WO2023112307A1

WO2023112307A1 - Substrate work device and method for managing surplus backup pins

Info

Publication number: WO2023112307A1
Application number: PCT/JP2021/046740
Authority: WO
Inventors: 主章浜崎
Original assignee: ヤマハ発動機株式会社
Priority date: 2021-12-17
Filing date: 2021-12-17
Publication date: 2023-06-22
Also published as: JPWO2023112307A1

Abstract

A push-up plate 70 on which backup pins 70 are installed upright is divided into a plurality of surplus pin upright installation areas R1-R5 and an order of priority is set for the plurality of surplus pin upright installation areas in a surface mounting device 14, and a control unit 29 therein executes the following: change processing in which the arrangement of backup pins 73 is changed by a changing unit when the type of a substrate P or the front/back thereof are switched; and movement processing in which surplus backup pins 73 not used in backing up of the substrate P after switching among backup pins 73 installed upright in positions overlapping with the work position of the substrate P after switching while in the state prior to changing the arrangement are moved to a surplus pin upright installation area high in the order or priority among the surplus pin upright installation areas not overlapping with the work position of the substrate P after switching.

Description

Board working device and method for managing surplus backup pins

The technology disclosed in this specification relates to a board working device and a method for managing surplus backup pins.

The mounting line that mounts components on the board is equipped with multiple board working devices that work on the board. Board working devices include screen printers that print circuit patterns on boards, dispensers that apply adhesive to boards, surface mounters that mount components on boards, and the like. These board working apparatuses are provided with a backup section that backs up the board from below in order to prevent the board from bending while working on the board. The backup section includes a plurality of backup pins for backing up the substrate, a plate on which the backup pins are erected, and an elevating mechanism for elevating the plate.

The backup pin is set up at a position that avoids the circuit pattern printed on the board. When mounting components on both sides of the board, when mounting components on one side and then mounting components on the other side, the circuit pattern printed on one side and the components mounted on the other side A backup pin is erected at a position avoiding the Since the positions where circuit patterns and components are mounted differ depending on the type and front and back sides of the board, the positions where the backup pins are erected are set for each type and front and back sides of the board. When the type or front/back side of the board to be produced is changed, so-called setup change is performed to change the arrangement of backup pins according to the type or front/back side after switching.

A conventional board working apparatus has a storage section for storing surplus backup pins that are not used for backing up a board, in addition to a plate on which backup pins are erected. However, the provision of the storage section requires a space for arranging the storage section in the board working apparatus, and also causes a problem of an increase in the number of parts. For this reason, conventionally, part of the plate is also used as a region for erecting redundant backup pins (see, for example, Patent Document 1).
Specifically, the electronic component mounting apparatus described in Patent Document 1 provides a stock area in a certain area outside the area of the plurality of types of boards on the backup base when mounting components on the boards of a plurality of types. , a surplus backup pin is erected in the stock area (second embodiment of Patent Document 1).

JP 2011-14627 A

However, in the electronic component mounting apparatus described in Patent Document 1, sufficient consideration has not been given to the problem of providing the stock area in the backup base.
This specification discloses a technique capable of shortening the total setup time over a relatively long period of time when setting up surplus backup pins on a plate on which backup pins are set up.

A board working apparatus for working on a board, comprising: a conveying section for conveying the board to a work position according to the type of the board or the front and back of the board; a plurality of backup pins; and the backup pins. a backup unit that backs up the substrate conveyed to the working position by the conveying unit by the backup pin; and a work unit that performs the work on the substrate backed up by the backup unit. a changing unit for changing the arrangement of the backup pins erected on the plate; and a control unit, wherein the plate is partitioned into a plurality of surplus pin erecting regions, and the plurality of surplus pins. A priority order is set for the standing regions, and the control unit performs change processing for changing the arrangement of the backup pins by the change unit when the type or the front and back of the substrate is switched, and a state before the arrangement is changed. of the backup pins erected at a position overlapping the working position of the board after switching, the surplus backup pins not used for backing up the board after switching overlap with the working position of the board after switching. and a moving process of moving to the surplus pin erection region having a higher priority among the surplus pin erection regions that do not exist.

According to the above configuration, the total setup time can be shortened over a relatively long period of time when the surplus backup pins are set up on the plate on which the backup pins are set up.

Schematic diagram of a mounting line according to the first embodiment Schematic diagram of a surface mounter viewed from above Side view of head unit and backup unit Schematic diagram of transfer conveyor and push-up plate Perspective view of backup unit Block diagram showing the electrical configuration of a surface mounter Flowchart of backup pin arrangement change processing Schematic diagram showing the work position when mounting components on a product type A board Schematic diagram showing the work position when mounting components on the board of product type B Schematic diagram showing the work position when mounting components on the board of product type C Schematic diagram showing the work position when mounting components on the board of product type D Schematic diagram showing the work position when mounting components on the board of product type E Schematic diagram showing the working position when mounting components on the board of product type F

(Outline of this embodiment)
(1) A board working apparatus according to the present disclosure is a board working apparatus that performs work on a board, and includes a transport unit that transports the board to a work position according to the type of the board or the front and back of the board, and a plurality of a backup pin and a plate on which the backup pin is erected; a backup unit for backing up the substrate transported to the working position by the transport unit by the backup pin; a working section that performs the work on the board; a changing section that changes the arrangement of the backup pins erected on the plate; and a priority order is set for the plurality of surplus pin erecting regions, and the control unit changes the arrangement of the backup pins by the changing unit when the type or the front and back of the substrate is switched. and a surplus backup pin not used for backing up the board after switching among the backup pins erected at a position overlapping the working position of the board after switching in the state before changing the arrangement. to the surplus pin erection region having a higher priority among the surplus pin erection regions that do not overlap with the work position of the substrate after switching.

When setting up surplus backup pins on a plate on which backup pins are set up, it may not be possible to set a surplus pin setting area on the plate that does not overlap with the working position of any board. In that case, any area on the plate is set as the surplus pin erecting area, and if the work position of the board overlaps with the surplus pin erecting area, the surplus pin erecting area is set to the surplus pin erecting area. The backup pin is moved to an area that does not overlap with the working position of the board. In this case, if an area that is likely to overlap with the working position of the board is set as the surplus pin erecting area, the number of times the backup pin must be moved increases because the working position overlaps the surplus pin erecting area. For this reason, the total setup time becomes long when viewed over a relatively long period.

According to the board working apparatus, surplus backup pins that are not used for backing up the board after switching among the backup pins erected at positions overlapping the working position of the board after switching in the state before the arrangement is changed. , to a surplus pin setting region with a higher priority among the surplus pin setting regions that do not overlap with the working position of the substrate after switching. For this reason, if a higher priority is set for the surplus pin setting area that is less likely to overlap with the work position, the number of times the work position of the board overlaps the surplus pin setting area and the backup pin must be moved can be reduced. . Therefore, the total setup time can be shortened over a relatively long period of time.
Therefore, according to the board working apparatus described above, the total setup time can be shortened over a relatively long period of time when the surplus backup pins are erected on the plate on which the backup pins are erected.

(2) In the change processing, the control unit may be configured to back up the substrate after switching only by the backup pin, which is erected at a position overlapping the working position of the substrate after switching in the state before the arrangement is changed. When the backup pins used for the above are insufficient, among the backup pins standing at positions that do not overlap with the working position of the substrate after switching, the surplus pin erecting region having a lower priority is erected. The backup pin may be used as the backup pin for the shortage.

For example, if the backup pins set up in the surplus pin setting region with high priority are used for the shortage, the number of backup pins set up in the surplus pin setting region with high priority is reduced. . To put it the other way around, the number of backup pins erected in the surplus pin erection region, which tends to overlap with the working position of the board, increases. For this reason, the number of times that the redundant backup pin must be moved increases. On the other hand, if the backup pins in the surplus pin setting area with a low priority are used, it is not necessary to reduce the number of backup pins set up in the area where it is difficult to overlap with the substrate, so they must be moved as surplus backup pins. You can reduce the number of times you have to.

(3) The transport unit has a pair of conveyor belts for transporting the substrate, each of the conveyor belts is configured to be movable in a direction orthogonal to the transport direction of the substrate, and the four corners of the plate are respectively While being partitioned as one first surplus pin erecting region, regions other than the four first surplus pin erecting regions are partitioned as second surplus pin erecting regions, may be set to have a higher priority than the second surplus pin setting region.

When each conveyor belt is configured to be movable in a direction perpendicular to the direction in which the substrate is conveyed, work on the substrate must be performed at both the working position on one side and the working position on the other side of the direction perpendicular to the direction. can be done. When the work on the substrate can be performed at both work positions, it is difficult for the substrates to overlap at the four corners of the plate compared to other areas when viewed from above.
According to the board working device, the priority of the four first surplus pin erecting regions (that is, the four corner regions of the plate) is higher than the second surplus pin erecting region (that is, the regions other than the four corners). , the setup time can be shortened compared to the case where the priority is lower than that of the second surplus pin setting region.

(4) The four first surplus pin erecting regions are such that when one of the conveyor belts is at the farthest end on the opposite side of the other conveyor belt, the other conveyor belt is attached to one of the conveyor belts. The area within the area between one of the conveyor belts and the other of the conveyor belts when they are closest, and the one when the other of the conveyor belts is at the farthest end on the opposite side of the one of the conveyor belts. The area within the area between one of the conveyor belts and the other of the conveyor belts when the two conveyor belts are closest to the other conveyor belt.

As described above, the first surplus pin standing region is less likely to overlap the substrate than the second surplus pin standing region, but the width of the first surplus pin standing region in the orthogonal direction is wide. As a result, the first surplus pin standing area tends to overlap the working position of the board.
According to the above board working device, the four first surplus pin erecting regions are arranged such that when one conveyor belt is at the farthest end on the opposite side of the other conveyor belt, the other conveyor belt is attached to the other conveyor belt. The area within the area between one conveyor belt and the other conveyor belt when they are closest, and one conveyor belt when the other conveyor belt is at the extreme end opposite to the one conveyor belt Since it is an area within the area between one conveyor belt and the other conveyor belt when it is closest to the other conveyor belt, part of the first surplus pin erecting area is outside these areas. Compared to the case, the working position of the substrate is less likely to overlap the first surplus pin erecting region.

(5) A different priority may be set for each of the four first surplus pin erecting regions.

According to the board working device, the surplus backup pins are moved to the first surplus pin erection region with the highest priority among the four first surplus pin erection regions, so there is a possibility that the setup time can be shortened. becomes higher.

[Details of the embodiment of the present disclosure]
Embodiments of the present disclosure will be described below. The present disclosure is not limited to these examples, but is indicated by the scope of the claims, and is intended to include all modifications within the meaning and scope of equivalents of the scope of the claims.
Embodiments of the present disclosure can be realized in various forms such as devices, systems, methods, computer programs for realizing the functions of these devices, systems or methods, and recording media recording the computer programs.

<Embodiment 1>
Embodiment 1 will be described with reference to FIGS. 1 to 13. FIG. In the following description, the horizontal direction shown in FIG. 1 is called the X direction, the vertical direction is called the Z direction, and the front-back direction shown in FIG. 2 is called the Y direction. In the following description, the right side is called the upstream side, and the left side is called the downstream side. Also, in the following description, the reference numerals in the drawings may be omitted except for some of the same components.

(1) Mounting Line A mounting line 1 for mounting components on a substrate will be described with reference to FIG. The mounting line 1 includes a loader 10, a screen printer 11, a print inspection machine 12, a dispenser 13, three surface mounters 14, a post-mounting visual inspection machine 15, a reflow device 16, a post-curing visual inspection machine 17, and an unloader 18. These are lined up in a row via a plurality of conveyors 19 . The screen printer 11, the dispenser 13, and the surface mounter 14 are examples of board working equipment. In the following description, the surface mounter 14 is taken as an example of the board working device.

(2) Overall Configuration of Surface Mounter Referring to FIG. 2, the overall configuration of surface mounter 14 will be described. The surface mounter 14 includes a base 20, a transport conveyor 21 (an example of a transport section), two substrate stoppers 22, four component supply devices 23, a backup section 24 (see FIG. 3), a head unit 25, a head moving section 26, It has two component imaging cameras 27, a board imaging camera 28, a control section 29 (see FIG. 6), and an operation section 30 (see FIG. 6). The head unit 25 and the head moving section 26 are examples of a working section and a changing section.

The base 20 has a rectangular shape in plan view and has a flat upper surface. A region 100 indicated by a two-dot dashed line in FIG. 2 is a working position where the board P is fixed when the component E is mounted on the board P. As shown in FIG. Although the details will be described later, the working positions include a front working position and a rear working position. Which working position is fixed depends on the type of substrate P and the front and back surfaces.

The transport conveyor 21 includes a pair of conveyor belts 31 (a front conveyor belt 31A and a rear conveyor belt 31B) that circulate in the X-axis direction, a conveyor drive motor 89 (see FIG. 6) that drives the conveyor belts 31, and the like. Although details will be described later, the transport conveyor 21 is a so-called dual stage (DS) conveyor capable of selectively transporting the substrate P to a front working position and a rear working position. (an example of a direction orthogonal to the conveying direction) is configured to be independently movable. The transport conveyor 21 also includes a belt moving motor 90 (see FIG. 6) for independently moving each conveyor belt 31 in the front-rear direction.

The substrate stopper 22 is a mechanism that abuts on the substrate P transported by the transport conveyor 21 from the downstream side to position the substrate P. Two substrate stoppers 22 are provided on the rear side of the conveyor frame of the front conveyor belt 31A so as to be spaced apart from each other. The substrate stopper 22 includes a contact portion that contacts the substrate P, a moving mechanism that moves the contact portion in the left-right direction, and an elevating mechanism that raises and lowers the contact portion.

The four component supply devices 23 are arranged in the X-axis direction on both the front and rear sides of the conveyor 21, two each, for a total of four locations. A plurality of tape feeders 32 are attached to the component supply device 23 so as to be aligned side by side in the X-axis direction. Each tape feeder 32 includes a reel (not shown) on which a component tape (not shown) containing a plurality of components E is wound, and an electric delivery device (not shown) that pulls out the component tape from the reel. The parts E are supplied one by one from the part supply position provided at the end on the conveyer 21 side.

The backup unit 24 (see FIG. 3) is a device that backs up the board P when the component E is mounted on the board P. As shown in FIG. A description of the backup unit 24 will be given later.
The head unit 25 has a plurality of mounting heads 40 for picking up and releasing the component E. As shown in FIG. A description of the head unit 25 will be given later.

The head moving section 26 moves the head unit 25 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head moving portion 26 includes a beam 35 supporting the head unit 25 so as to be able to reciprocate in the X-axis direction, a pair of Y-axis guide rails 36 supporting the beam 35 so as to be able to reciprocate in the Y-axis direction, and the head unit 25 . X-axis servomotor 37 for reciprocating the beam 35 in the X-axis direction, Y-axis servomotor 38 for reciprocating the beam 35 in the Y-axis direction, and the like.

The two component imaging cameras 27 are provided between the two component supply devices 23 aligned in the X-axis direction. The component imaging camera 27 is a camera for capturing an image of the component E sucked by the mounting head 40 from below and recognizing the shape, angle, and the like of the component E. FIG. The component imaging camera 27 is disposed with its imaging surface facing upward.
A board imaging camera 28 is provided in the head unit 25 . The substrate imaging camera 28 is a camera for detecting the position and angle of the substrate P by imaging fiducial marks attached to the substrate P from above. The board imaging camera 28 is disposed with its imaging surface facing downward.

(2-1) Head Unit The head unit 25 will be described with reference to FIG. The head unit 25 is of a so-called in-line type, and has a plurality of mounting heads 40 arranged side by side in the X-axis direction. The head unit 25 includes a Z-axis servomotor 87 (see FIG. 3) for individually raising and lowering these mounting heads 40, and an R-axis servomotor 88 (see FIG. 3) for simultaneously rotating these mounting heads 40 around the axis. ) is provided.

Each mounting head 40 picks up and releases the component E, and has a nozzle shaft 40A and a pick-up nozzle 40B detachably attached to the lower end of the nozzle shaft 40A. Negative pressure and positive pressure are supplied to the suction nozzle 40B from an air supply device (not shown) through the nozzle shaft 40A. The suction nozzle 40B sucks the component E by being supplied with a negative pressure, and releases the component E by being supplied with a positive pressure.
Although the in-line type head unit 25 has been described here as an example, the head unit 25 may be, for example, a so-called rotary head in which a plurality of mounting heads 40 are arranged on a circumference.

The head unit 25 is used not only for mounting the component E, but also for changing the arrangement of backup pins 73 provided in the backup section 24, which will be described later. Specifically, inside the surface mounter 14 is arranged a nozzle station (not shown) in which a spare suction nozzle 40B is stored. The nozzle station also stores a suction nozzle for sucking the backup pin 73 (hereinafter referred to as a pin suction nozzle). When changing the arrangement of the backup pins, the suction nozzle 40B attached to the nozzle shaft 40A is stored in the nozzle station, and the pin suction nozzle is attached to the nozzle shaft 40A. The surface mounter 14 sucks and moves the backup pin to be moved by the pin suction nozzle.

(2-2) Conveyor The conveyer 21 will be described with reference to FIG. As described above, the transport conveyor 21 is a DS conveyor. In FIG. 4, position 60 is the rearmost position of the rear conveyor belt 31B, and position 62 is the frontmost position of the rear conveyor belt 31B. Position 61 is the position where the front conveyor belt 31A has moved to the rearmost, and position 63 is the position to which the front conveyor belt 31A has moved the most to the front. The distance between

positions

60 and 61 and the distance between

positions

62 and 63 are the minimum widths of the pair of conveyor belts 31, respectively.

In the front working position described above, the front conveyor belt 31A is at the frontmost position 63, and the rear conveyor belt 31 is separated rearward from the front conveyor belt 31 by the width of the substrate P. In the above-described rear working position, the rear conveyor belt 31B is at the rearmost position 60, and the front conveyor belt 31A is separated from the rear conveyor belt 31 by the width of the substrate P to the front side.

In the case of a type in which more components E supplied by the component supply device 23 arranged on the front side are mounted than components E supplied by the component supply device 23 arranged on the rear side, the work position on the front side The total moving distance of the head unit 25 in the front-rear direction is shorter when the component E is mounted in . In other words, the tact time is shortened. Conversely, in the case of a product type in which more components E supplied by the component supply device 23 arranged on the rear side are mounted, it is better to mount the components E at the working position on the rear side. the total distance traveled is shortened.

For this reason, in the surface mounter 14, the work position for mounting the component E on the board P is set for each type of the board P. Specifically, in the case of a product type in which more components E are supplied by the component supply device 23 on the front side, the work position on the front side is set, and the work position on the front side is set. In the case of a product with a large number of scratches, the working position on the rear side is set. The same is true for the front and back surfaces, and a work position for mounting the component E on the front surface and a work position for mounting the component E on the back surface are set for each product type. For the sake of convenience, in the following description, the product type and front and back surfaces are collectively referred to simply as the product type.

The working position is also variable in the left-right direction (conveyance direction). As described above, since a plurality of tape feeders 32 are mounted side by side in the component supply device 23, the component E supplied by the left tape feeder 32 is the same as the component E supplied by the right tape feeder 32. For more types, the working position is set to the left. Conversely, in the case of a product type in which more components E are supplied by the tape feeder 32 on the right side, the working position is set to the right side.

(2-3) Backup Section As shown in FIG. 3, the backup section 24 includes a push-up plate 70 (an example of a plate), a base plate 71 arranged below the push-up plate 70, four pillars 72, and a plurality of backup plates. A pin 73 and an elevating mechanism 74 for elevating the base plate 71 are provided.

As shown in FIG. 5, the push-up plate 70 is a flat metal member. A plurality of pin insertion holes 70A are formed in a matrix in the push-up plate 70 so as to pass through the plate in the thickness direction. The base plate 71 is a plate-like member, and is connected to the push-up plate 70 via supports 72 rising from four corners.
The backup pin 73 has a cylindrical portion 73A and a flange portion 73B annularly projecting from the cylindrical portion 73A. The outer diameter of the cylindrical portion 73A is the same as or slightly smaller than the inner diameter of the pin insertion hole 70A. The outer diameter of the flange portion 73B is larger than the inner diameter of the pin insertion hole 70A.

As shown in FIG. 3, the lifting mechanism 74 includes a plurality of ball screws 74A extending downward from the base plate 71, ball nuts 74B screwed to the ball screws 74A, lifting motors 74C, and the ball nuts 74B and the lifting motors 74C. It has a belt 74D and the like that is hung around. When the lifting motor 74C rotates, the ball nut 74B rotates via the belt 74D, and the ball screw 74A moves up and down. As a result, the backup unit 24 moves up and down.

Before the board P is brought into the working position, the backup pin 73 is lowered to a position where the upper end is below the conveyor belt 31 . When the board P is carried into the working position, the push-up plate 70 rises and the board P is lifted up by the plurality of backup pins 73 . As a result, the substrate P is backed up by the backup unit 24 .

(3) Electrical Configuration of Surface Mounting Machine As shown in FIG. The control unit 29 includes an arithmetic processing unit 81, a motor control unit 82, a storage unit 83, an image processing unit 84, an external input/output unit 85, a feeder communication unit 86, and the like.

The arithmetic processing section 81 includes a CPU, a RAM, etc., and controls each section of the surface mounter 14 by executing a control program stored in the storage section 83 .
A motor control unit 82 controls the rotation of each motor such as the X-axis servomotor 37 and the Y-axis servomotor 38 under the control of the arithmetic processing unit 81 .
Various programs and data to be executed by the arithmetic processing unit 81 are stored in the storage unit 83 . The various data include information on the production of the board P, work positions for each type of board P, standing positions of the backup pins 73 for each type of board P (hereinafter referred to as backup positions), and the like.

The image processing unit 84 is configured to receive image signals output from the component imaging camera 27 and the board imaging camera 28 .
The external input/output unit 85 is a so-called interface, and is configured to receive detection signals output from various sensors 91 provided on the main body of the surface mounter 14 . Further, the external input/output unit 85 is configured to control the operation of various actuators 92 (backup unit 24, substrate stopper 22, air supply device, etc.) based on control signals output from the arithmetic processing unit 81. .

The feeder communication unit 86 is connected to the tape feeder 32 and controls the tape feeder 32 as a whole.
The operation unit 30 includes a display device such as a liquid crystal display, and an input device such as a touch panel, keyboard, and mouse. The operator can operate the operation unit 30 to perform various settings.

(4) Surplus Pin Setting Region The surplus pin setting region set in the push-up plate 70 will be described with reference to FIG. The push-up plate 70 is divided into a plurality of surplus pin erection regions R1 to R5, and the surplus pin erection regions that are less likely to overlap with the work position of the substrate P are given higher priority.

Specifically, in general, the four corner regions of the push-up plate 70 are less likely to be overlapped by the substrate P than the other regions. For this reason, the four corner regions of the push-up plate 70 are each partitioned as one first surplus pin standing regions R1 to R4, and the regions other than the four first surplus pin standing regions R1 to R4 are It is partitioned as a second surplus pin standing region R5. A higher priority than the second surplus pin setting region R5 is set to the four first surplus pin setting regions R1 to R4.

A more specific description will be given of the four first surplus pin erecting regions R1 to R4. The area between the two conveyor belts 31 when the rear conveyor belt 31B is at position 60 and the front conveyor belt 31A is at position 61 (one conveyor belt at the extreme end opposite the other conveyor belt). An example of the area between one conveyor belt and the other conveyor belt when the other conveyor belt is closest to the other conveyor belt at a certain time), the left end and the right end are the first It is partitioned as one surplus pin standing regions R2 and R3.

Similarly, the area between those two conveyor belts 31 when the rear conveyor belt 31B is at position 62 and the front conveyor belt 31A is at position 63 (the other conveyor belt is on the opposite side of the other conveyor belt). An example of the area between one conveyor belt and the other conveyor belt when one conveyor belt is closest to the other conveyor belt when it is at the end), the left end and the right end are partitioned as first surplus pin standing regions R1 and R4.

There is also a difference in the difficulty of overlapping the substrate P between the four first surplus pin standing regions R1 to R4. Therefore, different priorities are set for the four first surplus pin standing regions R1 to R4. Specifically, in the first embodiment, the first surplus pin erecting region R1 is the least likely to overlap with the work position of the substrate P, and the first surplus pin erecting region R2, the first surplus pin erecting region R3, the first surplus pin erecting region R3, and the It is assumed that overlapping with the work position is likely to occur in the order of the surplus pin erecting region R4 of No. 1. Therefore, the highest priority is set to the first surplus pin setting region R1, followed by the first surplus pin setting region R2, the first surplus pin setting region R3, and the first surplus pin setting region. The priority is lower in the order of R4.

The order of priority among the four first surplus pin setting regions R1 to R4 can be set in various ways. For example, in a factory where the surface mounter 14 is used, a factory operator investigates for each type of board P the first surplus pin erecting region that overlaps the work position of the board P of that type, and finds that the work position overlaps. A higher priority may be set for the first surplus pin erecting region having a smaller number of product types. Alternatively, the order of priority among the four first surplus pin setting regions may be set in the surface mounter 14 in advance by the manufacturer of the surface mounter 14 .

Alternatively, the surface mounter 14 may set the priority. For example, each time the surface mounter 14 produces a board P of one type, it records the work position of the board P of that type as work position data. Based on the work position data, the number of product types whose work positions overlap is counted for each first surplus pin setting area, and the first surplus pin setting area with a smaller number of product types whose work positions overlap is given a higher priority. may be set.
Alternatively, the operator may arbitrarily set priorities for the four first surplus pin setting regions R1 to R4.

For convenience, in the following description, the first surplus pin setting region R1 will be referred to as the first priority R1, the first surplus pin setting region R2 will be referred to as the second priority R2, and the first surplus pin setting region R3 will be referred to. This is called the third priority R3, the first surplus pin erection region R4 is called the fourth priority R4, and the second surplus pin erection region R5 is called the fifth priority R5.

In the following description, the surplus pin erection area that overlaps the working position of the board P refers to the surplus pin erection area where the entire surplus pin erection area overlaps the work position. Therefore, when only a part of the surplus pin erecting area overlaps the working position, the surplus pin erecting area does not overlap the working position. The head unit 25 erects a backup pin 73 in a region of the surplus pin erecting region that does not overlap the working position even if a part of the surplus pin erecting region overlaps the working position. and the backup pin 73 erected in that area can be moved.

The margins secured on the outside of the conveyor belt 31 and on the left and right sides of the substrate P will be described with reference to FIG. There is some protrusion on the outer side of the conveyor belt 31 (the front side in the case of the front side conveyor belt 31A and the rear side in the case of the rear side conveyor belt 31B). For this reason, a margin 101 is secured outside the conveyor belt 31 in order to prevent the extra backup pin 73 from interfering with the protrusion. Further, a moving mechanism, an elevating mechanism, and the like for moving the contact portion in the left-right direction are arranged around the contact portion of the substrate stopper 22 on the upstream side. For this reason, a margin 102 is secured on the downstream side of the substrate P in order to prevent the extra backup pins 73 from interfering with them. In this embodiment, it is assumed that there is some member on the upstream side of the substrate P as well. Therefore, a margin 103 is secured on the upstream side of the substrate P. FIG.
It is assumed that backup pins 73 cannot be erected in areas overlapping these

margins

101, 102 and 103 in the surplus pin erecting area.

(5) Change of Arrangement of Backup Pins First, the flow of processing for changing the arrangement of backup pins will be explained, and then a specific example will be explained.

(5-1) Flow of Processing for Changing Arrangement of Backup Pins A flow of processing for changing the arrangement of backup pins will be described with reference to FIG. This processing is executed after the production of the substrate P of one type is finished and before the production of the substrate P of the next type is started.
Here, when the arrangement of the backup pins 73 is changed, the control unit 29 sets the backup pins 73 standing at positions overlapping the working positions of the board P of the type after the switching in the state before the arrangement is changed. It is used preferentially for backing up the board P of the type after switching.

In S101, the control unit 29 sets the work position of the substrate P of the next product type (hereinafter referred to as the product type after switching) and the backup position of the substrate P of the product type after switching (in other words, the backup pin 73 is set up). position of the pin insertion hole 70A) is read from the storage unit 83.
In S102, the control unit 29 determines the number of backup pins 73 erected at positions overlapping the working positions of the board P of the type after switching in the state before the layout change.

In S103, the controller 29 proceeds to S104 if the number determined in S102 is equal to or greater than the number of backup pins 73 to be used for backing up the board P of the type after switching, and proceeds to S106 if less.
In S104, the control unit 29 moves the backup pin 73 standing at a position overlapping the work position of the board P of the type after switching in the state before the arrangement is changed to the backup position of the board P of the type after switching. (an example of change processing).

In S105, the control unit 29 selects the backup pin 73 standing at a position that overlaps the work position of the board P of the type after switching in the state before the arrangement is changed to back up the board P of the type after switching. The surplus backup pins 73 that are not used are moved to a surplus pin erection region with a higher priority among the surplus pin erection regions that do not overlap with the work position of the board P of the type after the change (an example of movement processing).

In S106, the control unit 29 moves the backup pin 73 standing at a position overlapping the working position of the board P of the new type in the state before the layout change to the backup position of the board P of the new type after the switching. (an example of change processing).
In S107, the control unit 29 selects the backup pins erected in the surplus pin erection region having a low priority among the backup pins 73 erected at positions not overlapping with the work position of the board P of the type after the switching. 73 is preferentially used as a backup pin 73 for the shortage (an example of change processing).

(5-2) Specific Examples of Changing Arrangement of Backup Pins Specific examples of changing the arrangement of backup pins 73 will be described with reference to FIGS. 8 to 13 . In these figures, a white circle 111 inside the pin insertion hole 70A indicates the position of the backup pin 73 before change, and a black circle 112 indicates the position of the backup pin 73 after change. A black circle 112 inside the white circle 111 indicates that the position of the backup pin 73 has not changed between before and after the change.

FIG. 8 shows the case where component E is mounted on board P of product type A. The board P of the product type A has a relatively narrow width in the front-rear direction and a width in the left-right direction, and is fixed at the rear and right working positions. In the example shown in FIG. 8, nine backup pins 73 are used to back up the board P of the product type A, and ten surplus backup pins 73 are erected for the first priority R1.

Fig. 9 shows the case where product type A is switched to product type B. The substrate P of the product type B has a width in the horizontal direction and a width in the front-rear direction that are larger than those of the substrate P of the product type A, and the width in the horizontal direction substantially matches the width in the horizontal direction of the push-up plate 70 . The board P of the product type B is fixed in the rear working position. Fourteen backup pins 73 are used for backing up the substrate P of the product type B. As shown in FIG.

In the example shown in FIG. 9, nine backup pins 73 (before changing the arrangement of the backup pins 73 at positions indicated by white circles 111 before changing the arrangement) overlap the working positions of the board P of the product type B in the state before the arrangement of the backup pins 73 is changed. The backup pin 73) which was erected is erected. Therefore, these nine backup pins 73 are preferentially used for backing up the board P of the type B. FIG. In this case, five backup pins 73 are insufficient. Therefore, the backup pins 73 erected on the first priority R1 are used as backup pins 73 for the shortage. The backup pins 73 erected at the first priority R1 are located in the surplus pin erection region having a low priority among the backup pins 73 erected at positions not overlapping with the working position of the board P of the type after the switching. It is an example of the backup pin 73 provided upright.

FIG. 10 shows the case where the product type B is switched to the product type C. FIG. The board P of the product type C is fixed in the front and right working position. Twelve backup pins 73 are used for backing up the substrate P of the product type C. As shown in FIG.
In the example shown in FIG. 10, three backup pins 73 are erected at positions overlapping the working positions of the board P of the product type C before the arrangement of the backup pins 73 is changed. In this case, nine backup pins 73 are insufficient. Therefore, among the backup pins 73 erected at positions not overlapping the working position of the board P after switching, the seven backup pins 73 erected at the fifth priority R5 and the third priority R3 are The two standing backup pins 73 are used as backup pins 73 for the shortage. These backup pins 73 are an example of the backup pins erected in the surplus pin erection region with low priority among the backup pins erected at positions not overlapping the working position of the substrate after switching.

FIG. 11 shows the case where the product type C is switched to the product type D. FIG. The width of the substrate P of the product type D in the front-rear direction is narrower than that of the substrate P of the product type B, and the width in the horizontal direction substantially matches the width of the push-up plate 70 in the horizontal direction. The board P of the product type D is fixed in the front working position. Eleven backup pins 73 are used for backing up the substrate P of the product type D. As shown in FIG.
In the example shown in FIG. 11, 17 backup pins 73 are erected at positions overlapping the working position of the board P of the product type D before the arrangement of the backup pins 73 is changed. In this case, six backup pins 73 become redundant, so the redundant backup pins 73 are moved to the second priority R2. The second priority R2 is an example of a surplus pin erection region having a high priority among the surplus pin erection regions that do not overlap the work position of the board P of the type after the switching. The backup pins 73 to be moved as redundant backup pins 73 are any of the backup pins 73 that stand at positions overlapping the working position of the board P of the product type D in the state before the arrangement is changed. There may be.

FIG. 12 shows the case where the product type D is switched to the product type E. In FIG. The width of the substrate P of the product type E in the front-rear direction is approximately the same as that of the substrate of the product type A, but the width in the horizontal direction is narrower than that of the product type A. The board P of the product type E is fixed in a working position on the rear side and slightly to the right of the center in the left-right direction. Six backup pins 73 are used for backing up the board P of the type E. As shown in FIG.
In the example shown in FIG. 12, the backup pin 73 is not set up at a position overlapping the working position of the board P of the product type E before the arrangement of the backup pin 73 is changed. In this case, six backup pins 73 are insufficient. For this reason, among the backup pins 73 erected at positions not overlapping the working position of the substrate P after switching, the six backup pins 73 erected at the fifth priority R5 are the backup pins for the shortage. 73.

FIG. 13 shows the case where the product type E is switched to the product type F. FIG. The board P of the product type F is fixed in the rear working position. Twelve backup pins 73 are used for backing up the board P of the product type F. As shown in FIG.
In the example shown in FIG. 13, 14 backup pins 73 are erected at positions overlapping the working position of the board P of the product type F before the arrangement of the backup pins 73 is changed. In this case, two backup pins 73 are redundant, so the redundant backup pins 73 are moved to the first priority R1.

Here, in the example shown in FIG. 13, the two backup pins 73 erected under the front conveyor belt 31A are moved to the first priority R1. This is to prevent the two backup pins 73 from interfering with the front conveyor belt 31A. As a result, four backup pins 73 are moved to the first priority R1.
Although not shown in the above-described specific example, if the backup pin 73 is erected at a position overlapping the

margins

101, 102, and 103 of the product type after switching in the state before the arrangement of the backup pin 73 is changed, Those backup pins 73 are also moved to the superfluous pin setting area with a high priority.

(6) Effect of the Embodiment According to the surface mounter 14 according to the first embodiment, the backup pins 73 erected at positions overlapping the working positions of the substrate P after switching in the state before the arrangement is changed are replaced. Surplus backup pins 73 that are not used for backing up the board P later are moved to a surplus pin erecting area having a higher priority among surplus pin erecting areas that do not overlap the working position of the board P after switching. For this reason, if a higher priority is set for the surplus pin setting area that is less likely to overlap with the work position, the number of times the backup pin 73 must be moved due to the work position of the board P overlapping the surplus pin setting area can be reduced. can be reduced.
For example, in FIG. 11, if two of the six redundant backup pins 73 are moved not to the second priority R2 but to the fifth priority R5, which has a lower priority, the two backup pins 73 after switching It becomes easy to overlap with the work position of the substrate P of the product type. If it easily overlaps with the working position of the board P, there is a high possibility that it will have to be moved as an extra backup pin 73 . On the other hand, when it is moved to the second priority R2, which has a higher priority, it is difficult for the work position of the board P of the type after switching to overlap with the second priority R2. less likely to disappear.
Therefore, according to the surface mounter 14, the total setup time can be shortened over a relatively long period of time when the surplus backup pins 73 are erected on the push-up plate 70 on which the backup pins 73 are erected. .

According to the surface mounter 14, when the number of backup pins 73 is insufficient, the surplus pin erecting region having the lowest priority among the backup pins 73 erected at positions not overlapping with the working position of the board P of the type after the changeover. is preferentially used. If the backup pins 73 in the surplus pin setting area with a low priority are used, the number of the backup pins 73 set up in the area where it is difficult to overlap with the substrate does not need to be reduced, so the surplus backup pins 73 must be moved. You can reduce the number of times that it will not go away.

According to the surface mounter 14, the four first surplus pin setting regions R1 to R4 (ie, the four corners of the plate) have higher priority than the second surplus pin setting region R5 (ie, regions other than the four corners). Therefore, the setup time can be shortened compared to the case where the priority is lower than that of the second surplus pin setting region.

According to the surface mounter 14, the four first surplus pin standing regions R1 to R4 are located on the front side when the rear conveyor belt 31B is closest to the front conveyor belt 31A when the front conveyor belt 31A is on the frontmost side. The area in the area between the conveyor belt 31A and the rear conveyor belt 31B, and the front side when the front conveyor belt 31A is closest to the rear conveyor belt 31B when the rear conveyor belt 31B is at the rearmost side. Since the area is within the area between the conveyor belt 31A and the rear conveyor belt 31B, the first surplus pin standing areas R1 to R4 are partly outside these areas. The working position of the board P is less likely to overlap the surplus pin standing regions R1 to R4.

According to the surface mounter 14, different priorities are set for the four first surplus pin standing regions R1 to R4. In this way, the surplus backup pins 73 are moved to the first surplus pin setting region with the highest priority among the four first surplus pin setting regions R1 to R4, so that the setup time can be shortened. become more sexual.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described in the above description and drawings, and the following embodiments are also included in the technical scope disclosed in this specification.

(1) In the above-described embodiment, the backup pin 73, which is erected at a position overlapping the working position of the board P of the type after switching in the state before the arrangement is changed, is used as a backup for the board P of the type after switching. The case of preferential use has been described as an example. However, this is an example. For example, the backup pin 73 erected in the surplus pin erection region having a low priority may be preferentially used.

(2) In the first embodiment, even if there is an empty surplus pin setting area with a high priority, the surplus backup pin 73 is set up in a surplus pin setting area with a low priority. (eg FIGS. 10, 12 and 13). For this reason, after the arrangement of the backup pins 73 is changed, the redundant backup pins 73 set up in the redundant pin setting region with the low priority are aggregated in the redundant pin setting region with the high priority. may

(3) In the first embodiment, the DS conveyor in which the two conveyor belts 31 can independently move in the front-rear direction was described as an example of the conveyor 21 . Only the conveyor belt 31 may be a single-stage transfer conveyor 21 that is movable in the front-rear direction. In that case, for example, when only the rear conveyor belt 31B is movable in the front-rear direction, only the two rear corners of the push-up plate 70 (that is, the first surplus pin standing regions R2 and R3) are moved to the first position. may be used as the surplus pin setting area, and all other areas may be set as the second surplus pin setting area. This is because when work is performed only at the front working position, the working position of the board P is unlikely to overlap the two rear corners.

(4) In the above-described embodiment, the backup pins 73 erected in the surplus pin erection region having a low priority among the surplus pin erection regions that do not overlap with the work position of the substrate P of the type after the switching are replaced by the shortage of the backup pins 73 The case where it is preferentially used as the backup pin 73 of . On the other hand, regardless of the order of priority, arbitrary backup pins 73 erected in the surplus pin erecting region that do not overlap with the working position of the board P of the type after switching are used as backup pins 73 for the shortage. may

(5) In the above embodiment, as an example of partitioning the push-up plate 70 into a plurality of surplus pin erecting regions, the case of partitioning into four corner regions and other regions has been described as an example. However, this is only an example, and it is possible to appropriately select how to divide the push-up plate 70 into a plurality of surplus pin erecting regions.

(6) In the above embodiment, the case where the entire area of the push-up plate 70 is used as the surplus pin erecting area has been described as an example, but only a partial area of the push-up plate 70 is used as the surplus pin erecting area. may For example, only the first surplus pin standing regions R1 to R4 may be used, and the second surplus pin standing region R5 may be excluded from the surplus pin standing regions. In that case, the backup pins erected in the second surplus pin erecting region R5 that do not overlap with the working position of the substrate P are the surplus backup pins 73, which are the first surplus pins having a higher priority. Moved to the standing area.

(7) In the above-described embodiment, the area within the minimum width of the pair of conveyor belts 31 was described as an example of the four first surplus pin erecting areas of the push-up plate 70, but the first surplus pin erecting area The width in the front-rear direction may be wider than the minimum width of the pair of conveyor belts 31 .

(8) In the above-described embodiment, the four first surplus pin setting regions have been given different priorities. may be the same. Alternatively, the same priority may be set for two or more of the four first surplus pin setting regions.

(9) In the above-described first embodiment, the case where it is determined that the working position of the board P overlaps only when the entire surplus pin erecting region overlaps with the working position has been described as an example. On the other hand, if a part of the surplus pin standing region overlaps the working position, it may be determined that the working position overlaps.

(10) In the first embodiment, the surface mounter 14 is used as the board working device, but the board working device may be the screen printer 11 or the dispenser 13 . Alternatively, the substrate working device may be another device constituting the mounting line 1 as long as it has a backup unit.

14: Surface mounter (an example of board working equipment)
21: Conveyor (an example of the transport section)
24: Backup section 25: Head unit (an example of a working section and a changing section)
26: Head moving unit (an example of working unit and changing unit)
29: Control unit 31: Pair of conveyor belts 31A: Front conveyor belt (an example of one conveyor belt)
31B: Rear conveyor belt (an example of the other conveyor belt)
70: Push-up plate (an example of a plate)
73: Backup pins P: Substrates R1 to R4: First surplus pin standing region R5: Second surplus pin standing region

Claims

A board working device for working on a board,
a transport unit that transports the substrate to a work position according to the type of the substrate or the front and back of the substrate;
a backup unit having a plurality of backup pins and a plate on which the backup pins are erected, and using the backup pins to back up the board transported to the working position by the transport unit;
a work unit that performs the work on the substrate backed up by the backup unit;
a changing portion for changing the arrangement of the backup pins erected on the plate;
a control unit;
with
The plate is partitioned into a plurality of surplus pin setting regions, and priority is set for the plurality of surplus pin setting regions,
The control unit
a change process of changing the arrangement of the backup pins by the change unit when the type or the front and back of the substrate is switched;
Of the backup pins erected at a position overlapping the working position of the board after switching in the state before the arrangement is changed, the surplus backup pins that are not used for backing up the board after switching are removed. a moving process of moving the board to the surplus pin setting area having a higher priority among the surplus pin setting areas that do not overlap with the work position of the substrate;
board working equipment.
The board working apparatus according to claim 1,
In the change processing, the control unit uses only the backup pin erected at a position overlapping the working position of the substrate after switching in the state before changing the arrangement to back up the substrate after switching. When the backup pins are insufficient, the backup pins erected in the surplus pin erection region having a lower priority among the backup pins erected at positions not overlapping the working position of the substrate after switching. as the backup pins for the shortage.
The board working apparatus according to claim 1 or claim 2,
The transport unit has a pair of conveyor belts for transporting the substrate, and each conveyor belt is configured to be movable in a direction orthogonal to the transport direction of the substrate,
Each of the four corners of the plate is partitioned as one first surplus pin erecting area, and the areas other than the four first surplus pin erecting areas are partitioned as second surplus pin erecting areas. has been
A board working apparatus, wherein a higher priority is set to the first surplus pin erecting area than to the second surplus pin erecting area.
The board working apparatus according to claim 3,
The four first surplus pin setting regions are arranged such that the other conveyor belt is closest to the one conveyor belt when the one conveyor belt is at the farthest end on the side opposite to the other conveyor belt. the area in the area between one of the conveyor belts and the other of the conveyor belts when the other conveyor belt is at the extreme end opposite to the one of the conveyor belts A substrate working device that is the area within the area between one of the conveyor belts and the other of the conveyor belts when the belts are closest to the other conveyor belt.
The board working apparatus according to claim 3 or claim 4,
A board working apparatus, wherein different priorities are set for the four first surplus pin erecting regions.
A method for managing surplus backup pins in a board working device for working on a board, comprising:
The board working device includes:
a transport unit that transports the substrate to a work position according to the type of the substrate or the front and back of the substrate;
a backup unit having a plurality of backup pins and a plate on which the backup pins are erected, and using the backup pins to back up the board transported to the working position by the transport unit;
a work unit that performs the work on the substrate backed up by the backup unit;
a changing portion for changing the arrangement of the backup pins erected on the plate;
with
The plate is partitioned into a plurality of surplus pin setting regions, and priority is set for the plurality of surplus pin setting regions,
The management method is
a changing step of changing the arrangement of the backup pins by the changing unit when the type or front and back of the substrate is switched;
Of the backup pins erected at positions overlapping the working position of the substrate after switching in the state before the arrangement is changed, the surplus backup pins that are not used for backing up the substrate after switching are replaced with the backup pins after switching. a moving step of moving to the surplus pin setting region having a higher priority among the surplus pin setting regions that do not overlap with the working position of the substrate;
How to manage redundant backup pins, including: