JP3258792B2 - Component mounting device - Google Patents
Component mounting deviceInfo
- Publication number
- JP3258792B2 JP3258792B2 JP29332393A JP29332393A JP3258792B2 JP 3258792 B2 JP3258792 B2 JP 3258792B2 JP 29332393 A JP29332393 A JP 29332393A JP 29332393 A JP29332393 A JP 29332393A JP 3258792 B2 JP3258792 B2 JP 3258792B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- component mounting
- machine
- placement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、生産ライン中に複数台
の部品装着機を並べる部品装着装置に関し、電子回路基
板組立工程に利用することができる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus in which a plurality of component mounting machines are arranged in a production line, and can be used in an electronic circuit board assembly process.
【0002】[0002]
【従来の技術】生産ライン中に複数台の部品装着機を並
べ、各部品装着機に部品装着の一端を担わせるに際し、
どの部品装着機にどの部品を振り分けるかは作業能率上
大きな意味を持つ。その振り分け作業を自動化し、作業
時間と労力を減少させようという装置が、特開平5−2
59693号公報に記載されている。2. Description of the Related Art When arranging a plurality of component mounting machines in a production line and each component mounting machine plays a part of component mounting,
Which component is to be allocated to which component mounting machine has a great significance in terms of work efficiency. An apparatus for automating the sorting operation and reducing the working time and labor is disclosed in Japanese Patent Laid-Open No. 5-2 / 1993.
No. 59693.
【0003】[0003]
【発明が解決しようとする課題】特開平5−25969
3号公報記載の装置は、同一機種の実装機が存在する場
合にそれらをひとくくりにした仮想実装システムを構成
し、その上で各実装機に関し最適実装デ−タ、部品毎の
タクトデ−タを作成している。すなわち単一ライン中に
同一機種の実装機が複数台存在するような大規模システ
ムに適用されるものであるが、本発明は、ライン中に同
一機種の部品装着機が存在しない小規模システムにも適
用できる部品振り分け手法を提供しようとするものであ
る。Problems to be Solved by the Invention
The apparatus described in Japanese Patent Application Laid-Open No. 3 (1996) -1995 constitutes a virtual mounting system in which mounting machines of the same model exist when they are present, and then performs optimal mounting data and tact data for each component on each mounting machine. Has been created. That is, the present invention is applied to a large-scale system in which a plurality of mounters of the same model exist in a single line, but the present invention is applied to a small-scale system in which there is no component mounter of the same model in a line. The purpose of the present invention is to provide a component distribution method that can also be applied.
【0004】[0004]
【課題を解決するための手段】本発明では、生産ライン
に配置した複数台の部品装着機の各々がどの部品を装着
するかの振り分けを、以下の処理により行うものとし
た。 a.装着の分担を仮設定する。 b.テストピ−スを生産ラインに流し、各部品装着機が
テストピ−スに自己の分担分の部品を装着するのに要す
る時間を計測する。 c.テストピ−スへの部品装着に要した時間と、テスト
ピ−スに装着したものを含め、自己の装着可能な部品種
類の情報を、部品装着機同士で相互に通信する。 d.装着時間が長い方の部品装着機は、仮設定で自己に
割り当てられた部品の中から、他方の部品装着機が装着
可能で、且つ装着の役割を他方の部品装着機に委譲する
ことにより装着時間の均等化に役立つ部品を選択し、そ
の部品の装着に必要な情報を他方に転移する。 e.部品装着の役割を移転した後の装着分担に基づき装
着のNCデ−タを再編成する。According to the present invention, distribution of which component is mounted by each of the plurality of component mounting machines arranged on the production line is performed by the following processing. a. Temporarily set the allocation of mounting. b. The test pieces are sent to the production line, and the time required for each component mounting machine to mount its own part on the test pieces is measured. c. The time required for mounting the components on the test piece and the information on the types of components that can be mounted, including those mounted on the test piece, are mutually communicated between the component mounting machines. d. For the component placement machine with the longer placement time, the other component placement machine can be placed out of the components assigned to it in the tentative setting, and the placement role is delegated to the other component placement machine. A part that helps time equalization is selected, and information necessary for mounting the part is transferred to the other. e. The NC data of the mounting is reorganized based on the allocation of the mounting after the role of the component mounting is transferred.
【0005】[0005]
【作用】上記処理により、各部品装着機の稼働時間が均
等化され、かつ、部品振り分けに際して、部品の無駄な
振り分けを回避し、部品振り分けが一層スムーズにかつ
短時間に行われる。According to the above processing, the operation time of each component mounting machine is equalized.
When equalizing and sorting parts,
Avoids sorting, makes parts sorting smoother and
It takes place in a short time .
【0006】[0006]
【実施例】図1において、1は生産ラインである。生産
ライン1は電子回路基板の組立に使用されるものであ
り、2台の部品装着機10A、10Bを有する。部品装
着機10A、10Bはいずれも情報の送受信機能と情報
の処理・記憶装置を備えている。部品装着機10A、1
0Bの上流側及び下流側には電子回路基板組立作業に関
連したその他の機械が配置されるが、これらは図示を省
略する。20は生産ライン中の各機械を統括制御する制
御装置、21は情報を処理した上で制御装置20に伝達
する処理部である。処理部21には、デ−タ記憶部2
2、CAD装置23、キ−ボ−ド等の入力装置24、及
び表示装置25が接続されている。生産ライン1中の各
機械と制御装置20とはLAN(ロ−カルエリアネット
ワ−ク)26で接続される。DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 denotes a production line. The production line 1 is used for assembling an electronic circuit board, and has two component mounting machines 10A and 10B. Each of the component mounting machines 10A and 10B has an information transmitting / receiving function and an information processing / storage device. Component mounting machine 10A, 1
Other machines related to the electronic circuit board assembling work are arranged on the upstream side and the downstream side of OB, but these are not shown. Reference numeral 20 denotes a control device that controls each machine in the production line, and reference numeral 21 denotes a processing unit that processes information and transmits the information to the control device 20. The processing unit 21 includes a data storage unit 2
2, a CAD device 23, an input device 24 such as a keyboard, and a display device 25 are connected. Each machine in the production line 1 and the control device 20 are connected by a LAN (local area network) 26.
【0007】次に、部品装着機10A、10Bへの部品
の振り分けに際して行う処理について説明する。まず、
部品装着機10A、10Bの各々で行う装着作業をCA
D装置23上で仮に設定する。次に、生産ライン1にテ
ストピ−ス(この場合電子回路基板)を流し、部品装着
機10A、10Bがテストピ−スに自己の分担分の部品
を装着するのに要する時間を、部品装着機それぞれに計
測させる。計測後、テストピ−スへの部品装着に要した
時間と、テストピ−スに装着したものを含め、自己が装
着することが可能な部品種類の情報を、部品装着機同士
で相互に通信させる。自己の装着時間と他方の装着時間
を比較した結果、装着時間の長い方の部品装着機は、仮
設定で自己に割り当てられた部品の中から、他方の部品
装着機が装着可能で、且つ装着の役割を委譲することに
より装着時間の均等化に役立つ部品を選択し、その部品
の装着に必要な情報(CAD情報)を他方に転移する。
最後に、部品装着の役割を移転した後の装着分担に基づ
き、装着のNCデ−タを再編成する。再編成は処理部2
1で行う。Next, a description will be given of processing performed when components are distributed to the component mounting machines 10A and 10B. First,
The mounting work performed by each of the component mounting machines 10A and 10B is CA
It is temporarily set on the D device 23. Next, a test piece (in this case, an electronic circuit board) is supplied to the production line 1, and the time required for the component mounting machines 10A and 10B to mount their own components on the test piece is determined by the respective component mounting machines. To measure. After the measurement, the time required for mounting the components on the test piece and the information on the types of components that can be mounted by themselves, including those mounted on the test piece, are mutually communicated between the component mounting machines. As a result of comparing the mounting time of oneself with the mounting time of the other, the component mounting machine with the longer mounting time is able to mount the other component mounting machine from the components assigned to itself in the provisional setting, and mounts. By transferring the role of the component, a component useful for equalizing the mounting time is selected, and information (CAD information) necessary for mounting the component is transferred to the other component.
Finally, the NC data for mounting is rearranged based on the allocation of the mounted parts after the role of the mounted parts is transferred. Reorganization is processing unit 2
Perform in step 1.
【0008】上記実施例では、部品装着機相互間の通信
にLANを用いたが、LANを介さず部品装着機同士を
直接接続しても良い。In the above embodiment, the LAN is used for communication between the component mounting machines. However, the component mounting machines may be directly connected to each other without using the LAN.
【0009】[0009]
【発明の効果】本発明によれば、小規模システムにおい
ても部品振り分けを自動的に行うことができ、各部品装
着機の稼動時間を均等化することができる。また、テス
トピ−スへの装着実績に基づきNCデ−タを再編成する
ので、計算結果の信頼性が高い。更に、自己の装着可能
な部品種類の情報を、部品装着機同士で相互に通信し、
装着時間が長い方の部品装着機は、仮設定で自己に割り
当てられた部品の中から、他方の部品装着機が装着可能
で、且つ装着の役割を委譲することにより装着時間の均
等化に役立つ部品を選択し、その部品の装着に必要な情
報を他方に転移するので、部品の無駄な振り分けを回避
し、部品振り分けを一層スムーズにかつ短時間に行うこ
とができる。 According to the present invention, parts distribution can be performed automatically even in a small-scale system,
The operating time of the landing machine can be equalized . In addition, since the NC data is rearranged based on the results of mounting on the test piece, the reliability of the calculation result is high. In addition, you can wear it yourself
Information of various component types is communicated between component mounting machines,
Component placement machines with longer placement times can be assigned to
The other component mounting machine can be mounted from the applied components
And by delegating the role of wearing,
Select a part that is useful for equalization and provide the information necessary to install that part.
Transferring information to the other side, avoiding unnecessary sorting of parts
Parts distribution more smoothly and in a shorter time.
Can be.
【図1】部品装着装置の概略構成図である。FIG. 1 is a schematic configuration diagram of a component mounting apparatus.
【図2】処理フロ−を示すフロ−チャ−トである。FIG. 2 is a flowchart showing a processing flow.
1 生産ライン 10A 部品装着機 10B 部品装着機 26 LAN 1 production line 10A component mounting machine 10B component mounting machine 26 LAN
Claims (1)
るものにおいて、どちらの部品装着機がどの部品を装着
するかの振り分けを、以下の処理により行うことを特徴
とする部品装着装置。 a.装着の分担を仮設定する。 b.テストピ−スを生産ラインに流し、各部品装着機が
テストピ−スに自己の分担分の部品を装着するのに要す
る時間を計測する。 c.テストピ−スへの部品装着に要した時間と、テスト
ピ−スに装着したものを含め、自己の装着可能な部品種
類の情報を、部品装着機同士で相互に通信する。 d.装着時間が長い方の部品装着機は、仮設定で自己に
割り当てられた部品の中から、他方の部品装着機が装着
可能で、且つ装着の役割を他方の部品装着機に委譲する
ことにより装着時間の均等化に役立つ部品を選択し、そ
の部品の装着に必要な情報を他方に転移する。 e.部品装着の役割を移転した後の装着分担に基づき装
着のNCデ−タを再編成する。1. A component mounting apparatus in which two component mounting machines are arranged on a production line, wherein the distribution of which component mounting machine mounts which component is performed by the following processing. a. Temporarily set the allocation of mounting. b. The test pieces are sent to the production line, and the time required for each component mounting machine to mount its own part on the test pieces is measured. c. The time required for mounting the components on the test piece and the information on the types of components that can be mounted, including those mounted on the test piece, are mutually communicated between the component mounting machines. d. For the component placement machine with the longer placement time, the other component placement machine can be placed out of the components assigned to it in the tentative setting, and the placement role is delegated to the other component placement machine. A part that helps time equalization is selected, and information necessary for mounting the part is transferred to the other. e. The NC data of the mounting is reorganized based on the allocation of the mounting after the role of the component mounting is transferred.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29332393A JP3258792B2 (en) | 1993-11-24 | 1993-11-24 | Component mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29332393A JP3258792B2 (en) | 1993-11-24 | 1993-11-24 | Component mounting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07136876A JPH07136876A (en) | 1995-05-30 |
JP3258792B2 true JP3258792B2 (en) | 2002-02-18 |
Family
ID=17793348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29332393A Expired - Fee Related JP3258792B2 (en) | 1993-11-24 | 1993-11-24 | Component mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3258792B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4127086B2 (en) * | 2003-03-19 | 2008-07-30 | 松下電器産業株式会社 | Electronic component mounting system and electronic component mounting method |
KR100861512B1 (en) * | 2007-03-06 | 2008-10-02 | 삼성테크윈 주식회사 | Total control system of a plurality of chip mounter |
-
1993
- 1993-11-24 JP JP29332393A patent/JP3258792B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07136876A (en) | 1995-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |