JP4494910B2 - Surface mount equipment - Google Patents

Surface mount equipment Download PDF

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JP4494910B2
JP4494910B2 JP2004260089A JP2004260089A JP4494910B2 JP 4494910 B2 JP4494910 B2 JP 4494910B2 JP 2004260089 A JP2004260089 A JP 2004260089A JP 2004260089 A JP2004260089 A JP 2004260089A JP 4494910 B2 JP4494910 B2 JP 4494910B2
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substrate
positioning
mounting
component supply
nozzle replacement
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JP2006080158A (en
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英浩 福沢
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Juki Corp
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本発明は、表面実装装置、特に電子部品等の部品を回路基板等の基板に実装する際に適用して好適な表面実装装置に関する。   The present invention relates to a surface mounting apparatus, and more particularly to a surface mounting apparatus suitable for application when mounting a component such as an electronic component on a substrate such as a circuit board.

電子部品を配線基板に実装する際に使用する表面実装装置としては、例えば特許文献1に開示されているものが知られている。   As a surface mounting device used when mounting an electronic component on a wiring board, for example, a device disclosed in Patent Document 1 is known.

このような表面実装装置10は、図3に概要を示すように、電子部品を実装する基板Sを支持する基板ステージ12と、図中両方向矢印で示すように該基板ステージ12をY方向に進退移動させ、図示されている基板ステージ12の位置に対応する実装領域において支持されている基板Sを位置決めすることが可能な基板位置決め部14とを備えている。又、この実装領域の両側にそれぞれ配設された第1、第2部品供給部16A、16Bと、各部品供給部16A、16Bから部品を吸着して取り出し、基板S上の実装位置に実装する第1、第2吸着ヘッド18A、18Bと、各吸着ヘッド18A、18Bを独立にX方向に進退移動させ、同方向の位置決めを行なうことが可能なX方向位置決めガイド20と、該位置決めガイド20をY方向に進退移動させ、両吸着ヘッド18A、18Bを同方向に位置決めすることが可能なY方向位置決めガイド22とを備えている。   As shown schematically in FIG. 3, such a surface mounting apparatus 10 includes a substrate stage 12 that supports a substrate S on which electronic components are mounted, and the substrate stage 12 is advanced and retracted in the Y direction as indicated by a double-directional arrow in the figure. And a substrate positioning unit 14 that can be moved to position the substrate S supported in the mounting region corresponding to the position of the illustrated substrate stage 12. Further, the first and second component supply units 16A and 16B disposed on both sides of the mounting region and the components are sucked out from the component supply units 16A and 16B, and mounted on the mounting positions on the substrate S. The first and second suction heads 18A and 18B, the suction heads 18A and 18B can be independently moved forward and backward in the X direction, and the positioning guide 20 can be positioned in the same direction. A Y-direction positioning guide 22 capable of moving forward and backward in the Y direction and positioning both suction heads 18A and 18B in the same direction is provided.

上記表面実装装置では、又、基板Sを前工程からX方向に沿って前記基板位置決め部14へ搬送する上流側基板搬送部24Aと、部品の実装が終了した基板Sを次工程へ搬送する下流側基板搬送部24Bとが、前記第1、第2部品供給部16A、16Bに沿って配設されている。なお、図中26は、装置全体を支持しているベースである。   In the surface mounting apparatus, the upstream substrate transport unit 24A that transports the substrate S from the previous process to the substrate positioning unit 14 along the X direction, and the downstream that transports the substrate S on which components have been mounted to the next process. A side substrate transport unit 24B is disposed along the first and second component supply units 16A and 16B. In the figure, reference numeral 26 denotes a base that supports the entire apparatus.

このような表面実装装置では、2つの吸着ヘッド18A、18Bが、図中○で示す複数(ここでは3つ)の吸着ノズル装着部を有し、各装着部に装着支持された吸着ノズルにより、前記第1、第2部品供給部16A、16BのそれぞれにX方向に並設された複数の狭幅矩形で示すテープフィーダ(部品供給装置)の所定位置から部品を吸着した後、X方向の所定位置に移動し、上下(Z)方向及び回転(θ)方向の位置決めを行なって基板Sの所定位置に実装する。通常の生産時には、この実装動作が、図中両方向矢印で示す範囲内で移動する2つの吸着ヘッド18A、18Bにより交互に実行される。   In such a surface mounting apparatus, the two suction heads 18A and 18B have a plurality (three in this case) of suction nozzle mounting portions indicated by ◯ in the drawing, and by the suction nozzles mounted and supported by the mounting portions, After adsorbing components from a predetermined position of a tape feeder (component supply device) indicated by a plurality of narrow rectangles arranged in parallel in the X direction on each of the first and second component supply units 16A and 16B, a predetermined value in the X direction is obtained. The substrate is moved to a position, positioned in the vertical (Z) direction and the rotational (θ) direction, and mounted at a predetermined position on the substrate S. During normal production, this mounting operation is executed alternately by the two suction heads 18A and 18B that move within the range indicated by the double-headed arrow in the drawing.

ところで、このような表面実装装置では、各吸着ヘッド18A、18Bは実装する電子部品の寸法や形状に応じて吸着に適した吸着ノズルに交換可能な構造を有しており、必要に応じて適宜、部品供給部16A、16Bと基板搬送部24A、24Bとの間に配設され、図中○で示す複数本のノズルが格納されている第1、第2ノズル交換部30A、30Bに各吸着ヘッド18A、18Bを移動させてノズル交換が行なわれるようになっている。   By the way, in such a surface mounting apparatus, each suction head 18A, 18B has a structure that can be replaced with a suction nozzle suitable for suction according to the size and shape of the electronic component to be mounted. The first and second nozzle replacement units 30A and 30B, which are arranged between the component supply units 16A and 16B and the substrate transfer units 24A and 24B and store a plurality of nozzles indicated by ○ in the drawing, The nozzles are exchanged by moving the heads 18A and 18B.

特開2004−6605号公報JP 2004-6605 A

しかしながら、前記従来の表面実装装置では、ノズル交換を行なうためには吸着ヘッドをY方向に移動させ、ノズル交換部に位置決めする必要があるが、2つの吸着ヘッド18A、18Bが同一のX方向位置決めガイド20に支持されていることから、一方の吸着ヘッドのみノズル交換を行ない、その間他方の吸着ヘッドで部品を吸着、実装する動作を継続することはできないため、生産性の低下を招くという問題があった。   However, in the conventional surface mounting apparatus, in order to perform nozzle replacement, it is necessary to move the suction head in the Y direction and position it in the nozzle replacement portion. However, the two suction heads 18A and 18B are positioned in the same X direction. Since it is supported by the guide 20, only one of the suction heads is replaced with a nozzle, and during that time, the operation of sucking and mounting the components cannot be continued with the other suction head, resulting in a decrease in productivity. there were.

本発明は、前記従来の問題点を解決するべくなされたもので、同一のX方向位置決めガイドに2つの吸着ヘッドが支持されている表面実装装置において、一方の吸着ヘッドでノズル交換を行なっている間でも、他方の吸着ヘッドで基板に部品を実装する作業を継続することができ、生産性の向上を図ることができるようにすることを課題とする。   The present invention has been made to solve the above-described conventional problems, and in a surface mount apparatus in which two suction heads are supported on the same X-direction positioning guide, nozzle replacement is performed with one suction head. In the meantime, it is an object to be able to continue the work of mounting the component on the substrate with the other suction head and to improve the productivity.

本発明は、基板をX方向に搬送し、実装領域で該基板に部品を実装した後、実装後の基板を次工程へ搬送する表面実装装置において、部品を実装するための基板を支持する基板ステージと、該基板ステージを水平面でX方向と直交するY方向に進退移動させ、支持されている基板を前記実装領域において位置決めする基板位置決め手段と、前記実装領域のX方向両側にそれぞれ配設された第1及び第2部品供給手段と、第1及び第2部品供給手段からそれぞれ部品を吸着し、前記実装領域において基板ステージに支持されている基板に実装する第1及び第2吸着ヘッドと、第1及び第2吸着ヘッドを、それぞれ独立にX方向に進退移動させ、位置決めする同一のX方向位置決めガイドとを備えていると共に、前記実装領域と前記第1及び第2部品供給手段との間に、前記基板ステージとは独立にそれぞれ配設された第1及び第2ノズル交換部と、第1及び第2ノズル交換部をそれぞれY方向に個別に進退移動させ、位置決めする、前記基板位置決め手段とは異なるノズル交換部位置決め手段を備えたことにより、前記課題を解決したものである。 The present invention provides a substrate for supporting a substrate for mounting a component in a surface mounting apparatus that transports the substrate in the X direction, mounts the component on the substrate in the mounting region, and then transports the mounted substrate to the next process. a stage, a substrate stage is moved back and forth in the Y direction perpendicular to the X direction in a horizontal plane, and the substrate positioning means for positioning in the mounting area of the substrate being supported, respectively arranged in the X direction on both sides of the mounting region First and second component supply means, and first and second suction heads for sucking components from the first and second component supply means and mounting them on a substrate supported by a substrate stage in the mounting region, The first and second suction heads are each provided with the same X-direction positioning guides that are independently moved forward and backward in the X direction, and the mounting region and the first and second heads. The first and second nozzle replacement portions and the first and second nozzle replacement portions respectively disposed independently of the substrate stage between the product supply means and the first and second nozzle replacement portions are individually moved forward and backward in the Y direction for positioning. The problem is solved by providing nozzle replacement part positioning means different from the substrate positioning means.

本発明は、又、前記第1及び第2部品供給手段に沿ったX方向には、基板を上流側から下流側に搬送する基板搬送部が配設されていると共に、前記基板搬送部中心を通るX軸に関して、前記基板ステージ、基板位置決め手段、第1及び第2部品供給手段、第1及び第2吸着ヘッド、X方向位置決めガイド、第1及び第2ノズル交換部、並びに、ノズル交換部位置決め手段が実質的にY方向に対称な配置になっているようにしてもよい。 In the present invention, a substrate transport unit for transporting a substrate from the upstream side to the downstream side is disposed in the X direction along the first and second component supply means, and the center of the substrate transport unit is provided. The X axis passing through the substrate stage , the substrate positioning means, the first and second component supply means, the first and second suction heads, the X direction positioning guide, the first and second nozzle replacement parts, and the nozzle replacement part positioning the hand stages may be have become substantially symmetrical arrangement in the Y direction.

本発明は、更に、前記X方向位置決めガイドをY方向に進退移動させ、前記第1及び第2吸着ヘッドを同方向に位置決めするY方向位置決めガイドを備えているようにしてもよい。   The present invention may further include a Y-direction positioning guide that moves the X-direction positioning guide back and forth in the Y direction and positions the first and second suction heads in the same direction.

本発明によれば、基板を位置決めして実装を行なう実装領域と、その両側に配置された第1及び第2部品供給手段の間に、第1及び第2ノズル交換部をそれぞれ配設すると共に、各ノズル交換部をY方向に進退移動させ、位置決め可能であるようにした。従って、ノズル交換を行なう際、吸着ノズルをノズル交換部に一致させるために、Y方向へ移動させる必要が無くなることから、一方の吸着ヘッドを該当するノズル交換部へ移動させてノズル交換の作業を行なっている間でも、他方の吸着ヘッドでは電子部品の吸着、実装動作を継続することが可能であるため、生産効率を向上させることが可能となる。   According to the present invention, the first and second nozzle replacement portions are respectively disposed between the mounting region where the substrate is positioned and mounted, and the first and second component supply means disposed on both sides thereof. Each nozzle replacement part is moved forward and backward in the Y direction so that it can be positioned. Therefore, when replacing the nozzle, it is not necessary to move the suction nozzle in the Y direction in order to match the suction nozzle with the nozzle replacement section. Therefore, the nozzle replacement work is performed by moving one suction head to the corresponding nozzle replacement section. Even during the process, the other suction head can continue the suction and mounting operation of the electronic component, and thus can improve the production efficiency.

以下、図面を参照して、本発明の実施の形態について詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1は、本発明に係る第1実施形態の表面実装装置の概要を示す平面図である。   FIG. 1 is a plan view showing an outline of a surface mounting apparatus according to a first embodiment of the present invention.

本実施形態の表面実装装置10は、前記図3に示した従来例と同様の基本構成からなる。即ち、電子部品を実装するための配線基板Sを、クランプ機構により固定・支持する基板ステージ12と、該基板ステージ12をY方向に進退移動させ、図示されている基板ステージ12の位置に対応する実装領域において、指示されている基板を位置決めする基板位置決め部14と、前記実装領域の両側にそれぞれ配設された第1及び第2部品供給部16A、16Bと、各部品供給部16A、16Bに設置されている複数列のテープフィーダ(図中、狭幅矩形)により供給される部品を所定位置で吸着し、前記実装領域において基板ステージ12に支持されている基板Sに実装する第1及び第2吸着ヘッド18A、18Bと、これら吸着ヘッド18A、18Bを、それぞれ独立にリニアモータ等によりX方向に進退移動させ、位置決めするX方向位置決めガイド20と、該X方向位置決めガイド20をY方向に進退移動させ、第1及び第2吸着ヘッド18A、18Bを同方向へ位置決めする、例えば一対のベルトコンベアからなるY方向位置決めガイド22等を備えている。   The surface mount device 10 of this embodiment has the same basic configuration as the conventional example shown in FIG. That is, the substrate stage 12 for fixing and supporting the wiring board S for mounting the electronic component by the clamp mechanism, and the substrate stage 12 are moved forward and backward in the Y direction to correspond to the position of the illustrated substrate stage 12. In the mounting area, the board positioning unit 14 for positioning the instructed board, the first and second component supply units 16A and 16B disposed on both sides of the mounting area, and the component supply units 16A and 16B, The first and first components are sucked at a predetermined position by a plurality of rows of tape feeders (narrow-width rectangles in the figure) installed and mounted on the substrate S supported by the substrate stage 12 in the mounting region. 2Suction heads 18A and 18B and these suction heads 18A and 18B are moved forward and backward in the X direction by a linear motor or the like and positioned. The direction positioning guide 20 and the X direction positioning guide 20 are moved forward and backward in the Y direction to position the first and second suction heads 18A and 18B in the same direction. For example, the Y direction positioning guide 22 including a pair of belt conveyors, etc. It has.

前記基板位置決め部14は、基板ステージ12をY方向に案内する一対のガイドレール32と、該基板ステージ12をY方向に移動させ、正確に位置決めすることができるボールねじ34と、これを回転させるサーボモータ36とを備えた構成になっている。   The substrate positioning unit 14 rotates a pair of guide rails 32 that guide the substrate stage 12 in the Y direction, a ball screw 34 that can move the substrate stage 12 in the Y direction and can be positioned accurately. The servo motor 36 is provided.

又、前記第1及び第2部品供給部16A、16Bに沿ったX方向には、基板Sを前記基板位置決め部14の近傍位置まで搬入する一対のコンベアからなる上流側基板搬送部24Aと、該基板位置決め部14から基板Sを搬出する同様の下流側基板搬送部24Bとが配設されている。   Further, in the X direction along the first and second component supply units 16A and 16B, an upstream side substrate transport unit 24A including a pair of conveyors for transporting the substrate S to a position near the substrate positioning unit 14; A similar downstream substrate transport unit 24B for unloading the substrate S from the substrate positioning unit 14 is provided.

本実施形態においては、基板Sに部品を実装するために、該基板Sを位置決めする実装領域と、前記第1部品供給部16A及び第2部品供給部16Bとの間に、それぞれ第1ノズル交換部30A及び第2ノズル交換部30Bが縦向きに配設されている。   In the present embodiment, in order to mount components on the substrate S, the first nozzle replacement is performed between the mounting region for positioning the substrate S and the first component supply unit 16A and the second component supply unit 16B. The part 30A and the second nozzle replacement part 30B are arranged vertically.

そして、これら両ノズル交換部30A、30Bは、図示は省略するが、例えば基板ステージ12の場合と同様に、Y方向に移動させるボールねじとサーボモータ等で構成されるノズル交換部位置決め手段により、図中矢印で示すように、各ノズル交換部30A、30BがそれぞれY方向に進退移動され、位置決め可能になっている。   These nozzle replacement parts 30A and 30B are not shown in the figure, but, for example, as in the case of the substrate stage 12, by means of a nozzle replacement part positioning means composed of a ball screw that moves in the Y direction, a servo motor, and the like, As indicated by arrows in the figure, the nozzle replacement portions 30A and 30B are moved forward and backward in the Y direction, respectively, so that they can be positioned.

次に、本実施形態の作用を説明する。   Next, the operation of this embodiment will be described.

上流側基板搬送部24Aにより前工程から搬送されてくる基板Sを、所定位置で前記基板ステージ12に支持・固定した後、基板位置決め部14によりY方向に移動して実装領域に位置決めして図示した状態にした後、該基板Sへの電子部品の実装が開始される。   The substrate S transported from the previous process by the upstream substrate transport unit 24A is supported and fixed on the substrate stage 12 at a predetermined position, and then moved in the Y direction by the substrate positioning unit 14 to be positioned in the mounting region. After the above state is reached, mounting of electronic components on the substrate S is started.

通常生産時には、従来例と同様に、第1及び第2の各吸着ヘッド18A、18BがX方向位置決めガイド20により、対応する第1及び第2部品供給部16A、16Bにそれぞれ設置されたテープフィーダ(部品供給装置)における吸着位置(座標)に位置決めされ、同位置で部品を吸着した後、同X方向位置決めガイド20により移動され、X方向の実装座標に正確に位置決めされると共に、基板位置決め部14によりY方向の実装座標に位置決めされた回路基板S上の実装位置に実装を行なう。   During normal production, as in the conventional example, each of the first and second suction heads 18A and 18B is installed in the corresponding first and second component supply units 16A and 16B by the X-direction positioning guide 20, respectively. After being positioned at the suction position (coordinates) in the (component supply apparatus) and picking up the components at the same position, the parts are moved by the X-direction positioning guide 20 and accurately positioned at the mounting coordinates in the X direction, and the board positioning unit 14, mounting is performed at the mounting position on the circuit board S positioned at the mounting coordinates in the Y direction.

一方、ノズル交換が発生したときには、例えば第1吸着ヘッド18Aのノズル交換を行なう場合であれば、該吸着ヘッド18AがX方向位置決めガイド20によりX方向の第1ノズル交換部30A上に位置決めされると、該ノズル交換部30Aはノズル交換部位置決め手段によりY方向に移動され、装着あるいは返却する吸着ノズルの対応位置に位置決めすることができるため、吸着ヘッド18AをY方向に移動させることなく、ノズルの交換を行なうことができる。従って、その間、ノズル交換を行なっていない他方の吸着ヘッド18Bは第2部品供給部16Bと基板Sの間を移動可能であるため、部品の吸着・実装動作を継続することができる。   On the other hand, when nozzle replacement occurs, for example, when replacing the nozzle of the first suction head 18A, the suction head 18A is positioned on the first nozzle replacement section 30A in the X direction by the X direction positioning guide 20. The nozzle replacement unit 30A is moved in the Y direction by the nozzle replacement unit positioning means, and can be positioned at the corresponding position of the suction nozzle to be mounted or returned. Therefore, the nozzle replacement unit 30A can move the nozzle without moving the suction head 18A in the Y direction. Can be exchanged. Accordingly, during this time, the other suction head 18B that has not performed the nozzle replacement can move between the second component supply unit 16B and the substrate S, and thus the component suction / mounting operation can be continued.

以上詳述したように、本実施形態によれば、ノズル交換を行なう際、吸着ノズルをノズル交換部に一致させるためにY方向へ移動させる必要が無くなることから、一方の吸着ヘッドを該当するノズル交換部へ移動させてノズル交換の作業を行なっている間でも、他方の吸着ヘッドでは電子部品の吸着・実装動作を継続可能であるため、生産効率を向上させることが可能となる。   As described above in detail, according to the present embodiment, when the nozzle is replaced, it is not necessary to move the suction nozzle in the Y direction in order to match the suction nozzle with the nozzle replacement portion. Even while moving to the replacement part and performing the nozzle replacement work, the other suction head can continue the suction / mounting operation of the electronic component, so that the production efficiency can be improved.

図2は、本発明に係る第2実施形態の表面実装装置の概要を示す平面図である。   FIG. 2 is a plan view showing an outline of the surface mounting apparatus according to the second embodiment of the present invention.

本実施形態の表面実装装置は、前記図1に示した第1実施形態の表面実装装置と実質的に同一の装置構成を、基板搬送部24A、24Bの中心を通るX軸に関してY方向に対称に配置する構成としたものである。   The surface mounting apparatus of the present embodiment is substantially the same as the surface mounting apparatus of the first embodiment shown in FIG. 1, and is symmetric in the Y direction with respect to the X axis passing through the centers of the substrate transfer units 24A and 24B. It is set as the structure arrange | positioned.

従って、本実施形態では、基板Sを支持する基板ステージ12が2つ図示されているように、部品の実装領域が2箇所に設けられており、従って2倍の生産効率で部品の実装を行なうことが可能になっている。   Therefore, in the present embodiment, as shown in the figure, two substrate stages 12 that support the substrate S are provided with two component mounting regions, and therefore the components are mounted with twice the production efficiency. It is possible.

本実施形態によれば、いずれの実装領域においても、一方の吸着ヘッドについてノズル交換を行っている間、他方の吸着ヘッドにより基板Sに部品を吸着・実装する動作を継続することが可能となる。   According to the present embodiment, in any mounting region, it is possible to continue the operation of sucking and mounting components on the substrate S by the other suction head while the nozzle replacement is performed for one suction head. .

なお、前記実施形態では、第1、第2吸着ヘッド18A、18BをY方向位置決めガイド22によりY方向に移動できる例を示したが、本発明の表面実装装置は、必ずしも吸着ヘッドをY方向に移動させる必要がないので、Y方向位置決めガイド22が無い、即ちX方向位置決めガイド20が図示されている位置に固定されているものであってもよい。   In the above-described embodiment, the example in which the first and second suction heads 18A and 18B can be moved in the Y direction by the Y-direction positioning guide 22 is shown. However, the surface mounting apparatus of the present invention does not necessarily move the suction head in the Y direction. Since there is no need to move, the Y-direction positioning guide 22 may not be provided, that is, the X-direction positioning guide 20 may be fixed at the illustrated position.

又、前記第2実施形態では、第1、第2吸着ヘッド18A、18Bが支持されているX方向位置決めガイド20が2つ設置されている例を示したが、これに限定されず、1つのガイド20により2つの基板に交互に実装する構成にしてもよい。   In the second embodiment, an example in which two X-direction positioning guides 20 on which the first and second suction heads 18A and 18B are supported is provided. However, the present invention is not limited to this. The guide 20 may be alternately mounted on two substrates.

本発明に係る第1実施形態の表面実装装置を示す概略平面図1 is a schematic plan view showing a surface mounting apparatus according to a first embodiment of the present invention. 本発明に係る第2実施形態の表面実装装置を示す概略平面図Schematic plan view showing a surface mounting apparatus according to a second embodiment of the present invention. 従来の表面実装装置の特徴を示す概略平面図Schematic plan view showing features of conventional surface mount equipment

符号の説明Explanation of symbols

S…基板
10…表面実装装置
12…基板ステージ
14…基板位置決め部
16…部品供給部
18…吸着ヘッド
20…X方向位置決めガイド
22…Y方向位置決めガイド
24…基板搬送部
26…ベース
30…ノズル交換部
32…ガイドレール
34…ボールねじ
36…サーボモータ
S ... Substrate 10 ... Surface mount device 12 ... Substrate stage 14 ... Substrate positioning unit 16 ... Component supply unit 18 ... Suction head 20 ... X direction positioning guide 22 ... Y direction positioning guide 24 ... Substrate transport unit 26 ... Base 30 ... Nozzle replacement Part 32 ... Guide rail 34 ... Ball screw 36 ... Servo motor

Claims (3)

基板をX方向に搬送し、実装領域で該基板に部品を実装した後、実装後の基板を次工程へ搬送する表面実装装置において、
部品を実装するための基板を支持する基板ステージと、
該基板ステージを水平面でX方向と直交するY方向に進退移動させ、支持されている基板を前記実装領域において位置決めする基板位置決め手段と、
前記実装領域のX方向両側にそれぞれ配設された第1及び第2部品供給手段と、
第1及び第2部品供給手段からそれぞれ部品を吸着し、前記実装領域において基板ステージに支持されている基板に実装する第1及び第2吸着ヘッドと、
第1及び第2吸着ヘッドを、それぞれ独立にX方向に進退移動させ、位置決めする同一のX方向位置決めガイドとを備えていると共に、
前記実装領域と前記第1及び第2部品供給手段との間に、前記基板ステージとは独立にそれぞれ配設された第1及び第2ノズル交換部と、
第1及び第2ノズル交換部をそれぞれY方向に個別に進退移動させ、位置決めする、前記基板位置決め手段とは異なるノズル交換部位置決め手段を備えたことを特徴とする表面実装装置。
In a surface mounting apparatus that transports a board in the X direction, mounts components on the board in the mounting area, and then transports the mounted board to the next process.
A substrate stage for supporting a substrate for mounting components;
Substrate stage is moved back and forth in the Y direction perpendicular to the X direction in a horizontal plane, and the substrate positioning means for positioning the substrate supported in the mounting region,
First and second component supply means respectively disposed on both sides in the X direction of the mounting region;
First and second suction heads for sucking components from the first and second component supply means and mounting them on the substrate supported by the substrate stage in the mounting region;
The first and second suction heads are each provided with the same X-direction positioning guide for independently moving forward and backward in the X direction and positioning,
A first and a second nozzle replacement unit disposed independently of the substrate stage between the mounting area and the first and second component supply units;
A surface mounting apparatus comprising a nozzle replacement part positioning means different from the substrate positioning means for individually moving the first and second nozzle replacement parts forward and backward in the Y direction and positioning them.
前記第1及び第2部品供給手段に沿ったX方向には、基板を上流側から下流側に搬送する基板搬送部が配設されていると共に、
前記基板搬送部中心を通るX軸に関して、前記基板ステージ、基板位置決め手段、第1及び第2部品供給手段、第1及び第2吸着ヘッド、X方向位置決めガイド、第1及び第2ノズル交換部、並びに、ノズル交換部位置決め手段が実質的にY方向に対称な配置になっていることを特徴とする請求項1に記載の表面実装装置。
In the X direction along the first and second component supply means, a substrate transport unit for transporting the substrate from the upstream side to the downstream side is disposed,
With respect to the X-axis passing through the center of the substrate transport unit, the substrate stage , substrate positioning means, first and second component supply means, first and second suction heads, X direction positioning guides, first and second nozzle replacement units and, a surface mounting apparatus according to claim 1, characterized in that the nozzle changing portion positioning the hand stage is in substantially symmetrical arrangement in the Y direction.
前記X方向位置決めガイドをY方向に進退移動させ、前記第1及び第2吸着ヘッドを同方向に位置決めするY方向位置決めガイドを備えていることを特徴とする請求項1又は2に記載の表面実装装置。   3. The surface mounting according to claim 1, further comprising a Y-direction positioning guide that moves the X-direction positioning guide forward and backward in the Y direction and positions the first and second suction heads in the same direction. apparatus.
JP2004260089A 2004-09-07 2004-09-07 Surface mount equipment Expired - Fee Related JP4494910B2 (en)

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KR20120111921A (en) * 2010-01-19 2012-10-11 파나소닉 주식회사 Component mounting method and component mounting device
JP6348687B2 (en) * 2013-05-30 2018-06-27 株式会社Fuji Nozzle container
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