whether or not all the PP cycles have been completed based on the control program Rc and the actual mounting condition (S12). If all the PP cycles have not been completed (S12: No), the control device 50 repeatedly executes the PP cycles (S20). When all the PP cycles are completed (S12: Yes), the control device 50 executes the unloading process of the substrate 90 (S13). In the unloading process of the substrate 90, the substrate transport device 10 unclamps the positioned substrate 90 and unloads the substrate 90 out of the component mounting machine 1.

According to the mounting process as described above, the mounting position change process (S25) is executed in the executing PP cycle in which a part of the mounting operation becomes infeasible and recovery processing is required. As a result, the recovery process is immediately executed before the next and subsequent PP cycles are executed. Therefore, in a predetermined PP cycle in which a plurality of parts of the same type are mounted, priority is given to mounting the skip operation at the mounting position. In the production of a type of substrate product in which the mounting order for a plurality of mounting positions is affected by the required time, the efficiency of the production can be improved.

5. Production processing using a multi-chamfered substrate A production process using a multi-chamfered substrate including a mounting process by the component mounting machine 1 will be described with reference to FIGS. 3 and 9. Specifically, in the production line, as shown in FIG. 9, first, solder is printed on the upper surface of the substrate 90 by a printing machine (S11). Next, the mounting process is executed by one or more component mounting machines 1 (S12). As a result, a large number of components are mounted on the upper surface of the substrate 90. In the above mounting process (S12), a recovery process can be executed as needed.

Here, if the mounting process is executed based on the predetermined mounting actual condition, the parts may be mounted only on a part of the plurality of unit boards 91. In such a case, the substrate 90 is subjected to a marking process (S13) after the mounting process (S12) is executed. The marking process makes the unit substrate 91 visible, for example, by applying ink to the unit substrate 91 on which no component is mounted. As a result, it is possible to prevent the mounting process by another component mounting machine 1 and the inspection process by the inspection device from being executed on the unit board 91 on which the component is not mounted on the downstream side of the component mounting machine 1.

Further, in the marking process, if the area occupied by the plurality of unit boards 91 on which the components are mounted and the area occupied by the plurality of unit boards 91 on which the components are not mounted can be classified in the board 90 which is a multi-chamfered board. , A division line 95 for dividing each region may be attached as shown in FIG. As a result, the marking process visually classifies the unit board 91 on which the component is mounted and the unit board 91 on which the component is not mounted. The marking process is executed by a function provided in the component mounting machine 1 or another board-to-board working machine.

Subsequently, the substrate 90 is subjected to a reflow process by the reflow furnace (S14). As a result, the substrate 90 is in a state where the solder is melted by heating and soldered. Then, after executing the mounting process (S12), the marking process (S13), and the reflow process (S14), the substrate 90 is subjected to a molding process of coating the surface with a resin material (S15). The above-mentioned molding process is, for example, a process in which a substrate 90 is housed inside a mold and filled with a melted resin to form a mold.

Finally, the substrate 90, which is a multi-chamfered substrate, is subjected to a division process (S16). As a result, the plurality of unit substrates 91 are made into individual substrate products. In the division process, the unit board 91 on which the parts are not mounted and which is marked by the marking process (S13) and the unit board 91 on which the parts are normally mounted and can be a board product are sorted.

In the mounting process (S12) of the production process as described above, for example, when a skip operation occurs due to the occurrence of a collection error, the recovery process as described above is appropriately executed, so that the control program Rc is applied to the substrate 90. Parts are mounted without skipping part of the mounting sequence commanded by. In this way, a plurality of components are continuously arranged on the substrate 90, and the unit substrate 91 that cannot be commercialized is prevented from being discontinuously generated.

As a result, for example, a division line 95 can be attached so as to be roughly divided into an area in which the unit substrate 91 that can be commercialized is continuous and an area in which the unit substrate 91 that cannot be commercialized is continuously generated in the marking process. Therefore, the marking process is simplified and the productivity can be improved. Since the unit substrate 91 that can be commercialized and the unit substrate 91 that cannot be commercialized are roughly classified, the division process (S16) and the subsequent sorting process can be simplified.

By the way, if the recovery process is not executed for the unit board 91 to which the parts are not mounted due to the occurrence of the skip operation, the number of parts mounted on the unit board 91 is smaller than that of the surrounding unit boards 91. If such a unit substrate 91 that cannot be commercialized exists discontinuously, the resin material applied to the surface of the substrate 90 in the molding process (S15) becomes not uniform, which causes a factor of lowering the coating quality. On the other hand, when the unit substrate 91 that can be commercialized and the unit substrate 91 that cannot be commercialized are roughly classified according to the above configuration, the resin material is suitably applied to a plurality of unit substrates 91 that can be continuously commercialized. The quality of the molding process can be improved.

6. Modifications of the Embodiment 6-1. Configuration of component mounting machine 1 In the embodiment, the component mounting machine 1 is configured to include one mounting head 33. On the other hand, the component mounting machine 1 may be configured to include a plurality of mounting heads 33 that can operate independently of each other. Specifically, as shown in FIG. 10, the component mounting machine 101 includes a first mounting head 137 and a second mounting head 138 that move one or more suction nozzles 34 in the horizontal direction independently of each other.

The first mounting head 137 and the second mounting head 138 are configured so that their movable ranges overlap each other in the component mounting machine 1, and the mounting operation can be executed on one board 90. The first mounting head 137 supports a part (for example, 4 out of 8) of the plurality of suction nozzles 34 used in the mounting process. The second mounting head 138 supports the remaining part (for example, 4 out of 8) of the plurality of suction nozzles 34.

Then, in the mounting process, the first mounting head 137 is used for the component sampling process and in the holding state of the component during the period in which the component mounting operation on the substrate 90 using the second mounting head 138 is executed. Recognition processing is executed. Then, the second mounting head 138 moves from above the substrate 90 to above the component supply device 20 in order to sample the component after the mounting operation for the sampled component is completed.

In the mounting process using a plurality of mounting heads (first mounting head 137, second mounting head 138), for example, the first mounting head 137 and the second mounting head 138 alternately perform a component collection operation and a mounting operation. repeat. Therefore, in the present embodiment, one PP cycle is a second mounting that is executed in parallel with the mounting operation using the first mounting head 137 after the collection operation using the first mounting head 137 is started. It is assumed that it is an operation until the collection operation and the mounting operation using the head 138 are completed.

In the mounting process with the above configuration, for example, it is assumed that a sampling error occurs in the component holding state recognition process after performing the sampling operation using the first mounting head 137. In such a case, the control device 50 sets the mounting operation related to the collection error as a skip operation. At this time, when the first mounting head 137 supports a plurality of suction nozzles 34 and another suction nozzle 34 collects a part of the same type as the part related to the collection error, the control device 50 implements the operation. As illustrated in the embodiment, the recovery process using another suction nozzle 34 may be executed in the same PP cycle.

Further, in the above situation, the control device 50 is set to collect the parts related to the above collection error using the second mounting head 138 in parallel with the mounting operation using the first mounting head 137. Then, the recovery process using the second mounting head 138 may be executed in the same PP cycle. At this time, a change process for changing the mounting position related to the mounting operation using the second mounting head 138 is executed, and further, a complementary process is appropriately executed in the subsequent PP cycle. The embodiments exemplified in the embodiment can be applied to the above-mentioned change processing and complement processing.

6-2. Recovery processing In the embodiment, in the mounting position change processing, the mounting order instructed by the control program Rc is prioritized by the mounting position first. On the other hand, in the process of changing the mounting position, various matters may be prioritized. For example, when the substrate 90 is a multi-chamfered substrate as in the embodiment, the unit substrate 91 that can be commercialized is located on the upstream side or the downstream side of the substrate 90 in the transport direction, or in the front side or the rear side region of the component mounting machine 1. The mounting position may be changed so that continuity is prioritized.

6-3. In other embodiments, the production processing of the substrate product includes marking processing and molding processing. The marking process is executed in a device installed between the plurality of component mounting machines 1, and may also be executed in the machine of the component mounting machine 1. In addition, the marking process and the molding process may not be included in the production process of the substrate product.

In the embodiment, the substrate 90 used for producing the substrate product is a multi-chamfered substrate composed of a plurality of unit substrates 91. On the other hand, the substrate 90 may be a general-purpose substrate other than the multi-chamfered substrate. In such a configuration, when the PP cycle is executed a plurality of times and a plurality of parts of the same type are mounted in the same PP cycle, the mounting process for executing the recovery process as illustrated in the embodiment is performed. Can be applied. In such a configuration, the same effect as that of the embodiment is obtained.

1: Parts mounting machine, 30: Parts transfer device, 33: Mounting head, 137: First mounting head, 138: Second mounting head, 34: Suction nozzle, 50: Control device, 51: Storage device, 52: Status Recognition unit, 53: Recovery control unit, 81: Parts, 90: Board (multi-chamfered board), 91: Unit board, 92: Identification code, 93: Reference mark, 95: Classification line, Rc: Control program, Gc: Schedule PP cycle group

Claims

Multiple holding members that hold the collected parts,
A state recognition unit that executes a process of recognizing the holding state of the parts held by each of the plurality of holding members, and
Based on the control program indicating the mounting position and mounting order of the parts and the result of the recognition process, the pick-and-place cycle (hereinafter, “PP cycle”) including the picking operation and the mounting operation of the parts is repeatedly executed. Equipped with a control device,
The plurality of holding members are assigned the collecting operation and the mounting operation of the same type of parts in at least one of the PP cycles executed over a plurality of times.
When the control device determines that the mounting operation assigned to the predetermined holding member is infeasible based on the result of the recognition process, the control device sets the mounting operation as a skip operation and is the same as the skip operation. The change process of changing the mounting position of the mounting operation assigned to one of the other holding members from which the parts of the same type were sampled by the collecting operation in the PP cycle to the mounting position of the skip operation is executed. , Parts mounting machine.
The control device changes the mounting position so that the component is mounted so that the mounting order takes precedence over the mounting position of the earlier mounting operation among the plurality of mounting operations scheduled to be executed in the PP cycle. The component mounting machine according to claim 1, which executes the process.
The control device sets the mounting position of the mounting operation scheduled to be executed after the skip operation in the same PP cycle to the mounting position of the mounting operation of the same type of component scheduled to be executed immediately before each. The component mounting machine according to claim 2, wherein the change process for each change is executed.
The control device skips the mounting position and the mounting order of the mounting operation of the same type of component that is scheduled to be executed last among the mounting operations scheduled to be executed after the skip operation in the same PP cycle. The component mounting machine according to claim 2, wherein the change process for changing the mounting position and the mounting order of the operation is executed.
The change in which the mounting position of the mounting operation scheduled to be executed after the skip operation in the same PP cycle is changed to the mounting position of the mounting operation of the same type of component scheduled to be executed immediately before each. The process is the first change process
In the same PP cycle, among the mounting operations scheduled to be executed after the skip operation, the mounting position and the mounting order of the mounting operation of the same type of the component scheduled to be executed last are set to the mounting position of the skip operation. And the change process of changing to the mounting order is set as the second change process.
A claim that the control device selects and executes the change process that shortens the time required for each of the PP cycles when the first change process and the second change process are applied separately to the PP cycle. The parts mounting machine according to 2.
When the control device executes the change process of the mounting position in the predetermined PP cycle, the control device performs the mounting position of the component mounting operation of the same type as the skip operation in the PP cycle scheduled to be executed thereafter. The component mounting machine according to any one of claims 1-5, which executes complementary processing for changing the mounting operation of the same type of component to the mounting position, which is scheduled to be executed immediately before each.
When the control device executes the change processing of the mounting position in the predetermined PP cycle, the number of skip operations included in the predetermined PP cycle before the PP cycle scheduled to be executed thereafter. The component mounting machine according to any one of claims 1-5, which executes a complementary process including a mounting operation to the mounting position that has not been mounted due to the collecting operation of the component and the change of the mounting position. ..
In the PP cycle scheduled to be executed after the predetermined PP cycle in which the change processing of the mounting position is executed, the mounting position of the component mounting operation of the same type as the skip operation is scheduled to be executed immediately before each. The complementary process of changing the mounting operation of the same type of component to the mounting position is defined as the first complementary process.
Before the PP cycle scheduled to be executed after the predetermined PP cycle in which the change processing of the mounting position is executed, the number of skip operations included in the predetermined PP cycle and the collection operation of the component and the said. Complementary processing including the mounting operation to the mounting position that has not been mounted due to the change of the mounting position is defined as the second complementary process.
One or more of the PP cycles scheduled to be executed after the predetermined PP cycle in which the change processing of the mounting position is executed is defined as a scheduled PP cycle group.
The control device selects and executes the complementary process in which the time required for the scheduled PP cycle group is shortened when the first complementary process and the second complementary process are separately applied to the scheduled PP cycle group. The component mounting machine according to any one of claims 1-5.
The substrate on which the component is mounted is a multi-chamfered substrate which is composed of a plurality of unit substrates and is divided after mounting the same type of component on each of the plurality of unit substrates by executing the PP cycle. Item 5. The component mounting machine according to any one of Items 1-8.
The control device executes a mounting process of repeating the PP cycle a plurality of times so as to mount the component on a part of the unit boards among the plurality of unit boards.
After executing the mounting process, the multi-chamfered board is divided after executing a marking process for visually separating the unit board on which the component is mounted and the unit board on which the component is not mounted. The component mounting machine according to claim 9.
The control device executes a mounting process of repeating the PP cycle a plurality of times so as to mount the component on a part of the unit boards among the plurality of unit boards.
The component mounting machine according to claim 9 or 10, wherein the multi-chamfered substrate is divided after performing a molding process of coating the surface with a resin material after executing the mounting process.
The component mounting machine further includes a mounting head that supports each of the plurality of holding members and integrally moves the plurality of holding members in the horizontal direction.
One of the PP cycles is any one of claims 1-11, which is an operation from the start of a series of collection operations by at least two or more of the plurality of holding members to the end of a series of mounting operations. Parts mounting machine described in the section.
The component mounting machine further includes a first mounting head and a second mounting head that support a part of the plurality of holding members and move the holding members in the horizontal direction independently of each other.
The one PP cycle is a collection operation using the second mounting head, which is executed in parallel with the mounting operation using the first mounting head after the collection operation using the first mounting head is started. The component mounting machine according to any one of claims 1-11, which is an operation until the mounting operation is completed.