JP2007018505A - Production management method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production management method of a part mounting machine for controlling generation of stock-out or a stock to the utmost and to provide the production management method for reducing a power consumption in the event of an enough production capacity. <P>SOLUTION: The above production facility acquires a production information constituting a production plan (S604 to S606) while a mounting substrate is produced, and the production facility includes a throughput deciding step (S607) to decide the throughput of the production facility related to the mounting substrate based on the production information while the production facility produces a series of mounting substrates. Furthermore, the production facility includes production condition deciding steps (S608 to S615) to decide the production condition so as to reduce the power consumption of the production facility in a range not to be lower than the decided throughput when the throughput decided by the throughput deciding step is lower than a current throughput of the production facility. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounter for producing a mounting board by mounting components on a board, and a production management method for a production facility constituting a production line including a plurality of the component mounters.

  Conventionally, when an electronic component is mounted on a board such as a printed wiring board to produce a mounting board, a production line is used. This production line includes equipment that plays a role such as a device that prints solder on a substrate, a device that applies adhesive to the substrate, a device that mounts electronic components on the substrate, and a device that solders the substrate and electronic components. It is a production line that is lined up and produces mounting boards by flow work.

  In order to obtain high throughput as a whole production line, high throughput is required also in individual production equipment, for example, a component mounter for mounting components on a board. And in order to realize this, the component mounting machine is a suction process that is a process of sucking and holding the component supplied to the component mounting machine by vacuum, and a process of transporting the lifted component from the component supply unit to the substrate The hardware measures such as moving parts at high speed are taken in each process of the transfer process and the mounting process, which is the process of lowering and placing the transferred parts on the board surface, or attaching to the component mounter The arrangement order of component cassettes for supplying components and component tapes is optimized, and software measures are taken to optimize the component mounting order (see, for example, Patent Document 1).

And, by holding such a high-throughput production line, it is possible to produce mounting boards as planned, fully corresponding to production plans that are planned based on sales prospects, which are information from sales. Has been done.
JP 2002-50900 A

  However, information such as sales forecasts that are the basis of production plans are only expected values, and such production plans are created in a relatively long span, such as annual or monthly units. In many cases, there is a difference between a mounting board produced by a daily operation plan based on the above and a mounting board that is actually shipped (sold).

  If there is a difference between the planned value and the actual value in this way, the completed mounting board must be stored in the production factory, so-called inventory, or production cannot catch up and cannot be shipped (cannot be sold). So-called out-of-stock items may occur.

  In general, the shortage affects downstream processes, for example, the process of mounting a mounting board to complete a product, so it tends to be a production plan that is more likely to have a stock than a shortage. A space for storing the mounting substrate is required, and storage costs are incurred.

  In addition, in order to deal with unstable factors such as sudden change of plan even though there is a margin in terms of delivery time, we will continue to produce the specified number of boards quickly while maintaining the high throughput. The trend is also strong. In this case, although the production plan can be achieved, power is wasted and inventory is increased, leading to an increase in costs including power costs.

  The present invention has been made in view of the above problems, and provides a production management method for a component mounting machine that can suppress the occurrence of shortage and inventory as much as possible. It is an object of the present invention to provide a production management method capable of achieving the above.

  In order to achieve the above object, a production management method according to the present invention is a production management method for managing production of a board by a component mounter that mounts components on a board, and includes a production information obtaining step for obtaining production information; And a throughput determining step for determining a throughput based on the production information.

  As a result, it is possible to determine the throughput based on the acquired production information and make adjustments so as to minimize the shortage and inventory, thereby saving power.

  The production information acquisition step acquires the production information constituting the production plan while the production equipment is producing the mounting board, and the throughput determination step is the production equipment producing the series of mounting boards. In the meantime, it is desirable to determine the throughput of the production facility related to the mounting board based on the production information.

  In addition, it is desirable that the production information acquired in the production information acquisition step includes the production number of the mounted substrates or a production time that is a time for producing the production number. The production information acquisition step further includes a sales number acquisition step of acquiring a sales number of a product in which the mounting board produced by the production facility is incorporated, and the production number of the mounting board is acquired based on the acquired sales number. good.

  The production information acquisition step further includes a mounting board number acquisition step for acquiring the number of mounting boards produced by the production facility, and a completed board number acquisition step for acquiring the number of mounting boards in a completed state produced by the production line; And a production number changing step of changing the production number based on the difference between the number of mounting boards obtained in the mounting board number obtaining step and the number of mounting boards obtained in the completed board number obtaining step.

  The production information acquisition step may further include a production time change step of changing the production time based on the time during which the production facility is interrupting production.

  Thereby, production information is acquired in real time during the production of the substrate, and the throughput of the production apparatus is determined in real time based on the acquired production information.

  Therefore, the production equipment can be managed with new throughput based on the latest information, and the number of production boards and production time that meet the latest production information can be obtained. Become.

  Further, when the throughput determined in the throughput determination step is lower than the current throughput of the production facility, the production condition is determined such that the power consumption of the production facility is reduced within a range not lower than the determined throughput. It is desirable to include a condition determination step.

  It is preferable that the production condition determining step further includes a mounting acceleration reducing step of reducing throughput by reducing an acceleration generated when the production facility is operated.

  As a result, when the throughput determined is lower than the throughput realized by the current production facility, that is, when there is a time margin in the production facility, the production facility is operated with power saving using this time margin. be able to.

  The object of the present application can also be achieved as a production management program that causes a computer to execute the above steps. It can also be achieved as a production management apparatus provided with means for realizing the steps.

  Furthermore, even if a component mounter, which is one of production facilities, includes the production management device, the object can be achieved.

  According to the present invention, so-called just-in-time production that suppresses inventory (intermediate inventory) and shortage can be realized on a production line in which components are mounted on a board. Furthermore, when there is a surplus in production, energy management and a reduction in production cost can be realized by performing production management with reduced power consumption.

  Hereinafter, a production management apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a production line managed by the production management apparatus according to the present embodiment.

  The production line 10 is a production line that sequentially transports a board from an upstream production facility to a downstream production facility, and produces a mounting board on which components are mounted by a flow operation. 30, a solder printer 16, conveyors 18 and 26, an adhesive applicator 20, component mounters 22 and 24, and a reflow furnace 28 are provided as production facilities.

  The computer 12 includes a production management apparatus 100 (see FIG. 4).

  The stockers 14 and 30 are devices for stocking substrates, and the stocker 14 is located on the uppermost stream of the production line, and the stocker 30 is located on the most downstream side of the production line. That is, the stocker 14 is stocked with a substrate on which no component is mounted, and the stocker 30 is stocked with a completed mounting substrate with the component mounted thereon.

  The solder printer 16 is an apparatus that prints a solder pattern on a substrate using paste solder by a screen printing technique. The solder printer 16 contacts the mask on which the solder pattern is formed with the substrate, and prints the solder pattern by moving the squeegee in parallel while supplying paste solder from above the mask.

  The conveyors 18 and 26 are apparatuses for transporting the substrate.

  The adhesive applicator 20 is an apparatus that applies an adhesive for temporarily bonding an electronic component on a substrate only to a necessary portion so that a relatively large electronic component is not displaced from the substrate during transportation. For example, the adhesive applicator 20 moves the tank and the substrate with a viscous adhesive pushed out from the tank, and applies the adhesive onto the substrate so as to be linear or dotted. Done.

  The component mounters 22 and 24 are devices for mounting components on a board. Details will be described later.

  The reflow furnace 28 is a device for melting the solder printed by the solder printing machine 16 and heating the component on the substrate by heating the substrate on which the component is mounted. The computer 12 is a computer that comprehensively controls the entire production line. The computer 12 includes a production management apparatus 100 and is connected to all the above-described production facilities constituting the production line to manage production of each production facility. The computer 12 is also connected to a network 101 such as the Internet for communicating with other computers such as a sales performance management server (not shown).

  The word “production” described in the present specification and claims refers to an operation in which the stocker 14 carries out the substrate, an operation in which the stocker 30 carries in and stocks the substrate, and a solder printer 16 carries out soldering. Operation for printing, operation for conveying the substrates by the conveyors 18 and 26, operation for applying the adhesive by the adhesive applicator 16, operation for mounting the electronic components on the substrate by the component mounting machines 22 and 24, solder performed by the reflow furnace 28 It is used to include all operations performed by each production facility for the production of mounting boards, such as heating operations for attachment.

  Here, the following description will explain the production management apparatus 100 and the production management method using the component mounter 22 of the production line 10 as a representative example. Management is done.

  FIG. 2 is an external perspective view showing a part of the component mounter 22 according to the embodiment of the present invention.

  The component mounting machine 22 shown in the figure is a device that mounts electronic components on a board received from the upstream of the production line, and sends out a mounting board on which electronic components have been mounted downstream. A multi-head unit 110 having a plurality of mounting heads that can mount components, an XY robot 113 that moves the multi-head unit 110 in the horizontal plane direction, and a component supply unit 115 that supplies components to the mounting head. Yes.

  Specifically, the component mounting machine 22 is a mounting machine that can mount various electronic components from minute components to connectors on a board. □ Large electronic components of 10 mm or more and odd-shaped components such as switches and connectors , QFP (Quad Flat Package), BGA (Ball Grid Array) and other multi-function mounting machines that can be mounted with IC components such as a multi-head unit 110 at a time. 115 is an apparatus capable of transporting from 115 to the upper part of the substrate, and is a high-speed mounting machine capable of mounting electronic components at high speed by reducing the number of reciprocations of the multi-head unit 110 between the component supply unit 115 and the upper part of the substrate.

  FIG. 3 is a plan view showing a main internal configuration of the component mounter 22.

  The component mounter 22 further includes a nozzle station 119 on which a replacement nozzle that is replaceably attached to the mounting head to accommodate various types of component types, a rail 121 that forms a track for transporting the substrate 120, and a transport A mounting table 122 on which the mounted substrate 120 is mounted and an electronic component is mounted, and a component collection device 123 that collects the component when the sucked and held electronic component is defective are provided.

  In addition, the component supply unit 115 is provided before and after the component mounter 22, and includes a component supply unit 115a that supplies an electronic component stored on the tape, and a plate that is partitioned according to the size of the component. And a component supply unit 115b for supplying electronic components to be stored.

  The multi-head unit 110 provided in the component mounter 22 mounts electronic components between the component supply unit 115 and the substrate 120 placed on the mounting table 122 by the XY robot 113 or improves the throughput. In addition, the component moves at high speed between the mounting points. The component supply unit 115 is stationary so as to attract the electronic component, and the component is stationary because the electronic component is mounted on the substrate 120. Therefore, while the electronic component is mounted, the multi-head unit 110 frequently repeats moving and stopping, and moves with a very large acceleration / deceleration every time the moving and stopping occurs. A large amount of electric power is required to drive the multihead unit 110 with such acceleration / deceleration.

  FIG. 4 is a block diagram illustrating a functional configuration of the production management apparatus 100.

  The production management apparatus 100 shown in the figure is an apparatus that manages the production of each facility on the production line in addition to the component mounter 22, and includes a production information acquisition unit 401, a throughput determination unit 402, a production condition determination unit 403, and the like. , An acceleration increase / decrease unit 404, a control unit 405, a display unit 406, an input unit 407, a storage unit 408, and a communication I / F 409.

  The production information acquisition unit 401 is a processing unit that acquires information about production from a sales performance management server (not shown), each facility of the production line, and the like via the network 101 and the communication I / F 409. The production information acquired by the production information acquisition unit 401 includes, for example, the latest sales number per day of a product in which a mounting board is incorporated from the sales performance management server, the production interruption time of the component mounting machine 22, and each facility. The time when the production starts, the time when the production must be finished, the number of mounting boards that are the number of mounting boards produced by the component mounting machine 22, the number of completed boards that are the number of mounting boards stocked in the stocker 30, and the like. In addition, when a numerical value is manually input to a necessary part on the screen by the input unit 407 and the display unit 406, the numerical value can be acquired as production information (see FIG. 8).

  The throughput determining unit 402 is a processing unit that determines the throughput of the component mounter based on the information acquired by the production information acquiring unit 401. Further, the throughput determination unit 402 holds the maximum throughput of the component mounting machine 22, that is, the throughput value improved to a limit that takes into account the motor rating, component suction deviation, component mounting deviation, and the like.

  The production condition determination unit 403 is a processing unit that determines the mounting conditions of the component mounter 22 so as to match the throughput determined by the throughput determination unit 402. In particular, when the throughput determining unit 402 determines to decrease the throughput, the mounting condition is determined so that the power consumption decreases within the determined throughput.

  In this embodiment, since the component mounting machine 22 is targeted, the production condition determining unit 403 determines the mounting conditions. However, when targeting other production facilities, the production conditions unique to the other production facilities are determined. It will be.

  As the mounting condition for reducing the power consumption, for example, changing the mounting order in addition to the condition for decreasing the acceleration of the multi-head unit 110 is applicable.

  Specifically, the case where the electronic component A and the electronic component B supplied by different types of trays included in the tray-type component supply unit 115b are continuously mounted will be described. The tray type component supply unit stores a plurality of trays stacked on the component supply unit main body, and the electronic component A and the electronic component B are mounted on separate trays of the component supply unit main body, respectively. Is placed. When the electronic component A is supplied, the tray on which the electronic component A is placed is pulled out from the main body, and when the electronic component B is next supplied, the tray is stored in the main body, and the electronic component B is loaded. The electronic tray B is supplied by pulling out the placed tray.

  For example, the high-throughput mounting condition, that is, the tray replacement time for storing and withdrawing the tray, the multi-head unit 110 is moved, the electronic component A is mounted on the substrate 120, and the multi-head unit 110 is returned to the component supply unit 115b again. Assume that the mounting conditions for picking up the electronic component B and moving the multi-head unit 110 to mount the electronic component B on the substrate 120 are set. If this condition is changed to a mounting condition for reducing the number of movements of the multi-head unit 110, power consumption can be reduced. The mounting condition after the change is that the time for replacing the tray is made to stand by without moving the multi-head unit 110, and the electronic component A and the electronic component B are attracted to the multi-head unit 110, and then the substrate is replaced. The mounting condition is that the electronic component A and the electronic component B are mounted by moving to 120.

  Thus, the power consumption can be reduced by determining the mounting conditions (component mounting order) that reduce the number of times of movement of the multi-head unit 110 as much as possible (one movement from the stationary state until it stops again). .

  Furthermore, when the component mounter has a plurality of multi-head units that can be moved independently, the power supplied to the motor for driving any of the multi-head units is shut off, and the throughput is reduced. In addition, it is possible to determine a mounting condition for achieving power saving, and when all mounting processes can be performed by the component mounting machine 24, other parts of the component mounting machine 22, for example, the multi-head unit 110, leaving only conveyance. It is also possible to determine a mounting condition in which all the power supplied to the beam driving unit is cut off.

  The acceleration increase / decrease unit 404 is a processing unit provided in the production condition determination unit 403, and is a processing unit that adjusts the moving acceleration of the multihead unit 110 and the like, among other mounting conditions.

  For example, when adjusting the acceleration, acceleration data 500 as shown in FIG. 5 is used. The acceleration data 500 shown in the figure is stored in the storage unit 408, and is composed of information indicating the moving section in which the multi-head unit 110 moves and the acceleration generated in the moving section. Since the movement section corresponds to the mounting point of the board, the mounting point No. Acceleration is defined by associating numerals with accelerations determined in stages (for example, stages 1 to 9), and the smaller the number, the higher the acceleration. When adjusting the acceleration, the number of acceleration patterns is increased or decreased at each movement section or all movement sections at once, and the mounting conditions are determined so as to achieve the target throughput.

  The acceleration data 500 is generally created with the maximum acceleration possible within the range where there is no problem in mounting quality as an upper limit. Further, the range where there is no problem in the mounting quality is a range determined based on the rated torque of the motor that drives the movable member of the component mounting machine 22, and is an added value that occurs when the multi mounting head 110 moves. This is a range in which the electronic components held by the multi-mounting head 112 are not displaced or dropped due to the inertial force accompanying the deceleration. Therefore, even if the acceleration increasing / decreasing unit 404 is adjusted to increase the acceleration, it is impossible to set an acceleration of acceleration data 500 or more (decrease the number).

  Those skilled in the art and the like may refer to “acceleration” as “speed” in the sense of acceleration, and may be described. The “acceleration” may be referred to as “speed” and the speed may be adjusted.

  Among the mounting conditions, the acceleration is particularly adjusted because the acceleration greatly affects the throughput, and particularly when the acceleration is reduced, it greatly contributes to power saving.

  Here, the “acceleration” refers to a horizontal acceleration generated when the multi-head unit 110 moves, a vertical acceleration generated when the mounting head included in the multi-head unit 110 sucks or mounts electronic components, and the like. This means a broad concept of acceleration including all accelerations generated in the component mounter 22.

  In this embodiment, since the production condition determining unit 403 is provided in the production management apparatus 100, the throughput determined by the throughput determining part 402 is determined in the production management apparatus 200 as a production condition that matches the throughput. However, the present invention is not limited to this, and the production condition determining unit may be provided in each production facility such as the component mounting machine 22. In this case, by transmitting the throughput determined by the throughput determining unit 402 to each production facility, each production facility autonomously determines the production conditions, and production is executed under the determined conditions. The operation of each processing unit to be described later is the same regardless of where any processing unit is provided.

  The control unit 405 is a processing unit that controls each processing unit included in the production management apparatus 100.

  The display unit 406 is a CRT, LCD, or the like, and the input unit 407 is a keyboard, mouse, touch panel, or the like. These are used for displaying the operating state of the component mounter 22 or inputting production information manually.

  The storage unit 408 is a storage device such as a hard disk drive capable of accumulating and holding data, and stores the acceleration data 500 and the like.

  The communication I / F 409 is an interface for exchanging information with the component mounter 22 (including other equipment constituting the production line).

  Next, the processing operation for the component mounter 22 of the production management apparatus 100 will be described.

  FIG. 6 is a flowchart showing the processing operation of the production management apparatus.

  First, the production management apparatus 100 acquires initial data and sets it as an initial value (S601). The initial data includes the number of mounting boards produced as a whole production line, production start time, production end time, and the like. These initial data are obtained from production plans, production line operation plans, and the like. This step is not always necessary.

  Next, the production condition determination unit 403 targets the component mounter 22 and based on the acceleration data 500 and the component library 700 (see FIG. 7), the arrangement of various electronic components and the mounting order of the electronic components in the component supply unit 115. The mounting conditions such as the above are optimized so as to obtain the highest throughput, and the optimized conditions are acquired (S602). As described above, this step is performed by the production condition determination unit provided outside the production management apparatus 100 when the production condition determination unit 403 is provided outside the production management apparatus 100 (for example, the component mounter 22). The production management apparatus 100 acquires the optimized conditions that are executed.

  Next, the component mounting machine 22 receives the first board from the upstream process of the production line, starts production, and transmits production start information notifying that this production has started. Then, the production management apparatus 100 acquires the production start information of the component mounter 22 and calculates the production time (S603). The production start information is information that the component mounter 22 has actually started production. When managing the production of the component mounter 22, the production time is calculated based on the time when the production start information is received. It will be. Specifically, the time when the production start information is received is subtracted from the final time permitted for the production line 10, and the production of the entire production line 10 is completed after the production of the component mounter 22 is completed. The value obtained by subtracting the time lag until is the production time of the component mounting machine 22.

  Next, the production information acquisition unit 401 acquires the number of sales that is the number of target products sold yesterday from the sales performance management server, and calculates the number of production that is the number of boards that should be produced today based on the acquired number of sales. (S604).

  Further, the production information acquisition unit 401 changes the production number based on the difference between the number produced by the component mounter 22 and the number received by the stocker 30 (S605). This is to compensate for the difference between the completed mounting board and the mounting board produced by the component mounting machine 22 when the mounting board produced by the component mounting machine 22 is extracted due to a failure in the downstream process of the production line. It is to do. Accordingly, the number of mounting boards produced by the component mounting machine 22 is increased by the number of sheets extracted than the number of productions calculated in step S604.

  The downstream process may include a process of inspecting the produced mounting board and inspecting the mounting board for good or defective. In this case, since the mounting board that has become defective due to the inspection is extracted, the number of mounting boards produced by the component mounting machine 22 is increased by the number of sheets extracted from the number of production calculated in step S604.

  Furthermore, the yield of mounting board production may be obtained in advance, and the number of mounting boards produced by the component mounter 22 may be increased based on the yield.

  In addition, since a time lag occurs until the production board produced by the component mounting machine 22 passes through the downstream process of the production line and is stocked in the stocker 30, the production number is changed in consideration of this time lag.

  Furthermore, the production information acquisition unit 401 acquires the time when the component mounter 22 interrupted the production, and subtracts this value from the production time. (S606) Note that the interruption of operation refers to a case where a delay occurs in the upstream / downstream process of the production line or the throughput of the production equipment in the upstream process, in addition to the case where it is interrupted due to a failure of the component mounter 22 or the addition / replacement of parts. This includes the case where the operation is interrupted because the substrate is not loaded or unloaded because the limit is reached.

  Next, based on the production information acquired by the production information acquisition unit 401, the throughput determination unit 402 calculates and determines a target throughput to be realized by the component mounter 22 (S607). Specifically, the production time (remaining production time) is updated by subtracting the time already spent on production (production elapsed time) from the preset production time (initial production time), and the production information acquisition unit The number of production (number of finished production) is subtracted from the number of production (acquired production) acquired by 401 to update the production number (remaining production number), and the target is based on the updated production time and production number. Calculate the throughput. In principle, the approximate throughput can be calculated by the number of productions divided by the production time, but fine corrections such as errors at the start and end of production and rounding when not divisible are implemented.

When the above is expressed by a mathematical formula,
Production time (remaining production time) = initially set production time−elapsed production time Production number (remaining production number) = acquired production number−production end number Target throughput = production number ÷ production time.

  Next, the current throughput achieved by the component mounter 22 is compared with the target throughput (S608). If the current throughput is faster than the target throughput (S608: current SP> target SP), the acceleration is decreased. (S609), the throughput is recalculated based on the reduced acceleration. Then, steps S608 and S609 are repeated until a throughput that is closest to the target throughput and does not become slower than the target throughput is calculated.

  As a specific calculation method of the throughput, the tact for each moving section is calculated from the acceleration, and the throughput is calculated from the total value of the tacts of all the moving sections.

  The acceleration decreasing procedure can be exemplified by a procedure in which the acceleration is decreased by one step for all the moving sections, and further, the acceleration is decreased for each moving section as a fine adjustment.

  On the other hand, if the current throughput is slower than the target throughput (S608: current SP <target SP), the acceleration is increased (S611), and the throughput is recalculated based on the increased acceleration. If the recalculated throughput exceeds the limit (S613: Y), a warning is displayed on the display unit 406 (S614).

  If the recalculated throughput does not exceed the limit value (S613: Y), steps S611 to S613 are repeated until a throughput that is closest to the target throughput and does not become slower than the target throughput is calculated.

  The acceleration increasing procedure can be exemplified by a procedure of increasing the acceleration one step at a time for all moving sections, and further increasing the acceleration for each moving section as a fine adjustment, as in the decreasing procedure.

  If the calculated throughput is closest to the target throughput (S608: current SP≈target SP), the mounting condition is determined based on the set acceleration (S615).

  When the mounting conditions are determined, the numerical part of the screen display shown in FIG. 8, for example, a numerical value such as the operation rate of the board A, and the acquired information are displayed.

  In the figure, “plan” and “plan” are numerical values set first, and “acquired” is a value obtained in real time, that is, a value that is changed from the first set value later. Value.

  The steps from S604 to S615 are performed every time the component mounter 22 produces one mounting board, and this is repeated until the required number of production is reached.

  If the production management apparatus 100 and the production management method described above are applied to the component mounter 22, the throughput is adjusted in real time while the component mounter 22 is continuously producing the same type of mounting boards. An accurate number of mounting boards can be produced based on the latest information. In addition, when there is a margin in the production of the component mounting machine 22, the margin can be used for energy saving.

  Also, when production information that exceeds the production capacity is acquired, a warning is displayed, so it is possible to grasp the shortage in advance and request support from other related lines such as other production lines be able to.

  In the above description, throughput comparison and the like are performed for each substrate, but the present invention is not limited to this, and may be performed at an arbitrary timing such as for every plurality of substrates.

  In the description of the processing operation, the adjustment of the throughput has been described by taking the increase / decrease of the acceleration as an example. However, the present invention is not limited to this, and the throughput is also improved by changing other mounting conditions, for example, the mounting order. Adjustment is possible.

  Further, in the present specification and claims, all the description and description are made with “throughput”. However, even if this is used as “tact time” (time from substrate loading to processing substrate being unloaded), the effect is Of course, it is the same.

  Although the above description has been limited to the component mounting machine 22, as described above, the present invention can be applied to all production facilities constituting the production line.

  Further, it is not necessary to separate the production management device and the production facility, and each production facility may be provided with a production management device. Further, the processing units constituting the production management apparatus may be separate from each other. That is, the operation and effect of the present invention does not change depending on the physical position where each processing unit is provided.

  Further, the production information is not limited to the above information, but may be a delivery stock or a process stock. When the production information is a process stock or the like, the throughput may be determined autonomously.

  The present invention can be applied to a production line for manufacturing a mounting board in which components are mounted on a substrate, and in particular to a production line for manufacturing a circuit board on which electronic components are mounted.

It is an external view which shows the structure of the production line managed by the production management apparatus which concerns on this embodiment. It is an external appearance perspective view which cuts and shows a part of component mounting machine applied to embodiment of this invention. It is a top view which shows the main internal structures of the said component mounting machine. It is a block diagram which shows the functional structure of a production management apparatus. It is a figure which illustrates acceleration data. It is a flowchart which shows the processing operation of a production management apparatus. It is a figure which illustrates a parts library. It is a figure which shows the screen in which the processing content of this embodiment was reflected.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mounting board production line 14, 30 Stocker 16 Solder printer 18, 26 Conveyor 20 Adhesive application machine 22, 24 Component mounting machine 28 Reflow furnace 23 Mounting control part 100 Production management apparatus 101 Network 110 Multihead part 113 XY robot 115 Parts Supply unit 120 Substrate 121 Rail 122 Mounting table 401 Production information acquisition unit 402 Throughput determination unit 403 Mounting condition determination unit 404 Acceleration increase / decrease unit 405 Control unit 406 Display unit 407 Input unit 408 Storage unit 409 Communication I / F
500 Acceleration data 700 Parts library

Claims (11)

A production management method for managing production of a board by a component mounting machine for mounting a component on a board,
A production information acquisition step for acquiring production information;
And a throughput determining step of determining a throughput based on the production information. The production information acquisition step includes:
Obtaining production information constituting a production plan while the production facility is producing a mounting board,
The throughput determining step includes:
The production management method according to claim 1, wherein a throughput of the production facility related to the mounting substrate is determined based on the production information while the production facility is producing the series of mounting substrates.   The production management method according to claim 2, wherein the production information acquired in the production information acquisition step includes a production number of mounted substrates or a production time that is a time for producing the production number. The production information acquisition step further includes
Including a sales number acquisition step of acquiring a sales number of a product in which a mounting board produced by the production facility is incorporated,
The production management method according to claim 2, wherein the production number of the mounting board is obtained based on the obtained sales number. The production information acquisition step further includes
A mounting board number obtaining step for obtaining the number of mounting boards produced by the production facility;
A step of obtaining a number of completed boards to obtain the number of mounted boards in a completed state produced by the production line;
The production number changing step of changing the production number based on a difference between the number of mounting boards obtained in the mounting board number obtaining step and the number of mounting boards obtained in the completed board number obtaining step. Production management method. The production information acquisition step further includes
The production management method according to claim 2, further comprising a production time change step of changing a production time, which is a time during which a predetermined number of mounted boards must be produced based on a time during which the production facility suspends production.   Further, when the throughput determined in the throughput determination step is lower than the current throughput of the production facility, the production condition is determined such that the power consumption of the production facility is reduced within a range not lower than the determined throughput. The production management method according to claim 2, further comprising a condition determining step. The production condition determining step further includes
The production management method according to claim 7, further comprising a mounting acceleration reduction step of reducing throughput by reducing acceleration generated when the production facility is operated. A production management program for a production facility constituting a production line for producing a mounting board by mounting components on the board,
A production information acquisition step of acquiring production information constituting a production plan while the production facility is producing a mounting board;
A production management program for causing a computer to execute a throughput determining step for determining a throughput of a production facility related to the mounting substrate based on the production information while the production facility is producing the series of mounting substrates. A production management device for a production facility constituting a production line for producing a mounting board by mounting components on the board,
Production information acquisition means for acquiring production information constituting a production plan while the production facility is producing a mounting board;
A production management apparatus comprising: throughput determining means for determining a throughput of the production facility related to the mounting substrate based on the production information while the production facility is producing the series of mounting substrates. A component mounter for mounting components on a board,
Production information acquisition means for acquiring production information constituting a production plan while the production facility is producing a mounting board;
A component mounting machine comprising: throughput determining means for determining a throughput of the component mounting machine related to the mounting board based on the production information while the component mounting machine is producing the series of mounting boards.

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