JP7281614B2 - COMPONENT MOUNTING APPARATUS AND MOUNTING BOARD MANUFACTURING METHOD - Google Patents

Description

The present invention relates to a component mounting apparatus for mounting components on a substrate and a method for manufacturing a mounting substrate having components mounted on the substrate.

As a component mounted on a mounting board in which components are mounted on the board, a bottom surface electrode that connects an electrode formed on the bottom surface of a component such as a BGA (Ball Grid Array) component to a land formed on the surface of the board via solder. Parts are known (see, for example, Patent Document 1). In the component mounting apparatus described in Patent Document 1, the quality of solder bumps formed on the electrodes (BG joints) of the BGA component is determined before mounting on the board, such as missing, misalignment, and insufficient amount of solder. The quality of the mounting board is improved by discarding it and not mounting it on the board.

WO 98/26641

However, in the prior art including Patent Document 1, after it is determined that there is no defect in the electrode of the lower surface electrode component and it is mounted on the mounting position of the substrate, the position of the lower surface electrode component is shifted by the surface tension of the solder melted by the heating due to reflow. There is a problem that a defect may occur due to movement and contact with adjacent parts.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus and a method for manufacturing a mounting board, which can improve the quality of the mounting board on which the lower surface electrode component is mounted.

The component mounting apparatus of the present invention is a component mounting apparatus that connects electrodes of the component to lands formed on the substrate through solder by mounting the component on the mounting position of the substrate by component mounting means, When the component is mounted on the mounting position and the solder is melted based on the direction and amount of deviation of the position of the electrode with respect to the outer shape of the component mounted on the mounting position, the component is attached to the component. Interference determination means for determining whether or not the component interferes with the adjacent adjacent component, and the component mounting means mounts the component when the interference determination means determines that the component interferes with the adjacent component. Do not install in position.

A method for manufacturing a mounting substrate according to the present invention is a method for manufacturing a mounting substrate in which a component is mounted at a mounting position on a substrate so that electrodes of the component are connected to lands formed on the substrate via solder, When the component is mounted on the mounting position and the solder is melted based on the direction and amount of deviation of the position of the electrode with respect to the outer shape of the component mounted on the mounting position, the component is attached to the component. and a post-determination processing step of processing the component based on the determination result of the interference determination step. is determined to interfere with the adjacent component, the component is not mounted at the mounting position in the post-determination processing step.

According to the present invention, it is possible to improve the quality of the mounting board on which the lower surface electrode component is mounted.

1 is a plan view showing the configuration of a component mounting apparatus according to one embodiment of the present invention; 1(a) side view and (b) bottom view of a component having electrodes on its lower surface mounted on a substrate by a component mounting apparatus according to an embodiment of the present invention. FIG. FIG. 4 is an explanatory diagram of a component imaging operation by a component recognition camera provided in the component mounting apparatus according to one embodiment of the present invention; (a), (b), and (c) process explanatory diagrams for mounting a component on a substrate by the component mounting apparatus according to one embodiment of the present invention; 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 2 is a diagram showing an example of a component recognition image captured by a component recognition camera included in the component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a partial plan view of the vicinity of a mounting position of a board on which components are mounted by a component mounting apparatus according to an embodiment of the present invention; FIG. 2(a) Partial plan view before solder melting and (b) Partial plan view after solder melting of a board on which components are mounted by a component mounting apparatus according to an embodiment of the present invention. FIG. 1 is a flowchart of a method for manufacturing a mounting board according to one embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, the two axial directions perpendicular to each other in the horizontal plane are the X direction of the substrate transfer direction (horizontal direction in FIG. 1) and the Y direction perpendicular to the substrate transfer direction (vertical direction in FIG. 1). is shown.

First, the configuration of a component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a substrate transfer mechanism 2 is installed in the X direction at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side in the X direction, and positions and holds it at a mounting work position by the mounting head described below. Further, the board transfer mechanism 2 carries out the board 3 on which the component mounting work is completed to the downstream side. A component supply unit 4 is installed on each side of the board transfer mechanism 2 .

A plurality of tape feeders 5 are mounted in parallel in the X direction on both component supply units 4 . The tape feeder 5 pitch-feeds the carrier tape in which pockets for storing components are formed in a direction (tape feeding direction) from the outside of the component supply unit 4 toward the substrate transport mechanism 2, so that the mounting head picks up the components. Parts are supplied to the parts pick-up position. A tray feeder 7 for supplying a tray 6 holding the components D in an aligned manner to a component pick-up position is attached to one of the component supply units 4 .

Here, the structure of the component D will be described with reference to FIGS. 2(a) and 2(b). A component D shown in FIG. 2A is a bottom electrode component having a plurality of electrodes E (here, four electrodes) connected to lands of the substrate 3 on its bottom surface Dd. In FIG. 2(b), four electrodes E are formed on the lower surface Dd of the component D at equal intervals vertically and horizontally. In this example, the center of the four electrodes E of the component D (hereinafter simply referred to as "electrode center Ce") is the center of the component D based on the outline of the component D (hereinafter simply referred to as "component center Cd"). ) are formed so as to coincide with each other. Note that the component D shown in FIG. 2 is an example of the lower electrode component, and the number of electrodes E is not limited to four. Further, the outer shape of the part D is not limited to a square, and the electrode E may be set at a position where the electrode center Ce does not match the part center Cd.

In FIG. 1, a Y-axis table 8 having a linear drive mechanism is arranged at both ends in the X direction on the upper surface of the base 1a. A beam 9 similarly provided with a linear mechanism is coupled to the Y-axis table 8 so as to be movable in the Y direction. A mounting head 10 is attached to the beam 9 so as to be movable in the X direction. The mounting head 10 includes a plurality of suction units (not shown) that hold the component D and can move up and down. A suction nozzle 10a (see FIG. 3) for sucking and holding the component D is attached to the lower end of each suction unit.

The Y-axis table 8 and the beam 9 constitute a mounting head moving mechanism for moving the mounting head 10 in horizontal directions (X direction and Y direction). The mounting head moving mechanism and the mounting head 10 constitute component mounting means 11 for mounting the component D at the mounting position on the board 3 . The component mounting means 11 picks up the upper surface Du (see FIG. 2(a)) of the component D from the component take-out position of the tape feeder 5 and the tray feeder 7 mounted in the component supply unit 4 by vacuum suction with the suction nozzle 10a. Then, the component mounting work of transferring and mounting the substrate 3 held by the substrate transport mechanism 2 to the mounting position is executed.

In the component mounting operation, the mounting head 10 moves above the component supply unit 4, picks up a predetermined component D with each suction nozzle 10a, moves above the substrate 3, and picks up the component D held by each suction nozzle 10a. to each mounting position.

In FIG. 1, the beam 9 is equipped with a head camera 12 positioned below the beam 9 and moving integrally with the mounting head 10 . As the mounting head 10 moves, the head camera 12 moves above the board 3 positioned at the mounting work position of the board transport mechanism 2 and picks up an image of a board mark (not shown) provided on the board 3 . to recognize the position of the substrate 3.

A component recognition camera 13 and a disposal unit 14 are installed between the component supply unit 4 and the substrate transport mechanism 2 . The component recognition camera 13 captures an image of the component D held by the suction nozzle 10a from below when the mounting head 10 that has taken out the component D from the component supply unit 4 is positioned above the component recognition camera 13 (see FIG. 3). ). In the work of mounting the component D on the board 3 by the mounting head 10, the mounting position is corrected in consideration of the recognition result of the board 3 by the head camera 12 and the recognition result of the component D by the component recognition camera 13. FIG.

In FIG. 1 , among the components D held by the mounting head 10 , the components D that are not mounted on the substrate 3 are discarded in the disposal section 14 . A touch panel 15 operated by a worker is installed at a position where the worker works on the front surface of the component mounting apparatus 1 . The touch panel 15 displays various information on its display section, and the operator inputs data and operates the component mounting apparatus 1 using operation buttons displayed on the display section.

Next, with reference to FIGS. 4(a) to 4(c), the component mounting process for mounting the component D on the board 3 will be described. FIG. 4(a) is a partial plan view of the substrate 3 near the mounting position S1 where the component D shown in FIG. 2 is mounted. Chip components P (P1, P2) such as resistors and capacitors are mounted adjacent to the components D on the substrate 3 . In FIG. 4A, on the surface of the substrate 3, lands L to which the electrodes E of the component D or the chip component P are connected are formed. As shown in FIG. 4B, prior to the component mounting operation, solder Q corresponding to the shape of the land L is printed (deposited) on the surface of the land L of the substrate 3 by a screen printer or the like (not shown). be. Next, the board 3 on which the solder Q is printed is carried into the component mounting apparatus 1 and held at the mounting work position.

Next, the component mounting means 11 picks up the component D or the chip component P supplied from the tray feeder 7 or the tape feeder 5, picks up an image (FIG. 3) with the component recognition camera 13, and then picks up the component at the mounting position S set on the board 3. A component D or a chip component P is mounted on the . In the example of FIG. 4, the mounting position S1 of the component D is at the center of the four lands L1, the mounting position S2 of the chip component P1 is between the two lands L2, and the mounting position S3 of the chip component P2 is between the two lands L2. Each is set between the lands L3. The component mounting means 11 mounts the component D and the chip components P1 and P2 on the mounting positions S1 to S3 in consideration of the recognition result by the component recognition camera 13. FIG. As shown in FIG. 4(c), the component D is mounted on the board 3 so that the component center Cd coincides with the mounting position S1.

Next, the substrate 3 on which the component D and the chip components P1 and P2 are mounted is transported to a reflow device (not shown). The reflow device melts the solder Q by heating the substrate 3 while transporting it, and then solidifies the solder Q to solder the component D and the chip components P1 and P2 to the substrate 3 . As described above, the component mounting apparatus 1 mounts the component D or the chip component P on the mounting position S of the substrate 3 by the component mounting means 11, thereby mounting the component D or the chip component P on the land L formed on the substrate 3 via the solder. The electrode E of the chip component P is connected.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. A control unit 20 provided in the component mounting apparatus 1 is connected with a substrate transport mechanism 2, a component supply unit 4, a component mounting means 11, a head camera 12, a component recognition camera 13, and a touch panel 15. FIG. The control unit 20 includes a recognition processing unit 21 , an interference determination processing unit 22 , a mounting control unit 23 , a production data storage unit 24 , a parts information storage unit 25 and a misalignment information storage unit 26 .

The production data storage unit 24 is a storage device, and stores the component D, the component name (kind) of the chip component P referred to when mounting the component D and the chip component P on the substrate 3, the mounting position S (XY coordinates), and the like. store production data including; The component information storage unit 25 is a storage device, and stores the size, the standard position of the electrode E with respect to the outer shape, the minimum distance between adjacent components, and the like for each component name of the component D and the chip component P mounted on the substrate 3. there is

In FIG. 5, the recognition processing unit 21 recognizes the outline of the component D and the position of the electrode E by recognizing the image of the lower surface Dd of the component D held by the suction nozzle 10a captured by the component recognition camera 13 . That is, the component recognition camera 13 is an imaging unit that captures an image of the external shape and the electrode E of the component D held by the component mounting means 11 . Further, the recognition processing unit 21 calculates the position of the component D with respect to the suction nozzle 10a that vacuum-sucks the component D based on the recognized outer shape of the component D. FIG.

The position of the electrode E of the component D, which is a lower surface electrode component, may deviate from the standard position due to manufacturing errors and variations in the manufacturing process. The recognition processing unit 21 determines the position of the electrode E from the standard position based on the recognized external shape of the component D, the position of the electrode E, and the standard position of the electrode E with respect to the external shape of the component D stored in the component information storage unit 25. A positional deviation (a deviation direction and a deviation amount) is calculated. That is, the recognition processing unit 21 is a processing unit that calculates the deviation direction and the deviation amount of the position of the electrode E with respect to the outer shape of the part D from the result of imaging by the imaging unit.

Here, referring to FIG. 6, the position of the component D (component center Cd), the position of the electrode E (the electrode The center Ce) will be explained. In the component recognition image 13a, the center line 13x in the X direction and the center line 13y in the Y direction are superimposed and displayed. The intersection of the center line 13x in the X direction and the center line 13y in the Y direction is the center 13c of the component recognition image 13a.

In FIG. 6, the stop position of the suction nozzle 10a holding the component D is adjusted so that the center 13c of the component recognition image 13a and the center Cn of the suction nozzle 10a are aligned. The part center Cd is recognized from the outer shape of the part D by the recognition processing unit 21 . Further, the recognition processing unit 21 calculates the pickup position deviation (ΔXd, ΔYd) of the component D from the position of the component center Cd with respect to the center 13c of the component recognition image 13a.

The electrode center Ce is recognized from the positions of the four electrodes E by the recognition processing unit 21 . Further, the recognition processing unit 21 calculates the displacement (ΔXe, ΔYe) of the electrode E from the component center Cd, the electrode center Ce, and the standard position of the electrode E stored in the component information storage unit 25 . In this example, the standard position (electrode center Ce) of the electrode E coincides with the component center Cd, and the relative position of the electrode center Ce with respect to the component center Cd is the displacement of the electrode E (ΔXe, ΔYe). The recognition processing unit 21 stores the calculated suction position shift (ΔXd, ΔYd) of the component D and the calculated position shift (ΔXe, ΔYe) of the electrode E in the position shift information storage unit 26 .

In FIG. 5, the interference determination processing unit 22 calculates the positional deviation (ΔXe, ΔYe) of the electrode E stored in the positional deviation information storage unit 26, the part D stored in the production data storage unit 24, and the adjoining parts D. Based on the mounting position S of the component, the size of the component D and the adjacent component stored in the component information storage unit 25, and the minimum distance between the component D and the adjacent component, the component D is mounted at the mounting position S1 and the solder is melted. In this case, it is determined whether or not the component D interferes with the adjacent component.

Here, with reference to FIG. 7, an example of the substrate 3 in which the mounting position S1 on which the component D is mounted will be described. The mounting position S1 is set at the center position of four lands L1 formed on the substrate 3 to which the four electrodes E of the component D are connected. The component D is mounted on the board 3 after position correction so that the component center Cd coincides with the mounting position S1. Above the mounting position S1 (in the Y direction), a mounting position S2 is set where the chip component P1, which is an adjacent component, is mounted. The mounting position S2 is set apart from the mounting position S1 by a distance Y0 in the Y direction. The mounting position S2 is set at the center position of the two lands L2 to which the two electrodes E of the chip component P1 are connected. The chip component P1 is mounted on the substrate 3 after being positionally corrected so that the component center Cp coincides with the mounting position S2.

A mounting position S3 is set on the left side (X direction) of the mounting position S1, where the chip component P2, which is an adjacent component, is mounted. The mounting position S3 is set apart from the mounting position S1 by a distance X0 in the X direction. The mounting position S3 is set at the center position of the two lands L3 to which the two electrodes E of the chip component P2 are connected. The chip component P2 is mounted on the substrate 3 after position correction so that the component center Cp coincides with the mounting position S3.

In FIG. 7, the size of the component D is Dx in the X direction and Dy in the Y direction. The Y-direction size of the chip component P1 is Py, and the X-direction size of the chip component P2 is Px. When the component D and the chip component P2 are mounted on the substrate 3 without deviation, the distance Gx in the X direction between the component D and the chip component P2 is X0-Dx/2-Px/2. Similarly, when the component D and the chip component P1 are mounted on the substrate 3 without deviation, the Y-direction spacing Gy between the component D and the chip component P1 is Y0-Dy/2-Py/2.

Next, with reference to FIGS. 8(a) and 8(b), an example in which the component D with the positional deviation (ΔXe, ΔYe) of the electrode E is mounted on the substrate 3 will be described. FIG. 8(a) shows the state immediately after the component D is mounted on the board 3 on which the solder Q is printed on the land L, and FIG. 8(b) shows the state after the component D is mounted and the solder Q is melted and solidified. state. In FIG. 8A, when the component center Cd of the component D is aligned with the mounting position S1 and mounted on the board 3, the electrode E of the component D is shifted from the mounting position S1 of the board 3 by the position of the electrode E (.DELTA.Xe, .DELTA.Ye). It will be in a state of being displaced. That is, the position of the electrode E is on the side farther from the chip component P2 than the land L1 by ΔXe in the X direction, and on the side farther from the chip component P1 by ΔYe in the Y direction.

When the solder Q is melted, the surface tension of the melted liquid solder Q moves the position of the component D so that the electrode E of the component D is aligned with the land L1 as shown in FIG. 8(b). That is, when the solder Q is melted, the component D moves to a position where the electrode center Ce coincides with the mounting position S1. Then, in the component D where the displacement direction of the electrode E is far from the adjacent components (chip components P1 and P2) and the amount of deviation is large, contact (collision) with the adjacent component occurs when the solder Q is melted. or too close interference may occur.

The interference determination processing unit 22 determines whether or not the component D interferes with adjacent components (chip components P1 and P2). Specifically, the interference determination processing unit 22 determines that the distance Gx (X0−Dx/2−Px/2−ΔXe) between the component D and the chip component P2 in the X direction after melting the solder Q is greater than the minimum distance Gxm. When it becomes smaller (including when it becomes negative), it is determined that the component D interferes with the adjacent chip component P2. Alternatively, the interference determination processing unit 22 determines that the distance Gy (Y0−Dy/2−Py/2−ΔYe) between the component D and the chip component P1 in the Y direction after melting the solder becomes smaller than the minimum distance Gym (negative ), it is determined that the component D interferes with the adjacent chip component P1.

That is, the interference determination processing unit 22 determines the distance (Gx, Gy) is equal to or less than a predetermined value (Gxm, Gym), it is determined that the component D interferes with an adjacent component. In this way, the component recognition camera 13 (imaging unit), the recognition processing unit 21 (processing unit), and the interference determination processing unit 22 determine the deviation direction and deviation of the position of the electrode E with respect to the external shape of the component D mounted at the mounting position S1. Based on the amount (positional deviation (ΔXe, ΔYe) of the electrode E), when the component D is mounted on the mounting position S1 and the solder Q is melted, the component D is attached to the adjacent component adjacent to the component D. Interference judgment means 27 (see FIG. 5) for judging whether or not there is interference is provided.

In FIG. 5, the mounting control unit 23 controls the component mounting means 11 to vacuum-suck the upper surface Du of the component D stored in the tray 6 by the suction nozzle 10a to pick up the component D held by the suction nozzle 10a. is mounted on the mounting position S1 of the substrate 3, the component mounting work is executed. At this time, the mounting control unit 23 mounts the component D on the board 3 after correcting the component center Cp of the component D to match the mounting position S1 based on the pickup position deviation (ΔXd, ΔYd) of the component D. Further, when the interference determination processing unit 22 determines that the component D held by the suction nozzle 10a interferes with an adjacent component, the mounting control unit 23 causes the disposal unit 14 to discard the component D.

That is, when the interference determination means 27 determines that the component D interferes with the adjacent component, the component mounting means 11 discards the component D to the disposal unit 14 and does not mount the component D at the mounting position S1. . As a result, it is possible to prevent the component D mounted on the board 3 from interfering with the adjacent components after the solder Q is melted, thereby improving the quality of the mounting board on which the lower surface electrode component (component D) is mounted. can.

Further, when the interference determination processing unit 22 determines that the component D held by the suction nozzle 10a will interfere with the adjacent component if it is mounted on the initially planned mounting position S1, the interference determination processing unit 22 mounts the adjacent component on the same substrate 3 without interfering with the adjacent component. A search is made for an alternative mounting position S where the component D can be mounted. When a plurality of components of the same type as component D are mounted on the board 3, the adjacent component may be farther from the initially planned mounting position S1, or the relative positional relationship with the adjacent component may be in a direction that does not interfere. In some cases, alternative mounting locations S may be found.

When the interference determination processing unit 22 finds the mounting position S where the component D held by the suction nozzle 10a can be mounted, the mounting control unit 23 controls the component mounting means 11 to mount the component D at the mounting position S. Let That is, the component mounting means 11 mounts the component D on another mounting position S when it is determined that the component D interferes with the adjacent component. As a result, it is possible to avoid the loss caused by discarding the part D.

Next, according to the flow of FIG. 9, the part D stored in the tray 6 is picked up by the suction nozzle 10a in the component mounting apparatus 1 and mounted on the mounting position S1 of the board 3, thereby forming the land formed on the board 3. One turn of the manufacturing method of the mounting board in which the electrode E of the component D is connected to L1 via the solder Q will be described. Assume that a substrate 3 having solder Q printed on a land L is positioned and held at the mounting work position of the component mounting apparatus 1 . First, the component mounting means 11 picks up the component D from the tray 6 (ST1: component picking step). Next, when the component mounting means 11 holding the component D moves upward, the component recognition camera 13 (imaging section) images the outer shape of the component D held by the component mounting means 11 and the electrodes E (ST2: imaging step ).

Next, the recognition processing unit 21 calculates the displacement direction and displacement amount of the electrode E with respect to the external shape of the component D (positional displacement (ΔXe, ΔYe) of the electrode E) from the imaging result of the imaging step (ST2) (ST3: process process). At this time, the recognition processing unit 21 also calculates the pick-up position deviation (ΔXd, ΔYd) of the component D, and stores it in the position deviation information storage unit 26 together with the position deviation (ΔXe, ΔYe) of the electrode E. Next, based on the positional deviation (ΔXe, ΔYe) of the electrodes E of the component D mounted on the mounting position S1, the interference determination processing unit 22 determines that when the component D is mounted on the mounting position S1 and the solder Q is melted, First, it is determined whether or not the component D interferes with adjacent components (chip components P1 and P2) adjacent to the component D (ST4: interference determination step).

Specifically, in the interference determination step (ST4), the interference determination processing unit 22 compares the outer shape of the component D and the outer shape of the adjacent component when the component D is mounted on the mounting position S1 and the solder Q is melted. When the interval (Gx, Gy) is equal to or less than a predetermined value (Gxm, Gym), it is determined that the component D interferes with the adjacent component. If it is determined that there is no interference in the interference determination step (ST4) (No), the component mounting means 11 corrects the position based on the pickup position deviation (ΔXd, ΔYd) of the component D so that the component center Cd of the component D is It is mounted on the substrate 3 so as to match the mounting position S1 (ST5).

In FIG. 9, when it is determined that there is interference in the interference determination step (ST4) (Yes), the interference determination processing unit 22 replaces the initially planned mounting position S1 with another mounting position S where the component D can be mounted. search (ST6: alternative mounting position search step). If the component D can be mounted on another mounting position S (Yes in ST6), the component mounting means 11 mounts the component D on another mounting position S (ST7). If there is no other mounting position S that can be mounted (No in ST6), the component mounting means 11 discards the component D to the discarding unit 14 (ST8: component discarding step), and returns to the component extraction step (ST1). Take out the next part D.

Thus, ST5 to ST8 in the flow shown in FIG. 9 are post-determination processing steps for processing the component D based on the determination result of the interference determination step (ST4). In the post-determination process, when it is determined that the component D does not interfere with the adjacent component (No in ST4), the component D is mounted at the mounting position S1. Further, in the post-determination processing step, if it is determined in the interference determination step (ST4) that the component D interferes with the adjacent component (Yes), if it is determined that the component D can be mounted at another mounting position S (Yes in ST6). The component D is mounted on another mounting position S (ST7), and if there is no other mounting position S that can be mounted (No in ST6), the component D is discarded by the discarding unit 14 (ST8).

That is, when it is determined in the interference determination step (ST4) that the component D interferes with the adjacent component (Yes), the component D is not mounted at the initially planned mounting position S1 in the post-determination process (ST7, ST8). As a result, it is possible to prevent the component D mounted on the board 3 from interfering with the adjacent components after the solder Q is melted, thereby improving the quality of the mounting board on which the lower surface electrode component (component D) is mounted. can.

As described above, the component mounting apparatus 1 of the present embodiment has the positional deviation direction and deviation amount of the electrode E with respect to the external shape of the component D mounted on the mounting position S1 (positional deviation (ΔXe, ΔYe) of the electrode E). ), interference determination means for determining whether or not the component D interferes with adjacent components (chip components P1 and P2) when the component D is mounted on the mounting position S1 and the solder Q is melted. 27 (component recognition camera 13, recognition processing unit 21, interference determination processing unit 22). When the interference determining means 27 determines that the component D interferes with the adjacent component, the component mounting means 11 does not mount the component D at the mounting position S1. As a result, it is possible to prevent the component D mounted on the board 3 from interfering with the adjacent components after the solder Q is melted, thereby improving the quality of the mounting board on which the lower surface electrode component (component D) is mounted. can.

In the above description, after the component D is taken out from the tray 6, the displacement (ΔXe, ΔYe) of the electrode E of the component D is calculated by the component recognition camera 13 (imaging unit) and the recognition processing unit 21 (processing unit). However, embodiments are not limited to this. For example, before the components D are stored in the tray 6 or the carrier tape, the positional deviation (ΔXe, ΔYe) of the electrodes E of the components D is measured, and stored in the positional deviation information storage unit 26 in association with each component D. Before the component D taken out from 6 is mounted on the board 3, it may be read out from the positional deviation information storage unit 26 and interference determination may be executed.

INDUSTRIAL APPLICABILITY The component mounting apparatus and the method for manufacturing a mounting board according to the present invention have the effect of improving the quality of the mounting board on which the lower surface electrode component is mounted, and are useful in the field of mounting components on the board.

REFERENCE SIGNS LIST 1 component mounting device 3 board 11 component mounting means 13 component recognition camera (imaging unit)
D Part E Electrode Gx, Gy Spacing L, L1, L2, L3 Land Q Solder S, S1, S2, S3 Mounting position

Claims (10)

A component mounting apparatus for connecting electrodes of the component to lands formed on the substrate through solder by mounting the component on the mounting position of the substrate by component mounting means,
When the component is mounted on the mounting position and the solder is melted based on the direction and amount of deviation of the position of the electrode with respect to the outer shape of the component mounted on the mounting position, the component is attached to the component. Equipped with interference determination means for determining whether or not there is interference with adjacent adjacent parts,
The component mounting means is
A component mounting apparatus which does not mount the component on the mounting position when the interference determining means determines that the component interferes with the adjacent component. The interference determination means is
It is determined that the component interferes with the adjacent component when the distance between the outer shape of the component and the outer shape of the adjacent component when the component is mounted on the mounting position and the solder is melted is a predetermined value or less. , The component mounting apparatus according to claim 1. The component mounting means is
3. The component mounting apparatus according to claim 1, wherein said component is discarded when it is determined that said component interferes with said adjacent component. The component mounting means is
3. The component mounting apparatus according to claim 1, wherein said component is mounted at another mounting position when it is determined that said component interferes with said adjacent component. The interference determination means is
an imaging unit that captures an image of the external shape and electrode of the component held by the component mounting means;
5. The component mounting apparatus according to any one of claims 1 to 4, further comprising a processing unit that calculates a deviation direction and a deviation amount of the position of the electrode with respect to the outer shape of the component based on the imaging result of the imaging unit. A method for manufacturing a mounting substrate, wherein the electrodes of the component are connected to lands formed on the substrate via solder by mounting the component on the mounting position of the substrate,
When the component is mounted on the mounting position and the solder is melted based on the direction and amount of deviation of the position of the electrode with respect to the outer shape of the component mounted on the mounting position, the component is attached to the component. an interference determination step of determining whether or not there is interference with adjacent adjacent parts;
a post-determination processing step of processing the component based on the determination result of the interference determination step;
A method of manufacturing a mounted board, wherein the component is not mounted at the mounting position in the post-determination processing step when it is determined in the interference determination step that the component interferes with the adjacent component. In the interference determination step, when the distance between the outer shape of the component and the outer shape of the adjacent component when the component is mounted on the mounting position and the solder is melted is a predetermined value or less, the component is positioned adjacent to the adjacent component. 7. The method of manufacturing a mounting board according to claim 6, wherein it is determined that the component interferes with the component. 8. The method of manufacturing a mounting board according to claim 6, wherein, when it is determined in said interference determination step that said component interferes with said adjacent component, said component is discarded in said post-determination processing step. 8. The manufacturing of the mounted board according to claim 6, wherein when the component is determined to interfere with the adjacent component in the interference determination step, the component is mounted at another mounting position in the post-determination processing step. Method. an imaging step of imaging the external shape and electrodes of the component ;
10. The method of manufacturing a mounting board according to claim 6, further comprising a processing step of calculating a shift direction and a shift amount of the position of the electrode with respect to the outer shape of the component based on the imaging result of the imaging step.

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