JP7329727B2 - Component mounting device, three-dimensional shape measuring device, and three-dimensional shape measuring method - Google Patents

Description

The present invention relates to a component mounting apparatus that measures the three-dimensional shape of a component and mounts it on a board, a three-dimensional shape measuring device that measures the three-dimensional shape of the component, and a three-dimensional shape measuring method.

As a method for measuring the height of a component mounted on a board, a method using two cameras (stereo cameras) arranged side by side is known. In Patent Document 1, a mounting board on which a component is mounted is imaged from above by a pair of CCD cameras, and the positional deviation amount (parallax) of the same component in the images captured by the two CCD cameras is used to identify the component. is calculated and compared with the reference height to determine whether the mounting board is good or bad.

JP-A-5-198999

By the way, in order to reduce the number of repair man-hours caused by defective mounting, the three-dimensional shape of the component is measured immediately before mounting the component on the board, and only the component whose amount of warpage satisfies a predetermined standard is mounted on the board. is desirable. However, in the prior art including Patent Document 1, although it is possible to measure relatively large areas such as the top and bottom surfaces of components, it is possible to measure the edge of the side wall of an elongated shield case and the height of the corner of a notched component. There was a problem that the measurement was difficult.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a component mounting apparatus, a three-dimensional shape measuring apparatus, and a three-dimensional shape measuring method capable of measuring a three-dimensional shape of a component having edges.

A component mounting apparatus according to the present invention comprises: virtual intersection setting means for setting a position where two of a plurality of edges of a component intersect as a virtual intersection; height measurement means for measuring the height of the virtual intersection; warp amount calculation means for calculating the warp amount of the component based on the height of the virtual intersection point ; The height measuring means includes two imaging units arranged side by side, positions of two edges forming the virtual intersection from images captured by the two imaging units, and at least one of the two edges. a virtual intersection height calculator that recognizes the height of the edge and calculates the height of the virtual intersection from the recognized positions of the two edges and the height of at least one of the edges.

A three-dimensional shape measuring apparatus according to the present invention includes: virtual intersection setting means for setting a position where two of a plurality of edges of a workpiece intersect as a virtual intersection; height measurement means for measuring the height of the virtual intersection; a shape calculation unit that calculates a three-dimensional shape of the workpiece based on the height of the virtual intersection point that has been calculated, and the height measurement means includes two imaging units arranged in parallel and the two imaging units. recognizing the positions of the two edges forming the virtual intersection and the height of at least one of the two edges from the captured image captured by the unit, and recognizing the recognized positions of the two edges and the at least one edge and a virtual intersection height calculator that calculates the height of the virtual intersection from the height of the virtual intersection .

A three-dimensional shape measuring method of the present invention is a three-dimensional shape measuring method for measuring a three-dimensional shape of a work, wherein a position where two of a plurality of edges of a work intersect is set as a virtual intersection, and two machines are arranged side by side. and recognizes the positions of the two edges forming the virtual intersection and the height of at least one of the two edges from the images captured by the two imaging units. and measuring the height of the virtual intersection from the recognized positions of the two edges and the height of at least one of the edges, and calculating the three-dimensional shape of the workpiece based on the measured height of the virtual intersection.

According to the present invention, it is possible to measure the three-dimensional shape of a part having edges.

1 is a plan view showing the configuration of a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is an explanatory diagram of the configuration of a component recognition unit provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 2A is a perspective view before mounting a shield case on a mounting board manufactured by a component mounting apparatus according to an embodiment of the present invention, and FIG. 1B is a perspective view after mounting a shield case. (a) (b) Explanatory drawing of an example of a virtual intersection set in a shield case mounted on a board by a component mounting apparatus according to one embodiment of the present invention (c) Explanatory drawing of the amount of warpage of a shield case (a) (b) (c) Explanatory diagrams of examples of virtual intersections set in a shield case mounted on a substrate by the component mounting apparatus according to one embodiment of the present invention. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 2A is a diagram showing an example of an image captured by a first camera, and FIG. FIG. 1 is a flowchart of a three-dimensional shape measuring method according to one embodiment of the present invention; 1(a) plan view, (b) bottom view, and (c) side view of a land grid array mounted on a substrate by a component mounting apparatus according to one embodiment of the present invention. FIG.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, and the like described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting device, the three-dimensional shape measuring device, and the component (workpiece). In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, the two axial directions perpendicular to each other in the horizontal plane are the X direction of the substrate transfer direction (horizontal direction in FIG. 1) and the Y direction perpendicular to the substrate transfer direction (vertical direction in FIG. 1). is shown. In FIG. 2 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

First, the configuration of a component mounting apparatus 1 will be described with reference to FIGS. In FIG. 1, a substrate transfer mechanism 2 is installed in the X direction at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side in the X direction, and positions and holds it at a mounting work position by the mounting head described below. Further, the board transfer mechanism 2 carries out the board 3 on which the component mounting work is completed to the downstream side.

A component supply unit 4 is installed on each side of the board transfer mechanism 2 . A plurality of tape feeders 5 are mounted in parallel in the X direction on both component supply units 4 . The tape feeder 5 pitch-feeds the carrier tape in which pockets for storing the components D are formed in a direction (tape feed direction) from the outside of the component supply unit 4 toward the substrate transport mechanism 2, so that the mounting head picks up the components. The parts are supplied to the part picking position where the A tray feeder 7 for supplying a tray 6 holding the components D in an aligned manner to a component pick-up position is attached to one of the component supply units 4 .

In FIG. 1, a Y-axis table 8 having a linear drive mechanism is arranged at both ends in the X direction on the upper surface of the base 1a. A beam 9 similarly provided with a linear mechanism is coupled to the Y-axis table 8 so as to be movable in the Y direction. A mounting head 10 is attached to the beam 9 so as to be movable in the X direction.

In FIG. 2, the mounting head 10 includes a mounting unit 10a having a lifting and rotating mechanism. A holding nozzle 10b that holds the component D by vacuum suction is attached to the lower end of the mounting unit 10a. The mounting unit 10a raises and lowers the holding nozzle 10b by driving an elevation rotation drive mechanism. Further, the mounting unit 10a drives the up-and-down rotation driving mechanism to rotate the holding nozzle 10b by θ around the Z axis (arrow a). A plurality of types of holding nozzles 10b with different nozzle diameters and shapes are prepared according to the size and shape of the component D to be held. 10 is installed.

In FIG. 1, the Y-axis table 8 and the beam 9 constitute a moving mechanism for moving the mounting head 10 in horizontal directions (X direction and Y direction). The moving mechanism and the mounting head 10 pick up the component D supplied to the component pick-up position of the tape feeder 5 and the tray feeder 7 attached to the component supply unit 4 by the holding nozzle 10b, and the component D is held by the substrate transport mechanism 2. It is a component holding/moving mechanism 12 for transferring to the mounting position of the board 3 . In the component mounting operation, the component holding/moving mechanism 12 moves above the component supply section 4, picks up a predetermined component D with the holding nozzle 10b, moves above the substrate 3, and picks up the component D held by the holding nozzle 10b. Repeat a series of turns to put on the mounting position.

In FIG. 1, the beam 9 is equipped with a head camera 13 which is positioned below the beam 9 and moves together with the mounting head 10 . As the mounting head 10 moves, the head camera 13 moves above the board 3 positioned at the mounting work position of the board transport mechanism 2 and picks up a board mark (not shown) provided on the board 3. . A component recognition unit 14 and a component disposal unit 15 are installed between the component supply unit 4 and the substrate transport mechanism 2 .

The component recognition unit 14 takes an image of the component D held by the holding nozzle 10b from below when the mounting head 10 that has taken out the component D from the component supply section 4 is positioned above the component recognition unit 14 . In the operation of mounting the component D on the board 3 by the mounting head 10, the mounting position is corrected in consideration of the recognition result of the board 3 by the head camera 13 and the recognition result of the component D by the component recognition unit 14. FIG. Among the components D picked up from the component supply unit 4 by the mounting head 10 , the component disposal unit 15 discards the components D that do not satisfy predetermined conditions such as the amount of warpage of the components D.

In FIG. 1, a touch panel 16 operated by a worker is installed at a position where the worker works on the front surface of the component mounting apparatus 1 . The touch panel 16 displays various information on its display section, and the operator uses operation buttons displayed on the display section to input data and operate the component mounting apparatus 1 .

Next, with reference to FIG. 2, details of the component recognition unit 14 will be described. The component recognition unit 14 includes a first camera 17a and a second camera 17b arranged side by side in the X direction. The imaging axes of the first camera 17a and the second camera 17b are directed obliquely upward, and when the component D held by the component holding/moving mechanism 12 is above the component recognition unit 14, the component D is imaged at the same time. The first camera 17a and the second camera 17b (two imaging units) constitute a stereo camera that measures the height H from the upper surface 14a of the component recognition unit 14 from the parallax of the captured object.

In the example of FIG. 2, the first camera 17a and the second camera 17b measure the height H to the lower surface of the component D held by the holding nozzle 10b. A component holding/moving mechanism 12 (work holding/moving mechanism) holds a component D (work) and arranges the held component D in front of two imaging units (first camera 17a and second camera 17b). Move in the direction (X direction) in which the two imaging units are arranged (arrow b). The two imaging units capture images of the moving component D multiple times, and transmit the captured images to the control device 30 ( FIG. 6 ) provided in the component mounting apparatus 1 . In the example of FIG. 2, the two imaging units are arranged side by side in the direction in which the component D is moved (X direction). ) may be installed side by side.

In FIG. 2, the component recognition unit 14 has a first illumination section 18 above the first camera 17a and the second camera 17b. The first illumination unit 18 includes a light source such as an LED, and illuminates the component D obliquely from below while the first camera 17a and the second camera 17b are imaging the component D. As shown in FIG. The component recognition unit 14 also has a second illumination section 19 below between the first camera 17a and the second camera 17b. The second illumination unit 19 includes a light source such as an LED, and illuminates the component D from below while the first camera 17a and the second camera 17b are imaging the component D. As shown in FIG.

The control device 30 controls lighting conditions such as which of the first lighting unit 18 and the second lighting unit 19 should be lit, whether they should be lit at the same time, and at what illuminance.

Next, an example of a mounting substrate manufactured by the component mounting apparatus 1 will be described with reference to FIG. The substrate 3 is a printed circuit board in which conductor wiring (not shown) is formed on or inside an insulator base material, and electrodes (not shown) connected to the wiring are formed on the surface of the substrate 3. . Cream solder is deposited on the electrodes by a printing device or the like, and terminals of chip components D1 such as resistors and capacitors and integrated circuit components D2 are mounted on the substrate 3 so as to be connected to the electrodes via the cream solder. . A shield case 20 is mounted by the component mounting apparatus 1 on the integrated circuit component D2. The shield case 20 has a structure in which the integrated circuit component D2 is surrounded by a wall surface 20a made of thin metal, and has the function of shielding the electromagnetic noise generated from the integrated circuit component D2 from propagating to the surroundings. .

In the component mounting apparatus 1, the shield case 20 is supplied from the tape feeder 5 or the tray feeder 7 with the surface to be mounted on the board 3 facing downward, and is mounted on the board 3 while being held by the holding nozzle 10b. A portion of the shield case 20 is connected to a position fixing dummy electrode formed on the substrate 3 via cream solder. Predetermined chip components D1, integrated circuit components D2, shield case 20, etc. are mounted on substrate 3. Cream solder is melted by a reflow device and then hardened to form electrodes of substrate 3, chip components D1 and integrated circuit components D2. terminals and the shield case 20 are soldered to form a mounting board.

Next, an example of the shield case 21 will be described in detail with reference to FIGS. 4(a) and 4(b). When the shield case 21 is attached to the integrated circuit component D2 mounted on the substrate 3, it has four wall surfaces 22 to 25 positioned on four side surfaces of the integrated circuit component D2 for shielding. The shield case 21 is attached to the substrate 3 so that the bottom surfaces 22a-25a of the four wall surfaces 22-25 are in contact with the top surface of the substrate 3. As shown in FIG. The four bottom surfaces 22a to 25a are located on the four sides of the rectangle but do not extend to the positions of the four vertices of the rectangle, and have a shape with the vicinity of the vertices removed.

That is, neither the wall surface 22 nor the wall surface 23 exists at the imaginary intersection point P1 where the outer edge 22b of the bottom surface 22a and the outer edge 23b of the bottom surface 23a intersect. Similarly, a virtual intersection P2 where the outer edge 23b of the bottom surface 23a and the outer edge 24b of the bottom surface 24a intersect, a virtual intersection P3 where the outer edge 24b of the bottom surface 24a and the outer edge 25b of the bottom surface 25a intersect, and the outer edge of the bottom surface 25a The wall surfaces 22 to 25 do not exist at an imaginary intersection P4 where the edge 25b and the outer edge 22b of the bottom surface 22a intersect. In this way, positions where two of the plurality of edges 22b to 25b of the shield case 22 (parts) intersect are defined as imaginary intersections P1 to P4. These imaginary intersections P1 to P4 are located at positions where they come into contact with the substrate 3 when mounted on the substrate 3. As shown in FIG.

For the shield case 21 attached to the substrate 3, the warp of the shield case 21, which is the distortion of the four bottom surfaces 22a to 25a in contact with the upper surface of the substrate 3, must be less than a predetermined value in order to prevent mounting failure. 4(b) shows an ideal state in which the shield case 21 is not warped, and FIG. 4(c) shows a state in which the shield case 21 is warped and cannot be attached to the substrate 3. FIG. The warpage of the shield case 21 before being attached to the substrate 3 can be calculated from the relative height positions of the bottom surfaces 22a to 25a of the shield case 21 held by the holding nozzle 10b. However, if the bottom surface 23a of the shield case 21 shown in FIG. 4(c) is warped, it is difficult to define the height of the bottom surface 23a. Therefore, the amount of warpage is calculated from the heights of the four imaginary intersections P1 to P4 corresponding to the vertices of the rectangle.

4B, the height position of the lower surface 10c of the holding nozzle 10b that holds the shield case 21 is the height position of the upper surface 21a of the shield case 21. In FIG. The height positions of the imaginary intersection points P1 to P4 from the lower surface 10c of the holding nozzle 10b holding the shield case 21 can be calculated from the shape information of the shield case 21. FIG. The relative height positions of the four virtual intersections P1 to P4 of the ideal shield case 21 without warp from the lower surface 10c of the holding nozzle 10b (hereinafter referred to as “relative height positions G”) are position G.

The virtual intersection point P1 of the warped shield case 21 shown in FIG. position G1). The shield case 21 calculates warp amounts ΔG1 to ΔG4 of each of the virtual intersections P1 to P4 from heights H of the four virtual intersections P1 to P4. judged to be a major defect. Alternatively, if the difference between the maximum value and the minimum value of the heights H of the four imaginary intersections P1 to P4 exceeds a predetermined threshold value, it may be determined as defective.

Alternatively, a curved surface including the four virtual intersection points P1 to P4 is calculated from the horizontal position (XY coordinates) and height (Z coordinate) of the four virtual intersection points P1 to P4, and the curvature of the curved surface ( If the amount of deviation) exceeds a predetermined threshold, it may be determined that the product is defective. By calculating the curved surface including the four virtual intersections P1 to P4, it is possible to eliminate the influence of the inclination when the shield case 21 is held by the holding nozzle 10b. In addition, it is also possible to determine whether the product is good or bad based on three positions (XYZ coordinates) of the four virtual intersections P1 to P4, or two positions and the relative height position G from the lower surface 10c of the holding nozzle 10b.

Next, with reference to FIG. 5, another example of the imaginary intersections P5-P7 set on the shield cases 26-28 will be described. In FIG. 5(a), the wall surface 26a of the shield case 26 is not divided at the corners unlike the wall surfaces 22 to 25 of the shield case 21, and is connected by a curved surface 26b. In the shield case 26, the position where the two edges 26c and 26d of the bottom surface of the wall surface 26a sandwiching the curved surface 26b intersect is defined as an imaginary intersection point P5. In FIG. 5(b), the shield case 27 has a relatively large bottom surface 27a near the corner, and a notch 27b is formed at the corner. In the shield case 27, the position where the two edges 27c and 27d of the bottom surface 27a sandwiching the notch 27b intersect is defined as an imaginary intersection point P6.

In FIG. 5(c), the shield case 28 has an inner corner 28a recessed inward. In the shield case 28, the position where the two edges 28c and 28d of the bottom surface 28b sandwiching the inner corner 28a intersect is defined as a virtual intersection point P7. The imaginary intersection point P7 is located inside the bottom surface 28b unlike the other imaginary intersection points P1 to P6.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. A control device 30 provided in the component mounting apparatus 1 is connected with the substrate transport mechanism 2, the component supply section 4, the component holding/moving mechanism 12, the head camera 13, the component recognition unit 14, and the touch panel 16. FIG. The control device 30 includes a virtual intersection setting section 31 , a virtual intersection height calculation section 32 , a warp amount calculation section 33 , a measurement control section 34 , a mounting control section 35 and a storage section 40 . The storage unit 40 is a storage device, and stores mounting data 41, component data 42, virtual intersection position data 43, captured image data 44, virtual intersection height data 45, and the like.

The mounting data 41 stores the component name (kind), mounting position (XY coordinates), etc. of the component D to be referenced when mounting the component D including the shield case 21 (workpiece) on the substrate 3 . The part data 42 stores the characteristics, size, shape information, etc. of the part D for each part name. The virtual intersection setting unit 31 (virtual intersection setting means) determines, based on the shape information of the shield case 21 included in the component data 42, that two of the plurality of edges 22b to 25b of the shield case 21 (component, workpiece) are The intersecting positions are set as virtual intersections P1 to P4 (see FIG. 4). The positions of the set virtual intersections P1 to P4 are stored in the storage unit 40 as virtual intersection position data 43. FIG.

In FIG. 6, the measurement control unit 34 controls the component holding/moving mechanism 12 and the component recognition unit 14 to measure the three-dimensional shape of the shield case 21 (part, work) held by the holding nozzle 10b of the component holding/moving mechanism 12. Execute. When measuring the three-dimensional shape of the shield case 21 (work), the measurement control unit 34 causes the component holding and moving mechanism 12 (work holding and moving mechanism) to hold the shield case 21 at a predetermined angle (horizontal rotation angle). Then, the held shield case 21 is moved in a predetermined direction and at a predetermined speed in front of the first camera 17a and the second camera 17b (two imaging units) of the component recognition unit 14 (arrow b in FIG. 2).

The measurement control unit 34 causes the first camera 17a and the second camera 17b to image the moving shield case 21 a plurality of times. Further, the measurement control unit 34 controls the first lighting unit 18 and the second lighting unit 19 during imaging to illuminate the shield case 21 under predetermined lighting conditions. A plurality of captured images captured by the first camera 17 a and the second camera 17 b are stored in the storage unit 40 as captured image data 44 .

In FIG. 6, the virtual intersection height calculator 32 calculates the horizontal heights of the virtual intersections P1 to P4 based on a plurality of captured images captured by the first camera 17a and the second camera 17b (two imaging units). Positions (XY coordinates) and heights H (Z coordinates) of virtual intersections P1 to P4 are calculated. The calculated positions and heights H of the virtual intersections P1 to P4 are stored in the storage unit 40 as virtual intersection height data 45. FIG.

Here, a specific example of calculation of the horizontal position and height H of the virtual intersection point P1 and the virtual intersection point P4 by the virtual intersection height calculator 32 will be described with reference to FIG. 7A shows a captured image 50 captured by the first camera 17a, and FIG. 7B shows a captured image 51 captured by the second camera 17b. 7(a) and 7(b) are captured images of a part of the shield case 21 held by the holding nozzle 10b taken simultaneously by the first camera 17a and the second camera 17b. and part of the bottom surface 23a and the bottom surface 25a.

In FIG. 7A, the virtual intersection height calculator 32 recognizes the images of the bottom surface 22a, the bottom surface 23a, and the bottom surface 25a of the shield case 21, and the edge 22b of the bottom surface 22a, the edge 23b of the bottom surface 23a, and the bottom surface 25a. Edge 25b is extracted. Next, the virtual intersection height calculator 32 determines the position where the edge 22b and the edge 23b extend and intersect as the virtual intersection point P1. In addition, the virtual intersection height calculator 32 determines a position where the edge 22b and the edge 25b extend and intersect as a virtual intersection P4. Next, the virtual intersection height calculator 32 calculates the positions of the determined virtual intersection points P1 and P4 from the center of the holding nozzle 10b, and determines the horizontal positions (XY coordinates) of the virtual intersection points P1 and P4. .

Next, the virtual intersection height calculator 32 calculates the bottom surface 22a, the bottom surface 23a, and the bottom surface 25a (FIG. 7A) imaged by the first camera 17a and the bottom surface 22a, the bottom surface 23a, and the bottom surface 22a, the bottom surface 23a, and
The height H of the bottom surface 22a, the bottom surface 23a, and the bottom surface 25a is calculated from the parallax of the bottom surface 25a (FIG. 7B). In this example, the height H of the bottom surface 22a is calculated based on the parallax of the bottom surface 22a having many components in the direction (Y direction) orthogonal to the direction (X direction) in which the first camera 17a and the second camera 17b are arranged. there is Here, it is assumed that the height H1 of the bottom surface 22a near the imaginary intersection point P1 is 12.3 mm, and the height H4 of the position near the imaginary intersection point P4 is 12.5 mm.

Next, the virtual intersection point height calculator 32 determines the height of the virtual intersection point P1 to be 12.3 mm, which is the same as the height H1, and the height of the virtual intersection point P4 to be 12.5 mm, which is the same as the height H4. Alternatively, the virtual intersection height calculator 32 linearly approximates the virtual intersection P1 and the virtual intersection P4 from the heights H1 and H4 based on the shape information of the shield case 21, and calculates the height of the virtual intersection P1 by 12.5. 2 mm, and the height of the imaginary intersection point P4 is calculated as 12.6 mm.

In this manner, the virtual intersection height calculator 32 calculates the height of the virtual intersection P1 from the horizontal positions of the two edges 22b and 23b forming the virtual intersection P1 and the height of the edge 22b. The virtual intersection height calculator 32 calculates the height of the virtual intersection P4 from the horizontal positions of the two edges 22b and 25b that form the virtual intersection P4 and the height of the edge 22b. That is, the virtual intersection height calculator 32 calculates the positions of the two edges 22b and 23b (22b and 25b) that form the virtual intersection P1 (virtual intersection P4) recognized from the captured images 50 and 51, the two edges 22b, The height of the imaginary intersection point is calculated from the height of at least one of 23b (22b, 25b).

In this way, the height of the virtual intersection point is determined based on the two imaging units (the first camera 17a and the second camera 17b) arranged side by side and the captured images 50 and 51 captured by the two imaging units. The virtual intersection height calculator 32 for calculating constitutes height measuring means 46 for measuring the height of the virtual intersection.

In FIG. 6, the warp amount calculator 33 (warp amount calculator) calculates the warp amounts ΔG1 to ΔG4 of the component based on the measured heights H of the virtual intersections P1 to P4 included in the virtual intersection height data 45. do. That is, the warp amount calculator 33 is a shape calculator that calculates the three-dimensional shape of the workpiece (shield case 21) based on the measured heights H of the virtual intersections P1 to P4.

The mounting control section 35 controls the component supply section 4 and the component holding/moving mechanism 12 to mount the component D (shield case 21 ) taken out from the component supply section 4 at the mounting position of the board 3 . At this time, the mounting control unit 35 attaches the shield case 21 to the substrate 3, the warp amounts ΔG1 to ΔG4 calculated by the warp amount calculation unit 33 being equal to or less than a predetermined threshold value (predetermined value). The shield case 21 with the amount of warp ΔG1 to ΔG4 larger than the threshold value cannot be soldered to the electrodes of the substrate 3 due to floating or the like, resulting in defective mounting, and is discarded in the parts disposal section 15 . In this manner, the mounting control unit 35 and the component holding/moving mechanism 12 are mounting means for mounting components (shield case 21, workpiece) whose calculated warpage amounts ΔG1 to ΔG4 are equal to or less than a predetermined value on the substrate 3 .

As described above, a virtual intersection setting means (virtual intersection setting unit 31) for setting positions where two of the plurality of edges 22b to 25b of the workpiece (shield case 21) intersect as virtual intersections P1 to P4; Based on the height measurement means 46 (first camera 17a, second camera 17b, virtual intersection height calculator 32) for measuring the height H of P1 to P4, and the measured height H of the virtual intersection P1 to P4 The shape calculator (warp amount calculator 33) for calculating the three-dimensional shape (warp amounts ΔG1 to ΔG4) of the workpiece constitutes a three-dimensional shape measuring apparatus. This makes it possible to measure the three-dimensional shape (amount of warp) of the component (shield case 21) having edges.

Next, a three-dimensional shape measuring method for calculating the shape of a work (shield case 21) will be described along the flow of FIG. 8, taking the shield case 21 shown in FIGS. 4 and 7 as an example. First, the virtual intersection setting unit 31 sets positions where two of the plurality of edges 22b to 25b of the workpiece intersect as virtual intersections P1 to P4 (ST1) (see FIG. 4A). Then the first camera 1
7a and the second camera 17b (two imaging units arranged side by side) capture an image of the workpiece (ST2). At that time, the workpiece is moved in front of the first camera 17a and the second camera 17b according to the size of the workpiece, and the workpiece is imaged several times.

Next, the virtual intersection height calculator 32 calculates the height H of the virtual intersections P1 to P4 based on the plurality of captured images 50 and 51 captured by the first camera 17a and the second camera 17b (ST3) ( See Figure 7). Next, the warp amount calculator 33 calculates the shape of the workpiece (warp amounts ΔG1 to ΔG4) based on the calculated heights H of the virtual intersections P1 to P4 (ST4). This makes it possible to measure the three-dimensional shape (amount of warp) of the workpiece (shield case 21) having edges.

As described above, the component mounting apparatus 1 of the present embodiment performs virtual intersection setting for setting positions at which two of the plurality of edges 22b to 25b of the component (shield case 21) intersect as the virtual intersections P1 to P4. means (virtual intersection setting unit 31); height measurement means 46 (first camera 17a, second camera 17b, virtual intersection height calculation unit 32) for measuring height H of virtual intersections P1 to P4; Warp amount calculation means (warp amount calculation unit 33) for calculating the warp amount ΔG1 to ΔG4 of the part based on the height H of the virtual intersections P1 to P4, and the parts whose calculated warp amounts ΔG1 to ΔG4 are less than a predetermined value mounting means (component holding/moving mechanism 12, mounting control unit 35) for mounting on the substrate 3. This makes it possible to measure the three-dimensional shape (amount of warp) of the component (shield case 21) having edges.

Next, referring to FIGS. 9A to 9C, a land grid array 60 (component, workpiece), which is another component mounted on the substrate 3 after the amount of warpage is calculated by the component mounting apparatus 1, is shown in FIG. explain. The land grid array 60 has a main body portion 61 that is a flat plate-like insulator base material. A component 62 such as a semiconductor chip is attached to the upper surface 61a of the body portion 61 . A plurality of lands 63 are formed on the lower surface 61b of the body portion 61 . Each land 63 is connected to a terminal of the component 62 by wiring formed inside the body portion 61 .

In FIG. 9(b), on the lower surface 61b of the land grid array 60, 16 lands 63 are arranged on the outer circumference, and 4 lands 63 are arranged inside the lands 63 on the outer circumference. Hereinafter, for the sake of convenience, the land 63 in the upper right corner arranged on the outer periphery of the plurality of lands 63 will be referred to as land 64, the land 63 in the upper left corner as land 65, the land 63 in the lower left corner as land 66, and the land 63 in the lower right corner as land 67. called. The upper right land 63 arranged in the center is called land 68, the upper left land 63 is called land 69, the lower left land 63 is called land 70, and the lower right land 63 is called land 71. FIG.

In FIG. 9B, the virtual intersection point setting unit 31 sets the upper right corner of the land 64 where the right edge 64a and the upper edge 64b of the land 64 at the upper right corner arranged on the outer periphery intersect as a virtual intersection point P8. Similarly, the virtual intersection point setting unit 31 sets the upper left corner of the upper left land 65 as a virtual intersection point P9, the lower left corner of the lower left land 66 as a virtual intersection point P10, and the lower right corner of the lower right land 67 as a virtual intersection point P10. The intersection point P11 is set respectively.

The virtual intersection point setting unit 31 also sets the upper right corner of the upper right land 68 arranged in the central part as a virtual intersection point P12, the upper left corner of the upper left land 69 as a virtual intersection point P13, and the lower left corner of the lower left land 70 as a virtual intersection point P13. A virtual intersection point P14 and a lower right corner of the lower right land 71 are set as a virtual intersection point P15, respectively. That is, the virtual intersection setting means (virtual intersection setting unit 31) sets positions (corners of the land 63) at which two of the plurality of edges 64a and 64b of the land grid array 60 (parts, workpieces) intersect with the virtual intersections P8 to P8. Set as P15.

Further, the height measuring means 46 (the first camera 17a, the second camera 17b, the virtual intersection height calculator 32) measures the height H of the virtual intersections P8 to P15 of the land grid array 60 held by the holding nozzle 10b. measure. The warp amount calculator (warp amount calculator 33) calculates the warp amount of the land grid array 60 based on the measured heights H of the virtual intersections P8 to P15. Then, the mounting means (the component holding/moving mechanism 12 and the mounting control section 35) mounts the land grid array 60 having the calculated warp amount equal to or less than a predetermined value on the substrate 3. FIG.

In this way, the three-dimensional shape (amount of warp) of the land grid array 60 having the edges 64a and 64b can be measured. Further, by calculating the amount of warp based on the height H of the virtual intersection points P8 to P11 on the outer peripheral side of the land grid array 60 and the virtual intersection points P12 to P15 on the central portion, the central portion contacts the substrate 3, but the outer peripheral portion 4 It is also possible to measure a three-dimensional shape in which the corners warp upward and cause mounting failure.

INDUSTRIAL APPLICABILITY The component mounting apparatus, the three-dimensional shape measuring apparatus, and the three-dimensional shape measuring method of the present invention have the effect of being able to measure the three-dimensional shape of a component having edges, and are useful in the field of mounting components on substrates.

1 Component Mounting Device 3 Board 12 Component Holding and Moving Mechanism (Mounting Means, Work Holding and Moving Mechanism)
17a First camera (imaging unit)
17b Second camera (imaging unit)
20, 21, 26-28 Shield case (parts, work)
22b-25b, 26c, 26d, 27c, 27d, 28c, 28d, 64a, 64b
Edge 46 Height measuring means 50, 51 Captured image 60 Land grid array (component, workpiece)
D Part H Height P1 to P15 Virtual intersection ΔG1, ΔG2 Amount of warpage

Claims (9)

virtual intersection setting means for setting a position where two of the plurality of edges of the part intersect as a virtual intersection;
height measuring means for measuring the height of the virtual intersection;
warp amount calculation means for calculating the warp amount of the component based on the measured height of the virtual intersection;
mounting means for mounting the component having the calculated amount of warp equal to or less than a predetermined value on the substrate ;
The height measuring means is
two imaging units arranged side by side;
recognizing the positions of two edges forming the virtual intersection and the height of at least one of the two edges from the captured images captured by the two imaging units, and recognizing the recognized positions of the two edges; and a virtual intersection height calculator that calculates the height of the virtual intersection from the height of the at least one edge . further comprising a component holding and moving mechanism that holds a component and moves the held component in front of the two imaging units;
The two imaging units image the moving parts a plurality of times,
2. The component mounting apparatus according to claim 1 , wherein said virtual intersection height calculator calculates the height of said virtual intersection based on a plurality of captured images. 3. The warp amount calculation means according to claim 1, wherein the warp amount calculation means calculates the amount of warp of the component based on the height of the virtual intersection at a position where the part abuts against the board when mounted on the board. Component mounting equipment. 4. The component mounting apparatus according to claim 1, wherein said component is a shield case. 4. The component mounting apparatus according to claim 1, wherein said component is a land grid array, and said edge is an outer circumference of an electrode. virtual intersection setting means for setting a position where two of the plurality of edges of the workpiece intersect as a virtual intersection;
height measuring means for measuring the height of the virtual intersection;
a shape calculation unit that calculates a three-dimensional shape of the workpiece based on the measured height of the virtual intersection ,
The height measuring means is
two imaging units arranged side by side;
recognizing the positions of two edges forming the virtual intersection and the height of at least one of the two edges from the captured images captured by the two imaging units, and recognizing the recognized positions of the two edges; a virtual intersection height calculator that calculates the height of the virtual intersection from the height of the at least one edge . further comprising a work holding and moving mechanism for holding a work and moving the held work in front of the two imaging units;
The two imaging units image the moving workpiece a plurality of times,
The three-dimensional shape measurement apparatus according to claim 6 , wherein the virtual intersection height calculator calculates the height of the virtual intersection based on a plurality of captured images. A three-dimensional shape measuring method for measuring a three-dimensional shape of a workpiece,
setting a position where two of the plurality of edges of the workpiece intersect as a virtual intersection;
The workpiece is imaged by two imaging units arranged side by side,
recognizing the positions of two edges forming the virtual intersection and the height of at least one of the two edges from the captured images captured by the two imaging units, and recognizing the recognized positions of the two edges; measuring the height of the virtual intersection from the height of the at least one edge ;
A three-dimensional shape measuring method, wherein the three-dimensional shape of the workpiece is calculated based on the measured heights of the virtual intersections. imaging the work a plurality of times with the two imaging units while moving the work in front of the two imaging units;
The three-dimensional shape measuring method according to claim 8 , wherein the height of the virtual intersection is calculated based on a plurality of captured images.

Images