JP2009111103A - Component mounting condition determining method, component mounting apparatus and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting condition determining method and the like, capable of improving throughput of a component mounting line, even when the tact time of some component mounting apparatuses causes a bottleneck. <P>SOLUTION: The method of determining mounting conditions for a component mounting apparatus for mounting components on a substrate 120 includes mounting condition changing steps (S1001-S1011) for gradually changing the mounting conditions so that the tact time may become small within a range not exceeding a quality boundary value indicating a boundary enough to maintain the minimum quality predetermined each of the mounting conditions, for a plurality of mounting conditions influencing the tact time of the component mountint apparatus and the quality of component mounting. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for determining mounting conditions by a component mounting apparatus for mounting components on a substrate.

  In component mounting lines that mount components on a printed circuit board or other board, it is necessary to level and shorten the tact (processing time) of the component mounting equipment that constitutes the line in order to improve the throughput of the entire line. It is done. That is, it is required to minimize the line tact (the maximum tact among the tacts for each apparatus constituting the line). Here, the component mounting apparatus is a general term for apparatuses constituting the component mounting line, and specifically includes apparatuses such as a printing apparatus, an adhesive application apparatus, a component mounting apparatus, a reflow apparatus, and an inspection apparatus.

  Therefore, focusing on the component mounting device that mainly constitutes the component mounting line, adjusting the component arrangement, suction sequence, mounting sequence, etc., of the component supply unit, the load balance between each component mounting device is taken into consideration. A method for reducing tact time has been proposed.

  However, even if the above method or the like is used to reduce the tact while considering the load balance between the component mounting devices, the load between the different types of component mounting devices (for example, the printing device and the component mounting device) is reduced. Since it is difficult to consider the balance, there is a problem that the load balance is lost in the entire component mounting line, and the line tact cannot be reduced beyond a certain level.

  Therefore, conventionally, an adjustment method has been proposed for leveling tact when a component mounting apparatus other than the component mounting apparatus has the maximum tact in the component mounting line (for example, Patent Document 1).

In Patent Document 1, as shown in FIG. 13, when a component mounting device other than the component mounting device 211 such as the printing device 210 has the maximum tact in the component mounting line 200, the mounting speed of the component mounting device 211 is decreased. Thus, the tact of the component mounting apparatus 211 is increased within a range not exceeding the maximum tact. As a result, the quality of component mounting can be improved while maintaining the line tact.
Japanese Patent No. 3461574

  However, in such a conventional tact adjustment method, although tact leveling can be achieved, the line tact is the same as before adjustment, and there is a problem that the throughput of the component mounting line cannot be improved.

  Therefore, the present invention has been made to solve the above problems, and improves the throughput of the component mounting line even when the tact of some of the component mounting apparatuses constituting the component mounting line is a bottleneck. An object of the present invention is to provide a component mounting condition determination method and the like that can be performed.

  In order to achieve the above object, a component mounting condition determining method according to the present invention is a method for determining a mounting condition by a component mounting apparatus that mounts a component on a board, and improves the tact and component mounting quality of the component mounting apparatus. For multiple mounting conditions that have an impact, the mounting conditions are sequentially changed so that the tact is reduced within a range that does not exceed the quality boundary value that indicates the boundary that can maintain the minimum quality predetermined for each mounting condition. It is characterized by including various mounting condition changing steps.

  This makes it possible to shorten the tact of the component mounting device while maintaining the minimum quality, and even if the tact of some component mounting devices is a bottleneck, Throughput can be improved.

  In other words, by changing the mounting conditions that affect the component mounting quality in the component mounting apparatus that is considered difficult to shorten the tact by already executing the means for shortening the tact, Reduces tact time. Here, simply changing the mounting conditions so that the tact time can be shortened causes a problem in the quality of the board after mounting the components. Therefore, by changing the mounting conditions within a range that does not exceed the quality boundary value, the tact can be shortened while maintaining a certain level of quality.

  In the mounting condition changing step, it is preferable that the change is performed with priority given to a mounting condition that gives the highest priority to the quality of component mounting among the plurality of mounting conditions.

  The mounting condition changing step includes: a selecting step for selecting one mounting condition giving the highest priority to mounting quality from the plurality of mounting conditions; and a value that reduces the tact for the selected mounting condition. A change step for changing to a tact, a calculation step for calculating a tact under the changed mounting condition, and a determination step for determining whether or not the calculated tact is greater than a predetermined tact. Only when it is determined that the tact of the mounting apparatus is the maximum, the change in the printing condition change step is performed, and when it is determined that the tact calculated in the determination step is larger than the predetermined tact. The selection in the selection step, the change in the change step, the calculation in the calculation step, and the determination in the determination step are repeated. Door is preferable.

  As a result, the mounting conditions are changed in consideration of the degree of deterioration of the component mounting quality. Therefore, it is possible to improve the throughput of the component mounting line while suppressing the deterioration of the component mounting quality as much as possible.

  The component mounting condition determination method further includes an acquisition step of acquiring tacts of all the component mounting apparatuses that constitute a production line including the component mounting apparatus, and the tact of the component mounting apparatus among the acquired tacts. A determination step for determining whether or not it is maximum, and only when the tact of the component mounting apparatus is determined to be maximum in the determination step, the change in the mounting condition change step is performed, In the determination step, it is preferable that the determination is performed by setting a tact other than the component mounting apparatus as the predetermined tact among the tact acquired in the acquisition step.

  As a result, the mounting conditions can be changed compared to the tacts of other devices that make up the component mounting line, so it is possible to reduce the tact of some component mounting devices to a level that does not become a bottleneck in the component mounting line. Become.

  Note that the present invention can also be realized as a mounting apparatus using steps included in such a component mounting condition determination method. Further, it can be realized as a program for causing a computer to execute the steps included in the component mounting condition determination method. Such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  According to the present invention, in a component mounting line for mounting components on a printed circuit board or the like, even if the tact of some of the component mounting apparatuses is a bottleneck, the throughput of the component mounting line is improved. Is possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a component mounting line 100 for mounting an electronic component according to the present embodiment on a substrate such as a printed wiring board. This component mounting line is composed of component mounting devices such as a printing device 110, an adhesive application device 111, a component mounting device 112, a reflow device 113, and an inspection device 114 from the upstream side.

  The printing apparatus 110 is an example of a component mounting apparatus that prints (applies) cream solder or the like on a substrate in order to electrically connect and mechanically fix electronic components.

  The adhesive application device 111 is a component mounting apparatus that applies an adhesive for temporarily adhering an electronic component on a substrate only to a necessary portion so that a relatively large electronic component is not displaced from the substrate during transportation or the like. It is an example.

  The component mounting device 112 is an example of a component mounting device that mounts a plurality of electronic components on a board that has been carried in from the adhesive application device 111.

  The reflow device 113 is an example of a component mounting device that sends heated gas to cream solder printed on a substrate in order to perform soldering processing of electronic components placed on the substrate carried in from the component mounting device 112 It is.

  The inspection device 114 is an example of a component mounting device that inspects the mounting state of components on the board that has been carried in from the reflow device 113 and the printed state of solder.

  As described above, according to the component mounting line 100, the substrate put into the printing apparatus 110 passes through the adhesive application device 111, the component mounting device 112, the reflow device 113, and the inspection device 114 in this order, thereby obtaining an electronic component. Is implemented. In such a line configuration, the work of the immediately following apparatus cannot be started unless the work of the immediately preceding apparatus is completed. Therefore, if even one unit in the line has a long tact, the throughput of the entire line is the tact of the apparatus. It will be rate-limited.

  Hereinafter, the printing apparatus 110, which is an example of a component mounting apparatus constituting the component mounting line 100, will be described in more detail.

  FIG. 2 is a plan view of the printing apparatus 110. The printing apparatus 110 is an apparatus that prints cream solder 121 on a substrate 120. A mask 122 having an opening in a land on the substrate 120 (a place where the cream solder 121 is to be applied), and a cream placed on the mask 122. A squeegee 123 for scraping the solder 121, a cleaning roll 124 for removing the cream solder 121 remaining on the mask 122 after printing, and the like. Although not shown in the drawing, the printing apparatus 110 also includes a control unit as a controller that controls these mechanism units.

  FIG. 3 is a functional block diagram illustrating the configuration of the printing apparatus 110. The printing apparatus 110 includes a mechanism unit 130 including a squeegee 123 and a cleaning roll 124 shown in FIG. 2, a control unit 131 that is a computer device that controls the mechanism unit 130, and an input unit such as a keyboard that serves as an interface with an operator. 132 and an output unit 133 such as an LCD.

  The control unit 131 includes a memory or a microcomputer that stores a control program. When the control unit 131 is activated by an instruction from an operator via the input unit 132, the control program causes the mechanism unit 130 to operate according to a preset printing condition. By controlling, printing is sequentially performed on the substrate 120 that is sequentially carried in, and is then carried out to the downstream apparatus. The control unit 131 further includes a table storage unit 134, a current value storage unit 135, and a printing condition change unit 136, which are functions for changing the printing conditions according to the present invention.

  The table storage unit 134 corresponds to a memory or the like and is an example of a unit that stores the print condition table 140. Here, the printing condition table 140 includes a plurality of setting values that can maintain a predetermined minimum quality for each of a plurality of mounting conditions that affect the tact of the component mounting apparatus and the quality of component mounting, FIG. 4 is an example of a table including information on influences corresponding to respective setting values. Here, as shown in FIG. 4, a plurality of settings are set for a plurality of printing conditions that affect tact and print quality. It is an information table that holds the value and the magnitude of the influence of the setting value on the tact and print quality. The print condition table 140 further includes, in accordance with each print condition, a device life priority ranking that ranks the influence value of the device life due to the quality boundary value and the tact priority that are the limit values for maintaining the minimum print quality. Hold.

Hereinafter, items of the printing condition table 140 will be described.
“Printing condition” is an example of a plurality of mounting conditions that affect the tact of the component mounting apparatus and the quality of the component mounting. Here, the printing conditions are various conditions that affect the tact and printing quality of the printing apparatus 110. Usually, the manufacturer provides a limit value for maintaining the minimum print quality as a recommended value. Details of the printing conditions shown in the drawing will be described later.

  “Equipment life priority” is a ranking based on the magnitude of the influence on the device life by giving priority to shortening the tact time to the printing conditions. When the quality priorities of the printing conditions described below are the same, by preferentially selecting printing conditions with a small setting value of `` equipment life priority '', the life of the equipment is extended, that is, the equipment Degradation can be suppressed and the influence of quality deterioration can be reduced.

  “Quality priority levels 1 to 5” are a plurality of setting values for each printing condition arranged stepwise in order of increasing print quality (increase in tact). “5” is a setting value when quality is prioritized most. “Quality priority 1” represents a quality boundary value.

  The current value storage unit 135 corresponds to a memory or the like, and is an example of a unit that stores a current setting value related to printing conditions. For example, a setting value corresponding to the quality priority of each printing condition as shown in FIG. 4 is held.

  The printing condition changing unit 136 is an example of a mounting condition changing unit that sequentially changes setting values of a plurality of mounting conditions stored in the current value storage unit so that the tact becomes smaller than the present time. Is a processing unit realized by a memory, a microcomputer, and the like, and by referring to the print condition table 140 stored in the table storage unit 134 and the current value of the print condition stored in the current value storage unit 135, This is an example of a printing condition changing unit that sequentially changes the setting values of a plurality of printing conditions stored in the current value storage unit so that the tact is reduced.

  Next, a basic operation of the printing apparatus 110 according to the present embodiment configured as described above will be described.

  FIG. 5 is a flowchart showing a printing processing procedure by the printing apparatus 110 with a focus on processing that affects tact.

  First, when the substrate 120 is carried into the printing apparatus 110 (S501), the printing apparatus 110 brings the substrate 120 into close contact with the lower surface of the mask 122 (S502). Next, the printing apparatus 110 moves the squeegee 123 to print the cream solder 121 on the substrate 120 through the opening provided in the mask 122 (S503). When printing is completed, the printing apparatus 110 separates the substrate 120 from the mask 122 (S504) and unloads the substrate 120 (S505). Finally, the printing apparatus 110 removes the cream solder 121 remaining on the mask 122 by the cleaning roll 124 (S506).

  Through the above processing, the cream solder is printed on the land of the substrate 120 carried into the printing apparatus 110 and carried out to the next apparatus.

  6 to 9 are diagrams specifically explaining how the printing conditions shown in the printing condition table of FIG. 4 affect the tact and the printing quality in the above-described printing processing procedure.

  FIG. 6 is a diagram for explaining the squeegee speed 141 shown in FIG. 4. The squeegee speed 141 (moving speed of the squeegee 123) when the cream solder 121 is printed on the substrate 120 by moving the squeegee 123 is tact time. And the effect on quality. As shown in FIG. 6A, when the squeegee speed 141 is low, the cream solder 121 is completely accommodated in the opening provided in the mask 122 and the print quality is improved, but the tact is increased. On the other hand, as shown in FIG. 6B, when the squeegee speed 141 is high, the tact is small, but the print quality is low because the cream solder 121 does not completely fit in the opening provided in the mask 122. .

  FIG. 7 is a diagram for explaining the squeegee multi-stage control 142 shown in FIG. 4. When the cream solder 121 is printed on the substrate 120 by moving the squeegee 123, the number of stages of the squeegee multi-stage control 142 (the movement of the squeegee 123). This shows the effect of the number of stoppages on the tact and quality. As shown in FIG. 7A, when the number of stages of the squeegee multi-stage control 142 is large (two stages in the figure), the cream solder 121 is completely accommodated in the opening provided in the mask 122 and the print quality is improved. Will grow. Conversely, as shown in FIG. 7B, when the number of stages of the squeegee multi-stage control 142 is small (one stage in the figure), the tact is small, but the cream solder 121 is completely formed in the opening provided in the mask 122. The print quality is low because it does not fit.

  FIG. 8 is a diagram for explaining the cleaning speed 143 shown in FIG. 4. When cleaning the cream solder 121 remaining on the mask 122, the cleaning speed 143 (moving speed of the cleaning roll 124) is tact and quality. The effect on As shown in FIG. 8A, when the cleaning speed 143 is low, the cream solder 121 remaining in the opening provided in the mask 122 is completely removed and the print quality is improved, but the tact is increased. Conversely, as shown in FIG. 8B, when the cleaning speed 143 is high, the tact is small, but the cream solder 121 remains in the opening provided in the mask 122, and the print quality is low.

  FIG. 9 is a diagram for explaining the mask separation speed 144 shown in FIG. 4, and the mask separation speed 144 (the speed at which the substrate 120 and the mask 122 are separated) when the substrate 120 and the mask 122 are separated after printing is completed. Shows the effect of tact on tact and quality. As shown in FIG. 9A, when the mask separation speed 144 is low, the cream solder 121 having the same shape as the opening provided in the mask 122 remains on the substrate and the print quality is improved, but the tact is large. Become. Conversely, as shown in FIG. 9B, when the mask separation speed 144 is high, the tact is small, but the shape of the cream solder 121 printed on the substrate 120 is broken, and the print quality is low.

  As described above, when printing is performed in the printing apparatus 110, there are a plurality of printing conditions that affect tact and print quality. Normally, these printing conditions are suggested by the manufacturer as a recommended limit value to maintain the minimum print quality, but the user sets a printing condition with a margin in quality than the limit value. Often used.

  Therefore, when the printing apparatus 110 is a bottleneck in the component mounting line 100, the printing conditions with sufficient quality are changed before printing as shown in FIG. 10 to reduce the tact of the printing apparatus 110. By doing so, it becomes possible to eliminate the bottleneck of the component mounting line 100.

  FIG. 10 is a flowchart showing a processing procedure when changing the printing conditions of the printing apparatus 110 before executing printing in order to eliminate the bottleneck of the component mounting line 100.

  First, the printing condition changing unit 136 acquires a tact or a line tact of an apparatus (a printing apparatus 110, an adhesive application apparatus 111, a component mounting apparatus 112, a reflow apparatus 113, an inspection apparatus 114, etc.) constituting the component mounting line 100. (S1001). Here, if the tact of the printing apparatus 110 is the maximum (Yes in S1002), the printing condition changing unit 136 sets the next tact next to the printing apparatus 110 as the requested tact (S1003), and the printing apparatus. If the tact of 110 is not the maximum (No in S1002), the process ends.

  Next, the printing condition changing unit 136 acquires the current setting value related to the printing condition stored in the current value storage unit 135 (S1004), and refers to the printing condition table 140 stored in the table storage unit 134. Thus, the print condition having the highest quality priority among the current set values and the quality higher than the quality boundary value is acquired as the print condition having a low degree of quality deterioration due to the change (S1005).

  The printing condition changing unit 136 determines whether there are a plurality of acquired printing conditions (S1007) when the printing conditions matching the conditions can be acquired (Yes in S1006). In S1006, No), the process is terminated. Here, when there are a plurality of acquired printing conditions (Yes in S1007), the printing condition changing unit 136 selects the printing condition having the highest device life priority among the acquired printing conditions (S1008), and acquired it. If there are not a plurality of printing conditions (No in S1007), the process proceeds to the next process (S1009).

  Then, the printing condition changing unit 136 displays the current value of the printing condition obtained by the processing so far (the printing condition acquired in S1006 if No in S1007, or the printing condition selected in S1008 if Yes in S1007). The current value stored in the storage unit 135 is changed to a value obtained by lowering the quality priority by one (S1009). The printing condition changing unit 136 calculates the tact of the printing apparatus 110 at the changed current value (S1010), and repeats the printing condition changing process until the calculated tact of the printing apparatus 110 becomes smaller than the requested tact. (S1011).

  FIG. 11 illustrates the above processing with a specific example. First, in the component mounting line 100, the tact (40 seconds) of the printing apparatus 110 is a bottleneck (S1101). Therefore, the printing apparatus 110 considers the mask separation speed 144, which is the printing condition with the highest quality priority of the current value, as a printing condition with a low degree of quality deterioration by changing the setting value, and sets the quality priority. The setting value is changed by one (S1102). As a result, although the tact time of the printing apparatus 110 is as small as 34 seconds, the fact that the printing apparatus 110 is a bottleneck has not been resolved, so the printing apparatus 110 again sets the setting value of the mask separation speed 144 having the highest quality priority. Is changed (S1103). As a result, the tact time of the printing apparatus 110 is 28 seconds, which is no longer a bottleneck in the component mounting line 100. Therefore, the printing apparatus 110 ends the printing condition change process.

  As described above, even when the tact of the printing apparatus 110 is a bottleneck in the component mounting line 100, by reducing the tact of the printing apparatus 110, the line tact is reduced, that is, the throughput of the entire line is improved. It becomes possible to make it. Since the printing condition with the highest quality priority is changed in consideration of the degree of deterioration in printing quality, it is possible to suppress the deterioration in printing quality as much as possible. In addition, by changing the printing conditions within a range that does not exceed the quality boundary value, it becomes possible to maintain a print quality of a certain level or higher.

  In the present embodiment, the throughput of the component mounting line has been improved by changing the printing conditions of the printing apparatus. However, the present technique may be applied to other apparatuses constituting the component mounting line. . For example, in the case shown in FIG. 12, it is conceivable to improve the throughput of the component mounting line by applying this method.

  FIG. 12 is a diagram illustrating an example of applying the present technique to an apparatus other than the printing apparatus among the component mounting apparatuses constituting the component mounting line 100. Here, the component mounting apparatus is a general term for apparatuses constituting the component mounting line 100. Specifically, the printing apparatus 110, the adhesive application apparatus 111, the component mounting apparatus 112, the reflow apparatus 113, the inspection apparatus 114, and the like. Applicable devices.

  In the upper part of the figure, a component mounting line 100 and a component mounting apparatus constituting the component mounting line 100 are shown. Since it is the same as that shown in FIG. In the lower part of the figure, mounting conditions corresponding to apparatuses other than the printing apparatus 110 among the component mounting apparatuses shown in the upper part of the figure are displayed. Here, the mounting conditions are a general term for a plurality of conditions that affect the tact and quality of the component mounting apparatus. In addition to the printing conditions described above, the bonding conditions, mounting conditions, reflow conditions, and inspections described below. Conditions are also included.

  The bonding conditions 151 are a plurality of conditions that affect the tact and quality of the adhesive application device 111, and specifically, the application amount, the application temperature, the number of disposals, the application height, and the like.

  The mounting condition 152 is a plurality of conditions that affect the tact and quality of the component mounting apparatus 112, and specifically includes a mounting speed, a suction speed, a recognition speed, a feeder feed speed, and the like.

  The reflow conditions 153 are a plurality of conditions that affect the tact and quality of the reflow apparatus 113, and specifically correspond to the substrate transfer speed, the temperature profile, the oxygen concentration, and the like.

  The inspection condition 154 is a plurality of conditions that affect the tact and quality of the inspection device 114, and specifically includes head acceleration, head maximum speed, field resolution, establishment time, number of recognized parts, and the like.

  Similar to the printing apparatus, the component mounting apparatus other than these printing apparatuses also includes a control unit 131 as shown in FIG. In this case, the control unit 131 includes a “mounting condition changing unit” instead of the “printing condition changing unit”, and the table storage unit 134 holds a “mounting condition table” instead of the “printing condition table”. In the “mounting condition table”, instead of the printing conditions shown in FIG. 4, adhesive conditions 151, mounting conditions 152, reflow conditions 153, or inspection conditions 154 corresponding to the respective apparatuses are held. Value is set.

  In addition, the “mounting condition changing unit” executes the same processing as the flowchart shown in FIG. 10 to change the mounting conditions of the component mounting apparatus before executing the component mounting, thereby eliminating the bottleneck of the component mounting line 100. It becomes possible to do.

  That is, the “mounting condition changing unit” refers to the “mounting condition table” and the current set value when the tact of the own apparatus is the largest among the component mounting apparatuses constituting the component mounting line 100. Thus, the mounting condition having the highest quality priority among the current set values and the quality higher than the quality boundary value is acquired as the mounting condition having a low degree of quality degradation due to the change. Then, the “mounting condition changing unit” selects one mounting condition from the acquired mounting conditions, and then changes the current value of the mounting condition to a value obtained by lowering the quality priority by one, and changes the tact after the change. calculate. Such processing is repeated until the apparatus does not reach the maximum tact in the component mounting line 100, or until all mounting conditions reach the quality boundary value, and the mounting conditions are changed.

  As described above, even when a component mounting apparatus other than the printing apparatus is a bottleneck in the component mounting line 100, the tact is reduced so that the mounting condition of the quality higher than the quality boundary value having the highest quality priority is reduced. By changing it, it is possible to suppress the degradation of quality as much as possible, to reduce the line tact after ensuring a certain level of quality, that is, to improve the throughput of the entire line.

  As mentioned above, although the component mounting apparatus which concerns on this invention was demonstrated based on embodiment, this invention is not limited to this embodiment. Unless it deviates from the meaning of this invention, the form which carried out the various deformation | transformation which those skilled in the art can think to this embodiment, and the structure constructed | assembled combining the component in different embodiment is also contained in the scope of the present invention. .

  The present invention is a component mounting apparatus that constitutes a component mounting line for mounting components on a printed circuit board or the like, particularly when the tact of some of the component mounting apparatuses becomes a bottleneck of the entire line. This can be used as a component mounting apparatus that can eliminate the problem.

It is a figure which shows the structure of a component mounting line. It is a top view of a printing apparatus. FIG. 2 is a functional block diagram illustrating a configuration of a printing apparatus. FIG. 3 is a diagram illustrating a configuration of a printing condition table held by a printing apparatus. 6 is a flowchart illustrating a printing processing procedure performed by the printing apparatus. (A) It is the figure which showed the influence which acts on a tact and quality when a squeegee speed is low. (B) It is the figure which showed the influence which acts on a tact and quality when a squeegee speed is high. (A) It is the figure which showed the influence which acts on a tact and quality when there are many stages of squeegee multistage control. (B) It is the figure which showed the influence which acts on a tact and quality when there are few steps | paragraphs of squeegee multistage control. (A) It is the figure which showed the influence which acts on a tact and quality when a mask separation speed is low. (B) It is the figure which showed the influence which acts on a tact and quality when a mask separation speed is high. (A) It is the figure which showed the influence which acts on a tact and quality when a cleaning speed is low. (B) It is the figure which showed the influence which acts on a tact and quality when a cleaning speed is high. It is the flowchart which showed the process sequence when changing the printing conditions of a printing apparatus. It is a figure explaining the process shown by the flowchart of FIG. It is the figure which showed the example of application of this method to apparatuses other than the printing apparatus which comprises a component mounting line. It is a figure explaining the conventional tact adjustment method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting line 110 Printing apparatus 111 Adhesive application apparatus 112 Component mounting apparatus 113 Reflow apparatus 114 Inspection apparatus 120 Board | substrate 121 Cream solder 122 Mask 123 Squeegee 124 Cleaning roll 130 Mechanism part 131 Control part 132 Input part 133 Output part 134 Table memory | storage part 135 Current Value Storage Unit 136 Printing Condition Changing Unit 140 Printing Condition Table 141 Squeegee Speed 142 Squeegee Multistage Control 143 Cleaning Speed 144 Mask Separation Speed 151 Adhesion Condition 152 Mounting Condition 153 Reflow Condition 154 Inspection Condition 200 Component Mounting Line 210 Printing Device 211 Component Mounting apparatus

Claims (9)

A method for determining mounting conditions by a component mounting apparatus for mounting components on a board,
For a plurality of mounting conditions that affect the tact of the component mounting apparatus and the quality of component mounting, the tact is within a range that does not exceed a quality boundary value that indicates a boundary that can maintain a predetermined minimum quality for each mounting condition. A component mounting condition determining method comprising a mounting condition changing step for sequentially changing mounting conditions so as to be reduced. The component mounting condition determining method according to claim 1, wherein in the mounting condition changing step, the changing is performed with priority given to a mounting condition that gives the highest priority to the quality of component mounting among the plurality of mounting conditions. . The mounting condition changing step includes:
A selection step of selecting one mounting condition giving the highest priority to the quality of component mounting from the plurality of mounting conditions;
A change step of changing the selected mounting condition to a value that reduces the tact;
A calculation step for calculating a tact in the changed mounting condition;
Determining whether the calculated tact is greater than a predetermined tact,
When it is determined that the tact calculated in the determination step is greater than a predetermined tact, the selection in the selection step, the change in the change step, the calculation in the calculation step, and the determination in the determination step 3. The component mounting condition determining method according to claim 2, wherein the determination is repeated. The component mounting condition determination method further includes an acquisition step of acquiring tacts of all the component mounting apparatuses that constitute a production line including the component mounting apparatus;
Determining whether the tact of the component mounting apparatus is the maximum among the obtained tacts,
Only when it is determined that the tact of the component mounting apparatus is the maximum in the determination step, the change in the mounting condition change step is performed,
4. The component mounting condition determination according to claim 3, wherein, in the determination step, the determination is performed using a tact other than the component mounting apparatus as the predetermined tact in the tact acquired in the acquisition step. 5. Method. The component mounting apparatus includes an adhesive application device for applying an adhesive for temporarily bonding an electronic component on a substrate, a component mounting device for mounting a plurality of components on the substrate, and a cream-like solder printed on the substrate. 5. A component mounting condition according to claim 1, wherein the component mounting condition is a reflow device that feeds heated gas to the substrate or an inspection device that inspects the mounting state of the component on the substrate and the printed state of the solder. Decision method. A component mounting apparatus for mounting components on a board,
A plurality of setting values capable of maintaining a predetermined minimum quality for each of a plurality of mounting conditions affecting the tact and the component mounting quality of the component mounting apparatus, and the plurality of setting values corresponding to each of the plurality of setting values A table storage unit for storing a table including information on influences;
A current value storage unit storing current setting values of the plurality of mounting conditions;
By referring to the setting value stored in the current value storage unit and the table stored in the table storage unit, it is stored in the current value storage unit so that the tact becomes smaller than the present time. A component mounting apparatus comprising: a mounting condition changing unit that sequentially changes setting values of a plurality of mounting conditions. In the table, for each of the plurality of mounting conditions, the plurality of setting values are arranged in ascending order or descending order of the size of the tact or the degree of the quality,
The information on the influence is a position where the plurality of setting values are arranged in the table,
The mounting condition changing unit refers to the position in the table where the current setting value is arranged, so that the mounting condition with the lowest tact priority among the current setting values, or the quality priority 7. The mounting condition with the highest degree is specified, and the specified mounting condition is changed to a setting value with a higher tact priority or a setting value with a lower quality priority. Component mounting equipment. The component mounting according to claim 7, wherein, for each of the plurality of mounting conditions, the setting value having the highest tact priority is arranged as a boundary value capable of maintaining the lowest quality. apparatus. A program for determining mounting conditions by a component mounting apparatus for mounting components on a board,
A program for causing a computer to execute the steps included in the component mounting condition determination method according to claim 1.

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