JP4952692B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

In an electronic component mounting apparatus used in a component mounting line for manufacturing a mounting substrate, a component mounting operation in which an electronic component is taken out from a parts feeder such as a tape feeder by a mounting head, and transferred and mounted on the substrate is repeatedly executed. In recent years, due to demands for improving mounting efficiency, a mounting head is provided with a plurality of suction nozzles for sucking and holding electronic components, and a plurality of electronic components are simultaneously mounted in one mounting turn operation in which the mounting head makes one round trip between the component supply unit and the substrate. A method of transporting and loading is used. In this method, the part feeding operation for picking up electronic components by moving the mounting head up and down relative to the parts feeder by matching the arrangement pitch of the parts feeder in the parts supply unit with the mounting pitch of the suction nozzles in the mounting head. In FIG. 2, a plurality of electronic components are collectively sucked and held by a plurality of suction nozzles (see Patent Document 1).
JP 2005-5288 A

  In recent years, with the progress of miniaturization of electronic devices, the size of electronic components mounted on a substrate has also been reduced, and in electronic component mounting apparatuses, minute components having a size of 1 mm or less are targeted. When taking out such a micro component, a high positioning accuracy between the suction nozzle and the electronic component is required. For this reason, in order to stably perform the simultaneous suction of the plurality of components described above, it is necessary to correctly align the plurality of suction nozzles with respect to the respective electronic components to be suctioned within an allowable accuracy range.

  However, since part feeders such as tape feeders in the component supply unit are rearranged by changing the product type, some arrangement pitch errors occur due to attachment / detachment to the feeder base provided in the component supply unit. It is inevitable. Also, when using a tape feeder, each tape feeder has its own component feed position error, and even if the tape feeder itself is correctly installed, the electronic components sent by the component feed operation are always in the correct position. It does not necessarily stop. For this reason, when performing alignment for the purpose of simultaneously taking out multiple components, depending on the component position variation state in the component supply unit, the suction nozzle must be within an allowable range of misalignment for normal suction operation. There are often situations in which it is not possible to position and multiple parts cannot be picked up simultaneously. As described above, in the conventional electronic component mounting apparatus and electronic component mounting method, the application range of the simultaneous multiple component extraction is restricted due to the variation in the component positions in the component supply unit, which may lead to a decrease in mounting efficiency.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of improving the mounting efficiency by expanding the application range of simultaneous extraction of a plurality of components.

An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that takes out an electronic component from a component supply unit by a mounting head and mounts the electronic component on a substrate held by a substrate holding unit, and has a predetermined feeder arrangement pitch in the component supply unit. A plurality of parts feeders arranged in parallel to supply the electronic components to the pick-up position by the mounting head, and a plurality of parts feeders mounted on the mounting head at a nozzle mounting pitch corresponding to the feeder arrangement pitch A suction head, a mounting head moving mechanism for moving the mounting head between the component supply unit and the substrate holding unit, and normalization of an actual extraction position at the extraction position by imaging and recognizing the extraction position A positional deviation detecting means for detecting a positional deviation amount indicating an error with respect to the position; and a detection result of the positional deviation detecting means. And by holding the plurality of suction nozzles to the plurality of parts feeders by controlling the mounting head moving mechanism in accordance with a position correction parameter calculated based on a positional deviation allowable value set in advance for each type of electronic component. A take-out operation control unit that causes the mounting head to simultaneously take out a plurality of electronic components that have been taken out at the same time, and the take-out operation control unit performs misalignment detection a plurality of times for each of the plurality of parts feeders. A plurality of individual positional deviation statistical values obtained by statistically processing the plurality of positional deviation amounts detected by execution are calculated, and each of the plurality of individual positional deviation statistical values is calculated for each electronic component that is a target in the extraction operation. By comparing with the allowable displacement value corresponding to the type, the allowable displacement value The presence / absence of an individual positional deviation statistic value outside the range is determined, and if at least one individual positional deviation statistic value is outside the range of the positional deviation allowable value, the individual positional deviation statistical value is determined to be the positional deviation allowable value. The position correction parameter is calculated so that it falls within the range, and if there is an individual positional deviation statistical value that cannot be within the range of the positional deviation allowable value, the individual positional deviation statistical value is rejected. The position correction parameter is calculated, and a multiple component simultaneous extraction operation is performed on an electronic component corresponding to the remaining individual positional deviation statistical value. Further, the individual positional deviation statistical value is a value of a positional deviation amount in the part feeder. It is the upper limit or lower limit of the normal variation range in the distribution .

The electronic component mounting method according to the present invention includes a plurality of parts feeders that are arranged in parallel at a predetermined feeder arrangement pitch in the component supply unit and that supply the electronic components to a take-out position by the mounting head, and the feeder arrangement pitch at the feeder arrangement pitch. A plurality of suction nozzles that are mounted at a corresponding nozzle mounting pitch to suck and hold the electronic component, and a mounting head moving mechanism that moves the mounting head between the component supply unit and the substrate holding unit that holds the substrate; The component supply unit includes an electronic component mounting apparatus including a displacement detection unit that detects a displacement amount indicating an error of the actual removal position with respect to a normal position at the removal position by capturing and recognizing the removal position. The electronic component is taken out from the board by the mounting head and mounted on the board held by the board holding part A mounting method for controlling the mounting head moving mechanism according to a position correction parameter calculated based on a detection result of the position shift detection means and a position shift allowable value set in advance for each type of the electronic component. Detecting each of the plurality of parts feeders in an extraction operation control step for causing the mounting head to simultaneously perform a plurality of component extraction operations for simultaneously extracting a plurality of electronic components held on the plurality of parts feeders by the plurality of suction nozzles. Calculating a plurality of individual positional deviation statistical values obtained by statistically processing the positional deviation amounts individually, and comparing the plurality of individual positional deviation statistical values with the allowable positional deviation values corresponding to the types of the electronic components, respectively. To determine whether there is an individual positional deviation statistical value that is outside the range of the positional deviation allowable value. Both when one individual positional deviation statistic is outside the range of the position shift tolerance, it calculates the position correction parameter as the individual position displacement statistic is in the range of the position shift tolerance, If there is an individual positional deviation statistical value that cannot be within the allowable positional deviation value, the individual positional deviation statistical value is rejected to calculate the position correction parameter, and the remaining individual positional deviation statistical value The multiple component simultaneous pick-up operation is executed for the electronic component corresponding to the above, and the individual positional deviation statistical value is the upper limit value or the lower limit value of the normal variation range in the positional deviation amount distribution in the part feeder .

  According to the present invention, a plurality of positional deviation amounts detected by executing positional deviation detection for each of a plurality of parts feeders are individually statistically processed to create a plurality of individual positional deviation statistical values. By comparing each individual positional deviation statistical value with a positional deviation allowable value corresponding to the type of electronic component that is the target in the extraction operation, it is determined whether there is an individual positional deviation statistical value that is outside the range of the allowable positional deviation. When at least one individual positional deviation statistical value is outside the range of the positional deviation allowable value, by calculating the position correction parameter so that the individual positional deviation statistical value is within the range of the positional deviation allowable value, It is possible to improve the mounting efficiency by expanding the application range of simultaneous pick-up of multiple components.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a configuration explanatory view of a tape feeder mounted on the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 4 is a partial sectional view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 4 is a partial plan view of a component supply unit of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. FIG. 6 is an explanatory diagram of detection of a positional deviation at the pick-up position in the component supply unit of the electronic component mounting apparatus, and FIG. 6 is an explanatory diagram of a variation distribution state of the positional deviation amount at the pick-up position in the electronic component mounting apparatus according to the embodiment of the present invention. 7 is an explanatory diagram of a positional deviation allowable value of the component picking-up operation in the electronic component mounting apparatus of one embodiment of the present invention, and FIG. 8 is a diagram of position correction at the picking-up operation in the electronic component mounting apparatus of one embodiment of the present invention. Illustrations, 9 and 10 are books FIG. 11 is an explanatory diagram of position correction at the time of a multiple component simultaneous take-out operation in the electronic component mounting method according to one embodiment of the invention; FIG. FIG. 12 is a flowchart of the removal operation control process in the electronic component mounting method according to the embodiment of the present invention.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The conveyance path 2 conveys the substrate 3 on which the electronic component is mounted, positions it at the mounting work position, and holds it. Accordingly, the transport path 2 is a substrate holding unit that holds the substrate 3. On both sides of the conveyance path 2, a component supply unit 4 that supplies a plurality of types of electronic components is disposed. In the component supply unit 4, a tape feeder 5 that is a parts feeder that supplies electronic components is a predetermined feeder. A plurality are arranged in parallel at an arrangement pitch.

  As shown in FIG. 2, the tape feeder 5 is provided with a tape feeding mechanism for feeding a carrier tape 15 (see FIG. 5) holding an electronic component. The electronic components are supplied to a take-out position by a mounting head 8 to be described later. The motor 13 is driven by a motor driving unit 12 b built in the feeder control unit 12 and is controlled by the control function of the apparatus main body via the feeder control unit 12. Thereby, the feed pitch when the carrier tape 15 is pitch-fed and the stop position when the feed is stopped can be arbitrarily set. Further, the tape feeder 5 includes a feeder storage unit 12a built in the feeder control unit 12, and statistically analyzes the type of components held on the carrier tape and the amount of positional deviation unique to each tape feeder at the electronic component take-out position 5a. Thus, data such as individual positional deviation statistics can be written and stored via the feeder control unit 12.

  Y-axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. Mounted on the X-axis tables 7A and 7B are a mounting head 8 and a substrate recognition camera 9 that moves integrally with the mounting head 8, respectively. The Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B constitute a head moving mechanism that moves the mounting head 8 between the component supply unit 4 and the substrate holding unit. By driving the head moving mechanism, the mounting head 8 moves horizontally, picks up an electronic component from each component supply unit 4 by the suction nozzle 10 (see FIG. 3), and mounts it on the substrate 3 positioned in the conveyance path 2. To do.

The substrate recognition camera 9 moved onto the substrate 3 together with the mounting head 8 images the recognition mark provided on the substrate 3. By recognizing this imaging result, the position of the substrate 3 is recognized. Further, the board recognition camera 9 moved to the component supply unit 4 images the take-out position 5 a of each tape feeder 5. By recognizing the imaging result, it is possible to detect the positional deviation of the electronic component at the take-out position 5a of each tape feeder 5. A component recognition camera 11 is disposed on the route from the component supply unit 4 to the conveyance path 2. The component recognition camera 11 images the electronic component held by each mounting head 8 from below. By recognizing the imaging result, it is possible to detect an electronic component and detect a misalignment state.

  Next, the mounting head 8 will be described with reference to FIG. As shown in FIG. 3, the mounting head is of a multi-type, and has eight unit mounting heads 8a (4 × 2 rows). These unit mounting heads 8a are each provided with a suction nozzle 10 that sucks and holds an electronic component at the lower end, and is moved up and down by an individual Z-axis motor (not shown) and rotated around the nozzle axis by a common θ-axis motor 8b. Is possible.

  Here, the feeder arrangement pitch p of the unit mounting heads 8 a in the mounting head 8 coincides with the feeder arrangement pitch p of the tape feeder 5 in the component supply unit 4. In other words, the electronic component mounting apparatus includes a plurality of suction nozzles 10 that are mounted on the mounting head 8 at a nozzle mounting pitch p corresponding to the feeder arrangement pitch p and suck and hold the electronic components. Thus, in a single component take-out operation in which the mounting head 8 is moved up and down with respect to the component supply unit 4, a plurality of electronic components P are simultaneously sucked and taken out from a plurality of adjacent tape feeders 5 by a plurality of unit mounting heads 8a. Multiple parts can be taken out simultaneously.

  Next, with reference to FIGS. 4, 5, and 6, detection of the displacement of the electronic component at the take-out position 5 a of the tape feeder 5 arranged in the component supply unit 4 will be described. The position of the electronic component P sent to the take-out position 5a by each tape feeder 5 is not necessarily in the normal position on the design drawing, but from the normal position (indicated by a cross) as shown in FIG. In many cases, the positional deviation occurs, and the positional deviation varies from one tape feeder 5 to another. Such misalignment is inevitably caused by factors such as a mounting error when the tape feeder 5 is replaced in the component supply unit 4 and an error in a stop position when the carrier tape is pitch-fed in the tape feeder 5. is there.

  As described above, the present embodiment employs a method of simultaneously taking out a plurality of electronic components P by the mounting head 8 provided with a plurality of suction nozzles 10, so that such a misalignment state is avoided. It is necessary to cause the mounting head 8 to perform a component removal operation in consideration. That is, when the plurality of suction nozzles 10 of the mounting head 8 are aligned with the plurality of electronic components P to be taken out in a position shift state, the position of each electronic component P and the suction nozzle 10 is taken into consideration. The mounting head 8 is positioned so that the amount of displacement is within an allowable range determined in advance for each component type.

  Here, as a method for detecting the positional deviation amount of the electronic component P at the take-out position 5a of each tape feeder 5, a position detection method by recognizing an image obtained by picking up the take-out position 5a by the substrate recognition camera 9 is used. . FIG. 5 shows an imaging field W obtained by imaging the carrier tape 15 holding the electronic component P at the take-out position 5 a by the board recognition camera 9. That is, the substrate recognition camera 9 is moved so that the origin O of the optical coordinate system of the substrate recognition camera 9 coincides with the normal position of extraction at the extraction position 5a that is the position shift detection target. The take-out position 5a is imaged.

The carrier tape 15 is provided with a component pocket 15 a for storing the electronic component P and a feed hole 15 b for feeding the carrier tape 15 by the sprocket 14. Here, when detecting the displacement, the gravity center position G of the component pocket 15a is obtained by image recognition, and the obtained gravity center position G is regarded as the position of the electronic component P for convenience. When there is no error factor, the center-of-gravity position G in the imaging field of view W coincides with the origin O of the optical coordinate system of the board recognition camera 9, but usually the mounting error of the tape feeder 5 in the component supply unit 4 or the tape feeder 5 Due to various error factors such as errors caused by the tape feeding of the carrier tape 15 due to the above, the center of gravity position G to be obtained is at a position deviated from the origin O by a positional deviation amount indicated by (δx, δy). Here, δx and δy are the X direction (the width direction of the carrier tape) and Y, respectively.
This is the amount of displacement in the direction (tape feed direction).

  Such misregistration amounts δx and δy do not always have a uniform value even in the same tape feeder 5 and often show variations within a certain range. That is, as shown in FIG. 6, the positional deviation amount δx (δy) varies in a frequency distribution similar to the normal distribution. This variation distribution has a normal variation range dx (dy) in both positive and negative directions with the average position Mp deviated from the normal position Np on the design drawing by the average positional deviation amount ΔX (ΔY) as the center. By obtaining such a variation distribution in advance prior to the execution of the component mounting operation, in the multiple component simultaneous extraction operation by the mounting head 8, the position of the electronic component P at each extraction position 5a by the substrate recognition camera 9 for each extraction operation. The mounting head 8 can be appropriately aligned with the plurality of electronic components P without performing recognition each time.

  Here, the average position Mp is a positional shift amount corresponding to the positional shift caused by the mounting error of the tape feeder 5. Further, the normal variation range dx (dy) is naturally caused in a normal state due to a mechanism error such as a tape feed error in the tape feeder 5 (play between a sprocket feed pin and a feed hole, a dimensional error of the carrier tape 15, etc.). Is the amount of positional deviation that occurs in These positional deviation amounts are usually on the order of 10 μm to 100 μm, and when the size of the target electronic component is large, there is no significant effect on the component extraction operation, but when the target is a minute component, it is stable. This is not negligible when taking out the parts.

  Note that the normal variation range dx (dy) on both the positive and negative sides is determined by excluding a range regarded as an abnormal value from the acquired measured data. As the abnormal value, a value appropriately determined in consideration of the occurrence frequency distribution such as a value corresponding to 2σ in the normal distribution is used. The upper limit value Lu of the normal variation range dx (dy) on the positive side and the lower limit value Ll of the normal variation range on the negative side determined in this way are used as the misalignment range of the takeout position at the takeout position 5a of the tape feeder 5. Is used as an index value indicating a statistical value, that is, an individual positional deviation statistical value.

  In order to acquire such individual positional deviation statistical values, it is necessary to execute positional deviation detection by the substrate recognition camera 9 a plurality of times for each tape feeder 5. A plurality of variations can be assumed as the timing for detecting the positional deviation for obtaining the statistical data, and may be determined as appropriate according to the actual production. For example, prior to the start of actual production work, a method may be used in which a dummy carrier tape is attached to each tape feeder 5 and the positional deviation detection shown in FIG. 5 is repeatedly executed for a predetermined N number. The position recognition of the take-out position 5a by the board recognition camera 9 may be performed only during a predetermined N parts take-out operation at the start of actual production work, and data may be acquired while performing actual production. In this case, at the time of data acquisition, the actual positional deviation amount of the electronic component P acquired for each component extraction operation is used instead of the individual positional deviation statistical value. That is, the upper limit value Lu and the lower limit value Ll described above are individual positional deviation statistical values obtained by individually statistically processing a plurality of positional deviation amounts detected by performing positional deviation detection for a plurality of tape feeders 5 a plurality of times. It has become.

  Next, with reference to FIG. 7, a description will be given of a positional deviation allowable value that is allowed when the electronic component P is taken out by the suction nozzle 10. The electronic component P is taken out by the suction nozzle 10 by holding the electronic component P at the lower end of the suction nozzle 10 by vacuum suction. At this time, as long as the electronic component P is sucked and held in a stable posture, the suction nozzle 10 does not necessarily need to be in exact contact with the center position of the electronic component P. As shown in FIG. What is necessary is just to contact | abut to the predetermined range set on both sides of the center.

The allowable displacement is a dimension that defines the size of the predetermined range, and is set individually for each component type based on the size and shape in the form of a width dimension TX (TY) distributed in both directions from the center. TX and TY indicate allowable displacements in the X direction and the Y direction, respectively. In general, since the planar shape of electronic components is often different in size in the width and length directions, the positional deviation allowable value is also set individually according to the direction. Since the center of gravity G (see FIG. 5) of the component pocket 15a that accommodates the electronic component P is regarded as the center of the electronic component P, the actual range corresponding to the positional deviation allowable value TX (TY) is This is a range that is distributed in both directions by the width dimension TX (TY) around the center of gravity position G of 15a. Thus, when considering the displacement of the electronic component, it is necessary to consider both the X direction and the Y direction. However, in the following description, only the displacement in the X direction, that is, the width direction of the carrier tape 15 is considered. Describe.

  When the electronic component P having the positional deviation allowable value TX shown in FIG. 7 as a characteristic value is picked up by the suction nozzle 10 and taken out from the tape feeder 5 having the positional deviation distribution shown in FIG. Is done. That is, when the mounting head 8 performs a component picking operation in a normal state, the position control of the mounting head 8 is performed so that the suction nozzle 10 is aligned with the normal position Np. At this time, when the value of the upper limit value Lu and the lower limit value Ll that is further away from the normal position Np (here, the upper limit value Lu) is smaller than the allowable positional deviation TX (TX> Lu), FIG. Even when the center of gravity position G is positioned at the upper limit value Lu as shown in a), the normal position Np is included within the range of the allowable displacement error TX (in other words, the suction nozzle 10 is allowed to be displaced). In other words, the electronic component P can be sucked and held by the suction nozzle 10 without requiring position correction.

  On the other hand, as shown in FIG. 8 (b), the value of the upper limit value Lu and the lower limit value Ll that is further away from the normal position Np (here, the upper limit value Lu) is larger than the allowable displacement value TX. In (TX <Lu), when the gravity center position G is positioned at the upper limit value Lu, the normal position Np is out of the range of the allowable positional deviation TX (in other words, the suction nozzle 10 is within the range of the allowable positional deviation TX. Will not abut). For this reason, the electronic component P cannot be stably held by suction by the suction nozzle 10, and position correction is required. That is, whether or not position correction is necessary can be determined by comparing the upper limit value Lu and the lower limit value Ll as individual position shift statistical values with the position shift allowable value TX. If it is determined that position correction is necessary, as shown in FIG. 8 (c), the position of the mounting head 8 during the take-out operation is moved laterally by an appropriate correction amount, thereby The position is included in the range of the positional deviation allowable value TX.

  In this position correction, the correction amount is set within the range shown below. (A) shows an example in which a correction value α1 (a movement amount from the normal position Np) is determined such that the position of the suction nozzle 10 is positioned at the lower end of the range of the allowable positional deviation TX. Further, (B) shows an example in which a correction value α2 is set such that the position of the suction nozzle 10 is positioned at the upper limit end of the range of the positional deviation allowable value TX. As far as individual suction nozzles 10 are concerned, if the correction value is within the range of α1 to α2, the suction nozzle 10 is located within the range defined by the allowable displacement value TX, and the electronic component P is placed in the suction nozzle 10. Can be properly held and taken out. In the example shown in FIG. 8, the upper limit value Lu is further separated from the normal position Np than the lower limit value Ll. However, the lower limit value Ll is further separated from the normal position Np than the upper limit value Lu. If it is, the state where the gravity center position G is located at the lower limit L1 may be assumed.

The above description relates to position correction for each nozzle 10, but in the actual component picking operation, the plurality of suction nozzles 10 are collectively moved by the mounting head 8 to simultaneously move the plurality of electronic components P. Take out. For this reason, in the simultaneous pick-out operation of a plurality of components by the mounting head 8, position correction for each suction nozzle 10 shown in FIG. 8 is executed for the plurality of suction nozzles 10. That is, as shown in FIG. 9, four suction nozzles 10 mounted on the mounting head 8 from the adjacent tape feeders 5 (1), 5 (2), 5 (3), and 5 (4). (1) 10 (2), 10 (3), and 10 (4) perform the operation of taking out the electronic components P1, P2, P3, and P4 at the same time. The electronic components P1, P2, P3, and P4 correspond to positional deviation allowable values TX1, TX2, TX3, and TX4, respectively. When the electronic parts P1, P2, P3, and P4 are of the same type, the positional deviation allowable values TX1, TX2, TX3, and TX4 have the same value.

  The variation distribution of the positional deviation amount in the tape feeder 5 (1) that supplies the electronic component P1 has a normal variation range dx1 in both positive and negative directions centered on the average position Mp1 that is deviated from the normal position Np1 by the average positional deviation amount ΔX1. It has become. Similarly, the variation distribution of the tape feeders 5 (2), 5 (3), and 5 (4) that supply the electronic components P2, P3, and P4 has average positional deviation amounts ΔX2, ΔX3, and the normal positions Np2, Np3, and Np4. It has a form having normal variation ranges dx2, dx3, dx4 in both positive and negative directions with the average positions Mp2, Mp3, Mp4 biased by ΔX4 as the center. From these average positional deviation amounts ΔX1, ΔX2, ΔX3, ΔX4 and normal variation ranges dx1, dx2, dx3, dx4, upper limit values Lu1, Lu2, Lu3, Lu4 and lower limit values Ll1, Ll2, Ll3, Ll4 are calculated. .

  Based on these allowable displacement values TX1, TX2, TX3, TX4, upper limit values Lu1, Lu2, Lu3, Lu4 and lower limit values Ll1, Ll2, Ll3, Ll4, whether or not the position correction described with reference to FIG. Determination and position correction calculation are executed. That is, for each combination of the individual suction nozzle 10 and the electronic component P, determination of whether or not position correction is necessary and calculation for obtaining correction values α1 to α2 are first performed. This individual position correction calculation is a movement amount when individually moving the suction nozzles 10 (1), 10 (2), 10 (3), and 10 (4). In the actual position correction operation, the plurality of suction nozzles 10 (1), 10 (2), 10 (3), and 10 (4) are collectively moved by moving the center line CR (H) of the mounting head 8. Since it is a form to move, several correction value (alpha) 1i- (alpha) 2i (i = 1-4) calculated | required about several tape feeders 5 (1), 5 (2), 5 (3), 5 (4) is used. A range common to all the suction nozzles 10 is extracted by overlapping.

  Here, as shown in FIG. 10A, a common correction value range αc1 to αc2 can be extracted for all tape feeders 5 (1), 5 (2), 5 (3), and 5 (4). In this case, it is indicated that it is possible to correct the position of the suction nozzle 10 for all the tape feeders 5 by a single correction operation for correcting the lowering operation position of the mounting head 8. Then, a correction value appropriately selected from such a correction value range αc1 to αc2 (for example, an intermediate value (αc1 + αc2) / 2) is output as a position correction parameter. With this position correction, the plurality of suction nozzles 10 (1), 10 (2), 10 (3), and 10 (4) allow the tape feeders 5 (1), 5 (2), 5 (3), and 5 (4). ), The electronic components P1, P2, P3, and P4 can be taken out collectively.

  On the other hand, as shown in FIG. 10B, the positional deviation range of one tape feeder 5 (here, tape feeder 5 (4)) is discrete from the positional deviation ranges of the other tape feeders 5, and is common. When the range of correction values to be extracted cannot be extracted, it is indicated that it is impossible to correct the position of the suction nozzle 10 properly for all the electronic components P by a single correction operation. In such a case, the tape feeder 5 (4) having the highest degree of discreteness compared to the other tape feeders 5 is rejected from the simultaneous removal target, and the remaining tape feeders 5 (1), 5 (2), 5 For (3), the position correction calculation for simultaneously taking out a plurality of parts is executed again.

The purpose of the position correction operation shown in FIG. 9 is to correct the positional deviation amount δx in the X direction (the width direction of the carrier tape). As for the positional deviation in the Y direction (tape feeding direction), a correction method by correcting the position of the mounting head 8 in the Y direction may be adopted, as in the position correction shown in FIGS. By controlling the tape feeding operation by the feeder 5 (by correcting the stop position in the pitch feeding of the carrier tape), the tape feeder 5 may be individually corrected.

  Next, the configuration of the control system will be described with reference to FIG. The calculation unit 20 is a CPU, and executes the program stored in the program storage unit 21 to control each unit described below to execute an electronic component mounting operation, a recognition operation, and other various processes. These programs include a mounting operation program 21a and a take-out operation control program 21b, and data stored in the data storage unit 22 is referred to when these programs are executed.

  The mounting operation program 21a is an operation program for performing a component mounting operation for mounting the electronic component on the substrate 3 by moving the mounting head 8 by the head moving mechanism. The take-out operation control program 21 b is a program for controlling the take-out operation when the mounting head 8 takes out an electronic component from the component supply unit 4. In the present embodiment, as described above, in the single component take-out operation by the mounting head 8, a plurality of electronic components P are simultaneously sucked and taken out by the plurality of unit mounting heads 8a. For this reason, the take-out operation control program 21b includes a program for arithmetic processing and operation control processing for simultaneously taking out a plurality of components.

  The data storage unit 22 stores various data such as mounting data 22a, a positional deviation allowable value 22b, and an individual positional deviation statistical value 22c. The mounting data 22a is data indicating what kind of electronic component is mounted at which position on the production target board, component data indicating the type and size of these electronic parts, and component mounting on the board 3 It consists of mounting sequence data indicating the position and mounting order. The positional deviation allowable value data 22b is data relating to the above-described positional deviation allowable values TX and TY, and is stored for each type of electronic component to be mounted. The misregistration statistical value data 22c is data on individual misregistration statistics such as average misregistration amounts ΔX and ΔY of the misregistration amount in each tape feeder 5 and the upper limit value Lu and the lower limit value Ll. Is remembered.

  The image recognition unit 23 performs detection processing described below by recognizing the imaging results obtained by the board recognition camera 9 and the component recognition camera 11. The position of the substrate 3 is detected by moving the substrate recognition camera 9 onto the substrate 3 and recognizing image data obtained by imaging the substrate 3. By moving the board recognition camera 9 to the component supply unit 4 and recognizing image data obtained by imaging the take-out position 5a of the tape feeder 5, as shown in FIG. 5, the electronic component P at the take-out position 5a of the tape feeder 5 is recognized. The position shift amount with respect to the normal position can be detected. In a state where the mounting head 8 picking up the electronic component is moved onto the component recognition camera 11, image data obtained by imaging the electronic component from below is recognized and held by each suction nozzle 10 of the mounting head 8. The position of the electronic component in the state can be detected.

  The mechanism driving unit 24 drives the substrate transport mechanism 25 that moves the substrate 3 along the transport path 2, the mounting head 8, and the head moving mechanism 26 that moves the mounting head 8. The operation / input unit 27 is an input means such as a touch panel or a keyboard, and inputs operation commands and data. The display unit 28 displays a guidance screen at the time of operation input, a notification screen at the time of warning, and the like. Further, the feeder control unit 12 of each tape feeder 5 is connected to the control system of the apparatus main body, and a control command necessary for executing a component supply operation in each tape feeder 5 is sent to the feeder control unit 12.

  In the above-described configuration, the substrate recognition camera 9 and the image recognition unit 23 capture and recognize the take-out position 5a in the tape feeder 5 to obtain a positional deviation amount indicating an error with respect to the normal position of the actual take-out position at the take-out position 5a. This is a displacement detection means for detecting. The function realized by the calculation unit 20 executing the take-out operation control program 21b is calculated based on the detection result of the above-described misregistration detection means and the permissible misregistration value preset for each type of electronic component. By controlling the head moving mechanism 26 in accordance with the position correction parameter, the mounting head 8 performs a multiple component simultaneous extraction operation for simultaneously extracting a plurality of electronic components held on the plurality of tape feeders 5 by the plurality of suction nozzles 10. It is an operation control means.

  Specifically, the take-out operation control unit 21b executes the following processing. First, a plurality of individual positional deviation statistical values 22c obtained by individually statistically processing a plurality of positional deviation amounts detected by executing positional deviation detection a plurality of times for each of the plurality of tape feeders 5 are calculated. Then, by comparing the calculated individual individual positional deviation statistical values with the positional deviation allowable value TX corresponding to the type of the electronic component that is the target in the extraction operation, individual individual values that are outside the range of the positional deviation allowable value TX are obtained. The presence / absence of the positional deviation statistical value 22c is determined. When at least one individual positional deviation statistical value is outside the range of the allowable positional deviation 22b, the position correction parameter is calculated so that the individual positional deviation statistical value 22c is within the range of the allowable positional deviation TX. To do.

  This electronic component mounting apparatus is configured as described above. Next, an electronic component mounting method will be described. In this electronic component mounting method, an electronic component is taken out from the component supply unit 4 by the mounting head 8 and mounted on the substrate 3 held in the conveyance path 2 which is a substrate holding unit. Here, a plurality of electronic components are simultaneously extracted from a plurality of tape feeders 5 arranged in the component supply unit 4 by a plurality of suction nozzles 10 mounted on the mounting head. In the take-out operation control step for causing the mounting head 8 to execute the take-out operation, the following processing is performed. These processes are performed by executing the take-out operation control program 21b by the take-out control means, that is, the arithmetic unit 20 described above.

  First, the individual positional deviation statistical value 22c is calculated for each of the plurality of tape feeders 5 (ST1). In this calculation process, the average positional deviation amount ΔX (ΔY), the upper limit value Lu, and the lower limit value Ll shown in FIG. 6 are calculated for each tape feeder 5. The timing of execution may be calculated in advance by attaching a dummy carrier tape to each tape feeder 5 prior to the start of actual production work. Sometimes, data may be acquired and calculated while performing actual production.

  Next, the positional deviation tolerance TX of the electronic component to be taken out is read from the data storage unit 22 (ST2). Next, in order to determine whether or not position correction is necessary in the take-out operation by the mounting head 8, the calculated individual positional deviation statistical value 22c for each tape feeder 5, that is, the upper limit value Lu and the lower limit value Ll are used as the tape. The positional deviation allowable value TX of the electronic component P supplied by the feeder 5 is compared (ST3). Then, it is determined whether there is an individual positional deviation statistical value 22c outside the range of the allowable positional deviation TX (ST4). That is, in all combinations of the tape feeder 5 and the suction nozzle 10, as described with reference to FIG. 8A, both the upper limit value Lu and the lower limit value Ll are included in the range of the positional deviation allowable value TX ( If (TX> Lu), it is determined as NO in (ST4). In this case, a plurality of components are simultaneously picked up by the mounting head 8 without performing position correction (ST9).

On the other hand, if there is the individual positional deviation statistical value 22c outside the range of the positional deviation allowable value TX in (ST4), that is, as described in FIG. 8B, whichever of the upper limit value Lu and the lower limit value Ll Is out of the range of the allowable positional deviation TX (TX <Lu), it is determined that position correction is necessary, and position correction calculation is executed (ST5). In this position correction calculation, it is first determined whether or not all the individual positional deviation statistical values 22c can be within the range of the allowable positional deviation TX by position correction (ST6).

  This determination is made based on whether or not the common correction value range αc1 to αc2 shown in FIG. Here, if the common correction value ranges αc1 to αc2 can be extracted, YES is determined in (ST6). In this case, the position correction parameter is calculated for all individual positional deviation statistical values (ST7). That is, a position correction parameter used for actual position correction, such as an intermediate value (αc1 + αc2) / 2 of a common correction value range αc1 to αc2, is calculated, and the position correction parameter is output to the mechanism drive unit 24. As a result, the mounting head 8 performs position correction using the position correction parameter, and then performs a multiple component simultaneous pick-up operation (ST9).

  If it is determined NO in (ST6), that is, if the common correction value range αc1 to αc2 cannot be extracted, the most discrete discrete positional deviation statistical value is rejected to calculate the position correction parameter. (ST8). In other words, the tape feeder 5 having the largest amount of positional deviation is excluded from the simultaneous extraction target, and the position correction parameter for simultaneous multiple component extraction is calculated only for the remaining plurality of tape feeders 5. Then, after performing position correction using this position correction parameter, a plurality of parts taking-out operation is executed for the remaining plurality of tape feeders 5 (ST9). Next, a component take-out operation is executed for the tape feeder 5 excluded from the simultaneous take-out. As a result, the electronic components are held by all the suction nozzles 10 mounted on the mounting head 8.

  That is, in the electronic component mounting method, when there is an individual misalignment statistical value that cannot be within the allowable misalignment range, the individual misalignment statistical value is rejected to correct the position. A parameter is calculated, and a multiple component simultaneous extraction operation is executed for the electronic component corresponding to the remaining individual positional deviation statistical value.

  As described above, in the electronic component mounting apparatus according to the present invention, first, a plurality of misalignments detected by performing misalignment detection a plurality of times for each of a plurality of parts feeders to be simultaneously extracted. A plurality of individual misregistration statistics are created by statistically processing the quantities individually. Then, by comparing these individual misregistration statistics with the misregistration allowance corresponding to the type of electronic component that is the target in the extraction operation, whether or not there is an individual misregistration statistical value that is outside the range of misalignment tolerance Judging. When at least one individual positional deviation statistical value is outside the range of allowable positional deviation, the position correction parameter is calculated so that the individual positional deviation statistical value is within the range of allowable positional deviation. Yes.

  By adopting such a method, the following excellent effects can be obtained. In other words, when multiple component simultaneous extraction is applied to a minute component, a high degree of alignment accuracy between the suction nozzle and the electronic component is required when removing the component. In many cases, it is difficult to correctly align the component within the allowable accuracy range. Even in such a case, it is possible to appropriately grasp the positional deviation tendency of each part feeder by preparing individual positional deviation statistical values for each of the plurality of parts feeders in advance. Therefore, even when a minute part is targeted, it is possible to ensure alignment accuracy, and it is possible to expand the application range of simultaneous pick-up of a plurality of parts. Further, according to this method, it is not necessary to detect the position of the electronic component by image recognition or the like every time when the mounting head takes out. Therefore, the operation tact time can be shortened by the time required for image recognition, and the mounting efficiency can be improved as compared with the method of detecting the positional deviation for each take-out operation.

  The electronic component mounting apparatus and the electronic component mounting method of the present invention have the effect that the application range of multiple component simultaneous extraction can be expanded and the mounting efficiency can be improved, and the electronic component is mounted on the substrate and the mounting substrate is mounted. Useful in the field of manufacturing.

The top view of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the tape feeder with which the electronic component mounting apparatus of one embodiment of this invention is mounted | worn The fragmentary sectional view of the electronic component mounting device of one embodiment of the present invention The fragmentary top view of the component supply part of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the position shift detection of the taking-out position in the component supply part of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the dispersion | distribution distribution state of the positional offset amount of the taking-out position in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the position shift allowable value of the component extraction operation | movement in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the position correction | amendment at the time of taking-out operation | movement in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the position correction | amendment at the time of the several components simultaneous pick-out operation | movement in the electronic component mounting method of one embodiment of this invention Explanatory drawing of the position correction | amendment at the time of the several components simultaneous pick-out operation | movement in the electronic component mounting method of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention Flow chart of take-out operation control process in electronic component mounting method of one embodiment of the present invention

Explanation of symbols

2 Transport path 3 Substrate 4 Component supply unit 5 Tape feeder 5a Pick-up position 8 Mounting head 9 Substrate recognition camera 10 Suction nozzle P Electronic component δx, δy Position shift amount Np Regular position Mp Average position ΔX, ΔY Average position shift amount Lu Upper limit Ll Lower limit value TX, TY Position shift tolerance

Claims (2)

An electronic component mounting apparatus for taking out an electronic component from a component supply unit by a mounting head and mounting the electronic component on a substrate held by a substrate holding unit,
A plurality of parts feeders that are arranged in parallel at a predetermined feeder arrangement pitch in the parts supply unit and that supply the electronic parts to the take-out position by the mounting head;
A plurality of suction nozzles mounted on the mounting head at a nozzle mounting pitch corresponding to the feeder arrangement pitch and holding the electronic component by suction;
A mounting head moving mechanism for moving the mounting head between the component supply unit and the substrate holding unit;
A positional deviation detection means for detecting a positional deviation amount indicating an error from a normal position of the actual extraction position at the extraction position by imaging and recognizing the extraction position;
The plurality of suction nozzles are controlled by controlling the mounting head moving mechanism according to a position correction parameter calculated based on a detection result of the position shift detection unit and a position shift allowable value preset for each type of the electronic component. An unloading operation control unit that causes the mounting head to perform a multiple component simultaneous unloading operation of simultaneously unloading a plurality of electronic components held by the plurality of parts feeders,
The take-out operation control unit calculates a plurality of individual positional deviation statistical values obtained by individually performing statistical processing on the plurality of positional deviation amounts detected by executing positional deviation detection for each of the plurality of parts feeders a plurality of times. ,
By comparing the plurality of individual positional deviation statistical values with the positional deviation allowable value corresponding to the type of electronic component that is a target in the extraction operation, the individual positional deviation statistical values that are outside the range of the positional deviation allowable value The presence or absence of
When at least one individual positional deviation statistical value is outside the range of the allowable positional deviation, the position correction parameter is calculated so that the individual positional deviation statistical value is within the range of the allowable positional deviation ;
If there is an individual positional deviation statistical value that cannot be within the allowable positional deviation value, the individual positional deviation statistical value is rejected to calculate the position correction parameter, and the remaining individual positional deviation statistical value Execute multiple parts simultaneous extraction operation for electronic parts corresponding to
Further, the individual positional deviation statistical value is an upper limit value or a lower limit value of a normal variation range in the distribution of positional deviation amounts in the part feeder . A plurality of parts feeders that are arranged in parallel at a predetermined feeder arrangement pitch in the parts supply unit and that supply the electronic components to a take-out position by a mounting head, and are mounted on the mounting head at a nozzle mounting pitch corresponding to the feeder arrangement pitch. A plurality of suction nozzles for sucking and holding electronic components, a mounting head moving mechanism for moving the mounting head between the component supply unit and the substrate holding unit for holding the substrate, and imaging and recognizing the take-out position Thus, an electronic component mounting apparatus having a displacement detection means for detecting a displacement amount that indicates an error of the actual removal position with respect to the normal position at the removal position, takes out the electronic component from the component supply unit by the mounting head. An electronic component mounting method for mounting on a substrate held by the substrate holding unit,
The plurality of suction nozzles are controlled by controlling the mounting head moving mechanism according to a position correction parameter calculated based on a detection result of the position shift detection unit and a position shift allowable value preset for each type of the electronic component. In the take-out operation control step of causing the mounting head to execute a multi-component simultaneous take-out operation for simultaneously taking out a plurality of electronic components held in the plurality of parts feeders by:
Calculating a plurality of individual positional deviation statistical values obtained by individually statistically processing the positional deviation amounts detected for each of the plurality of parts feeders;
By comparing the plurality of individual positional deviation statistical values with the positional deviation allowable value corresponding to the type of the electronic component, respectively, to determine the presence or absence of individual positional deviation statistical values outside the range of the positional deviation allowable value,
When at least one individual positional deviation statistical value is outside the range of the allowable positional deviation, the position correction parameter is calculated so that the individual positional deviation statistical value is within the range of the allowable positional deviation ;
If there is an individual positional deviation statistical value that cannot be within the allowable positional deviation value, the individual positional deviation statistical value is rejected to calculate the position correction parameter, and the remaining individual positional deviation statistical value Execute multiple parts simultaneous extraction operation for electronic parts corresponding to
Further, the individual positional deviation statistical value is an upper limit value or a lower limit value of a normal variation range in the positional deviation amount distribution in the part feeder .

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