JP2002353692A - Electronic component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate and reduce loss due to collapsed coordination between two beams. SOLUTION: Total time of required duration of a beam occupying an mount area is calculated for each of beams 10A and 10B. When MA is determined as the mount area occupation duration total of the beam 10A, and MB as the mount area occupation duration total of the beam 10B, the ratio of them is set to RATIO = MA/MB. An appropriate position may be established by calculating such a position that a position (y) of a printed board viewed from the beams 10A and 10B is in the opposite relationship with the ratio of the mount area occupation duration of the respective beams. While the position of a positioning part 5 is set in such a manner, a supply conveyor 4 that receives a printed board P from an upstream-side device 7 is moved in Y direction along a guide 4B provided between a pair of fixing parts 4A, in a manner that a pair of chutes 4C may be communicated with a chute 5C of the positioning part 5 by a driving motor 4E through a driving circuit 4D, and it delivers the printed board P to the board positioning part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pair of beams movable in one direction by a driving source, provided with mounting heads respectively movable by a driving source in a direction along the pair of beams, and the mounting head sucking electronic components. The present invention relates to an electronic component mounting apparatus provided with a suction nozzle to be mounted on a printed circuit board.

[0002]

2. Description of the Related Art Japanese Patent Laying-Open No. 2000-136904 discloses a multifunctional electronic component mounting apparatus, that is, an electronic component mounting apparatus having a pair of beams. In such a mounting apparatus, in order to operate the apparatus efficiently, the number of component mounting points (types / points) processed by each facing beam
The point is to distribute the beam as evenly as possible for each beam, and to establish a balanced two-beam cooperative operation.

[0003]

However, since the components are mounted on the printed circuit board positioned between the front and rear beams, the beams that inevitably face each other are broken in coordination due to mounting batting. Non-operation time during which mounting is waited due to positional interference with the partner beam) occurs, which often affects the length of the substrate finishing time.
Optimal component placement (allocation) to increase throughput
The decision is the point. If it is a low-mix high-volume production type, it is better to make the best parts arrangement even if it takes time, but in the case of a high-mix low-volume production form, the parts arrangement is changed every time the model is changed and two beams are allocated. In many cases, the setup work itself, such as optimizing the production, results in a loss time as a whole and affects production.

Accordingly, the present invention has been made in view of the above points,
It is an object of the present invention to correct and reduce a loss due to a loss of coordination between two beams. In other words, if the component allocation between the two beams cannot be equalized and there is a bias, the coordination balance can be adjusted by moving the board positioning position to the beam with the higher component throughput in advance. It will be realized.

[0005]

Means for Solving the Problems For this reason, the first invention provides
A pair of beams that can be moved in one direction by a drive source are provided with mounting heads that are respectively movable by a drive source in a direction along the pair of beams, and a suction nozzle that suctions electronic components to the mounting head and mounts them on a printed circuit board is provided. In the provided electronic component mounting apparatus, a positioning section for positioning and fixing the printed circuit board in a mounting area for each type of the printed circuit board based on the mounting data, and the positioning section after inheriting the printed circuit board from an upstream apparatus. The supply conveyor for connecting to the chute of the positioning section and passing it to the positioning section by sliding and moving the printed circuit board in the one direction corresponding to the above, and the printed board is delivered from the positioning section. The printed circuit board is moved in the one direction by sliding in accordance with the chute of the rear downstream side device, whereby the downstream side is moved. Is connected to the chute of the apparatus is characterized by providing a discharge conveyor for passing the downstream side device.

According to a second aspect of the present invention, in the electronic component mounting apparatus, a positioning section for positioning and fixing the printed circuit board at a position preliminarily deviated from the beam having a longer total occupation time of the mounting area, and After the handover, the printed board is moved in the one direction so as to be connected to the chute of the positioning section and transferred to the positioning section, and the printed board is transferred to the positioning section after being transferred from the positioning section. A discharge conveyor connected to a chute of the downstream device by being moved in the direction and transferred to the downstream device.

According to a third aspect of the present invention, in the electronic component mounting apparatus, a positioning section for positioning and fixing the printed circuit board at a position which is pre-biased to the beam having a larger number of mounting points of the electronic component on the printed circuit board; A supply conveyor for transferring the printed circuit board in the one direction after being inherited from the side device so as to be connected to the chute of the positioning section and transferring the printed circuit board to the positioning section, and the printed circuit board after being transferred from the positioning section. And a discharge conveyer that is connected to a chute of the downstream device by moving the device in the one direction, and is delivered to the downstream device.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus, a positioning section for positioning and fixing the printed circuit board at a position preliminarily biased to the beam having a larger number of reciprocations to a mounting area, and inheriting the position from an upstream apparatus. Then, by moving the printed circuit board in the one direction, the supply conveyor is connected to the chute of the positioning section and passed to the positioning section, and the printed circuit board is transferred from the positioning section to the one direction. And a discharge conveyor connected to the chute of the downstream device and transferred to the downstream device.

According to a fifth aspect of the present invention, in the electronic component mounting apparatus, the positioning head is provided between the one chute and the other chute in a mounting area where the mounting head mounts an electronic component on a printed circuit board. The distance between the position of one chute when the printed circuit board is positioned and the opening limit position of this one chute is y, and the opening limit position of the one chute and the component suction position of the mounting head of one of the beams. Is defined as A_const, the interval between the opening limit position of the other chute and the component suction position of the other beam mounting head is defined as B_const, and the width of the printed circuit board conveyed by the one and other chutes is PCB_Y. The distance between the opening limit position of the one chute and the opening limit position of the other chute is L, Mounting area occupation period accumulation of one mounting head determined in advance based on the data, the number of reciprocations cumulative to the mounting area of the mounting points accumulated or one beam and MA,
The sum of the mounting area occupation time of the other mounting head, the total number of mounting points, or the total number of reciprocations to the mounting area of the other beam, which is obtained in advance based on the mounting data, is MA, and the interval y
Is

[0010]

(Equation 2) , And the position of the one or other shoot is determined based on the calculated interval y.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and various electronic components are mounted on a base 2 of the apparatus 1. A plurality of component supply units 3 are provided side by side to supply the components one by one to the component pick-up portion (component suction position). A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing units 3 groups. The supply conveyor 4 transfers the printed circuit board P received from the upstream device 7 to the positioning unit 5.
After the electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) by the positioning unit 5, the electronic components are transferred to the discharge conveyor 6.

The positioning section 5 is for positioning and fixing the printed circuit board P at a position which is preliminarily deviated to a beam 10A or 10B, which will be described later, which has a larger processing amount of electronic components on the printed circuit board P. A pair of chutes 5C along both guides 5B provided between the fixing portions 5A
Can be independently moved in the Y direction according to the size of the printed circuit board P by each drive motor 5E via each drive circuit 5D.

The supply conveyor 4 transfers the printed board P to the board positioning unit 5 by moving the printed board P in the Y direction each time the printed board P is received from the chute of the upstream device 7. After being inherited from the upstream device 7, the pair of chutes 4C are independently driven by the respective driving motors 4E via the respective driving circuits 4D along the guides 4B provided between the pair of fixing portions 4A. Then, it moves in the Y direction so as to be connected to the chute 5C, and is transferred to the substrate positioning section 5.

The discharge conveyor 6 moves the printed circuit board P delivered from the positioning unit 5 in the Y direction each time the mounting of the electronic component based on the mounting data is completed by the positioning unit 5 so that the downstream side device can be used. 8, after the printed circuit board P is inherited from the positioning portion 5, the pair of chutes 6C are moved through the respective driving circuits 6D along the guides 6B provided between the pair of fixing portions 6A. Each of them is independently moved by the drive motor 6E in the Y direction so as to be connected to the chute of the downstream device 8 and delivered to the downstream device 8.

Although two drive motors are provided for the supply conveyor 4, the positioning section 5 and the discharge conveyor 6, each chute can be moved by providing one and providing a clutch. Good.

Numerals 10A and 10B denote a pair of beams long in the X direction, each of which rotates a screw shaft (not shown) by driving a Y-axis motor 21 via a driving circuit 20, and moves along a pair of left and right guides 11 It individually moves in the Y direction above the printed circuit board P fixed to the positioning unit 5 and the component take-out unit (component suction position) of the component supply unit 3.

Each of the beams 10A and 10B is provided with an X-axis motor 23 through a drive circuit 22 in the longitudinal direction, that is, in the X direction.
Mounting head 1 that moves along a guide (not shown)
2A and 12B are provided respectively. Each mounting head 12
A or 12B is provided with a vertical motor 24 for vertically moving each of the two suction nozzles 13 and a θ-axis motor 25 for rotating the suction nozzle 13 about a vertical axis. Therefore, the two mounting heads 12A, 12B
Are movable in the X and Y directions, are rotatable around a vertical line, and are movable up and down.

Numeral 14 denotes a component recognition camera for component position recognition. Two component recognition cameras are provided corresponding to the mounting heads 12A and 12B. The electronic component is imaged in order to recognize the position in the XY direction and the rotation angle. 1
Reference numerals 5 and 15 denote nozzle stockers for storing various suction nozzles 13, which are stored for replacement of the suction nozzles 13.

Each of the mounting heads 12A and 12B is provided with a board recognition camera 17 for picking up an image of the mark on the printed circuit board P in order to recognize the position of the mark.

Then, the cables and air tubes for the mounting heads 12A and 12 are arranged in a side-by-side state, and each is fixed with an adhesive to form a substantially flat plate-like flat cable 16.
One end is connected to each of the motors and the like, and the other end is connected to a control circuit board (not shown) or an air supply source (not shown).

Next, the control block diagram of FIG. 5 will be described. Based on the data stored in the RAM 31, the CPU 30 comprehensively controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 in accordance with the program stored in the ROM 32. That is, the CPU 30 drives the X-axis motor 23 via the drive circuit 22 and drives the Y-axis motor 23 via the drive circuit 20.
The drive of the shaft motor 21 is controlled via a drive circuit 26, the drive of the θ-axis motor 25 is controlled, and the drive of the vertical motor 24 of the suction nozzle 13 is controlled via a drive circuit 27.

Reference numeral 35 denotes a component recognition processing unit connected to the CPU 30 through an interface 33. The recognition processing unit 35 performs recognition processing of an image captured and captured by the component recognition camera 14. The processing result is sent to the CPU 30. That is, the CPU 30 uses the component recognition camera 1
In this case, an instruction is output to the component recognition processing unit 35 to perform recognition processing (calculation of the amount of positional deviation, etc.) on the image captured in No. 4, and the result of the recognition processing is received from the recognition processing unit 35.

Reference numeral 34 denotes a board recognition processing unit, which performs a recognition process on an image captured and taken by the board recognition camera 17, and sends a processing result to the CPU 30. That is, the CPU 30 controls the board recognition camera 1
7, an instruction is output to the board recognition processing unit 34 to perform recognition processing (such as calculation of the amount of displacement) on the image captured by the image processing unit 7, and the result of the recognition processing is received from the board recognition processing unit 34.

That is, when the displacement amount is grasped by the recognition processing of the component recognition processing unit 35 and the board recognition processing unit 34, the result is sent to the CPU 30, and the CPU 30 sends the Y-axis motor 21 and the X-axis motor 23 And the θ-axis motor 25 is driven to correct the rotational angle position in the X and Y directions and around the vertical axis.

Here, the determination of the optimum position of the printed circuit board P in the Y direction by the above configuration will be described.
First, the basic operation of the beams 10A and 10B is as follows.
There are many multi-suction types that collectively process multiple components in a single reciprocating operation so that the number of reciprocating operations of beam suction and mounting is not too large for component recognition and component mounting. Regarding the head and the multi-mounting head, what is focused on and the position of the printed circuit board P in the Y direction is determined will be described.

According to the production model data (mounting data) for each printed circuit board P, a component mounting sequence that is allocated to the two beams 10A and 10B and executed is simulated by individual beams, and an area (mounting) shared by the two beams Calculate the total work time in the area).

That is, the simulation is performed in the following manner, and will be described with reference to the schematic diagram shown in FIG. The position of the printed circuit board P in the Y direction is the Y position of the printed circuit board P.
The center in the direction is regarded as the center of the L dimension of the opening limit of both chutes 5C (the position of L / 2 when viewed from the upper chute opening limit), and the control command calculation value of each axis such as X axis and Y axis of beams 10A and 10B. (Speed / acceleration), the component suction position of the component supply unit 3, and the mounting coordinate position.

Here, for each of the beams 10A and 10B, one operation pattern has the following flow, and this operation is repeated until all of the component mountings assigned to the user are completed. An operation example of one beam mounting five points in three reciprocations is shown below. In the first reciprocation (two points mounted), suction movement → suction →
Suction movement → Suction → Recognition of both parts → Mounting movement → Mounting → Mounting movement → Mounting. The second reciprocation (two-point mounting) requires suction movement →
Suction → Suction movement → Suction → Recognition of both parts → Mounting movement → Mounting →
Mounting movement → mounting, the third reciprocation (single point mounting), nozzle replacement → suction movement → suction → component recognition → mounting movement → mounting →
Nozzle replacement → move to origin.

In this sequence flow, the total time required for the beams indicated by "mounting movement" and "mounting" to occupy the mounting area is calculated for each of the beams 10A and 10B. MA is the total mounting area occupation time of the beam 10A, MB is the total mounting area occupation time of the beam 10B, and the ratio is RATIO = MA / MB. The position where the printed circuit board position: y viewed from the beams 10A and 10B has the opposite positional relationship to the mounting area occupation time ratio of each beam may be calculated and set as the optimum position. That is, FIG.
When the expression is made using the respective intervals and dimensions shown in FIG.

[0030]

(Equation 3)

[0031]

(Equation 4) Here, the RATIO is determined based on the total mounting area occupation time of the beams 10A and 10B. However, the mounting heads 12A and 12B of the beams 10A and 10B are simply determined.
B, the number of mounting points, or beams 10A, 10A
It may be calculated as a ratio of the number of reciprocations to the mounting area B. That is, the substrate position is preliminarily deviated to the beam on the side with a high ratio of the number of mounting points, or the substrate position is preliminarily deviated to the beam on the side with a high reciprocation frequency ratio. Further, the calculation and the storage of the calculation result may be performed manually or automatically (under the control of the CPU 30) by a program stored in the ROM 32.

The distance y is calculated based on the above formula 1, and the position of the one or other shoot is determined by the calculated distance y. Appropriate for each type.

As described above, conventionally, the printed circuit board P is deviated toward the fixed chute side of the chute, and is closer to the beam 10A, but farther from the beam 10B. The coordination is lost due to the difference, and a loss such as a waiting for mounting occurs, and as a result, a factor of lengthening the board finishing time has been changed. However, the concept of the fixed chute has been changed. Finishing the printed circuit board by deliberately shifting the board position so that even if the suction / loading strokes are equalized and the components of the beams 10A and 10B cannot be evenly distributed, the balance can be corrected. The time can be reduced and improved.

As described above, the positioning position of the printed circuit board P in the Y direction is determined according to the type of the printed circuit board P, that is, the mounting data stored in the RAM 31 and the component supply stored in the RAM 31 are also determined. Suction line position in unit 3 group, RAM 31
Opening limit of each chute 5C stored in
The position of the printed circuit board P in the Y direction is calculated by the positioning unit 5 based on the size of the printed circuit board in the Y direction stored in M31, and the calculation result is represented by R
Store it in AM31. Then, based on the calculation result stored in the RAM 31, the CPU 30 controls the drive motor 5E of the positioning unit 5 to move each chute 5C according to the type of the printed circuit board P to be produced.

That is, the position in the Y direction at which the substrate is positioned is determined and set up in advance at the time of model changeover. Therefore, the printed circuit board P is not moved after the positioning by the positioning section 5 is completed. The reason is that the absolute value accuracy at the time of correction mounting is assured by not changing the board position captured by the board recognition, and the printed board P is not moved so as not to apply stress to the mounted components.

Then, as shown in FIG. 3 and FIG. 4, with the position of the positioning portion 5 determined as described above, the supply conveyor 4 which has inherited the printed circuit board P from the upstream device 7
Moves a pair of chutes 4C in a Y direction along a guide 4B provided between a pair of fixed portions 4A by a drive motor 4E via a drive circuit 4D so as to be connected to the chutes 5C of the positioning portion 5; It is passed to the substrate positioning unit 5. In the board positioning section 5, the printed board P is positioned and fixed by a positioning mechanism (not shown).

The XY coordinate position of the printed circuit board P to be mounted, the rotation angle position around the vertical axis, the arrangement number of each component supply unit 3 and the like stored in the RAM 31 are specified according to the specified mounting data. The electronic component to be mounted by the suction nozzle corresponding to the component type is sucked out from the predetermined component supply unit 3 and taken out.

Next, the suction nozzle 13 of the mounting head 12A
Moves so as to be located above the component supply unit 3 that stores the electronic components to be mounted. In the Y direction, the Y-axis motor 21 is driven by the drive circuit 20, and the beam 10A moves along the pair of guides 11, In the X direction, the X-axis motor 23 is driven by the drive circuit 22 to move the mounting head 12A,
Since the predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the drive circuit 27 drives the vertical motor 24 to lower the suction nozzle 13 to suck and take out the electronic components. And then the mounting head 12A
Rises and the suction nozzle 13 moves above the component supply unit 3 for storing the next electronic component to be mounted, and the nozzle 13 also lowers to suck and take out the electronic component.

At this time, the suction nozzle 13 of the mounting head 12B moves above the component supply unit 3 for storing the electronic component to be mounted, and the nozzle 13 descends to suck and take out the electronic component. Rises and the suction nozzle 13 moves above the component supply unit 3 for storing the next electronic component to be mounted.
Descends to suck and take out the electronic components.

Then, as described above, the suction nozzles 13 of the mounting head 12A are moved by the Y-axis motor 21 and the X-axis motor 23 so as to be positioned above the component recognition cameras 14, and are suctioned by the nozzles 13. Each electronic component is imaged, and each suction nozzle 13 of the mounting head 12B moves so as to be positioned above the component recognition camera 14, and each electronic component sucked by each nozzle 13 is imaged, and each electronic component is imaged. The recognition result is calculated by the component recognition processing unit 35 with respect to the XY directions and the rotation angle of how much the nozzle is misaligned with respect to the nozzle and held.

Then, the CPU 30 determines whether or not the mounting area is unused, and since it is not used, the beam 10A acquires the mounting area. More specifically, the CPU 30
To the effect that the beam 10A occupies the mounting area,
In order to perform the board recognition operation for the beam 10A that has occupied the mounting area, the beam 10A and the mounting head 12A are moved to recognize each mark by the board recognition camera 17 in order to recognize the position of the mark on the printed circuit board P. An image is picked up and the recognition process is performed by the board recognition processing unit 34, stored in the RAM 31, the beam 10A and the mounting head 12A are moved again, and the suction nozzles 13 recognize components on the printed board P based on the board recognition result. Each electronic component is mounted while compensating for the positional deviation in consideration of the result, the next step is cut out by stepping through the sequence data, and since the next step data exists, the mounting area is opened (the unused state is set). ).

Next, after the mounting area is opened by the beam 10A, the beam 10B occupies the mounting area. Therefore,
In order to recognize the position of the mark on the printed circuit board P by moving the beam 10B and the mounting head 12B in order to perform the board recognition operation for the beam 10B that has occupied the mounting area, the board recognition camera 17 The image is picked up, the recognition processing is performed by the board recognition processing section 34, and the result is stored in the RAM 31. Each suction nozzle 13 corrects the position shift on the printed board P by adding the board recognition result to the component recognition result. While mounting each electronic component, the next step is cut out by stepping through the sequence data, and since there is next step data, the mounting area is opened (the unused state is set).

As described above, the components are sequentially mounted on the printed circuit board P in accordance with the mounting data stored in the RAM 31. Before all the components have been mounted, as shown in FIG. Since the chute 6C is connected to the chute 5C of the positioning unit 5, the printed circuit board P is conveyed from the positioning unit 5 to the discharge conveyor 6 after the mounting is completed and is inherited. Then, the printed circuit board P delivered from the positioning unit 5 is
After being inherited, the pair of chutes 6C are moved along the guides 6B provided between the pair of fixing portions 6A.
Each of the drive motors 6 </ b> E moves in the Y direction via D to be connected to the downstream device 8, and is transferred to the downstream device 8.

Although the embodiments of the present invention have been described above, various alternatives, modifications or variations are possible for those skilled in the art based on the above description, and the present invention is not limited to the above-described various embodiments without departing from the spirit thereof. It is intended to cover alternatives, modifications or variations.

[0045]

As described above, according to the present invention, it is possible to correct and reduce a loss caused by a loss of coordination between two beams.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus showing a state in which a large printed circuit board is passed from a supply conveyor to a positioning unit.

FIG. 2 is a sectional view taken along line BB of FIG.

FIG. 3 is a plan view of the electronic component mounting apparatus showing a state in which a small printed circuit board is transferred from an upstream apparatus to a supply conveyor.

FIG. 4 is a plan view of the electronic component mounting apparatus showing a state where a small printed circuit board is passed from a supply conveyor to a positioning unit.

FIG. 5 is a control block diagram of the electronic component mounting apparatus.

FIG. 6 is a schematic view of an electronic component mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 4 Supply conveyor 5 Positioning part 6 Discharge conveyor 10A, B beam 12A, B mounting head 13 Suction nozzle 30 CPU 31 RAM

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Shuji Motoyama 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Shigeru Kageyama 2-chome Keihanhondori, Moriguchi-shi, Osaka No.5-5 Sanyo Electric Co., Ltd. F term (reference) 5E313 AA11 CC03 DD12 DD15 EE02 EE03 EE24 FF11

Claims (5)

[Claims] 1. A pair of beams movable in one direction by a driving source are provided with mounting heads respectively movable by a driving source in a direction along the pair of beams, and the mounting head sucks an electronic component onto a printed circuit board. In an electronic component mounting apparatus provided with a suction nozzle to be mounted, a positioning section for positioning and fixing the printed circuit board for each type of the printed circuit board in a mounting area based on mounting data, and inheriting the printed circuit board from an upstream apparatus. Then, a supply conveyor for connecting to the chute of the positioning unit and passing the printed circuit board to the positioning unit by sliding the printed circuit board in the one direction by sliding in accordance with the positioning unit, and After being transferred from the device, the printed circuit board is moved in the one direction by sliding in accordance with the chute of the downstream device. And a discharge conveyer connected to a chute of the downstream device and delivered to the downstream device. 2. A pair of beams which can be moved in one direction by a drive source are provided with mounting heads which can be respectively moved by a drive source in a direction along the pair of beams. In an electronic component mounting apparatus provided with a suction nozzle to be mounted, a positioning unit for positioning and fixing the printed circuit board at a position preliminarily deviated from the beam having a longer total occupation time of the mounting area, and an inherited signal from an upstream device. Then, by moving the printed circuit board in the one direction, a supply conveyor for connecting to the chute of the positioning section and passing the printed board to the positioning section, and moving the printed circuit board in the one direction after being delivered from the positioning section. A discharge conveyor connected to the chute of the downstream device by moving the discharge device and transferring the chute to the downstream device. Electronic component mounting device. 3. A pair of beams that can be moved in one direction by a drive source are provided with mounting heads that are respectively movable by a drive source in a direction along the pair of beams, and the mounting head sucks an electronic component onto a printed circuit board. An electronic component mounting apparatus provided with a suction nozzle to be mounted, a positioning unit for positioning and fixing the printed circuit board at a position preliminarily deviated to the beam having a larger number of mounting points of the electronic component on the printed circuit board; A supply conveyor for connecting the chute of the positioning unit to the positioning unit by moving the printed circuit board in the one direction after inheriting, and passing the chute to the positioning unit,
After the printed board is transferred from the positioning section, the printed board is moved in the one direction so as to be connected to a chute of the downstream device and provided with a discharge conveyor for transferring to the downstream device. Electronic component mounting device. 4. A pair of beams movable in one direction by a driving source are provided with mounting heads respectively movable in a direction along the pair of beams by a driving source. In an electronic component mounting apparatus provided with a suction nozzle to be mounted, a positioning section for positioning and fixing the printed circuit board at a position preliminarily deviated to the beam having a larger number of reciprocations to a mounting area, and after inheriting from an upstream apparatus. By moving the printed circuit board in the one direction, a supply conveyer is connected to the chute of the positioning section and passed to the positioning section, and the printed circuit board is moved in the one direction after being delivered from the positioning section. A discharge conveyor connected to the chute of the downstream device by transferring the discharge device to the downstream device. Component mounting device. 5. The electronic component mounting device according to claim 2, wherein one of the chutes and the other of the positioning portion is provided in a mounting area where the electronic component is mounted on a printed circuit board by each of the mounting heads. The distance between the position of one of the chutes when the printed circuit board is positioned between the two chutes and the opening limit of the one chute is defined as y, and the opening limit of the one chute and one of the beams A_const is the distance between the mounting head and the component suction position.
B_const is the distance between the opening limit position of the other chute and the component suction position of the other beam mounting head.
The width of the printed board conveyed by the one and the other chutes is PCB_Y, the interval between the opening limit position of the one chute and the opening limit position of the other chute is L, and based on the mounting data MA is the sum of the mounting area occupation time of one mounting head, the total number of mounting points, or the total number of reciprocations of one beam to the mounting area determined in advance, and the mounting area occupancy time of the other mounting head obtained in advance based on the mounting data. MA is the total, the total number of mounting points, or the total number of reciprocations to the mounting area of the other beam, and the interval y is The electronic component mounting apparatus is characterized in that the position of the one or the other chute is determined based on the calculated interval y.