JP4494910B2 - Surface mount equipment - Google Patents

Description

  The present invention relates to a surface mounting apparatus, and more particularly to a surface mounting apparatus suitable for application when mounting a component such as an electronic component on a substrate such as a circuit board.

  As a surface mounting device used when mounting an electronic component on a wiring board, for example, a device disclosed in Patent Document 1 is known.

  As shown schematically in FIG. 3, such a surface mounting apparatus 10 includes a substrate stage 12 that supports a substrate S on which electronic components are mounted, and the substrate stage 12 is advanced and retracted in the Y direction as indicated by a double-directional arrow in the figure. And a substrate positioning unit 14 that can be moved to position the substrate S supported in the mounting region corresponding to the position of the illustrated substrate stage 12. Further, the first and second component supply units 16A and 16B disposed on both sides of the mounting region and the components are sucked out from the component supply units 16A and 16B, and mounted on the mounting positions on the substrate S. The first and second suction heads 18A and 18B, the suction heads 18A and 18B can be independently moved forward and backward in the X direction, and the positioning guide 20 can be positioned in the same direction. A Y-direction positioning guide 22 capable of moving forward and backward in the Y direction and positioning both suction heads 18A and 18B in the same direction is provided.

  In the surface mounting apparatus, the upstream substrate transport unit 24A that transports the substrate S from the previous process to the substrate positioning unit 14 along the X direction, and the downstream that transports the substrate S on which components have been mounted to the next process. A side substrate transport unit 24B is disposed along the first and second component supply units 16A and 16B. In the figure, reference numeral 26 denotes a base that supports the entire apparatus.

  In such a surface mounting apparatus, the two suction heads 18A and 18B have a plurality (three in this case) of suction nozzle mounting portions indicated by ◯ in the drawing, and by the suction nozzles mounted and supported by the mounting portions, After adsorbing components from a predetermined position of a tape feeder (component supply device) indicated by a plurality of narrow rectangles arranged in parallel in the X direction on each of the first and second component supply units 16A and 16B, a predetermined value in the X direction is obtained. The substrate is moved to a position, positioned in the vertical (Z) direction and the rotational (θ) direction, and mounted at a predetermined position on the substrate S. During normal production, this mounting operation is executed alternately by the two suction heads 18A and 18B that move within the range indicated by the double-headed arrow in the drawing.

  By the way, in such a surface mounting apparatus, each suction head 18A, 18B has a structure that can be replaced with a suction nozzle suitable for suction according to the size and shape of the electronic component to be mounted. The first and second nozzle replacement units 30A and 30B, which are arranged between the component supply units 16A and 16B and the substrate transfer units 24A and 24B and store a plurality of nozzles indicated by ○ in the drawing, The nozzles are exchanged by moving the heads 18A and 18B.

JP 2004-6605 A

  However, in the conventional surface mounting apparatus, in order to perform nozzle replacement, it is necessary to move the suction head in the Y direction and position it in the nozzle replacement portion. However, the two suction heads 18A and 18B are positioned in the same X direction. Since it is supported by the guide 20, only one of the suction heads is replaced with a nozzle, and during that time, the operation of sucking and mounting the components cannot be continued with the other suction head, resulting in a decrease in productivity. there were.

  The present invention has been made to solve the above-described conventional problems, and in a surface mount apparatus in which two suction heads are supported on the same X-direction positioning guide, nozzle replacement is performed with one suction head. In the meantime, it is an object to be able to continue the work of mounting the component on the substrate with the other suction head and to improve the productivity.

The present invention provides a substrate for supporting a substrate for mounting a component in a surface mounting apparatus that transports the substrate in the X direction, mounts the component on the substrate in the mounting region, and then transports the mounted substrate to the next process. a stage, a substrate stage is moved back and forth in the Y direction perpendicular to the X direction in a horizontal plane, and the substrate positioning means for positioning in the mounting area of the substrate being supported, respectively arranged in the X direction on both sides of the mounting region First and second component supply means, and first and second suction heads for sucking components from the first and second component supply means and mounting them on a substrate supported by a substrate stage in the mounting region, The first and second suction heads are each provided with the same X-direction positioning guides that are independently moved forward and backward in the X direction, and the mounting region and the first and second heads. The first and second nozzle replacement portions and the first and second nozzle replacement portions respectively disposed independently of the substrate stage between the product supply means and the first and second nozzle replacement portions are individually moved forward and backward in the Y direction for positioning. The problem is solved by providing nozzle replacement part positioning means different from the substrate positioning means.

In the present invention, a substrate transport unit for transporting a substrate from the upstream side to the downstream side is disposed in the X direction along the first and second component supply means, and the center of the substrate transport unit is provided. The X axis passing through the substrate stage , the substrate positioning means, the first and second component supply means, the first and second suction heads, the X direction positioning guide, the first and second nozzle replacement parts, and the nozzle replacement part positioning the hand stages may be have become substantially symmetrical arrangement in the Y direction.

  The present invention may further include a Y-direction positioning guide that moves the X-direction positioning guide back and forth in the Y direction and positions the first and second suction heads in the same direction.

  According to the present invention, the first and second nozzle replacement portions are respectively disposed between the mounting region where the substrate is positioned and mounted, and the first and second component supply means disposed on both sides thereof. Each nozzle replacement part is moved forward and backward in the Y direction so that it can be positioned. Therefore, when replacing the nozzle, it is not necessary to move the suction nozzle in the Y direction in order to match the suction nozzle with the nozzle replacement section. Therefore, the nozzle replacement work is performed by moving one suction head to the corresponding nozzle replacement section. Even during the process, the other suction head can continue the suction and mounting operation of the electronic component, and thus can improve the production efficiency.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing an outline of a surface mounting apparatus according to a first embodiment of the present invention.

  The surface mount device 10 of this embodiment has the same basic configuration as the conventional example shown in FIG. That is, the substrate stage 12 for fixing and supporting the wiring board S for mounting the electronic component by the clamp mechanism, and the substrate stage 12 are moved forward and backward in the Y direction to correspond to the position of the illustrated substrate stage 12. In the mounting area, the board positioning unit 14 for positioning the instructed board, the first and second component supply units 16A and 16B disposed on both sides of the mounting area, and the component supply units 16A and 16B, The first and first components are sucked at a predetermined position by a plurality of rows of tape feeders (narrow-width rectangles in the figure) installed and mounted on the substrate S supported by the substrate stage 12 in the mounting region. 2Suction heads 18A and 18B and these suction heads 18A and 18B are moved forward and backward in the X direction by a linear motor or the like and positioned. The direction positioning guide 20 and the X direction positioning guide 20 are moved forward and backward in the Y direction to position the first and second suction heads 18A and 18B in the same direction. For example, the Y direction positioning guide 22 including a pair of belt conveyors, etc. It has.

  The substrate positioning unit 14 rotates a pair of guide rails 32 that guide the substrate stage 12 in the Y direction, a ball screw 34 that can move the substrate stage 12 in the Y direction and can be positioned accurately. The servo motor 36 is provided.

  Further, in the X direction along the first and second component supply units 16A and 16B, an upstream side substrate transport unit 24A including a pair of conveyors for transporting the substrate S to a position near the substrate positioning unit 14; A similar downstream substrate transport unit 24B for unloading the substrate S from the substrate positioning unit 14 is provided.

  In the present embodiment, in order to mount components on the substrate S, the first nozzle replacement is performed between the mounting region for positioning the substrate S and the first component supply unit 16A and the second component supply unit 16B. The part 30A and the second nozzle replacement part 30B are arranged vertically.

  These nozzle replacement parts 30A and 30B are not shown in the figure, but, for example, as in the case of the substrate stage 12, by means of a nozzle replacement part positioning means composed of a ball screw that moves in the Y direction, a servo motor, and the like, As indicated by arrows in the figure, the nozzle replacement portions 30A and 30B are moved forward and backward in the Y direction, respectively, so that they can be positioned.

  Next, the operation of this embodiment will be described.

  The substrate S transported from the previous process by the upstream substrate transport unit 24A is supported and fixed on the substrate stage 12 at a predetermined position, and then moved in the Y direction by the substrate positioning unit 14 to be positioned in the mounting region. After the above state is reached, mounting of electronic components on the substrate S is started.

  During normal production, as in the conventional example, each of the first and second suction heads 18A and 18B is installed in the corresponding first and second component supply units 16A and 16B by the X-direction positioning guide 20, respectively. After being positioned at the suction position (coordinates) in the (component supply apparatus) and picking up the components at the same position, the parts are moved by the X-direction positioning guide 20 and accurately positioned at the mounting coordinates in the X direction, and the board positioning unit 14, mounting is performed at the mounting position on the circuit board S positioned at the mounting coordinates in the Y direction.

  On the other hand, when nozzle replacement occurs, for example, when replacing the nozzle of the first suction head 18A, the suction head 18A is positioned on the first nozzle replacement section 30A in the X direction by the X direction positioning guide 20. The nozzle replacement unit 30A is moved in the Y direction by the nozzle replacement unit positioning means, and can be positioned at the corresponding position of the suction nozzle to be mounted or returned. Therefore, the nozzle replacement unit 30A can move the nozzle without moving the suction head 18A in the Y direction. Can be exchanged. Accordingly, during this time, the other suction head 18B that has not performed the nozzle replacement can move between the second component supply unit 16B and the substrate S, and thus the component suction / mounting operation can be continued.

  As described above in detail, according to the present embodiment, when the nozzle is replaced, it is not necessary to move the suction nozzle in the Y direction in order to match the suction nozzle with the nozzle replacement portion. Even while moving to the replacement part and performing the nozzle replacement work, the other suction head can continue the suction / mounting operation of the electronic component, so that the production efficiency can be improved.

  FIG. 2 is a plan view showing an outline of the surface mounting apparatus according to the second embodiment of the present invention.

  The surface mounting apparatus of the present embodiment is substantially the same as the surface mounting apparatus of the first embodiment shown in FIG. 1, and is symmetric in the Y direction with respect to the X axis passing through the centers of the substrate transfer units 24A and 24B. It is set as the structure arrange | positioned.

  Therefore, in the present embodiment, as shown in the figure, two substrate stages 12 that support the substrate S are provided with two component mounting regions, and therefore the components are mounted with twice the production efficiency. It is possible.

  According to the present embodiment, in any mounting region, it is possible to continue the operation of sucking and mounting components on the substrate S by the other suction head while the nozzle replacement is performed for one suction head. .

  In the above-described embodiment, the example in which the first and second suction heads 18A and 18B can be moved in the Y direction by the Y-direction positioning guide 22 is shown. However, the surface mounting apparatus of the present invention does not necessarily move the suction head in the Y direction. Since there is no need to move, the Y-direction positioning guide 22 may not be provided, that is, the X-direction positioning guide 20 may be fixed at the illustrated position.

  In the second embodiment, an example in which two X-direction positioning guides 20 on which the first and second suction heads 18A and 18B are supported is provided. However, the present invention is not limited to this. The guide 20 may be alternately mounted on two substrates.

1 is a schematic plan view showing a surface mounting apparatus according to a first embodiment of the present invention. Schematic plan view showing a surface mounting apparatus according to a second embodiment of the present invention. Schematic plan view showing features of conventional surface mount equipment

Explanation of symbols

S ... Substrate 10 ... Surface mount device 12 ... Substrate stage 14 ... Substrate positioning unit 16 ... Component supply unit 18 ... Suction head 20 ... X direction positioning guide 22 ... Y direction positioning guide 24 ... Substrate transport unit 26 ... Base 30 ... Nozzle replacement Part 32 ... Guide rail 34 ... Ball screw 36 ... Servo motor

Claims (3)

In a surface mounting apparatus that transports a board in the X direction, mounts components on the board in the mounting area, and then transports the mounted board to the next process.
A substrate stage for supporting a substrate for mounting components;
Substrate stage is moved back and forth in the Y direction perpendicular to the X direction in a horizontal plane, and the substrate positioning means for positioning the substrate supported in the mounting region,
First and second component supply means respectively disposed on both sides in the X direction of the mounting region;
First and second suction heads for sucking components from the first and second component supply means and mounting them on the substrate supported by the substrate stage in the mounting region;
The first and second suction heads are each provided with the same X-direction positioning guide for independently moving forward and backward in the X direction and positioning,
A first and a second nozzle replacement unit disposed independently of the substrate stage between the mounting area and the first and second component supply units;
A surface mounting apparatus comprising a nozzle replacement part positioning means different from the substrate positioning means for individually moving the first and second nozzle replacement parts forward and backward in the Y direction and positioning them. In the X direction along the first and second component supply means, a substrate transport unit for transporting the substrate from the upstream side to the downstream side is disposed,
With respect to the X-axis passing through the center of the substrate transport unit, the substrate stage , substrate positioning means, first and second component supply means, first and second suction heads, X direction positioning guides, first and second nozzle replacement units and, a surface mounting apparatus according to claim 1, characterized in that the nozzle changing portion positioning the hand stage is in substantially symmetrical arrangement in the Y direction.   3. The surface mounting according to claim 1, further comprising a Y-direction positioning guide that moves the X-direction positioning guide forward and backward in the Y direction and positions the first and second suction heads in the same direction. apparatus.

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